CN112018214B - Photovoltaic diode with 2.0-line diameter and processing die thereof - Google Patents
Photovoltaic diode with 2.0-line diameter and processing die thereof Download PDFInfo
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- CN112018214B CN112018214B CN202010777005.0A CN202010777005A CN112018214B CN 112018214 B CN112018214 B CN 112018214B CN 202010777005 A CN202010777005 A CN 202010777005A CN 112018214 B CN112018214 B CN 112018214B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
本发明公开了一种2.0线径的光伏二极管及其加工模具，2.0线径的光伏二极管包括铜引线和圆形板，铜引线的线径为2.0mm，圆形板的直径为5.85mm；其加工模具包括第一模块和第二模块，第一模块的一侧和第二模块的一侧均开设有进线槽，两个进线槽的一侧均开设有模具槽，第一模块顶部的一端和第二模块顶部的一端均固定连接有第一缓冲座，两个第一缓冲座的顶部均固定连接有缓冲柱，优点是加工模具组装拆卸方便，通过第一减震弹簧和第二减震弹簧二次缓冲减弱模块跟随气缸运动时受到的冲击，小球和限位块的配合，减少摩擦固定位置，缓冲效果。
The invention discloses a photovoltaic diode with a wire diameter of 2.0 and a processing mold thereof. The photovoltaic diode with a wire diameter of 2.0 comprises a copper lead wire and a circular plate, the wire diameter of the copper lead wire is 2.0 mm, and the diameter of the circular plate is 5.85 mm; The processing mold includes a first module and a second module. One side of the first module and one side of the second module are provided with wire inlet grooves, and one side of the two wire inlet grooves are provided with mold grooves. One end and one end of the top of the second module are fixedly connected with a first buffer seat, and the tops of the two first buffer seats are fixedly connected with a buffer column. The advantage is that the processing mold is easy to assemble and disassemble. The secondary buffer of the shock spring reduces the impact of the module when it follows the movement of the cylinder, and the cooperation of the ball and the limit block reduces friction to fix the position and buffer effect.
Description
Technical Field
The invention relates to a processing die of a photovoltaic diode, in particular to a photovoltaic diode with a 2.0-line diameter and a processing die thereof, and belongs to the technical field of processing dies.
Background
The photovoltaic diode is used on a photovoltaic module (a solar panel), because of the unique one-way conductivity of the diode, current can only flow from one direction, so that the current feedback is prevented through the photovoltaic diode, a protection circuit is used, the function of the protection circuit is equivalent to a switch, the photovoltaic diode is switched on in the forward direction and switched off in the reverse direction, however, the existing machining die of the photovoltaic diode with the linear diameter is inconvenient to assemble and disassemble, and the damping effect is poor when the photovoltaic diode moves along with an air cylinder, so that the improvement is made, and the photovoltaic diode with the linear diameter of 2.0 and the machining die thereof are provided.
Disclosure of Invention
The invention aims to provide a photovoltaic diode with a 2.0-wire diameter and a processing die thereof, and aims to solve the problems that the processing die of the photovoltaic diode is inconvenient to assemble and disassemble and has poor damping effect when moving along with an air cylinder in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a processing die of a photovoltaic diode with a 2.0-line diameter comprises a first module and a second module, wherein wire inlet grooves are formed in one side of the first module and one side of the second module, die grooves are formed in one side of the two wire inlet grooves, a first buffer seat is fixedly connected to one end of the top of the first module and one end of the top of the second module, buffer columns are fixedly connected to the tops of the two first buffer seats, a second buffer seat is fixedly connected to the tops of the two buffer columns, a buffer block is fixedly connected to the tops of the two second buffer seats, a buffer groove is formed in the top of the buffer block, a second damping spring is fixedly arranged at the bottom of the buffer groove, the top of the second damping spring is fixedly connected with the bottom of a limiting block, a telescopic column is fixedly connected to the top of the limiting block, and the top of the telescopic column penetrates through the buffer groove and is fixedly connected with the bottom of a connecting block, the top of the connecting block is fixedly connected with a shock pad.
As a preferable technical scheme of the invention, the first module and the second module are both made of white steel.
As a preferred embodiment of the present invention, a first fixing member is fixedly connected to one side of the first module, a second fixing member is fixedly connected to one side of the second module, and the first fixing member and the second fixing member are engaged with each other.
As a preferred technical solution of the present invention, a first damping spring is fixedly disposed between the first buffer seat and the second buffer seat.
As a preferable technical scheme, two sides of the limiting block are respectively provided with a mounting groove, small balls are arranged inside the two mounting grooves in a sliding mode, and the two small balls are respectively connected with two sides of the buffer groove in a sliding mode.
As a preferable technical solution of the present invention, the center of the top of the first module and the center of the top of the second module are both provided with two connecting slots.
A photovoltaic diode with 2.0 wire diameters, wherein the photovoltaic diode with 2.0 wire diameters is processed and molded by adopting the processing mold of the photovoltaic diode with 2.0 wire diameters, which is disclosed by any one of the claims.
The photovoltaic diode with the wire diameter of 2.0 comprises a copper lead and a circular plate, wherein one end of the copper lead is connected with the circular plate, the wire diameter of the copper lead is 2.0mm, and the diameter of the circular plate is 5.85 mm.
Compared with the prior art, the invention has the beneficial effects that: according to the processing die for the photovoltaic diode with the 2.0-wire diameter, the first fixing piece and the second fixing piece are connected and fixed with the first module and the second module through the cross clamps, the operation is simple, the assembly and the disassembly are convenient, the shock absorption structures at the tops of the first module and the second module can reduce the impact on the modules when the modules move along with the air cylinder to the maximum extent through secondary buffering of the first shock absorption spring and the second shock absorption spring, the matching of the small ball and the limiting block can reduce the friction fixing position, and the buffering effect is optimized. The wire diameter of the conventional common photovoltaic diode is only 1.28mm, the diameter of the circular plate is 5.6mm, the wire diameter of the copper lead is 2.0mm, the diameter of the circular plate is 5.85mm, the conductivity is good, and the power is high.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic cross-sectional structure of the module of the present invention.
Fig. 3 is a top view of the present invention.
Fig. 4 is a partial cross-sectional structural view of the present invention.
Fig. 5 is a schematic view of the lead of a 2.0 wire diameter photovoltaic diode of the present invention.
In the figure: 1. a first module; 2. a second module; 3. a first buffer seat; 4. a buffer column; 5. a buffer block; 6. a wire inlet groove; 7. a second buffer seat; 8. a buffer tank; 9. a second damping spring; 10. a telescopic column; 11. a first damping spring; 12. a limiting block; 13. connecting blocks; 14. a second fixing member; 15. mounting grooves; 16. a pellet; 17. a first fixing member; 18. connecting grooves; 19. a mold slot; 20. a copper lead; 21. a circular plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the invention provides a processing mold for a photovoltaic diode with a 2.0 line diameter, comprising a first module 1 and a second module 2, wherein one side of the first module 1 and one side of the second module 2 are both provided with a line inlet groove 6, one side of each of the two line inlet grooves 6 is both provided with a mold groove 19, one end of the top of the first module 1 and one end of the top of the second module 2 are both fixedly connected with a first buffer seat 3, the tops of the two first buffer seats 3 are both fixedly connected with a buffer column 4, the tops of the two buffer columns 4 are both fixedly connected with a second buffer seat 7, the tops of the two second buffer seats 7 are both fixedly connected with a buffer block 5, the top of the buffer block 5 is provided with a buffer groove 8, the bottom of the buffer groove 8 is fixedly provided with a second damping spring 9, the top of the second damping spring 9 is fixedly connected with the bottom of a limiting block 12, the top of the limiting block 12 is fixedly connected with a telescopic column 10, the top of telescopic column 10 is worn out buffer slot 8 and is connected with the bottom fixed connection of connecting block 13, and the top fixed connection of connecting block 13 has the shock pad.
Preferably, the first module 1 and the second module 2 are made of white steel, the strength of the white steel is high, and the die is convenient to extrude when being enlarged in size.
Preferably, one side of the first module 1 is fixedly connected with a first fixing member 17, one side of the second module 2 is fixedly connected with a second fixing member 14, the first fixing member 17 is connected with the second fixing member 14 in a clamping manner, the first fixing member 17 and the second fixing member 14 are fixedly connected with the first module 1 and the second module 2 through cross clamps, and the assembling and disassembling are simple to operate and convenient.
Preferably, a first damping spring 11 is fixedly arranged between the first buffer seat 3 and the second buffer seat 7, and the impact on the module when the module moves along with the cylinder can be weakened to the maximum extent through twice buffering of the first damping spring 11 and the second damping spring 9.
Preferably, mounting groove 15 has all been seted up to the both sides of stopper 12, and the inside of two mounting grooves 15 all slides and is provided with bobble 16, two bobbles 16 respectively with the both sides sliding connection of dashpot 8, the cooperation of bobble 16 and stopper 12, can reduce friction fixed position, optimize buffering effect.
Preferably, two connecting grooves 18 are formed in the center of the top of the first module 1 and the center of the top of the second module 2, and are connected and fixed with other parts through the connecting grooves 18.
A photovoltaic diode with 2.0 wire diameters, wherein the photovoltaic diode with 2.0 wire diameters is processed and molded by adopting the processing mold of the photovoltaic diode with 2.0 wire diameters, which is disclosed by any one of the claims. The photovoltaic diode with the wire diameter of 2.0 comprises a copper lead 20 and a circular plate 21, wherein one end of the copper lead 20 is connected with the circular plate 21, the wire diameter of the copper lead 20 is 2.0mm, and the diameter of the circular plate 21 is 5.85 mm. The wire diameter of the conventional common photovoltaic diode is only 1.28mm, the diameter of the circular plate is 5.6mm, the wire diameter of the copper lead is 2.0mm, the diameter of the circular plate is 5.85mm, the conductivity is good, and the power is high.
When the processing die is used specifically, the first die block 1 and the second die block 2 are both made of white steel, the white steel is high in strength, and extrusion forming is facilitated when the die is enlarged in size; the first fixing part 17 and the second fixing part 14 are used for connecting and fixing the first module 1 and the second module 2 through cross clamps, so that the operation is simple, and the assembly and disassembly are convenient; when the first module 1 and the second module 2 are impacted, the connecting block 13 is extruded, the telescopic column 10 pushes the limiting block 12 to extrude the second damping spring 9, the second damping spring 9 is extruded to deform, and the small ball 16 moves on two sides of the buffer groove 8, so that the impact on the first module 1 and the second module 2 is weakened, and the friction fixing position can be reduced and the buffering effect can be optimized due to the matching of the small ball 16 and the limiting block 12; the first and second cushion sockets 3 and 7 can further weaken the impact by the first damper springs 11.
In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A processing die of a photovoltaic diode with a 2.0 line diameter comprises a first module (1) and a second module (2), and is characterized in that wire inlet grooves (6) are formed in one side of the first module (1) and one side of the second module (2), die grooves (19) are formed in one side of each of the two wire inlet grooves (6), a first buffer seat (3) is fixedly connected to one end of the top of the first module (1) and one end of the top of the second module (2), buffer columns (4) are fixedly connected to the tops of the two first buffer seats (3), a second buffer seat (7) is fixedly connected to the tops of the two buffer columns (4), a buffer block (5) is fixedly connected to the tops of the two second buffer seats (7), a buffer groove (8) is formed in the top of the buffer block (5), and a second damping spring (9) is fixedly arranged at the bottom of the buffer groove (8), the top of the second damping spring (9) is fixedly connected with the bottom of the limiting block (12), the top of the limiting block (12) is fixedly connected with a telescopic column (10), the top end of the telescopic column (10) penetrates through the buffer groove (8) to be fixedly connected with the bottom of the connecting block (13), and the top of the connecting block (13) is fixedly connected with a damping pad; the photovoltaic diode with the diameter of 2.0 wires is processed and molded by adopting a processing mold of the photovoltaic diode with the diameter of 2.0 wires; the photovoltaic diode with the wire diameter of 2.0 comprises a copper lead and a circular plate, wherein one end of the copper lead is connected with the circular plate, the wire diameter of the copper lead is 2.0mm, and the diameter of the circular plate is 5.85 mm.
2. The processing mold of the photovoltaic diode with the wire diameter of 2.0 as claimed in claim 1, wherein: the first module (1) and the second module (2) are both made of white steel.
3. The processing mold of the photovoltaic diode with the wire diameter of 2.0 as claimed in claim 1, wherein: one side fixedly connected with first mounting (17) of first module (1), one side fixedly connected with second mounting (14) of second module (2), first mounting (17) and second mounting (14) block are connected.
4. The processing mold of the photovoltaic diode with the wire diameter of 2.0 as claimed in claim 1, wherein: a first damping spring (11) is fixedly arranged between the first buffer seat (3) and the second buffer seat (7).
5. The processing mold of the photovoltaic diode with the wire diameter of 2.0 as claimed in claim 1, wherein: mounting grooves (15) have all been seted up to the both sides of stopper (12), two the inside of mounting groove (15) all slides and is provided with bobble (16), two bobble (16) respectively with the both sides sliding connection of dashpot (8).
6. The processing mold of the photovoltaic diode with the wire diameter of 2.0 as claimed in claim 1, wherein: two connecting grooves (18) are formed in the center of the top of the first module (1) and the center of the top of the second module (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010777005.0A CN112018214B (en) | 2020-08-05 | 2020-08-05 | Photovoltaic diode with 2.0-line diameter and processing die thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010777005.0A CN112018214B (en) | 2020-08-05 | 2020-08-05 | Photovoltaic diode with 2.0-line diameter and processing die thereof |
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| CN112018214A CN112018214A (en) | 2020-12-01 |
| CN112018214B true CN112018214B (en) | 2022-01-07 |
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| CN211043457U (en) * | 2019-10-22 | 2020-07-17 | 南通皋鑫电子股份有限公司 | Improve test machine high pressure test portion structure |
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| CN102593616A (en) * | 2011-01-10 | 2012-07-18 | 卢迪 | Lead clamping device |
| CN204209914U (en) * | 2014-10-29 | 2015-03-18 | 宁波市创源光伏科技有限公司 | A kind of small enclosed terminal box injection mold |
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| BE604723A (en) * | 1960-06-09 | 1961-10-02 | Repusseau & Cie Sa Des Ets | Hydraulic shock absorber for buffers of railway vehicles. |
| CN211043457U (en) * | 2019-10-22 | 2020-07-17 | 南通皋鑫电子股份有限公司 | Improve test machine high pressure test portion structure |
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Denomination of invention: A 2.0 wire diameter photovoltaic diode and its processing die Effective date of registration: 20220331 Granted publication date: 20220107 Pledgee: Jiangsu Zaibao South communication Financing Guarantee Co.,Ltd. Pledgor: NANTONG GAOXIN SCIENCE AND TECHNOLOGY DEV Co.,Ltd. Registration number: Y2022980003741 |
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Date of cancellation: 20230808 Granted publication date: 20220107 Pledgee: Jiangsu Zaibao South communication Financing Guarantee Co.,Ltd. Pledgor: NANTONG GAOXIN SCIENCE AND TECHNOLOGY DEV Co.,Ltd. Registration number: Y2022980003741 |
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Denomination of invention: A 2.0 wire diameter photovoltaic diode and its processing mold Effective date of registration: 20230818 Granted publication date: 20220107 Pledgee: China Merchants Bank Limited by Share Ltd. Nantong branch Pledgor: NANTONG GAOXIN SCIENCE AND TECHNOLOGY DEV Co.,Ltd. Registration number: Y2023980052675 |