CN111984098B - Heat dissipation method, device, equipment and medium for computer system - Google Patents

Abstract

The application discloses a heat dissipation method of a computer system, which is applied to BMC in a target computer system and comprises the following steps: detecting a temperature value of the target computer system by utilizing the busbar; wherein, the busbar is a wire cable which is inserted in advance on the PCBA in the target computer system; and acquiring a temperature value, and adjusting the rotating speed of a fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system. Obviously, compared with the prior art, the method detects the temperature value of the target computer system by using the current flowing through the PCBA, and can avoid the influence of the temperature of the PCBA on the temperature measurement value of the target computer system, so that the temperature value of the computer system can be more accurately detected by the arrangement mode, and the computer system can be accurately radiated. Accordingly, the heat dissipation device, the equipment and the medium of the computer system provided by the application also have the beneficial effects.

Description

A computer system cooling method, device, equipment and medium

technical field

The present invention relates to the field of computer technology, and in particular, to a heat dissipation method, device, device and medium for a computer system.

Background technique

Under the existing computer system architecture, a temperature sensing component is usually used to feed back the temperature value of the computer system, and the detected temperature value is used to cool down the computer system. Among them, in the process of using the temperature sensing component to feedback the temperature value of the computer system, first of all, it is necessary to connect the more common temperature sensing component BJT (Bipolar Junction Transistor, bipolar junction transistor) chip, IC (Integrated Circuit, integrated circuit) chip or The thermistor is attached to the PCBA (Printed CircuitBoard Assembly, printed circuit board) through SMD (Surface Mounted Devices), and then the temperature value of the computer system is determined by the voltage and current fed back by the temperature sensing component, However, since the temperature sensing component is attached to the PCBA through SMD, the temperature value detected by the temperature sensing component will be relatively close to the temperature of the PCBA board itself, and will not accurately reflect the temperature value of the computer system. Therefore, under this detection mechanism, additional software algorithms are needed to infer the actual temperature value of the computer system, and finally, the BMC cools the computer system according to the actual temperature value of the computer system. Obviously, since this temperature detection method cannot accurately feed back the temperature value of the target computer system, it will cause the problem that the computer system cannot accurately dissipate heat. At present, there is no more effective solution to this phenomenon.

It can be seen that how to more accurately detect the temperature value of the computer system and accurately dissipate heat to the computer system is a technical problem to be solved urgently by those skilled in the art.

SUMMARY OF THE INVENTION

In view of this, the purpose of the present invention is to provide a heat dissipation method, device, device and medium for a computer system, so that the temperature value of the computer system can be detected more accurately, and the computer system can be accurately dissipated. Its specific plan is as follows:

A method for cooling a computer system, applied to a BMC in a target computer system, comprising:

Use busbar to detect the temperature value of the target computer system; wherein, the busbar is a wire and cable pre-inserted on the PCBA in the target computer system;

The temperature value is acquired, and the rotational speed of the fan in the target computer system is adjusted according to the temperature value, so as to dissipate heat to the target computer system.

Preferably, the busbar is evenly inserted on the PCBA.

Preferably, the process of using the busbar to detect the temperature value of the target computer system includes:

Use a current detection circuit to detect the target voltage value of the busbar;

The temperature value of the target computer system is determined according to the target voltage value and a target mapping relationship; wherein, the target mapping relationship is the temperature value of the busbar and the unit temperature of the busbar established in advance according to the attribute characteristics of the busbar The mapping relationship between the impedance values of the area busbar.

Preferably, the current detection circuit includes: a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sensing resistor for measuring the resistance value of the busbar, and an operational amplifier;

Wherein, the first end of the sensing resistor is connected to the first end of the first resistor, the first end of the sensing resistor is also used for receiving the target voltage, and the second end of the sensing resistor is respectively connected to The first end of the second resistor is connected to the first end of the third resistor, the second end of the second resistor is grounded, and the second end of the first resistor is respectively connected to the positive phase of the operational amplifier The input end is connected to the first end of the fourth resistor, the second end of the fourth resistor is grounded, and the second end of the third resistor is respectively connected to the negative input end of the operational amplifier and the fifth The first end of the resistor is connected to the second end of the fifth resistor is connected to the output end of the operational amplifier.

Preferably, the process of determining the temperature value of the target computer system according to the target voltage value and the target mapping relationship includes:

Obtain the target impedance value of the busbar by using the target voltage value;

A target temperature value corresponding to the target impedance value is searched from the target mapping relationship, and the target temperature value is determined as the temperature value of the target computer system.

Preferably, it also includes:

The target mapping relationship is stored in the BMC in advance.

Correspondingly, the present invention also discloses a heat dissipation device for a computer system, which is applied to the BMC in the target computer system, including:

A temperature detection module for detecting the temperature value of the target computer system by using the busbar; wherein the busbar is a wire and cable pre-inserted on the PCBA in the target computer system;

A rotational speed adjustment module, configured to acquire the temperature value, and adjust the rotational speed of the fan in the target computer system according to the temperature value, so as to dissipate heat from the target computer system.

Correspondingly, the present invention also discloses a heat dissipation device for a computer system, including:

memory for storing computer programs;

The processor is configured to implement the steps of the method for dissipating heat of a computer system as disclosed above when the computer program is executed.

Correspondingly, the present invention also discloses a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by the processor, the heat dissipation of the computer system as disclosed above is realized. steps of the method.

It can be seen that in the present invention, firstly, the busbar is inserted on the PCBA of the target computer system in advance, because the busbar can generate conduction loss and emit heat under the condition of current flow. The busbar can detect the temperature value of the target computer system; when the BMC obtains the temperature value of the computer system, it adjusts the speed of the fan in the target computer system according to the temperature value to dissipate heat to the target computer system. Obviously, compared with the prior art, because the method provided by the present invention utilizes the current flowing through the PCBA to detect the temperature value of the target computer system, the temperature of the PCBA board itself can be avoided to affect the temperature measurement value of the target computer system. Therefore, by this method, the temperature value of the computer system can be detected more accurately, and the computer system can be accurately dissipated. Correspondingly, the cooling device, equipment and medium of a computer system provided by the present invention also have the above beneficial effects.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

1 is a flowchart of a method for cooling a computer system according to an embodiment of the present invention;

Figure 2 is a schematic diagram of the mapping relationship between the temperature value of the busbar and the impedance value;

3 is a structural diagram of a current detection circuit according to an embodiment of the present invention;

4 is a structural diagram of a heat dissipation device of a computer system according to an embodiment of the present invention;

FIG. 5 is a structural diagram of a heat dissipation device of a computer system according to an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Please refer to FIG. 1. FIG. 1 is a flowchart of a method for cooling a computer system according to an embodiment of the present invention. The method includes:

Step S11: use the busbar to detect the temperature value of the target computer system;

Among them, the busbar is a wire and cable pre-inserted on the PCBA in the target computer system;

Step S12: Obtain a temperature value, and adjust the rotational speed of the fan in the target computer system according to the temperature value, so as to dissipate heat to the target computer system.

In this embodiment, a heat dissipation method for a novel computer system is provided, by which the temperature value of the computer system can be detected more accurately, and the computer system can be accurately dissipated. It should be noted that the heat dissipation method provided in this embodiment is described with the BMC in the target computer system as the execution body. In the heat dissipation method, a busbar needs to be inserted on the PCBA of the target computer system in advance.

It can be understood that the PCBA in the target computer system is generally used to carry various electronic components in the target computer system. Therefore, the temperature value of the PCBA can usually be used to characterize the temperature value of the entire target computer system, and the busbar is generally used. As a transmission wire in power systems, it is used to transmit electricity in distribution networks, distribution boxes and substations. Because the busbar can generate conduction loss and dissipate heat under the condition of current flow, in this embodiment, the busbar inserted on the PCBA is used to detect the temperature value of the target computer system.

It is conceivable that when the temperature value of the target computer is obtained, the BMC can adjust the speed of the fan in the target computer according to the temperature value of the target computer, thereby achieving the purpose of cooling the target computer. Since the process of adjusting the fan speed by the BMC according to the temperature value of the target computer is well known to those skilled in the art, the focus of this application is on how to more accurately detect the temperature value of the target computer system. In the embodiment, the process of adjusting the fan speed by the BMC is not described in detail.

Compared with the prior art, because the heat dissipation method provided in this embodiment uses the current flowing through the PCBA to detect the temperature value of the target computer system, it can avoid the temperature of the PCBA board itself being affected by the temperature measurement value of the target computer system. Therefore, through this detection method, the temperature value of the target computer system can be accurately detected, and the target computer system can be accurately dissipated.

In addition, since the cost of the busbar is lower than the cost of the temperature sensing component in the prior art, when the method provided in this embodiment is used to detect the temperature value of the target computer system, the required cost of the target computer system can be relatively reduced. design cost.

It can be seen that in this embodiment, the busbar is first inserted on the PCBA of the target computer system in advance, because the busbar can generate conduction loss and emit heat under the condition of current flow, so the use of the circuit board inserted on the PCBA is used. The busbar can detect the temperature value of the target computer system; when the BMC obtains the temperature value of the computer system, it adjusts the speed of the fan in the target computer system according to the temperature value to dissipate heat to the target computer system. Obviously, compared with the prior art, because the method provided by this embodiment uses the current flowing through the PCBA to detect the temperature value of the target computer system, it can avoid the temperature of the PCBA board itself being affected by the temperature measurement value of the target computer system. Therefore, through this method, the temperature value of the computer system can be detected more accurately, and the computer system can be accurately dissipated.

Based on the above embodiment, this embodiment further describes and optimizes the technical solution. As a preferred embodiment, the busbar is evenly inserted on the PCBA.

It can be understood that in practical applications, the chips or processors installed on the PCBA of the target computer system must have logic devices with relatively high operating power and relatively low operating power, and the heat they dissipate must also have The difference will cause the surface temperature of the PCBA to be locally overheated or locally low.

Obviously, if the surface temperature of the PCBA is locally overheated or locally low, then the impedance value of the busbar inserted in a position with a higher temperature of the PCBA will be larger, while the impedance value of the busbar inserted in a position with a lower temperature of the PCBA will be higher. Therefore, in this embodiment, in order to avoid the measurement error caused by the uneven insertion of the busbar on the PCBA, the busbar is evenly inserted on the PCBA in advance, so that the busbar can be used more accurately The temperature value of the target computer system is detected.

Based on the above embodiment, this embodiment further illustrates and optimizes the technical solution. As a preferred implementation, the above steps: the process of using the busbar to detect the temperature value of the target computer system, including:

Use the current detection circuit to detect the target voltage value of the busbar;

Determine the temperature value of the target computer system according to the target voltage value and the target mapping relationship;

The target mapping relationship is a mapping relationship between the temperature value of the busbar and the impedance value of the busbar per unit area established in advance according to the attribute characteristics of the busbar.

It can be understood that the busbar is mainly composed of copper foil. Therefore, when a current passes through the busbar, the copper foil in the busbar will generate impedance, which will cause the busbar to generate a voltage difference and cause the buabar to emit corresponding heat. Obviously, under this setting mechanism, since the heat dissipated by the busbar is caused by the current flowing through the PCBA, the temperature value of the busbar can represent the temperature value of the target computer.

Please refer to Figure 2. Figure 2 is a schematic diagram of the mapping relationship between the temperature value and the impedance value of the busbar. The mapping relationship shown in Figure 2 is when the length, width and thickness of the copper foil in the busbar are 1mm, 1mm and 35um respectively. , the corresponding relationship between copper foil impedance value and temperature value. Obviously, when the mapping relationship between the impedance value and the temperature value of the copper foil in the busbar is obtained, it is equivalent to establishing a target mapping relationship between the temperature value and the impedance value of the busbar according to the attribute characteristics of the busbar.

Among them, the calculation expression of copper foil impedance value is:

In the formula, l is the length of the busbar, w is the width of the busbar, t is the thickness of the busbar, and ρ is the specific impedance of the copper foil in the busbar.

In practical applications, if the calculation is based on the impedance value of the busbar per unit area, then the calculation expression of the busbar impedance value is:

In the formula, R _P is the impedance value of the busbar per unit area read from the mapping table shown in Figure 2, l is the length of the busbar, w is the width of the busbar, and t is the thickness of the busbar.

If the length and width of the copper foil in the busbar are 50mm and 3mm respectively, and the temperature of the busbar is 25°C, then the impedance value of the busbar is: R=R _p ×1/w×35/t=0.49×50/3 ×35/35=8.17mΩ. In this case, if the current on the PCBA is 3A, then the voltage drop of the busbar is 24.5mA; and when the temperature of the busbar rises to 100°C, according to the mapping relationship shown in Figure 2, the impedance value of the busbar will be will increase by 29%, and the voltage drop of the busbar will also increase to 31.6mV at this time. Therefore, in the actual operation process, in the process of using the busbar to detect the temperature value of the target computer system, the current detection circuit is first used to detect the target voltage value of the busbar, and then, according to the target voltage value of the busbar and the pre-created target The mapping relationship is used to determine the temperature value of the target computer system.

Please refer to FIG. 3 , which is a structural diagram of a current detection circuit according to an embodiment of the present invention. As a preferred embodiment, the current detection circuit includes: a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, and a sensing resistor Rs for measuring the resistance value of the busbar and the operational amplifier U;

The first end of the sensing resistor Rs is connected to the first end of the first resistor R1, the first end of the sensing resistor Rs is also used to receive the target voltage, and the second end of the sensing resistor Rs is respectively connected to the second resistor R2 The first end of the first resistor R3 is connected to the first end of the third resistor R3, the second end of the second resistor R2 is grounded, and the second end of the first resistor R1 is respectively connected to the non-inverting input end of the operational amplifier U and the first end of the fourth resistor R4. One end is connected, the second end of the fourth resistor R4 is grounded, the second end of the third resistor R3 is connected to the negative input end of the operational amplifier U and the first end of the fifth resistor R5 respectively, the second end of the fifth resistor R5 The terminal is connected to the output terminal of the operational amplifier U.

In this embodiment, the current detection circuit shown in FIG. 3 is used to detect the target voltage value of the busbar. In the actual operation process, the sensing resistor can be replaced with the two wiring ports of the busbar. Obviously, through such a setting The method is equivalent to connecting the busbar to the detection circuit. In this case, the operational amplifier U can be used to detect the voltage drop of the busbar, that is, to detect the target voltage value of the busbar.

As a preferred embodiment, the above steps: the process of determining the temperature value of the target computer system according to the target voltage value and the target mapping relationship, including:

Use the target voltage value to obtain the target impedance value of the busbar;

The target temperature value corresponding to the target impedance value is searched from the target mapping relationship, and the target temperature value is determined as the temperature value of the target computer system.

In this embodiment, in the process of calculating the temperature value of the target computer system, the target impedance value of the busbar is first obtained by using the target voltage value of the busbar, that is, the busbar is determined according to the target voltage value of the busbar and the current flowing through the busbar. Then, according to the obtained target impedance value of the busbar, the target temperature value corresponding to the target impedance value is searched from the target mapping relationship.

It can be understood that, because the target temperature value obtained by the search is the temperature value of the busbar, and the temperature value of the busbar is the temperature value generated by the current flowing on the PCBA, in this case, the temperature value of the busbar can be calculated. Determined as the temperature value of the target computer system.

As a preferred embodiment, it also includes:

The target mapping relationship is stored in the BMC in advance.

In practical applications, the target mapping relationship between the temperature value of the busbar and the impedance value can also be stored in the BMC in advance, so that the BMC can directly access the target mapping relationship stored in the BMC during the process of regulating the fan speed. Find the temperature value corresponding to the target computer system in the computer, and directly adjust the speed of the fan according to the temperature value of the target computer system, so that the purpose of cooling the target computer system can be achieved.

Obviously, with the technical solution provided in this embodiment, since the tedious process of calling the target mapping relationship from other storage areas by the BMC can be avoided, this setting method can further improve the control speed when the BMC controls the fan.

Please refer to FIG. 4. FIG. 4 is a structural diagram of a heat dissipation device of a computer system according to an embodiment of the present invention. The heat dissipation device is applied to a BMC in a target computer system, including:

The temperature detection module 21 is used to detect the temperature value of the target computer system by using the busbar; wherein, the busbar is a wire and cable pre-inserted on the PCBA in the target computer system;

The rotational speed adjustment module 22 is used for acquiring the temperature value, and adjusting the rotational speed of the fan in the target computer system according to the temperature value, so as to dissipate heat to the target computer system.

Preferably, the temperature detection module 21 includes:

The voltage detection sub-module is used to detect the target voltage value of the busbar by using the current detection circuit;

The temperature detection sub-module is used to determine the temperature value of the target computer system according to the target voltage value and the target mapping relationship; wherein, the target mapping relationship is the temperature value of the busbar and the impedance value of the busbar per unit area established in advance according to the attribute characteristics of the busbar mapping relationship between them.

Preferably, the temperature detection sub-module includes:

an impedance acquisition unit, used to obtain the target impedance value of the busbar by using the target voltage value;

The temperature determination unit is used for searching the target temperature value corresponding to the target impedance value from the target mapping relationship, and determining the target temperature value as the temperature value of the target computer system.

Preferably, it also includes:

The relationship storage module is used to store the target mapping relationship to the BMC in advance.

A heat dissipation device for a computer system provided by an embodiment of the present invention has the beneficial effects of the heat dissipation method for a computer system disclosed above.

Please refer to FIG. 5. FIG. 5 is a structural diagram of a heat dissipation device of a computer system according to an embodiment of the present invention. The heat dissipation device includes:

memory 31 for storing computer programs;

The processor 32 is configured to implement the steps of the method for cooling a computer system as disclosed above when executing the computer program.

The heat dissipation device for a computer system provided by the embodiment of the present invention has the beneficial effects of the heat dissipation method for a computer system disclosed above.

Correspondingly, an embodiment of the present invention also discloses a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, a method for cooling a computer system as disclosed above is implemented. step.

A computer-readable storage medium provided by an embodiment of the present invention has the beneficial effects of the heat dissipation method for a computer system disclosed above.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments may be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method.

Finally, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any existence between these entities or operations. This actual relationship or sequence. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a list of elements includes not only those elements, but without further limitation Below, an element defined by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article, or device that includes the element.

The heat dissipation method, device, equipment and medium of a computer system provided by the present invention have been described in detail above. The principles and implementations of the present invention are described with specific examples in this paper. The descriptions of the above embodiments are only used for Help to understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. In summary, the content of this specification It should not be construed as a limitation of the present invention.

Claims (8)

1. the heat dissipation method of a computer system, is characterized in that, is applied to the BMC in the target computer system, comprises: Use busbar to detect the temperature value of the target computer system; wherein, the busbar is a wire and cable pre-inserted on the PCBA in the target computer system; acquiring the temperature value, and adjusting the rotational speed of the fan in the target computer system according to the temperature value, so as to dissipate heat from the target computer system; The process of using the busbar to detect the temperature value of the target computer system includes: Use a current detection circuit to detect the target voltage value of the busbar; The temperature value of the target computer system is determined according to the target voltage value and a target mapping relationship; wherein, the target mapping relationship is the temperature value of the busbar and the unit temperature of the busbar established in advance according to the attribute characteristics of the busbar The mapping relationship between the impedance values of the area busbar. 2 . The heat dissipation method according to claim 1 , wherein the busbar is evenly inserted on the PCBA. 3 . 3. The heat dissipation method according to claim 1, wherein the current detection circuit comprises: a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a resistor for measuring the busbar Sensing resistors and operational amplifiers for resistance values; Wherein, the first end of the sensing resistor is connected to the first end of the first resistor, the first end of the sensing resistor is also used for receiving the target voltage, and the second end of the sensing resistor is respectively connected to The first end of the second resistor is connected to the first end of the third resistor, the second end of the second resistor is grounded, and the second end of the first resistor is respectively connected to the positive phase of the operational amplifier The input end is connected to the first end of the fourth resistor, the second end of the fourth resistor is grounded, and the second end of the third resistor is respectively connected to the negative input end of the operational amplifier and the fifth The first end of the resistor is connected to the second end of the fifth resistor is connected to the output end of the operational amplifier. 4. The heat dissipation method according to claim 1, wherein the process of determining the temperature value of the target computer system according to the target voltage value and the target mapping relationship comprises: Obtain the target impedance value of the busbar by using the target voltage value; A target temperature value corresponding to the target impedance value is searched from the target mapping relationship, and the target temperature value is determined as the temperature value of the target computer system. 5. The heat dissipation method of claim 1, further comprising: The target mapping relationship is stored in the BMC in advance. 6. a heat dissipation device of a computer system, is characterized in that, is applied to the BMC in the target computer system, comprising: A temperature detection module for detecting the temperature value of the target computer system by using the busbar; wherein the busbar is a wire and cable pre-inserted on the PCBA in the target computer system; a rotational speed adjustment module, configured to obtain the temperature value, and adjust the rotational speed of the fan in the target computer system according to the temperature value, so as to dissipate heat to the target computer system; The process of using the busbar to detect the temperature value of the target computer system includes: Use a current detection circuit to detect the target voltage value of the busbar; The temperature value of the target computer system is determined according to the target voltage value and a target mapping relationship; wherein, the target mapping relationship is the temperature value of the busbar and the unit temperature of the busbar established in advance according to the attribute characteristics of the busbar The mapping relationship between the impedance values of the area busbar. 7. A cooling device for a computer system, comprising: memory for storing computer programs; The processor is configured to implement the steps of the heat dissipation method for a computer system according to any one of claims 1 to 5 when executing the computer program. 8. A computer-readable storage medium, characterized in that, a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, a computer program according to any one of claims 1 to 5 is implemented. The steps of a heat dissipation method for a computer system.

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