CN111973167A - Wearable device, optical module and packaging method thereof - Google Patents

Abstract

The invention discloses a wearable device, an optical device, an optical module and an encapsulation method thereof. The encapsulation method comprises the steps of: providing a substrate loaded with components; using two-color injection molding, secondary injection molding or encapsulation process to form a transparent The cover plate of the optical zone; the cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the The components are accommodated in the accommodating space to form the optical module. The molding shape of the cover plate of the present invention can be flexibly changed, and the outer surface of the cover plate can be formed into a plane or a curved surface or other complex curved surfaces, and then can be adaptively adjusted according to the shape of the equipment shell, thereby reducing the waste of the internal space of the equipment, which is conducive to realizing the miniaturization. In addition, the shape of the cover plate can be flexibly changed, the light-transmitting area is arranged on the cover plate, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of optical path design, and the process cost is low.

Description

Wearable device, optical device, optical module and packaging method thereof

technical field

The present invention relates to the technical field of electronic devices, in particular to a wearable device, an optical device, an optical module and a packaging method thereof.

Background technique

With the continuous enhancement of people's health awareness, more and more smart electronic devices, such as wristbands and watches, choose to integrate optical devices, such as heart rate sensors, which measure the user's heart rate and blood oxygen concentration according to the PPG principle. In the industry, the optical module is generally packaged by potting glue or mounting glass cover. When it is applied to the whole machine, it is often necessary to open the window design on the shell of the device. However, there are the following problems in the way of potting glue or mounting glass cover: (1) The upper surface of the optical module is generally flat, which cannot well adapt to the situation when the equipment shell is curved, which will cause a waste of the internal space of the equipment; (2) The shape of the light-transmitting body on the optical module is single, and the flexibility of the optical path design is small, and the structure design of the light-transmitting body with complex shape is very expensive; (3) Since the optical module and the shell cannot be completely eliminated during assembly Due to the distance between the windows, part of the light emitted by the LED will be reflected back to the PD by the lower surface of the window, resulting in optical crosstalk and affecting the accuracy of the measurement signal.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to propose a wearable device, an optical device, an optical module and a packaging method thereof, aiming to solve the technical problems of wasting equipment space and low flexibility in optical path design in the optical module.

In order to achieve the above object, the present invention provides a packaging method for an optical module, and the packaging method for the optical module includes the following steps:

providing a substrate loaded with components;

A cover plate with a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process;

The cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated in the base plate In the accommodating space, the optical module is formed.

Preferably, the cover plate includes a light-shielding plate and a light-transmitting block, and the step of forming a cover plate with a light-transmitting area by two-color injection molding, secondary injection molding or overmolding process includes:

The light-shielding plate and the light-transmitting block are integrally formed by two-color injection molding, secondary injection molding or overmolding process;

The cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated in the base plate. In the accommodating space, the steps of forming the optical module include:

One end of the light-shielding plate is installed on the base plate, the other end of the light-shielding plate protrudes toward the side away from the base plate, and the light-shielding plate surrounds the accommodation space, and the accommodation space is away from the base plate. One side of the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the light-transmitting block forms the light-transmitting area.

Preferably, the base plate is provided with a ventilation hole communicating with the accommodating space at a position corresponding to the accommodating space;

One end of the light-shielding plate is installed on the base plate, and the other end of the light-shielding plate protrudes toward the side away from the base plate. The side away from the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the step of forming the light-transmitting area by the light-transmitting block includes:

One end of the shading plate is bonded to the base plate through an adhesive, and the ventilation hole communicates the accommodation space with the cavity;

The adhesive is subjected to a baking curing process.

Preferably, after the step of baking the optical module to cure the adhesive, the method further includes:

filling the vent hole with adhesive;

The adhesive is subjected to irradiation curing treatment, so that the adhesive seals the vent hole.

Preferably, a side of the light-transmitting block facing the accommodating space is concave, convex or flat.

Preferably, the optical module has a plurality of the accommodation spaces arranged at intervals, any two adjacent accommodation spaces are separated by the shading plate, and each accommodation space is provided with one of the accommodation spaces correspondingly. A light-transmitting block; the component includes a light-emitting element and a light-receiving element, and the light-emitting element and the light-receiving element are respectively arranged in different receiving spaces.

Preferably, the cover plate has a rectangular structure or a circular structure;

When the cover plate has a rectangular structure, a plurality of the receiving spaces are arranged at intervals along the length direction of the cover plate, and in any two adjacent receiving spaces, one of the receiving spaces houses a light-emitting element , and another said receiving space accommodates a light-receiving element;

When the cover plate has a circular structure, among a plurality of the receiving spaces, one of the receiving spaces accommodates the light-emitting element and is located at the center of the cover plate, and the rest of the receiving spaces all contain the light-emitting element. The light receiving elements are arranged at intervals around the receiving space at the center of the cover plate.

The present invention also provides an optical module. The optical module is prepared by using the above-mentioned encapsulation method of the optical module.

The present invention also provides an optical device, the optical device includes a housing and the above-mentioned optical module;

The casing has a cavity, and the casing is provided with a window communicating with the cavity;

The optical module is accommodated in the cavity, and a side of the cover plate away from the substrate is embedded at the window to block the window, and the light-transmitting area is located corresponding to the position of the window.

Preferably, the outer surface of the casing and the surface of the cover plate facing away from the cavity are smoothly transitioned into an integral surface.

The present invention also provides a wearable device, the wearable device includes the above-mentioned optical device.

In the packaging method of the optical module of the present invention, by providing a substrate loaded with components, a cover plate with a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process, and the cover plate is installed on the substrate, The cover plate protrudes toward the side away from the base plate, and an accommodation space is formed between the cover plate and the base plate, and the components are accommodated in the accommodation space to form an optical module. Since the cover plate of the optical module is formed by two-color injection molding, secondary injection molding or overmolding process, its molding shape can be flexibly changed, and the outer surface of the cover plate can be formed into a plane or curved surface or other complex curved surfaces, that is, the outer surface of the cover plate It can be adaptively adjusted according to the shape of the device shell, reducing the waste of the internal space of the device, which is conducive to realizing the miniaturization of the device, especially for the wearable device which is a TWS earphone, the miniaturization advantage is more obvious. In addition, the shape of the cover plate can be flexibly changed, the light-transmitting area is arranged on the cover plate, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of the optical path design, and the process cost is low.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

1 is a schematic flowchart of a first embodiment of a packaging method for an optical module of the present invention;

2 is a schematic flowchart of a second embodiment of a packaging method for an optical module of the present invention;

FIG. 3 is a schematic flow chart of the refinement of step S300 in the packaging method of the optical module of the present invention;

4 is a three-dimensional schematic diagram of an optical module according to an embodiment of the present invention;

5 is a three-dimensional schematic diagram of an optical module without a substrate according to an embodiment of the present invention;

6 is a schematic cross-sectional view of an optical module according to an embodiment of the present invention;

7 is a schematic cross-sectional view of an optical module according to another embodiment of the present invention;

8 is a schematic cross-sectional view of an optical module according to another embodiment of the present invention;

9 is a schematic top view of an optical module according to another embodiment of the present invention;

10 is a schematic cross-sectional view of a functional chip in an optical module located outside the accommodation space according to an embodiment of the present invention;

11 is a schematic cross-sectional view of a functional chip in an optical module located in an accommodation space according to an embodiment of the present invention;

12 is another cross-sectional schematic diagram of an optical module according to an embodiment of the present invention;

13 is a schematic cross-sectional view of an optical device according to an embodiment of the present invention;

14 is a schematic cross-sectional view of an optical device provided with a scratch-resistant layer according to an embodiment of the present invention;

15 is an assembly perspective view of an optical module and a housing in an optical device according to an embodiment of the present invention.

Description of reference numbers:

The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that if there are directional indications (such as up, down, left, right, front, back, etc.) involved in the embodiments of the present invention, the directional indications are only used to explain a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.

In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for the purpose of description, and should not be construed as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.

The descriptions of orientations such as "up", "down", "left" and "right" in the present invention are based on the orientations shown in FIG. 6 and FIG. 13 , and are only used to explain the orientations shown in FIGS. 6 and 13 The relative positional relationship between the components, if the specific posture changes, the directional indication also changes accordingly.

The present invention provides a packaging method for an optical module.

Referring to FIG. 1, it is a schematic flowchart of a first embodiment of a packaging method for an optical module according to the present invention, and the method includes the following steps:

Step S100, providing a substrate loaded with components;

4 to 8 , components 22 are mounted on the lower surface of the substrate 21 , and it is understood that the components 22 can be used to transmit and receive light. The substrate 21 in this embodiment can be an organic substrate 21 or a ceramic substrate 21 with high strength, and can also be a PCB board. After grinding and dicing, the components 22 are mounted on the substrate 21 and bonded with the substrate 21 by wire bonding.

Step S200, adopting two-color injection molding, secondary injection molding or overmolding process to form a cover plate with a light-transmitting area;

Specifically, in this embodiment, PA (Polyamide, nylon), ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene-styrene copolymer), PMMC (polymethyl methacrylate, polymethyl methacrylate), PC (Polycarbonate, Polycarbonate) and other materials, the cover plate 23 is formed by two-color injection molding, secondary injection molding or overmolding process, and the cover plate 23 has a light-transmitting area. through the light-transmitting area. The cover plate 23 is integrally formed by two-color injection molding, secondary injection molding or overmolding process, which not only omits assembly steps, is easy to manufacture, improves production efficiency, but also avoids assembly errors, improves the consistency of finished products, and is conducive to improving the accuracy of measurement algorithms Spend.

In addition, the cover plate 23 is formed by two-color injection molding, secondary injection molding or overmolding process, and its molding shape can be flexibly changed. As shown in FIGS. 4 to 8 , the outer surface of the cover plate 23 can be formed into a flat surface, as shown in FIGS. 12 and 12 As shown in 15, the outer surface of the cover plate 23 can be formed into a curved surface. In other embodiments, the outer surface of the cover plate 23 can also be formed into other complex shapes, so that the outer surface of the cover plate 23 can be shaped according to the shape of the device housing 10. The adaptive adjustment reduces the waste of the internal space of the device, which is conducive to the miniaturization of the device, especially for the wearable device that is a TWS headset, the miniaturization advantage is more obvious. In addition, the shape of the cover plate 23 can be flexibly changed, the light-transmitting area is arranged on the cover plate 23, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of the optical path design, and the process cost is low.

Step S300, the cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated In the receiving space, the optical module is formed.

As shown in FIG. 4 to FIG. 14 , the cover plate 23 is placed on the bottom of the base plate 21 , and the lower side of the cover plate 23 protrudes downward. A receiving space 24 is formed between the cover plate 23 and the base plate 21 , and the components 22 are accommodated In the receiving space 24, the optical module 20 is formed.

The optical module 20 of this embodiment can be applied to a wearable device, such as a wristband, a watch or an earphone. When the wristband or watch is worn on the human wrist, the bottom of the cover plate 23 is located inside the wearable device. , that is, the side facing the human skin. Understandably, the optical module 20 monitors the human heart rate through photoelectric projection measurement, that is, the components 22, such as LED lights, emit light to illuminate the skin. Since blood absorbs light of a specific wavelength, each time the heart pump When blood is absorbed, this wavelength will be absorbed in large quantities, so that the heartbeat can be determined and the heart rate of the human body can be monitored. The monitoring of human blood oxygen is similar to the monitoring of heart rate, and will not be repeated here. The cover plate 23 of this embodiment has a light-transmitting area, the light emitted by the components 22 passes through the light-transmitting area to illuminate the human skin, and the light reflected by the human skin passes through the light-transmitting area and is received by the components 22 , so that the optical module 20 can pair the Monitoring of human heart rate and blood oxygen.

In the packaging method of the optical module 20 in this embodiment, by providing a substrate 21 loaded with components 22, a cover plate 23 having a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process, and the cover plate is 23 is mounted on the base plate 21 , the cover plate 23 protrudes toward the side away from the base plate 21 , and an accommodation space 24 is formed between the cover plate 23 and the base plate 21 , and the components 22 are accommodated in the accommodation space 24 to form the optical module 20 . Since the cover plate 23 of the optical module 20 is formed by two-color injection molding, secondary injection molding or overmolding process, its molding shape can be flexibly changed, and the outer surface of the cover plate 23 can be formed into a plane or curved surface or other complex curved surfaces, that is, the cover plate The outer surface of 23 can be adaptively adjusted according to the shape of the device casing 10, which reduces the waste of the internal space of the device and is conducive to realizing the miniaturization of the device, especially for the wearable device being a TWS earphone, the miniaturization advantage is more obvious. In addition, the shape of the cover plate 23 can be flexibly changed, the light-transmitting area is arranged on the cover plate 23, and the shape of the light-transmitting area can also be flexibly changed, thereby improving the flexibility of the optical path design, and the process cost is low.

Further, referring to FIG. 2 , it is a schematic flowchart of the second embodiment of the packaging method of the optical module according to the present invention. Based on the above-mentioned first embodiment, the step S200 includes:

Step S201, adopting two-color injection molding, secondary injection molding, or overmolding process to integrally form the light-shielding plate and the light-transmitting block;

Specifically, the light-shielding plate 231 of this embodiment can be made of materials such as PA, ABS, the light-transmitting block 232 can be made of materials such as PMMC, PC, and the like. The encapsulation process is integrally formed, which not only omits assembly steps, is easy to manufacture, improves production efficiency, but also avoids assembly errors, improves the consistency of finished products, and is conducive to improving the accuracy of measurement algorithms.

The step S300 includes:

Step S301, one end of the light shielding plate is installed on the base plate, the other end of the light shielding plate protrudes toward the side away from the base plate, and the light shielding plate is enclosed to form the receiving space, and the receiving space is formed by the light shielding plate. A side of the space away from the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the light-transmitting block forms the light-transmitting area.

The light-shielding plate 231 and the light-transmitting block 232 are integrally formed by two-color injection molding, secondary injection molding or plastic wrapping process, so that the cover plate 23 is integrally formed. In the process of assembling the cover plate 23 and the base plate 21 , the light shielding plate 231 of the cover plate 23 can be installed on the base plate 21 . Specifically, the upper end of the cover plate 23 is mounted on the base plate 21 , the lower end of the shading plate 231 protrudes downward, the shading plate 231 encloses a receiving space 24 , and the bottom of the receiving space 24 has an opening 241 . The light-transmitting block 232 is installed at the opening 241 , the opening 241 is blocked by the light-transmitting block 232 , and the light-transmitting block 232 forms a light-transmitting area, which facilitates light transmission and realizes light transmission and reception in the receiving space 24 .

Further, the base plate 21 is provided with a ventilation hole 211 at a position corresponding to the accommodating space 24, and the ventilation hole 211 is communicated with the accommodating space 24; the step S301 includes:

In step S3011, one end of the light shielding plate is bonded to the substrate through an adhesive, and the ventilation hole communicates the accommodation space with the cavity;

Step S3012, baking and curing the adhesive is performed.

In this embodiment, the upper end of the light shielding plate 231 is bonded to the bottom of the base plate 21 by the adhesive 30 . Specifically, the integrally formed cover plate 23 is mounted on the substrate 21 by means of scribing and SMT processes, and is subjected to high temperature baking and curing treatment to cure the adhesive 30 between the light shielding plate 231 of the cover plate 23 and the substrate 21 , to improve the assembly stability of the cover plate 23 and the base plate 21 . In order to balance the air pressure in the accommodating space 24 and the equipment cavity 11 during the high-temperature curing process, and prevent the cover plate 23 from being separated from the substrate 21 due to gas expansion, in this embodiment, a position on the substrate 21 corresponding to the accommodating space 24 is provided. The ventilation hole 211 communicates with the accommodating space 24 . Specifically, the ventilation hole 211 communicates with the accommodating space 24 and the equipment cavity 11 , which can realize the air pressure balance between the accommodating space 24 and the equipment cavity 11 during the high temperature curing process.

Further, after the step S3012, it also includes:

Step S3013, filling the vent hole with adhesive;

Step S3014, performing irradiation curing treatment on the adhesive, so that the adhesive seals the vent hole.

After the high-temperature baking and curing process is completed, the adhesive is injected into the vent hole 211 from the outside of the substrate 21. The adhesive can be UV adhesive. Light leakage occurs. It can be understood that UV glue is selected for the adhesive, and UV curing treatment is performed after filling the UV glue into the vent holes 211 , so that the adhesive can completely seal the vent holes and optimize the sealing effect.

In this embodiment, since the light-shielding plate 231 and the light-transmitting block 232 are integrally formed by two-color injection molding, secondary injection molding or overmolding process, the light-transmitting block 232 can be formed into a complex structure, and the shape of the light-transmitting block 232 is flexible and changeable. The side of the transparent block facing the receiving space 24 is concave, convex or flat. As shown in FIGS. 4 to 6 , in this embodiment, the side of the light-transmitting block 232 facing the receiving space 24 is flat, that is, the upper surface of the light-transmitting block 232 is flat, so that the thickness of the light-transmitting block 232 is uniform. Transmitting and receiving light can be incident or exiting vertically; as shown in FIG. 7 , in another embodiment, the upper surface of the light-transmitting block 232 is concave, so that the middle area of the light-transmitting block 232 is thin, and the two end areas are thicker, which is not suitable for transmitting and receiving light. As shown in FIG. 8 , in another embodiment, the upper surface of the light-transmitting block 232 is convex, so that the middle area of the light-transmitting block 232 is thicker, and the two end areas are thinner, which has a negative impact on the transmission and reception of light. The function of convergence is to improve the flexibility of the optical path design through the change of the shape of the light-transmitting block 232 .

In this embodiment, the optical module 20 has a plurality of accommodating spaces 24 arranged at intervals, any two adjacent accommodating spaces 24 are separated by a shading plate 231, and each accommodating space 24 is correspondingly provided with a light-transmitting block 232; The component 22 includes a light-emitting element 221 and a light-receiving element 222 , and the light-emitting element 221 and the light-receiving element 222 are respectively disposed in different receiving spaces 24 . The light-emitting element 221 of the present embodiment is an LED lamp, and the light-receiving element 222 is a PD. The LED and the light-receiving element 222 are respectively disposed in different receiving spaces 24 .

As shown in FIG. 4 to FIG. 8 , the number of the receiving spaces 24 is four, and the four receiving spaces 24 are arranged at intervals along the left-right direction, and from left to right are the first, second, third and fourth receiving spaces 24 respectively. , wherein the second accommodating space 24 and the fourth accommodating space 24 are provided with light-emitting elements 221, such as LED lights, and the first accommodating space 24 and the third accommodating space 24 are both provided with light-receiving elements 222, For example, a PD, the light emitted from the LED lamp irradiates the human skin, and is received by the PD adjacent to the LED lamp after reflection.

In addition, the light-transmitting block 232 blocks the opening 241 of the receiving space 24, and any two adjacent receiving spaces 24 are separated by the light-shielding plate 231, so that the outer periphery of the light-transmitting block 232 is surrounded by the light-shielding plate 231, and the light-shielding plate 231 Completely divided by the light-transmitting block 232, the optical crosstalk will not occur between the two, which improves the signal-to-noise ratio and improves the accuracy of the measurement signal.

Further, the cover plate 23 is in a rectangular structure or a circular structure; when the cover plate 23 is in a rectangular structure, a plurality of accommodating spaces 24 are arranged at intervals along the length direction of the cover plate 23, and in any two adjacent accommodating spaces 24, wherein One accommodating space 24 accommodates the light-emitting element 221 , and the other accommodating space 24 accommodates the light-receiving element 222 ; when the cover plate 23 has a circular structure, one of the plurality of accommodating spaces 24 accommodates the light-emitting element 24 . 221 and is located at the center of the cover plate 23 , and the remaining accommodation spaces 24 accommodate light-receiving elements 222 and are arranged at intervals around the accommodation space 24 at the center position of the cover plate 23 .

As shown in FIG. 4 to FIG. 8 , in one embodiment, the cover plate 23 has a rectangular structure, the length direction of the cover plate 23 is the left-right direction, the plurality of accommodation spaces 24 are arranged at intervals along the left-right direction, and any two adjacent storage spaces 24 are arranged in the left-right direction. Among the spaces 24, one of the accommodating spaces 24 accommodates an LED lamp, and the other accommodating space 24 accommodates a PD. The light emitted from the LED lamp irradiates the human skin and is received by the PD adjacent to the LED lamp after reflection.

As shown in FIG. 9 , in another embodiment, the cover plate 23 has a circular structure. Among the plurality of accommodation spaces 24 , one of the accommodation spaces 24 is located at the center of the cover plate 23 , and the accommodation space 24 accommodates an LED lamp. , the rest of the accommodation spaces 24 are arranged in a circular structure, and are evenly spaced around the accommodation spaces 24 at the center of the cover plate 23, and PDs are accommodated in the rest of the accommodation spaces 24, and the light emitted from the LED lamp illuminates the human skin and passes through After reflection, it is received simultaneously with multiple PDs around the LED lamp.

It can be understood that, in other embodiments, the cover plate 23 can be made of other shapes, and the structure is flexible and changeable, so as to flexibly adapt to the device casing 10 and meet different usage requirements.

In this embodiment, the optical module 20 further includes a connector 25 , and the connector 25 is installed on the side of the substrate 21 away from the receiving space 24 . As shown in FIG. 10 to FIG. 15 , the connector 25 is mounted on the upper side of the substrate 21, outside the accommodation space 24. The optical module 20 can use the connector 25 to form a stable electrical connection with the main board of the wearable device. Communication and power supply are formed, and the optical module 20 does not need to be mounted on the FPC or PCB, and its position can be flexibly set according to the actual situation.

The substrate 21 of the optical module 20 in this embodiment can also be mounted with a plurality of functional chips 26, and the plurality of functional chips 26 can be PPG AFE chips, acceleration chips, ECG chips, temperature sensor chips, resistors, capacitors, inductors, etc. , so that the optical module 20 can perform operations such as amplifying, filtering, and analog-to-digital conversion on the received signal, or the optical module 20 can integrate other functions. As shown in FIG. 10 , the functional chip 26 can be mounted on the upper surface of the substrate 21, or can be mounted on the lower surface of the substrate 21 outside the accommodation space 24. As shown in FIG. 11, the functional chip 26 can also be mounted on the The lower surface of the substrate 21 is located in the accommodating space 24, and is stacked with the light-emitting element 221 or the light-receiving element 222 in the vertical direction. The type and installation position of the function chip 26 can be flexibly selected according to the actual situation. The cover plate 23 , the light-emitting element 221 , the light-receiving element 222 , the connector 25 and the plurality of functional chips 26 of the optical module 20 in this embodiment are all unpackaged bare chips.

The present invention also provides an optical module 20 , and the optical module 20 is manufactured by using the packaging method of the optical module 20 as described above. Since the optical module 20 adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

As shown in FIG. 13 to FIG. 15 , the present invention further provides an optical device 100 . The optical device 100 includes a housing 10 and the optical module 20 as described above; the housing 10 has a cavity 11 inside, and the housing 10 opens There is a window 12 communicating with the cavity 11 ; the optical module 20 is accommodated in the cavity 11 , and the cover plate 23 is embedded in the window 12 on the side away from the substrate 21 , In order to block the window 12 , the light-transmitting area is located at a position corresponding to the window 12 .

The optical device 100 in this embodiment can be applied to a wearable device, such as a wristband, a watch or an earphone. When the wristband or watch is worn on the human wrist, the window 12 is located inside the wearable device, that is, the window 12 The side facing the human skin. As shown in FIGS. 13 to 15 , the bottom of the housing 10 is provided with a window 12 that communicates with the cavity 11 , the optical module 20 is accommodated in the cavity 11 , and the lower side of the cover plate 23 in the optical module 20 protrudes downward. and embedded in the window 12 , so as to block the window 12 and realize the assembly between the optical module 20 and the housing 10 . After the optical module 20 is assembled with the housing 10, the light-transmitting area of the optical module 20 corresponds to the position of the window 12, the light emitted by the components 22 irradiates the human skin through the light-transmitting area, and the light reflected by the human skin passes through the light-transmitting area and is absorbed by the human body. The component 22 receives, so as to realize the monitoring of the human heart rate and blood oxygen by the optical module 20 .

In the optical device 100 of the present embodiment, the cover plate 23 of the optical module 20 protrudes and is embedded at the window 12 to block the window 12 . The cover plate 23 can be directly used as an optical window for the wearable device. There is no need to provide an additional layer of transparent medium at the position, the number of parts is reduced, the structure is compact, and the embedded structure greatly reduces the space occupied by the optical module 20 in the wearable device, reduces the waste of internal space of the device, and is conducive to the realization of The miniaturization of the device, especially for the wearable device is the TWS earphone, the miniaturization advantage is more obvious. In addition, the optical module 20 only needs to pass through the light-transmitting area of the cover plate 23 to send and receive light without additionally passing through the transparent medium of the housing 10 , the light effect loss is small, the light output efficiency of the optical module 20 is higher, and the optical module The group 20 can use a smaller component 22 to drive the current to obtain a stronger optical signal, thereby reducing power consumption.

Specifically, the light shielding plate 231 of the cover plate 23 is embedded at the window 12 of the housing 10 to block the window 12 . The light-transmitting block 232 is installed at the opening 241 of the receiving space 24 enclosed by the shading plate 231 , and the light-transmitting block 232 forms a light-transmitting area, which facilitates light transmission and realizes light transmission and reception of the components 22 in the receiving space 24 .

Further, the outer surface of the housing 10 and the surface of the cover plate 23 facing away from the cavity 11 are smoothly connected to form an integral surface, and further, a scratch-resistant layer 40 is provided on the integral surface. In the cover plate 23, the shading plate 231 and the light-transmitting block 232 are integrally formed by two-color injection molding, secondary injection molding or overmolding process, which can form a complex structure matching the shape of the casing 10. For example, the cover plate 23 is embedded in the window 12. After that, the outer surface of the cover plate 23 fits with the outer surface of the housing 10, and can be smoothly transitioned to form an integral surface. Specifically, the surface of the cover plate 23 facing away from the cavity 11 is the outer surface of the cover plate 23. The surface and the outer surface of the housing 10 are smoothly transitioned into an integral surface.

The outer surface of the cover plate 23 can be flexibly adapted to the outer surface of the casing 10. When the outer surface of the casing 10 is a plane, the outer surface of the cover plate 23 is also a plane flush with the outer surface of the casing 10, and the outer surface of the casing 10 is a curved surface. At the same time, the outer surface of the cover plate 23 is also a curved surface that is smoothly connected with the outer surface of the housing 10 , so that the optical device 100 has an integral outer surface. Understandably, when the outer surface of the housing 10 is other special-shaped surfaces, the outer surface of the cover plate 23 can always be smoothly connected with the outer surface of the housing 10 to form an integral surface, which is flexible and changeable to meet different usage requirements.

After the optical module 20 is assembled with the casing 10, the outer surface of the cover plate 23 is directly coupled to the window 12 of the casing 10, and the cover plate 23 can be used as a part of the casing 10 to improve the compactness of the optical device 100. In addition, the optical module 20 The light-receiving element 222 and the light-emitting element 221 are closer to the outer surface of the housing 10, and thus closer to the human skin, which is also conducive to improving the measurement accuracy.

After the optical module 20 and the casing 10 are assembled, the surface of the optical device 100 can be covered with glue, that is, the outer surface of the cover plate 23 and the outer surface of the casing 10 are coated with a layer of transparent optical UV glue with Shore hardness above D , the thickness is about 30um, so as to form the anti-scratch layer 40 , which improves the anti-scratch performance of the optical device 100 while improving its sealing performance, and improves the appearance of the optical device 100 . In addition, since the thickness of the anti-scratch layer 40 is very small, it does not affect the light receiving and releasing conditions of the optical module 20 .

The present invention also provides a wearable device, and the wearable device includes the above-mentioned optical device 100 . It can be understood that the wearable device may be electronic products such as smart watches, wristbands, and earphones. Since the wearable device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the description and drawings of the present invention, or directly/indirectly applied to other All relevant technical fields are included in the scope of patent protection of the present invention.

Claims (11)

1. the encapsulation method of an optical module, is characterized in that, the encapsulation method of described optical module comprises the steps: providing a substrate loaded with components; A cover plate with a light-transmitting area is formed by two-color injection molding, secondary injection molding or overmolding process; The cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated in the base plate In the accommodating space, the optical module is formed. 2 . The packaging method of an optical module according to claim 1 , wherein the cover plate comprises a shading plate and a light-transmitting block, and the two-color injection molding, secondary injection molding or overmolding process is used to form a light-transmitting block. 3 . The steps to cover the area include: The light-shielding plate and the light-transmitting block are integrally formed by two-color injection molding, secondary injection molding or overmolding process; The cover plate is installed on the base plate, the cover plate protrudes toward the side away from the base plate, and a receiving space is formed between the cover plate and the base plate, and the components are accommodated in the base plate. In the accommodating space, the steps of forming the optical module include: One end of the light-shielding plate is installed on the base plate, the other end of the light-shielding plate protrudes toward the side away from the base plate, and the light-shielding plate surrounds the accommodation space, and the accommodation space is away from the base plate. One side of the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the light-transmitting block forms the light-transmitting area. 3 . The packaging method of an optical module according to claim 2 , wherein the substrate is provided with a ventilation hole communicating with the receiving space at a position corresponding to the receiving space; 3 . One end of the light-shielding plate is installed on the base plate, and the other end of the light-shielding plate protrudes toward the side away from the base plate. The side away from the substrate has an opening, the light-transmitting block is installed at the opening and blocks the opening, and the step of forming the light-transmitting area by the light-transmitting block includes: One end of the shading plate is bonded to the base plate through an adhesive, and the ventilation hole communicates the accommodation space with the cavity; The adhesive is subjected to a baking curing process. 4 . The method for packaging an optical module according to claim 3 , wherein after the step of baking the optical module to cure the adhesive, the method further comprises: 5 . filling the vent hole with adhesive; The adhesive is subjected to irradiation curing treatment, so that the adhesive seals the vent hole. 5 . The packaging method of an optical module according to claim 2 , wherein a side of the light-transmitting block facing the receiving space is concave, convex or flat. 6 . 6 . The packaging method of an optical module according to claim 2 , wherein the optical module has a plurality of the accommodation spaces arranged at intervals, and any two adjacent accommodation spaces pass through each other. 7 . The light-shielding plates are separated, and each of the receiving spaces is provided with one of the light-transmitting blocks; the components include a light-emitting element and a light-receiving element, and the light-emitting element and the light-receiving element are respectively arranged in different housings. within the space. 7. The packaging method of an optical module according to claim 6, wherein the cover plate is in a rectangular structure or a circular structure; When the cover plate has a rectangular structure, a plurality of the receiving spaces are arranged at intervals along the length direction of the cover plate, and in any two adjacent receiving spaces, one of the receiving spaces houses a light-emitting element , and another said receiving space accommodates a light-receiving element; When the cover plate has a circular structure, among a plurality of the receiving spaces, one of the receiving spaces accommodates the light-emitting element and is located at the center of the cover plate, and the rest of the receiving spaces all contain the light-emitting element. The light receiving elements are arranged at intervals around the receiving space at the center of the cover plate. 8 . An optical module, characterized in that, the optical module is prepared by the encapsulation method of the optical module according to any one of claims 1 to 7 . 9. An optical device, characterized in that, the optical device comprises a housing and an optical module as claimed in claim 8; The casing has a cavity, and the casing is provided with a window communicating with the cavity; The optical module is accommodated in the cavity, and a side of the cover plate away from the substrate is embedded in the window to block the window, and the light-transmitting area is located corresponding to the position of the window. 10 . The optical device according to claim 9 , wherein the outer surface of the housing and the surface of the cover plate facing away from the cavity are smoothly transitionally connected to form an integral surface. 11 . 11. A wearable device, wherein the wearable device comprises the optical device according to claim 9 or 10.

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