CN111966191B - Liquid-cooled radiator, novel server radiating system and regulation and control method - Google Patents

Abstract

The invention provides a liquid-cooled radiator, a novel server radiating system and a regulation and control method, wherein the liquid-cooled radiator comprises a radiating base and a plurality of radiating fin groups arranged on the radiating base; each radiating fin group comprises a hollow tube and two radiating fins, the radiating fins are of hollow structures, and the ends, far away from the radiating base, of the first radiating fins and the second radiating fins are connected through the hollow tube; the first radiating fins, the second radiating fins and the hollow pipe form a communicated cavity; the plurality of radiating fin groups are communicated in a serial or parallel or serial and parallel combination mode, and then two ends of the radiating fin groups are respectively communicated with the water inlet and the water outlet; the heat dissipation base is fixed on the heat generating element through the fixing hole; when the liquid-cooled radiator works, the first radiating fins, the second radiating fins and the hollow pipe form a communicated cavity and are filled with cooling liquid. The heat dissipation efficiency of the air cooling system is improved, and the effect of saving energy can be achieved.

Description

A liquid-cooled radiator, a novel server cooling system and a control method

technical field

The invention relates to the technical field of server cooling system design, in particular to a liquid-cooled radiator, a novel server cooling system and a control method.

Background technique

Air cooling and liquid cooling are the two most commonly used cooling methods for current servers. Air-cooled heat dissipation is to drive the air flow through the fan, and take the heat generated by the heat-generating components out of the server to realize the heat dissipation of the system. When the fan is working, the faster the speed, the higher the air flow rate and the stronger the heat dissipation capacity. Liquid cooling is to place a radiator filled with coolant on the heat-generating components in the server, and then take the heat out of the server through the flow of the coolant to achieve heat dissipation. The faster the coolant flow rate, the more heat it takes away per unit time, and the stronger the heat dissipation capacity.

The current control method of server air cooling and heat dissipation is based on the temperature value fed back by the internal temperature monitoring module of the server system, and the BMC controls the speed of multiple sets of fans in the server. The higher the temperature value, the faster the fan speed. However, there is a certain hysteresis in the temperature value feedback method. For example, in a certain business scenario, the power consumption of the CPU of the server increases sharply, and a large amount of heat is accumulated in a short period of time, and this power consumption change is reflected in the temperature change and then transmitted to the BMC through the temperature monitoring module. It takes some time. During this time, the fans are still running at a lower RPM and cannot bring heat to the outside of the case as quickly. As a result, when the BMC starts to adjust the fan speed according to the temperature value, the temperature value is already at a high level, so the fan must also run at a high speed, which leads to the violent fluctuation of the fan speed and the server temperature, which is not conducive to The stability of the server system will also increase the risk of fan aging and failure. In a more serious situation, if the temperature of the CPU exceeds the maximum value it can withstand during the period of feedback lag, it will cause downtime and cause serious losses to users.

The current liquid cooling system is usually used in conjunction with an air cooling system. A liquid cooling radiator is placed on a device with high power consumption to dissipate heat, and the heat generated by other devices with lower power consumption is dissipated by air cooling. The current liquid cooling radiators are mostly flat structures, attached to the high power consumption devices, and hardly have the effect of dissipating heat into the air. However, the liquid-cooled radiator is also within the scope of the air-cooled heat dissipation system. If the heat cannot be dissipated into the air, the heat dissipation capacity of the air-cooled system will be wasted invisibly.

The existing air-cooled cooling system regulation method is that the BMC adjusts the fan speed according to the temperature value fed back by the internal temperature monitoring module of the server system. However, due to the hysteresis of temperature feedback, it is easy to cause violent fluctuations in the fan speed and server temperature, which will affect the server. The service life of each internal component will affect the system stability. More seriously, the hysteresis of the temperature feedback method may even cause the temperature of the components in the server to exceed the acceptable range, thereby causing system failure and causing serious losses. The existing liquid cooling radiator has a flat structure and does not have the function of dissipating heat into the air. When used in conjunction with an air cooling system, the cooling capacity of the fan cannot be fully utilized, resulting in wasted energy.

SUMMARY OF THE INVENTION

To solve the problem of hysteresis in the heat dissipation of the current server based on temperature value feedback, and the problem of energy waste in the current heat dissipation mode of air cooling and liquid cooling, the present invention provides a liquid-cooled radiator, a novel server heat dissipation system and a control method. .

The technical scheme of the present invention is:

In the first aspect, the technical solution of the present invention provides a liquid-cooled radiator for dissipating heat energy generated by a heat-generating element during operation, including a heat-dissipating base and a plurality of heat-dissipating fin groups disposed on the heat-dissipating base;

Each heat dissipation fin group includes a hollow tube and two heat dissipation fins, the heat dissipation fins are hollow structures, and the upper and lower ends of the heat dissipation fins are provided with openings; the two heat dissipation fins are the first heat dissipation fin and the second heat dissipation fin respectively. heat dissipation fins; the first heat dissipation fin and the second heat dissipation fin are respectively fixedly connected with the heat dissipation base; the ends of the first heat dissipation fin and the second heat dissipation fin away from the heat dissipation base are connected through a hollow tube; the first heat dissipation fin The fin, the second heat dissipation fin and the hollow tube form a communicating cavity;

The cooling base is provided with a water inlet, a water outlet and a fixing hole;

Several heat dissipation fin groups are connected in series or in parallel or in a combination of series and parallel, and the two ends are respectively connected to the water inlet and the water outlet;

The heat dissipation base is fixed on the heat generating element through the fixing hole; when the liquid-cooled radiator works, the cavity formed by the first heat dissipation fin, the second heat dissipation fin and the hollow tube is filled with cooling liquid.

The technical solution of the present invention is preferably, several fin groups are connected in series or in parallel or connected in series into several rows, and then each row is connected in parallel to the water inlet and outlet of the cooling base.

The technical solution of the present invention is preferably that the heat dissipation fin groups are unevenly distributed on the heat dissipation base, and the distribution density of the heat dissipation fin groups at the center of the heat dissipation base is high. In order to improve the cooling effect.

As a technical solution of the present invention, preferably, the water inlet and the water outlet of the heat dissipation base are provided with check valves for preventing backflow of the cooling liquid.

The technical solution of the present invention is preferably that several rows of radiating fin groups are arranged on the heat dissipation base; the heat dissipation fin groups of each row are connected in series, and the several rows of heat dissipation fin groups are connected in parallel to the water inlet and the water outlet of the heat dissipation base;

Wherein, the first heat dissipation fin of the first heat dissipation fin group of each row of heat dissipation fin groups is connected with the water inlet of the heat dissipation base, and the second heat dissipation fin of the first heat dissipation fin group is connected to the next heat dissipation fin The first heat dissipation fins of the group are connected in series, and the first heat dissipation fin of the last heat dissipation fin group is connected with the second heat dissipation fin of the previous heat dissipation fin group, and the second heat dissipation fin of the last heat dissipation fin group is connected. The fins are communicated with the water outlet of the heat dissipation base. The arrangement and connection mode of the heat dissipation fins are arranged to improve the heat dissipation efficiency.

In the second aspect, the technical solution of the present invention also provides a new type of server cooling system, which includes a BMC, an air cooling system and a liquid cooling system, and the air cooling system and the liquid cooling system are respectively connected to the BMC;

The liquid cooling system includes a heat generating element power supply unit, a power monitoring chip and a liquid cooling unit arranged on each heat generating element;

Each liquid-cooling unit includes a flow rate controller and a liquid-cooled radiator disposed on the heat-generating element; the flow-rate controller is connected in communication with the BMC; the liquid-cooled radiator is the liquid-cooled radiator described in the first aspect; When the liquid cooling system is working, the hollow tubes and the hollow parts of the cooling fins are filled with coolant;

The heat generating element power supply unit is connected to the BMC through the power monitoring chip respectively; it is used to collect the output power of the heat generating element power supply unit in real time through the power monitoring chip and feed it back to the BMC, and the BMC outputs the control signal to the corresponding power consumption value according to the read power consumption value. The flow rate controller is used to control the flow rate of the cooling liquid; the heat in the cooling liquid is dissipated into the air through the cooling fins, and then discharged to the outside of the server through the air cooling system.

The technical solution of the present invention is preferably, the air cooling system includes a fan and a temperature sensor; the temperature sensor and the fan are respectively connected to the BMC for transmitting the temperature monitored by the temperature sensor to the BMC, and the BMC outputs a control signal according to a preset temperature threshold to adjust the fan speed. Heat is carried out of the server by moving the air.

The technical solution of the present invention is preferably, when the fan blows to the liquid cooling system, the distribution density of the heat dissipation fin group at the position of the air inlet and the distribution density of the heat dissipation fin group at the position of the air outlet are both smaller than the heat dissipation fins at the center of the heat dissipation base. The distribution density of the fin group; the setting of the heat dissipation fin group at the position of the air inlet is at a set angle with the wind inlet direction, and the setting of the heat dissipation fin group at the position of the air outlet is at a set angle with the wind inlet direction. This setting method can effectively reduce the wind resistance.

In a third aspect, the technical solution of the present invention further provides a novel server cooling control method, which is applied to the novel server cooling system described in the second aspect, and the method includes the following steps:

The BMC obtains the temperature value output by the temperature sensor and compares the obtained temperature value with the preset temperature threshold to output a PWM signal to control the fan speed;

The BMC obtains the power value of each heat-generating element output by the power monitoring chip and adjusts the cooling liquid flow rate according to the corresponding relationship between the preset power value and the cooling liquid flow rate;

When the BMC detects that the fan is faulty, it will increase the coolant flow rate of the liquid cooling system according to the number of faulty fans, and at the same time send out an alarm message to notify the user to replace the faulty fan; when the BMC detects that the liquid cooling system fails, the output stops. Working control signal liquid cooling system, and output control signal to the air cooling system to increase the fan speed, and at the same time send out alarm information to notify the user to maintain the liquid cooling system.

The technical solution of the present invention is preferably, the method also includes:

When the BMC controls the coolant flow rate, the difference between the coolant flow rate and the base flow rate is proportional to the power change value: VV ₀ =β(PP ₀ ), where V is the coolant flow rate at a certain moment, and V ₀ is The basic flow rate value of the cooling liquid, P is the power value of a heat-generating element at this moment, P ₀ is the set first percentage threshold of the peak power consumption of the heat-generating element, and β is the set fixed value coefficient;

By setting the power consumption of each heat-generating element to the set first percentage threshold of its peak value, and setting the rotational speed of the fan of the air-cooling system to the second percentage threshold, it is calculated that the normal heat dissipation of the server system can be maintained. The required cooling liquid flow rate value is the basic flow rate value V0 of the cooling liquid.

Controlling the cooling liquid flow rate based on the power of the heat-generating element solves the hysteresis problem of the traditional temperature-based control method, which can avoid large fluctuations in the temperature of the entire server and improve the system stability; by adding fins to the liquid cooling system The radiator, so that the heat in the cooling liquid can not only leave the server system through the liquid flow through the liquid outlet, but also can be dissipated into the air through the cooling fins, and be taken out of the server by the fan, which can make more full use of the air cooling system. At the same time, through the reasonable arrangement of the heat dissipation fins, the wind resistance can be effectively reduced on the premise of ensuring the heat dissipation capacity, which improves the heat dissipation efficiency of the whole system. The heat dissipation efficiency of the air-cooled system can save energy; in addition, the air-cooled system and the liquid-cooled system complement each other. When one of them fails, the other can enhance the heat dissipation capacity to maintain the normal heat dissipation of the server. It reduces the risk of server downtime due to cooling problems and improves system reliability.

It can be seen from the above technical solutions that the present invention has the following advantages: using the power-based heat dissipation control method to control the liquid cooling system, overcomes the hysteresis problem of the traditional heat dissipation control method, avoids the violent fluctuation of the server temperature, and improves the system stability sex. And innovatively introduce a fin radiator into the cooling unit, so that the air cooling system can act on the heat of the liquid cooling system and avoid energy waste. At the same time, through the reasonable layout of the heat dissipation fins, the wind resistance can be effectively reduced and the heat dissipation efficiency can be improved on the premise of ensuring the heat dissipation capacity.

In addition, the present invention has reliable design principle and simple structure, and has a very wide application prospect.

It can be seen that, compared with the prior art, the present invention has outstanding substantive features and significant progress, and the beneficial effects of its implementation are also obvious.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. In other words, other drawings can also be obtained based on these drawings without creative labor.

FIG. 1 is a schematic block diagram of a system according to an embodiment of the present invention.

FIG. 2 is a schematic structural diagram of a liquid-cooled radiator according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of the arrangement of heat dissipation fins of a liquid cooling radiator on a CPU according to an embodiment of the present invention.

Detailed ways

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

As shown in FIG. 2 , an embodiment of the present invention provides a liquid-cooled radiator for dissipating heat energy generated by a heat-generating element during operation, including a heat-dissipating base 1 and a plurality of heat-dissipating radiators disposed on the heat-dissipating base 1 fin set 2;

Each heat dissipation fin group 2 includes a hollow tube 201 and two heat dissipation fins, the heat dissipation fins are hollow structures, and the upper and lower ends of the heat dissipation fins are provided with openings 202; the two heat dissipation fins are the first heat dissipation fins respectively and the second heat dissipation fin; the first heat dissipation fin and the second heat dissipation fin are respectively fixedly connected with the heat dissipation base 1; the ends of the first heat dissipation fin and the second heat dissipation fin away from the heat dissipation base are connected by a hollow tube 201 ; The first radiating fin, the second radiating fin and the hollow tube 201 form a communicating cavity;

The heat dissipation base 1 is provided with a water inlet 4, a water outlet 5 and a fixing hole 3;

The plurality of heat dissipation fin groups 2 are connected in series or in parallel or in a combination of series and parallel, and the two ends are respectively connected to the water inlet 4 and the water outlet 5;

The heat dissipation base 1 is fixed on the heat generating element through the fixing hole 3; when the liquid-cooled radiator works, the cavity formed by the first heat dissipation fin, the second heat dissipation fin and the hollow tube is filled with cooling liquid.

It should be noted that, in order to make the water flow smoothly, the first heat dissipation fin and the second heat dissipation fin are respectively vertically arranged on the heat dissipation base, the heat dissipation fin group 2 is in the shape of a door frame, and the heat dissipation fin is in an olive shape.

In some embodiments, several sets of radiating fins 2 are connected in series or in parallel or in several rows, and then each row is connected in parallel with the water inlet 4 and the water outlet 5 of the cooling base.

In some embodiments, the heat dissipation fin groups 2 are unevenly distributed on the heat dissipation base 1 , and the heat dissipation fin groups 2 have a high distribution density at the center of the heat dissipation base 1 . In order to improve the cooling effect.

In some embodiments, both the water inlet 4 and the water outlet 5 of the heat dissipation base 1 are provided with check valves for preventing backflow of the cooling liquid.

In some embodiments, the heat dissipation base 1 is provided with several rows of heat dissipation fin groups 2; the heat dissipation fin groups in each row are connected in series, and the several rows of heat dissipation fin groups are connected in parallel to the water inlet and the water outlet of the heat dissipation base;

Wherein, the first heat dissipation fin of the first heat dissipation fin group of each row of heat dissipation fin groups is connected with the water inlet of the heat dissipation base, and the second heat dissipation fin of the first heat dissipation fin group is connected to the next heat dissipation fin The first heat dissipation fins of the group are connected in series, and the first heat dissipation fin of the last heat dissipation fin group is connected with the second heat dissipation fin of the previous heat dissipation fin group, and the second heat dissipation fin of the last heat dissipation fin group is connected. The fins are communicated with the water outlet of the heat dissipation base. The arrangement and connection mode of the heat dissipation fins are arranged to improve the heat dissipation efficiency.

The fixing hole 3 can be installed with screws to fix the liquid-cooled radiator above the heat-generating device; the check valve is arranged near the water inlet 4 and the water outlet 5 to prevent the backflow of the cooling liquid. The heat dissipation fins are hollow structures. When the liquid cooling system works, the hollow part of the cooling fins will be filled with cooling liquid, and the heat in the cooling liquid can be dissipated into the air through the cooling fins, and then discharged to the outside of the server through the air cooling system.

As shown in FIG. 1 , an embodiment of the present invention also provides a novel server cooling system, including a BMC, an air cooling system, and a liquid cooling system, and the air cooling system and the liquid cooling system are respectively connected to the BMC;

The liquid cooling system includes a heat generating element power supply unit, a power monitoring chip and a liquid cooling unit arranged on each heat generating element;

Each liquid-cooling unit includes a flow rate controller and a liquid-cooled radiator disposed on the heat-generating element; the flow-rate controller is connected in communication with the BMC; the liquid-cooled radiator is the liquid-cooled radiator described in the above embodiment; When the liquid cooling system is working, the hollow tubes and the hollow parts of the cooling fins are filled with coolant;

The heat generating element power supply unit is connected to the BMC through the power monitoring chip respectively; it is used to collect the output power of the heat generating element power supply unit in real time through the power monitoring chip and feed it back to the BMC, and the BMC outputs the control signal to the corresponding power consumption value according to the read power consumption value. The flow rate controller is used to control the flow rate of the cooling liquid; the heat in the cooling liquid is dissipated into the air through the cooling fins, and then discharged to the outside of the server through the air cooling system.

In some embodiments, the air-cooling system includes a fan and a temperature sensor; the temperature sensor and the fan are respectively connected to the BMC for transmitting the temperature monitored by the temperature sensor to the BMC, and the BMC outputs a control signal to adjust the rotational speed of the fan according to a preset temperature threshold . Heat is carried out of the server by moving the air. The air-cooled cooling system includes a temperature sensor (Sensor 0-M) and a fan. The temperature sensors distributed in various positions inside the server transmit the collected temperature values (T ₁ -T _M ) to the BMC; the BMC sends a PWM signal according to the pre-set relationship between the temperature value and the fan speed; the fan receives the PWM signal , run at the speed corresponding to the PWM signal, and take the heat out of the server by driving the air flow. Heat-generating components include CPU, memory, hard disk, and PCIe devices; liquid cooling system includes CPU power supply unit, memory power supply unit, hard disk power supply unit, PCIe device power supply unit, power monitoring chip, CPU liquid cooling unit, memory liquid cooling unit, and hard disk liquid cooling unit. Cooling unit, PCIe device liquid cooling unit. The power monitoring chip can collect the output power (P1-P4) of the CPU power supply unit, the memory power supply unit, the hard disk power supply unit and the PCIe device power supply unit in real time, and feed it back to the BMC through the I2C bus; the BMC reads the power supply unit in real time through the I2C bus. power consumption value, and according to the pre-set rules, send flow control signals (CTL1-4) to the CPU liquid cooling unit, memory liquid cooling unit, hard disk liquid cooling unit, and PCIe device liquid cooling unit respectively; each liquid cooling unit includes The flow rate controller can reasonably control the flow rate of the coolant according to the CTL signal sent by the BMC, and take away the heat through the flow of the coolant. It should be noted that the liquid cooling system also includes other conventional settings, such as a cooling liquid storage device and a cooling liquid circulation driving device, which will not be repeated here.

In some embodiments, when the fan blows to the liquid cooling system, the distribution density of the heat dissipation fin group at the position of the air inlet and the distribution density of the heat dissipation fin group at the position of the air outlet are both smaller than the distribution density of the heat dissipation fin group at the center position of the heat dissipation base Distribution density; the setting of the heat dissipation fin group at the position of the air inlet is at a set angle with the wind inlet direction, and the setting of the heat dissipation fin group at the position of the air outlet is at a set angle with the wind inlet direction. This setting method can effectively reduce the wind resistance. Taking a liquid-cooled radiator disposed on the CPU as an example for illustration, the cooling fins of the CPU liquid-cooled radiator are arranged in the manner shown in FIG. 3 . Several rows of heat dissipation fin groups are arranged on the heat dissipation base; the heat dissipation fin groups of each row are connected in series, and several rows of heat dissipation fin groups are connected in parallel to the water inlet and the water outlet of the heat dissipation base; The first heat dissipation fins of each heat dissipation fin group are connected with the water inlet of the heat dissipation base, and the second heat dissipation fins of the first heat dissipation fin group are connected with the first heat dissipation fins of the next heat dissipation fin group, which are connected in series in sequence. The first heat dissipation fin of the last heat dissipation fin group is communicated with the second heat dissipation fin of the previous heat dissipation fin group, and the second heat dissipation fin of the last heat dissipation fin group is communicated with the water outlet of the heat dissipation base. At the position close to the air inlet, the density of the heat dissipation fins is relatively low, and it forms a certain angle with the direction of the air intake, which can reduce the wind resistance; at the center of the heat dissipation base with high heat density, the density of the heat dissipation fins is also higher. , which can improve the ability of the coolant to dissipate heat into the air; in the position close to the air outlet, the density of the heat dissipation fins is also relatively low, and it forms a certain angle with the direction of the incoming wind, which can effectively reduce the wind resistance.

The embodiment of the present invention also provides a novel server cooling control method, which is applied to the novel server cooling system described in the above-mentioned embodiment, and the method includes the following steps:

S1: BMC obtains the temperature value output by the temperature sensor and compares the obtained temperature value with the preset temperature threshold and outputs a PWM signal to control the fan speed;

S2: BMC obtains the power value of each heat-generating element output by the power monitoring chip, and regulates the cooling liquid flow rate according to the corresponding relationship between the preset power value and the cooling liquid flow rate;

S3: When the BMC detects that the fan is faulty, it increases the coolant flow rate of the liquid cooling system according to the number of faulty fans, and sends out an alarm message to notify the user to replace the faulty fan; when the BMC detects that the liquid cooling system fails, it outputs Stop the working control signal of the liquid cooling system, and output the control signal to the air cooling system to increase the speed of the fan, and at the same time issue an alarm message to notify the user to maintain the liquid cooling system.

In step S2, when the BMC controls the cooling liquid flow rate, the difference between the cooling liquid flow rate and the basic flow rate and the power change value are proportional to: VV ₀ =β(PP ₀ ), where V is the flow rate value of the cooling liquid at a certain moment. , V ₀ is the basic flow rate value of the cooling liquid, P is the power value of a heat-generating element at this moment, P ₀ is the set first percentage threshold of the peak power consumption of the heat-generating element, here is 50%, β is the set fixed value coefficient;

By setting the power consumption of each heat-generating element to 50% of its peak value, and setting the rotational speed of the fan of the air-cooling system to the second percentage threshold, which is 30% here, it is calculated that the server system can maintain normal heat dissipation. The required cooling liquid flow rate value is the basic flow rate value V ₀ of the cooling liquid.

It should be noted that each liquid cooling unit has a basic cooling liquid flow rate. When the power consumption of each heat-generating element does not exceed 50% of its peak value, the cooling liquid of each liquid cooling unit flows at the basic flow rate; when the power consumption of each heat-generating element exceeds 50% of its peak value, the BMC starts The flow rate dynamic control mechanism adjusts the cooling fluid flow rate in real time according to the change of the power consumption of the heat generating element.

Among them, the basic flow rate of the cooling liquid is determined by the following steps: setting the power consumption of the heat-generating elements to reach 50% of its peak value, and setting the rotational speed of all fans for air-cooled heat dissipation to 30%, under the above two conditions, The value of the cooling liquid flow rate that can meet the cooling requirements of the server system is calculated, which is the basic flow rate value; each liquid cooling unit has its own basic flow rate value.

There is a fan failure detection unit in the air-cooling system, which is a conventional setting of the air-cooling system and is well known. Once a fan failure is detected, the BMC will appropriately increase the coolant flow rate of the liquid cooling system according to the number of faulty fans, maintain the normal cooling function of the server system, and issue an alarm message to notify the user to replace the faulty fan.

There is a cooling liquid leakage detection unit in the liquid cooling system, which is also the conventional setting of the liquid cooling system. The specific design method belongs to the existing technology. Once the liquid leakage fault is detected, the operation of the liquid cooling system will be stopped, and the BMC will control the air cooling. The fan of the system runs at a higher speed to maintain the normal cooling function of the server system, and an alarm message is issued to notify users to maintain the liquid cooling system.

The specific instructions are as follows:

1) The BMC obtains the temperature values T ₁ , T ₂ . . . T _m detected by temperature sensors distributed throughout the server through the management bus;

2) BMC reads the power monitoring chip through the I2C bus, and obtains the real-time power consumption value of the main heat-generating components in real time; the power monitoring chip is PAC1934;

3) By setting the power consumption of each heat-generating element to 50% of its peak value, and setting the rotational speed of the air-cooled cooling fan to 30%, the value of the coolant flow rate that can maintain the normal cooling requirements of the server system is calculated, which is Cooling fluid base flow rate V ₀ , and input V ₀ into BMC;

4) According to the cooling requirements of the server system, formulate the corresponding relationship between the temperature value and the fan speed and power value and the coolant flow rate, and input it into the BMC.

When the BMC starts to control the coolant flow rate, the difference between the coolant flow rate and the base flow rate is proportional to the power change value, using the formula VV ₀ =β(PP ₀ ), where V is the coolant flow rate value at a certain moment, V ₀ is the basic flow rate value of the cooling liquid, P is the power of a heat-generating element at this moment, P ₀ is 50% of the peak power consumption of the heat-generating element, and β is a fixed value coefficient obtained by calculation;

5) The BMC outputs a PWM signal to control the fan speed according to the acquired temperature value. According to the set rules, the BMC outputs a PWM signal corresponding to the duty cycle according to the acquired temperature values T ₁ , T ₂ . . . T _m , and controls the fan to run at a certain speed. The air flow caused by the operation of the fans can carry heat from the inside of the server (including the heat dissipated into the air by the cooling system through the radiator fins) to the outside of the server;

6) The BMC regulates the coolant flow rate according to the power of the main heat-generating components. For any heat generating element, when its power does not exceed 50% of its peak value, BMC controls the cooling liquid of its liquid cooling unit to flow at the basic flow rate V ₀ . When the power of the heat generating element exceeds 50% of its peak value, the BMC outputs the corresponding CTL signal according to the rules set in step 4) and according to the changes of the obtained power values P1, P2, P3 and P4 to control the cooling liquid flow rate. The flow of the cooling liquid transfers the heat from the heat-generating element to the cooling unit and takes it out of the server;

7) The BMC monitors the health of the air cooling system and the liquid cooling system respectively. When the BMC detects that a fan is faulty, it appropriately increases the coolant flow rate of the liquid cooling system according to the number of faulty fans, maintains the normal cooling function of the server system, and issues an alarm message to notify the user to replace the faulty fan. When the BMC detects a liquid leakage fault, it stops the operation of the liquid cooling system, and controls the fans of the air cooling system to run at a higher speed to maintain the normal cooling function of the server system.

Although the present invention has been described in detail in conjunction with the preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all fall within the scope of the present invention/any Those skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should all be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. A liquid-cooled radiator for dissipating the thermal energy generated when a heat-generating element operates, characterized in that it comprises a heat-dissipating base and a plurality of heat-dissipating fin groups arranged on the heat-dissipating base; Each heat dissipation fin group includes a hollow tube and two heat dissipation fins, the heat dissipation fins are hollow structures, and the upper and lower ends of the heat dissipation fins are provided with openings; the two heat dissipation fins are the first heat dissipation fin and the second heat dissipation fin respectively. heat dissipation fins; the first heat dissipation fin and the second heat dissipation fin are respectively fixedly connected with the heat dissipation base; the ends of the first heat dissipation fin and the second heat dissipation fin away from the heat dissipation base are connected through a hollow tube; the first heat dissipation fin The fin, the second heat dissipation fin and the hollow tube form a communicating cavity; The cooling base is provided with a water inlet, a water outlet and a fixing hole; Several heat dissipation fin groups are connected in series or in parallel or in a combination of series and parallel, and the two ends are respectively connected to the water inlet and the water outlet; The heat dissipation base is fixed on the heat generating element through the fixing hole; when the liquid-cooled radiator works, the cavity formed by the first heat dissipation fin, the second heat dissipation fin and the hollow tube is filled with cooling liquid. 2 . A liquid-cooled radiator according to claim 1 , wherein a plurality of radiating fin groups are connected in series or in parallel or connected in series into several rows, and then each row is connected in parallel to the water inlet of the cooling base. 3 . and water outlet. 3 . The liquid-cooled radiator according to claim 1 , wherein the distribution of the heat dissipation fin groups on the heat dissipation base is uneven, and the distribution density of the heat dissipation fin groups at the center of the heat dissipation base is high. 4 . 4 . The liquid-cooled radiator according to claim 1 , wherein the water inlet and the water outlet of the heat dissipation base are provided with check valves for preventing backflow of the cooling liquid. 5 . 5 . The liquid-cooled radiator according to claim 1 , wherein several rows of radiating fin groups are arranged on the heat dissipation base; the radiating fin groups in each row are connected in series, and several rows of radiating fin groups are connected in series. It is connected in parallel with the water inlet and outlet of the cooling base; Wherein, the first heat dissipation fin of the first heat dissipation fin group of each row of heat dissipation fin groups is connected with the water inlet of the heat dissipation base, and the second heat dissipation fin of the first heat dissipation fin group is connected to the next heat dissipation fin The first radiating fins of the group are connected, and are sequentially connected in series, and the second radiating fins of the last radiating fin group are communicated with the water outlet of the radiating base. 6. A novel server cooling system, characterized in that it comprises a BMC, an air-cooling system and a liquid-cooling system, and the air-cooling system and the liquid-cooling system are respectively connected to the BMC; The liquid cooling system includes a heat generating element power supply unit, a power monitoring chip and a liquid cooling unit arranged on each heat generating element; Each liquid-cooling unit includes a flow rate controller and a liquid-cooled radiator disposed on the heat-generating element; the flow-rate controller is connected to the BMC in communication; the liquid-cooled radiator is the liquid-cooled radiator described in any one of claims 1-5 type radiator; when the liquid cooling system is working, the hollow tube and the hollow part of the cooling fin are filled with coolant; The heat generating element power supply unit is connected to the BMC through the power monitoring chip respectively; it is used to collect the output power of the heat generating element power supply unit in real time through the power monitoring chip and feed it back to the BMC, and the BMC outputs the control signal to the corresponding power consumption value according to the read power consumption value. The flow rate controller is used to control the flow rate of the cooling liquid; the heat in the cooling liquid is dissipated into the air through the cooling fins, and then discharged to the outside of the server through the air cooling system. 7. A novel server cooling system according to claim 6, wherein the air cooling system comprises a fan and a temperature sensor; the temperature sensor and the fan are respectively connected to the BMC, and are used to transmit the temperature monitored by the temperature sensor to the BMC, The BMC outputs a control signal to adjust the speed of the fan according to the preset temperature threshold. 8 . The novel server cooling system according to claim 7 , wherein when the fan blows to the liquid cooling system, the distribution density of the cooling fin groups at the positions of the air inlets and the distribution density of the cooling fin groups at the positions of the air outlets. 9 . The distribution density is smaller than the distribution density of the heat dissipation fin group at the center of the heat dissipation base; the setting of the heat dissipation fin group at the position of the air inlet is at a set angle with the wind inlet direction, and the setting of the heat dissipation fin group at the air outlet position is related to the wind inlet direction. into a set angle. 9. A novel server cooling control method, characterized in that, applied to the novel server cooling system of claim 7 or 8, the method comprising the following steps: The BMC obtains the temperature value output by the temperature sensor and compares the obtained temperature value with the preset temperature threshold to output a PWM signal to control the fan speed; The BMC obtains the power value of each heat-generating element output by the power monitoring chip and regulates the cooling liquid flow rate according to the corresponding relationship between the preset power value and the cooling liquid flow rate; When the BMC detects that the fan is faulty, it increases the coolant flow rate of the liquid cooling system according to the number of faulty fans, and sends out an alarm message to notify the user to replace the faulty fan; when the BMC detects that the liquid cooling system fails, the output stops. Working control signal liquid cooling system, and output control signal to the air cooling system to increase the fan speed, and at the same time send out alarm information to notify the user to maintain the liquid cooling system. 10 . The novel server cooling control method according to claim 9 , wherein the method further comprises: 10 . When the BMC controls the coolant flow rate, the difference between the coolant flow rate and the base flow rate is proportional to the power change value: VV ₀ =β(PP ₀ ), where V is the coolant flow rate at a certain moment, and V ₀ is The basic flow rate value of the cooling liquid, P is the power value of a heat-generating element at this moment, P ₀ is the set first percentage threshold of the peak power consumption of the heat-generating element, and β is the set fixed value coefficient; By setting the power consumption of each heat-generating element to the set first percentage threshold of its peak value, and setting the rotational speed of the fan of the air-cooling system to the second percentage threshold, it is calculated that the normal heat dissipation of the server system can be maintained. The required cooling liquid flow rate value is the basic flow rate value V ₀ of the cooling liquid.

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