CN111954384A - Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof - Google Patents

Abstract

The invention provides a circuit board structure and a manufacturing method thereof, and a display device and a manufacturing method thereof. The insulating substrate has a first surface and a second surface opposite to each other. The connecting pad is located on the first surface of the insulating substrate. The circuit layer is located on the second surface of the insulating substrate. The via hole penetrates through the insulating substrate. The connecting pads are overlapped with the through holes.

Description

Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof

technical field

The invention relates to an electronic component and a manufacturing method thereof, in particular to a circuit board structure and a manufacturing method thereof, a display device with a circuit board structure and a manufacturing method thereof.

Background technique

The circuit board often has a solder mask on the side where the electronic components are arranged. The solder mask needs to have a window to connect with the circuit board. However, solder mask openings have size limitations and alignment issues.

SUMMARY OF THE INVENTION

The present invention provides a circuit board structure and a manufacturing method thereof, which can have better flatness or higher number of components in application.

The manufacturing method of the circuit board structure of the present invention includes the following steps. Supplied with insulating base material. The insulating base material has a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface. A conductive material layer is formed on the insulating substrate to cover the first surface and the second surface, and the conductive material layer is filled into the plurality of through holes to form a plurality of through holes. Part of the conductive material layer on the first surface is removed to form a plurality of connection pads, wherein the plurality of connection pads overlap the plurality of via holes. Part of the conductive material layer on the second surface is removed to form a wiring layer.

The circuit board structure of the present invention includes an insulating base material, a plurality of connection pads, a circuit layer and a plurality of through holes. The insulating base material has a first surface and a second surface opposite to each other. The connection pads are on the first surface of the insulating substrate. The circuit layer is located on the second surface of the insulating substrate. The via hole penetrates through the insulating substrate. The plurality of connection pads overlap the plurality of vias.

In an embodiment of the present invention, on the first surface, there are no lines between the plurality of connection pads.

In one embodiment of the present invention, there are only a plurality of connection pads on the first surface.

In an embodiment of the present invention, the plurality of vias and the plurality of connection pads are arranged in a one-to-one manner.

In an embodiment of the present invention, the projection range of the plurality of via holes on the first surface is completely within the projection range of the plurality of connection pads on the first surface. In an embodiment of the present invention, the plurality of vias are solid vias.

In an embodiment of the present invention, the diameter of the via hole is less than 50 microns.

Based on the above, the circuit board structure and the manufacturing method thereof of the present invention can have better flatness or higher number of components in application.

The present invention provides a display device and a manufacturing method thereof, which have better flatness or a higher number of display elements.

The display device of the present invention includes the aforementioned circuit board structure and a display element. The display element is arranged on the first surface of the insulating base material of the circuit board structure. The display element is electrically connected to a plurality of connection pads of the circuit board structure. The display element is a micro light-emitting diode (Micro LED) or a sub-millimeter light-emitting diode (mini LED).

The manufacturing method of the display device of the present invention includes the following steps. The aforementioned circuit board structure is provided. The display element is arranged on the first surface of the insulating substrate of the circuit board structure, and the display element is electrically connected to a plurality of connection pads of the circuit board structure. The display elements are micro-LEDs or sub-millimeter light-emitting diodes.

Based on the above, the display device and the manufacturing method thereof of the present invention include or use the circuit board structure of the present invention, and thus have better flatness or a higher number of display elements.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

Description of drawings

1A to 1C are partial cross-sectional schematic diagrams of a part of a method for fabricating a circuit board structure according to a first embodiment of the present invention;

1D is a partial top view schematic diagram of a circuit board structure according to the first embodiment of the present invention;

1E is a partial bottom view of a circuit board structure according to the first embodiment of the present invention;

2 is a partial cross-sectional schematic diagram of a circuit board structure according to a second embodiment of the present invention;

3 is a partial cross-sectional schematic diagram of a circuit board structure according to a third embodiment of the present invention;

4 is a partial cross-sectional schematic diagram of a circuit board structure according to a fourth embodiment of the present invention;

FIG. 5 is a schematic partial cross-sectional view of a display device according to an embodiment of the present invention.

Description of reference numerals

100, 200, 300, 400: circuit board structure

110: Insulation substrate

111: First Surface

112: Second Surface

113: Through hole

113a: Aperture

120: Conductive material layer

121: The first conductive part

122: Second conductive part

123: Third conductive part

141: Connection pad

152: circuit layer

163, 363, 463: Vias

163a: Aperture

364: Core Conductive Layer

465: Core Insulation

270: Insulation layer

271: Insulation opening

500: Display device

580: Display element

590: Conductive Paste

Detailed ways

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "rear", "left", "right", etc., only refer to the directions of the attached drawings. Accordingly, the directional terms used are intended to illustrate rather than limit the present invention. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.

1A to 1C are partial cross-sectional schematic views of a part of a method for fabricating a circuit board structure according to a first embodiment of the present invention. FIG. 1D is a schematic partial top view of a circuit board structure according to the first embodiment of the present invention. FIG. 1E is a schematic partial bottom view of a circuit board structure according to the first embodiment of the present invention.

Referring to FIG. 1A , an insulating substrate 110 is provided. In this embodiment, the insulating substrate 110 may be a rigid substrate or a flexible substrate, which is not limited in the present invention. For example, the material of the aforementioned rigid substrate includes, for example, polymer glass fiber composite materials, glass, ceramics or other rigid materials, and the aforementioned material of the flexible substrate is, for example, polyimide (PI) or other flexible materials. The insulating substrate 110 may be a single-layer board or a composite board, which is not limited in the present invention.

The insulating substrate 110 has a first surface 111 , a second surface 112 and a plurality of through holes 113 . The second surface 112 is opposite to the first surface 111 . The through hole 113 connects the first surface 111 and the second surface 112 . The through holes 113 can be formed by, for example, mechanical drilling, laser drilling, etching or other suitable methods, which are not limited in the present invention.

It is worth noting that, in FIG. 1A , only one of the through holes 113 is exemplarily shown, but the present invention does not limit the number of the through holes 113 .

In this embodiment, the diameter 113a of the through hole 113 may be smaller than 50 micrometers (micrometer; μm), but the present invention is not limited thereto.

Referring to FIG. 1B , a conductive material layer 120 is formed on the insulating substrate 110 . The conductive material layer 120 may be a single-layer structure or a multi-layer structure, which is not limited in the present invention. For example, the seed layer can be formed by sputtering. Then, an electroplating layer can be formed on the aforementioned seed crystal layer by means of electroplating. However, the present invention does not limit the material or the formation method of the conductive material layer 120 .

The conductive material layer 120 includes a first conductive portion 121 , a second conductive portion 122 and a third conductive portion 123 . The first conductive portion 121 covers the first surface 111 of the insulating substrate 110 . The second conductive portion 122 covers the second surface 112 of the insulating substrate 110 . The third conductive portion 123 is filled into the through hole 113 of the insulating substrate 110 .

In this embodiment, the third conductive portion 123 can be completely filled into the through hole 113 of the insulating substrate 110 . In other words, the through hole 113 may be completely filled by the third conductive portion 123 without voids, but the present invention is not limited thereto.

Referring to FIGS. 1B to 1C , a portion of the first conductive portion 121 on the first surface 111 is removed to form a plurality of connection pads 141 . And, part of the second conductive portion 122 on the second surface 112 is removed to form at least the circuit layer 152 . It should be noted that the present invention does not limit the formation order of the connection pads 141 and the circuit layers 152 . In addition, the third conductive portion 123 filled in the through hole 113 may constitute the through hole 163 .

The connection pads 141 and/or the circuit layers 152 may be formed by, for example, etching, laser peeling or other suitable methods, which are not limited in the present invention. The connection pads 141 and the circuit layers 152 may be formed in the same manner or in different manners, which are not limited in the present invention. In addition, the layout of the circuit layer 152 can be adjusted according to design requirements, which is not limited in the present invention.

After the above process, the fabrication of the circuit board structure 100 of this embodiment can be substantially completed.

Referring to FIGS. 1C to 1E , the circuit board structure 100 includes an insulating substrate 110 , a plurality of connection pads 141 , a circuit layer 152 and a plurality of via holes 163 . The insulating substrate 110 has a first surface 111 and a second surface 112 opposite to each other. The connection pads 141 are located on the first surface 111 of the insulating substrate 110 . The circuit layer 152 is located on the second surface 112 of the insulating substrate 110 . The via hole 163 penetrates through the insulating substrate 110 . The connection pad 141 overlaps with the via hole 163 .

In this embodiment, on the first surface 111 , there is no line between the plurality of connection pads 141 (not shown because there is none). Therefore, if other elements (eg, the display element 580 in the subsequent embodiment) need to be arranged on the first surface 111 , the formation of the solder resist layer on the first surface 111 may be omitted. In this way, the solder mask opening of the solder mask layer can be reduced in size limitation and alignment problems.

In this embodiment, the first surface 111 only has a plurality of connection pads 141 . In this way, the number per unit area of the connection pads 141 on the first surface 111 can be increased; or, the distribution density of the connection pads 141 can be increased.

In this embodiment, the number of the via holes 163 is multiple, the number of the connection pads 141 is multiple, and the via holes 163 and the connection pads 141 may be arranged in a one-to-one manner. In other words, the number of the via holes 163 may be the same as the number of the connection pads 141 .

In this embodiment, the projection range of the via hole 163 on the first surface 111 is completely within the projection range of the connection pad 141 on the first surface 111 .

In this embodiment, the plurality of vias 163 are solid vias. Therefore, if other elements (eg, the display element 580 in the subsequent embodiment) need to be arranged on the first surface 111 , the flow of the conductive adhesive material (eg, the conductive paste 590 in the subsequent embodiment) into the through hole 113 can be reduced. In this way, the possibility of surface unevenness can be reduced, and the overall flatness can be improved.

In this embodiment, the diameter 163a of the via hole 163 may be smaller than 50 microns.

FIG. 2 is a schematic partial cross-sectional view of a circuit board structure according to a second embodiment of the present invention. The manufacturing method of the circuit board structure 200 of the present embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment. .

The circuit board structure 200 of this embodiment is similar to the circuit board structure 100 of the first embodiment, except that the circuit board structure 100 may further include an insulating layer 270 . The insulating layer 270 is located on the second surface 112 of the insulating substrate 110 , and the insulating layer 270 covers at least part of the circuit layer 152 .

In this embodiment, the insulating layer 270 may be a single-layer structure or a multi-layer structure, which is not limited in the present invention.

In this embodiment, the insulating layer 270 may be a cover layer or a solder resist layer, which is not limited in the present invention.

In this embodiment, the insulating layer 270 may have insulating openings 271 so that the circuit layer 152 can pass through the insulating openings 271 of the insulating layer 270 to be electrically connected with other conductive elements (not shown).

3 is a partial cross-sectional schematic diagram of a circuit board structure according to a third embodiment of the present invention. The manufacturing method of the circuit board structure 300 of the present embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment. .

The circuit board structure 300 of the present embodiment is similar to the circuit board structure 100 of the first embodiment, except that the via hole 363 has a core conductive layer 364 . In other words, the via hole 363 may include the third conductive portion 123 and the core conductive layer 364 . The via holes 363 may be formed by multiple plating methods.

In addition, in the process of forming the via hole 363 , if the third conductive portion 123 is not completely filled in the via hole 113 of the insulating substrate 110 , the via hole 363 can be a solid via hole through the core conductive layer 364 .

4 is a partial cross-sectional schematic diagram of a circuit board structure according to a fourth embodiment of the present invention. The manufacturing method of the circuit board structure 400 of the present embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment. .

The circuit board structure 400 of the present embodiment is similar to the circuit board structure 100 of the first embodiment, except that the via hole 463 has a core insulating layer 465 . In other words, the via hole 463 may include the third conductive portion 123 and the core insulating layer 465 . The material of the core insulating layer 465 may include resin, ink or other suitable curable materials, which are not limited in the present invention.

In addition, in the process of forming the via hole 463 , if the third conductive portion 123 is not completely filled in the via hole 113 of the insulating substrate 110 , the via hole 463 can be a solid via hole through the core insulating layer 465 .

To sum up, the circuit board structure and the manufacturing method of the present invention can have better flatness or higher number of components in application.

FIG. 5 is a schematic partial cross-sectional view of a display device according to an embodiment of the present invention.

Referring to FIG. 5 , the manufacturing method of the display device 500 may be as follows.

Provide circuit board structure. In this embodiment, the circuit board structure used is the circuit board structure 100 of the first embodiment as an example, but in other unshown embodiments, a circuit board structure similar to the circuit board structure 100 can be used ( Such as: the same or similar to the circuit board structure 200, the circuit board structure 300, the circuit board structure 400). In other words, in the following description, the circuit board structure is marked and described with the circuit board structure 100 used as an example, and its similar components are denoted by the same reference numerals and have similar functions, materials or formation methods, And the description is omitted.

5 , the display element 580 is disposed on the first surface 111 of the insulating substrate 110 of the circuit board structure 100 , and the display element 580 is electrically connected to the plurality of connection pads 141 of the circuit board structure 100 .

In this embodiment, the display element 580 may be electrically connected to the connection pad 141 by means of flip chip bonding. For example, the display element 580 and the connection pad 141 may be electrically connected through a conductive paste 590 (eg, solder paste).

In this embodiment, the via hole 163 is a solid via hole. Therefore, when the display element 580 is arranged on the first surface 111 , the flow of the conductive paste 590 into the through hole 113 can be reduced. In this way, the possibility of surface unevenness can be reduced, and the overall flatness of the display element 580 can be improved.

In this embodiment, on the first surface 111 of the insulating substrate 110 of the circuit board structure 100 , there are no lines between the plurality of connection pads 141 (not shown because there are none). Therefore, when the display element 580 is arranged on the first surface 111, the formation of the solder resist layer on the first surface 111 can be omitted. In this way, the problems of size limitation and alignment of the solder mask opening of the solder mask can be reduced, and the problems of size limitation and alignment of the display element 580 can also be reduced. In other words, the display element 580 can be a micro light-emitting diode (Micro LED) or a sub-millimeter light-emitting diode (mini LED), which can improve the resolution and display quality of the display device 500 .

In this embodiment, in the circuit board structure 100 , the first surface 111 of the insulating substrate 110 of the circuit board structure 100 only has the connection pads 141 . In this way, by increasing the number or distribution density per unit area of the connection pads 141 , the number or distribution density per unit area of the display device 500 can be further increased, and the resolution and display quality of the display element 580 can be improved.

To sum up, the display device and the manufacturing method thereof of the present invention include or use the circuit board structure of the present invention, and thus have better flatness or a higher number of display elements.

Although the present invention has been disclosed above with examples, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be subject to what is defined in the claims.

Claims (10)

1. A method for making a circuit board structure, comprising: providing an insulating substrate, the insulating substrate has a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface; forming a conductive material layer on the insulating substrate to cover the first surface and the second surface, and filling the conductive material layer into the plurality of through holes to form a plurality of through holes; removing a portion of the conductive material layer on the first surface to form a plurality of connection pads, wherein the plurality of connection pads overlap the plurality of vias; and Part of the conductive material layer on the second surface is removed to form a wiring layer. 2. A circuit board structure, comprising: an insulating substrate having a first surface and a second surface opposite to each other; a plurality of connection pads on the first surface of the insulating substrate; a wiring layer on the second surface of the insulating substrate; and A plurality of through holes penetrate through the insulating substrate, and the plurality of connection pads overlap with the plurality of through holes. 3 . The circuit board structure of claim 2 , wherein on the first surface, there is no line between the plurality of connection pads. 4 . 4. The circuit board structure of claim 3, wherein only the plurality of connection pads are provided on the first surface. 5. The circuit board structure of claim 2, wherein the plurality of vias and the plurality of connection pads are arranged in a one-to-one manner. 6 . The circuit board structure according to claim 2 , wherein the projection range of the plurality of via holes on the first surface is completely within the projection range of the plurality of connection pads on the first surface. 7 . . 7. The circuit board structure of claim 2, wherein the plurality of vias are solid vias. 8. The circuit board structure of claim 2, wherein the diameters of the plurality of vias are less than 50 microns. 9. A display device comprising: The circuit board structure of claim 2; and A display element is disposed on the first surface of the insulating substrate of the circuit board structure, and the display element is electrically connected to the plurality of connection pads of the circuit board structure, wherein the display element The elements are micro-LEDs or sub-millimeter light-emitting diodes. 10. A manufacturing method of a display device, comprising: providing the circuit board structure of claim 2; and A display element is arranged on the first surface of the insulating substrate of the circuit board structure, and the display element is electrically connected to the plurality of connection pads of the circuit board structure, wherein the display element is The elements are micro-LEDs or sub-millimeter light-emitting diodes.

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