CN111954374A - A connection structure and its sensor - Google Patents

Abstract

The invention discloses a connecting structure and a sensor thereof, and relates to the technical field of sensors. The connection structure of the present invention includes: the invention further discloses an assembling method of the connecting structure. The connection operation among the first unit, the second unit and the third unit is simple and effective, the problems of inaccurate alignment and/or adhesive material overflow among the first unit, the second unit and the third unit can be avoided, the yield and the operation efficiency are improved, the usage amount of the adhesive material is reduced, and the cost is saved.

Description

A connection structure and its sensor

technical field

The invention relates to the technical field of sensors, in particular to a connection structure and a sensor thereof.

Background technique

A sensor is a device or device that can sense the measured value and convert it into a usable output signal according to a certain law, usually composed of sensitive elements and conversion components. The sensitive element refers to the part of the sensor that can directly sense or respond to the measurand; the conversion component refers to the part of the sensor that converts the measured change sensed or responded to by the sensitive element into a signal suitable for transmission or measurement.

Usually according to the physical quantity measured by the sensor, it can be divided into displacement sensor, pressure sensor, acceleration sensor, temperature sensor and so on. The so-called pressure sensor refers to a device or device that can sense the fluid pressure and convert it into a usable signal output according to a certain law.

The sensitive element of the pressure sensor includes a main body and a sensing sheet, and the main body is mainly a mechanical elastic body (such as a common metal or other material diaphragm) that senses the fluid pressure. The induction sheet is made on the elastomer substrate through a specific process, and is connected to the circuit board through leads. The circuit board and the elastomer need to be dielectrically isolated and fixedly connected by insulating materials. When the measured act on the elastic body, the elastic body will change accordingly, and the induction sheet will change a certain characteristic (usually electrical characteristics such as resistance, capacitance, etc.) in response to the change of the elastic body, and generate a certain circuit connection corresponding signal output.

In the prior art, the circuit board and the elastic body are fixedly connected by insulating materials. The specific method is to coat the elastic body of the pressure sensor sensitive element body with an adhesive material, and then bond the insulating material (ring gasket) to the elastic body. on the annular gasket, further coating the adhesive material on the annular gasket, and then bonding the circuit board to the annular gasket, so as to finally realize the bonding and fixing of the circuit board to the elastic body.

Problems in the prior art: 1. It is difficult to locate and align the ring gasket when it is bonded to the elastomer, which is time-consuming and easily leads to defective products; 2. When the circuit board is bonded to the ring gasket, it is not easy to locate and align, Time-consuming and easy to lead to defective products; 3. When the ring gasket is bonded to the elastomer, and/or the circuit board is bonded to the ring gasket, it is easy to cause the coated bonding material to overflow, which must be cleaned up, and it is easy to remove Bring it to other parts to cause pollution, and at the same time, it is easy to cause the translocation of the gasket and the circuit board, which needs to be repositioned and aligned, which is time-consuming and easily leads to defective products; 4. The annular gasket and the elastomer are bonded to a plane contact And the area is limited, which often leads to insufficient bonding strength and difficult control, high requirements for operators, low work efficiency, and waste of bonding materials; 5. The ring gasket is bonded to the elastomer, and the circuit board is bonded to the ring. The gasket needs to be coated with the bonding material independently twice, and the process is complicated and the working hours are long.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a connection structure in view of the existing shortcomings.

For solving the technical problems of the present invention, the following technical solutions are adopted:

The present invention provides a connection structure, the connection structure comprises: a first unit (1), a second unit (2) and a third unit (3), the first unit (1) and the second unit (2) Connection, the second unit (2) is connected with the third unit (3), wherein: the first unit (1) includes a first unit connecting part (11); the second unit ( 2) comprises a hollow part (21) and a connecting part (22), the connecting part (22) comprises an upper connecting part (221) and a lower connecting part (222); the third unit (3) comprises a third unit connecting part (31); the first unit connection part (11) is connected with the upper connection part (221), and the lower connection part (222) is connected with the third unit connection part (31); the connection The portion (22) includes a lower edge portion (224), the lower edge portion (224) protruding downward relative to the lower connecting portion (222) to form a lower boss structure (2241), the lower boss structure (2241) forms a snap-fit connection with the third unit (3).

As one of the embodiments, the present invention provides a connection structure, wherein the connection part (22) includes an upper edge part (223), and the upper edge part (223) is opposite to the upper connection part (221) It protrudes upward to form an upper boss structure (2231), and the upper boss structure (2231) forms a snap-fit connection with the first unit (1).

As one of the embodiments, the present invention provides a connection structure, wherein the connection portion (22) of the second unit (2) includes a hollow structure (23), and the hollow structure (23) is formed to pass through Through the structure of the upper connecting part (221) and the lower connecting part (222).

As one of the embodiments, the present invention provides a connection structure, wherein a bonding material ( A) and connect.

As one of the embodiments, the present invention provides a connection structure, wherein the first unit (1) includes a circuit board.

As one of the embodiments, the present invention provides a connection structure, wherein the upper boss structure (2231) has a notch (2232).

As one of the embodiments, the present invention provides a connection structure, wherein the upper boss structure (2231) has a plurality of notches (2232) in a symmetrical structure.

As one of the embodiments, the present invention provides a connection structure, wherein the hollow structure (23) is formed as a plurality of circular holes (231).

As one of the embodiments, the present invention provides a connection structure, wherein the bonding material (A) is silica gel.

As one of the embodiments, the present invention provides a connection structure, wherein the second unit (2) is made of insulating materials including plastic materials.

The present invention also provides a sensor including the above connection structure.

The present invention also provides an assembling method of the above connection structure, the assembling method comprising the steps of: connecting the first unit (1) with the second unit (2); connecting the second unit (2) connected with the third unit (3).

As one of the embodiments, the present invention provides an assembly method, wherein the first unit (1) is connected with the second unit (2) and/or the The second unit (2) is connected to the third unit (3).

As one of the embodiments, the present invention provides an assembling method, wherein the bonding material (A) is coated on the surface of the connecting portion (31); the second unit (2) is aligned The connecting part (31) is also connected with the third unit (3).

As one of the embodiments, the present invention provides an assembly method, wherein the first unit (1) and the second unit (2) and/or the second unit (2) and the third unit The units (3) are connected to each other by means of snap fit.

As one of the embodiments, the present invention provides an assembly method, wherein the bonding material (A) is silica gel or epoxy resin.

The present invention provides a sensor obtained by the above assembling method.

The present invention provides a sensor that includes a pressure sensor.

The beneficial effects of the present invention are:

1. The upper boss structure (2231) and the lower boss structure (2241) of the second unit (2) form a snap-fit connection with the first unit (1) and the third unit (3) respectively, and it is easy to connect the first unit (1), the second unit (2), and the third unit (3) are aligned and connected, which improves the work efficiency, and the lower boss structure (2241) can remove the adhesive material (A) overflowing from the third unit (3) Covering, reducing the action of removing the bonding material (A), and further playing the role of fixing the second unit (2), increasing the bonding strength;

2. The connecting portion (22) of the second unit (2) is provided with a hollow structure (23), which can reduce the process of applying the bonding material (A) in one step, improve work efficiency and save manufacturing costs;

3. The upper boss structure (2231) is provided with a notch (2232), which reduces the processing technology of the first unit (1), improves the work efficiency, and plays a preliminary role in positioning the first unit (1).

It can be seen that after adopting the new technical solution, the connection operation between the first unit (1), the second unit (2) and the third unit (3) is simple and effective, and there will be no misalignment and/or overflow among the three. The problem of the bonding material (A) improves the yield and operation efficiency, reduces the amount of bonding material used, and saves costs.

Description of drawings

Fig. 1 is the split structure schematic diagram of the present invention;

Fig. 2 is the first unit structure schematic diagram of the present invention;

3 is a top view of the second unit of the present invention;

Fig. 4 is the bottom view of the second unit of the present invention;

5 is a front view of the second unit of the present invention;

Description of reference numerals: first unit (1); first unit connecting part (11); second unit (2); hollow part (21); connecting part (22); hollow structure (23); upper connecting part ( 221); lower connecting part (222); upper edge part (223); lower edge part (224); round hole (231); upper boss structure (2231); notch part (2232); lower boss structure (2241) ); the third unit (3); the third unit connecting part (31).

Detailed ways

The specific implementation of the present invention will be described in detail below. It is necessary to point out that the following implementation is only used for the further description of the present invention, and should not be construed as a limitation on the protection scope of the present invention. Some non-essential improvements and adjustments made still belong to the protection scope of the present invention.

1 to 5, a connection structure includes: a first unit (1), a second unit (2) and a third unit (3), the first unit (1) and the second unit (2) ) connection, the second unit (2) and the third unit (3) are connected, and the second unit (2) is located in the middle of the first unit (1) and the third unit (3) to connect the first unit (1) and the role of the third unit (3).

Specifically, the first unit (1) includes a first unit connecting portion (11); the second unit (2) includes a hollow portion (21) and a connecting portion (22), and the hollow portion (21) may The connecting part (22) includes an upper connecting part (221) and a lower connecting part (222); the third unit (3) includes a third unit connecting part (31); The first unit connection part (11) is connected with the upper connection part (221), and the lower connection part (222) is connected with the third unit connection part (31).

The first unit (1) includes a circuit board, the second unit (2) is made of insulating materials including plastic materials, the third unit (3) is a sensor body, and the third unit is connected to The part (31) is an elastomer. The first unit (1), the second unit (2) and the third unit (3) are connected by a bonding material (A), and the bonding material (A) can be silica gel or epoxy resin.

In this embodiment, the connecting portion (22) includes a lower edge portion (224), and the lower edge portion (224) protrudes downward relative to the lower connecting portion (222) to form a lower boss structure (2241). ), the lower boss structure (2241) includes the lower edge portion (224) and the lower connecting portion (222), the lower boss structure (2241) and the third unit (3) form a card Fitting connection, the snap-fit connection here means that the lower edge part (224) and the lower connecting part (222) are respectively connected with the edge part of the third unit (3) and the third unit connecting part (31). ) contact connection to facilitate the alignment and connection operation of the second unit (2) and the third unit (3), and the lower edge portion (224) can overflow the third unit (3). The edge part is covered with silica gel to reduce the action of wiping glue, the lower edge part (224) is connected by the silicone overflowing from the edge part of the third unit (3), and the second unit (2) and the The bonding area of the third unit (3) further enhances the stability of the second unit (2).

In this embodiment, the connecting portion (22) includes an upper edge portion (223), and the upper edge portion (223) protrudes upward relative to the upper connecting portion (221) to form an upper boss structure (2231) , the upper boss structure (2231) includes the upper connecting part (221) and the upper edge part (223), and the upper boss structure (2231) forms a snap fit with the first unit (1) connection, the snap-fit connection here means that the upper connecting part (221) and the upper edge part (223) are respectively contacted and connected with the first unit connecting part (11) and the edge part of the first unit, The alignment and connection operation of the second unit (2) and the first unit (1) is facilitated.

In this embodiment, the connecting part (22) of the second unit (2) includes a hollow structure (23), and the hollow structure (23) is formed to penetrate the upper connecting part (221) and the The structure of the lower connecting portion (222), the hollow structure (23) is formed into a plurality of circular holes (231), and the plurality of circular holes (231) can be symmetrical structures or irregularly arranged, depending on product requirements Depends. The bonding material (A) is applied on the third unit connecting portion (31), and the bonding material (A) is overflowed on the upper connecting portion (221) through the hollow structure (23). , the overflowing adhesive material (A) can be used for the connection between the upper connecting part (221) and the first unit connecting part (11), which reduces the need for re-coating and sticking on the upper connecting part (221). The action of knotting materials improves production efficiency and saves costs. Taking the sensor as an example, the first unit (1) includes a circuit board, and the circuit board has several welding holes. When the first unit (1) and the second unit (2) are connected, the welding hole does not overlap with the circular hole (231), so as to prevent the overflowing adhesive material (A) from blocking the welding hole, Affect the subsequent welding of the sensor.

In this embodiment, the upper boss structure (2231) has a notch portion (2232), and further, the upper boss structure (2231) has a plurality of notch portions (2232) in a symmetrical structure. Taking the sensor as an example, the first unit (1) includes a circuit board, and there will be a nozzle on a single circuit board (the nozzle, that is, after the single circuit board is detached, the edge will partially protrude). If the nozzle is not treated, it may cause The first unit (1) and the second unit (2) are inconveniently connected. The notch portion (2232) is matched with the nozzle of the circuit board, and by arranging the notch portion (2232), the step of processing the nozzle of the circuit board can be omitted, the production efficiency is improved, and the first unit (1) ) played a preliminary positioning role. In order to achieve the effect of precise positioning of the first unit (1), two protrusions may be provided on the upper connecting portion (221), and two protrusions may be provided on the first unit (1) and the upper connecting portion (221) ) two concave points corresponding to the protrusions, so that the first unit (1) can be accurately positioned.

A sensor includes the above-mentioned connection structure, and the sensor includes a pressure sensor.

The assembling method of the above connection structure, comprising the steps of: connecting the first unit (1) with the second unit (2); connecting the second unit (2) with the third unit (3) .

The first unit (1) and the second unit (2) and/or the second unit (2) and the third unit (3) are connected by using an adhesive material (A). Specifically, the adhesive material (A) is coated on the surface of the connecting part (31), the second unit (2) is aligned with the connecting part (31) and is connected with the third unit (3) Connection. The first unit (1) and the second unit (2) and/or the second unit (2) and the third unit (3) are connected to each other by means of snap fit, and the adhesive material (A) is silica gel or epoxy resin.

Specifically, taking a sensor as an example, the sensor may be a pressure sensor. The sensor includes the connection structure of the present invention.

The second unit (2) includes the lower boss structure (2241), and the assembling method includes the following steps:

a. Coating the bonding material (A) on the surface of the connecting portion (31);

b. The second unit (2) and the third unit (3) are connected to each other by means of snap fit;

c. Coating the bonding material (A) on the surface of the upper connecting portion (221);

d. The second unit (2) is aligned and connected to the first unit (1).

The second unit (2) includes the lower boss structure (2241) and the upper boss structure (2231), the upper boss structure (2231) has a notch portion (2232), and the connecting portion ( 22) comprising a hollow structure (23), and the assembling method comprises the following steps:

a. Coating the bonding material (A) on the surface of the connecting portion (31);

b. The second unit (2) and the third unit (3) are connected to each other by means of snap fit;

c. Coating the bonding material (A) on the surface of the upper connecting portion (221);

d. The position of the first unit (1) is adjusted through the notch (2232), and the second unit (2) is connected to each other by means of snap fit.

The second unit (2) includes the lower boss structure (2241) and the upper boss structure (2231), the upper boss structure (2231) has a notch portion (2232), and the connecting portion ( 22) comprising a hollow structure (23), and the assembling method comprises the following steps:

a. Coating the bonding material (A) on the surface of the connecting portion (31);

b. The second unit (2) and the third unit (3) are connected to each other by means of snap fit;

c. Adjust the position of the first unit (1) through the notch portion (2232), and connect with the second unit (2) by means of snap fit.

Although exemplary embodiments of the present invention have been described for purposes of illustration, workers skilled in the art will recognize that changes may be made in form and detail without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Carry out various modifications, additions and substitutions, etc., and all these changes should belong to the protection scope of the appended claims of the present invention, and the various steps in the various departments and methods of the products claimed in the present invention can be combined arbitrarily. form together. Accordingly, the description of the embodiments disclosed in the present invention is not intended to limit the scope of the present invention, but to describe the present invention. Accordingly, the scope of the present invention is not limited by the above embodiments, but is defined by the claims or their equivalents.

Claims (18)

1. A connection structure, comprising: a first unit (1), a second unit (2) and a third unit (3), the first unit (1) being connected with the second unit (2) and the second unit (2) being connected with the third unit (3), wherein:

the first unit (1) comprises a first unit connection (11);

the second unit (2) comprises a hollow portion (21) and a connecting portion (22), the connecting portion (22) comprising an upper connecting portion (221) and a lower connecting portion (222);

the third unit (3) comprises a third unit connection (31);

the first unit connection part (11) is connected to the upper connection part (221), and the lower connection part (222) is connected to the third unit connection part (31);

the connecting portion (22) comprises a lower edge portion (224), the lower edge portion (224) protrudes downwards relative to the lower connecting portion (222) so as to form a lower boss structure (2241), and the lower boss structure (2241) forms a snap-fit connection with the third unit (3).

2. The connecting structure according to claim 1, wherein:

the connecting portion (22) comprises an upper edge portion (223), the upper edge portion (223) protrudes upwards relative to the upper connecting portion (221) so as to form an upper boss structure (2231), and the upper boss structure (2231) is connected with the first unit (1) in a clamping mode.

3. The connecting structure according to claim 1, wherein:

the connection part (22) of the second unit (2) includes a hollowed structure (23), and the hollowed structure (23) is formed in a structure penetrating the upper connection part (221) and the lower connection part (222).

4. The connecting structure according to claim 1, wherein:

the first unit (1), the second unit (2) and the third unit (3) are connected by an adhesive material (A).

5. The connecting structure according to claim 1, wherein:

the first unit (1) comprises a circuit board.

6. The connecting structure according to claim 2, wherein:

the upper boss structure (2231) has a notch portion (2232).

7. The connecting structure according to claim 2, wherein:

the upper boss structure (2231) is provided with a plurality of notch parts (2232) which are in a symmetrical structure.

8. The connecting structure according to claim 3, wherein:

the hollow-out structures (23) are formed into a plurality of round holes (231).

9. The connecting structure according to claim 4, wherein:

the bonding material (A) is silica gel or epoxy resin.

10. The connecting structure according to claim 1, wherein:

the second unit (2) is made of an insulating material including a plastic material or the like.

11. A sensor, characterized by:

comprising the connecting structure of any one of claims 1-10.

12. A method of assembling a joint structure of any one of claims 1 to 10, comprising the steps of:

connecting the first unit (1) with the second unit (2);

connecting the second unit (2) with the third unit (3).

13. The method of assembly of claim 12, wherein:

-connecting the first unit (1) with the second unit (2) and/or connecting the second unit (2) with the third unit (3) by using a bonding material (a).

14. The method of assembly of claim 13, wherein:

applying the adhesive material (A) to the surface of the connection portion (31);

aligning the second unit (2) with the connection (31) and connecting with the third unit (3).

15. The method of assembly of claim 12, wherein:

the first unit (1) and the second unit (2) and/or the second unit (2) and the third unit (3) are connected with each other in a clamping manner.

16. The method of assembly of any one of claims 12-15, wherein:

the bonding material (A) is silica gel or epoxy resin.

17. A sensor obtained with a method comprising the assembly method of any one of claims 12-16.

18. A sensor as claimed in claim 11 or 17, comprising a pressure sensor.

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