CN111951879A - Testing Equipment - Google Patents

Abstract

A detection device includes a chip carrying device and a pressing device. The chip carrier device includes a circuit board and a plurality of electrical connection units. A plurality of electrical connection units are used to carry a plurality of chips. The pressing device includes a cover body and a pressing member. The cover body is arranged on one side of the circuit board, and the cover body and the circuit board together form an accommodating space, and a plurality of electrical connection units arranged on the circuit board are correspondingly located in the accommodating space. The air extraction device can draw out the air in the accommodating space to make the accommodating space into a negative pressure state. The pressing member is arranged between the cover body and the plurality of electrical connection units, and the pressing member is located in the accommodating space. When the air extraction device pulls out the air in the accommodating space, the pressing member will press against the plurality of electrical connection units and the chips, so that the chips are connected with the electrical connection units.

Description

Testing Equipment

technical field

The present invention relates to a detection device, in particular to a detection device for detecting chips.

Background technique

In the existing common memory detection equipment, the way to detect the memory is to insert a plurality of memories on a plurality of electrical bases on a circuit board one by one manually or by a mechanical arm. Afterwards, a plurality of memories are tested through the circuit board and a plurality of electrical bases. However, in specific applications, it often happens that the memory is not firmly connected to the electrical base (for example, the pins of the memory are not completely connected to the pins of the electrical base), and the memory should be a good product, but it is judged to have failed the test. And for the problem of defective products.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a detection device, which is used to improve the prior art. The memory detection device uses manual or mechanical arms to insert the memory into the electrical base one by one, so that when the detection operation is performed, it is easy to cause the memory to be unstable. Inserted into the electrical base, resulting in incorrect test results.

In order to achieve the above object, the present invention provides a testing device for testing a plurality of chips, the testing device includes a chip carrying device and a pressing device, and the chip carrying device includes at least one circuit board and a plurality of electrical a connecting unit; a plurality of electrical connecting units are arranged on the circuit board, and the plurality of the electrical connecting units are used to carry a plurality of the chips; a pressing device includes: a cover body and a pressing piece, the cover body One side is concavely formed with a groove, the cover body is arranged on one side of the circuit board, and the cover body and the circuit board together form an accommodating space, and a plurality of The electrical connection unit is correspondingly located in the accommodating space, and the cover body can be connected with an air extraction device, and the air extraction device can extract the air in the accommodating space to the outside, so that the The accommodating space is in a negative pressure state; a pressing member is disposed between the cover body and the plurality of the electrical connection units, and at least a part of the pressing member is located in the accommodating space; wherein, When the air extraction device pulls out the air in the accommodating space, so that the pressure of the accommodating space reaches a predetermined pressure, the pressing member will press against the plurality of the electrical connection units and the The chips are arranged therein, so that each of the chips will be interconnected with the corresponding electrical connection unit.

Preferably, the cover body has at least one air extraction hole or the circuit board has at least one air extraction hole, and the air extraction device can extract the air in the accommodating space outward through the air extraction hole.

Preferably, each of the electrical connection units includes a body, a support structure, a lifting structure, at least one elastic component and a plurality of probe components, the body has a top wall and a ring side wall, the top wall has an opening One end of the side wall of the ring is connected to the periphery of the top wall, the other end of the side wall of the ring is arranged on the circuit board, and the top wall, the side wall of the ring and the circuit board are connected together An accommodating groove is formed; the two opposite sides of the top wall are defined as an outer side and an inner side, the inner side is located in the accommodating groove; a support structure is arranged on the circuit board, and the The supporting structure is located in the accommodating groove; a lifting structure is arranged in the accommodating groove, the lifting structure has a base and a bearing part, the base is located in the accommodating groove, and the base faces a The bearing portion is formed by lateral extension, and at least a part of the bearing portion is located in the opening; the bearing portion is extended to a side away from the base to form a plurality of limiting portions, and a plurality of the limiting portions are formed. At least a part of the chip passes through the opening, and a plurality of the limiting parts and the bearing part together form a chip accommodating groove, and the chip accommodating groove is used for accommodating one of the chips; the lifting structure also has a plurality of connecting holes, the plurality of connecting holes penetrate the base part and the bearing part; at least one elastic component is arranged in the accommodating groove, one end of the elastic component is fixed on the lifting structure, the elastic component is The other end of the component is fixed on the support structure; the elastic restoring force generated by the compression of the elastic component makes the base abut against the inner side surface of the top wall, and makes the lifting structure and the support A gap is formed between the structures; one end of each of the probe assemblies is fixedly arranged on the support structure, and the probe assemblies are connected with the circuit board, and the other ends of the plurality of probe assemblies pass through the a plurality of the connection holes; wherein, when the chip container is provided with the chip and the limiting portion is not pressed by the pressing member, the probes located in the plurality of connection holes The needle assembly is not in contact with the plurality of contact points of the chip; wherein, when the chip container is provided with the chip, and the pressing member abuts against the outer side surface of the top wall, it is exposed The limiting portion of the main body will be pressed by the pressing device to be retracted in the main body, and a plurality of the probe assemblies will abut a plurality of the contact portions, and a plurality of The probe assembly and the chip are connected to each other.

Preferably, the length direction of each of the probe assemblies is defined as an axial direction, and the height of the portion of each of the limiting portions exposed to the body along the axial direction is less than or equal to the height of the limiting portion When pressed, the distance between the lifting structure and the supporting structure along the axial direction.

Preferably, the length direction of each probe assembly is defined as an axial direction, and when the lifting structure is not pressed, the distance between the end of each probe assembly and the opening of one end of the corresponding connecting hole , which is less than or equal to the distance between the lifting structure and the supporting structure along the axial direction when the lifting structure is not pressed.

Preferably, when the chip container is provided with the chip, and the pressing device abuts against the outer side surface of the top wall, a plurality of the probe assemblies abut against the plurality of the contact portions , and the chip is far away from the outer side surface of the lifting structure, and correspondingly abuts against the pressing device against the side of the limiting portion.

Preferably, when the chip container is provided with the chip, and the pressing device abuts against the outer side surface of the top wall, one end of the plurality of probe assemblies protrudes out of the plurality of the probe assemblies. connection hole.

Preferably, when the chip container is provided with the chip, the pressing device is pressed against the limiting portion, and the lifting structure is pressed against the support structure, a plurality of the probe assemblies A plurality of the contact portions are pressed against each other, and the chip is far away from the outer side surface of the lifting structure, and correspondingly abuts against the pressing device against one side of the limiting portion.

Preferably, when the chip container is provided with the chip, the pressing device is pressed against the limiting portion, and the lifting structure is pressed against the support structure, a plurality of the probe assemblies A plurality of the connecting holes pass through one end.

The beneficial effect of the present invention may be that: the detection device of the present invention can cooperate with an external air pumping device to pump air into the accommodating space, whereby the accommodating space can be in a negative pressure state, so that the pressing member can be in a negative pressure state. The chips disposed on the plurality of electrical connection units are tightly pressed to ensure that each chip can be tightly connected to the electrical connection units.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, however, the accompanying drawings are only for reference and description, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a schematic diagram of the detection device of the present invention.

FIG. 2 is an exploded schematic view of the detection device of the present invention.

FIG. 3 is a partially enlarged schematic view of the electrical connection unit of the present invention disposed on a circuit board.

4 is a schematic exploded cross-sectional view of the electrical connection unit of the present invention.

FIG. 5 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line V shown in FIG. 3 .

FIG. 6 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line VI shown in FIG. 3 .

FIG. 7 is a schematic diagram of a chip provided in the electrical connection unit of the present invention.

FIG. 8 is a schematic cross-sectional view of the electrical connection unit of the present invention taken along the section line VIII shown in FIG. 7 .

9 is a schematic cross-sectional view of the electrical connection unit of the present invention provided with a chip and under pressure.

10 is an exploded schematic view of the probe assembly of the electrical connection unit of the present invention.

FIG. 11 is a schematic diagram of a pressing device of the detection device of the present invention.

FIG. 12 is a schematic diagram of another viewing angle of the pressing device of the detection apparatus of the present invention.

13 is a schematic cross-sectional view of the pressing device of the detection apparatus of the present invention pressing against a plurality of electrical connection units.

FIG. 14 is a schematic cross-sectional view of another embodiment of the detection device of the present invention.

15 is a schematic cross-sectional view of another embodiment of the pressing device of the detection device of the present invention.

16 is a schematic cross-sectional view of yet another embodiment of the pressing device of the detection apparatus of the present invention.

Detailed ways

In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used for emphasis in the subsequent description, and most of the related content mentioned appears in the specific figure, but It is not intended that in this ensuing description, reference may be made to only the particular drawings described.

Please refer to FIG. 1 and FIG. 2 , which are schematic diagrams of assembly and disassembly of the detection device of the present invention. As shown in the figure, the detection device E includes: a chip carrying device E1 and a pressing device E2.

The chip carrier E1 has a circuit board 1 and a plurality of electrical connection units 2 . A plurality of electrical connection units 2 are fixedly arranged on the circuit board 1 , each electrical connection unit 2 is used to carry a chip C (as shown in FIG. 7 ), and each electrical connection unit 2 is provided with a plurality of probe assemblies 20 (as shown in FIG. 4 ) shown), one end of each probe assembly 20 is used to connect with the circuit board 1, the other end of each probe assembly 20 is used to connect with the chip C, and a plurality of probe assemblies 20 are used to connect the chip C to the circuit The boards 1 can be connected to each other. In different applications, there may be multiple circuit boards 1 instead of being limited to a single circuit board 1 . The chip C referred to here particularly refers to a memory (eg, NAND Flash), but is not limited thereto.

In a specific application, the circuit board 1 may be provided with at least one control unit (not shown, such as various microprocessors) or the circuit board 1 may be connected to a control device (not shown, such as a computer device) , and the control unit or the control device can be connected with each chip C through the circuit board 1 , so as to perform detection work on each chip C. The detection operation performed by the control unit or the control device on the chip C may vary according to the actual requirements and the difference of the chip C; The detection operation, or the control unit or the control device may also perform different detection operations on the chips C disposed in different regions of the circuit board 1 , which is not limited herein.

The pressing device E2 can be controlled to press the side of each electrical connection unit 2 where the chip C is arranged, so that the chip C can be stably connected to the probes in the electrical connection unit 2 when the chip C is tested. Components 20 are connected. In different embodiments, the pressing device E2 can also be used to change the temperature of each chip C, so that the chip C can perform the detection operation in a high temperature state or a low temperature state.

As shown in FIG. 3 , it shows a schematic diagram of a single electrical connection unit 2 of the present invention arranged on the circuit board 1 ; FIG. 4 shows an exploded cross-sectional schematic diagram of a single electrical connection unit 2 ; FIG. 5 is arranged on the circuit board 1 . 3 is a schematic view of the electrical connection unit 2 cut along the section line V shown in FIG. 3; FIG. 6 is a schematic view of the electrical connection unit 2 disposed on the circuit board 1 cut along the section line VI shown in FIG. As shown in FIGS. 3 to 6 , each electrical connection unit 2 includes a plurality of probe assemblies 20 , a body 21 , a lifting structure 22 , a supporting structure 23 and four elastic elements 24 .

The main body 21 has a top wall 211 and a ring side wall 212, the top wall 211 has an opening 21A, one side of the ring side wall 212 is connected to the periphery of the top wall 211, and the other side of the ring side wall 212 is fixedly arranged on the circuit The board 1 , the top wall 211 , the ring side wall 212 and the circuit board 1 together form an accommodating groove 21B. Two opposite sides of the top wall 211 are defined as an outer side 2111 and an inner side 2112 . In practical applications, the top wall 211 and the ring side wall 212 can be integrally formed, and the body 21 can also have a plurality of locking holes 21C (as shown in FIG. 3 ), and the plurality of locking holes 21C can be combined with a plurality of locking members ( For example, screws) cooperate with each other to fix the main body 21 to the circuit board 1 , but the way of fixing the main body 21 to the circuit board 1 is not limited to this.

The lifting structure 22 includes a base portion 221 and a bearing portion 222 . The base portion 221 is completely disposed in the accommodating groove 21B, the base portion 221 extends to one side to form a bearing portion 222 , and a portion of the bearing portion 222 can pass through the opening 21A. A side of the bearing portion 222 away from the base portion 221 is extended to form four limiting portions 223 . The four limiting portions 223 are located at four corners of the bearing portion 222 , and the four limiting portions 223 are common with the bearing portion 222 . A chip accommodating groove 22B is formed, and the chip accommodating groove 22B is used for providing the chip C to be arranged, and the four limiting portions 223 are used for mutually engaging the chip C. Each limiting portion 223 can be roughly L-shaped, but not limited to this; the number of limiting portions 223 can also be changed according to needs, not limited to four, and the setting positions of the limiting portions 223 are not shown in the figure. The illustration is limited, and the four limiting portions 223 may not be disposed at the four corners. The lifting structure 22 also has a plurality of connecting holes 22A (as shown in FIG. 6 ), and each connecting hole 22A is disposed through the base portion 221 and the bearing portion 222 .

A part of the plurality of probe assemblies 20 is fixedly disposed in the support structure 23, and the plurality of probe assemblies 20 are fixedly disposed at one end of the support structure 23 to be connected with the circuit board 1; another part of the plurality of probe assemblies 20 One end is located in the plurality of connection holes 22A, and one end of the probe assembly 20 located in the plurality of connection holes 22A is used for connecting with the contact portion C1 of the chip C. As shown in FIG.

As shown in FIG. 4 to FIG. 6 , the support structure 23 is disposed in the accommodating groove 21B, and the four elastic components 24 are disposed between the support structure 23 and the lifting structure 22 . Each elastic component 24 may be, for example, a compression spring, and the sides of the lifting structure 22 and the supporting structure 23 facing each other may be respectively formed with corresponding engaging grooves 22C and 23A, and two ends of each elastic component 24 correspond to each other. The engaging grooves 22C and 23A are engaged with each other. In different applications, the elevating structure 22 and the supporting structure 23 may have engaging protrusions formed in the engaging grooves 22C and 23A, respectively, and two ends of each elastic component 24 may be corresponding to two engaging protrusions Snap and fix each other.

The four elastic components 24 can make the base 221 of the lifting structure 22 abut against the inner side surface 2112 of the top wall 211 , and form a corresponding gap S between the base 221 and the supporting structure 23 (as shown in FIG. 6 ). In practical applications, when the electrical connecting unit 2 is fixed on the circuit board 1 and the limiting portion 223 of the electrical connecting unit 2 is not pressed by external force, the four elastic components 24 located between the lifting structure 22 and the supporting structure 23 It may be slightly compressed, and the elastic restoring force generated by the compression of the elastic component 24 will make the lifting structure 22 firmly abut against the inner side surface 2112 of the top wall 211 .

In particular, the number of the elastic components 24 of the electrical connection unit 2 is not limited to the above four, and the number of the elastic components 24 can be changed according to requirements, for example, it can be one.

As shown in FIG. 7 and FIG. 8 , when the chip C is fixedly disposed in the chip container 22B, and the pressing device E2 (as shown in FIG. 2 ) does not press the limiting portion 223 , the plurality of contact portions C1 of the chip C Correspondingly are accommodated in the plurality of connection holes 22A, and each probe assembly 20 is not connected with the plurality of contact portions C1 (for example, not in contact with each other), and between the lifting structure 22 and the supporting structure 23 is formed with Gap S. In the embodiment shown in FIG. 8 , the outer side surface C2 of the chip C away from the lifting structure 22 may not protrude from the limiting portion 223 , but it is not limited to this. The side C2 may also be substantially flush with the outer side 223A of the limiting portion 223 , or the outer side C2 of the chip C may also be slightly protruding from the outer side 223A of the limiting portion 223 . It is worth mentioning that, in the drawings of this embodiment, the pattern in which the contact portion C1 is a solder ball is taken as an example, but the contact portion C1 may be a pin, a flat pad, etc., which is not limited thereto.

As shown in FIG. 13 , when the chip C is disposed in the chip container 22B, and the pressing device E2 abuts against the outer side surface 2111 of the top wall 211 , the limiting portion 223 will be pressed and retracted in the body 21 , That is, the lifting structure 22 will move in the direction of the circuit board 1 relative to the plurality of probe assemblies 20 .

During the process that the pressing device E2 presses the limiting portion 223 to retract the limiting portion 223 into the body 21 , the lifting structure 22 will move relative to the plurality of probe assemblies 20 . When the lifting structure 22 abuts against the supporting structure 23, the plurality of probe assemblies 20 will correspondingly pass through the plurality of connecting holes 22A, and one end of the plurality of probe assemblies 20 will correspond to the plurality of contact portions C1 of the chip C, and the plurality of probe assemblies 20 is connected to chip C accordingly. It should be noted that, when the lifting structure 22 abuts against one side of the supporting structure 23, as long as the plurality of probe assemblies 2 can be connected to the chip C, the plurality of probe assemblies 2 may also not penetrate through the plurality of connections. Hole 22A. In the drawings of this embodiment, after the lifting structure 22 is pressed, the limiting portion 223 can be completely retracted into the main body 21 as an example, but not limited thereto. In different embodiments, the lifting structure After the 22 is pressed, the limiting portion 223 may also be partially retracted in the body 21 .

When the pressing device E2 abuts against the outer side surface 2111 of the electrical connection unit 2 , the plurality of probe assemblies 20 can be pushed against the chip C, so that the outer side surface C2 of the chip C abuts against the inner side of the pressing device E2 . When the outer side surface C2 of the chip C abuts against the inner side of the pressing device E2, the springs 202 of the plurality of probe assemblies 20 will be compressed, and the elastic restoring force corresponding to the compression of the springs 202 will make the chip C stably It abuts against the inner side surface 2112 of the pressing device E2.

Please refer to FIG. 6 again, it is particularly noted that if the length direction of the probe assembly 20 is defined as an axial direction (ie, the Y-axis direction shown in the figure), when the lifting structure 22 is not pressed (at this time, the base 221 can be against the top wall 211), the distance D2 between the end of each probe assembly 20 and the opening of one end of the corresponding connecting hole 22A can be smaller than the distance D1 between the lifting structure 22 and the supporting structure 23 in the axial direction, In this way, when the lifting structure 22 is pressed against one side of the supporting structure 23 (as shown in FIG. 10 ), one end of the probe assembly 20 will pass through the connecting hole 22A, so as to ensure the safety of the probe assembly 20 One end can be connected to the contact portion C1 of the chip C (for example, to be in contact with each other).

It should be noted that, as long as the lifting structure 22 is pressed, the plurality of probe assemblies 20 can be converted from not in contact with the plurality of contact portions C1 of the chip C to contact with the plurality of contact portions C1. The above distance D2 and spacing D1 can be adjusted according to requirements, that is, after the lifting structure 22 is pressed, the probe assemblies 20 can be in contact with the contact portions C1 under the premise that the probe assembly 20 is pressed when the lifting structure 22 is pressed , the probe assembly 20 may be protruded or not protruded from the corresponding connecting hole 22A.

As shown in FIG. 6 , the height H1 of the portion of each limiting portion 223 exposed to the body 21 along the axial direction (ie, the Y-axis direction shown in the figure) is less than or equal to when the limiting portion 223 is not pressed, The distance D1 between the lifting structure 22 and the supporting structure 23 along the axial direction is such that each limiting portion 223 can be retracted in the body 21 when pressed by the pressing device E2. In the embodiment in which the height H1 of the portion of each limiting portion 223 exposed from the body 21 along the axial direction (ie, the Y-axis direction shown in the figure) is equal to the distance D1 between the lifting structure 22 and the supporting structure 23 , the When the pressing device E2 abuts against the outer side surface 2111 of the main body 21 , the lifting structure 22 will correspondingly abut against one side of the support structure 23 .

According to the above, when the pressing device E2 abuts against the outer side surface 2111 of the electrical connection unit 2, the plurality of probe assemblies 20 will abut against the chip C, so that the chip C abuts against one side of the pressing device E2, At this time, the control unit or the control equipment can perform the detection operation on the chip C, and at the same time control the pressing device E2 to increase or decrease the temperature, so that the chip C can perform the detection operation in a high temperature state or a low temperature state.

When the pressing device E2 abuts against the outer side surfaces 2111 of the plurality of electrical connection units 2, the pressing device E2 is attached to the outer side surfaces C2 of the plurality of chips C at the same time, so the pressing device E2 is controlled to heat up or During cooling, the temperatures of the plurality of chips C will vary with the pressing device E2, and the temperatures of the plurality of chips C will be close to the same, thus ensuring that the plurality of chips C perform detection operations at approximately the same temperature.

In the prior art, the way to make a plurality of chips C perform detection operations in a high temperature environment at the same time is as follows: first, the circuit board 1 with the plurality of chips C inserted therein is placed in an oven; The internal temperature of the oven is raised, so that the multiple chips C can be tested in a high temperature environment; however, the detection method of the prior art cannot accurately control the temperature of each area in the oven, so it is impossible to ensure that each The chips C are all tested at the expected temperature, which leads to the problem of inaccurate test results. In contrast, the above-mentioned detection device E of the present invention can greatly improve the problems existing in the above-mentioned prior art.

As shown in FIGS. 4 , 6 and 10 , in practical applications, the support structure 23 may include a base structure 231 and an auxiliary structure 232 . The base structure 231 is disposed in the accommodating groove 21B, and the base structure 231 and the main body 21 are fixed to each other (for example, the base structure 231 is fixed to the main body 21 by cooperating with a plurality of screws). The base structure 231 has a plurality of through holes 231A, and one end of the plurality of probe assemblies 20 is fixedly disposed in the plurality of through holes 231A.

It is worth mentioning that one of the main functions of the base structure 231 is to stably set the probe assembly 20 upright in the accommodating groove 21B. Therefore, the hole diameter of the through hole 231A of the base structure 231 may be slightly smaller than that of the probe assembly 20 maximum outer diameter, and each probe assembly 20 and the through hole 231A can be arranged in a snap fit. The number of through-holes 231A of the base structure 231 , the depth of each through-hole 231A, the distance between the through-holes 231A, the arrangement of the plurality of through-holes 231A, etc., can be changed according to requirements, and the figure is only an exemplary method. , not limited thereto.

The auxiliary structure 232 is disposed in the accommodating slot 21B, and the auxiliary structure 232 is located between the base structure 231 and the top wall 211 , and the auxiliary structure 232 and the base structure 231 are fixed to each other (eg, mutually locked by screws). The auxiliary structure 232 has a plurality of supporting holes 232A, the plurality of supporting holes 232A are spaced apart from each other, the plurality of supporting holes 232A and the plurality of through holes 231A of the base structure 231 communicate with each other, and the plurality of supporting holes 232A are connected with the plurality of connecting holes 22A. Correspondingly, the plurality of connection holes 22A, the plurality of support holes 232A and the plurality of through holes 231A will jointly form a plurality of probe channels T, and the plurality of probe assemblies 20 are correspondingly disposed in the plurality of probe channels T.

As shown in FIG. 10 , it is an exploded schematic diagram of a single probe assembly 20 . The probe assembly 20 includes a needle body 201 and a spring 202 . The needle body 201 is a rod-shaped structure, and two ends of the needle body 201 are defined as a contact end 201A and a tail end 201B. The position of the needle body 201 adjacent to the contact end 201A has a limiting protrusion 2011 (an annular structure is used as an example in the figure, but the shape is not limited to this), and the limiting protrusion 2011 separates the needle body 201 There are an exposed section 201C and an inner section 201D, the spring 202 is correspondingly sleeved on the inner section 201D of the needle body 201 , and the exposed section 201C of the needle body 201 is not sleeved with the spring 202 .

The needle body 201 is further divided into a fixing section 201E in the inner section 201D. The fixing section 201E is located at a position adjacent to the limiting protrusion 2011. The outer diameter of the needle body 201 in the fixing section 201E is larger than that in the needle body 201 in The outer diameter of the remaining sections of the built-in section 201D.

The spring 202 is sequentially partitioned from one end to the other end with a first tight section 202A, an elastic section 202B and a second tight section 202C. The inner diameter of the spring 202 in the first tight section 202A is smaller than the outer diameter of the needle body 201 in the fixed section 201E, and when the spring 202 is sleeved on the inner section 201D of the needle body 201, the first tight section of the spring 202 202A corresponds to the fixing section 201E of the needle body 201 to be mutually clamped, and one end of the spring 202 adjacent to the first tight section 202A abuts against one side of the limiting protrusion 2011 correspondingly. That is to say, one end of the spring 202 can be fixedly arranged on the fixed section 201E of the needle body 201 through the design that the inner diameter of the first tight section 202A of the spring 202 and the outer diameter of the needle body 201 and the fixing section 201E cooperate with each other.

The pitch of the spring 202 between the first tight section 202A and the second tight section 202C is smaller than the pitch between the spring 202 and the elastic section 202B. In practical applications, the spring 202 is in the first tight section. The pitch of the 202A or the second tight section 202C can be close to zero, that is, no matter whether the spring 202 is compressed or not, the spring 202 will not deform in the first tight section 202A or the second tight section 202C, The first tight section 202A and the second tight section 202C of the spring 202 only serve as a structure for fixing the needle body 201 and the base structure 231 to each other.

The length of the spring 202 in the first tight section 202A is smaller than the length of the spring 202 in the elastic section 202B; the length of the spring 202 in the second tight section 202C can be determined by the depth of the through hole 231A of the base structure 231 .

In practical applications, the springs 202 of each probe assembly 20 can be made of conductive material. The tail end 201B of the body 201 may not be exposed to the spring 202, and when the electrical connection unit 2 is fixed to the circuit board 1, the end of the spring 202 with the second tight section 202C abuts against the circuit board 1, and the spring 202 is connected to the circuit board 1. The circuit board 1 is connected, and the current and signal between the circuit board 1 and the chip C are transmitted through the needle body 201 and the spring 202 .

As shown in FIG. 6 and FIG. 10 , the auxiliary structure 232 may have an abutting structure 2321 in each supporting hole 232A, and each abutting structure 2321 is used to abut the limiting protrusion 2011 of the needle body 201 . When the probe assembly 20 is disposed in the probe channel T, the limiting protrusions 2011 of the needle body 201 will correspondingly abut against the abutting structure 2321 , and the abutting structure 2321 can restrict the needle body 201 relative to the auxiliary structure 232 to move up and down accordingly The direction of the structure 22 moves. Since the limiting protrusions 2011 of the needle body 201 abut against the abutting structure 2321 correspondingly, the inner section 201D of the needle body 201 is located in the auxiliary structure 232 and the base structure 231 (ie, the supporting structure 23 ) correspondingly. Most of the exposed section 201C of the body 201 is correspondingly exposed outside the support structure 23 , and the section of the needle body 201 adjacent to the contact end 201A is correspondingly located in the connecting hole 22A.

It is worth mentioning that, as shown in FIG. 3 and FIG. 6 , in practical applications, each electrical connection unit 2 can be fixed to the circuit board 1 by means of locking, and each probe assembly 20 is adjacent to the circuit board 1 . One end can be connected to the circuit board 1 in abutting manner, and each probe assembly 20 is not fixed to the circuit board 1 by welding; in this way, the relevant personnel can disassemble and replace any electrical connection on the circuit board 1 as required unit 2 , and relevant personnel can also disassemble and replace any probe assembly 20 in each electrical connection unit 2 as required.

Please refer to FIG. 8 and FIG. 9 together, when the pressing device E2 no longer presses the limiting portion 223, the elastic restoring force generated by the pressing of the elastic element 24 will push against the lifting structure 22, so that the lifting structure 22 is freed from The position adjacent to the auxiliary structure 232 is moved to a position where the inner side surface 2112 of the top wall 211 abuts against each other. When the lifting structure 22 is moved from the state of FIG. 10 to the state of FIG. 8 , the lifting structure 22 will cause the chip C to move. The contact ends 201A of the plurality of needle bodies 201 are separated from each other, so that the chip C is no longer connected to the plurality of probe assemblies 20 (for example, no longer in contact with each other).

It is worth mentioning that, as shown in FIGS. 6 and 10 , the height H1 along the axial direction (ie, the Y-axis direction shown in the figure) of the portion of each limiting portion 223 exposed to the body 21 is smaller than that of the limiting portion. When the 223 is not pressed, the distance D1 between the lifting structure 22 and the supporting structure 23 along the axial direction in the embodiment, when the pressing device E2 abuts against the outer side surface 2111, between the lifting structure 22 and the auxiliary structure 232 A gap G may be formed. Through the design of the gap G, when the lifting structure 22 or the auxiliary structure 232 has production errors, it can still be ensured that the pressing device E2 can abut against the outer side surface 2111 .

In different embodiments, when the pressing device E2 presses the lifting structure 22 and the plurality of probe assemblies 20 are connected to the contact portions C1 of the chip C (for example, in contact with each other), the pressing device E2 may also be different. It is pressed against the outer side surface 2111 , and the lifting structure 22 is pressed against one side of the supporting structure 23 .

According to the above, in simple terms, when the chip C is disposed in the chip container 22B of the electrical connection unit 2 and the lifting structure 22 is not pressed, the plurality of probe assemblies 20 are not connected to the chip C; when the lifting structure 22 is not pressed When the structure 22 is pressed and retracted in the body 21 , the plurality of probe assemblies 20 will be pressed against the chip C and connected to each other; when the lifting structure 22 is no longer pressed, the lifting structure 22 will return to not being pressed the state at the time, and the chip C will no longer be connected with the plurality of probe assemblies 20 .

Please refer to FIGS. 11 to 13 together. FIGS. 11 and 12 are exploded schematic views of one embodiment of the pressing device E2 of the detection apparatus E of the present invention, and FIG. 13 shows the pressing device E2 of the present embodiment pressing against A cross-sectional schematic view of a plurality of electrical connection units 2 . As shown in the figure, the pressing device E2 may include a temperature adjustment component 30 and an air extraction component 40 . The number of the temperature adjustment components 30 can be changed according to requirements, and is not limited to one.

The temperature adjustment component 30 may include a temperature regulator 31 and a cover 32 . One side of the temperature regulator 31 has a flat structure 311, the flat structure 311 has a flat contact surface 3111, and the inside of the temperature regulator 31 may have a heating coil (not shown), the heating coil can be controlled to generate heat energy. The interior of the temperature regulator 31 may also have at least one fluid channel (not shown), and the fluid channel may be communicated with a fluid inlet 31A and a fluid outlet 31B of the temperature regulator 31, and the cryogenic fluid may be made of fluid. The inlet 31A enters the fluid channel and flows out through the fluid outlet 31B. In particular, the pressing device E2 shown in FIG. 9 may be the flat structure 311 of the temperature adjustment assembly 30 described in this embodiment. The number of the fluid inlet 31A and the fluid outlet 31B can be increased according to requirements, and is not limited to a single one. The number of temperature regulators 31 is not limited to a single one, and in different embodiments, the number of temperature regulators 31 may also be more than two.

As shown in FIG. 12 and FIG. 9 , when the pressing device E2 is pressed against the electrical connection unit 2 , the flat structure 311 of the pressing device E2 will abut against the outer side surface 2111 of the electrical connection unit 2 and the outer surface of each chip C correspondingly. Side C2, at this time, relevant personnel or equipment can control the operation of the temperature regulator 31 through the control unit or the control equipment, so that the heating coil generates heat energy, thereby increasing the temperature of the flat structure 311, so that the chip C is The detection operation is carried out in a high temperature state; alternatively, the relevant personnel or equipment can control the operation of the cryogenic fluid storage device (not shown) connected to the temperature regulator 31 through the control unit or control device, so that the cryogenic fluid storage device is stored The low-temperature fluid enters the temperature regulator 31 through the fluid inlet 31A, so that the temperature of the flat structure 311 is lowered, so that the chip C can be tested in a low-temperature state.

It is particularly noted that, in practical applications, the pressing device E2 may only have a heating coil but not a fluid channel, or the pressing device E2 may only have a fluid channel but not a heating coil, that is, the pressing device E2 The pressing device E2 is not limited to have the functions of heating and cooling at the same time, and the pressing device E2 may only have the function of heating or only the cooling. In the embodiment in which the pressing device E2 does not have a heating coil but only has a fluid channel, the high temperature liquid may also flow into the fluid channel, so that the pressing device E2 can still have a heating function.

The above-mentioned temperature adjustment component 30 is only an exemplary manner, and the practical application is not limited to the above description. For example, the temperature adjustment component 30 may also include a cooling chip.

The cover body 32 is fixedly arranged on one side of the temperature regulator 31, and the cover body 32 is used to block the transfer of thermal energy, so as to prevent the thermal energy generated by the temperature regulator 31 from quickly dissipating outward, or to prevent the external thermal energy from being transferred to a low temperature. The temperature regulator 31 through which the fluid flows. In practical applications, an accommodating space 32A may be correspondingly formed between the cover body 32 and the temperature regulator 31 , and the accommodating space 32A may be filled with any component that can block heat transfer. The shape and size of the temperature regulator 31 and the cover body 32 can be changed according to requirements, and the figure shown in the figure is only an exemplary method. In addition, the method of generating thermal energy of the temperature regulator 31 is not limited to using a heating coil, and the temperature regulator 31 is not limited to using a low-temperature fluid to achieve the effect of lowering the temperature.

The air extraction assembly 40 has a cover body 401 , a groove 40A is concavely formed on one side of the cover body 401 , and the cover body 401 has an accommodating opening 40B, and the accommodating opening 40B communicates with the groove 40A. A protruding portion 312 may be formed on the side of the temperature regulator 31 opposite to the flat structure 311 . The flat structure 311 is fixedly disposed in the groove 40A, and the protruding portion 312 is correspondingly exposed to the accommodating opening 40B. The fluid inlet 31A and the fluid outlet 31B are disposed on the protruding portion 312 , but not limited thereto, and the positions of the fluid inlet 31A and the fluid outlet 31B can be changed according to requirements. The cover body 32 is disposed on the side of the cover body 401 opposite to the side where the groove 40A is formed. The cover body 401 also has two air extraction holes 40C, and the two air extraction holes 40C are used for connecting with air extraction equipment. The appearance and size of the cover body 401 , the number and size of the air extraction holes 40C, etc., can be changed according to requirements, and the drawings are only exemplary.

As shown in FIG. 13 and FIG. 9 , when the pressing device E2 is disposed on one side of the circuit board 1 , the flat structure 311 of the temperature regulator 31 will correspondingly abut against the limiting portions 223 of the plurality of electrical connection units 2 , The cover body 401, the circuit board 1 and the flat structure 311 together form an accommodating space SP, and the air suction hole 40C is communicated with the accommodating space SP. In this way, the air suction device can perform the accommodating space SP through the air suction hole 40C. The air extraction operation is performed to extract the air in the accommodating space SP outward, so that the accommodating space SP becomes a negative pressure state, thereby pressing the auxiliary flat structure 311 against the plurality of electrical connections disposed on the circuit board 1 The limiting portion 223 of the unit 2 .

More specifically, when the pressing device E2 presses the limiting portion 223 , the pressing device E2 must resist the elastic restoring force generated by the elastic component 24 and the plurality of probe components 20 . When the number of the electrical connection units 2 increases, the force required by the pressing device E2 to simultaneously press the limiting portions 223 of the plurality of electrical connection units 2 will increase accordingly; in this case, the above-mentioned pressing device E2 cooperates The air extraction device can greatly reduce the force required by the pressing device E2 to press down the plurality of limiting portions 223 simultaneously, so that the accommodating space SP is in a negative pressure state.

When the pressing device E2 cooperates with the air extraction device, the accommodating space SP is in a negative pressure state, and the temperature regulator 31 performs heating or cooling operations on a plurality of chips, because the accommodating space SP is in a vacuum or Since it is close to a vacuum state, the probability that the temperature of the accommodation space SP is affected by the external environment can be effectively reduced.

Please refer to FIG. 2 and FIG. 14 together. In different embodiments, the air extraction assembly 40 may further include an airtight member 50 and a structural reinforcement member 60 . The airtight member 50 may be a ring-shaped structure. The airtight member 50 is disposed between the cover body 401 and the circuit board 1 , and the airtight member 50 is used to prevent the external air from communicating with the accommodating space SP. In a specific application, the airtight member 50 can be engaged with the circuit board 1 or the cover body 401 , which is not limited here; the shape, size, and installation position of the airtight member 50 can be changed according to the requirements, which are not included here. limit. It is particularly noted that, in practical applications, a corresponding airtight member may be additionally provided at any position that may affect the airtightness of the accommodating space SP. For example, as shown in FIG. 3 , each lock hole 21C An elastic rubber ring may be provided inside; or colloid may be poured into the lock hole 21C to enhance the air-tight effect between the lock and the lock hole.

An engaging groove 60A is concavely formed on one side of the structural reinforcement member 60 , and the circuit board 1 is engaged and fixed in the engaging groove 60A. The structural reinforcement 60 is used to strengthen the overall structural strength of the circuit board 1 , thereby avoiding the problem of deformation of the circuit board 1 during the process of vacuuming the accommodating space SP by the vacuuming device. In a better embodiment, the circuit board 1 and the structural reinforcing member 60 can be fixed to each other by means of a plurality of locking members (such as screws), in addition to being fixed to each other through the engaging groove 60A. , a sealing rubber ring may also be arranged between the locking member and the circuit board 1 , or a possible gap between the locking member and the circuit board 1 may be sealed by welding, spraying airtight colloid, or the like.

In different embodiments, the number of structural reinforcements 60 and their arrangement positions can also be changed according to requirements. For example, the detection device can also have two structural reinforcements 60, and the circuit board 1 is sandwiched between the two. between the structural reinforcements 60 .

Please refer to FIG. 14 , which is a schematic cross-sectional view of another embodiment of the detection apparatus of the present invention. The biggest difference between this embodiment and the embodiment shown in FIG. 13 is that the detection device E may also not have the airtight member 50 , and the cover body 401 may directly abut against one side of the circuit board 1 . In a specific application, the cover body 401 and the circuit board 1 may also respectively have structures that can engage with each other.

Please refer to FIG. 15 , which is a schematic cross-sectional view of yet another embodiment of the detection apparatus of the present invention. The biggest difference between this embodiment and the embodiment shown in FIG. 14 is that the pressing device E2 of the detection device 1 may also not have the temperature adjustment component 30 , but still have the air extraction component 40 . The air extraction assembly 40 has a cover body 401A, and a groove 40A is concavely formed on one side of the cover body 401A, but the cover body 401A does not have the aforementioned accommodating opening 40B;

The cover body 401A is covered on one side of the circuit board 1, and the cover body 401A and the circuit board 1 together form an accommodating space SP, and the cover body 401A also has at least one air extraction hole 40C (as shown in FIG. 12), and The air extraction device can draw out the air in the accommodating space SP through the air extraction hole 40C. The pressing member 70 may be detachably fixed to the cover body 401A, and the pressing member 70 is correspondingly located in the groove 40A. In different applications, the pressing member 70 may also be fixed in the cover body 401A in a non-detachable manner such as adhesion.

The cover body 401A can be fixed on one side of the circuit board 1 by cooperating with a plurality of fasteners (such as screws); when the cover body 401A is covered on the circuit board 1, the pressing member 70 is correspondingly located on the cover body 401A and the plurality of electrical connection units 2, and the pressing member 70 correspondingly presses the chips C (as shown in FIG. 9) arranged on the plurality of electrical connection units 2; when the cover 401A is fixedly arranged on the circuit board 1, and the air extraction equipment When the space SP is evacuated, when the pressure of the accommodating space SP reaches a predetermined pressure (negative pressure), the pressing member 70 can simultaneously shrink the limiting portions 223 of the plurality of electrical connection units 2 to the corresponding bodies 21 thereof. , and the pressing member 70 will correspondingly abut the side of the chip C opposite to the electrical connection unit 2 , whereby the chip C will be connected to the plurality of probe assemblies 20 in the electrical connection unit 2 . As shown in FIG. 16 , in another embodiment, the cover body 401B and the pressing member 70 may also be integrally formed, and the cover body 401B and the pressing member 70 are not limited to be independent components.

To sum up, the testing equipment and the chip carrying device of the present invention can simultaneously press the chips disposed on the plurality of electrical connection units by the pressing device, so that the plurality of chips can be tested at the same temperature at the same time. . In the electrical connection unit of the present invention, through the cooperation of the lifting structure, the elastic assembly, the probe assembly and other components, the chip can be stably connected to a plurality of probe assemblies during the detection operation.

The above descriptions are only preferred feasible embodiments of the present invention, which do not limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the protection scope of the present invention. .

Claims (9)

1. A detection device, characterized in that, the detection device is used to detect a plurality of chips, and the detection device comprises: A chip carrying device, comprising: at least one circuit board; and a plurality of electrical connection units disposed on the circuit board, and a plurality of the electrical connection units are used to carry a plurality of the chips: and A pressing device, which includes: a cover body, a groove is formed on one side of the cover body, the cover body is arranged on one side of the circuit board, and the cover body and the circuit board together form an accommodating space, which is arranged on the circuit board A plurality of the electrical connection units on the board are correspondingly located in the accommodating space, the cover body can be connected with an air extraction device, and the air extraction device can draw out the air in the accommodating space to the outside , so that the accommodating space becomes a negative pressure state; a pressing member disposed between the cover body and the plurality of the electrical connection units, and at least a part of the pressing member is located in the accommodating space; and Wherein, when the air extraction device pulls out the air in the accommodating space, so that the pressure of the accommodating space reaches a predetermined pressure, the pressing member will press against the plurality of the electrical connections units and the chips disposed therein, so that each of the chips will be interconnected with the corresponding electrical connection units. 2 . The detection device according to claim 1 , wherein the cover body has at least one air extraction hole or the circuit board has at least one air extraction hole, and the air extraction device can remove the The air in the accommodating space is drawn out. 3. The detection device according to any one of claims 1 or 2, wherein each of the electrical connection units comprises: a body, which has a top wall and a ring side wall, the top wall has an opening, one end of the ring side wall is connected with the periphery of the top wall, and the other end of the ring side wall is arranged on the The circuit board, the top wall, the ring side wall and the circuit board together form an accommodating groove; the two opposite sides of the top wall are defined as an outer side and an inner side, and the inner side is defined as an outer side and an inner side. is located in the accommodating groove; a support structure, which is disposed on the circuit board, and the support structure is located in the accommodating groove; A lifting structure is disposed in the accommodating groove, the lifting structure has a base portion and a bearing portion, the base portion is located in the accommodating groove, and the base portion extends to one side to form the bearing portion, At least a part of the bearing part is located in the opening; the bearing part extends to a side away from the base part to form a plurality of limit parts, and at least a part of the plurality of limit parts passes through the opening. A plurality of the limiting parts and the carrying parts together form a chip accommodating groove, the chip accommodating groove is used for accommodating one of the chips; the lifting structure also has a plurality of connecting holes, a plurality of all the the connecting hole penetrates the base and the bearing part; At least one elastic component is disposed in the accommodating groove, one end of the elastic component is fixed to the lifting structure, and the other end of the elastic component is fixed to the supporting structure; The elastic restoring force of the base part abuts the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure; A plurality of probe assemblies, one end of each of the probe assemblies is fixedly arranged on the support structure, and the probe assemblies are connected with the circuit board, and the other ends of the plurality of probe assemblies pass through the plurality of probe assemblies. the connecting holes; Wherein, when the chip container is provided with the chip, and the limiting portion is not pressed by the pressing member, the probe assemblies located in the plurality of connection holes are not connected to the chip. A plurality of contact parts are in contact; Wherein, when the chip container is provided with the chip, and the pressing member abuts against the outer side surface of the top wall, the limiting portion exposed to the body will be blocked by the The pressing device is pressed and retracted in the body, and the plurality of the probe assemblies will abut against the plurality of the contact portions, and the plurality of the probe assemblies and the chips are connected to each other. 4 . The testing device according to claim 3 , wherein the length direction of each probe assembly is defined as an axial direction, and the portion of each limiting portion exposed to the body is along the axial direction. 5 . The height in the direction is less than or equal to the distance between the lifting structure and the supporting structure along the axial direction when the limiting portion is not pressed. 5. The detection device according to claim 3 or 4, wherein the length direction of each of the probe assemblies is defined as an axial direction, and when the lifting structure is not pressed, each of the probe assemblies The distance between the end of the connecting hole and the opening of the corresponding end of the connecting hole is less than or equal to the distance between the lifting structure and the supporting structure along the axial direction when the lifting structure is not pressed. 6 . The testing apparatus according to claim 5 , wherein when the chip container is provided with the chip, and the pressing device abuts against the outer side surface of the top wall, a plurality of The probe assembly abuts against a plurality of the contact portions, and the chip is far from the outer side surface of the lifting structure, and correspondingly abuts against the pressing device against one side of the limiting portion. 7 . The testing apparatus according to claim 4 , wherein when the chip container is provided with the chip, and the pressing device abuts against the outer side surface of the top wall, a plurality of One end of the probe assembly protrudes through a plurality of the connection holes. 8 . The testing apparatus according to claim 3 , wherein when the chip container is provided with the chip, the pressing device presses against the limiting portion, and the lifting structure abuts against the position-limiting portion. 9 . In the supporting structure, a plurality of the probe assemblies abut the plurality of the contact portions, and the chips are far away from the outer side surface of the lifting structure, and correspondingly abut the pressing device against the limiting portion. side. 9 . The testing apparatus according to claim 6 , wherein when the chip container is provided with the chip, the pressing device presses against the limiting portion, and the lifting structure abuts against the position-limiting portion. 10 . In the supporting structure, one end of the plurality of probe assemblies protrudes through the plurality of connecting holes.

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