CN111951669A - 一种显示面板及显示装置 - Google Patents
一种显示面板及显示装置 Download PDFInfo
- Publication number
- CN111951669A CN111951669A CN202010802068.7A CN202010802068A CN111951669A CN 111951669 A CN111951669 A CN 111951669A CN 202010802068 A CN202010802068 A CN 202010802068A CN 111951669 A CN111951669 A CN 111951669A
- Authority
- CN
- China
- Prior art keywords
- virtual
- display panel
- circuit board
- display
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/802—Applying energy for connecting
- H01L2224/80201—Compression bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
本申请公开了一种显示面板及显示装置,显示面板包括显示基板和柔性电路板,以及芯片,设于显示区一侧的所述显示基板上;绑定焊盘,设于所述显示基板上且位于所述芯片左右至少一侧;虚拟绑定焊盘,设于所述绑定焊盘一侧的所述显示基板上;金手指,设于所述柔性电路板上,且对应地与所述绑定焊盘的表面相接;虚拟金手指,设于所述金手指一侧的所述柔性电路板上,且对应地与所述虚拟绑定焊盘的表面相接。在绑定焊盘的一侧增加虚拟绑定焊盘,柔性电路板与其对应的位置也增加一些虚拟金手指,虚拟绑定焊盘的表面和虚拟金手指的表面一一对应相接触,能够提高柔性电路板与显示面板的接触面积,从而增加柔性电路板的拉拔力。
Description
技术领域
本申请涉及显示面板领域,尤其地涉及一种显示面板及显示装置。
背景技术
由于目前显示屏屏占比不断提高,所以需要显示器的下边框越来越小。请参阅图1,图1所示为现有技术中提供的显示面板的结构示意图,显示面板100包括显示基板10、显示区20、扇出区30、芯片40、绑定焊盘50、金手指70、柔性电路板60,芯片40设于显示区20一侧的显示基板10上,绑定焊盘50设于显示基板10上且位于芯片40左右两侧,金手指70设于柔性电路板60上,且对应地与绑定焊盘50的表面相接。由于绑定焊盘在芯片两侧的数量较少,导致柔性电路板整体与显示基板的接触面积小,可能导致在拉拔柔性电路板时可能将柔性电路板拉拔掉。
因此,确有必要来开发一种新型的显示面板,以克服现有技术的缺陷。
发明内容
本发明的一个目的是提供一种显示面板,其能够解决现有技术中柔性电路板与显示基板的接触面积小的问题。
为实现上述目的,本发明提供一种显示面板,包括显示基板和柔性电路板,以及芯片,设于显示区一侧的所述显示基板上;绑定焊盘,设于所述显示基板上且位于所述芯片左右至少一侧;虚拟绑定焊盘,设于所述绑定焊盘一侧的所述显示基板上;金手指,设于所述柔性电路板上,且对应地与所述绑定焊盘的表面相接;虚拟金手指,设于所述金手指一侧的所述柔性电路板上,且对应地与所述虚拟绑定焊盘的表面相接。
在绑定焊盘的一侧增加虚拟绑定焊盘,柔性电路板与其对应的位置也增加一些虚拟金手指,虚拟绑定焊盘的表面和虚拟金手指的表面一一对应地相接触,能够提高所述柔性电路板与显示面板的接触面积,从而增加柔性电路板的拉拔力。
进一步的,在其他实施方式中,其中所述绑定焊盘与所述芯片之间设置有引线,所述绑定焊盘通过所述引线连接于所述芯片。
进一步的,在其他实施方式中,其中所述虚拟绑定焊盘与所述芯片之间不设置引线。因为设置所述虚拟绑定焊盘是为了增加所述柔性电路板与显示面板的接触面积,所以所述虚拟绑定焊盘并不需要发挥电性作用。
进一步的,在其他实施方式中,其中还包括扇出区,所述扇出区包括阴极引线,连接所述芯片和所述显示区内的各列像素;阳极引线,连接所述芯片与所述显示区内的各行像素。在其他实施方式中,所述阴极引线和所述阳极引线的位置也可以互换,即所述阳极引线一端连接到所述芯片,另一端分别连接到所述显示区内的各列像素;所述阴极引线一端连接到所述芯片,另一端分别连接到所述显示区内的各行像素。
进一步的,在其他实施方式中,其中还包括导电胶膜,所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。在其他实施方式中,所述导电胶膜中还包括导电金球,所述绑定焊盘与所述金手指通过所述导电金球电性连接。
进一步的,在其他实施方式中,其中所述虚拟绑定焊盘与所述虚拟金手指之间也设置有导电胶膜,但不设置所述导电金球,所述虚拟绑定焊盘与所述虚拟金手指之间不需要电性连接,只需对应地黏贴增加所述柔性电路板与显示面板的接触面积即可。
进一步的,在其他实施方式中,其中所述金手指的数量与所述绑定焊盘的数量相同,所述绑定焊盘的数量为两个以上,多个所述绑定焊盘之间相互隔绝,多个所述金手指之间相互隔绝。
两个相邻所述绑定焊盘之间的距离优选为0.4mm,两个相邻所述金手指之间的距离优选为0.4mm。
进一步的,在其他实施方式中,其中所述绑定焊盘为矩形。
进一步的,在其他实施方式中,其中所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
进一步的,在其他实施方式中,其中所述绑定焊盘的形状可以为椭圆型、多边形,在此不做限定。
所述绑定焊盘和所述虚拟绑定焊盘的大小相同,宽度优选为4mm,长度优选为9mm。
进一步的,在其他实施方式中,其中所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同,所述虚拟绑定焊盘的数量为两个以上,多个所述虚拟绑定焊盘之间相互隔绝,多个所述虚拟金手指之间相互隔绝。
进一步的,在其他实施方式中,其中所述柔性电路板呈Y型。
进一步的,在其他实施方式中,其中所述柔性电路板包括主体和连接端,所述金手指和所述虚拟金手指均设于所述连接端。
为了实现上述目的,本发明还提供一种显示装置,包括本发明涉及的所述显示面板。
相对于现有技术,本发明的有益效果在于:本发明提供一种显示面板及显示装置,在绑定焊盘的一侧增加虚拟绑定焊盘,柔性电路板与其对应的位置也增加一些虚拟金手指,虚拟绑定焊盘的表面和虚拟金手指的表面一一对应相接触,能够提高柔性电路板与显示面板的接触面积,从而增加柔性电路板的拉拔力。
附图说明
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。
图1为现有技术中提供的显示面板的结构示意图;
图2为本发明实施例提供的显示面板的结构示意图;
图3为本发明实施例提供的显示基板结构示意图;
图4为本发明实施例提供的柔性电路板结构示意图。
背景技术中的附图说明:
显示面板-100; 显示基板-10;
显示区-20; 扇出区-30;
芯片-40; 绑定焊盘-50;
柔性电路板-60; 金手指-70。
具体实施方式中的附图说明:
显示面板-100; 显示基板-10;
显示区-20; 扇出区-30;
芯片-40; 绑定焊盘-50;
柔性电路板-60; 金手指-70;
虚拟焊盘-51; 虚拟金手指-71;
引线-80; 柔性电路板主体-61;
连接端-62。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图2,图2为本发明实施例提供的显示面板的结构示意图,显示面板100,包括显示基板10和柔性电路板60,显示基板10包括显示区20、扇出区30、芯片40、绑定焊盘50、虚拟绑定焊盘51。
请参阅图3,图3为本发明实施例提供的显示基板结构示意图,芯片40设于显示区20一侧的显示基板10上,绑定焊盘50设于显示基板10上且位于芯片40左右两侧;虚拟绑定焊盘51设于绑定焊盘50一侧的显示基板10上。
在本实施例中,绑定焊盘50为矩形,绑定焊盘50的排列方向垂直绑定焊盘的长度方向;虚拟绑定焊盘51为矩形,虚拟绑定焊盘51的排列方向垂直绑定焊盘的长度方向。
在其他实施方式中,绑定焊盘50和虚拟绑定焊盘51的形状可以为椭圆型、多边形,在此不做限定。
在本实施例中,绑定焊盘50和虚拟绑定焊盘51的大小相同,宽度优选为4mm,长度优选为9mm,从而相较于现有技术中宽度和长度均为6mm的绑定焊盘,绑定焊盘50的宽度减小并且载流面积不变。
在本实施例中,金手指70和虚拟虚拟金手指71的大小相同,宽度优选为4mm,长度优选为9mm。
扇出区50包括阴极引线和阳极引线,其中阴极引线的一端连接芯片40,另一端分别连接显示区20内的各列像素;阳极引线一端连接芯片40,另一端分别连接显示区20内的各行像素。
在其他实施方式中,阴极引线和阳极引线的位置也可以互换,即阳极引线一端连接到芯片40,另一端分别连接到显示区20内的各列像素;阴极引线一端连接到芯片40,另一端分别连接到显示区20内的各行像素。
请参阅图4,图4为本发明实施例提供的柔性电路板结构示意图。柔性电路板60呈Y型,柔性电路板60包括主体61和连接端62,金手指70和虚拟金手指71均设于连接端62。
金手指70对应地与绑定焊盘的表面相接;虚拟金手指71设于金手指70一侧的柔性电路板60上,且对应地与虚拟绑定焊盘51的表面相接。
在绑定焊盘50的一侧增加虚拟绑定焊盘51,柔性电路板60与其对应的位置也增加一些虚拟金手指71,虚拟绑定焊盘51的表面和虚拟金手指71的表面一一对应地相接触,能够提高柔性电路板60与显示面板100的接触面积,从而增加柔性电路板60的拉拔力。
其中,绑定焊盘与芯片40之间设置有引线80,绑定焊盘通过引线80连接于芯片40。
虚拟绑定焊盘51与芯片40之间不设置引线,因为设置虚拟绑定焊盘51是为了增加柔性电路板60与显示面板100的接触面积,所以虚拟绑定焊盘51并不需要发挥电性作用。
绑定焊盘50与金手指70之间还设置有导电胶膜,绑定焊盘50与金手指70通过导电胶膜压合连接。在其他实施方式中,导电胶膜中还包括导电金球,绑定焊盘50与金手指70通过导电金球电性连接。
虚拟绑定焊盘51与虚拟金手指71之间也设置有导电胶膜,但不设置导电金球,虚拟绑定焊盘51与虚拟金手指71之间不需要电性连接,只需对应地黏贴,能够增加柔性电路板60与显示面板100的接触面积即可。
金手指70的数量与绑定焊盘50的数量相同,绑定焊盘50的数量为两个以上,多个绑定焊盘50之间相互隔绝,多个金手指70之间相互隔绝。两个相邻绑定焊盘50之间的距离优选为0.4mm,两个相邻金手指70之间的距离优选为0.4mm。
虚拟金手指71的数量与虚拟绑定焊盘51的数量相同,虚拟绑定焊盘51的数量为两个以上,多个虚拟绑定焊盘51之间相互隔绝,多个虚拟金手指71之间相互隔绝。两个相邻虚拟绑定焊盘51之间的距离优选为0.4mm,两个相邻虚拟金手指71之间的距离优选为0.4mm。
为了实现上述目的,本发明还提供一种显示装置,包括本发明涉及的显示面板100。
本发明的有益效果在于:本发明提供一种显示面板及显示装置,在绑定焊盘50的一侧增加虚拟绑定焊盘51,柔性电路板60与其对应的位置也增加一些虚拟金手指71,虚拟绑定焊盘51的表面和虚拟金手指71的表面一一对应相接触,能够提高柔性电路板60与显示面板100的接触面积,从而增加柔性电路板60的拉拔力。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板及屏显示装置进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。
Claims (10)
1.一种显示面板,其特征在于,包括显示基板和柔性电路板,以及
芯片,设于显示区一侧的所述显示基板上;
绑定焊盘,设于所述显示基板上且位于所述芯片左右至少一侧;
虚拟绑定焊盘,设于所述绑定焊盘一侧的所述显示基板上;
金手指,设于所述柔性电路板上,且对应地与所述绑定焊盘的表面相接;
虚拟金手指,设于所述金手指一侧的所述柔性电路板上,且对应地与所述虚拟绑定焊盘的表面相接。
2.根据权利要求1所述的显示面板,其特征在于,所述绑定焊盘与所述芯片之间设置有引线,所述绑定焊盘通过所述引线连接于所述芯片。
3.根据权利要求1所述的显示面板,其特征在于,所述虚拟绑定焊盘与所述芯片之间不设置引线。
4.根据权利要求1所述的显示面板,其特征在于,还包括
阴极引线,连接所述芯片和所述显示区内的各列像素;
阳极引线,连接所述芯片与所述显示区内的各行像素。
5.根据权利要求1所述的显示面板,其特征在于,还包括
导电胶膜,所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。
6.根据权利要求1所述的显示面板,其特征在于,所述金手指的数量与所述绑定焊盘的数量相同,所述绑定焊盘的数量为两个以上,多个所述绑定焊盘之间相互隔绝,多个所述金手指之间相互隔绝。
7.根据权利要求1所述的显示面板,其特征在于,所述绑定焊盘为矩形。
8.根据权利要求1所述的显示面板,其特征在于,所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
9.根据权利要1所述的显示面板,其特征在于,所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同,所述虚拟绑定焊盘的数量为两个以上,多个所述虚拟绑定焊盘之间相互隔绝,多个所述虚拟金手指之间相互隔绝。
10.一种显示装置,其特征在于,包括权利要求1-9任一项所述的显示面板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010802068.7A CN111951669A (zh) | 2020-08-11 | 2020-08-11 | 一种显示面板及显示装置 |
KR1020217030900A KR102554227B1 (ko) | 2020-08-11 | 2020-08-24 | 디스플레이 패널 및 디스플레이 장치 |
JP2021520592A JP2022547752A (ja) | 2020-08-11 | 2020-08-24 | ディスプレイパネルおよびディスプレイ装置 |
PCT/CN2020/110767 WO2022032718A1 (zh) | 2020-08-11 | 2020-08-24 | 一种显示面板及显示装置 |
EP20885393.7A EP4198952A4 (en) | 2020-08-11 | 2020-08-24 | DISPLAY BOARD AND DISPLAY DEVICE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010802068.7A CN111951669A (zh) | 2020-08-11 | 2020-08-11 | 一种显示面板及显示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111951669A true CN111951669A (zh) | 2020-11-17 |
Family
ID=73332326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010802068.7A Pending CN111951669A (zh) | 2020-08-11 | 2020-08-11 | 一种显示面板及显示装置 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP4198952A4 (zh) |
JP (1) | JP2022547752A (zh) |
KR (1) | KR102554227B1 (zh) |
CN (1) | CN111951669A (zh) |
WO (1) | WO2022032718A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113923861A (zh) * | 2021-11-17 | 2022-01-11 | 广西天山电子股份有限公司 | 一种绑定受力平均的柔性电路板及其与lcd的绑定方法 |
CN114898662A (zh) * | 2022-05-06 | 2022-08-12 | 武汉天马微电子有限公司 | 模组及基板 |
US20230360578A1 (en) * | 2022-05-09 | 2023-11-09 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display panel and display device |
US12356826B2 (en) | 2021-06-02 | 2025-07-08 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel, manufacturing method thereof, and display device |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206742520U (zh) * | 2017-06-06 | 2017-12-12 | 信利半导体有限公司 | 一种转接fpc |
JP2019008106A (ja) * | 2017-06-23 | 2019-01-17 | 三菱電機株式会社 | アレイ基板およびアレイ基板を備える表示パネル |
CN208705626U (zh) * | 2018-07-23 | 2019-04-05 | Oppo广东移动通信有限公司 | 移动终端及其显示装置 |
CN109785750A (zh) * | 2019-03-26 | 2019-05-21 | 京东方科技集团股份有限公司 | 显示面板、柔性线路板及显示装置 |
CN110062524A (zh) * | 2019-05-30 | 2019-07-26 | 昆山维信诺科技有限公司 | 绑定结构、显示模组和显示装置 |
CN110579917A (zh) * | 2019-10-15 | 2019-12-17 | 上海中航光电子有限公司 | 显示模组及显示装置 |
CN110660319A (zh) * | 2019-09-27 | 2020-01-07 | 维沃移动通信有限公司 | 一种显示模组及终端设备 |
CN110687728A (zh) * | 2019-09-27 | 2020-01-14 | 维沃移动通信有限公司 | 一种显示模组及终端设备 |
CN210168287U (zh) * | 2018-12-28 | 2020-03-20 | 江苏省德懿翔宇光电科技有限公司 | 汽车车灯补强板、柔性板和接插件连接结构 |
CN210223406U (zh) * | 2019-09-29 | 2020-03-31 | 维沃移动通信有限公司 | 显示模组及电子设备 |
CN111025793A (zh) * | 2019-12-27 | 2020-04-17 | 厦门天马微电子有限公司 | 一种显示面板及显示装置 |
US20200135062A1 (en) * | 2017-12-18 | 2020-04-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flat panel display |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5800507B2 (ja) * | 2011-01-06 | 2015-10-28 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
KR102379591B1 (ko) * | 2014-04-10 | 2022-03-30 | 삼성디스플레이 주식회사 | 전자부품, 이를 포함하는 전자기기 및 전자기기의 본딩 방법 |
JP2016075896A (ja) * | 2014-10-07 | 2016-05-12 | 凸版印刷株式会社 | 表示パネルおよびその製造方法 |
JP2017167208A (ja) * | 2016-03-14 | 2017-09-21 | 株式会社ジャパンディスプレイ | 表示装置 |
KR20200000508A (ko) * | 2018-06-22 | 2020-01-03 | 삼성디스플레이 주식회사 | 표시 패널, 이를 포함하는 전자 장치, 및 이의 제조 방법 |
KR102603403B1 (ko) * | 2018-08-09 | 2023-11-17 | 삼성디스플레이 주식회사 | 표시 장치 |
CN109445649B (zh) * | 2018-10-08 | 2020-11-10 | 武汉华星光电半导体显示技术有限公司 | 一种触控显示面板及绑定方法 |
CN118759747A (zh) * | 2019-02-22 | 2024-10-11 | 武汉华星光电技术有限公司 | 显示面板 |
CN118363216A (zh) * | 2019-04-10 | 2024-07-19 | 武汉华星光电技术有限公司 | 显示面板及显示装置 |
CN109994042B (zh) * | 2019-04-11 | 2024-05-03 | 武汉华星光电技术有限公司 | 驱动芯片及显示面板 |
CN209911692U (zh) * | 2019-06-11 | 2020-01-07 | 北海惠科光电技术有限公司 | 绑定结构及显示装置 |
CN110286535B (zh) * | 2019-06-20 | 2021-08-31 | 上海天马微电子有限公司 | 显示模组、显示模组的制造方法及显示装置 |
-
2020
- 2020-08-11 CN CN202010802068.7A patent/CN111951669A/zh active Pending
- 2020-08-24 WO PCT/CN2020/110767 patent/WO2022032718A1/zh unknown
- 2020-08-24 JP JP2021520592A patent/JP2022547752A/ja active Pending
- 2020-08-24 KR KR1020217030900A patent/KR102554227B1/ko active Active
- 2020-08-24 EP EP20885393.7A patent/EP4198952A4/en active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206742520U (zh) * | 2017-06-06 | 2017-12-12 | 信利半导体有限公司 | 一种转接fpc |
JP2019008106A (ja) * | 2017-06-23 | 2019-01-17 | 三菱電機株式会社 | アレイ基板およびアレイ基板を備える表示パネル |
US20200135062A1 (en) * | 2017-12-18 | 2020-04-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flat panel display |
CN208705626U (zh) * | 2018-07-23 | 2019-04-05 | Oppo广东移动通信有限公司 | 移动终端及其显示装置 |
CN210168287U (zh) * | 2018-12-28 | 2020-03-20 | 江苏省德懿翔宇光电科技有限公司 | 汽车车灯补强板、柔性板和接插件连接结构 |
CN109785750A (zh) * | 2019-03-26 | 2019-05-21 | 京东方科技集团股份有限公司 | 显示面板、柔性线路板及显示装置 |
CN110062524A (zh) * | 2019-05-30 | 2019-07-26 | 昆山维信诺科技有限公司 | 绑定结构、显示模组和显示装置 |
CN110660319A (zh) * | 2019-09-27 | 2020-01-07 | 维沃移动通信有限公司 | 一种显示模组及终端设备 |
CN110687728A (zh) * | 2019-09-27 | 2020-01-14 | 维沃移动通信有限公司 | 一种显示模组及终端设备 |
CN210223406U (zh) * | 2019-09-29 | 2020-03-31 | 维沃移动通信有限公司 | 显示模组及电子设备 |
CN110579917A (zh) * | 2019-10-15 | 2019-12-17 | 上海中航光电子有限公司 | 显示模组及显示装置 |
CN111025793A (zh) * | 2019-12-27 | 2020-04-17 | 厦门天马微电子有限公司 | 一种显示面板及显示装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12356826B2 (en) | 2021-06-02 | 2025-07-08 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel, manufacturing method thereof, and display device |
CN113923861A (zh) * | 2021-11-17 | 2022-01-11 | 广西天山电子股份有限公司 | 一种绑定受力平均的柔性电路板及其与lcd的绑定方法 |
CN113923861B (zh) * | 2021-11-17 | 2025-03-21 | 广西天山电子股份有限公司 | 一种绑定受力平均的柔性电路板及其与lcd的绑定方法 |
CN114898662A (zh) * | 2022-05-06 | 2022-08-12 | 武汉天马微电子有限公司 | 模组及基板 |
CN114898662B (zh) * | 2022-05-06 | 2023-09-26 | 武汉天马微电子有限公司 | 模组及基板 |
US20230360578A1 (en) * | 2022-05-09 | 2023-11-09 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display panel and display device |
US11961447B2 (en) * | 2022-05-09 | 2024-04-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device |
Also Published As
Publication number | Publication date |
---|---|
JP2022547752A (ja) | 2022-11-16 |
EP4198952A4 (en) | 2024-08-28 |
WO2022032718A1 (zh) | 2022-02-17 |
KR102554227B1 (ko) | 2023-07-10 |
KR20220021447A (ko) | 2022-02-22 |
EP4198952A1 (en) | 2023-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111951669A (zh) | 一种显示面板及显示装置 | |
US7994621B2 (en) | Stacked semiconductor package | |
CN107621710B (zh) | 驱动芯片、显示基板、显示装置及显示装置的制作方法 | |
CN109597252A (zh) | 一种液晶显示模组和液晶显示装置 | |
US11515243B2 (en) | Display device and chip-on-film structure thereof | |
US20160351607A1 (en) | Image sensing device | |
TW201009965A (en) | A bump structure and its manufacturing method | |
US20090001567A1 (en) | IC chip with finger-like bumps | |
US20230098663A1 (en) | Display panel and display device | |
KR101000455B1 (ko) | 구동 칩 및 이를 갖는 표시장치 | |
US10692832B2 (en) | Manufacturing method of semiconductor structure | |
KR20170005254A (ko) | 디스플레이 장치 | |
CN108183095B (zh) | 柔性显示面板及其覆晶薄膜结构 | |
CN112185984A (zh) | 一种阵列基板及显示面板 | |
US20070252263A1 (en) | Memory package structure | |
JP2009295857A (ja) | Icチップと外部配線との接続構造およびicチップ | |
CN113257127A (zh) | 显示装置 | |
EA044085B1 (ru) | Дисплейная панель и дисплейное устройство | |
EP3701773B1 (en) | Flex on board anisotropic conductive adhesive interconnection | |
US20120228000A1 (en) | Conductive adhesive having multiple curved lead wires therein | |
US8039959B2 (en) | Microelectronic connection component | |
CN221928817U (zh) | 一种弹性线路用转接器件 | |
CN109920821B (zh) | 柔性显示装置 | |
CN210469872U (zh) | Pcb板 | |
CN212278269U (zh) | 电路板、显示屏和移动终端 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201117 |