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CN111951669A - 一种显示面板及显示装置 - Google Patents

一种显示面板及显示装置 Download PDF

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Publication number
CN111951669A
CN111951669A CN202010802068.7A CN202010802068A CN111951669A CN 111951669 A CN111951669 A CN 111951669A CN 202010802068 A CN202010802068 A CN 202010802068A CN 111951669 A CN111951669 A CN 111951669A
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virtual
display panel
circuit board
display
flexible circuit
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卢延涛
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to CN202010802068.7A priority Critical patent/CN111951669A/zh
Priority to KR1020217030900A priority patent/KR102554227B1/ko
Priority to JP2021520592A priority patent/JP2022547752A/ja
Priority to PCT/CN2020/110767 priority patent/WO2022032718A1/zh
Priority to EP20885393.7A priority patent/EP4198952A4/en
Publication of CN111951669A publication Critical patent/CN111951669A/zh
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13452Conductors connecting driver circuitry and terminals of panels
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13458Terminal pads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/88Dummy elements, i.e. elements having non-functional features
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50Forming devices by joining two substrates together, e.g. lamination techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/802Applying energy for connecting
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    • HELECTRICITY
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display

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  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

本申请公开了一种显示面板及显示装置,显示面板包括显示基板和柔性电路板,以及芯片,设于显示区一侧的所述显示基板上;绑定焊盘,设于所述显示基板上且位于所述芯片左右至少一侧;虚拟绑定焊盘,设于所述绑定焊盘一侧的所述显示基板上;金手指,设于所述柔性电路板上,且对应地与所述绑定焊盘的表面相接;虚拟金手指,设于所述金手指一侧的所述柔性电路板上,且对应地与所述虚拟绑定焊盘的表面相接。在绑定焊盘的一侧增加虚拟绑定焊盘,柔性电路板与其对应的位置也增加一些虚拟金手指,虚拟绑定焊盘的表面和虚拟金手指的表面一一对应相接触,能够提高柔性电路板与显示面板的接触面积,从而增加柔性电路板的拉拔力。

Description

一种显示面板及显示装置
技术领域
本申请涉及显示面板领域,尤其地涉及一种显示面板及显示装置。
背景技术
由于目前显示屏屏占比不断提高,所以需要显示器的下边框越来越小。请参阅图1,图1所示为现有技术中提供的显示面板的结构示意图,显示面板100包括显示基板10、显示区20、扇出区30、芯片40、绑定焊盘50、金手指70、柔性电路板60,芯片40设于显示区20一侧的显示基板10上,绑定焊盘50设于显示基板10上且位于芯片40左右两侧,金手指70设于柔性电路板60上,且对应地与绑定焊盘50的表面相接。由于绑定焊盘在芯片两侧的数量较少,导致柔性电路板整体与显示基板的接触面积小,可能导致在拉拔柔性电路板时可能将柔性电路板拉拔掉。
因此,确有必要来开发一种新型的显示面板,以克服现有技术的缺陷。
发明内容
本发明的一个目的是提供一种显示面板,其能够解决现有技术中柔性电路板与显示基板的接触面积小的问题。
为实现上述目的,本发明提供一种显示面板,包括显示基板和柔性电路板,以及芯片,设于显示区一侧的所述显示基板上;绑定焊盘,设于所述显示基板上且位于所述芯片左右至少一侧;虚拟绑定焊盘,设于所述绑定焊盘一侧的所述显示基板上;金手指,设于所述柔性电路板上,且对应地与所述绑定焊盘的表面相接;虚拟金手指,设于所述金手指一侧的所述柔性电路板上,且对应地与所述虚拟绑定焊盘的表面相接。
在绑定焊盘的一侧增加虚拟绑定焊盘,柔性电路板与其对应的位置也增加一些虚拟金手指,虚拟绑定焊盘的表面和虚拟金手指的表面一一对应地相接触,能够提高所述柔性电路板与显示面板的接触面积,从而增加柔性电路板的拉拔力。
进一步的,在其他实施方式中,其中所述绑定焊盘与所述芯片之间设置有引线,所述绑定焊盘通过所述引线连接于所述芯片。
进一步的,在其他实施方式中,其中所述虚拟绑定焊盘与所述芯片之间不设置引线。因为设置所述虚拟绑定焊盘是为了增加所述柔性电路板与显示面板的接触面积,所以所述虚拟绑定焊盘并不需要发挥电性作用。
进一步的,在其他实施方式中,其中还包括扇出区,所述扇出区包括阴极引线,连接所述芯片和所述显示区内的各列像素;阳极引线,连接所述芯片与所述显示区内的各行像素。在其他实施方式中,所述阴极引线和所述阳极引线的位置也可以互换,即所述阳极引线一端连接到所述芯片,另一端分别连接到所述显示区内的各列像素;所述阴极引线一端连接到所述芯片,另一端分别连接到所述显示区内的各行像素。
进一步的,在其他实施方式中,其中还包括导电胶膜,所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。在其他实施方式中,所述导电胶膜中还包括导电金球,所述绑定焊盘与所述金手指通过所述导电金球电性连接。
进一步的,在其他实施方式中,其中所述虚拟绑定焊盘与所述虚拟金手指之间也设置有导电胶膜,但不设置所述导电金球,所述虚拟绑定焊盘与所述虚拟金手指之间不需要电性连接,只需对应地黏贴增加所述柔性电路板与显示面板的接触面积即可。
进一步的,在其他实施方式中,其中所述金手指的数量与所述绑定焊盘的数量相同,所述绑定焊盘的数量为两个以上,多个所述绑定焊盘之间相互隔绝,多个所述金手指之间相互隔绝。
两个相邻所述绑定焊盘之间的距离优选为0.4mm,两个相邻所述金手指之间的距离优选为0.4mm。
进一步的,在其他实施方式中,其中所述绑定焊盘为矩形。
进一步的,在其他实施方式中,其中所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
进一步的,在其他实施方式中,其中所述绑定焊盘的形状可以为椭圆型、多边形,在此不做限定。
所述绑定焊盘和所述虚拟绑定焊盘的大小相同,宽度优选为4mm,长度优选为9mm。
进一步的,在其他实施方式中,其中所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同,所述虚拟绑定焊盘的数量为两个以上,多个所述虚拟绑定焊盘之间相互隔绝,多个所述虚拟金手指之间相互隔绝。
进一步的,在其他实施方式中,其中所述柔性电路板呈Y型。
进一步的,在其他实施方式中,其中所述柔性电路板包括主体和连接端,所述金手指和所述虚拟金手指均设于所述连接端。
为了实现上述目的,本发明还提供一种显示装置,包括本发明涉及的所述显示面板。
相对于现有技术,本发明的有益效果在于:本发明提供一种显示面板及显示装置,在绑定焊盘的一侧增加虚拟绑定焊盘,柔性电路板与其对应的位置也增加一些虚拟金手指,虚拟绑定焊盘的表面和虚拟金手指的表面一一对应相接触,能够提高柔性电路板与显示面板的接触面积,从而增加柔性电路板的拉拔力。
附图说明
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。
图1为现有技术中提供的显示面板的结构示意图;
图2为本发明实施例提供的显示面板的结构示意图;
图3为本发明实施例提供的显示基板结构示意图;
图4为本发明实施例提供的柔性电路板结构示意图。
背景技术中的附图说明:
显示面板-100; 显示基板-10;
显示区-20; 扇出区-30;
芯片-40; 绑定焊盘-50;
柔性电路板-60; 金手指-70。
具体实施方式中的附图说明:
显示面板-100; 显示基板-10;
显示区-20; 扇出区-30;
芯片-40; 绑定焊盘-50;
柔性电路板-60; 金手指-70;
虚拟焊盘-51; 虚拟金手指-71;
引线-80; 柔性电路板主体-61;
连接端-62。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图2,图2为本发明实施例提供的显示面板的结构示意图,显示面板100,包括显示基板10和柔性电路板60,显示基板10包括显示区20、扇出区30、芯片40、绑定焊盘50、虚拟绑定焊盘51。
请参阅图3,图3为本发明实施例提供的显示基板结构示意图,芯片40设于显示区20一侧的显示基板10上,绑定焊盘50设于显示基板10上且位于芯片40左右两侧;虚拟绑定焊盘51设于绑定焊盘50一侧的显示基板10上。
在本实施例中,绑定焊盘50为矩形,绑定焊盘50的排列方向垂直绑定焊盘的长度方向;虚拟绑定焊盘51为矩形,虚拟绑定焊盘51的排列方向垂直绑定焊盘的长度方向。
在其他实施方式中,绑定焊盘50和虚拟绑定焊盘51的形状可以为椭圆型、多边形,在此不做限定。
在本实施例中,绑定焊盘50和虚拟绑定焊盘51的大小相同,宽度优选为4mm,长度优选为9mm,从而相较于现有技术中宽度和长度均为6mm的绑定焊盘,绑定焊盘50的宽度减小并且载流面积不变。
在本实施例中,金手指70和虚拟虚拟金手指71的大小相同,宽度优选为4mm,长度优选为9mm。
扇出区50包括阴极引线和阳极引线,其中阴极引线的一端连接芯片40,另一端分别连接显示区20内的各列像素;阳极引线一端连接芯片40,另一端分别连接显示区20内的各行像素。
在其他实施方式中,阴极引线和阳极引线的位置也可以互换,即阳极引线一端连接到芯片40,另一端分别连接到显示区20内的各列像素;阴极引线一端连接到芯片40,另一端分别连接到显示区20内的各行像素。
请参阅图4,图4为本发明实施例提供的柔性电路板结构示意图。柔性电路板60呈Y型,柔性电路板60包括主体61和连接端62,金手指70和虚拟金手指71均设于连接端62。
金手指70对应地与绑定焊盘的表面相接;虚拟金手指71设于金手指70一侧的柔性电路板60上,且对应地与虚拟绑定焊盘51的表面相接。
在绑定焊盘50的一侧增加虚拟绑定焊盘51,柔性电路板60与其对应的位置也增加一些虚拟金手指71,虚拟绑定焊盘51的表面和虚拟金手指71的表面一一对应地相接触,能够提高柔性电路板60与显示面板100的接触面积,从而增加柔性电路板60的拉拔力。
其中,绑定焊盘与芯片40之间设置有引线80,绑定焊盘通过引线80连接于芯片40。
虚拟绑定焊盘51与芯片40之间不设置引线,因为设置虚拟绑定焊盘51是为了增加柔性电路板60与显示面板100的接触面积,所以虚拟绑定焊盘51并不需要发挥电性作用。
绑定焊盘50与金手指70之间还设置有导电胶膜,绑定焊盘50与金手指70通过导电胶膜压合连接。在其他实施方式中,导电胶膜中还包括导电金球,绑定焊盘50与金手指70通过导电金球电性连接。
虚拟绑定焊盘51与虚拟金手指71之间也设置有导电胶膜,但不设置导电金球,虚拟绑定焊盘51与虚拟金手指71之间不需要电性连接,只需对应地黏贴,能够增加柔性电路板60与显示面板100的接触面积即可。
金手指70的数量与绑定焊盘50的数量相同,绑定焊盘50的数量为两个以上,多个绑定焊盘50之间相互隔绝,多个金手指70之间相互隔绝。两个相邻绑定焊盘50之间的距离优选为0.4mm,两个相邻金手指70之间的距离优选为0.4mm。
虚拟金手指71的数量与虚拟绑定焊盘51的数量相同,虚拟绑定焊盘51的数量为两个以上,多个虚拟绑定焊盘51之间相互隔绝,多个虚拟金手指71之间相互隔绝。两个相邻虚拟绑定焊盘51之间的距离优选为0.4mm,两个相邻虚拟金手指71之间的距离优选为0.4mm。
为了实现上述目的,本发明还提供一种显示装置,包括本发明涉及的显示面板100。
本发明的有益效果在于:本发明提供一种显示面板及显示装置,在绑定焊盘50的一侧增加虚拟绑定焊盘51,柔性电路板60与其对应的位置也增加一些虚拟金手指71,虚拟绑定焊盘51的表面和虚拟金手指71的表面一一对应相接触,能够提高柔性电路板60与显示面板100的接触面积,从而增加柔性电路板60的拉拔力。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板及屏显示装置进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (10)

1.一种显示面板,其特征在于,包括显示基板和柔性电路板,以及
芯片,设于显示区一侧的所述显示基板上;
绑定焊盘,设于所述显示基板上且位于所述芯片左右至少一侧;
虚拟绑定焊盘,设于所述绑定焊盘一侧的所述显示基板上;
金手指,设于所述柔性电路板上,且对应地与所述绑定焊盘的表面相接;
虚拟金手指,设于所述金手指一侧的所述柔性电路板上,且对应地与所述虚拟绑定焊盘的表面相接。
2.根据权利要求1所述的显示面板,其特征在于,所述绑定焊盘与所述芯片之间设置有引线,所述绑定焊盘通过所述引线连接于所述芯片。
3.根据权利要求1所述的显示面板,其特征在于,所述虚拟绑定焊盘与所述芯片之间不设置引线。
4.根据权利要求1所述的显示面板,其特征在于,还包括
阴极引线,连接所述芯片和所述显示区内的各列像素;
阳极引线,连接所述芯片与所述显示区内的各行像素。
5.根据权利要求1所述的显示面板,其特征在于,还包括
导电胶膜,所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。
6.根据权利要求1所述的显示面板,其特征在于,所述金手指的数量与所述绑定焊盘的数量相同,所述绑定焊盘的数量为两个以上,多个所述绑定焊盘之间相互隔绝,多个所述金手指之间相互隔绝。
7.根据权利要求1所述的显示面板,其特征在于,所述绑定焊盘为矩形。
8.根据权利要求1所述的显示面板,其特征在于,所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
9.根据权利要1所述的显示面板,其特征在于,所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同,所述虚拟绑定焊盘的数量为两个以上,多个所述虚拟绑定焊盘之间相互隔绝,多个所述虚拟金手指之间相互隔绝。
10.一种显示装置,其特征在于,包括权利要求1-9任一项所述的显示面板。
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Application publication date: 20201117