CN111948854A - Ultra-thin straight following formula backlight unit based on chip level light emitting area - Google Patents

Abstract

The invention discloses an ultra-thin direct-lit backlight module based on a chip-level light-emitting surface, comprising a PCB board, a silk screen, a light source body, a column foot, an optical lens, a secondary lens, and a grid board. The light source body, the top of the PCB board is installed with silk screen on both sides of the light source body, the top of the PCB board is installed with several pillars, the tops of several pillars are connected to the grid board, and the grid board is installed inside the secondary lens At the bottom of the cavity, the grid plate is in the shape of a ring, and several column feet are distributed in a circular array with the center of the grid plate. An optical lens is installed at the center of the grid plate. The optical lens is a hollow structure like a semi-ellipsoid. The lens is located in the inner cavity of the secondary lens; the ultra-thin direct-lit backlight module breaks the shortcomings of the traditional reflective lens with low light efficiency, effectively improves the utilization rate of the light source, and improves the light efficiency. The brightness can be increased by more than 20%, and it can save energy.

Description

An ultra-thin direct-lit backlight module based on a chip-level light-emitting surface

technical field

The invention relates to the field of backlight modules, in particular to an ultra-thin direct-type backlight module based on a chip-level light-emitting surface.

Background technique

The backlight module is one of the key components of the LCD panel. Its function is to supply sufficient brightness and a uniformly distributed light source so that it can display images normally. The backlight is a light source located behind the LCD display. Its luminous effect will It directly affects the visual effect of the liquid crystal display module.

The backlight module is divided into an edge-type backlight module and a direct-type backlight module according to the different incident positions of the light source. The direct-type backlight module is to set the light-emitting light source or light-emitting diode behind the liquid crystal panel to directly form a surface light source and provide it to the liquid crystal panel. In the side-illuminated backlight module, the backlight LED light bar is arranged on the edge of the back panel at the back of the liquid crystal panel. The light emitted by the LED light bar enters the light guide plate from the light incident surface on the side of the light guide plate. It is emitted from the light-emitting surface of the light guide plate, and then passes through the optical film group to form a surface light source and provide it to the liquid crystal panel.

However, the reflective lens of the existing direct type backlight module has low light efficiency, which affects the utilization rate of the light source. Therefore, in order to cope with the high definition, high contrast, high image quality, ultra-thin design and high quality of LCD TVs To meet the requirements of brightness, the present invention designs a new type of light source with a refracting secondary lens, which breaks the shortcomings of the traditional reflective lens with low light efficiency, effectively improves the utilization rate of the light source, and improves the light efficiency. It is an ultra-thin direct-type backlight module based on a chip-level light-emitting surface that can increase the brightness of the machine by more than 20%, and can save energy to a certain extent.

SUMMARY OF THE INVENTION

In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide an ultra-thin direct-lit backlight module based on a chip-level light-emitting surface: by installing the LED light-emitting body at the inner cavity axis of the LED bracket, the LED light-emitting body, White glue with high thermal conductivity and high reflectivity is filled between the LED brackets. The top heights of the white glue, LED illuminator and LED bracket are all the same. By setting the chip to blue, the phosphor to yellow, and the silk screen to yellow, By installing the grid plate at the bottom of the inner cavity of the secondary lens, the problem that the reflective lens of the existing direct type backlight module has low light efficiency and affects the utilization rate of the light source is solved.

The object of the present invention can be realized through the following technical solutions:

An ultra-thin direct-type backlight module based on a chip-level light-emitting surface, comprising a PCB board, a silk screen, a light source body, a column foot, an optical lens, a secondary lens, and a grid plate, and a light source body is installed in the middle position of the top of the PCB board. , the top of the PCB board is installed with silk screen on both sides of the light source body, the top of the PCB board is installed with a number of pillars, the top of the several pillars are connected to the grid board, the grid board is installed At the bottom of the inner cavity of the secondary lens, the grid plate is in the shape of a ring, and a number of the column feet are distributed in a circular array with the center of the grid plate, and an optical lens is installed at the center of the grid plate. The optical lens is a semi-ellipsoid-like hollow structure, and the optical lens is located in the inner cavity of the secondary lens.

As a further solution of the present invention, the optical lens is located directly above the light source body, and the bottom area of the optical lens is larger than the top area of the light source body.

As a further solution of the present invention: the light source body includes white glue, an LED illuminator, and an LED bracket, an LED illuminator is installed in the inner cavity of the LED bracket, and the LED illuminator is located at the axis of the LED bracket, so White glue is filled between the LED light-emitting body and the LED bracket, and the top heights of the white glue, the LED light-emitting body and the LED bracket are all the same.

As a further solution of the present invention: the LED luminous body includes a chip, phosphor powder, and chip fixing glue, the top of the chip is provided with phosphor powder, and the bottom of the chip is connected to the bottom of the inner cavity of the LED bracket through the chip fixing glue.

As a further solution of the present invention: a working principle of an ultra-thin direct-lit backlight module based on a chip-level light-emitting surface is as follows:

Principle 1: By installing the LED illuminant at the inner cavity axis of the LED bracket, white glue with high thermal conductivity and high reflectivity is filled between the LED illuminator and the LED bracket. The height of the top is the same, which ensures that the light-emitting surface of the LED light source will not be affected by the white glue and the LED bracket, so that the actual light-emitting surface of the light source is the size of the chip, which breaks the traditional backlight light source The light-emitting surface of the light source is controlled by the bracket cup The influence of the port, and the driving current of the light bar module is controlled by the heat dissipation capacity of the bracket;

Principle 2: Set the chip as blue, set the phosphor as yellow, and set the silk screen as yellow. Therefore, the LED white light source is the mixed white light obtained after the blue chip excites the yellow phosphor. The wavelengths of light of different colors are different and pass through the same medium. The refractive index will also be different, which will cause the difference in the refractive index of white light after passing through the lens, resulting in the separation of yellow light and blue light. Through the yellow silk screen on the PCB board, some blue light on the lamp can be absorbed, reducing the intensity of blue light on the lamp, Color unevenness can be alleviated, thereby improving the quality of the backlight, thereby solving the phenomenon of color separation, which is based on the principle that the same color surface only reflects the same color light;

Principle 3: Install the grid plate at the bottom of the inner cavity of the secondary lens. When the light released by the light source body passes through the optical lens, some of the light is refracted and directly exits, and some of the light greater than the critical angle will be totally reflected and reflected to the grid. On the grid plate, through the special grid design, the light can be refracted regularly and mixed evenly, so that the effect of the backlight module is more uniform.

Beneficial effects of the present invention:

According to the ultra-thin direct-lit backlight module based on the chip-level light-emitting surface of the present invention, by installing the LED light-emitting body at the inner cavity axis of the LED support, the LED light-emitting body and the LED support are filled with high thermal conductivity and high thermal conductivity. The reflectivity of the white glue, the top height of the white glue, the LED illuminator and the LED bracket are all the same, which ensures that the light-emitting surface of the LED illuminator will not be affected by the white glue and the LED bracket, so that the actual emitting surface of the light source is the size of the chip. , which breaks the influence of the traditional backlight strip light source whose luminous surface is controlled by the cup mouth of the bracket, and the driving current of the light strip module is controlled by the heat dissipation capacity of the bracket; by setting the chip as blue, the phosphor as yellow, and the silk screen as Therefore, the LED white light source is the mixed white light obtained after the blue chip excites the yellow phosphor. The wavelength bands of the light of different colors are different, and the refractive index of the light passing through the same medium will also be different, which will cause the white light to pass through the lens. The reason for the different refractive index The problem of separation of yellow light and blue light is caused. Through the yellow silk screen on the PCB board, some blue light on the lamp can be absorbed, the intensity of blue light on the lamp can be reduced, and the uneven color can be alleviated, thereby improving the quality of the backlight and solving the color separation. This is based on the principle that the same color surface only reflects the same color light; by installing the grid plate at the bottom of the inner cavity of the secondary lens, when the light released by the light source body passes through the optical lens, part of the light is refracted Directly out, some light greater than the critical angle will be totally reflected and reflected on the grid plate. Through the special grid design, the light can be refracted regularly and mixed evenly, so that the effect of the backlight module is more uniform; The ultra-thin direct-lit backlight module breaks the shortcomings of the traditional reflective lens with low light efficiency, effectively improves the utilization rate of the light source, and improves the light efficiency. .

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings.

1 is a schematic structural diagram of an ultra-thin direct-lit backlight module based on a chip-level light-emitting surface in the present invention;

Fig. 2 is the structural representation of the secondary lens in the present invention;

Fig. 3 is the connection view of column foot, optical lens, secondary lens, grid plate in the present invention;

Fig. 4 is the top view of the light source body in the present invention;

5 is a cross-sectional view of a light source body in the present invention.

In the figure: 101, PCB board; 102, silk screen; 103, light source body; 104, column foot; 105, optical lens; 106, secondary lens; 107, grid plate; 1031, white glue; 1032, LED illuminant; 1033, LED bracket; 1034, chip; 1035, phosphor; 1036, chip fixing glue.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1:

1-5, this embodiment is an ultra-thin direct-lit backlight module based on a chip-level light-emitting surface, including a PCB board 101, a silk screen 102, a light source body 103, a column foot 104, an optical lens 105, two The secondary lens 106, the grid plate 107, the light source body 103 is installed in the middle position of the top of the PCB board 101, the silk screen 102 is installed on both sides of the light source body 103 on the top of the PCB board 101, and the top of the PCB board 101 is installed with several There are several column feet 104, the tops of the plurality of column feet 104 are connected to the grid plate 107, the grid plate 107 is installed at the bottom of the inner cavity of the secondary lens 106, and the grid plate 107 is annular , a number of the column feet 104 are distributed in a circular array with the center of the grid plate 107, and an optical lens 105 is installed at the center of the grid plate 107, and the optical lens 105 is a semi-ellipsoid-like hollow structure, The optical lens 105 is located in the inner cavity of the secondary lens 106 .

The optical lens 105 is located directly above the light source body 103 , and the bottom area of the optical lens 105 is larger than the top area of the light source body 103 .

The light source body 103 includes a white glue 1031, an LED light-emitting body 1032, and an LED bracket 1033. The LED light-emitting body 1032 is installed in the inner cavity of the LED bracket 1033, and the LED light-emitting body 1032 is located at the axis of the LED bracket 1033. White glue 1031 is filled between the LED light-emitting body 1032 and the LED bracket 1033 , and the top heights of the white glue 1031 , the LED light-emitting body 1032 and the LED bracket 1033 are all the same.

The LED illuminator 1032 includes a chip 1034, a phosphor 1035, and a chip fixing glue 1036. The top of the chip 1034 is provided with a phosphor 1035, and the bottom of the chip 1034 is connected to the inner cavity of the LED bracket 1033 through the chip fixing glue 1036. bottom.

The material of the white glue 1031 is ceramic powder, which has the characteristics of high thermal conductivity and high reflectivity.

Referring to Figures 1-5, the working principle of an ultra-thin direct-lit backlight module based on a chip-level light-emitting surface in this embodiment is as follows:

Principle 1: By installing the LED illuminator 1032 at the inner cavity axis of the LED bracket 1033, the white glue 1031 with high thermal conductivity and high reflectivity is filled between the LED illuminator 1032 and the LED bracket 1033, white glue 1031, LED The top heights of the illuminant 1032 and the LED bracket 1033 are the same, which ensures that the light-emitting surface of the LED illuminator 1032 will not be affected by the white glue 1031 and the LED bracket 1033, so that the actual luminous surface of the light source is the size of the chip 1034, which breaks the traditional The light-emitting surface of the backlight light source is controlled by the cup opening of the bracket, and the driving current of the light bar module is controlled by the heat dissipation capacity of the bracket;

Principle 2: Set the chip 1034 to be blue, the phosphor 1035 to be yellow, and the silk screen 102 to be yellow. Therefore, the LED white light source is the mixed white light obtained after the blue chip 1034 excites the yellow phosphor 1035, and the wavelengths of light of different colors are different. , through the same medium, the refractive index will also be different, which will cause the problem of separation of yellow light and blue light due to the different refractive index of white light after passing through the lens. Through the yellow silk screen 102 on the PCB board 101, some blue light on the lamp can be absorbed, Reduce the intensity of blue light on the lamp, the uneven color can be alleviated, thereby improving the quality of the backlight, thereby solving the phenomenon of color separation, which is based on the principle that the same color surface only reflects the same color light;

Principle 3: The grid plate 107 is installed at the bottom of the inner cavity of the secondary lens 106. When the light released by the light source body 103 passes through the optical lens 105, a part of the light is directly refracted, and a part of the light greater than the critical angle will be totally reflected , reflected on the grid plate 107, through the special grid design, the light can be refracted regularly and mixed evenly, so that the effect of the backlight module is more uniform.

In the description of this specification, description with reference to the terms "one embodiment," "example," "specific example," etc. means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one aspect of the present invention. in one embodiment or example. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above contents are only examples and descriptions of the present invention, and those skilled in the art can make various modifications or supplements to the described specific embodiments or replace them in similar ways, as long as they do not deviate from the invention or exceed the present rights The scope defined by the claims shall all belong to the protection scope of the present invention.

Claims (4)

1. The ultra-thin direct type backlight module based on the chip level light emitting surface is characterized by comprising a PCB (101), a silk screen (102), a light source body (103), column feet (104), an optical lens (105), a secondary lens (106) and a grid plate (107), wherein the light source body (103) is installed at the middle position of the top of the PCB (101), the silk screen (102) is installed at the two sides of the light source body (103) at the top of the PCB (101), the column feet (104) are installed at the top of the PCB (101), the top ends of the column feet (104) are connected to the grid plate (107), the grid plate (107) is installed at the bottom of an inner cavity of the secondary lens (106), the grid plate (107) is annular, the column feet (104) are distributed in a circular array mode by the circle center of the grid plate (107), the optical lens (105) is installed at the circle center of the grid plate (107), the optical lens (105) is of a semi-ellipsoidal-like hollow structure, and the optical lens (105) is located in an inner cavity of the secondary lens (106).

2. The ultra-thin direct type backlight module based on the chip scale light emitting surface of claim 1, wherein the optical lens (105) is located right above the light source body (103), and the bottom area of the optical lens (105) is larger than the top area of the light source body (103).

3. The ultra-thin direct type backlight module based on the chip level light emitting surface of claim 1, wherein the light source body (103) comprises white glue (1031), an LED light emitting body (1032) and an LED bracket (1033), the LED light emitting body (1032) is installed in an inner cavity of the LED bracket (1033), the LED light emitting body (1032) is located at an axis of the LED bracket (1033), the white glue (1031) is filled between the LED light emitting body (1032) and the LED bracket (1033), and top heights of the white glue (1031), the LED light emitting body (1032) and the LED bracket (1033) are the same.

4. The ultra-thin direct type backlight module based on the chip level luminous surface as claimed in claim 3, wherein the LED luminous body (1032) comprises a chip (1034), a phosphor (1035) and a chip fixing adhesive (1036), the phosphor (1035) is disposed on the top of the chip (1034), and the bottom of the chip (1034) is connected to the bottom of the inner cavity of the LED bracket (1033) through the chip fixing adhesive (1036).

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