CN111940743B - Preparation method of tungsten and copper solderless seamless connection combined part - Google Patents
Preparation method of tungsten and copper solderless seamless connection combined part Download PDFInfo
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- CN111940743B CN111940743B CN202010809670.3A CN202010809670A CN111940743B CN 111940743 B CN111940743 B CN 111940743B CN 202010809670 A CN202010809670 A CN 202010809670A CN 111940743 B CN111940743 B CN 111940743B
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- tungsten
- copper
- sintering furnace
- piece
- solderless
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 claims abstract description 66
- 239000010949 copper Substances 0.000 claims abstract description 66
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 56
- 239000010937 tungsten Substances 0.000 claims abstract description 56
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 55
- 238000005245 sintering Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005219 brazing Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Arc Welding In General (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to a method for preparing a tungsten and copper solderless seamless connection combination part, which comprises the following steps: step A, placing a tungsten piece in a positioning groove; b, pouring a copper material into the sleeve, wherein the copper material completely covers the tungsten piece; step C, placing the die with the tungsten piece and the copper material in a sintering furnace, and carrying out heating-heat preservation-cooling operation on the sintering furnace; and D, taking the die out of the sintering furnace after cooling, and taking the combined tungsten and copper combination piece out of the die. The invention has good tungsten and copper combination effect, completely realizes seamless connection, and the combined product has better conductivity.
Description
Technical Field
The invention belongs to the technical field of tungsten-containing part manufacturing, and particularly relates to a method for preparing a tungsten and copper solderless seamless connection combined piece.
Background
The tungsten-copper combined part is a product combining tungsten and copper, has the high temperature resistance of tungsten and the excellent conductive performance of copper, and is widely applied to the fields of resistance welding, spraying and the like.
Because the difference between the melting points of tungsten and copper is very large, and the melting point of tungsten is 3410 degrees, the manufacturing method of the tungsten-copper joint is generally a brazing method and a hot pressing method.
The brazing method is a welding method in which brazing filler metal lower than the melting point of a weldment and the weldment are heated to the melting temperature of the brazing filler metal at the same time, and then the liquid brazing filler metal is used for filling gaps of solid workpieces to connect the metals. Brazing in turn includes gas-shielded brazing and vacuum furnace brazing.
After the surfaces to be connected of the tungsten rod and the copper rod are subjected to grinding, polishing, ultrasonic cleaning and the like by a hot pressing method, the connection surfaces are butted, and the tungsten rod and the copper rod are subjected to heat preservation for a certain time at high temperature and in a protective atmosphere after being pressed and fixed, so that connection is realized. For example, application numbers published on 11, 28/2017 are: 2017105003937.4, title of invention: a patent of a high strength direct welding process of metallic tungsten and copper, the patent comprising: carrying out pretreatment such as grinding, polishing, ultrasonic cleaning and the like on the surfaces to be connected of the tungsten rod and the copper rod; and butt jointing the axial degrees of the to-be-connected surfaces of the tungsten rod and the copper rod after pretreatment, pressurizing and fixing, and then annealing at the annealing temperature of 970-1000 ℃ and the heat preservation time of 2.5-3.5 h in the argon protective atmosphere, so that the diffusion between the tungsten and the copper and the metallurgical bonding on the interface are realized.
The brazing method has the following defects: the connection strength is low; due to the introduction of third-party elements, the filling of welding seams has great influence on the quality of products; the product quality is difficult to control; the opposite joint surface is inconvenient to weld.
The hot pressing method has the following defects: only fit for regular planar connections; the requirements on the cleanliness and the surface quality of the bonding raw materials are high.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the invention overcomes the defects of the prior art and provides a preparation method of a tungsten and copper solderless seamless connection binder.
The technical scheme adopted by the invention for solving the problems in the prior art is as follows:
a method for preparing a tungsten and copper solderless seamless connection combining piece comprises a die, wherein the die is formed by connecting a base and a sleeve above the base. The base top surface indent have the constant head tank, the constant head tank is located the sheathed tube inside.
The preparation method of the tungsten and copper solderless seamless connection bonding part comprises the following steps:
step A, placing a tungsten piece in a positioning groove;
b, pouring a copper material into the sleeve, wherein the copper material completely covers the tungsten piece;
step C, placing the die with the tungsten piece and the copper material in a sintering furnace, and carrying out heating-heat preservation-cooling operation on the sintering furnace;
and D, taking the die out of the sintering furnace after cooling, and taking the combined tungsten and copper out of the die.
Preferably, the top surface of the base is provided with a supporting surface in an upward protruding manner, the positioning groove is concavely arranged on the supporting surface, and the lower end of the sleeve is sleeved outside the supporting surface.
Preferably, the sleeve is in interference fit or over-fit with the supporting surface.
Preferably, the mold is made of graphite.
Preferably, copper powder or blocky or flaky red copper can be used as the copper material.
Preferably, when copper powder is adopted as the copper material, the particle size of the copper powder is less than 6 microns.
Preferably, when the copper material is blocky or flaky red copper, the blocky or flaky red copper needs to be cleaned.
Preferably, in the step C, before the temperature of the sintering furnace is raised, air in the sintering furnace is pumped out and hydrogen is injected, the temperature of the sintering furnace is raised to be higher than 1185 ℃, after the temperature is raised to be a preset temperature, the temperature is kept for 2.5 to 3.5 hours, and after the temperature is kept, nitrogen is introduced into the sintering furnace for cooling.
Preferably, in the step C, the temperature of the sintering furnace is increased to 1200-1300 ℃.
Compared with the prior art, the invention has the following beneficial effects:
(1) no third party element is introduced, and the product performance is stable.
(2) The tungsten piece and the copper are good in combination effect, and seamless connection is achieved.
(3) The structural shape of the tungsten piece is not limited, and the tungsten piece and the copper in any shape can be combined.
(4) In the sintering and heating process, the hydrogen can reduce the oxides in the tungsten and copper raw materials, so that the product combined with the tungsten and the copper has better conductivity.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic view of the preparation of a tungsten and copper solderless seamless joint of the present invention.
In the figure: 1-mould, 1 a-base, 1a 1-positioning groove, 1a 2-supporting surface, 1 b-sleeve, 2-tungsten piece and 3-copper material.
Detailed Description
The attached drawings are preferred embodiments of the method for preparing the tungsten and copper solderless seamless connection combination piece, and the invention is further described in detail with reference to the attached drawings.
A method for preparing a tungsten and copper solderless seamless connection combination part comprises a die 1. As shown in the attached drawing 1, the mold 1 is formed by connecting a base 1a and a sleeve 1b above the base 1a, and the mold 1 is made of graphite. Because graphite has good thermal conductivity and high temperature resistance, the graphite has small thermal expansion coefficient and certain strain resistance to rapid heating and rapid cooling in the high-temperature use process.
The top surface of the base 1a is provided with a supporting surface 1a2 protruding upwards, the top surface of the supporting surface 1a2 is provided with a positioning slot 1a1 inwards, and the lower end of the sleeve 1b is sleeved outside the supporting surface 1a 2. The sleeve 1b is in interference fit or over-fit with the supporting surface 1a2, so that molten copper liquid is prevented from flowing out of the die 1 through a gap between the sleeve 1b and the base 1a during sintering and over-filling.
The preparation method of the tungsten and copper solderless seamless connection combination piece comprises the following steps:
step A, placing the tungsten piece 2 in the positioning groove 1a 1.
The tungsten piece 2 can adopt a tungsten rod and can also adopt other special-shaped structures. The portion of the tungsten piece 2 that needs to be bonded with copper leaks outside the positioning groove 1a 1.
And step B, pouring the copper material 3 into the sleeve 1B, wherein the tungsten piece 2 is completely covered by the copper material 3.
Copper powder or blocky or flaky red copper can be used as the copper material 3. When the copper material 3 is copper powder, the granularity of the copper powder is less than 6 microns. When the copper material 3 is blocky or flaky red copper, the blocky or flaky red copper needs to be cleaned. The cleaning mode of the blocky or flaky red copper can adopt ultrasonic cleaning, namely ultrasonic cleaning is carried out in absolute ethyl alcohol for 15-20 min, and the red copper is used after being dried. Since the copper powder has a certain loose ratio and gaps exist among the blocky or flaky red copper, the copper material 3 not only completely covers the tungsten piece 2, but also is higher than the tungsten piece 2 by a certain distance.
And step C, putting the die 1 with the tungsten piece 2 and the copper material 3 in the sintering furnace, and performing heating-heat preservation-cooling operation on the sintering furnace.
Before the temperature of the sintering furnace is raised, the air of the sintering furnace is pumped out and hydrogen is injected, so that the copper or tungsten is prevented from being oxidized in the sintering process, and meanwhile, the hydrogen is beneficial to reducing oxidation impurities in the tungsten and copper raw materials in the sintering process.
The temperature of the sintering furnace is higher than 1185 ℃, and in the embodiment, the temperature of the sintering furnace is 1200-1300 ℃. And (4) after the temperature rises to the preset temperature, preserving the heat for 2.5-3.5 h, and introducing nitrogen into the sintering furnace after the heat preservation is finished to perform the cooling operation.
And D, taking the die 1 out of the sintering furnace after cooling, and taking the combined tungsten and copper combination piece out of the die 1.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (3)
1. A method for preparing a tungsten and copper solderless seamless connection binder is characterized in that:
the preparation method of the tungsten and copper solderless seamless connection combination piece comprises a mould (1), wherein the mould (1) is formed by connecting a base (1 a) and a sleeve (1 b) above the base (1 a),
the top surface of the base (1 a) is provided with a supporting surface (1 a 2) which protrudes upwards, the positioning groove (1 a 1) is concavely arranged on the supporting surface (1 a 2),
the lower end of the sleeve (1 b) is sleeved outside the supporting surface (1 a 2), the sleeve (1 b) is in interference fit with the supporting surface (1 a 2), and the positioning groove (1 a 1) is positioned inside the sleeve (1 b);
the preparation method of the tungsten and copper solderless seamless connection combination piece comprises the following steps:
step A, placing a tungsten piece (2) in a positioning groove (1 a 1), wherein the tungsten piece (2) is connected with a mould (1) in an inserting manner;
step B, pouring a copper material (3) into the sleeve (1B), wherein the tungsten piece (2) is completely covered by the copper material (3), and the copper material (3) adopts copper powder, and the granularity of the copper powder is less than 6 microns;
step C, putting the die (1) with the tungsten piece (2) and the copper material (3) in the sintering furnace, heating, preserving heat and cooling the sintering furnace,
extracting air from the sintering furnace and injecting hydrogen before heating the sintering furnace, wherein the temperature of the sintering furnace is higher than 1185 ℃, keeping the temperature for 2.5-3.5 hours after the temperature is raised to a preset temperature, and introducing nitrogen into the sintering furnace after the temperature is kept, so as to perform cooling operation;
and D, taking the die (1) out of the sintering furnace after cooling, and taking the combined tungsten and copper combination piece out of the die (1).
2. The method for preparing the tungsten-copper solderless seamless joint combination as claimed in claim 1, wherein:
the mold (1) is made of graphite.
3. The method for preparing the solderless seamless connection bonding element of tungsten and copper as claimed in claim 1, wherein:
in the step C, the temperature of the sintering furnace is 1200-1300 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010809670.3A CN111940743B (en) | 2020-08-13 | 2020-08-13 | Preparation method of tungsten and copper solderless seamless connection combined part |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010809670.3A CN111940743B (en) | 2020-08-13 | 2020-08-13 | Preparation method of tungsten and copper solderless seamless connection combined part |
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| Publication Number | Publication Date |
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| CN111940743A CN111940743A (en) | 2020-11-17 |
| CN111940743B true CN111940743B (en) | 2022-08-30 |
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| CN115125474B (en) * | 2022-06-29 | 2024-03-22 | 苏州仓立新能源科技有限公司 | High-temperature-resistant plasma electrode in seamless connection and preparation method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB347207A (en) * | 1929-01-17 | 1931-04-16 | Fansteel Prod Co Inc | Improvements in or relating to electrodes for resistance welding and method of making same |
| CN102114529B (en) * | 2009-12-31 | 2012-09-05 | 南京理工大学 | Method for induction heating fusion-cast welding of copper-tungsten mold |
| CN104588620B (en) * | 2014-12-26 | 2017-07-04 | 安泰天龙（天津）钨钼科技有限公司 | A kind of preparation method of tungsten copper module |
| CN107052350B (en) * | 2017-06-16 | 2019-10-11 | 大连理工大学 | A method of connecting tungsten material and copper material |
| CN107398630B (en) * | 2017-06-26 | 2019-11-12 | 天津大学 | High-strength direct bonding process for metal tungsten and copper |
| CN109128194B (en) * | 2018-08-16 | 2020-05-22 | 西安理工大学 | Preparation method of Cu-W bimetal layered material |
| CN110885945B (en) * | 2019-11-20 | 2021-03-23 | 厦门虹鹭钨钼工业有限公司 | Preparation method of tungsten-copper bar with large length-diameter ratio |
| CN111438412A (en) * | 2020-04-16 | 2020-07-24 | 山东威尔斯通钨业有限公司 | Tungsten-copper alloy surface silver spraying technology |
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