CN111908797B - Low-thermal-expansion cordierite-based microcrystalline glass material and preparation method thereof - Google Patents
Low-thermal-expansion cordierite-based microcrystalline glass material and preparation method thereof Download PDFInfo
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Abstract
本发明属于电子陶瓷材料领域,提供一种低热膨胀堇青石基微晶玻璃材料及其制备方法,用于超大规模集成电路封装。本发明微晶玻璃材料按照质量百分比组成为:MgO为15~19wt%、Al2O3为26~30wt%、SiO2为46~50wt%、ZrO2为2~6wt%、B2O3为1~5wt%、K2O为1~3wt%;通过引入K2O作为改性剂,ZrO2作为晶核剂,B2O3作为降烧剂,抑制了一部分(MgAl2Si3O10)0.6相转化为Mg2Al4Si5O18相,从而调节热膨胀系数趋于Si芯片(3.5×10‑6/℃),并且在2.5~3.5×10‑6/℃可调,热稳定性好;同时,抗弯强度可达150~200MPa,杨氏模量可达80~95GPa,介电常数低5~6(@1MHz),介质损耗低0.5~1×10‑3(@1MHz),能够提高信号传输速度,大大降低了功耗;综上,本发明低热膨胀堇青石基微晶玻璃材料适用于超大规模集成电路封装,能够显著减少信号传输延时、降低功耗,与硅芯片良好匹配。
The invention belongs to the field of electronic ceramic materials, and provides a low thermal expansion cordierite-based glass-ceramic material and a preparation method thereof, which are used for ultra-large-scale integrated circuit packaging. The glass-ceramic material of the present invention is composed of: 15-19wt% of MgO, 26-30wt% of Al2O3 , 46-50wt % of SiO2 , 2-6wt % of ZrO2, 2-6wt % of B2O3 1-5wt%, K 2 O is 1-3wt%; by introducing K 2 O as modifier, ZrO 2 as crystal nucleating agent, and B 2 O 3 as calcination reducing agent, a part of (MgAl 2 Si 3 O 10 ) 0.6 phase is transformed into Mg 2 Al 4 Si 5 O 18 phase, thereby adjusting the thermal expansion coefficient to tend to Si chip (3.5×10 ‑6 /℃), and can be adjusted at 2.5~3.5×10 ‑6 /℃, thermal stability Good; at the same time, the flexural strength can reach 150~200MPa, the Young’s modulus can reach 80~95GPa, the dielectric constant is 5~6(@1MHz), and the dielectric loss is 0.5~1×10 ‑3 (@1MHz), It can improve the signal transmission speed and greatly reduce the power consumption. In conclusion, the low thermal expansion cordierite-based glass-ceramic material of the present invention is suitable for VLSI packaging, can significantly reduce signal transmission delay, reduce power consumption, and is compatible with silicon chips. match.
Description
技术领域technical field
本发明属于电子陶瓷材料领域,涉及一种低热膨胀堇青石基微晶玻璃材料及其制备方法;特别适用于超大规模集成电路封装。The invention belongs to the field of electronic ceramic materials, and relates to a low thermal expansion cordierite-based glass-ceramic material and a preparation method thereof; it is particularly suitable for ultra-large-scale integrated circuit packaging.
背景技术Background technique
近年来信息技术的高速发展,推动集成电路的超大规模化和多功能化,寻求性能优异的封装材料成为人们关注的焦点;MgO-Al2O3-SiO2系微晶玻璃,具有热膨胀系数低、介电性能优异等特点,但是存在机械性能差、烧结温度高等难题。In recent years, the rapid development of information technology has promoted the ultra-large scale and multi-functionalization of integrated circuits, and the search for packaging materials with excellent performance has become the focus of attention; MgO-Al 2 O 3 -SiO 2 series glass-ceramics have a low thermal expansion coefficient. , excellent dielectric properties and other characteristics, but there are problems such as poor mechanical properties and high sintering temperature.
例如,Journal of Non-Crystalline Solids,2015,419:16-26报道,K2O对镁铝硅系微晶玻璃性能的影响,该微晶玻璃组分按质量百分比如下:MgO为21.60mol%、Al2O3为21.61m ol%、SiO2为54.00mol%、K2O为2.79mol%;混料于1550℃熔融保温6h,用PVA造粒成型并在925℃下烧结6h,得到的综合性能最优;其抗弯强度为145MPa,热膨胀系数为5.63×10-6/℃,介电常数为7.51(@10MHz),介质损耗为14×10-3(@10MHz),不足之处是抗弯强度偏低,热膨胀系数和介电损耗偏高。For example, Journal of Non-Crystalline Solids, 2015, 419: 16-26 reported the effect of K 2 O on the properties of magnesium-aluminum-silicon-based glass-ceramics. Al 2 O 3 is 21.61 mol%, SiO 2 is 54.00 mol%, and K 2 O is 2.79 mol%; the mixture is melted and kept at 1550℃ for 6h, granulated with PVA and sintered at 925℃ for 6h. It has the best performance; its flexural strength is 145MPa, its thermal expansion coefficient is 5.63×10 -6 /℃, its dielectric constant is 7.51 (@10MHz), and its dielectric loss is 14×10 -3 (@10MHz). The bending strength is low, and the thermal expansion coefficient and dielectric loss are high.
针对上述问题,本发明的发明人在申请号201810507515.9的发明专利中公开了“一种堇青石基微晶玻璃材料及其制备方法”,该微晶玻璃组分按质量百分比如下:MgO为10~20wt%、Al2O3为25~35wt%、SiO2为40~50wt%、ZrO2为5~10wt%、B2O3为1~5wt%;混料于1400~1450℃熔融保温1~2h,用丙烯酸造粒成型并在875~925℃下烧结1~2h,最后得到的材料具有以下性能:抗弯强度为160~230MPa,杨氏模量为80~100GPa,介电常数为4.5~5.0(@1MHz),介质损耗为0.5~0.6×10-3(@1MHz),热膨胀系数为1.5~2.5×10-6/℃;不足之处是介电常数较低,热膨胀系数偏低,不能与硅芯片良好的热匹配。In view of the above problems, the inventor of the present invention disclosed "a cordierite-based glass-ceramic material and its preparation method" in the invention patent with application number 201810507515.9. 20wt%, Al 2 O 3 is 25-35wt%, SiO 2 is 40-50wt%, ZrO 2 is 5-10wt%, B 2 O 3 is 1-5wt%; the mixture is melted and kept at 1400-1450 ℃ for 1- 2h, granulated with acrylic acid and sintered at 875~925℃ for 1~2h, the final obtained material has the following properties: flexural strength of 160~230MPa, Young's modulus of 80~100GPa, dielectric constant of 4.5~ 5.0(@1MHz), the dielectric loss is 0.5~0.6×10 -3 (@1MHz), and the thermal expansion coefficient is 1.5~2.5×10 -6 /℃; Good thermal match with silicon chips.
发明内容SUMMARY OF THE INVENTION
本发明针对背景技术中已有陶瓷材料存在机械性能差、热膨胀系数不匹配、介质损耗大等问题,导致信号传输延时较大及功耗较高等问题,提供一种低热膨胀堇青石基微晶玻璃材料及其制备方法,既能实现与硅芯片良好的热匹配,还具有较高的抗弯强度及杨氏模量,且介电性能优异。The present invention provides a low thermal expansion cordierite-based microcrystal in order to solve the problems of poor mechanical properties, mismatched thermal expansion coefficients, large dielectric loss, etc. in existing ceramic materials in the background technology, resulting in large signal transmission delay and high power consumption. The glass material and the preparation method thereof can not only achieve good thermal matching with the silicon chip, but also have high flexural strength and Young's modulus, and have excellent dielectric properties.
为实现上述目的,本发明采用的技术方案为:To achieve the above object, the technical scheme adopted in the present invention is:
一种低热膨胀堇青石基微晶玻璃材料及其制备方法,其特征在于,按照质量百分比组成如下:A low thermal expansion cordierite-based glass-ceramic material and a preparation method thereof, characterized in that, according to mass percentage, the composition is as follows:
MgO为15~19wt%、MgO is 15-19wt%,
Al2O3为26~30wt%、Al 2 O 3 is 26 to 30 wt %,
SiO2为46~50wt%、SiO 2 is 46-50wt%,
ZrO2为2~6wt%、ZrO 2 is 2 to 6wt%,
B2O3为1~5wt%、B 2 O 3 is 1 to 5 wt %,
K2O为1~3wt%。K 2 O is 1 to 3 wt %.
上述低热膨胀堇青石基微晶玻璃材料及其制备方法,包括以下步骤:The above-mentioned low thermal expansion cordierite-based glass-ceramic material and preparation method thereof, comprising the following steps:
步骤1:以MgO、Al2O3、SiO2、ZrO2、B2O3、K2O为组份设计配方,按照配比计算各氧化物对应原料的实际用量,并混合均匀;Step 1: Design a formula with MgO, Al 2 O 3 , SiO 2 , ZrO 2 , B 2 O 3 , and K 2 O as components, calculate the actual amount of the corresponding raw materials of each oxide according to the ratio, and mix them evenly;
步骤2:球磨2~4小时后干燥,将混合料置于坩埚中,在1400~1450℃高温熔融1~2小时后,倒入去离子水中得到透明的玻璃渣;Step 2: dry after ball milling for 2 to 4 hours, place the mixture in a crucible, melt at a high temperature of 1400 to 1450 ° C for 1 to 2 hours, and pour it into deionized water to obtain transparent glass slag;
步骤3:将所得到的玻璃渣,在陶瓷罐中球磨1~1.5小时,干燥得到玻璃粉;Step 3: Ball milling the obtained glass slag in a ceramic jar for 1-1.5 hours, and drying to obtain glass powder;
步骤4:将所得到的玻璃粉,在尼龙罐球磨6~8小时,干燥后得到均匀分散的粉体;Step 4: ball mill the obtained glass powder in a nylon tank for 6 to 8 hours, and obtain a uniformly dispersed powder after drying;
步骤5:向粉体中加入丙烯酸进行造粒,干压成型后,在900~950℃烧结,并保温1~2小时,即得到低热膨胀堇青石基微晶玻璃。Step 5: adding acrylic acid to the powder for granulation, and after dry pressing, sintering at 900-950° C. and keeping the temperature for 1-2 hours to obtain low thermal expansion cordierite-based glass-ceramic.
与现有技术相比,本发明的有益效果体现在:Compared with the prior art, the beneficial effects of the present invention are embodied in:
本发明提供一种低热膨胀堇青石基微晶玻璃材料,属于镁铝硅体系,通过引入K2O作为改性剂,ZrO2作为晶核剂,B2O3作为降烧剂,抑制了一部分(MgAl2Si3O10)0.6相转化为Mg2Al4Si5O18相,通过计算,最终材料中的Mg2Al4Si5O18相的含量为65.2~76.5%,(MgAl2Si3O10)0.6相的含量为18.3~25.7%;微晶玻璃的热膨胀系数主要由晶相种类和含量决定,由于Mg2Al4Si5O18相的热膨胀系数为1.5×10-6/℃,(MgAl2Si3O10)0.6相的热膨胀系数约为5.0×10-6/℃,不同晶相的含量必定会改变材料内部的热应力,从而调节热膨胀系数趋于Si芯片(3.5×10-6/℃),并且在2.5~3.5×10-6/℃可调,热稳定性好;同时,抗弯强度可达150~200MPa,杨氏模量可达80~95GPa,介电常数低5~6(@1MHz),介质损耗低0.5~1×10-3(@1MHz),提高信号传输速度,大大降低了功耗;综上,本发明低热膨胀堇青石基微晶玻璃材料适用于超大规模集成电路封装,能够显著减少信号传输延时、降低功耗,与硅芯片良好匹配。另外,本发明的烧结温度进一步降低到950℃以下、减小能耗,且制备方法工艺流程简单、原料来源丰富,对工业化生产具有重要意义。The invention provides a low thermal expansion cordierite-based glass-ceramic material, which belongs to a magnesium-aluminum-silicon system. By introducing K 2 O as a modifier, ZrO 2 as a crystal nucleating agent, and B 2 O 3 as a calcination reducing agent, a part of the The (MgAl 2 Si 3 O 10 ) 0.6 phase is transformed into the Mg 2 Al 4 Si 5 O 18 phase. By calculation, the content of the Mg 2 Al 4 Si 5 O 18 phase in the final material is 65.2-76.5%, (MgAl 2 Si The content of 3 O 10 ) 0.6 phase is 18.3-25.7%; the thermal expansion coefficient of glass-ceramic is mainly determined by the type and content of crystal phase, because the thermal expansion coefficient of Mg 2 Al 4 Si 5 O 18 phase is 1.5×10 -6 /℃ , the thermal expansion coefficient of (MgAl 2 Si 3 O 10 ) 0.6 phase is about 5.0×10 -6 /℃, the content of different crystal phases will definitely change the thermal stress inside the material, thus adjusting the thermal expansion coefficient to the Si chip (3.5×10 -6 /℃), and adjustable at 2.5~3.5×10 -6 /℃, good thermal stability; at the same time, the flexural strength can reach 150~200MPa, the Young’s modulus can reach 80~95GPa, and the dielectric constant is low 5~6(@1MHz), the dielectric loss is low by 0.5~1×10 -3 (@1MHz), the signal transmission speed is improved, and the power consumption is greatly reduced; The VLSI package can significantly reduce signal transmission delay, reduce power consumption, and match well with silicon chips. In addition, the sintering temperature of the present invention is further reduced to below 950° C., energy consumption is reduced, and the preparation method has a simple technological process and abundant raw material sources, which is of great significance to industrialized production.
附图说明Description of drawings
图1为实施例2的一种低热膨胀堇青石基微晶玻璃的XRD图。1 is an XRD pattern of a low thermal expansion cordierite-based glass-ceramic of Example 2.
图2为实施例2的一种低热膨胀堇青石基微晶玻璃断面的SEM图。FIG. 2 is a SEM image of a section of a low thermal expansion cordierite-based glass-ceramic in Example 2. FIG.
具体实施方式Detailed ways
下面结合附图和实施例对本发明做进一步详细说明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
实施例1Example 1
按照配方:MgO为15wt%、Al2O3为26wt%、SiO2为50wt%、ZrO2为6wt%、B2O3为1wt%、K2O为2wt%,精确计算出对应原料的重量,准确称量后,球磨2小时,使其混合均匀;干燥后将混合料置于坩埚中熔制,升温至1400℃保温1.5小时,熔融完全后水淬;然后将所得玻璃渣经过湿法球磨,干燥得到玻璃粉,以去离子水为介质球磨6小时,烘干后得到均匀分散的粉体;该粉体经过造粒、干压成型后,在900℃烧结并保温1小时,即得到低热膨胀堇青石基微晶玻璃材料。According to the formula: MgO is 15wt%, Al 2 O 3 is 26wt%, SiO 2 is 50wt%, ZrO 2 is 6wt%, B 2 O 3 is 1wt%, K 2 O is 2wt%, and the weight of the corresponding raw materials is accurately calculated , after accurate weighing, ball-milled for 2 hours to make it evenly mixed; after drying, the mixture was placed in a crucible and melted, heated to 1400 ° C for 1.5 hours, and then water-quenched after melting; then the obtained glass slag was subjected to wet ball milling , dried to obtain glass powder, ball-milled with deionized water as medium for 6 hours, and dried to obtain uniformly dispersed powder; after granulation and dry pressing, the powder was sintered at 900 ° C and kept for 1 hour to obtain low temperature Thermally expanded cordierite-based glass-ceramic material.
本实施例制得的低热膨胀堇青石基微晶玻璃材料,Mg2Al4Si5O18相的含量为73.4%,(Mg Al2Si3O10)0.6相的含量为19.1%。各项性能指标为:介电常数5.54(@1MHz),介电损耗0.75×10-3(@1MHz),热膨胀系数2.72×10-6/℃,抗弯强度175MPa,杨氏模量92Gpa。In the low thermal expansion cordierite-based glass-ceramic material prepared in this example, the content of the Mg 2 Al 4 Si 5 O 18 phase is 73.4%, and the content of the (Mg Al 2 Si 3 O 10 ) 0.6 phase is 19.1%. The performance indicators are: dielectric constant 5.54 (@1MHz), dielectric loss 0.75×10 -3 (@1MHz), thermal expansion coefficient 2.72×10 -6 /℃, flexural strength 175MPa, Young's modulus 92Gpa.
实施例2Example 2
按照配方:MgO为16wt%、Al2O3为27wt%、SiO2为49wt%、ZrO2为5wt%、B2O3为2wt%、K2O为1wt%,精确计算出对应原料的重量,准确称量后,球磨2小时,使其混合均匀;干燥后将混合料置于坩埚中熔制,升温至1400℃保温2小时,熔融完全后水淬;然后将所得玻璃渣经过湿法球磨,干燥得到玻璃粉,以去离子水为介质球磨6小时,烘干后得到均匀分散的粉体;该粉体经过造粒、干压成型后,在900℃烧结并保温1.5小时,即得到低热膨胀堇青石基微晶玻璃材料。According to the formula: MgO is 16wt%, Al 2 O 3 is 27wt%, SiO 2 is 49wt%, ZrO 2 is 5wt%, B 2 O 3 is 2wt%, K 2 O is 1wt%, and the weight of the corresponding raw materials is accurately calculated , after accurate weighing, ball-milled for 2 hours to make it evenly mixed; after drying, the mixture was placed in a crucible and melted, heated to 1400 ° C for 2 hours, and water-quenched after melting was complete; then the obtained glass slag was subjected to wet ball milling , dried to obtain glass powder, ball milled with deionized water as medium for 6 hours, and dried to obtain uniformly dispersed powder; after granulation and dry pressing, the powder was sintered at 900 ° C and kept for 1.5 hours to obtain low Thermally expanded cordierite-based glass-ceramic material.
本实施例制得的低热膨胀堇青石基微晶玻璃材料,XRD图如图1所示,其中,主晶相为Mg2Al4Si5O18,次晶相为(MgAl2Si3O10)0.6和ZrO2;SEM图如图2所示,较暗的区域A为晶相,明亮的区域B为玻璃相,黑色的区域C为孔洞,可以看出晶相占比较高,孔洞较少,从而使材料拥有低热膨胀系数的同时,具备较高的机械性能;更为具体的讲,Mg2Al4Si5O18相的含量为65.2%,(MgAl2Si3O10)0.6相的含量为25.7%。各项性能指标为:介电常数5.39(@1MHz),电损耗0.63×10-3(@1MHz),热膨胀系数3.32×10-6/℃,抗弯强度196MPa,杨氏模量95Gpa。The XRD pattern of the low thermal expansion cordierite-based glass-ceramic material prepared in this example is shown in FIG. 1 , wherein the main crystalline phase is Mg 2 Al 4 Si 5 O 18 , and the secondary crystalline phase is (MgAl 2 Si 3 O 10 ) 0.6 and ZrO 2 ; the SEM image is shown in Figure 2, the darker area A is the crystalline phase, the bright area B is the glass phase, and the black area C is the hole, it can be seen that the crystalline phase has a higher proportion and fewer holes , so that the material has a low thermal expansion coefficient and high mechanical properties; more specifically, the content of the Mg 2 Al 4 Si 5 O 18 phase is 65.2%, and the (MgAl 2 Si 3 O 10 ) 0.6 phase has a content of 65.2%. The content is 25.7%. Various performance indicators are: dielectric constant 5.39 (@1MHz), electrical loss 0.63×10 -3 (@1MHz), thermal expansion coefficient 3.32×10 -6 /℃, flexural strength 196MPa, Young's modulus 95Gpa.
实施例3Example 3
按照配方:MgO为17wt%、Al2O3为28wt%、SiO2为47wt%、ZrO2为4wt%、B2O3为1wt%、K2O为3wt%,精确计算出对应原料的重量,准确称量后,球磨3小时,使其混合均匀;干燥后将混合料置于坩埚中熔制,升温至1450℃保温1小时,熔融完全后水淬;然后将所得玻璃渣经过湿法球磨,干燥得到玻璃粉,以去离子水为介质球磨7小时,烘干后得到均匀分散的粉体;该粉体经过造粒、干压成型后,在925℃烧结并保温1.5小时,即得到低热膨胀堇青石基微晶玻璃材料。According to the formula: MgO is 17wt%, Al 2 O 3 is 28wt%, SiO 2 is 47wt%, ZrO 2 is 4wt%, B 2 O 3 is 1wt%, K 2 O is 3wt%, and the weight of the corresponding raw materials is accurately calculated , after accurate weighing, ball-milled for 3 hours to make it evenly mixed; after drying, the mixture was placed in a crucible and melted, heated to 1450 ° C for 1 hour, and water-quenched after melting was complete; then the obtained glass slag was subjected to wet ball milling , dried to obtain glass powder, ball-milled with deionized water as medium for 7 hours, and dried to obtain uniformly dispersed powder; after granulation and dry pressing, the powder was sintered at 925 ° C and kept for 1.5 hours to obtain low Thermally expanded cordierite-based glass-ceramic material.
本实施例制得的低热膨胀堇青石基微晶玻璃材料,Mg2Al4Si5O18相的含量为68.4%,(MgAl2Si3O10)0.6相的含量为22.6%。各项性能指标为:介电常数5.43(@1MHz),介电损耗0.77×10-3(@1MHz),热膨胀系数3.13×10-6/℃,抗弯强度173MPa,杨氏模量90Gpa。In the low thermal expansion cordierite-based glass-ceramic material prepared in this example, the content of the Mg 2 Al 4 Si 5 O 18 phase is 68.4%, and the content of the (MgAl 2 Si 3 O 10 ) 0.6 phase is 22.6%. The performance indicators are: dielectric constant 5.43 (@1MHz), dielectric loss 0.77×10 -3 (@1MHz), thermal expansion coefficient 3.13×10 -6 /℃, flexural strength 173MPa, Young's modulus 90Gpa.
实施例4Example 4
按照配方:MgO为15wt%、Al2O3为30wt%、SiO2为46wt%、ZrO2为3wt%、B2O3为4wt%、K2O为2wt%,精确计算出对应原料的重量,准确称量后,球磨4小时,使其混合均匀;干燥后将混合料置于坩埚中熔制,升温至1450℃保温1.5小时,熔融完全后水淬;然后将所得玻璃渣经过湿法球磨,干燥得到玻璃粉,以去离子水为介质球磨8小时,烘干后得到均匀分散的粉体;该粉体经过造粒、干压成型后,在925℃烧结并保温2小时,即得到低热膨胀堇青石基微晶玻璃材料。According to the formula: MgO is 15wt%, Al 2 O 3 is 30wt%, SiO 2 is 46wt%, ZrO 2 is 3wt%, B 2 O 3 is 4wt%, K 2 O is 2wt%, and the weight of the corresponding raw materials is accurately calculated , after accurate weighing, ball-milled for 4 hours to make it evenly mixed; after drying, the mixture was placed in a crucible and melted, heated to 1450 ° C for 1.5 hours, and then water-quenched after melting; then the obtained glass slag was subjected to wet ball milling , dried to obtain glass powder, ball-milled with deionized water for 8 hours, and dried to obtain uniformly dispersed powder; after granulation and dry pressing, the powder was sintered at 925 ° C and kept for 2 hours to obtain low Thermally expanded cordierite-based glass-ceramic material.
本实施例制得的低热膨胀堇青石基微晶玻璃材料,Mg2Al4Si5O18相的含量为70.6%,(Mg Al2Si3O10)0.6相的含量为21.5%。各项性能指标为:介电常数5.62(@1MHz),介电损耗0.86×10-3(@1MHz),热膨胀系数2.97×10-6/℃,抗弯强度162MPa,杨氏模量83Gpa。In the low thermal expansion cordierite-based glass-ceramic material prepared in this example, the content of Mg 2 Al 4 Si 5 O 18 phase is 70.6%, and the content of (Mg Al 2 Si 3 O 10 ) 0.6 phase is 21.5%. The performance indicators are: dielectric constant 5.62 (@1MHz), dielectric loss 0.86×10 -3 (@1MHz), thermal expansion coefficient 2.97×10 -6 /℃, flexural strength 162MPa, Young's modulus 83Gpa.
实施例5Example 5
按照配方:MgO为19wt%、Al2O3为26wt%、SiO2为47wt%、ZrO2为2wt%、B2O3为5wt%、K2O为1wt%,精确计算出对应原料的重量,准确称量后,球磨4小时,使其混合均匀;干燥后将混合料置于坩埚中熔制,升温至1450℃保温2小时,熔融完全后水淬;然后将所得玻璃渣经过湿法球磨,干燥得到玻璃粉,以去离子水为介质球磨8小时,烘干后得到均匀分散的粉体;该粉体经过造粒、干压成型后,在950℃烧结并保温1小时,即得到低热膨胀堇青石基微晶玻璃材料。According to the formula: MgO is 19wt%, Al 2 O 3 is 26wt%, SiO 2 is 47wt%, ZrO 2 is 2wt%, B 2 O 3 is 5wt%, K 2 O is 1wt%, and the weight of the corresponding raw materials is accurately calculated , after accurate weighing, ball mill for 4 hours to make it evenly mixed; after drying, the mixture is placed in a crucible and melted, heated to 1450 ° C for 2 hours, and water quenched after melting is complete; then the obtained glass slag is subjected to wet ball milling , dried to obtain glass powder, ball-milled with deionized water for 8 hours, and dried to obtain a uniformly dispersed powder; after granulation and dry pressing, the powder was sintered at 950 ° C and kept for 1 hour to obtain low Thermally expanded cordierite-based glass-ceramic material.
本实施例制得的低热膨胀堇青石基微晶玻璃材料,Mg2Al4Si5O18相的含量为76.5%,(MgAl2Si3O10)0.6相的含量为18.3%。各项性能指标为:介电常数5.77(@1MHz),介电损耗0.88×10-3(@1MHz),热膨胀系数2.58×10-6/℃,抗弯强度153MPa,杨氏模量81Gpa。In the low thermal expansion cordierite-based glass-ceramic material prepared in this example, the content of Mg 2 Al 4 Si 5 O 18 phase is 76.5%, and the content of (MgAl 2 Si 3 O 10 ) 0.6 phase is 18.3%. The performance indicators are: dielectric constant 5.77 (@1MHz), dielectric loss 0.88×10 -3 (@1MHz), thermal expansion coefficient 2.58×10 -6 /℃, flexural strength 153MPa, Young's modulus 81Gpa.
以上所述,仅为本发明的具体实施方式,本说明书中所公开的任一特征,除非特别叙述,均可被其他等效或具有类似目的的替代特征加以替换;所公开的所有特征、或所有方法或过程中的步骤,除了互相排斥的特征和/或步骤以外,均可以任何方式组合。The above descriptions are only specific embodiments of the present invention, and any feature disclosed in this specification, unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes; all the disclosed features, or All steps in a method or process, except mutually exclusive features and/or steps, may be combined in any way.
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