CN111900102A - Single Wafer Wet Processing Equipment - Google Patents

Abstract

The present disclosure provides a single wafer wet processing equipment, comprising: a rotating table for placing a wafer; a liquid supply device for applying a variety of process liquids to the wafer; a liquid recovery device, comprising a plurality of recovery rings, wherein each of the recovery rings is used to collect a corresponding one of the process liquids and a gas-liquid mixture entrained therein; and a plurality of gas recovery devices, respectively connected to the plurality of recovery rings of the liquid recovery device, for discharging the collected gas-liquid mixture.

Description

Single Wafer Wet Processing Equipment

technical field

The present disclosure relates to a wet processing equipment, in particular to a single wafer wet processing equipment.

Background technique

In the process of the semiconductor wafer, it is necessary to perform multiple processing steps on the component installation surface of the semiconductor wafer, including wet processing procedures such as etching and cleaning. As the process complexity of semiconductor wafers increases, a single-wafer wet processing machine has been developed, in which a rotary table is used to correspond to the design of multiple liquid recovery modules, so that the single-wafer wet processing machine can A variety of different chemical liquids are applied to the wafers on the rotary table, and the chemical liquids are collected by corresponding recycling modules. Various metal layers or thin film layers of other materials on semiconductor wafers can be cleaned and etched by applying different chemical liquids. That is, many different chemical liquids are used in a single-wafer wet processing tool, which makes the functional requirements of the collection device for collecting chemical liquids and their entrained gas-liquid mixtures extremely strict.

However, the existing single-wafer wet processing machine adopts a design in which multiple liquid recovery modules are jointly connected to a gas recovery device. That is to say, although the existing single-wafer wet processing machine can collect different chemical liquids correspondingly through a plurality of liquid recovery modules, it cannot independently collect different gas-liquid mixtures entrained by different chemical liquids. The design of the single gas recovery unit described above can result in the mixing of different gas-liquid mixtures within the gas recovery unit. Since different gas-liquid mixtures contain chemical liquids with different properties (such as acids, bases, solvents, etc.), if they are mixed together, additional chemical reactions are likely to occur, thereby causing injury to personnel or machines, and will also increase the processing time of recovered gas. Difficulty. Furthermore, if the mixed mixture flows back into the multiple liquid recovery modules, the problem of cross-contamination between the chemical liquid collected by the liquid recovery modules and the mixture will occur.

In view of this, it is necessary to propose a single-wafer wet processing equipment to solve the problems existing in the prior art.

SUMMARY OF THE INVENTION

In order to solve the above-mentioned problems of the prior art, the purpose of the present disclosure is to provide a single-wafer wet processing equipment, which can independently recover gas-liquid mixtures entrained by different process liquids, so as to avoid mixing of different gas-liquid mixtures in the Together.

In order to achieve the above object, the present disclosure provides a single-wafer wet processing equipment, comprising: a rotary table for placing wafers; a liquid supply device disposed above the rotary table for applying various Process liquid; a liquid recovery device, arranged circumferentially around the rotary table and movable relative to the rotary table in a vertical direction, wherein the liquid recovery device comprises a plurality of recovery devices stacked along the vertical direction ring, and each of the recovery rings is used to collect a corresponding one of the process liquids and the entrained gas-liquid mixture; and a plurality of gas recovery devices, respectively connected to the plurality of recovery rings of the liquid recovery device correspondingly , wherein each of the gas recovery devices comprises: a bellows, including a first connection port and a second connection port, wherein the first connection port is connected with the corresponding recovery ring, so that the gas-liquid mixture in the recovery ring is into the interior of the bellows through the first connection port; and an exhaust pipe, connected with the second connection port of the bellows, for discharging the collected gas-liquid mixture.

In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes: an upper surface, a lower surface, a side surface, and a cavity, the upper surface and the lower surface are disposed opposite to each other, and the the side surface is located between the upper surface and the lower surface, and the cavity is formed by interconnecting the upper surface, the lower surface, and the side surface, wherein the first connection A port is provided on the side surface, and the second connection port is provided on the upper surface.

In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further comprises: a liquid drain, disposed on the lower surface, so that the gas-liquid mixture passes through the condensed liquid produced by the bellows It is discharged through the discharge port.

In one of the preferred embodiments of the present disclosure, each of the recovery rings of the liquid recovery device includes: a liquid receiving port aligned with the rotary table; a partition plate disposed inside the recovery ring to separate Out of the inner annular space and the outer annular space, wherein the inner annular space is used to receive the process liquid entering from the liquid receiving port and the entrained gas-liquid mixture, and the partition plate blocks the process Liquid flows from the inner annular space to the outer annular space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner annular space to pass through the plurality of through holes. a hole enters the outer annular space; and a liquid collection port communicated with the inner annular space for discharging the process liquid from the liquid collection port; and a plurality of gas recovery devices, respectively connected to the liquid recovery device The plurality of recovery rings are connected correspondingly to discharge the collected gas-liquid mixture.

In one of the preferred embodiments of the present disclosure, each of the recovery rings further includes: an annular upper cover; an annular bottom plate, which is arranged corresponding to the annular upper cover; The outer peripheral edge of the annular bottom plate is connected; the gas channel port is arranged on the outer annular wall and is connected with the corresponding one of the gas recovery devices, wherein the partition plate is arranged on the annular upper cover and the between the annular bottom plates, and the liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes a viewing window, and the interior of the bellows can be seen through the viewing window; and wherein the single-wafer wet processing The apparatus further includes a plurality of water pipes, and the bellows of each of the gas recovery devices is connected to one of the water pipes, and clean water is transmitted to the bellows through the water pipes to clean the inside of the bellows.

The present disclosure also provides a single-wafer wet processing equipment, comprising: a rotary table for placing wafers; a liquid supply device disposed above the rotary table for applying various process liquids to the wafers; liquid A recovery device is circumferentially arranged around the rotary table and can move relative to the rotary table in a vertical direction, wherein the liquid recovery device comprises a plurality of recovery rings stacked and arranged in the vertical direction, wherein each The recovery ring includes: a liquid receiving port, aligned with the rotary table, for receiving one of the corresponding process liquids and the gas-liquid mixture entrained therein; a partition plate, arranged inside the recovery ring to The inner annular space and the outer annular space are separated, wherein the inner annular space is used to receive the process liquid and the entrained gas-liquid mixture entering from the liquid receiving port, and the partition plate blocks the Process liquid flows from the inner annular space to the outer annular space, and a plurality of through holes are formed on the partition plate for allowing the gas-liquid mixture in the inner annular space to pass through the plurality of through holes a through hole enters the outer annular space; and a liquid collection port communicated with the inner annular space for discharging the process liquid from the liquid collection port; and a plurality of gas recovery devices, respectively recovering from the liquid The plurality of recovery rings of the device are correspondingly connected for discharging the collected gas-liquid mixture.

In one of the preferred embodiments of the present disclosure, each of the recovery rings further includes: an annular upper cover; an annular bottom plate, which is arranged corresponding to the annular upper cover; The outer peripheral edge of the annular bottom plate is connected; the gas channel port is arranged on the outer annular wall and is connected with the corresponding one of the gas recovery devices, wherein the partition plate is arranged on the annular upper cover and the between the annular bottom plates, and the liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate.

In one of the preferred embodiments of the present disclosure, each of the gas recovery devices includes: a bellows, including a first connection port and a second connection port, wherein the first connection port is connected to a corresponding recovery ring, so that the recovery The gas-liquid mixture in the ring enters the inside of the bellows through the first connection port; and an exhaust pipe is connected to the second connection port of the bellows, and is used for collecting the gas-liquid mixture discharge.

In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes: an upper surface, a lower surface, a side surface, and a cavity, the upper surface and the lower surface are disposed opposite to each other, and the the side surface is located between the upper surface and the lower surface, and the cavity is formed by interconnecting the upper surface, the lower surface, and the side surface, wherein the first connection A port is provided on the side surface, and the second connection port is provided on the upper surface.

In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further comprises: a liquid drain, disposed on the lower surface, so that the gas-liquid mixture passes through the condensed liquid produced by the bellows It is discharged through the discharge port.

In one of the preferred embodiments of the present disclosure, the bellows of each of the gas recovery devices further includes a viewing window, and the interior of the bellows can be seen through the viewing window; and wherein the single-wafer wet processing The apparatus further includes a plurality of water pipes, and the bellows of each of the gas recovery devices is connected to one of the water pipes, and clean water is transmitted to the bellows through the water pipes to clean the inside of the bellows.

Compared with the prior art, the present disclosure provides the same number of gas recovery devices as recovery rings, and each recovery ring is correspondingly connected to one gas recovery device. With this design, the process gas from different recovery rings can be independently pumped through different gas recovery devices, so as to avoid mixing of different gas-liquid mixtures entrained by different process liquids, thereby generating additional chemical reactions, resulting in single Injuries to wet wafer processing equipment or personnel, and also reduces the complexity of handling recovered gas. Furthermore, the contamination of the wafer or other processing chambers caused by the mixed exhaust gas flowing back to the rotary table or the recycling ring can be avoided.

Description of drawings

FIG. 1 shows a schematic perspective view of a single-wafer wet processing apparatus according to a preferred embodiment of the present disclosure;

FIG. 2 shows an enlarged partial cross-sectional view of the single-wafer wet processing apparatus of FIG. 1;

FIG. 3 shows a partial schematic diagram of a recovery ring and a gas recovery device of the single-wafer wet processing apparatus of FIG. 1;

Figure 4 shows an exploded view of the parts of the recovery ring of Figure 3; and

FIG. 5 shows another partial cross-sectional enlarged view of the single-wafer wet processing apparatus of FIG. 1 .

Detailed ways

In order to make the above-mentioned and other objects, features, and advantages of the present disclosure more clearly understood, the preferred embodiments of the present disclosure will be exemplified below, and will be described in detail in conjunction with the accompanying drawings.

Please refer to FIG. 1 , which shows a schematic perspective view of a single-wafer wet processing apparatus 1 according to a preferred embodiment of the present disclosure. The single-wafer wet processing apparatus 1 includes a rotary table 10 , a liquid supply device (not shown in the figure), a liquid recovery device 20 , a plurality of gas recovery devices 30 , and a lift device 40 . In this embodiment, the number of the gas recovery devices 30 is four, but the present disclosure is not limited thereto. The turntable 10 is used to place a single wafer (not shown in the figure). In this embodiment, the top of the rotary table 10 includes a vacuum suction cup, and the wafer can be fixed on the top of the rotary table 10 by the suction force applied by the vacuum suction cup. The turntable 10 is provided with a drive mechanism for driving the turntable 10 to rotate about an axis. In other embodiments, the wafer may be fixed on the rotary table in other manners, such as using a clamping device. Furthermore, a liquid supply device is provided above the turntable 10 for applying various process liquids to the wafer. Specifically, the liquid supply device includes a nozzle and a plurality of liquid transfer lines, wherein the nozzle is arranged to be aligned with the top of the rotary table 10 , and one end of the plurality of liquid transfer lines is connected to the nozzle, and the other end is respectively connected to different process liquids supply side. With this design, the liquid supply device can be controlled to apply the corresponding process liquid to the wafer on the turntable 10 according to process requirements, so as to perform operations such as etching or cleaning the wafer.

As shown in FIG. 1 , the liquid recovery device 20 is disposed around the turntable 10 for collecting the process liquid thrown off by the centrifugal force from the wafer surface on the turntable 10 and discharging the process liquid. A plurality of gas recovery devices 30 are correspondingly connected to the liquid recovery device 20 for discharging the collected gas-liquid mixture. The specific structures of the liquid recovery device 20 and the gas recovery device 30 in this embodiment will be described in detail later. The lifting device 40 is connected to the liquid recovery device 20 for controlling the liquid recovery device 20 to move up and down relative to the rotary table 10 along a vertical direction. In addition, since the plurality of gas recovery devices 30 are connected to the liquid recovery device 20, when the liquid recovery device 20 is raised and lowered, the plurality of gas recovery devices 30 are also raised or lowered together.

Please refer to FIGS. 1 and 2 . FIG. 2 shows an enlarged partial cross-sectional view of the single-wafer wet processing apparatus 1 of FIG. 1 . The liquid recovery device 20 includes a plurality of recovery rings 21 to 24 stacked in a vertical direction. Each recovery ring 21-24 is used to collect a corresponding one of the process liquids and the entrained gas-liquid mixture. Through the control of the lifting device 40, the plurality of recovery rings 21-24 are moved synchronously together, so that the designated recovery rings 21-24 can be moved to be aligned with the rotary table 10, wherein the alignment refers to one of the recovery rings The liquid receiving ports 21 to 24 are adjacent to the wafer on the turntable 10, so that when the liquid supply device applies the process liquid to the wafer on the turntable 10 and the turntable 10 rotates, the surface of the wafer on the turntable 10 is affected by The process liquid thrown out by centrifugal force can be collected by one of the adjacent recovery rings 21-24. That is, the single-wafer wet processing apparatus 1 of the present disclosure is a cleaning and etching apparatus with a mobile liquid recovery device 20 , which can keep the wafer on the turntable 10 horizontally fixed without moving up and down. When a single wafer spin cleaning or etching process is performed, the designated recovery ring is controlled to move to the alignment turntable 10 according to the steps performed, and then the specific process liquid is sprayed onto the wafer surface by the liquid supply device above the wafer. The rotary table 10 rotates the wafer to collect the specific process liquid and its entrained gas-liquid mixture.

Please refer to FIGS. 2 and 3 , wherein FIG. 3 shows a partial schematic view of the recovery ring 21 and the gas recovery device 30 of the single-wafer wet processing apparatus 1 of FIG. 1 . Figure 3 illustrates the recovery loop 21 on the first floor and the gas recovery device 30 connected to it. It should be understood that the structures of the remaining recovery rings 22 to 24 are substantially the same as those of the recovery ring 21 of the first layer. As shown in FIG. 2 , the recovery ring 21 includes an annular upper cover 201 , an annular bottom plate 202 , an outer annular wall 203 , and a liquid receiving port 204 . Also, as shown in FIG. 3 , the recovery ring 21 further includes a partition plate 205 , a gas passage port 206 , and a liquid collection port 207 . The annular bottom plate 202 of the recovery ring 21 is arranged corresponding to the annular upper cover 201 . In this embodiment, the plurality of recovery rings 21 to 24 are stacked along the vertical direction, and the annular bottom plate 202 of the upper recovery ring is used as the annular upper cover 201 of the lower recovery ring, so that each recovery ring can be The space inside the ring is maximized, the materials used for the liquid recovery device 20 are saved, and the overall volume of the liquid recovery device 20 is effectively reduced. The outer ring wall 203 of the recovery ring 21 is connected with the outer peripheral edge of the annular upper cover 201 and the outer peripheral edge of the annular bottom plate 202 . The annular upper cover 201 , the annular bottom plate 202 , and the outer annular wall 203 are connected to each other and define the inner space of the recovery ring 21 . The liquid receiving port 204 of the recovery ring 21 is located between the inner peripheral edge of the annular upper cover 201 and the inner peripheral edge of the annular bottom plate 202 . When the designated recovery ring 21 is moved to align with the rotary table 10, the liquid receiving port 204 of the designated recovery ring 21 will be aligned with the rotary table 10, so that the recovery ring 21 can receive the corresponding process liquid and its entrainment through the liquid receiving port 204 gas-liquid mixture.

As shown in FIG. 3 , the partition plate 205 of the recovery ring 21 is disposed inside the recovery ring 21 to separate the inner space of the recovery ring 21 into an inner ring space 208 and an outer ring space 209 . The inner annular space 208 is used to receive the process liquid entering from the liquid receiving port 204 and its entrained gas-liquid mixture, and the blocking by the partition plate 205 can prevent the process liquid from flowing from the inner annular space 208 to the outer annular space 209 . A plurality of through holes 2051 are formed on the partition plate 205 , so that the gas-liquid mixture in the inner annular space 208 can enter the outer annular space 209 through the plurality of through holes 2051 . In this embodiment, 28 through holes 2051 are formed on the partition plate 205, but not limited thereto. Preferably, the diameter of the through hole 2051 of the partition plate 205 is about 5 to 10 mm, so as to ensure that the gas-liquid mixture entrained by the process liquid can be fully pumped from the inner annular space 208 to the outer annular space 209 on the one hand, and on the other hand, it can also be The process liquid can be trapped in the inner annular space 208 .

As shown in FIG. 3 , the gas channel port 206 of the recovery ring 21 is provided on the outer ring wall 203, and the gas channel port 206 is connected to the corresponding gas recovery device 30, so that the gas-liquid mixture collected by the recovery ring 21 enters the outer ring space 209 can then be conveyed to the gas recovery device 30 through the gas passage port 206 . The liquid collection port 207 of the recovery ring 21 communicates with the inner annular space 208 for discharging the process liquid from the liquid collection port 207 . Specifically, the liquid collection port 207 is located at the lowest point of the horizontal position of the recovery ring 21 , so that the process liquid collected by the recovery ring 21 flows to the liquid collection port 207 due to gravity. In addition, the liquid collection port 207 of the recovery ring 21 is connected to the corresponding recovery pipe, so as to discharge or recover the collected process liquid. For example, as shown in FIG. 2 , the recovery ring 22 on the second layer is connected to the recovery pipe 50 inside the single-wafer wet processing equipment 1 , and the process liquid collected by the recovery ring 22 is discharged through the path 51 . Optionally, the recovery pipe 50 may be connected with a circulation system to return the processed process liquid to the liquid supply device of the single-wafer wet processing apparatus 1 again. Preferably, the diameter of the liquid collection port 207 is about 10 to 15 mm, so as to ensure that the etched impurities, the collected process liquid or the crystals formed thereof can pass through.

Please refer to FIG. 4 , which shows an exploded view of the parts of the recovery ring 21 of FIG. 3 . The plate surface of the partition plate 205 is parallel to the stacking direction of the recovery ring 21 . One side of the partition plate 205 is installed in the lower groove 2021 of the annular bottom plate 202 , and the other side of the partition plate 205 is installed in the upper groove 2011 (see FIG. 5 ) of the annular upper cover 201 . Through the above-mentioned installation method of the partition plate 205 , the assembly and replacement of the partition plate 205 can be facilitated. Furthermore, in the present embodiment, the separation plate 205 of the recovery ring 21 adopts a four-piece structure, so that when the through hole 2051 of one of the separation plates 205 is blocked, only the said piece can be separated. Plates 205 are replaced without having to replace the entire set of separator plates 205. Other numbers of divider plates may be used in other embodiments, without limitation. It should be noted that the plurality of through holes 2051 of the partition plate 205 are arranged in a ring shape at equal or similar intervals to form a ring-shaped air extraction structure, thereby ensuring that the extraction air flow of the recovery ring 21 is uniform, which can be avoided. Fully extract the gas-liquid mixture entrained in the cleaning or etching process liquid. In addition, the design of the annular gas extraction structure can prevent the process liquid on the wafer from being deflected to a certain side due to the influence of the atmospheric airflow in a single direction during the etching operation of the wafer, resulting in uneven etching of the wafer.

As shown in FIG. 1 and FIG. 2 , the number of gas recovery devices 30 is the same as the number of recovery rings 21 to 24 , and each recovery ring 21 to 24 is correspondingly connected to one gas recovery device 30 . With this design, the process gas from different recovery rings 21-24 can be independently pumped through different gas recovery devices 30, so as to avoid mixing of different gas-liquid mixtures entrained by different process liquids, thereby generating additional chemical The reaction causes harm to the single-wafer wet processing equipment 1 or personnel, and also reduces the complexity of processing the recovered gas. Furthermore, it is also possible to prevent the mixed waste gas from flowing back to the turntable 10 or the recycling rings 21-24, thereby causing contamination of the wafer or other processing chambers.

Please refer to FIG. 5 , which shows another partial cross-sectional enlarged view of the single-wafer wet processing apparatus 1 of FIG. 1 . FIG. 5 illustrates the recovery loop 21 on the first floor and the gas recovery device 30 connected thereto. It should be understood that the structures of the remaining recovery rings 22 to 24 and the remaining gas recovery device 30 are substantially the same as those of the recovery ring 21 and the gas recovery device 30 of the first layer. The gas recovery device 30 applies negative pressure to the recovery ring 21 , so that the recovery ring 21 and the inside of the gas recovery device 30 generate a gas flow like the path 61 . Specifically, the gas-liquid mixture collected by the recovery ring 21 will be pumped from the inner annular space 208 to the outer annular space 209 through the through hole 2051 of the partition plate 205 . In addition, the gas-liquid mixture in the outer annular space 209 will be transferred to the inside of the gas recovery device 30 through the gas passage opening 206 on the outer annular wall 203 .

As shown in FIG. 5 , the gas recovery device 30 includes a wind box 31 and an exhaust pipe 32 . The bellows 31 includes an upper surface 301 , a lower surface 302 , a side surface 303 , a cavity 304 , a first connection port 305 , a second connection port 306 , and a liquid discharge port 307 . The upper surface 301 of the bellows 31 is disposed opposite to the lower surface 302 , and the side surface 303 is located between the upper surface 301 and the lower surface 302 . The upper surface 301 , the lower surface 302 , and the side surface 303 are connected to each other to form a cavity 304 . The side surface 303 of the bellows 31 is formed with a first connection port 305 , the upper surface 301 is formed with a second connection port 306 , and the lower surface 302 is formed with a liquid discharge port 307 . The first connection port 305 of the bellows 31 is connected to the gas passage port 206 of the recovery ring 21 , so that the gas-liquid mixture in the recovery ring 21 enters the cavity 304 of the bellows 31 through the first connection port 305 . The exhaust pipe 32 is connected to the second connection port 306 of the bellows 31 for discharging the collected gas-liquid mixture. Furthermore, when the gas-liquid mixture passes through the bellows 31, part of the gas will condense into liquid. In order to prevent liquid from accumulating in the cavity 304 of the bellows 31 , the condensed liquid can be drained through the drain 307 along the path 62 through the arrangement of the liquid discharge port 307 located on the lower surface 302 of the bellows 31 , so as to maintain the internal air of the bellows 31 . clean.

In addition, as shown in FIG. 3 , the single-wafer wet processing apparatus 1 further includes a plurality of water pipelines 70 , and the bellows 31 of each gas recovery device 30 is connected to one water pipeline 70 . In addition, the bellows 31 of each gas recovery device 30 further includes a viewing window 80 . Therefore, when a person sees crystals or foreign matter accumulation inside the bellows 31 through the viewing window 80 , the inside of the bellows can be cleaned through the water pipeline 70 . Specifically, a small amount of clean water is transmitted to the inside of the bellows 31 through the water pipeline 70 , so that crystals or foreign matter are discharged from the liquid discharge port 307 of the bellows 31 along the path 62 (as shown in FIG. 5 ).

To sum up, the present disclosure provides the same number of gas recovery devices as recovery rings, and each recovery ring is correspondingly connected to one gas recovery device. With this design, the process gas from different recovery rings can be independently pumped through different gas recovery devices, so as to avoid mixing of different gas-liquid mixtures entrained by different process liquids, thereby generating additional chemical reactions, resulting in single Injuries to wet wafer processing equipment or personnel, and also reduces the complexity of handling recovered gas. Furthermore, it is also possible to prevent the mixed exhaust gas from flowing back to the turntable or the recycling ring, thereby causing contamination of the wafer or other processing chambers.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that those skilled in the art can make several improvements and modifications without departing from the principles of the present disclosure, and these improvements and modifications should also be regarded as the protection of the present disclosure. scope.

Claims (12)

1. a single wafer wet processing equipment, is characterized in that, comprises: Rotary stage for placing wafers; a liquid supply device, arranged above the rotary table, for applying various process liquids to the wafer; a liquid recovery device, circumferentially disposed around the rotary table and movable relative to the rotary table in a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked along the vertical direction, and Each of the recovery loops is used to collect a corresponding one of the process liquids and an entrained gas-liquid mixture thereof; and A plurality of gas recovery devices, respectively connected to the plurality of recovery loops of the liquid recovery device, wherein each of the gas recovery devices includes: A bellows, comprising a first connection port and a second connection port, wherein the first connection port is connected with a corresponding recovery ring, so that the gas-liquid mixture in the recovery ring enters the bellows through the first connection port internal; and The exhaust pipe is connected to the second connection port of the bellows, and is used for discharging the collected gas-liquid mixture. 2 . The single-wafer wet processing apparatus according to claim 1 , wherein the bellows of each gas recovery device further comprises: an upper surface, a lower surface, a side surface, and a cavity, and the upper surface Opposed to the lower surface, the side surface is located between the upper surface and the lower surface, and the cavity is formed by the upper surface, the lower surface, and the side surface The first connection port is provided on the side surface, and the second connection port is provided on the upper surface. 3 . The single-wafer wet processing apparatus according to claim 2 , wherein the bellows of each of the gas recovery devices further comprises: a liquid drain, arranged on the lower surface, so that the gas-liquid The condensed liquid produced by the mixture passing through the bellows is discharged through the liquid discharge port. 4. The single-wafer wet processing apparatus of claim 1, wherein each of the recovery loops of the liquid recovery device comprises: a liquid receiving port, aligned with the rotary table; A dividing plate is arranged inside the recovery ring to separate an inner annular space and an outer annular space, wherein the inner annular space is used to receive the process liquid entering from the liquid receiving port and the entrained gas-liquid mixture, and the separation plate blocks the flow of the process liquid from the inner annular space to the outer annular space, and a plurality of through holes are formed on the separation plate for allowing the inner annular space The gas-liquid mixture in the space enters the outer annular space through the plurality of through holes; and a liquid collection port, in communication with the inner annular space, for allowing the process liquid to be discharged from the liquid collection port; and A plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device, and are used for discharging the collected gas-liquid mixture. 5. The single-wafer wet processing equipment of claim 4, wherein each of the recycling loops further comprises: Ring cover; an annular bottom plate corresponding to the annular upper cover; an outer ring wall, connected with the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate; A gas passage port is arranged on the outer ring wall and is connected with the corresponding one of the gas recovery devices, wherein the partition plate is arranged between the annular upper cover and the annular bottom plate, and the The liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate. 6 . The single-wafer wet processing apparatus of claim 1 , wherein the bellows of each of the gas recovery devices further comprises a viewing window, and the interior of the bellows can be seen through the viewing window. 7 . ;as well as The single-wafer wet processing equipment further includes a plurality of water pipelines, and the bellows of each gas recovery device is connected to one of the water pipelines, and clean water is transmitted to the bellows through the water pipelines to clean the inside of the bellows. 7. A single-wafer wet processing equipment, characterized in that, comprising: Rotary stage for placing wafers; a liquid supply device, arranged above the rotary table, for applying various process liquids to the wafer; A liquid recovery device is circumferentially arranged around the rotary table and is movable relative to the rotary table in a vertical direction, wherein the liquid recovery device includes a plurality of recovery rings stacked and arranged in the vertical direction, wherein Each of said recycling loops includes: a liquid receiving port, aligned with the rotary table, for receiving one of the corresponding process liquids and the entrained gas-liquid mixture; A dividing plate is arranged inside the recovery ring to separate an inner annular space and an outer annular space, wherein the inner annular space is used to receive the process liquid entering from the liquid receiving port and the entrained gas-liquid mixture, and the separation plate blocks the flow of the process liquid from the inner annular space to the outer annular space, and a plurality of through holes are formed on the separation plate for allowing the inner annular space The gas-liquid mixture in the space enters the outer annular space through the plurality of through holes; and a liquid collection port, in communication with the inner annular space, for allowing the process liquid to be discharged from the liquid collection port; and A plurality of gas recovery devices are respectively connected to the plurality of recovery rings of the liquid recovery device, and are used for discharging the collected gas-liquid mixture. 8. The single-wafer wet processing equipment of claim 7, wherein each of the recycling loops further comprises: Ring cover; an annular bottom plate corresponding to the annular upper cover; an outer ring wall, connected with the outer peripheral edge of the annular upper cover and the outer peripheral edge of the annular bottom plate; A gas passage port is arranged on the outer ring wall and is connected with the corresponding one of the gas recovery devices, wherein the partition plate is arranged between the annular upper cover and the annular bottom plate, and the The liquid receiving port is located between the inner peripheral edge of the annular upper cover and the inner peripheral edge of the annular bottom plate. 9. The single-wafer wet processing apparatus of claim 7, wherein each of the gas recovery devices comprises: A bellows, comprising a first connection port and a second connection port, wherein the first connection port is connected with a corresponding recovery ring, so that the gas-liquid mixture in the recovery ring enters the bellows through the first connection port internal; and The exhaust pipe is connected to the second connection port of the bellows, and is used for discharging the collected gas-liquid mixture. 10. The single-wafer wet processing apparatus of claim 9, wherein the bellows of each gas recovery device further comprises: an upper surface, a lower surface, a side surface, and a cavity, and the upper surface Opposed to the lower surface, the side surface is located between the upper surface and the lower surface, and the cavity is formed by the upper surface, the lower surface, and the side surface The first connection port is provided on the side surface, and the second connection port is provided on the upper surface. 11 . The single-wafer wet processing apparatus according to claim 9 , wherein the bellows of each of the gas recovery devices further comprises: a liquid discharge port, disposed on the lower surface, so that the gas-liquid The condensed liquid produced by the mixture passing through the bellows is discharged through the liquid discharge port. 12 . The single-wafer wet processing apparatus according to claim 9 , wherein the bellows of each of the gas recovery devices further comprises a viewing window, and the interior of the bellows can be seen through the viewing window. 13 . ;as well as The single-wafer wet processing equipment further includes a plurality of water pipelines, and the bellows of each gas recovery device is connected to one of the water pipelines, and clean water is transmitted to the bellows through the water pipelines to clean the inside of the bellows.

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