CN111892995A - Soldering flux cleaning agent for chip packaging process - Google Patents
Soldering flux cleaning agent for chip packaging process Download PDFInfo
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- CN111892995A CN111892995A CN202010794774.1A CN202010794774A CN111892995A CN 111892995 A CN111892995 A CN 111892995A CN 202010794774 A CN202010794774 A CN 202010794774A CN 111892995 A CN111892995 A CN 111892995A
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- packaging process
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- soldering flux
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 49
- 230000004907 flux Effects 0.000 title claims abstract description 42
- 238000005476 soldering Methods 0.000 title claims abstract description 37
- 238000012858 packaging process Methods 0.000 title claims abstract description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 37
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000007797 corrosion Effects 0.000 claims abstract description 18
- 238000005260 corrosion Methods 0.000 claims abstract description 18
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims abstract description 14
- RBNPOMFGQQGHHO-UHFFFAOYSA-N glyceric acid Chemical compound OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 12
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 7
- 150000007524 organic acids Chemical class 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000001412 amines Chemical class 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- PGISRKZDCUNMRX-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-(trifluoromethoxy)butane Chemical compound FC(F)(F)OC(F)(F)C(F)(F)C(F)(F)C(F)(F)F PGISRKZDCUNMRX-UHFFFAOYSA-N 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 5
- 229950008618 perfluamine Drugs 0.000 claims description 5
- JAJLKEVKNDUJBG-UHFFFAOYSA-N perfluorotripropylamine Chemical group FC(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)F JAJLKEVKNDUJBG-UHFFFAOYSA-N 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 230000001502 supplementing effect Effects 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 230000005764 inhibitory process Effects 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 239000000080 wetting agent Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 15
- 238000001035 drying Methods 0.000 abstract description 12
- 239000003112 inhibitor Substances 0.000 abstract description 5
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 abstract description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 4
- 125000001153 fluoro group Chemical group F* 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 239000002529 flux (metallurgy) Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- -1 etc Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/201—Monohydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/32—Amides; Substituted amides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a soldering flux cleaning agent for a chip packaging process, which comprises the following components in percentage by weight: fluoro-organic compounds: 2 to 8 percent; glycerol ether: 20 to 40 percent; n, N-dimethylacetamide: 5 to 15 percent; mercaptobenzothiazole: 1 to 5 percent; ethanol: 20 to 30 percent; the balance being water. The cleaning agent is added with a fluoro organic substance with strong electron withdrawing capability, has excellent wetting effect, and can effectively act on surfaces which are difficult to wet, such as blind holes, gaps and the like; the alcohol ether and the acetamide have good dissolving and removing capacities on organic acid, organic amine, rosin and glue substances respectively, and have good low-temperature cleaning effect and high oil removal speed; 2-mercaptobenzothiazole serving as a metal corrosion inhibitor reduces the corrosion effect of the cleaning agent on metal; the ethanol improves the quick-drying characteristic of the cleaning agent, and avoids corrosion of a bonding pad or a pin and the like caused by untimely drying.
Description
Technical Field
The invention relates to the technical field of materials in the electronic industry, in particular to a soldering flux cleaning agent for a chip packaging process.
Background
In the processing technology of electronic information products, a large amount of cleaning agent is consumed for cleaning SMT (surface mount technology) printing screens, wave crest furnaces, reflow furnaces and PCBA (printed circuit board assembly) every year. In the process of assembly welding of a common PCB, in order to ensure the reliability of welding, soldering fluxes with high activity are required to be used, the soldering fluxes are remained on the PCBA to corrode a circuit board and components, and simultaneously, the surface insulation resistance of the PCBA is reduced, and particularly, serious corrosion and electric leakage can occur under the environment of high temperature and high humidity to influence the reliability of the whole machine. At present, the soldering flux is developed and applied in a cleaning-free mode gradually, but the soldering flux used in most electronic industries is still in a traditional mode, the components of the soldering flux comprise organic acid, organic amine, rosin/glue substances and the like, and the residues of the soldering flux need to be cleaned to ensure the reliability of electronic components.
At present, industrial cleaning agents at home and abroad are generally divided into three types: solvent type, semi-water type, water-based type. The solvent cleaning agent mainly comprises halogenated hydrocarbons (chlorohydrocarbon, bromohydrocarbon and fluorohydrocarbon), petroleum, alcohols, ethers, glycol esters, siloxane and the like, and the cleaning agent is mature in technology at home and abroad and has a good cleaning effect mostly. Among them, ODS (ozone depleting substances) containing freon (CFC-113) etc. are prohibited from destroying the ozone layer and harming the ecological environment. The semi-water base detergent is developed for improving the use performance of solvent detergent in practical application and consists of mainly organic solvent, such as alcohol, terpene glycol ether, hydrocarbon, etc, activator and water in 5-20%. The semi-water-based cleaning agent has high dissolvability and high cleaning cleanliness, and the contained organic solvent has better cleaning capacity on organic matters, so that the volatility and flammability of the original flammable solvent are reduced. However, the semi-aqueous cleaning technology has the following disadvantages: the process flow is long, the operation cost is high, and the wastewater treatment capacity is large; when the metal is rinsed by pure water, the metal is easy to corrode and discolor; still contains volatile organic compounds and the like. The main components of the water-based cleaning agent comprise a surfactant, a washing assistant, a corrosion inhibitor and the like, and the water-based cleaning agent is a cleaning agent which is widely applied in recent years. The cleaning agent has good compatibility, low price, safe operation, no combustion and explosion, and large freedom degree of cleaning and formulation, and can adjust the formulation aiming at pollutants with different properties. However, the water-based cleaning agent in China has the following defects: i, cleaning effects on a plurality of viscous waxy dirt such as rosin and glue, blind holes and gaps on workpieces and hydrophobic parts are poor, and the phenomenon that the surface of a board is whitened is generally easy to occur after the PCBA is cleaned by the conventional water-based cleaning agent; II, residues after being cleaned by some water-based cleaning agents are difficult to wash away, especially residues in blind holes and gaps, and the residues can influence subsequent processes or application; III, the low-temperature cleaning effect is poor, the oil removal speed is slow, and the oil removal speed cannot be compared with that of a solvent type; IV, if the metal parts are not dried in time, corrosion is easy to occur, such as the pin parts of a steel mesh, a welding disc on the PCBA and components; v, lack of special multi-effect surfactants suitable for industrial cleaning, and the like.
In order to overcome the defects, research and development breakthroughs are made on the key technology, and a novel efficient soldering flux cleaning agent for a chip packaging process is prepared.
Disclosure of Invention
Aiming at the defects in the technology, the invention provides the soldering flux cleaning agent for the chip packaging process, which has good wettability and strong capability of removing organic matters, and can efficiently remove residual soldering flux and other oil stains on blind holes, gaps and general surfaces of workpieces; meanwhile, the metal corrosion inhibitor and volatile ethanol are added, so that the drying speed is high, and the corrosion of components caused by untimely drying and the like is avoided.
In order to achieve the purpose, the invention provides a soldering flux cleaning agent for a chip packaging process, which comprises the following components in percentage by weight:
fluoro-organic compounds: 2 to 8 percent of
Glycerol ether: 20 to 40 percent of
N, N-dimethylacetamide: 5 to 15 percent of
Mercaptobenzothiazole: 1 to 5 percent
Ethanol: 20 to 30 percent
The balance of water;
preparing a clean glass reaction kettle, and placing the glass reaction kettle in an ice bath;
adding the glycerol ether and the ethanol in percentage by weight into the reaction kettle, starting stirring, and uniformly mixing by regulating the rotation speed to 150 plus 180 rpm;
sequentially adding N, N-dimethylacetamide, perfluorobutyl methyl ether and 2-mercaptobenzothiazole under the stirring state, and finally supplementing water;
and after uniform dispersion, standing, sealing and keeping in shade for storage to obtain the soldering flux cleaning agent for the chip packaging process.
Wherein the fluorinated organic substance is perfluorotripropylamine or perfluorobutyl methyl ether, and the preferred concentration is 3-5%; fluorine has strong electron withdrawing ability, excellent thermal stability, unique low surface free energy and low viscosity, and good wettability, and can be used as surfactant of cleaning agent.
Wherein, the preferable concentration of the glycerol ether is 25-35%; the soldering flux is a good wetting agent, and can effectively remove organic acid and organic amine in the residual soldering flux.
Wherein, the preferable concentration of the N, N-dimethylacetamide is 8-12%; can effectively dissolve the rosin and glue substances in the residual soldering flux and efficiently remove organic matters.
Wherein, the preferable concentration of the 2-mercaptobenzothiazole is 2-3%; it contains-N-S-bond, can be effectively adsorbed on the metal surface, and can form an insoluble complex deposition film with metal ions at the interface, so that the corrosion inhibition effect is achieved.
Wherein, the preferable concentration of the ethanol is 25 to 30 percent; the cleaning agent has the characteristic of easy volatilization, provides the quick-drying characteristic after the cleaning agent is used, and avoids corrosion of a bonding pad and a pin part of an electronic component caused by untimely drying.
The invention has the beneficial effects that: compared with the prior art, the soldering flux cleaning agent for the chip packaging process has the following advantages: the cleaning agent is added with a fluoro organic substance with strong electron withdrawing capability, has excellent wetting effect, and can effectively act on surfaces which are difficult to wet, such as blind holes, gaps and the like; the alcohol ether and the acetamide have good dissolving and removing capacities on organic acid, organic amine, rosin and glue substances respectively, and have good low-temperature cleaning effect and high oil removal speed; 2-mercaptobenzothiazole serving as a metal corrosion inhibitor reduces the corrosion effect of the cleaning agent on metal; the ethanol improves the quick-drying characteristic of the cleaning agent, and avoids corrosion of a bonding pad or a pin and the like caused by untimely drying. Is a novel and efficient soldering flux cleaning agent for a chip packaging process. The cleaning agent has good wettability and strong capability of removing organic matters, and can efficiently remove residual soldering flux and other oil stains on blind holes, gaps and general surfaces of workpieces; meanwhile, the metal corrosion inhibitor and volatile ethanol are added, so that the drying speed is high, and the corrosion of components caused by untimely drying and the like is avoided.
Drawings
FIG. 1 is a view of a solder sample plate before cleaning;
FIG. 2 is a diagram of a solder sample plate after being cleaned by using a cleaning agent according to an embodiment of the present invention.
Detailed Description
In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.
The invention provides a soldering flux cleaning agent for a chip packaging process, which comprises the following components in percentage by weight:
fluoro-organic compounds: 2 to 8 percent of
Glycerol ether: 20 to 40 percent of
N, N-dimethylacetamide: 5 to 15 percent of
Mercaptobenzothiazole: 1 to 5 percent
Ethanol: 20 to 30 percent
The balance of water; approximately 15-25%;
preparing a clean glass reaction kettle, and placing the glass reaction kettle in an ice bath;
adding the glycerol ether and the ethanol in percentage by weight into the reaction kettle, starting stirring, and uniformly mixing by regulating the rotation speed to 150 plus 180 rpm;
sequentially adding N, N-dimethylacetamide, perfluorobutyl methyl ether and 2-mercaptobenzothiazole under the stirring state, and finally supplementing water;
and after uniform dispersion, standing, sealing and keeping in shade for storage to obtain the soldering flux cleaning agent for the chip packaging process.
In this embodiment, the fluorinated organic substance is perfluorotripropylamine or perfluorobutyl methyl ether, preferably at a concentration of 3 to 5%; fluorine has strong electron withdrawing ability, excellent thermal stability, unique low surface free energy and low viscosity, and good wettability, and can be used as surfactant of cleaning agent.
In this embodiment, the preferred concentration of the glycerol ether is 25-35%; the soldering flux is a good wetting agent, and can effectively remove organic acid and organic amine in the residual soldering flux.
In this embodiment, the concentration of the N, N-dimethylacetamide is preferably 8-12%; can effectively dissolve the rosin and glue substances in the residual soldering flux and efficiently remove organic matters.
In this embodiment, the 2-mercaptobenzothiazole is preferably present at a concentration of 2 to 3%; it contains-N-S-bond, can be effectively adsorbed on the metal surface, and can form an insoluble complex deposition film with metal ions at the interface, so that the corrosion inhibition effect is achieved.
In the embodiment, the concentration of the ethanol is preferably 25-30%; the cleaning agent has the characteristic of easy volatilization, provides the quick-drying characteristic after the cleaning agent is used, and avoids corrosion of a bonding pad and a pin part of an electronic component caused by untimely drying.
The following are specific examples of the present invention:
the first embodiment is as follows:
the soldering flux cleaning agent for the chip packaging process comprises the following components in parts by weight: 3 parts of perfluorobutyl methyl ether, 30 parts of glycerol ether, 10 parts of N, N-dimethylacetamide, 2 parts of 2-mercaptobenzothiazole, 30 parts of ethanol and 25 parts of water.
The preparation method comprises the following steps:
1. preparing a clean glass reaction kettle, and placing the glass reaction kettle in an ice bath;
2. adding the glycerol ether and the ethanol in parts by weight into the reaction kettle, starting stirring, and adjusting the rotation speed to 150 plus 180rpm to uniformly mix. Sequentially adding N, N-dimethylacetamide, perfluorobutyl methyl ether and 2-mercaptobenzothiazole under the stirring state, and finally supplementing and adding ultrapure water.
3. And after uniform dispersion, standing, sealing and keeping in shade for storage to obtain the soldering flux cleaning agent for the chip packaging process.
Example two:
the soldering flux cleaning agent for the chip packaging process comprises the following components in parts by weight: 5 parts of perfluorotripropylamine, 35 parts of glycerol ether, 8 parts of N, N-dimethylacetamide, 3 parts of 2-mercaptobenzothiazole, 28 parts of ethanol and 21 parts of water.
The preparation method comprises the following steps:
1. preparing a clean glass reaction kettle, and placing the glass reaction kettle in an ice bath;
2. adding the glycerol ether and the ethanol in parts by weight into the reaction kettle, starting stirring, and adjusting the rotation speed to 150 plus 180rpm to uniformly mix. And sequentially adding N, N-dimethylacetamide, perfluorotripropylamine and 2-mercaptobenzothiazole under the stirring state, and finally supplementing and adding ultrapure water.
3. And after uniform dispersion, standing, sealing and keeping in shade for storage to obtain the soldering flux cleaning agent for the chip packaging process.
As shown in fig. 1 and 2, after soldering with the flux, the surface of the PCB sample board remains much flux and dirt (fig. 1); after cleaning with the flux cleaner of the example, the surface was smooth and the metal surface was intact (fig. 2). According to IPC-TM-6502.3.28&2.3.25 standard, an ion chromatographic analyzer and a cleanliness tester are used for carrying out tests such as ion pollution on two sample plates, the results are listed in Table 1, and Table 1 is a graph of the detection results of the residues of the soldering tin sample plates before and after cleaning; it can be seen that most of the ions and organic acids after cleaning are significantly reduced to reach the cleaning standard, and the next process or procedure can be smoothly performed. Table 1 is as follows:
the above disclosure is only an example of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art should fall within the scope of the present invention.
Claims (5)
1. The soldering flux cleaning agent for the chip packaging process is characterized by comprising the following components in percentage by weight:
fluoro-organic compounds: 2 to 8 percent of
Glycerol ether: 20 to 40 percent of
N, N-dimethylacetamide: 5 to 15 percent of
Mercaptobenzothiazole: 1 to 5 percent
Ethanol: 20 to 30 percent
The balance of water;
preparing a clean glass reaction kettle, and placing the glass reaction kettle in an ice bath;
adding the glycerol ether and the ethanol in percentage by weight into the reaction kettle, starting stirring, and uniformly mixing by regulating the rotation speed to 150 plus 180 rpm;
sequentially adding N, N-dimethylacetamide, perfluorobutyl methyl ether and 2-mercaptobenzothiazole under the stirring state, and finally supplementing water;
and after uniform dispersion, standing, sealing and keeping in shade for storage to obtain the soldering flux cleaning agent for the chip packaging process.
2. The flux cleaning agent for the chip packaging process according to claim 1, wherein the fluorinated organic substance is perfluorotripropylamine or perfluorobutyl methyl ether, and the concentration is preferably 3-5%; fluorine has strong electron withdrawing ability, excellent thermal stability, unique low surface free energy and low viscosity, and good wettability, and can be used as surfactant of cleaning agent.
3. The flux cleaning agent for the chip packaging process according to claim 1, wherein the preferred concentration of the glycerol ether is 25-35%; the soldering flux is a good wetting agent, and can effectively remove organic acid and organic amine in the residual soldering flux.
4. The flux cleaning agent for the chip packaging process according to claim 1, wherein the preferable concentration of the N, N-dimethylacetamide is 8-12%; can effectively dissolve the rosin and glue substances in the residual soldering flux and efficiently remove organic matters.
5. The flux cleaning agent for the chip packaging process according to claim 1, wherein the preferred concentration of the 2-mercaptobenzothiazole is 2-3%; it contains-N-S-bond, can be effectively adsorbed on the metal surface, and can form an insoluble complex deposition film with metal ions at the interface, so that the corrosion inhibition effect is achieved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010794774.1A CN111892995B (en) | 2020-08-10 | 2020-08-10 | Soldering flux cleaning agent for chip packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010794774.1A CN111892995B (en) | 2020-08-10 | 2020-08-10 | Soldering flux cleaning agent for chip packaging process |
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| Publication Number | Publication Date |
|---|---|
| CN111892995A true CN111892995A (en) | 2020-11-06 |
| CN111892995B CN111892995B (en) | 2021-09-07 |
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| CN202010794774.1A Active CN111892995B (en) | 2020-08-10 | 2020-08-10 | Soldering flux cleaning agent for chip packaging process |
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