CN111883572A - Preparation method of display substrate, display substrate and display device - Google Patents
Preparation method of display substrate, display substrate and display device Download PDFInfo
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- CN111883572A CN111883572A CN202010785674.2A CN202010785674A CN111883572A CN 111883572 A CN111883572 A CN 111883572A CN 202010785674 A CN202010785674 A CN 202010785674A CN 111883572 A CN111883572 A CN 111883572A
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
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Abstract
The application provides a preparation method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a substrate, the substrate comprises a plurality of pixel areas, and each pixel area comprises a plurality of sub-pixel areas; an anode layer, an organic functional layer and a cathode layer which are arranged on one side of the substrate in a stacked manner; the anode layer is arranged close to the substrate, the organic functional layer comprises a hole injection layer which is arranged on one side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region. According to the technical scheme, the hole injection layer is set to be the discontinuous film layer, namely, the hole injection blocks corresponding to the sub-pixel regions are separately arranged, so that the transverse migration of P-dots of different sub-pixel regions in the hole injection layer is eliminated, the signal crosstalk problem is effectively avoided, the color purity is improved, the display performance is improved, and the yield is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a preparation method of a display substrate, the display substrate and a display device.
Background
Organic Light Emitting Diodes (OLEDs) have the advantages of being self-emitting, light, thin, foldable, wide in color gamut, high in contrast, and the like, and have attracted wide attention in the industry in the application fields of display, illumination, and the like.
In the existing OLED display product, when a single pixel is lit, a crosstalk phenomenon exists in which adjacent pixel points are also lit, for example, when only a green sub-pixel is lit, a surrounding red sub-pixel also emits light, so that a display picture is entirely red. The phenomenon causes the OLED to have poor color purity, serious color mixing effect and poor display effect.
Disclosure of Invention
The invention provides a preparation method of a display substrate, the display substrate and a display device, which are used for solving the problem of display crosstalk and improving color purity.
In order to solve the above problems, the present invention discloses a display substrate, including:
a substrate including a plurality of pixel regions, each of the pixel regions including a plurality of sub-pixel regions;
an anode layer, an organic functional layer, and a cathode layer stacked on one side of the substrate;
the anode layer is arranged close to the substrate, the organic functional layer comprises a hole injection layer which is arranged on one side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region.
In an alternative implementation, the organic functional layer further includes:
patterning a hole transport layer disposed on a side of the hole injection layer facing away from the substrate;
patterning a light-emitting layer arranged on one side of the hole transport layer, which is far away from the substrate;
wherein the orthographic projections of the hole transport layer and the light emitting layer on the substrate are completely overlapped with the orthographic projection of the hole injection layer on the substrate.
In an alternative implementation, the organic functional layer further includes:
patterning an electron transport layer arranged on the side, away from the substrate, of the light-emitting layer, wherein the orthographic projection of the electron transport layer on the substrate is completely overlapped with the orthographic projection of the hole injection layer on the substrate.
In an alternative implementation, an orthographic projection of the cathode layer on the substrate completely overlaps with an orthographic projection of the hole injection layer on the substrate.
In order to solve the above problem, the present invention further discloses a display device including the display substrate according to any one of the embodiments.
In order to solve the above problems, the present invention also discloses a method for manufacturing a display substrate, the method comprising:
providing a substrate, wherein the substrate comprises a plurality of pixel regions, and each pixel region comprises a plurality of sub-pixel regions;
forming an anode layer on one side of the substrate;
sequentially forming an organic functional layer and a cathode layer on one side of the anode layer, which is far away from the substrate;
the organic functional layer comprises a hole injection layer which is arranged on the side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region.
In an alternative implementation manner, the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist of a first preset region, wherein the orthographic projection of the first preset region on the substrate covers the opening region of each sub-pixel region;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
forming a hole injection layer material on the anode layer and one side of the photoresist, which is away from the substrate;
stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer;
and sequentially forming a hole transport layer, a light emitting layer, an electron transport layer and the cathode layer on one side of the hole injection layer, which is far away from the substrate.
In an alternative implementation manner, each of the pixel regions includes a first sub-pixel region, and the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist in a second preset area, wherein the orthographic projection of the second preset area on the substrate covers the opening area of each first sub-pixel area;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
sequentially forming a hole injection layer material, a hole transport layer material and a light-emitting layer material on the anode layer and one side of the photoresist, which is away from the substrate;
stripping the remaining sacrificial layer and the photoresist to obtain a hole injection layer, a hole transport layer and a light emitting layer of the first sub-pixel region;
and after the hole injection layer, the hole transport layer and the light emitting layer of each sub-pixel region are finished, an electron transport layer and the cathode layer are sequentially formed on one side, away from the substrate, of the light emitting layer.
In an alternative implementation manner, each of the pixel regions includes a first sub-pixel region, and the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist of a third preset region, wherein the orthographic projection of the third preset region on the substrate covers the opening region of each first sub-pixel region;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
sequentially forming a hole injection layer material, a hole transport layer material, a light-emitting layer material and an electron transport layer material on the anode layer and one side of the photoresist, which is away from the substrate;
stripping the remaining sacrificial layer and the photoresist to obtain a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer of the first sub-pixel region;
and after the hole injection layer, the hole transport layer, the light emitting layer and the electron transport layer of each sub-pixel region are finished, forming the cathode layer on one side, away from the substrate, of the electron transport layer.
In an alternative implementation manner, each of the pixel regions includes a first sub-pixel region, and the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist of a fourth preset region, wherein the orthographic projection of the fourth preset region on the substrate covers the opening region of each first sub-pixel region;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
sequentially forming a hole injection layer material, a hole transport layer material, a light emitting layer material, an electron transport layer material and a cathode material on the anode layer and one side of the photoresist, which is away from the substrate;
and stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer and the cathode layer of the first sub-pixel region.
Compared with the prior art, the invention has the following advantages:
the technical scheme of the application provides a preparation method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a substrate, the substrate comprises a plurality of pixel areas, and each pixel area comprises a plurality of sub-pixel areas; an anode layer, an organic functional layer and a cathode layer which are arranged on one side of the substrate in a stacked manner; the anode layer is arranged close to the substrate, the organic functional layer comprises a hole injection layer which is arranged on one side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region. According to the technical scheme, the hole injection layer is set to be the discontinuous film layer, namely, the hole injection blocks corresponding to the sub-pixel regions are separately arranged, so that the transverse migration of P-dots of different sub-pixel regions in the hole injection layer is eliminated, the signal crosstalk problem is effectively avoided, the color purity is improved, the display performance is improved, and the yield is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic cross-sectional view of a display substrate according to the related art;
fig. 2 is a schematic cross-sectional view illustrating a first display substrate according to an embodiment of the present disclosure;
FIG. 3 is a schematic cross-sectional view illustrating a second display substrate according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view illustrating a third display substrate according to an embodiment of the present disclosure;
FIG. 5 is a schematic cross-sectional view illustrating a fourth display substrate according to an embodiment of the present disclosure;
FIG. 6 is a flowchart illustrating steps of a method for manufacturing a display substrate according to an embodiment of the present disclosure;
fig. 7 is a flowchart illustrating a first method for manufacturing a display substrate according to an embodiment of the present disclosure;
fig. 8 is a flowchart illustrating a second method for manufacturing a display substrate according to an embodiment of the present disclosure;
fig. 9 is a flowchart illustrating a method for manufacturing a third display substrate according to an embodiment of the present disclosure;
fig. 10 is a flowchart illustrating a fourth method for manufacturing a display substrate according to an embodiment of the present disclosure;
FIG. 11 is a schematic view illustrating a process for manufacturing a first display substrate according to an embodiment of the present disclosure;
FIG. 12 is a schematic view illustrating a process for fabricating a second display substrate according to an embodiment of the present disclosure;
FIG. 13 is a schematic view illustrating a process for fabricating a third display substrate according to an embodiment of the present disclosure;
fig. 14 is a schematic view illustrating a manufacturing process of a fourth display substrate according to an embodiment of the present disclosure.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The inventor analyzes the Crosstalk problem in the related art, and finds that in the process of preparing the OLED display substrate, since the hole injection layer is prepared by co-evaporation doping of P-dopant and a hole transport layer material, and the hole injection layer HIL of R, G, B three sub-pixels is a common structure, as shown in fig. 1, the HIL film layer is prepared by full-area evaporation or spin coating, when the hole injection performance is strong, the lateral charge migration may cause the Crosstalk (Crosstalk) phenomenon, that is, when a single sub-pixel is lit, the P-dopant migrates in the common hole injection layer, and the adjacent sub-pixels are also lit.
If the signal crosstalk is improved by reducing the P-pinning ratio in the hole injection layer and reducing the transverse migration, the problems of voltage rise or carrier imbalance in the device and the like caused by the poor hole injection capability along with the reduction of the P-pinning ratio can occur.
In order to solve the problem of signal crosstalk and improve color purity, an embodiment of the present application provides a display substrate, which may include, with reference to fig. 2: a substrate 20, wherein the substrate 20 comprises a plurality of pixel regions, and each pixel region comprises a plurality of sub-pixel regions, such as a red sub-pixel region, a green sub-pixel region, a blue sub-pixel region, and the like; the display substrate further comprises an anode layer 21, an organic functional layer 22 and a cathode layer 23, which are arranged in layers on one side of the substrate 20.
The anode layer 21 may be disposed close to the substrate 20, the organic functional layer 22 may include a hole injection layer 221 patterned on a side of the anode layer 21 away from the substrate 20, the hole injection layer 221 includes a plurality of separately disposed hole injection blocks 2211, each hole injection block 2211 corresponds to a different sub-pixel region, and an orthographic projection of each hole injection block 2211 on the substrate 20 covers an opening region of the corresponding sub-pixel region.
The hole injection layer 221 mainly functions to reduce a hole injection barrier and improve hole injection efficiency. The hole injection layer 221 may be doped P-type, i.e., P-type doped material (B) and hole transport material (A) are co-evaporated to form the hole injection layer 221 (A: B), such as NPB: F4TCNQ, TAPC: MoO3, etc. The thickness of the hole injection layer 221 may be in a range of 5nm to 20nm, and the doping concentration of the P-type doping material B may be in a range of 0.5% to 10%. The hole transport material A may be arylamine compound, and its substituent may be carbazole, methylfluorene, spirofluorene, dibenzothiophene, furan, etc. The HOMO energy level | HOMO (A) | of the hole-transport-type material A is more than or equal to 5.0eV, and the doping proportion of the P-type doping material B is higher along with the deeper HOMO energy level of the hole-transport-type material A. The hole injection layer 221 may have a single-layer film structure or a multi-layer film structure, and optional materials include HATCN, CuPc, PEDOT: PSS, NiOx, and the like.
In practical applications, the organic functional layer 22 may further include: the hole transport layer HTL, the emission layer EML, and the electron transport layer ETL, which are disposed on the side of the hole injection layer 221 away from the substrate 20, are sequentially stacked. The emission layer EML includes a red emission layer R in a red sub-pixel region, a green emission layer G in a green sub-pixel region, and a blue emission layer B in a blue sub-pixel region. The hole transport layer HTL or the electron transport layer ETL may be a continuous film layer, as shown in fig. 2; it may also be a discontinuous film layer, as will be described in more detail in the examples that follow.
The display substrate provided by the embodiment changes the common hole injection layer into the independent hole injection blocks among the sub-pixels by patterning the hole injection layer, so that the lateral migration of the P-dots among different sub-pixel regions in the hole injection layer is eliminated, the problem of signal crosstalk can be effectively avoided, the display defects of devices caused by crosstalk are avoided, the color purity is improved, the display performance is improved, and the yield is improved.
In an alternative implementation, referring to fig. 3, the organic functional layer 22 may further include: patterning the hole transport layer 31 disposed on the side of the hole injection layer 221 facing away from the substrate 20; and a light-emitting layer 32 patterned on the side of the hole transport layer 31 facing away from the substrate 20; here, the orthographic projections of the hole transport layer 31 and the light emitting layer 32 on the substrate 20 completely overlap the orthographic projection of the hole injection layer 221 on the substrate 20.
In this implementation, patterning the hole injection layer 221 and the hole transport layer 31 can eliminate lateral migration of P-dots of different sub-pixel regions within the hole injection layer 221 and the hole transport layer 31, thereby further avoiding the problem of signal crosstalk. Meanwhile, the display substrate in the implementation mode does not need a high-precision metal mask FMM (fine metal mask) in the preparation process, and the opening area is not limited by the FMM, so that the opening rate can be increased, and the sum of the opening rates of the sub-pixel areas is larger than 25%, even larger than 50% or 70%. In addition, since it is not necessary to use an FMM, the cost can be reduced to some extent.
In an alternative implementation, referring to fig. 4, the organic functional layer 22 may further include: the electron transport layer 41 disposed on the side of the light-emitting layer 32 facing away from the substrate 20 is patterned, and the orthographic projection of the electron transport layer 41 on the substrate 20 completely overlaps with the orthographic projection of the hole injection layer 221 on the substrate 20.
In the display substrate shown in fig. 4, the hole injection layer 221, the hole transport layer 31, the light emitting layer 32, and the electron transport layer 41 included in the organic functional layer 22 are all discontinuous film layers, and are patterned, so that the signal crosstalk problem can be effectively avoided. Meanwhile, the display substrate in the implementation mode does not need a high-precision metal mask FMM (final mask) in the preparation process, and the opening area is not limited by the FMM, so that the opening rate can be increased, and the sum of the opening rates of the sub-pixel areas is larger than 25%, even larger than 50% or 70%. In addition, since it is not necessary to use an FMM, the cost can be reduced to some extent.
Referring to fig. 5, an orthogonal projection of the cathode layer 23 on the substrate 20 completely overlaps an orthogonal projection of the hole injection layer 221 on the substrate 20.
In the display substrate shown in fig. 5, the organic functional layer 22 and the cathode layer 23 are all discontinuous film layers, and are patterned, so that the signal crosstalk problem can be effectively avoided, an FMM is not needed in the preparation process, the cost can be reduced, and the aperture opening ratio can be improved; further, since the material of the cathode layer 23 is usually a metal material, the transmittance of the top emission display substrate can be increased by patterning the cathode layer 23, and transparent display is expected.
The display substrate, the Hole Injection Layer (HIL), the Hole Transport Layer (HTL), the light emitting layer (EML) and the Electron Transport Layer (ETL) in the cathode layer and the organic functional layer provided by the embodiment can be discontinuous films, and at least the hole injection layer HIL is set to be discontinuous films, so that the crosstalk phenomenon of OLED display can be effectively improved.
Another embodiment of the present application further provides a display device including the display substrate according to any one of the embodiments.
The display device in this embodiment may be: any product or component with a 2D or 3D display function, such as a display panel, electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
Another embodiment of the present application further provides a method for manufacturing a display substrate, and referring to fig. 6, the method includes:
step 601: a substrate is provided, the substrate including a plurality of pixel regions, each pixel region including a plurality of sub-pixel regions.
Step 602: an anode layer is formed on one side of the substrate.
Step 603: and sequentially forming an organic functional layer and a cathode layer on one side of the anode layer, which is far away from the substrate, wherein the organic functional layer comprises a hole injection layer which is arranged on one side of the anode layer, which is far away from the substrate in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region.
The patterned hole injection layer may be formed by FMM evaporation, or may be formed by a lift-off process, and the detailed processes of the lift-off process will be described in detail in the following embodiments.
The display substrates as shown in fig. 2 to 5 can be prepared by the preparation method provided by the embodiment.
In an alternative implementation, referring to fig. 7 and 11, step 602 may include:
step 701: the anode layer is coated with a sacrificial layer and a photoresist in sequence on the side facing away from the substrate.
Step 702: and exposing and developing the photoresist of the first preset region, wherein the orthographic projection of the first preset region on the substrate covers the opening region of each sub-pixel region.
Step 703: and developing the sacrificial layer to make the developed sacrificial layer retract relative to the developed photoresist.
In specific implementation, a sacrificial layer is spin-coated on one side of the anode layer, which is away from the substrate, soft-baked, then a layer of photoresist (photoresist) is spin-coated, then baking is performed, then exposure and development are performed on the photoresist, then development of the sacrificial layer is performed, the developed sacrificial layer needs to have a certain amount of indentation relative to the developed photoresist, and the left and right sides of the indentation can be respectively indented by 1-3 um, so that the stripping structure shown in fig. 11a is obtained. The sacrificial layer can be made of a fluorine-containing polymer material, the thickness range of the sacrificial layer can be 650 nm-970 nm, and the thickness range of the photoresist (PR photoresist) can be 1-2 um.
Step 704: and forming a hole injection layer material on the anode layer and the side of the photoresist, which faces away from the substrate.
In a specific implementation, the substrate shown in fig. 11a may be placed in an evaporation chamber, and a hole injection layer material is evaporated to complete evaporation, so as to obtain the structure shown in fig. 11 b.
In another implementation, a solution process such as spin coating or printing may be used to prepare the hole injection layer on the substrate shown in fig. 11a, so as to obtain the structure shown in fig. 11 b. The cavity opening times of evaporation can be reduced by preparing the hole injection layer by adopting a solution process, and the process time is shortened.
Step 705: and stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer.
In a specific implementation, the substrate shown in fig. 11b may be soaked in the stripping solution for 1 to 15min, specifically 1 to 7 min; and then baking at 65-85 ℃ to remove the stripping solution, so as to avoid the residue of the stripping solution, and obtaining the structure shown in fig. 11c after stripping.
Wherein the stripping liquid can dissolve the sacrificial layer in the stripping structure, thereby removing the stripping structure. The stripping liquid may be a solvent of perfluoroether or fluoroether, and does not affect the main body of the hole injection layer, and at the same time, the stripping liquid does not dissolve the P-dopant in the hole injection layer.
If the hole injection layer is prepared by a solution process, the solvent of the hole injection layer and the stripping solution used in the solution process are orthogonal to each other, i.e., the stripping solution does not dissolve the hole injection layer.
Step 706: and a hole transport layer, a light emitting layer, an electron transport layer and a cathode layer are sequentially formed on one side of the hole injection layer, which is far away from the substrate.
In a specific implementation, after the patterned hole injection layer is formed, the substrate shown in fig. 11c may be placed back into the evaporation chamber, and the hole transport layer, the light emitting layer, the electron transport layer, the cathode layer, and the like are sequentially evaporated, resulting in the display substrate shown in fig. 11d or fig. 2.
In an alternative implementation manner, each pixel region includes a first sub-pixel region (e.g., a red sub-pixel region as shown in fig. 12, and may also be a green sub-pixel region or a blue sub-pixel region), and referring to fig. 8 and 12, step 602 may include:
step 801: the anode layer is coated with a sacrificial layer and a photoresist in sequence on the side facing away from the substrate.
Step 802: and exposing and developing the photoresist of the second preset region, wherein the orthographic projection of the second preset region on the substrate covers the opening region of each first sub-pixel region.
Step 803: and developing the sacrificial layer to make the developed sacrificial layer retract relative to the developed photoresist.
Step 804: and sequentially forming a hole injection layer material, a hole transport layer material and a light-emitting layer material on the anode layer and one side of the photoresist, which is far away from the substrate.
In a specific implementation, the substrate shown in fig. 12a may be placed in an evaporation chamber, and a hole injection layer material, a hole transport layer material, and a light emitting layer material are sequentially evaporated until evaporation is completed, so as to obtain the structure shown in fig. 12 b.
In another implementation, a solution process such as spin coating or printing may be used to prepare the hole injection layer, the hole transport layer, and the light emitting layer on the substrate shown in fig. 12a, so as to obtain the structure shown in fig. 12 b. The preparation by adopting the solution process can reduce the times of opening the cavity by evaporation and reduce the process time.
Step 805: and stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer, the hole transport layer and the light emitting layer of the first sub-pixel region.
Step 805 is the same as or similar to step 705 above and will not be described further herein. This step, after stripping, results in the structure shown in fig. 12 c.
Then, steps 801 to 805 are repeated, and the preparation of the hole injection layer, the hole transport layer and the light emitting layer of the other sub-pixel regions (green sub-pixel region, blue sub-pixel region, and the like) is completed in sequence. In order to form the hole injection layer, the hole transport layer and the light emitting layer in the green sub-pixel region, the sacrificial layer and the photoresist in the green sub-pixel region need to be exposed and developed to form a lift-off structure as shown in fig. 12d, and then evaporation and lift-off processes are performed to complete the preparation of the organic functional layer in the green sub-pixel region, and the same steps are repeated to complete the preparation of the organic functional layer in the remaining sub-pixel region (e.g., blue sub-pixel region).
Step 806: and after the hole injection layer, the hole transport layer and the light emitting layer of each sub-pixel region are finished, an electron transport layer and a cathode layer are sequentially formed on one side, away from the substrate, of the light emitting layer.
In a specific implementation, after the light emitting layers of all the sub-pixel regions are formed, the substrate may be placed back into the evaporation chamber, and the electron transport layer, the cathode layer, and the like are sequentially evaporated, resulting in the display substrate shown in fig. 12e or fig. 3.
According to the preparation method provided by the embodiment, the high-precision metal mask FMM is not needed to carry out evaporation of the organic functional layer (including the light emitting layer), the cost is reduced, and meanwhile the aperture opening ratio of each sub-pixel region can be improved.
In an alternative implementation manner, each pixel region includes a first sub-pixel region (e.g., a red sub-pixel region shown in fig. 13, and may also be a green sub-pixel region or a blue sub-pixel region), and referring to fig. 9 and 13, step 602 may include:
step 901: the anode layer is coated with a sacrificial layer and a photoresist in sequence on the side facing away from the substrate.
Step 902: and exposing and developing the photoresist of the third preset region, wherein the orthographic projection of the third preset region on the substrate covers the opening region of each first sub-pixel region.
Step 903: and developing the sacrificial layer to make the developed sacrificial layer retract relative to the developed photoresist.
Step 904: and sequentially forming a hole injection layer material, a hole transport layer material, a light-emitting layer material and an electron transport layer material on the anode layer and one side of the photoresist, which is far away from the substrate.
In a specific implementation, the substrate shown in fig. 13a may be placed in an evaporation chamber, and a hole injection layer material, a hole transport layer material, a light emitting layer material, and an electron transport layer material are sequentially evaporated to complete evaporation, so as to obtain the structure shown in fig. 13 b.
In another implementation, a solution process such as spin coating or printing may be used to prepare the hole injection layer, the hole transport layer, the light emitting layer, and the electron transport layer on the substrate shown in fig. 13a, so as to obtain the structure shown in fig. 13 b. The preparation by adopting the solution process can reduce the times of opening the cavity by evaporation and reduce the process time.
Step 905: and stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer, the hole transport layer, the light emitting layer and the electron transport layer of the first sub-pixel region.
Step 905 is the same as or similar to step 705 above and will not be described further herein. This step, after stripping, results in the structure shown in fig. 13 c. Then, steps 901 to 905 are repeated, and the preparation of the hole injection layer, the hole transport layer, the light emitting layer and the electron transport layer of the other sub-pixel regions (green sub-pixel region, blue sub-pixel region, etc.) is completed in sequence.
Step 906: and after the hole injection layer, the hole transport layer, the light emitting layer and the electron transport layer of each sub-pixel region are finished, forming a cathode layer on one side, away from the substrate, of the electron transport layer.
In a specific implementation, after the electron transport layers of all the sub-pixel regions are formed, the substrate may be placed back into the evaporation chamber, and a cathode layer or the like is evaporated, resulting in the display substrate shown in fig. 13d or fig. 4.
According to the preparation method provided by the embodiment, the high-precision metal mask FMM is not needed to carry out evaporation of the organic functional layer (including the light emitting layer), the cost is reduced, and meanwhile the aperture opening ratio of each sub-pixel region can be improved.
In an alternative implementation manner, each pixel region includes a first sub-pixel region (e.g., a red sub-pixel region shown in fig. 14, and may also be a green sub-pixel region or a blue sub-pixel region), and referring to fig. 10 and fig. 14, step 602 may include:
step 1001: the anode layer is coated with a sacrificial layer and a photoresist in sequence on the side facing away from the substrate.
Step 1002: and exposing and developing the photoresist of the fourth preset region, wherein the orthographic projection of the fourth preset region on the substrate covers the opening region of each first sub-pixel region.
Step 1003: and developing the sacrificial layer to make the developed sacrificial layer retract relative to the developed photoresist.
Step 1004: and sequentially forming a hole injection layer material, a hole transport layer material, a light emitting layer material, an electron transport layer material and a cathode material on the anode layer and one side of the photoresist departing from the substrate.
In a specific implementation, the substrate shown in fig. 14a may be placed in an evaporation chamber, and a hole injection layer material, a hole transport layer material, a light emitting layer material, an electron transport layer material, and a cathode layer material are sequentially evaporated to complete evaporation, so as to obtain the structure shown in fig. 14 b.
In another implementation, a solution process such as spin coating or printing may be used to prepare the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the cathode layer on the substrate shown in fig. 14a, so as to obtain the structure shown in fig. 14 b. The preparation by adopting the solution process can reduce the times of opening the cavity by evaporation and reduce the process time.
Step 1005: and stripping the rest sacrificial layer and the photoresist to obtain a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and a cathode layer of the first sub-pixel region.
According to the preparation method provided by the embodiment, the high-precision metal mask FMM is not needed to carry out evaporation on the organic functional layer (including the light emitting layer), so that the cost is reduced, and the aperture opening ratio of the sub-pixel region can be improved.
In the preparation method provided by this embodiment, a series of stripping processes are adopted, so that at least the hole injection layer is patterned, and an open mask does not need to be changed, so that the common hole transport layer is changed into an independent structure between pixels, and the problem of signal crosstalk between adjacent sub-pixel regions is solved.
The embodiment provides a preparation method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a substrate, the substrate comprises a plurality of pixel areas, and each pixel area comprises a plurality of sub-pixel areas; an anode layer, an organic functional layer and a cathode layer which are arranged on one side of the substrate in a stacked manner; the anode layer is arranged close to the substrate, the organic functional layer comprises a hole injection layer which is arranged on one side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region. According to the technical scheme, the hole injection layer is set to be the discontinuous film layer, namely, the hole injection blocks corresponding to the sub-pixel regions are independently set, so that the transverse migration of P-dots of different sub-pixel regions in the hole injection layer is eliminated, the problem of signal crosstalk can be effectively avoided, the color purity is improved, the display performance is improved, and the yield is improved.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the use of the phrase "comprising a. -. said" to define an element does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
The above detailed description is provided for the manufacturing method of the display substrate, the display substrate and the display device, and the principle and the implementation of the present invention are explained in this document by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display substrate, comprising:
a substrate including a plurality of pixel regions, each of the pixel regions including a plurality of sub-pixel regions;
an anode layer, an organic functional layer, and a cathode layer stacked on one side of the substrate;
the anode layer is arranged close to the substrate, the organic functional layer comprises a hole injection layer which is arranged on one side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region.
2. The display substrate of claim 1, wherein the organic functional layer further comprises:
patterning a hole transport layer disposed on a side of the hole injection layer facing away from the substrate;
patterning a light-emitting layer arranged on one side of the hole transport layer, which is far away from the substrate;
wherein the orthographic projections of the hole transport layer and the light emitting layer on the substrate are completely overlapped with the orthographic projection of the hole injection layer on the substrate.
3. The display substrate of claim 2, wherein the organic functional layer further comprises:
patterning an electron transport layer arranged on the side, away from the substrate, of the light-emitting layer, wherein the orthographic projection of the electron transport layer on the substrate is completely overlapped with the orthographic projection of the hole injection layer on the substrate.
4. The display substrate of claim 3, wherein an orthographic projection of the cathode layer on the substrate completely overlaps an orthographic projection of the hole injection layer on the substrate.
5. A display device comprising the display substrate according to any one of claims 1 to 4.
6. A preparation method of a display substrate is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a plurality of pixel regions, and each pixel region comprises a plurality of sub-pixel regions;
forming an anode layer on one side of the substrate;
sequentially forming an organic functional layer and a cathode layer on one side of the anode layer, which is far away from the substrate;
the organic functional layer comprises a hole injection layer which is arranged on the side, away from the substrate, of the anode layer in a patterning mode, the hole injection layer comprises a plurality of hole injection blocks which are arranged in a separated mode, each hole injection block corresponds to different sub-pixel regions, and the orthographic projection of each hole injection block on the substrate covers the opening region of the corresponding sub-pixel region.
7. The method according to claim 6, wherein the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate comprises:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist of a first preset region, wherein the orthographic projection of the first preset region on the substrate covers the opening region of each sub-pixel region;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
forming a hole injection layer material on the anode layer and one side of the photoresist, which is away from the substrate;
stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer;
and sequentially forming a hole transport layer, a light emitting layer, an electron transport layer and the cathode layer on one side of the hole injection layer, which is far away from the substrate.
8. The method according to claim 6, wherein each of the pixel regions includes a first sub-pixel region, and the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist in a second preset area, wherein the orthographic projection of the second preset area on the substrate covers the opening area of each first sub-pixel area;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
sequentially forming a hole injection layer material, a hole transport layer material and a light-emitting layer material on the anode layer and one side of the photoresist, which is away from the substrate;
stripping the remaining sacrificial layer and the photoresist to obtain a hole injection layer, a hole transport layer and a light emitting layer of the first sub-pixel region;
and after the hole injection layer, the hole transport layer and the light emitting layer of each sub-pixel region are finished, an electron transport layer and the cathode layer are sequentially formed on one side, away from the substrate, of the light emitting layer.
9. The method according to claim 6, wherein each of the pixel regions includes a first sub-pixel region, and the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist of a third preset region, wherein the orthographic projection of the third preset region on the substrate covers the opening region of each first sub-pixel region;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
sequentially forming a hole injection layer material, a hole transport layer material, a light-emitting layer material and an electron transport layer material on the anode layer and one side of the photoresist, which is away from the substrate;
stripping the remaining sacrificial layer and the photoresist to obtain a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer of the first sub-pixel region;
and after the hole injection layer, the hole transport layer, the light emitting layer and the electron transport layer of each sub-pixel region are finished, forming the cathode layer on one side, away from the substrate, of the electron transport layer.
10. The method according to claim 6, wherein each of the pixel regions includes a first sub-pixel region, and the step of sequentially forming an organic functional layer and a cathode layer on a side of the anode layer facing away from the substrate includes:
sequentially coating a sacrificial layer and photoresist on one side of the anode layer, which is far away from the substrate;
exposing and developing the photoresist of a fourth preset region, wherein the orthographic projection of the fourth preset region on the substrate covers the opening region of each first sub-pixel region;
developing the sacrificial layer to enable the developed sacrificial layer to retract relative to the developed photoresist;
sequentially forming a hole injection layer material, a hole transport layer material, a light emitting layer material, an electron transport layer material and a cathode material on the anode layer and one side of the photoresist, which is away from the substrate;
and stripping the rest sacrificial layer and the photoresist to obtain the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer and the cathode layer of the first sub-pixel region.
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