CN111850635B - Electroplating system and electroplating method - Google Patents
Electroplating system and electroplating method Download PDFInfo
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- CN111850635B CN111850635B CN201910336048.2A CN201910336048A CN111850635B CN 111850635 B CN111850635 B CN 111850635B CN 201910336048 A CN201910336048 A CN 201910336048A CN 111850635 B CN111850635 B CN 111850635B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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Abstract
The application provides an electroplating system and an electroplating method, the electroplating system comprises a part to be plated, an electroplating bath and a liquid nozzle, the liquid nozzle is positioned in the electroplating bath and used for spraying electroplating liquid to the part to be plated, at least part of the part to be plated is positioned in the electroplating bath, and a first included angle is formed between the part to be plated and a horizontal plane. The electroplating method comprises the following steps: putting a piece to be plated into an electroplating bath, and enabling the piece to be plated to form a first included angle with a horizontal plane; and electrifying the part to be plated, spraying electroplating liquid to the part to be plated through a liquid nozzle, and covering the outer periphery of the part to be plated with the electroplating liquid to finish an electroplating process. The method and the device can reduce the attachment of bubbles in the electroplating liquid on the surface of the part to be plated, so that the whole surface of the part to be plated is plated with the plating layer, and the plating layer is uniform in thickness.
Description
Technical Field
The present disclosure relates to semiconductor technologies, and particularly to an electroplating system and an electroplating method.
Background
In the prior art, bubbles are easily generated in a tinning process of a large-plate product, so that the problems of uneven thickness of a plating layer, no tinning and the like are caused.
In the process of tinning, the electroplating solution is positioned at the bottom of the electroplating bath, the large plate is vertically placed in the bath body, and the large plate is electrified. The liquid medicine is vertically sprayed to the direction of the large plate from the liquid nozzle, so that electroplating is realized.
However, when the liquid medicine is sprayed to the high altitude, air is easily mixed, when the liquid medicine with air touches the large plate, bubbles are formed on the surface of the large plate and accumulated, and cannot be discharged, and the area where the bubbles are formed cannot be contacted with the liquid medicine, so that the plating layer is not deposited, and the problems of uneven thickness, no tin coating and the like are caused.
Disclosure of Invention
The invention provides an electroplating system and an electroplating method, which can reduce the attachment of bubbles in electroplating liquid on the surface of a piece to be plated, thereby achieving the effects that the whole surface of the piece to be plated is plated with a plating layer and the thickness of the plating layer is uniform.
In order to achieve the above object, an embodiment of the present invention provides an electroplating system, which includes a to-be-plated member, an electroplating tank, and a liquid nozzle, where the liquid nozzle is located in the electroplating tank and is configured to spray electroplating liquid onto the to-be-plated member, the to-be-plated member is at least partially located in the electroplating tank, and the to-be-plated member forms a first included angle with a horizontal plane.
Optionally, the first included angle formed between the to-be-plated part and the horizontal plane is 5-15 degrees.
Optionally, the to-be-plated part forms the first included angle with the horizontal plane through a first limiting part, and the first limiting part is a manipulator.
Optionally, a second included angle is formed between the electroplating bath and the horizontal plane, the second included angle is equal to the first included angle, the electroplating bath forms the second included angle with the horizontal plane through a second limiting member, and the to-be-plated part is connected with the electroplating bath; and/or the presence of a gas in the gas,
the liquid nozzle and the horizontal plane form a third included angle, and the third included angle is equal to the first included angle.
Optionally, a gap is arranged between the liquid nozzle and the part to be plated.
Optionally, the electroplating liquid flows back in the vertical direction under the action of its own weight, and the spraying path and the return path of the electroplating liquid are not completely overlapped.
The present application also provides an electroplating method, comprising:
putting a piece to be plated into an electroplating bath, and enabling the piece to be plated to form a first included angle with a horizontal plane;
and electrifying the part to be plated, spraying electroplating liquid to the part to be plated through a liquid nozzle, and covering the outer periphery of the part to be plated with the electroplating liquid to finish an electroplating process.
Optionally, the first included angle formed between the to-be-plated part and the horizontal plane is 5-15 degrees.
Optionally, the to-be-plated part forms the first included angle with the horizontal plane through a first limiting part, and the first limiting part is a manipulator.
Optionally, before the current is applied to the workpiece, the method further includes: forming a second included angle between the electroplating bath and the horizontal plane, wherein the second included angle is equal to the first included angle, the electroplating bath forms the second included angle with the horizontal plane through a second limiting piece, and the part to be plated is connected with the electroplating bath; and/or the presence of a gas in the gas,
and enabling the liquid nozzle to form a third included angle with the horizontal plane, wherein the third included angle is equal to the first included angle.
Optionally, the working temperature adopted in the electroplating process is 15-40 ℃; and/or the presence of a gas in the gas,
the duration of the electroplating process is 5-15 minutes.
And a gap is arranged between the liquid nozzle and the part to be plated.
Optionally, the electroplating liquid flows back in the vertical direction under the action of its own weight, and the spraying path and the return path of the electroplating liquid are not completely overlapped.
According to the electroplating system and the electroplating method provided by the embodiment of the application, the part to be plated forms the first included angle with the horizontal plane, so that bubbles in electroplating liquid can be reduced to be attached to the surface of the part to be plated, the whole surface of the part to be plated is plated with the plating layer, and the plating layer is uniform in thickness.
Drawings
Fig. 1 is a schematic diagram of an internal structure of an electroplating system according to an exemplary embodiment of the present disclosure.
Fig. 2 is a schematic view of the internal structure of an electroplating system according to another exemplary embodiment of the present disclosure.
FIG. 3 is a flow chart of an electroplating method according to an example embodiment of the present disclosure.
Description of the reference numerals
Plating liquid 13
To-be-plated part 15
First included angle alpha
Second included angle beta
Third included angle gamma
Arrow A
Arrow B
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" means two or more. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper" and/or "lower," and the like, are used for convenience of description and are not limited to a single position or orientation in space. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
According to various embodiments of the present disclosure, an electroplating system and an electroplating method are provided.
As shown in fig. 1, an electroplating system 10 of the present disclosure includes an electroplating tank 11, a liquid nozzle 12 and a workpiece 15 to be plated, wherein the liquid nozzle 12 is located in the electroplating tank 11 and is used for spraying an electroplating liquid 13 toward the workpiece 15 to be plated, the workpiece 15 is at least partially located in the electroplating tank 11 and is located above the liquid nozzle 12, and the workpiece 15 forms a first included angle α with a horizontal plane 30. Thus, the first included angle alpha is formed between the workpiece 15 to be plated and the horizontal plane 30, so that the bubbles 40 in the electroplating liquid 13 can be reduced from attaching to the surface of the workpiece 15 to be plated, and the effects that the whole surface of the workpiece 15 to be plated is plated and the thickness of the plated layer is uniform are achieved.
Through a great number of experiments, the inventors (a) have found that, in some embodiments, the first included angle α formed between the workpiece 15 and the horizontal plane 30 is 5 degrees to 15 degrees, and the electroplating effect is better. Specifically, when the first included angle α formed between the workpiece 15 and the horizontal plane 30 is 6 degrees, the electroplating effect is optimal.
The plating liquid is refluxed in the vertical direction under the action of its own weight, and the spray path and the reflux path of the plating liquid do not completely coincide.
In this embodiment, the workpiece 15 is a plate, but is not limited to a plate, and may also be a workpiece 15 with other shapes.
The specific working principle is as follows: the electroplating liquid 13 with bubbles is sprayed to the surface of the workpiece 15 along the direction of arrow A, and the sprayed electroplating liquid 13 reflows due to the action of gravity because the workpiece 15 forms a first included angle alpha with the horizontal plane 30, so that part of the bubbles 40 attached to the top of the workpiece 15 are eliminated, as shown by the direction of arrow B; meanwhile, since the workpiece 15 forms a first included angle α with the horizontal plane 30, that is, the workpiece 15 is placed obliquely to the horizontal plane 30, and the bubbles 40 are relatively light, and will be intensively discharged in the oblique direction (the upper left corner direction in fig. 1).
In the present embodiment, the workpiece 15 passes through a first angle α formed between the first limiting member and the horizontal plane 30. Specifically, the first limiting member is a manipulator, and the workpiece 15 to be plated is clamped by the manipulator to control a first included angle α formed between the workpiece 15 to be plated and the horizontal plane 30. The first limiting member is not limited to a manipulator, and may also be an inclined bracket to form the first included angle α between the workpiece 15 to be plated and the horizontal plane 30, or another member to form the first included angle α between the workpiece 15 to be plated and the horizontal plane 30.
In other embodiments, as shown in FIG. 2, plating bath 11 forms a second angle β with horizontal plane 30, where the second angle β is equal to the first angle α. Thus, the entire volume of the plating tank 11 can be reduced, thereby saving costs. The plating tank 11 may form a second included angle β with the horizontal plane 30 through a second limiting member. Specifically, the second limiting member is a single-sided leg to elevate one end of the bottom of the electroplating tank 11, so that the electroplating tank 11 and the horizontal plane 30 form a second included angle β. And, the workpiece 15 can be connected with the electroplating bath 11, so that the workpiece 15 and the horizontal plane 30 form a first included angle alpha. The second limiting member is not limited to a single-side leg, and may be an inclined bracket to form a second included angle β between the plating tank 11 and the horizontal plane 30, or other members to form a second included angle β between the plating tank 11 and the horizontal plane 30.
Further, the liquid nozzle 12 may form a third included angle γ with the horizontal plane 30, where the third included angle γ is equal to the first included angle α. In this way, the length of the liquid nozzle 12 and the height of the required spray can be saved, thereby saving costs.
In this embodiment, a gap 14 is provided between the liquid nozzle 12 and the workpiece 15. A gap 14 is arranged between the liquid nozzle 12 and the workpiece 15 to ensure that the liquid nozzle 12 is not in contact with the workpiece 15, thereby ensuring the uniformity of the plating liquid 13 sprayed by the liquid nozzle 12 on the workpiece 15.
In the electroplating process, the workpiece 15 to be plated is placed in the electroplating bath 11, and a first included angle alpha is formed between the workpiece 15 to be plated and the horizontal plane 30; the workpiece 15 is electrified, the plating liquid 13 is sprayed to the workpiece 15 through the liquid nozzle 12, and the plating liquid 13 covers the outer periphery of the workpiece 15 to complete the plating process. Thus, the first included angle alpha is formed between the workpiece 15 to be plated and the horizontal plane 30, so that the bubbles 40 in the electroplating liquid 13 can be reduced from attaching to the surface of the workpiece 15 to be plated, and the effects that the whole surface of the workpiece 15 to be plated is plated and the thickness of the plated layer is uniform are achieved.
The present disclosure also provides an electroplating method. Fig. 3 is a flow chart of a proposed electroplating method according to an example embodiment of the present disclosure. As shown in fig. 3, the plating method includes the steps of:
step 100: putting a piece to be plated into an electroplating bath, and enabling the piece to be plated to form a first included angle with a horizontal plane;
step 200: and electrifying the part to be plated, spraying electroplating liquid to the part to be plated through a liquid nozzle, and covering the outer periphery of the part to be plated with the electroplating liquid to finish an electroplating process.
In step 100, as shown in fig. 2, the bubbles 40 in the plating liquid 13 can be reduced from adhering to the surface of the workpiece 15 by forming a first included angle α between the workpiece 15 and the horizontal plane 30, so that the entire surface of the workpiece 15 is plated with a uniform plating thickness.
The specific working principle is as follows: the electroplating liquid 13 with bubbles is sprayed to the surface of the workpiece 15 along the direction of arrow A, and the sprayed electroplating liquid 13 reflows due to the action of gravity because the workpiece 15 forms a first included angle alpha with the horizontal plane 30, so that part of the bubbles 40 attached to the top of the workpiece 15 are eliminated, as shown by the direction of arrow B; meanwhile, since the workpiece 15 forms a first included angle α with the horizontal plane 30, that is, the workpiece 15 is placed obliquely to the horizontal plane 30, and the bubbles 40 are relatively light and will be intensively discharged along the oblique direction (the upper left corner direction in the figure).
Through a great number of experiments, the inventors (a) have found that, in some embodiments, the first included angle α formed between the workpiece 15 and the horizontal plane 30 is 5 degrees to 15 degrees, and the electroplating effect is better. Specifically, when the first included angle α formed between the workpiece 15 and the horizontal plane 30 is 6 degrees, the electroplating effect is optimal.
In the present embodiment, the workpiece 15 passes through a first angle α formed between the first limiting member and the horizontal plane 30. Specifically, the first limiting member is a manipulator, and the workpiece 15 to be plated is clamped by the manipulator to control a first included angle α formed between the workpiece 15 to be plated and the horizontal plane 30. The first limiting member is not limited to a manipulator, and may also be an inclined bracket to form the first included angle α between the workpiece 15 to be plated and the horizontal plane 30, or another member to form the first included angle α between the workpiece 15 to be plated and the horizontal plane 30.
In other embodiments, as shown in fig. 2, before step 200, that is, before energizing the workpiece 15, the method further includes: so that the plating bath 11 and the horizontal plane 30 form a second included angle beta, which is equal to the first included angle alpha. Thus, the entire volume of the plating tank 11 can be reduced, thereby saving costs.
The plating tank 11 may form a second included angle β with the horizontal plane 30 through a second limiting member. Specifically, the second limiting member is a single-sided leg to elevate one end of the bottom of the electroplating tank 11, so that the electroplating tank 11 and the horizontal plane 30 form a second included angle β. And, the workpiece 15 can be connected with the electroplating bath 11, so that the workpiece 15 and the horizontal plane 30 form a first included angle alpha. The second limiting member is not limited to a single-side leg, and may be an inclined bracket to form a second included angle β between the plating tank 11 and the horizontal plane 30, or other members to form a second included angle β between the plating tank 11 and the horizontal plane 30.
Before step 200, namely before the power is applied to the workpiece 15 to be plated, the method further comprises: the liquid nozzle 12 forms a third angle γ with the horizontal plane 30, which is equal to the first angle α. In this way, the length of the liquid nozzle 12 and the height of the required spray can be saved, thereby saving costs.
In step 200, the inventors (or the inventors) have found through a great deal of experiments that, in some embodiments, the working temperature of the electroplating process is 15 ℃ to 40 ℃, and the electroplating effect is better.
The inventors have found through a great deal of experiments that, in some embodiments, the duration of the electroplating process is 5 minutes to 15 minutes, and the electroplating effect is better.
The electroplating system and the electroplating method of the embodiment are not only suitable for electroplating metallic tin, but also suitable for electroplating other metal materials, and can achieve the effect that the whole surface of the workpiece 15 to be plated is plated with a plating layer and the thickness of the plating layer is uniform.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Claims (10)
1. An electroplating system is characterized by comprising a to-be-plated part, an electroplating bath and a liquid nozzle, wherein the liquid nozzle is positioned in the electroplating bath and used for spraying electroplating liquid to the to-be-plated part, at least part of the to-be-plated part is positioned in the electroplating bath, a first included angle is formed between the to-be-plated part and the horizontal plane, and the first included angle is 5-15 degrees; the surface to be plated of the part to be plated comprises a bottom edge, and the first included angle is an included angle formed by the bottom edge and a horizontal plane; the liquid nozzle and the horizontal plane form a third included angle which is equal to the first included angle; and the liquid nozzle sprays the electroplating liquid to the surface to be plated of the piece to be plated from one side of the bottom edge of the piece to be plated.
2. The plating system of claim 1, wherein the workpiece forms the first angle with the horizontal plane via a first stop, and the first stop is a robot.
3. The electroplating system of claim 1, wherein the electroplating bath forms a second included angle with the horizontal plane, the second included angle is equal to the first included angle, the electroplating bath forms the second included angle with the horizontal plane through a second limiting member, and the to-be-plated part is connected with the electroplating bath.
4. The plating system according to any one of claims 1 to 3, wherein a gap is provided between the liquid nozzle and the member to be plated.
5. The plating system according to claim 1, wherein the plating liquid is refluxed in a vertical direction by its own weight, and a spray path and a reflux path of the plating liquid do not completely coincide.
6. An electroplating method, comprising:
putting a to-be-plated piece into an electroplating bath, and enabling the to-be-plated piece to form a first included angle with the horizontal plane, wherein the first included angle is 5-15 degrees; the surface to be plated of the part to be plated comprises a bottom edge, and the first included angle is an included angle formed by the bottom edge and a horizontal plane;
electrifying the part to be plated, spraying electroplating liquid to the part to be plated through a liquid nozzle, and covering the outer periphery of the part to be plated with the electroplating liquid to finish an electroplating process; the liquid nozzle and the horizontal plane form a third included angle which is equal to the first included angle; and the liquid nozzle sprays the electroplating liquid to the surface to be plated of the piece to be plated from one side of the bottom edge of the piece to be plated.
7. The plating method according to claim 6, wherein the workpiece to be plated forms the first angle with the horizontal plane via a first stopper, and the first stopper is a robot.
8. The electroplating method according to claim 6, wherein a second included angle is formed between the electroplating bath and the horizontal plane, the second included angle is equal to the first included angle, the electroplating bath forms the second included angle with the horizontal plane through a second limiting member, and the member to be plated is connected with the electroplating bath.
9. The plating method according to claim 6, wherein the working temperature used in the plating step is 15 to 40 ℃; and/or the presence of a gas in the gas,
the duration of the electroplating process is 5-15 minutes.
10. The plating method according to claim 6, wherein the plating liquid is refluxed in a vertical direction by its own weight, and a spray path and a reflux path of the plating liquid do not completely coincide.
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| CN201910336048.2A CN111850635B (en) | 2019-04-24 | 2019-04-24 | Electroplating system and electroplating method |
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| CN201910336048.2A CN111850635B (en) | 2019-04-24 | 2019-04-24 | Electroplating system and electroplating method |
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| CN111850635B true CN111850635B (en) | 2022-03-25 |
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| CN105019006A (en) * | 2015-07-17 | 2015-11-04 | 深圳市华祥电路科技有限公司 | Electroplating bath |
| CN105970260A (en) * | 2016-04-25 | 2016-09-28 | 江苏师范大学 | Method for improving homogeneity in jet electrodeposition processing process |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1390268A (en) * | 1999-11-09 | 2003-01-08 | 西门子公司 | Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| CN1659686A (en) * | 2002-06-06 | 2005-08-24 | 株式会社荏原制作所 | Substrate processing apparatus and substrate processing method |
| CN204342899U (en) * | 2014-12-05 | 2015-05-20 | 大碇电脑配件(上海)有限公司 | A kind of galvanizing rig of electronic product handware |
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