CN111849735A - A chip with a composite layer and its application in biological detection - Google Patents

Abstract

The present invention provides a chip with a composite layer and its application in biological detection. The chip includes at least a first base layer and a second base layer disposed up and down, and at least one base layer leading to a second base layer is disposed on the first base layer. The first blind hole of the second base layer, the chip is also provided with at least one metallized via hole passing through the second base layer, the electrode is provided under the first blind hole, and the chip is provided with a contact, The electrodes are connected with the contacts through lines. The invention combines plastic and metal to develop a chip with a composite layer. The basic function of the chip is realized through the rational layout of the base layer, circuit layer and internal circuit of the chip, and the production is simple and the cost is low.

Description

A chip with a composite layer and its application in biological detection

technical field

The invention belongs to the technical field of chips, and particularly relates to a chip with a composite layer and its application in biological detection.

Background technique

With the rapid development of electronics and information technology, our country has entered the information age. As miniature integrated circuits, chips are widely used in various electronic products and systems such as computers, mobile phones, home appliances, automobiles, high-speed rail, power grids, medical instruments, robots, and industrial control. They are the core cornerstone of high-end manufacturing. The chip is composed of a base layer and a circuit. The base layer is made of a single crystal silicon wafer, and a metal-oxide semiconductor field effect transistor (MOSFET) or bipolar type is made by lithography, doping, chemical mechanical polishing (CMP) and other technologies. Transistor (BJT) and other components, and then use thin film and CMP technology to make circuits to complete chip production.

At present, the mainstream chip base layer is monocrystalline silicon. In electronic components and chips made of silicon crystals, carriers can be transported rapidly with a high mobility of 0.1 m ² /Vs. However, the current silicon crystal production process is very expensive, and the consumer electronics industry, which has a huge demand, is often unable to bear this excessively high cost, and is not conducive to the promotion and use of chips. Therefore, researchers are devoted to finding and developing other cheap alternatives. Plastic has entered the field of vision of scientists as a cheap and extremely malleable material. At present, the main research direction is the physical and chemical modification of insulating plastic materials to make them conductive. For example, Austrian scientists used plastics such as polystyrene to successfully create a solar cell with an efficiency of 3%; in 2011, scientists at the Belgian Microelectronics Research Center developed a prototype of a plastic chip; Philips of the Netherlands launched a thin, flexible The plastic computer display screen of this kind of display is made of plastic-based semiconductors; Japanese scientists have developed flexible conductive plastics containing hundreds of organic computer chips, and new types of flat-panel displays and electronic labels have been made using this conductive plastic. . Although research on plastic-based semiconductors or conductive plastics has yielded some results, there is still a long way to go before large-scale, low-cost applications.

Nowadays, the packaging materials of chips are generally plastic and metal, which are suitable for most chip application scenarios. If ordinary plastic materials can be applied to the base layer of the chip, the production cost of the chip will be greatly reduced. However, this is a problem.

Patent CN201710699800.0 discloses an online automatic monitoring system for dirty areas based on wireless remote control. The conductance sensor of the system includes an insulating plastic substrate with a wavy upper surface, and the upper surface of the insulating plastic substrate is plated with insulating porcelain and insulating plastic. Both ends of the base material are provided with metal clips, the metal clips are closely attached to the insulating porcelain, and the outer circumference of the metal clips is covered with a protective sleeve. to the motherboard. The invention connects electrodes on the metal clip to realize the operation of the entire monitoring system.

In addition, the chip has important application value in the biological field, especially in the field of genetic testing. The chip can replace the traditional laser lens, fluorescent dye, etc. to become a new sequencer. Applications are the way of the future. At present, the next-generation gene sequencing technology uses nano-sized pores as sensors. When nucleic acid molecules pass through the nano-pore, the ionic current passing through each nano-pore is detected. The gene sequence of each genome segment. For example, patent CN201810019657.0 discloses a disposable nanoporous biosensor, which includes a substrate, an electrode layer and a top cover that are stacked in sequence. The top cover is provided with micropores with a diameter of 5-200 μm, and the micropores are used for Nanopores and phospholipid films are injected, the substrate and the top cover are both plastic layers, the electrodes are a pair of silver electrodes arranged on the surface of the substrate, the micropores are opened on the insulating cover, the insulating cover covers the surface of a silver electrode, and the micropores It is placed on top of the silver electrode so that the silver electrode is only exposed through the micropores.

Patent CN200880126160.3 discloses a method of forming a layer separating two volumes of an aqueous solution, in which the upper part of the formed device is a device containing a chamber, and the lower part includes at least one non-conductive material leading to a groove leading to the chamber The main body of the device, a biolayer lipid membrane (BLM) is formed between the chamber and the groove, the device has a pair of electrodes, the upper electrode is located in the chamber and leads out of the chamber, and the lower electrode is located in the lower part of the groove and leads out the non-conductive material main body.

As the chip is gradually used in nanopore genetic testing, the structure of the chip should meet the requirements of mass genetic testing, making the structure more reasonable, the operation more convenient, and the functions more diverse. The invention combines the plastic material and the metal material to develop a chip with a composite layer, and through the rational layout of the composite layer of the chip, the basic function of the chip applied to the nanopore gene detection is realized.

SUMMARY OF THE INVENTION

In order to achieve the above purpose, the present invention provides a chip with a composite layer, the chip includes at least a first base layer and a second base layer arranged up and down, and at least one base layer leading to the second base layer is provided on the first base layer. A first blind hole, the chip is also provided with at least one metallized via hole passing through the second base layer, an electrode is provided under the first blind hole, the chip is provided with a contact, the The electrodes and the contacts are connected by wires.

A first electrode is further provided on the upper and lower surfaces of the first base layer or above the first base layer, the chip is further provided with a first contact, and the first electrode is connected with the first contact through a circuit.

Preferably, the second base layer is provided with an inner layer circuit, more preferably, the inner wall of the metallized via has an inner layer circuit extending outward, and the inner layer circuit extends and is embedded in the first base layer and The inside of the second base layer becomes an interconnection circuit; the interconnection circuit can extend to and connect to other circuit components inside the chip to realize interconnection of multiple components, which is beneficial for the chip to realize multiple functional applications.

Preferably, at least one third base layer is further arranged between the first base layer and the second base layer. More preferably, 1-5 third base layers are further arranged between the first base layer and the second base layer. For example, 1, 2, 3, 4 or 5 third base layers are further arranged between the first base layer and the second base layer.

In one form of the chip of the present invention, the first base layer is further provided with at least one second blind hole leading to the second base layer, and the second blind hole is provided with a first electrode below. At least two metallized via holes penetrating the second base layer are arranged on the chip, and inner layer lines are arranged on the outer walls of the metallized via holes. The first electrode is communicated with the first metallized via hole through a metal line, and the electrode is communicated with the second metallized via hole through the metal line. The inner layer line of the first metallized via or the first metallization via is provided with a first contact on the extended metal line on the lower surface of the second base layer; the inner layer line of the second metallization via or The second metallized via is provided with a contact on the extended metal line on the lower surface of the second base layer.

In a specific embodiment of the present invention, the first base layer is provided with a second blind hole leading to the second base layer, a first electrode is provided under the second blind hole, and the first electrode extends through the The metal circuit communicates with the first metallized via, and the first contact is arranged on the extended metal circuit of the first metallized via on the lower surface of the second base layer; the first metallized via and the second The metallized via passes through the second base layer, but does not penetrate the first base layer; the first metallized via hole and the second metallized via hole are provided with inner layer lines in the second base layer, and the inner layer lines surround The hole walls of the first metallized via and the second metallized via are spread out. The contact is located on the extended metal line of the second metallized via on the lower surface of the second base layer. The electrodes are arranged at the bottom of the first blind holes, and are connected to the second metallized vias by extending metal lines, thereby indirectly connecting the inner layer lines and the annular metal lines on the lower surface of the second base layer, and then connecting the contacts. point.

When in use, the first contact and the contact are connected to a power source, so that a voltage can be formed between the first electrode and the electrode, and a conductive medium is connected above the first blind hole and the second blind hole.

In another form of the chip according to the present invention, the first electrode is arranged on the upper surface of the first base layer, preferably, the first electrode is arranged at the upper edge of the first metallized via hole, more preferably, the The first electrode is arranged near the upper end of the first metallized via.

The electrode is arranged on the lower surface of the bottom of the first base layer and passes through the bottom of the first blind hole, more preferably, the electrode is arranged between the first base layer and the second base layer, more preferably, the electrode Covering the entire bottom surface of the first blind hole, particularly preferably, the electrode extends to the second metallized via hole.

The first blind hole is located on the first base layer, the bottom of the first blind hole is provided with an electrode, and the first blind hole, the first electrode and the electrode constitute a hole electrode.

The first contact is located on the extended metal line of the first metallized via on the upper surface of the first base layer or the lower surface of the second base layer, and the contact is located on the upper surface of the second metallized via or the first base layer. The extended metal lines on the lower surface of the second base layer. The first electrode can be connected to the first contact through a first metallized via on the ring metal circuit on the upper surface of the first base layer or the lower surface of the second base layer and the inner layer circuit, and the electrode can pass through the second metallized through hole Ring-shaped metal lines and inner-layer lines on the upper surface of the first base layer or the lower surface of the second base layer connect the contacts.

More preferably, the metal circuit and the inner layer circuit are copper foils.

The materials of the first base layer and the second base layer are plastics.

Preferably, the material of the first base layer is plastic, preferably, the material of the first base layer is polyimide resin board, FR-4 board, FR-1 board or CEM-1/3 board, more preferably Yes, the FR-4 board is a glass fiber board or an epoxy resin board with FR-4 grade. In a specific embodiment of the present invention, the material of the first base layer is a polyimide resin board.

The thickness of the first base layer is 0.05-0.5mm, preferably, the thickness of the first base layer is 0.08-0.2mm. In a specific embodiment of the present invention, the thickness of the first base layer is 0.1 mm.

The first blind hole and the second blind hole are arranged on the upper surface of the first base layer, preferably, the first blind hole and the second blind hole are circular holes; preferably, the first blind hole The hole diameter of the first blind hole is 0.05-0.2mm, and more preferably, the hole diameter of the first blind hole is 0.1-0.15mm. The first blind hole can be formed by laser drilling technology. Preferably, the diameter of the second blind hole is 0.5-2 mm, and more preferably, the diameter of the second blind hole is 1-1.5 mm. The second blind hole can be formed by laser drilling technology.

The material of the second base layer is plastic, preferably, the material of the second base layer is polyimide resin board, FR-4 board, FR-1 board or CEM-1/3 board, more preferably, the The material of the second base layer is FR-4 board, more preferably, the FR-4 board is a glass fiber board or an epoxy resin board with FR-4 grade. In a specific embodiment of the present invention, the material of the second base layer is FR-4 epoxy resin board.

The materials of the first base layer and the second base layer are insulated to ensure that the current signal of the chip can only be conducted by the metal circuit and the inner layer circuit, which facilitates the design of metal circuits and inner layer circuits of different structures according to actual needs; the The materials of the first base layer and the second base layer are corrosion-resistant, and while ensuring a certain strength, they also have strong impact resistance, so that the chip has a wide range of applications; the first base layer and the second base layer materials have strong plasticity , it is convenient to use PCB processing technology to make chips.

In a specific embodiment of the present invention, the chip includes a first base layer and a second base layer.

In another specific embodiment of the present invention, the chip includes a first base layer, a second base layer, and a third base layer between the first base layer and the second base layer.

The present invention also provides the application of the chip in biological detection, preferably, the application of the chip in nucleic acid sequencing, more preferably, the application of the chip in nanopore nucleic acid sequencing.

The inner layer circuit of the chip can be connected with the required detection and analysis equipment, the hole electrode, the first contact and the contact of the chip are connected to the current, and the current is then conducted to the required detection and analysis equipment through the inner layer circuit, so , the chip can control the detection and analysis equipment.

The present invention also provides the application of the chip as a chip for biological monitoring, preferably, the application of the chip as a chip of a nucleic acid sequencing device, and more preferably, the application of the chip as a chip of a nanopore sequencing device. Compared with the chip of silicon base material, the chip can realize the circuit arrangement among the multi-layer base layers, and has low cost and simple process.

Description of drawings

Fig. 1 is a chip structure diagram of the present invention.

FIG. 2 is an optional chip structure diagram of the present invention.

FIG. 3 is a structural diagram of the application of the chip of the present invention in a nanopore gene sequencing device.

FIG. 4 is a structural diagram of the chip of the present invention applied to an optional nanopore gene sequencing device.

FIG. 5 is a structural view of the top surface of the chip of the present invention.

FIG. 6 is an optional chip structure diagram of the present invention.

In the drawings, 1-first base layer, 2-second base layer, 3-first blind hole, 4-metal circuit, 401-first electrode, 402-electrode, 5-first metallized via, 501-th Two metallized vias, 6-inner layer circuit, 7-first contact, 8-contact, 9-third base layer, 10-electrolyte chamber, 11-phospholipid layer membrane, 12-second blind hole.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

The present invention provides a chip with a composite layer, the chip includes at least a first base layer 1 and a second base layer 2 disposed up and down, and at least one base layer leading to the second base layer 2 is disposed on the first base layer 1 The first blind hole 3, the chip is also provided with at least one metallized via hole passing through the second base layer 2, the electrode 402 is provided under the first blind hole 3, the chip is provided with a contact 8, and the electrode 402 is connected with the first blind hole 3. The contacts 8 are connected by wires.

All metal lines in the following examples are copper foils.

Example 1

The chip structure of this embodiment is shown in FIG. 1 , the first base layer 1 is located on the upper part of the chip, the first base layer 1 is a polyimide resin board, and the thickness of the first base layer 1 is 0.1 mm; the first base layer 1 is provided with holes Electrode, the upper surface of the first base layer 1 is provided with a first blind hole 3, the first blind hole 3 is a circular hole with a diameter of 0.1mm, the first blind hole 3 is formed by the technology of laser drilling, the first blind hole 3 There is a metal circuit 4 at the bottom of the metal circuit 4, the first blind hole 3 and the metal circuit 4 constitute a hole electrode; the first electrode 401 is arranged near the upper end of the first metallized via hole 5, and the electrode 402 is arranged on the first base layer 1 and the second base layer 2 and cover the entire bottom surface of the first blind hole 3, the electrode 402 extends to the second metallized via 501; the second base layer 2 is located under the first base layer 1, and is close to the first base layer 1, the second base layer 2 is an FR-4 epoxy resin sheet; the first metallized vias 5 and the second metallized vias 501 penetrate the first base layer 1 and the second base layer 2, and the first metallized vias 5 and the second metallized vias The inner layer circuit 6 is arranged on the hole wall of 501, the multiple metal circuits of the inner layer circuit 6 extend into the first base layer 1 and the second base layer 2, the metal circuit 4 of the hole electrode and the inner layer of the second metallized via hole 501 The line 6 is connected; the first contact 7 is arranged on the metal line on the top or bottom of the first metallized via 5, the contact 8 is arranged on the metal line on the top or bottom of the second metallized via 501, the first The electrode 401 is connected to the first contact 7 through the metal circuit of the first metallized via 5 and the inner layer circuit 6, and the electrode 402 is connected to the contact 8 through the metal circuit of the second metallized via 501 and the inner layer circuit 6 to realize interconnection , and further realize the circuit arrangement of the first base layer 1 and the second base layer 2 .

Example 2

The chip structure of this embodiment is shown in FIG. 2 , the first base layer 1 is located on the upper part of the chip, the first base layer 1 is a polyimide resin board, and the thickness of the first base layer 1 is 0.1 mm; the first base layer 1 is provided with holes Electrode, the upper surface of the first base layer 1 is provided with a first blind hole 3, the first blind hole 3 is a circular hole with a diameter of 0.1mm, the first blind hole 3 is formed by the technology of laser drilling, the first blind hole 3 There is a metal circuit 4 at the bottom of the hole, the first blind hole 3 and the metal circuit 4 constitute a hole electrode; the first electrode 401 is arranged near the upper end of the first metallized via 5, and the electrode 402 is arranged on the first base layer 1 and the third base layer 9 and cover the entire bottom surface of the first blind hole 3, the electrode 402 extends to the second metallized via 501; the third base layer 9 is located under the first base layer 1, and is close to the first base layer 1, the second base layer 2 is located below the third base layer 9 and is close to the third base layer 9, the second base layer 2 and the third base layer 9 are both FR-4 epoxy resin sheets; the first metallized via 5 and the second metallized via 501 runs through the first base layer 1 , the third base layer 9 and the second base layer 2 , the inner layer circuit 6 is provided on the hole wall of the first metallized via hole 5 and the second metallized via hole 501 , and a plurality of inner layer circuits 6 are provided. The metal circuit extends into the first base layer 1, the third base layer 9 and the second base layer 2, the metal circuit 4 of the hole electrode is connected with the inner layer circuit 6 of the second metallized via 501; the first contact 7 is arranged on the first metal On the top or bottom metal line of the metallized via 5, the contact 8 is arranged on the top or bottom metal line of the second metallized via 501, and the first electrode 401 passes through the metal line of the first metallized via 5 and The inner layer circuit 6 is connected to the first contact 7, and the electrode 402 is connected to the contact 8 through the metal circuit of the second metallized via 501 and the inner layer circuit 6 to realize interconnection, thereby realizing the first base layer 1, the third base layer 9 and the first base layer 9. The circuit arrangement of the second base layer 2.

Example 3

The structure of the chip applied in the nanopore gene sequencing device is shown in FIG. 3 , the first base layer 1 is located on the upper part of the chip, the first base layer 1 is a polyimide resin board, and the thickness of the first base layer 1 is 0.1 mm. The upper part of the chip is provided with an electrolyte chamber 10 for accommodating the electrolyte containing the DNA detection sample; the first base layer 1 is provided with a hole electrode, and the upper surface of the first base layer 1 is provided with a first blind hole 3, the first blind hole 3 is a circular hole with a diameter of 0.1 mm. The first blind hole 3 is formed by laser drilling technology. The bottom of the first blind hole 3 is provided with a metal circuit 4, and the first blind hole 3 and the metal circuit 4 constitute a hole electrode. The first electrode 401 is arranged near the upper end of the first metallized via 5, the electrode 402 is arranged between the first base layer 1 and the second base layer 2, and covers the entire bottom surface of the first blind hole 3, and the electrode 402 extends to the second Metallized vias 501 . The second base layer 2 is located below the first base layer 1 and is close to the first base layer 1 , and the second base layer 2 is an FR-4 epoxy resin board. The first metallization via hole 5 and the second metallization via hole 501 penetrate through the first base layer 1 and the second base layer 2 and are located outside the electrolyte chamber 10 . The first metallization via hole 5 and the second metallization via hole 501 There is an inner layer circuit 6 on the wall of the hole, the multiple metal circuits of the inner layer circuit 6 extend into the first base layer 1 and the second base layer 2, the metal circuit 4 of the hole electrode and the inner layer circuit of the second metallized via 501 6 connections. The first contact 7 is arranged on the metal line on the top or bottom of the first metallized via 5, the contact 8 is arranged on the metal line on the top or bottom of the second metallized via 501, and the first electrode 401 passes through the The metal circuit of a metallized via 5 and the inner layer circuit 6 are connected to the first contact 7, and the electrode 402 is connected to the contact 8 through the metal circuit of the second metallized via 501 and the inner layer circuit 6 to realize interconnection, thereby realizing the first contact. Circuit arrangement of a base layer 1 and a second base layer 2.

A phospholipid bilayer membrane 11 is arranged between the electrolyte chamber 10 and the first blind hole 3, so that the electrolyte chamber 10 and the first blind hole 3 form two chambers. For the protein with nanopore structure, when the first contact 7 and the contact 8 are powered on, that is, after the first electrode 401 and the electrode 402 are powered on, the DNA detection sample in the electrolyte chamber 10 moves under the action of the current, and Enter the first blind hole 3 through the nanopore of the protein, and record the current changes of different bases on the DNA when passing through the nanopore, and analyze the DNA sequence.

Example 4

The structure of the chip applied to an optional nanopore gene sequencing device is shown in Figure 4. The first base layer 1 is located on the upper part of the chip, the first base layer 1 is a polyimide resin plate, and the thickness of the first base layer 1 is 0.1mm . The upper part of the chip is provided with an electrolyte chamber 10 for accommodating the electrolyte containing the DNA detection sample; the first base layer 1 is provided with a hole electrode, and the upper surface of the first base layer 1 is provided with a first blind hole 3, the first blind hole 3 is a circular hole with a diameter of 0.1 mm. The first blind hole 3 is formed by laser drilling technology. The bottom of the first blind hole 3 is provided with a metal circuit 4, and the first blind hole 3 and the metal circuit 4 constitute a hole electrode. The first electrode 401 is arranged on the upper part of the electrolyte chamber 10 and extends to the outside for connecting the power supply. The electrode 402 is arranged between the first base layer 1 and the second base layer 2 and covers the entire bottom surface of the first blind hole 3. The electrode 402 extends to the second metallized via 501 . The second base layer 2 is located below the first base layer 1 and is close to the first base layer 1 , and the second base layer 2 is an FR-4 epoxy resin board. The second metallized via hole 501 penetrates through the first base layer 1 and the second base layer 2 and is located outside the electrolyte chamber 10 . The inner layer circuit 6 is provided on the hole wall of the second metallized via hole 501 . A plurality of metal lines extend into the first base layer 1 and the second base layer 2 , and the metal lines 4 of the hole electrodes are connected to the inner layer lines 6 of the second metallized vias 501 . The first contact 7 is arranged on the first electrode 401, the contact 8 is arranged on the metal line on the top or bottom of the second metallized via 501, and the electrode 402 passes through the metal line and the inner layer of the second metallized via 501 The lines 6 are connected to the contacts 8 to realize interconnection, thereby realizing the circuit arrangement of the first base layer 1 and the second base layer 2 .

A phospholipid bilayer membrane 11 is arranged between the electrolyte chamber 10 and the first blind hole 3, so that the electrolyte chamber 10 and the first blind hole 3 form two chambers. For the protein with nanopore structure, when the first contact 7 and the contact 8 are powered on, that is, after the first electrode 401 and the electrode 402 are powered on, the DNA detection sample in the electrolyte chamber 10 moves under the action of the current, and Enter the first blind hole 3 through the nanopore of the protein, and record the current changes of different bases on the DNA when passing through the nanopore, and analyze the DNA sequence.

Example 5

The top surface structure of the chip is shown in FIG. 5 , the first contact 7 is located on the extended metal line of the first metallized via 5 on the upper surface of the first base layer 1 , and the first electrode 401 is located on the first base layer 1 through the metallized via 5 The ring-shaped metal circuit on the upper surface is connected to the first contact 7, the electrode 402 is located at the bottom of the first blind hole 3, and the electrode 402 is connected to the contact through the inner wall of the second metallized via 501 and the ring-shaped metal circuit on the upper surface of the first base layer 1 8.

Example 6

The chip structure of this embodiment is shown in FIG. 6 , the first base layer 1 is provided with a second blind hole 12 leading to the second base layer 2 , and a first electrode 401 is provided under the second blind hole 12 . The first electrode 401 The extended metal line 4 communicates with the first metallized via hole 5, and the first contact 7 is provided on the extended metal line of the first metallized via hole 5 on the lower surface of the second base layer 2; the first metallized via hole 5 and The second metallized via hole 501 penetrates through the second base layer 2, but does not penetrate the first base layer 1; the first metallized via hole 5 and the second metallized via hole 501 are provided with inner layer lines 6 in the second base layer 2, The layer wiring 6 spreads around the hole walls of the first metallized via 5 and the second metallized via 501 . The contact 8 is located on the extended metal line of the second metallized via 501 on the lower surface of the second base layer 2 . The electrode 402 is arranged at the bottom of the first blind hole 3, and is connected to the second metallized via 501 by extending the metal circuit 4, thereby indirectly connecting the inner layer circuit 6 and the annular metal circuit on the lower surface of the second base layer 2, and then connecting the contact. Point 8.

When in use, the first contact 7 and the contact 8 are connected to a power supply, so that a voltage can be formed between the first electrode 401 and the electrode 402 , and a conductive medium is connected above the first blind hole 3 and the second blind hole 12 .

Claims (13)

1. a chip with a composite layer and its application in biological detection, wherein the chip comprises at least a first base layer and a second base layer arranged up and down, and the first base layer is provided with at least one pass through. To the first blind hole of the second base layer, the chip is also provided with at least one metallized via hole passing through the second base layer, an electrode is provided under the first blind hole, and the chip is provided with a contact hole. point, the electrodes are connected with the contacts through lines. 2 . The chip according to claim 1 , wherein a first electrode is further provided on the upper and lower surfaces of the first base layer or above the first base layer, and the chip is further provided with a first contact, so 2 . The first electrode is connected with the first contact through a line. 3. The chip according to claim 2, wherein the first base layer is further provided with at least one second blind hole leading to the second base layer, and the second blind hole is provided with a first electrode. 4 . The chip according to claim 3 , wherein at least two metallized vias penetrating through the second base layer are provided on the chip, and inner-layer lines are provided on the outer walls of the metallized vias. 5 . 5 . The chip according to claim 3 and 4 , wherein the first electrode communicates with the first metallized via via a metal line, and the electrode communicates with the second metallized via via a metal line. 6 . 6 . The chip according to claim 5 , wherein the inner layer line of the first metallized via or the first metallization via is provided with a first contact on the extended metal line on the lower surface of the second base layer. 7 . point; the inner layer line of the second metallized via hole or the second metallized via hole is provided with a contact on the extended metal line on the lower surface of the second base layer. 7 . The chip according to claim 1 and 2 , wherein the metallized via penetrates the first base layer and the second base layer, and the first contact is located on the first metallized via on the first base layer. 8 . The extended metal line on the surface or the lower surface of the second base layer, the first electrode is arranged on the upper edge of the first metallized via hole, and the first electrode is on the upper surface or the first base layer through the first metallized via hole. The annular metal circuit on the lower surface of the two base layers and the inner layer circuit are connected to the first contact. 8 . The chip according to claim 1 , wherein the contact is located on the extended metal line of the second metallized via on the upper surface of the first base layer or the lower surface of the second base layer; the electrode can pass through the second base layer. 9 . The metallized vias are connected to the contacts by a ring-shaped metal circuit on the upper surface of the first base layer or the lower surface of the second base layer and the inner layer circuit. 9 . The chip of claim 1 , wherein the second base layer is provided with inner layer lines. 10 . 10. The chip according to claim 1, wherein at least one third base layer is further disposed between the first base layer and the second base layer. 11. The chip according to claim 1, wherein the materials of the first base layer and the second base layer are plastics, and preferably, the materials of the first base layer and the second base layer are polyimide resin plates , FR-4 sheet, FR-1 sheet or CEM-1/3 sheet. 12 . The chip according to claim 1 , wherein the diameter of the first blind hole is 0.1-0.15 mm, and the diameter of the second blind hole is 1-1.5 mm. 13 . 13. The application of the chip according to claim 1 in biological detection, preferably, the application of the chip in nucleic acid sequencing, more preferably, the application of the chip in nanopore nucleic acid sequencing.

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