CN111843888A - High-voltage power supply multiplier assembling clamp for image intensifier and assembling method - Google Patents
High-voltage power supply multiplier assembling clamp for image intensifier and assembling method Download PDFInfo
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- CN111843888A CN111843888A CN202010493066.4A CN202010493066A CN111843888A CN 111843888 A CN111843888 A CN 111843888A CN 202010493066 A CN202010493066 A CN 202010493066A CN 111843888 A CN111843888 A CN 111843888A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 41
- 239000010959 steel Substances 0.000 claims abstract description 41
- 239000003990 capacitor Substances 0.000 claims description 87
- 238000003466 welding Methods 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
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Abstract
The invention relates to a high-voltage power supply multiplier assembly fixture for an image intensifier and an assembly method, belonging to the technical field of high-voltage power supplies for low-light-level image intensifiers; the technical problem to be solved is as follows: the assembling clamp and the assembling method for the high-voltage power supply multiplier for the image intensifier, which are simple, reliable and easy to operate, are provided, and the assembling clamp for various multipliers can be assembled in batch at one time; the technical scheme is as follows: including the anchor clamps body and clamping mechanism, the anchor clamps body includes the bottom plate of the square sheet structure that stacks in proper order from the bottom up, the steel mesh, middle splint and apron, clamping mechanism includes the reference column, fastening stud and nut, two reference column bottoms are fixed respectively on two relative angles of bottom plate, two fastening stud bottoms are fixed respectively on two other relative angles of bottom plate, the steel mesh is run through in proper order to the cylinder of reference column and fastening stud, the corresponding preformed hole on four angles of middle splint and apron, two nuts are respectively through the threaded fixation at two fastening stud tops and compress tightly fixed whole anchor clamps body.
Description
Technical Field
The invention discloses an assembly fixture and an assembly method for a high-voltage power supply multiplier for an image intensifier, belongs to the technical field of high-voltage power supplies for low-light-level image intensifiers, and particularly relates to the assembly fixture and the assembly method for the high-voltage power supply multiplier for the image intensifier.
Background
The working principle of the low-light level image intensifier is that the scenery under low light level reproduces the image visible to human eyes through the photoelectric conversion of the photocathode, the multiplication of the electron multiplier and the photoelectric conversion of the fluorescent screen. For the image intensifier to work properly, the four electrodes must be applied with appropriate voltages, which are provided by a high voltage power supply.
The invention mainly aims at a four-time voltage and three-time voltage assembling clamp, a single-time voltage and six-time voltage assembling clamp and the like, and details are not described herein.
In actual work, the multiplier is assembled in a manual welding mode, and due to the fact that the size of components is small, proper tool fixtures are not used for assisting welding, the welding quality of the multiplier is closely related to the welding level of operators, and the problems that the reliability of the multiplier is poor, the consistency is low and the like are caused; in addition, the welding assembly work of the multiplier can be manually completed one by one, so that the working efficiency is low.
Disclosure of Invention
The invention overcomes the defects of the prior art, provides the high-voltage power supply multiplier assembling clamp for the image intensifier and the assembling method which are simple, reliable and easy to operate, can assemble various multipliers in batch at a time, and is used for solving the problems of difficult welding, poor reliability, low consistency, low working efficiency and the like in the assembling process of the high-voltage power supply multiplier for the micro-light image intensifier.
In order to solve the technical problems, the invention adopts the technical scheme that: a high-voltage power multiplier assembly clamp for an image intensifier comprises a clamp body and a clamping mechanism;
the clamp body comprises a bottom plate, a steel mesh, a middle clamping plate and a cover plate which are sequentially stacked from bottom to top and are of a square sheet structure, the clamping mechanism comprises positioning columns, fastening studs and screw caps, the bottom ends of the two positioning columns are respectively fixed on two opposite corners of the bottom plate, the bottom ends of the two fastening studs are respectively fixed on the other two opposite corners of the bottom plate, the positioning columns and the cylinders of the fastening studs sequentially penetrate through corresponding reserved holes in the steel mesh, the middle clamping plate and the four corners of the cover plate, and the two screw caps are respectively fixed at the top ends of the two fastening studs through threads and tightly press and fix;
The middle part of the clamp body is provided with a square working area, the positioning column of the clamping mechanism and the column body of the fastening stud are positioned outside the square working area, the square working area is averagely divided into four unit areas, and each unit area consists of a plurality of square small grid units;
two capacitor grooves and a diode groove between the two capacitor grooves are formed in the bottom plate unit corresponding to each small square grid unit, and when the multi-stage capacitor to be assembled is placed in the capacitor grooves, the multi-stage capacitor cannot shake and only the bonding pad is exposed;
two groups of square through holes are formed in the steel mesh unit corresponding to each small square grid unit, the two groups of square through holes of the steel mesh unit respectively correspond to the pads of the multi-stage capacitor to be assembled in the two capacitor grooves of the bottom plate unit below the steel mesh unit, and the number of the square through holes in each group is equal to the number of the pads of the multi-stage capacitor to be assembled;
multiple diode through holes, pin through holes, multi-stage capacitor pad through holes and outgoing line grooves are formed in the middle clamping plate unit corresponding to each small square grid unit, the multiple diode through holes correspond to diode grooves in the bottom plate unit, the two groups of multi-stage capacitor pad through holes correspond to the two groups of square through holes in the steel mesh unit, a deep groove thin plate is connected between each group of multi-stage capacitor pad through holes and the multiple diode through holes, each multi-stage capacitor pad through hole is communicated with the multiple diode through holes through a trapezoidal pin through hole formed in the deep groove thin plate, and the multiple diode through holes in each middle clamping plate unit and one of the multi-stage capacitor pad through holes are provided with outgoing line grooves;
Two strip-shaped bosses are arranged on the bottom surface of the cover plate unit corresponding to each square small grid unit, are respectively positioned on two sides of the multi-connected diode through hole of the middle clamping plate unit and correspondingly compress the deep groove thin plate.
The unit area of the fixture body is correspondingly provided with the quadruple pressure multiplier, so that the number of the square through holes in each group of the steel mesh units is 4, and the number and the positions of the through holes of the multi-stage capacitor bonding pads of the middle clamping plate unit are matched and corresponding to the square through holes; and the unit area of the clamp body is correspondingly provided with the triple-pressure multiplier, the hole number of each group of square through holes of the steel mesh unit is 3, and the number and the positions of the through holes of the multi-stage capacitor bonding pads of the middle clamp plate unit are matched and corresponding to the square through holes.
The depth of the capacitor groove on the bottom plate unit is equal to the height of the multi-stage capacitor to be assembled, and the depth of the diode groove on the bottom plate unit is half of the height of the multi-connected diode to be assembled.
And wall grooves for accommodating the sharp ends of the tweezers are formed in two side walls of the capacitor groove in the bottom plate unit, and the length of each wall groove is smaller than half of that of the capacitor groove.
The length and the width of the square through hole on the steel mesh unit are equal to the length and the width of the corresponding multi-stage capacitor bonding pad to be assembled.
The length and the width of the through holes of the multi-stage capacitor pads on the middle clamping plate unit are equal to those of the multi-stage capacitor pads to be assembled, and the depths of the multi-connected diode through holes and the multi-stage capacitor pad through holes on the middle clamping plate unit are half of the height of the multi-connected diodes to be assembled.
And a multi-connected diode placing direction mark is arranged in the diode groove of the bottom plate unit.
The thickness of the deep-groove thin plate of the middle clamping plate unit is 1.5 times of the diameter of the pin of the multi-connected diode to be assembled.
And the positioning column and the fastening stud are integrally formed and are fixedly connected on the bottom plate.
An assembling method of a high-voltage power multiplier assembling clamp for an image intensifier comprises the following steps:
the method comprises the following steps that firstly, a bottom plate is placed on a flat operating platform with the right side facing upwards, and an assembly clamp area required on the bottom plate is selected according to the direction of a multiplier outgoing line;
secondly, placing the multi-stage capacitor to be assembled in a corresponding capacitor groove of a selected bottom plate unit on the bottom plate, wherein the welding surface is upward;
thirdly, positioning and fastening the steel mesh on the bottom plate, applying tin paste, and taking down the steel mesh;
fourthly, positioning the middle clamping plate on the bottom plate, and placing the multi-connected diodes to be assembled in the corresponding multi-connected diode through holes of the middle clamping plate according to the polarity requirement;
Fifthly, placing the cover plate on the middle clamping plate, and installing and fastening the cover plate on the fastening stud through a nut;
sixthly, putting the installed fixture body into a reflow soldering machine for reflow soldering;
and seventhly, taking out the device after welding is finished, and taking down the multiplier from the device.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention solves the problem of difficult welding caused by the fact that components can not be accurately positioned in the assembling process of the multiplier;
2. the invention replaces manual welding with reflow soldering, greatly improves the reliability and consistency of multiplier assembly, can assemble 400 multipliers at a time, and greatly improves the working efficiency through batch operation;
3. the invention has high universality, can integrate the quadruple-voltage and triple-voltage assembling clamps on the same clamp block, is convenient to operate and saves the cost.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings;
FIG. 1 is a schematic structural diagram of a high voltage power multiplier mounting fixture for an image intensifier according to the present invention;
FIG. 2 is a schematic diagram of a planar partition structure of a high voltage power multiplier mounting fixture for an image intensifier according to the present invention;
FIG. 3 is a schematic plan view of the base plate unit of four unit areas of a high voltage power multiplier mounting fixture for an image intensifier of the present invention;
FIG. 4 is a schematic cross-sectional view of a base plate unit of a high voltage power multiplier mounting fixture for an image intensifier of the present invention;
FIG. 5 is a schematic plan view of a steel mesh unit in four unit areas of a high voltage power multiplier mounting fixture for an image intensifier according to the present invention;
FIG. 6 is a schematic plan view of the middle clamping plate unit of the four unit areas of the assembling jig for high voltage power multiplier for image intensifier according to the present invention;
FIG. 7 is a schematic cross-sectional view of an intermediate clamp plate unit of a high voltage power multiplier mounting fixture for an image intensifier according to the present invention;
FIG. 8 is a schematic plan view of the cover plate units of four unit areas of a high voltage power multiplier mounting fixture for an image intensifier of the present invention;
FIG. 9 is a schematic cross-sectional view of a cover unit of a high voltage power multiplier mounting fixture for an image intensifier according to the present invention;
FIG. 10 is a schematic diagram of a completed structure of a single square grid cell of a jig for assembling a high voltage power multiplier for an image intensifier according to the present invention;
in the figure: the device comprises a base plate 1, a capacitor groove 11, a diode groove 12, a wall groove 13 and a multi-connected diode placing direction mark 14, wherein the base plate is a base plate;
2, a steel mesh and 21, a square through hole;
3, an intermediate clamping plate, 31, a multi-connected diode through hole, 32, a pin through hole, 33, a multi-stage capacitor bonding pad through hole, 34, an outgoing line groove and 35, wherein the intermediate clamping plate is a deep groove thin plate;
4 is a cover plate, 41 is a boss;
5 is a positioning column, 6 is a fastening stud, and 7 is a screw cap.
101 is a four-level capacitor, 102 is a three-level capacitor, 1011/1021 is a square pad, 1032 is a polarity sign on the multiple diode, 103 is the multiple diode, and 1031 is a multiple diode pin.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention relates to a high-voltage power multiplier assembly clamp for an image intensifier, which comprises a clamp body and a clamping mechanism;
as shown in fig. 1, the clamp body comprises a bottom plate 1, a steel mesh 2, a middle clamping plate 3 and a cover plate 4 which are sequentially stacked from bottom to top and have square sheet structures, a clamping mechanism comprises a positioning column 5, fastening studs 6 and nuts 7, the bottom ends of the two positioning columns 5 are respectively fixed on two opposite corners of the bottom plate 1, the bottom ends of the two fastening studs 6 are respectively fixed on the other two opposite corners of the bottom plate 1, cylinders of the positioning column 5 and the fastening studs 6 sequentially penetrate through corresponding reserved holes on the four corners of the steel mesh 2, the middle clamping plate 3 and the cover plate 4, the two nuts 7 are respectively fixed at the top ends of the two fastening studs 6 through threads and tightly press and fix the whole clamp body, the positioning column 5 and the bottom plate 1 are combined into a whole, the surface of the cylinder is smooth and is used for accurately positioning the steel mesh 2, the middle clamping plate 3 and, and is matched with a nut 7 for fastening the bottom plate 1, the steel mesh 2, the middle clamping plate 3 and the cover plate 4. The positioning column 5 and the fastening stud 6 are integrally connected and fixed on the bottom plate 1, so that the positioning column 5, the fastening stud 6 and the bottom plate 1 form a whole to ensure positioning accuracy and connection stability.
As shown in fig. 2, a square working area is arranged in the middle of the clamp body, the positioning columns 5 of the clamping mechanism and the columns of the fastening studs 6 are located outside the square working area, the square working area is divided into four unit areas on average, each unit area consists of a plurality of square small grid units, the plane structure of the clamp body is divided into the same areas, the difference is only that the internal structure of each square small grid unit is different due to different selection of assembling and processing of each unit area, each unit area consists of n × n square small grid units, each unit area consists of 10 × 10 square small grid units as shown in fig. 2, two areas shown in the upper part of the figure are a four-time pressing clamp first area and a two area, two areas shown in the lower part of the four-time pressing clamp first area and a two area, the square small grid units of the four-time pressing clamp first area and the three-time pressing clamp first area are left outgoing lines, and the square small grid cells in the second area of the quadruple pressing clamp and the second area of the triple pressing clamp are both right outgoing lines.
As shown in fig. 3, which is a schematic plane structure diagram of a single square small grid unit in four unit areas on a bottom plate 1 based on the embodiment of fig. 2, and fig. 4 is a schematic cross-sectional structure diagram of a single bottom plate unit, two capacitor grooves 11 and a diode groove 12 between the two capacitor grooves 11 are respectively arranged on the bottom plate unit corresponding to each square small grid unit, a multiple diode placement direction mark 14 is arranged in the diode groove 12, and a position of the multiple diode mark (a polarity mark 1032 on the multiple diode) facing upward corresponds to the diode placement direction mark during assembly; the length and the width of the capacitor groove 11 on the bottom plate unit are slightly larger than the length and the width of the corresponding multi-stage capacitor to be assembled, the depth of the capacitor groove is equal to the height of the corresponding multi-stage capacitor to be assembled, during assembly, the multi-stage capacitor to be assembled is placed in the capacitor groove (11) and cannot shake and only a pad is ensured to be exposed, the four-stage capacitor 101 and the three-stage capacitor 102 are included in fig. 3 and are to be assembled, four square pads 1011 of the four-stage capacitor 101 are placed upwards, the three square pads 1021 of the three-stage capacitor 102 are placed upwards, the length and the width of the diode groove 12 on the bottom plate unit are slightly larger than the length and the width of the corresponding multi-stage diode to be assembled, the depth of the multi-stage diode to be assembled is half of.
Preferably, wall grooves 13 for accommodating the tips of the tweezers are formed in two side walls of the capacitor groove 11 in the bottom plate unit and used for accommodating the tips of the tweezers when components are placed or taken out, and the length of each wall groove 13 is smaller than half of the length of the capacitor groove 11.
As shown in fig. 5, the schematic plan view is a schematic plan structure of a single square small grid unit in four unit areas on the steel mesh 2 based on the embodiment of fig. 2, two sets of square through holes 21 are respectively arranged on the steel mesh unit corresponding to each square small grid unit, the two sets of square through holes 21 of the steel mesh unit respectively correspond to pads to be provided with multi-level capacitors in the two capacitor grooves 11 of the bottom plate unit below the steel mesh unit, and the number of the square through holes 21 of each set is equal to the number of the pads corresponding to the multi-level capacitors to be provided; the length and width of the square through hole 21 on the steel mesh unit are equal to those of the corresponding multi-stage capacitor pad to be assembled. After the multistage capacitor is placed on the bottom plate 1, the steel mesh 2 is placed on the bottom plate to expose the bonding pad area for brushing solder paste.
As shown in fig. 6, based on the embodiment shown in fig. 2, a schematic plane structure of a single square small grid unit in four unit areas on the middle splint 3 is shown, while fig. 7 is a schematic cross-sectional structure of a single middle splint unit, a multiple diode through hole 31, a pin through hole 32, a multi-level capacitor pad through hole 33 and a lead-out wire groove 34 are arranged on the middle splint unit corresponding to each square small grid unit, the multiple diode through hole 31 corresponds to the diode groove 12 on the bottom plate unit, two sets of multi-level capacitor pad through holes 33 correspond to two sets of square through holes 21 on the steel mesh unit, a deep groove thin plate 35 is connected between each set of multi-level capacitor pad through holes 33 and the multiple diode through hole 31, each multi-level capacitor pad through hole 33 is communicated with the multiple diode through hole 31 through a trapezoidal pin through hole 32 arranged on the deep groove thin plate 35, and the multiple diode through hole 31 and one of the multi-level capacitor pad through A lead-out wire groove 34 is arranged; the length and the width of the multiple diode through hole 31 on the middle splint unit are slightly larger than the length and the width of the multiple diode to be assembled, so that the multiple diode can be placed in the multiple diode and cannot shake, the multiple diode through hole 31 on the middle splint unit is half of the height of the multiple diode 103 to be assembled, the position of the multiple diode 103 in the welding process is guaranteed not to move, the length and the width of the multistage capacitor pad through hole 33 on the middle splint unit are equal to those of the multistage capacitor pad to be assembled, the depth of the multistage capacitor pad through hole 33 is half of the height of the multiple diode 103 to be assembled, the multistage capacitor pad through hole is used for accommodating the multistage capacitor pad and the end part of the multiple diode pin 1031, and the pin through hole 32 is used for placing the multiple diode pin 1031.
As shown in fig. 8, based on the embodiment shown in fig. 2, a schematic plane structure diagram of a single square small grid unit in four unit areas on the cover plate 4 is shown, and fig. 9 is a schematic cross-sectional structure diagram of a single cover plate unit, two strip-shaped bosses 41 are respectively arranged on the bottom surface of the cover plate unit corresponding to each square small grid unit, the two bosses 41 are respectively located on two sides of the multiple diode through hole 31 of the middle splint unit and correspondingly press the deep groove thin plate 35, and the bosses 41 are used for pressing the multiple diode pin 1031 onto the multi-stage capacitor pad during the welding process, so that the multiple diode pin 1031 is reliably welded.
Based on the embodiment shown in fig. 2, the quadruple-pressure clamp of the clamp body is correspondingly provided with the quadruple-pressure multiplier in the first and second areas, so that the number of the square through holes 21 in each group of the steel mesh units is 4, and the number and the positions of the through holes 33 of the multi-stage capacitor pads of the middle clamp plate unit are matched and correspond to the square through holes 21; the triple-pressure clamp comprises a clamp body, wherein a first triple-pressure clamp area and a second triple-pressure clamp area are correspondingly assembled with a triple-pressure multiplier, the hole number of each group of square through holes 21 of a steel net unit is 3, and the number and the positions of the multi-stage capacitor pad through holes 33 of the middle clamp plate unit are matched and corresponding to the square through holes 21.
The thickness of the deep-groove thin plate 35 of the middle clamping plate unit is 1.5 times of the diameter of the pin 1031 of the multi-diode to be assembled.
An assembling method of a high-voltage power multiplier assembling clamp for an image intensifier comprises the following steps:
the method comprises the following steps that firstly, a bottom plate 1 is placed on a flat operating platform with the right side facing upwards, and an assembly clamp area required on the bottom plate is selected according to the direction of a multiplier outgoing line;
secondly, placing the multi-stage capacitor to be assembled in a corresponding capacitor groove 11 of a selected bottom plate unit on the bottom plate 1, wherein the welding surface is upward;
thirdly, positioning and fastening the steel mesh 2 on the bottom plate 1, applying tin paste, and taking down the steel mesh 2;
fourthly, positioning the middle clamping plate 3 on the bottom plate 1, and placing the multiple diodes to be assembled in the corresponding multiple diode through holes 31 of the middle clamping plate 3 according to the polarity requirement;
fifthly, placing the cover plate 4 on the middle clamping plate 3, installing and fastening the cover plate on the fastening stud 6 through the nut 7, and enabling the section of a single square small grid unit of the clamp body installed according to the steps to be shown in figure 10;
sixthly, putting the installed fixture body into a reflow soldering machine for reflow soldering;
and seventhly, taking out the device after welding is finished, and taking down the multiplier from the device.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A kind of image intensifier uses the assembly jig of the high-voltage power multiplier, characterized by that: comprises a clamp body and a clamping mechanism;
the clamp body comprises a bottom plate (1) of a square sheet structure, a steel mesh (2), a middle clamp plate (3) and a cover plate (4), wherein the bottom ends of the two positioning columns (5) are respectively fixed on two opposite corners of the bottom plate (1), the bottom ends of the two fastening studs (6) are respectively fixed on the other two opposite corners of the bottom plate (1), cylinders of the positioning columns (5) and the fastening studs (6) sequentially penetrate through corresponding reserved holes in four corners of the steel mesh (2), the middle clamp plate (3) and the cover plate (4), and the two nuts (7) are respectively fixed at the top ends of the two fastening studs (6) through threads and tightly press and fix the whole clamp body;
a square working area is arranged in the middle of the clamp body, a positioning column (5) of the clamping mechanism and a column body of the fastening stud (6) are located outside the square working area, the square working area is averagely divided into four unit areas, and each unit area consists of a plurality of square small grid units;
two capacitor grooves (11) and a diode groove (12) in the middle of the two capacitor grooves (11) are formed in the bottom plate unit corresponding to each small square grid unit, and when the multi-stage capacitor to be assembled is placed in the capacitor grooves (11) and cannot shake during assembly, and only the bonding pad is exposed;
Two groups of square through holes (21) are arranged on the steel mesh unit corresponding to each square small grid unit, the two groups of square through holes (21) of the steel mesh unit respectively correspond to the pads of the multi-stage capacitor to be assembled in the two capacitor grooves (11) of the bottom plate unit below the steel mesh unit, and the number of each group of square through holes (21) is equal to the number of the pads of the multi-stage capacitor to be assembled;
the middle clamping plate unit corresponding to each small square grid unit is provided with a multi-connected diode through hole (31), a pin through hole (32), a multi-stage capacitor pad through hole (33) and a lead-out wire groove (34), the multi-connection diode through hole (31) corresponds to a diode groove (12) on the bottom plate unit, the two groups of multi-level capacitor pad through holes (33) correspond to the two groups of square through holes (21) on the steel mesh unit, a deep groove thin plate (35) is connected between each group of multi-level capacitor pad through holes (33) and the multi-connection diode through hole (31), each multi-level capacitor pad through hole (33) is communicated with the multi-connection diode through hole (31) through a trapezoidal pin through hole (32) formed in the deep groove thin plate (35), and an outgoing line groove (34) is formed in the multi-connection diode through hole (31) and one multi-level capacitor pad through hole (33) in each middle clamping plate unit;
Two strip-shaped bosses (41) are arranged on the bottom surface of the cover plate unit corresponding to each square small grid unit, and the two bosses (41) are respectively positioned on two sides of the multi-connected diode through hole (31) of the middle clamping plate unit and correspondingly press the deep groove thin plate (35).
2. The high-voltage power multiplier assembling jig for an image intensifier as set forth in claim 1, wherein: the unit area of the fixture body is correspondingly provided with the quadruple pressure multiplier, so that the hole number of each group of square through holes (21) of the steel mesh unit is 4, and the number and the positions of the multi-stage capacitor pad through holes (33) of the middle clamp plate unit are matched and corresponding to the square through holes (21); and the unit area of the fixture body is correspondingly provided with the triple-pressure multiplier, the hole number of each group of square through holes (21) of the steel mesh unit is 3, and the number and the positions of the multi-stage capacitor pad through holes (33) of the middle clamp plate unit are matched and corresponding to the square through holes (21).
3. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: the depth of the capacitor groove (11) on the bottom plate unit is equal to the height of the corresponding multi-stage capacitor to be assembled, and the depth of the diode groove (12) on the bottom plate unit is half of the height of the corresponding multi-stage diode to be assembled.
4. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: wall grooves (13) for accommodating the tips of the tweezers are formed in two side walls of the capacitor groove (11) in the bottom plate unit, and the length of each wall groove (13) is smaller than half of the length of the capacitor groove (11).
5. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: the length and the width of the square through hole (21) on the steel mesh unit are equal to those of the multi-stage capacitor pad to be assembled.
6. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: the length and the width of the multi-stage capacitor pad through hole (33) in the middle clamping plate unit are equal to those of the multi-stage capacitor pad to be assembled, and the depths of the multi-connected diode through hole (31) in the middle clamping plate unit and the multi-stage capacitor pad through hole (33) are half of the height of the multi-connected diode to be assembled.
7. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: a multi-connected diode placing direction mark (14) is arranged in the diode groove (12) of the bottom plate unit.
8. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: the thickness of a deep groove thin plate (35) of the middle clamping plate unit is 1.5 times of the diameter of a pin of the multi-connected diode to be assembled.
9. A high-voltage power multiplier mounting jig for an image intensifier as claimed in claim 1 or 2, wherein: the positioning column (5) and the fastening stud (6) are integrally connected and fixed on the bottom plate (1).
10. A method of assembling a high voltage power multiplier assembly jig for an image intensifier as recited in claim 1, further comprising the steps of:
the method comprises the following steps that firstly, a bottom plate (1) is placed on a flat operating platform with the right side facing upwards, and an assembly clamp area required on the bottom plate is selected according to the direction of a multiplier outgoing line;
secondly, placing the multi-stage capacitor to be assembled in a corresponding capacitor groove (11) of a selected bottom plate unit on the bottom plate (1), wherein the welding surface faces upwards;
thirdly, positioning and fastening the steel mesh (2) on the bottom plate (1), applying solder paste, and taking down the steel mesh (2);
fourthly, positioning the middle clamping plate (3) on the bottom plate (1), and placing the multiple diodes to be assembled in the corresponding multiple diode through holes (31) of the middle clamping plate (3) according to the polarity requirement;
Fifthly, placing the cover plate (4) on the middle clamping plate (3), and installing and fastening the cover plate on the fastening stud (6) through a screw cap (7);
sixthly, putting the installed fixture body into a reflow soldering machine for reflow soldering;
and seventhly, taking out the device after welding is finished, and taking down the multiplier from the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010493066.4A CN111843888B (en) | 2020-06-03 | 2020-06-03 | High-voltage power supply multiplier assembling clamp for image intensifier and assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010493066.4A CN111843888B (en) | 2020-06-03 | 2020-06-03 | High-voltage power supply multiplier assembling clamp for image intensifier and assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111843888A true CN111843888A (en) | 2020-10-30 |
| CN111843888B CN111843888B (en) | 2021-11-09 |
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| US5263632A (en) * | 1992-08-06 | 1993-11-23 | United Technologies Corporation | Apparatus for positioning integrated circuit packages for tinning |
| US5971257A (en) * | 1997-11-25 | 1999-10-26 | Lucent Technologies Inc. | Method for use in bonding a chip to a substrate |
| CN202639695U (en) * | 2012-04-17 | 2013-01-02 | 北方夜视技术股份有限公司 | Anode glass flange seal clamp for shimmer image intensifier |
| CN103831568A (en) * | 2014-03-11 | 2014-06-04 | 西安永电电气有限责任公司 | Thermistor welding tool and method of IGBT module |
| CN103962772A (en) * | 2013-02-04 | 2014-08-06 | 西安永电电气有限责任公司 | IGBT (insulated gate bipolar transistor) once-bonding tooling and assembly method thereof |
| CN108235595A (en) * | 2017-12-29 | 2018-06-29 | 京信通信系统（中国）有限公司 | Print tin jig and print tin method |
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2020
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5263632A (en) * | 1992-08-06 | 1993-11-23 | United Technologies Corporation | Apparatus for positioning integrated circuit packages for tinning |
| US5971257A (en) * | 1997-11-25 | 1999-10-26 | Lucent Technologies Inc. | Method for use in bonding a chip to a substrate |
| CN202639695U (en) * | 2012-04-17 | 2013-01-02 | 北方夜视技术股份有限公司 | Anode glass flange seal clamp for shimmer image intensifier |
| CN103962772A (en) * | 2013-02-04 | 2014-08-06 | 西安永电电气有限责任公司 | IGBT (insulated gate bipolar transistor) once-bonding tooling and assembly method thereof |
| CN103831568A (en) * | 2014-03-11 | 2014-06-04 | 西安永电电气有限责任公司 | Thermistor welding tool and method of IGBT module |
| CN108235595A (en) * | 2017-12-29 | 2018-06-29 | 京信通信系统（中国）有限公司 | Print tin jig and print tin method |
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| CN111843888B (en) | 2021-11-09 |
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