CN111842528A - Manufacturing method of temperature-equalizing plate - Google Patents
Manufacturing method of temperature-equalizing plate Download PDFInfo
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- CN111842528A CN111842528A CN202010629748.3A CN202010629748A CN111842528A CN 111842528 A CN111842528 A CN 111842528A CN 202010629748 A CN202010629748 A CN 202010629748A CN 111842528 A CN111842528 A CN 111842528A
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- fiber
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 188
- 239000002184 metal Substances 0.000 claims abstract description 188
- 239000011148 porous material Substances 0.000 claims abstract description 112
- 239000011094 fiberboard Substances 0.000 claims abstract description 46
- 239000012530 fluid Substances 0.000 claims abstract description 43
- 239000000835 fiber Substances 0.000 claims abstract description 40
- 239000000843 powder Substances 0.000 claims abstract description 28
- 238000005245 sintering Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 17
- 239000007800 oxidant agent Substances 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 230000003197 catalytic effect Effects 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000009792 diffusion process Methods 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 238000009434 installation Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229940117975 chromium trioxide Drugs 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- 229960001484 edetic acid Drugs 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- XXQBEVHPUKOQEO-UHFFFAOYSA-N potassium superoxide Chemical compound [K+].[K+].[O-][O-] XXQBEVHPUKOQEO-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000001476 sodium potassium tartrate Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
- B22F3/1137—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers by coating porous removable preforms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing method of a vapor chamber, which comprises the following steps: step 1, forming a fiber board by fiber tissues, wherein the fiber board is provided with a plurality of first pores; step 2, placing metal powder into a plurality of first pores; step 3, sintering the fiber plate with the metal powder at high temperature, removing all fiber tissues, forming the metal plate by the metal powder after high-temperature sintering, and forming second pores in the space occupied by the sintered fiber tissues, wherein the second pores are positioned in the metal plate; step 4, carrying out hydrophilic treatment on the metal plate, and then carrying out thinning treatment on the metal plate to reduce the aperture of the second pore; or firstly, the metal plate is thinned to reduce the aperture of the second pore, and then the metal plate is subjected to hydrophilic treatment; through the steps, the pore density of the second pores in the metal plate is increased, so that the diffusion speed of the liquid working fluid in the metal plate can be increased, and the heat dissipation performance of the temperature equalization plate is improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a manufacturing method of a temperature-uniforming plate, in particular to a manufacturing method of a temperature-uniforming plate for improving heat dissipation efficiency.
[ background of the invention ]
The existing temperature-uniforming plate is manufactured by the following method: step one, an upper plate and a lower plate are provided. The lower surface of the upper plate is upwards concavely provided with a first groove, and the upper surface of the lower plate is downwards concavely provided with a second groove; secondly, placing metal powder in the second groove, and then sintering the metal powder at high temperature to form a metal plate with pores; and thirdly, stacking the upper plate above the lower plate to enable the first groove and the second groove to be communicated with each other to form an accommodating cavity. Sealing the upper plate and the lower plate, and reserving an opening to enable the accommodating cavity to be communicated with the outside through the opening; step five, filling working fluid into the accommodating cavity through the opening, enabling part of the working fluid to permeate into the metal plate, and then sealing the opening. The temperature-equalizing plate manufactured by the method can enable the working fluid to circulate in the accommodating cavity, so that the temperature-equalizing plate can dissipate heat of external elements.
However, since the metal plate having the pores manufactured in the above manner is directly formed by sintering, the number of pores in the metal plate and the size of the pores may vary according to the sintering temperature. If the sintering temperature is too low, the pore diameter of the pores of the metal plate is large, and even the metal powder cannot be sintered into the metal plate, which affects the diffusion of the working fluid in the metal plate, thereby causing the uneven distribution of the liquid working fluid and affecting the heat dissipation performance of the uniform temperature plate. If the sintering temperature is too high, the number of pores in the metal plate is reduced and the metal plate may even be broken and damaged. The diffusion of the working fluid of the liquid in the metal plate is also affected, so that the working fluid is unevenly distributed, and the heat dissipation performance of the temperature equalization plate is affected.
Therefore, it is necessary to design a method for manufacturing a vapor chamber to overcome the above problems.
[ summary of the invention ]
The invention aims to provide a metal plate with a plurality of second pores, and the metal plate is thinned, so that the pore diameters of the second pores are reduced, and the porosity of the metal plate is increased.
In order to achieve the purpose, the manufacturing method of the temperature-equalizing plate adopts the following technical scheme:
the manufacturing method of the temperature-uniforming plate is characterized by comprising the following steps: step 1, forming a fiber board by fiber tissue, wherein a plurality of first pores are formed on the fiber board; step 2, placing metal powder into a plurality of first pores; step 3, sintering the fiber board with the metal powder at high temperature, removing all fiber tissues in the fiber board, forming a metal board by the metal powder after high-temperature sintering, and forming second pores in the space occupied by the sintered fiber tissues, wherein the second pores are positioned in the metal board; step 4, carrying out hydrophilic treatment on the metal plate, and then carrying out thinning treatment on the metal plate to reduce the aperture of the second pore; or firstly, the metal plate is thinned to reduce the aperture of the second pore, and then the metal plate is subjected to hydrophilic treatment; step 5, providing an upper plate and a lower plate, forming an accommodating cavity between the upper plate and the lower plate, and placing the metal plate in the accommodating cavity; step 6, correspondingly matching the upper plate with the lower plate, and reserving an opening so that the accommodating cavity is communicated with the outside through the opening; step 7, filling working fluid into the accommodating cavity through the opening, and enabling at least part of the working fluid to penetrate into the second pore of the metal plate; and 8, sealing the upper plate, the lower plate and the opening to seal the metal plate and the working fluid in the accommodating cavity, wherein the metal plate, the working fluid, the upper plate and the lower plate jointly form the temperature equalizing plate.
Further, in step 3, the second pores have a plurality of second pores, the plurality of second pores are communicated with each other, and at least two of the plurality of second pores have different pore diameters.
Further, in step 4, in the process of pressing the metal plate, the pressing force acting on the metal plate is smaller than the yield strength of the metal plate, and the thickness of the metal plate becomes thinner gradually along the pressing direction, the pore diameters of the plurality of second pores decrease gradually, and the number of the plurality of second pores does not change.
Further, in step 4, during the pressing of the metal plate, a distance between two adjacent second apertures in the pressing direction is gradually decreased.
Further, in step 4, in the process of pressing the metal plate, the distance between two adjacent second apertures is gradually increased along the direction perpendicular to the pressing direction, and the length and the width of the metal plate are also gradually increased.
Further, in step 4, fifty grams of sodium hydroxide (NaOH) and twenty grams of potassium persulfate (K2S2O4) are mixed with one liter of water as an oxidizing agent when the metal plate is subjected to the hydrophilic treatment, and then the oxidizing agent is heated to eighty degrees celsius, and then the metal plate is put into the oxidizing agent at eighty degrees celsius, so that the metal plate is blackened.
Further, in step 5, the lower surface of the upper plate is recessed upward to form a first groove, the top surface of the first groove protrudes downward and is provided with a plurality of bumps at intervals, and in step 6, the bumps are abutted against the metal plate.
Further, after the step 1 and before the step 2, the fiberboard is subjected to an activation treatment to enable the surface of the fiberboard to have catalytic activity, in the step 2, the fiberboard with the surface having the catalytic activity is subjected to an electroless plating treatment to enable the fiber structure to be tightly combined with the metal powder, and then the fiberboard coated with the metal powder is placed into an electroplating solution to be electroplated to enable the metal powder to be completely electroplated in the first pores.
Further, in step 6, the upper plate is placed in one mold, the lower plate is placed in another mold, the mold with the upper plate mounted thereon is stacked above the mold with the lower plate mounted thereon, and then the two molds are placed in a high temperature vacuum furnace for high temperature pressing, so that the upper plate and the lower plate are sealed.
Further, in step 7, a gap is formed between the working fluid and the upper surface of the receiving cavity, and after step 7 and before step 8, the receiving cavity is vacuumized through the opening.
Compared with the prior art, the manufacturing method of the temperature-uniforming plate has the following beneficial effects:
the fiber sheet formed of a fibrous tissue in the present invention has a plurality of the first pores. Firstly, the metal powder is placed in the first pores, then the fiberboard with the metal powder is sintered at high temperature, so that all fiber tissues in the fiberboard are removed, a second pore is formed in a space occupied by the sintered fiber tissues, the metal powder forms the metal plate, and the second pore is located in the metal plate. In this way, the second pores are formed in the space occupied by the fiber structure only by sintering the fiber structure completely, and the second pores are located in the metal plate. And since the quantity and the size of the fiber tissues are determined when the fiber tissues are formed into the fiber board, the size of the space occupied by the sintered fiber tissues is also determined. Therefore, the number of the second pores formed in the metal plate and the size of the pore diameter of the second pores do not change with the change of the sintering temperature. Therefore, the liquid working fluid can be stably diffused in the metal plate with the second pores, and the temperature equalizing plate has good heat dissipation performance. And then the metal plate with the second pores is subjected to thinning treatment, the pore diameter of the second pores in the metal plate is reduced in the thinning process, and the distance between two adjacent second pores in the thinning direction is also reduced. In this way, the pore density of the second pores in the metal plate is increased. Therefore, the diffusion speed of the liquid working fluid in the metal plate can be accelerated, so that the liquid working fluid can be uniformly distributed in the metal plate, and the heat dissipation performance of the temperature equalization plate is improved.
[ description of the drawings ]
FIG. 1 is a cross-sectional view of a vapor chamber of the present invention prior to plating of a fiber sheet;
FIG. 2 is a cross-sectional view of a vapor chamber according to the present invention after plating a fiber sheet;
FIG. 3 is a cross-sectional view of a vapor plate of the present invention prior to metal plate decompression;
FIG. 4 is a cross-sectional view of a metal plate of the vapor plate of the present invention as compressed;
FIG. 5 is a perspective view of the upper plate of the vapor chamber of the present invention;
FIG. 6 is an exploded view of the vapor chamber of the present invention prior to assembly;
FIG. 7 is an assembled view of the vapor chamber of the present invention.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
Referring to fig. 5, 6 and 7, a vapor chamber a for dissipating heat of a heat generating electronic device (not shown) according to the present invention includes an upper plate 3, a lower plate 4 and a metal plate 2 having a plurality of second apertures 21 between the upper plate 3 and the lower plate 4. The lower surface of the upper plate 3 is recessed upwards to form a first groove 31 and a plurality of bumps 33, the upper surface of the lower plate 4 is recessed downwards to form a second groove 41, when the upper plate 3 and the lower plate 4 are sealed in a matching manner, the first groove 31 is communicated with the second groove 41 to form an accommodating cavity 8, the metal plate 2 is accommodated in the accommodating cavity 8, the metal plate 2 is specifically accommodated in the second groove (of course, in other embodiments, the metal plate may also be protruded upwards in the first groove), and the working fluid 5 is filled in the accommodating cavity 8, so that the temperature equalization plate a dissipates heat of the heating electronic element.
As shown in fig. 5, 6 and 7, the upper plate 3 is made of a copper metal plate (in other embodiments, the upper plate 3 may also be made of aluminum or other metal materials), and the upper plate 3 is rectangular (in other embodiments, the upper plate 3 may also be circular or other shapes). The upper surface of the upper plate 3 is a horizontal surface for contacting an external member (not shown, hereinafter the same). The lower surface of upper plate 3 is equipped with first recess 31 and surround a first installation department 32 of first recess 31, the lower surface of first installation department 32 with the lower surface of upper plate 3 is parallel and level mutually. The first groove 31 has a first inner surface 311, the first inner surface 311 is higher than the lower surface of the upper plate 3, and a plurality of the protrusions 33 are further protruded downward from the first inner surface 311 of the first groove 31, and the plurality of the protrusions 33 are arranged at intervals. Each of the bumps 33 is provided with a supporting surface 331, the supporting surface 331 is flush with the lower surface of the upper plate 3 (of course, in other embodiments, the height of the supporting surface 331 may be higher or lower than the lower surface of the upper plate 3), and the supporting surface 331 is configured to support against the metal plate 2.
As shown in fig. 6 and 7, the lower plate 4 is made of a copper metal plate (in other embodiments, the upper plate 3 may also be made of aluminum or other metal materials), and the lower plate 4 is rectangular (in other embodiments, the lower plate 4 may also be circular or other shapes). The lower surface of the lower plate 4 is a horizontal plane, and the lower surface of the lower plate 4 is used for contacting with the heating electronic component. The upper surface of the lower plate 4 is provided with the second groove 41 and a second mounting portion 42 surrounding the second groove 41 in a downward concave manner, and the upper surface of the second mounting portion 42 is flush with the upper surface of the lower plate 4.
As shown in fig. 4, 6 and 7, the metal material of the metal plate 2 is copper (of course, the metal plate 2 may be made of other metal materials in other embodiments), and the size of the metal plate 2 is substantially the same as that of the second groove 41. The metal plate 2 has a plurality of second pores 21 inside, the second pores 21 are connected to each other, and a part of the second pores 21 in the second pores 21 has a larger pore size than another part of the second pores 21. In other words, at least two of the second pores 21 in the second voids have different pore sizes (although in other embodiments, the pore sizes of the second pores 21 may be the same). And the distance between two adjacent second apertures 21 in a part of the plurality of second apertures 21 is greater than the distance between two adjacent second apertures 21 in another part (of course, in other embodiments, the distance between any two adjacent second apertures 21 may be the same).
As shown in fig. 7, when the upper plate 3 and the lower plate 4 are sealed, the metal plate 2 is fixed in the second groove 41, and the abutting surface 331 of the protrusion 33 and the upper surface of the metal plate 2 abut against each other. The first groove 31 and the second groove 41 are aligned up and down and communicated with each other to form the accommodating cavity 8, and the first installation part 32 and the second installation part 42 are sealed with each other. The containing cavity 8 is in a vacuum state, the working fluid 5 is contained in the containing cavity 8, and a gap 6 is further formed between the working fluid 5 and the first inner surface 311 of the first groove 31, so that the working fluid 5 is heated and evaporated in the gap 6.
As shown in fig. 1 to 7, a preferred embodiment of the method for manufacturing the vapor chamber a is shown (for convenience, some steps are omitted in fig. 1, 2 and 3):
step 1, providing a fiber board 1 (the fiber board 1 may be a sponge board, a foam board, etc.), wherein the fiber board 1 is formed by interweaving fiber tissues 11, and the interior of the fiber board 1 further has a plurality of first pores 12, and the plurality of first pores 12 are mutually communicated. The surface of the fiber board 1 is first roughened by oxidizing in an oxidizing roughening solution prepared from chromium trioxide (CrO3) and sulfuric acid (H2SO4) to make the fiber board 1 have good hydrophilic properties (in other embodiments, a solution prepared from another oxidizing substance may be used as the oxidizing roughening solution). After that, the fiber board 1 with good hydrophilicity is cleaned and reduced, then the cleaned and reduced fiber board 1 is sensitized in sensitizing solution prepared from stannous chloride (SnCl2) and hydrogen chloride (HCl) (of course, in other embodiments, other reagents can be used to prepare sensitizing solution), and finally the fiber board 1 is activated in activating solution, so that palladium microcrystals (of course, in other embodiments, other metal substances with catalytic activity) are adsorbed on the surface of the fiber board 1, and thus the surface of the fiber board 1 has catalytic activity. The activation solution is prepared from palladium chloride (PdCl2) and hydrogen chloride (HCl), and the size of the first pores 12 of the fiberboard 1 becomes uniform through the above-mentioned treatment.
And 2, placing the fiber board 1 with the active catalytic surface into an electroless copper plating solution for electroless copper plating treatment (of course, in other embodiments, the fiber board 1 can be placed into other chemical metal solutions for electroless copper plating treatment), so that the fiber board 1 after the electroless copper plating treatment has conductivity. In the chemical copper plating process, chemical plating is carried out by adopting chemical copper plating solution of a three-coordination system, and the coordination agent adopted in the chemical copper plating solution of the three-coordination system is prepared by sodium potassium tartrate, Ethylene Diamine Tetraacetic Acid (EDTA) and citric acid. Before electroless copper plating, the electroless copper plating solution is prepared into solution A 'and solution B', wherein the solution A 'is formed by mixing copper sulfate and a compounding agent, and the solution B' is prepared from a formaldehyde reduction solution. In the electroless copper plating, the A 'solution and the B' solution are mixed, and then the fiberboard 1 with the active catalytic surface is put into the mixed solution for electroless copper plating.
After that, the fiber board 1 after the electroless copper plating process is placed in a plating solution to perform a plating process, so that all the first pores 12 in the fiber board 1 are filled with metal powder (in this embodiment, the metal powder is copper powder, and in other embodiments, other metal powder is also available), and the metal powder filled in the first pores 12 is already connected to each other at the time of plating to form a plurality of metal fibers 22. In the electroplating process, the fiberboard 1 subjected to the electroless copper plating treatment is set as a cathode and is placed in an electroplating solution prepared from a copper sulfate (CuSO4) solution for electroplating treatment. In addition, the concentration of copper ions in the plating solution and the density of the applied current can be adjusted during the electroplating process, so that the metal fiber 22 has higher porosity and tensile strength.
And 3, putting the fiber board 1 with the metal fibers 22 into a vacuum furnace for high-temperature sintering treatment, wherein the high-temperature sintering temperature is higher than or equal to the melting point of the fiber tissue 11 in the fiber board 1. So that all the fiber tissues 11 in the fiber board 1 are sintered and melted, and the space occupied by the sintered fiber tissues 11 forms a plurality of second pores 21. The pore diameter of one part of the second pores 21 in the plurality of second pores 21 is larger than that of another part of the second pores 21 (of course, in other embodiments, the pore diameters of the plurality of second pores 21 may be the same, and the distance between two adjacent pores in one part of the plurality of second pores 21 is larger than that between two adjacent pores in another part (of course, in other embodiments, the distance between any two adjacent second pores 21 may be the same), when all the fiber tissues 11 are sintered, the interconnected metal fibers 22 are formed, the interconnected metal fibers 22 are interwoven to form the metal plate 2, the metal plate 2 is a three-dimensional net-shaped porous structure, the plurality of second pores 21 are located in the metal plate 2, and the shapes of the plurality of second pores 21 are different (of course, in other embodiments, the shape of one part of the second apertures 21 in the plurality of second apertures 21 may not be equal to the shape of another part of the second apertures 21, or the shapes of the plurality of second apertures 21 may be equal). After the fiber structure 11 is sintered, the metal plate 2 having the plurality of second pores 21 is subjected to hydrogen reduction annealing treatment, so that the metal plate 2 has high toughness.
And 4, mixing fifty grams of sodium hydroxide (NaOH) and twenty grams of potassium persulfate (K2S2O4) with one liter of water to serve as an oxidizing agent, and heating the oxidizing agent to keep the temperature of the oxidizing agent at about eighty ℃. After that, the metal plate 2 is put into the oxidant at eighty degrees centigrade to blacken the metal plate 2, so that the metal plate 2 has good hydrophilic performance (of course, in other embodiments, the metal plate 2 can also have good hydrophilic performance by hydrogen reduction, potassium peroxide oxidation, microetching, coating titanium dioxide on the surface of the metal plate 2, and the like, wherein 7% of hydrogen is mixed with 93% of nitrogen when the hydrogen reduction treatment is performed, and then the metal plate 2 is put into the mixed gas to be subjected to the reduction treatment, so that the metal plate 2 has good hydrophilic performance, and when the metal plate 2 has good hydrophilic performance through the microetching treatment, sulfuric acid or hydrogen peroxide solution can be selected as the microetching solution).
After that, the metal plate 2 with good hydrophilic performance is placed in a punch press, the jig B of the punch press presses the metal plate 2 along the thickness direction of the metal plate 2 (in other implementations, the hydraulic cylinder may also press the metal plate 2 along the thickness direction of the metal plate 2), and the pressing force applied by the jig B to the metal plate 2 is smaller than the yield strength of the metal plate 2, so that the metal plate 2 is plastically deformed. In this way, the thickness of the metal plate 2 becomes gradually thinner along the pressing direction, and the pore diameters of the plurality of second pores 21 also gradually decrease. The shape of each of the second apertures 21 to be crushed and the size of the deformation thereof are different from each other, but the number of the second apertures 21 in the metal plate 2 is not changed. The length of the second apertures 21 is increased and the width of the second apertures 21 is widened along the length and width directions of the metal plate 2, and the distance between two adjacent second apertures 21 is increased and widened along the length and width directions of the metal plate 2, and the length of the metal plate 2 is increased along the length direction of the metal plate 2 and the width of the metal plate 2 is increased along the width direction of the metal plate 2. However, the amount of change in the thickness direction of the metal plate 2 is larger than the amount of change in the length and width directions. In this way, the porosity of the second pores 21 in the metal plate 2 is increased, so that the working fluid 5 can be rapidly diffused in the metal plate 2, and the uniform temperature plate a has a good heat dissipation effect. In step 4, the order of the ironing process of the metal plate 2 and the hydrophilic process of the metal plate 2 may be interchanged.
And 5, providing the upper plate 3 and the lower plate 4. The lower surface of upper plate 3 sets up concavely and forms first recess 31, and surround first recess 31 first installation department 32, the lower surface of first installation department 32 is less than first recess 31 first internal surface 311, just the lower surface of first installation department 32 with the lower surface of upper plate 3 is parallel and level mutually. A plurality of the protrusions 33 are protruded downward from the first inner surface 311. Each of the bumps 33 has the abutting surface 331, and the abutting surface 331 is flush with the lower surface of the upper plate 3 (of course, the abutting surface 331 may be lower or higher than the lower surface of the upper plate 3 in other embodiments). The second groove 41 and the second mounting portion 42 surrounding the second groove 41 are recessed downward on the upper surface of the lower plate 4, the size of the second groove 41 is equal to the size of the first groove 31 (of course, in other embodiments, the size of the second groove 41 may be larger or smaller than the size of the first groove 31), and the upper surface of the second mounting portion 42 is flush with the upper surface of the lower plate 4. The metal plate 2 is placed in the second groove 41, and the upper surface of the metal plate 2 and the upper surface of the lower plate 4 are flush with each other (of course, in other embodiments, the upper surface of the metal plate 2 may be higher or lower than the upper surface of the lower plate 4)
Step 6, the upper plate 3 is placed in a first mold (not shown, the same below), and the lower surface of the first mounting portion 32 is exposed downward to the first mold. The lower plate 4 is placed in a second mold (not shown, the same applies below) such that the upper surface of the second mounting portion 42 is exposed upward from the second mold. After that, the first mold is stacked above the second mold, so that the first groove 31 and the second groove 41 are aligned up and down and are communicated with each other to form the accommodating cavity 8, the lower surface of the first mounting portion 32 and the upper surface of the second mounting portion 42 are abutted against each other, and the abutting surface 331 of the bump 33 and the upper surface of the metal plate 2 are abutted against each other. After that, the first mold and the second mold stacked on each other are placed into a vacuum furnace for high temperature pressing, so that the first mounting portion 32 and the second mounting portion 42 are pressed and sealed with each other, and an opening 7 is reserved during the pressing process, so that the receiving cavity 8 can communicate with the outside through the opening 7.
And 8, welding and sealing the opening 7 to seal the metal plate 2 and the working fluid 5 in the accommodating cavity 8, wherein the metal plate 2, the working fluid 5, the upper plate 3 and the lower plate 4 together form a uniform temperature plate A.
In summary, the manufacturing method of the temperature-uniforming plate A has the following beneficial effects:
(1) the fibreboard 1 formed by the fibrous tissue 11 has a plurality of the first apertures 12. Placing the metal powder in a plurality of the first apertures 12; and then sintering the fiber board 1 with the metal powder at a high temperature, so that all the fiber tissues 11 in the fiber board 1 are removed, and the spaces occupied by the sintered fiber tissues 11 form second pores 21, wherein the metal powder forms the metal board 2, and the second pores 21 are located in the metal board 2. In this way, only by sintering the entire fiber structure 11, the second pores 21 are formed in the space occupied by the fiber structure 11, and the second pores 21 are located in the metal plate 2. Furthermore, since the number and size of the fiber structures 11 are determined when the fiber structures 11 are formed into the fiber board 1, the size of the space occupied by the sintered fiber structures 11 is also determined. Therefore, the number of the second pores 21 formed in the metal plate 2 and the size of the pore diameter of the second pores 21 do not change with the change of the sintering temperature. In this way, the working fluid 5 in a liquid state can be stably diffused in the metal plate 2 having the second pores 21, so that the vapor chamber a has good heat dissipation performance. And then the metal plate 2 having the second apertures 21 is subjected to a thinning process, the pore diameter of the second apertures 21 in the metal plate 2 is reduced during the thinning process, and the distance between two adjacent second apertures 21 in the thinning direction is also reduced. In this way, the pore density of the second pores 21 in the metal plate 2 is increased. Therefore, the diffusion speed of the liquid working fluid 5 in the metal plate 2 can be increased, so that the liquid working fluid 5 can be uniformly distributed in the metal plate 2, and the heat dissipation performance of the uniform temperature plate A is improved.
(2) In the process of pressing the metal plate 2, the pressing force acting on the metal plate 2 is smaller than the yield strength of the metal plate 2, and along the pressing direction, the thickness of the metal plate 2 becomes gradually thinner, the pore diameters of the plurality of second pores 21 become gradually smaller, and the number of the plurality of second pores 21 does not change. This prevents the occurrence of a situation in which the pressing force acting on the metal plate 2 is too large, which results in the metal plate 2 breaking, and the pressing force is smaller than the yield strength of the metal plate 2, which makes it possible to plastically deform the metal plate 2, which is irreversible, and when the pressing force acting on the metal plate 2 disappears, the metal plate 2 does not rebound back to the thickness of the metal plate 2 before it is uncompressed, which makes it possible to make the metal plate 2 have a high porosity, so that the working fluid 5 can be rapidly diffused in the metal plate 2.
(3) The protrusion 33 abuts against the metal plate 2, so that the plate at the position of the upper plate 3 corresponding to the first groove 31 and the plate at the position of the lower plate 4 corresponding to the second groove 41 are not bent upwards or downwards due to the difference between the air pressure in the accommodating cavity 8 and the external atmospheric pressure.
(4) The upper plate 3 and the lower plate 4 are placed in a vacuum furnace for high-temperature sealing, and due to the small size of the uniform-temperature plate a, if the upper plate 3 and the lower plate 4 are sealed by welding, the sealing between the upper plate 3 and the lower plate 4 may be unstable. Therefore, high-temperature pressing is required to seal the upper plate 3 and the lower plate 4 stably, but due to the high temperature during high-temperature pressing, some substances in the upper plate 3 and the lower plate 4 are likely to react with air at high temperature, so that the service lives of the upper plate 3 and the lower plate 4 are affected. Therefore, the upper plate 3 and the lower plate 4 are placed in a vacuum furnace for high-temperature sealing, so that the phenomenon that some substances of the upper plate 3 and the lower plate 4 are easy to react with air at high temperature can be avoided, the service lives of the upper plate 3 and the lower plate 4 are prolonged, and the uniform temperature plate A has good heat dissipation performance.
(5) The gap 6 is formed between the working fluid 5 and the upper surface of the accommodating cavity 8, the gap 6 can enable the working fluid 5 to be heated and evaporated into a gaseous state, and when the gaseous working fluid 5 is cooled, the gaseous working fluid 5 is condensed into a liquid state and attached to the first inner surface 311, so that the working fluid 5 can be recycled, and the temperature equalization plate a has a good heat dissipation function.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and drawings are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the temperature-uniforming plate is characterized by comprising the following steps:
step 1, forming a fiber board by fiber tissue, wherein a plurality of first pores are formed on the fiber board;
step 2, placing metal powder into a plurality of first pores;
step 3, sintering the fiber board with the metal powder at high temperature, removing all fiber tissues in the fiber board, forming a metal board by the metal powder after high-temperature sintering, and forming second pores in the space occupied by the sintered fiber tissues, wherein the second pores are positioned in the metal board;
step 4, carrying out hydrophilic treatment on the metal plate, and then carrying out thinning treatment on the metal plate to reduce the aperture of the second pore; or firstly, the metal plate is thinned to reduce the aperture of the second pore, and then the metal plate is subjected to hydrophilic treatment;
Step 5, providing an upper plate and a lower plate, forming an accommodating cavity between the upper plate and the lower plate, and placing the metal plate in the accommodating cavity;
step 6, correspondingly matching the upper plate with the lower plate, and reserving an opening so that the accommodating cavity is communicated with the outside through the opening;
step 7, filling working fluid into the accommodating cavity through the opening, and enabling at least part of the working fluid to penetrate into the second pore of the metal plate;
and 8, sealing the upper plate, the lower plate and the opening to seal the metal plate and the working fluid in the accommodating cavity, wherein the metal plate, the working fluid, the upper plate and the lower plate jointly form the temperature equalizing plate.
2. The method for manufacturing the vapor chamber as claimed in claim 1, wherein: in step 3, the second pores have a plurality of second pores, the plurality of second pores are communicated with each other, and at least two of the plurality of second pores have different pore diameters.
3. The method for manufacturing the vapor chamber as claimed in claim 2, wherein: in step 4, in the process of pressing the metal plate, the pressing force acting on the metal plate is smaller than the yield strength of the metal plate, and the thickness of the metal plate becomes thinner gradually along the pressing direction, the pore diameter of the plurality of second pores decreases gradually, and the number of the plurality of second pores does not change.
4. The method for manufacturing the vapor chamber as claimed in claim 2, wherein: in step 4, in the process of pressing the metal plate, the distance between two adjacent second apertures along the pressing direction is gradually reduced.
5. The method for manufacturing the vapor chamber as claimed in claim 2, wherein: in step 4, in the process of pressing the metal plate, the distance between two adjacent second apertures is gradually increased along the direction perpendicular to the pressing direction, and the length and the width of the metal plate are also gradually increased.
6. The method for manufacturing the vapor chamber as claimed in claim 1, wherein: in step 4, fifty grams of sodium hydroxide (NaOH) and twenty grams of potassium persulfate (K) are selected for the hydrophilic treatment of the metal plate2S2O4) Mixed with one liter of water as an oxidizing agent, and then the oxidizing agent is heated to eighty degrees celsius, after which the metal plate is put into the oxidizing agent at eighty degrees celsius, so that the metal plate is blackened.
7. The method for manufacturing the vapor chamber as claimed in claim 1, wherein: in step 5, a first groove is formed by upward concave setting of the lower surface of the upper plate, a plurality of bumps are provided at intervals and protrude downward from the first inner surface of the first groove, and in step 6, the bumps are abutted against the metal plate.
8. The method for manufacturing the vapor chamber as claimed in claim 1, wherein: after step 1 and before step 2, the fiberboard is subjected to activation treatment to enable the surface of the fiberboard to have catalytic activity, in step 2, the fiberboard with the surface having catalytic activity is subjected to chemical plating treatment to enable the fiber structure to be tightly combined with the metal powder, and then the fiberboard plated with the metal powder is placed into an electroplating solution to be electroplated to enable the metal powder to be completely electroplated in the first pores.
9. The method for manufacturing the vapor chamber as claimed in claim 1, wherein: in step 6, the upper plate is arranged in one mold, the lower plate is arranged in the other mold, the mold provided with the upper plate is stacked above the mold provided with the lower plate, and then the two molds are placed in a high-temperature vacuum furnace for high-temperature pressing, so that the upper plate and the lower plate are sealed.
10. The method for manufacturing the vapor chamber as claimed in claim 1, wherein: in step 7, a gap is formed between the working fluid and the upper surface of the receiving cavity, and after step 7 and before step 8, the receiving cavity is vacuumized through the opening.
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Cited By (1)
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| CN111842528B (en) | 2023-08-01 |
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