CN111816684A - Display panel, manufacturing method thereof and display device - Google Patents

Abstract

The application relates to a display panel, a manufacturing method thereof and a display device. The pixel defining layer is disposed on the substrate. The pixel limiting layer is provided with a plurality of grooves which are arranged at intervals. The plurality of white light emitting units are respectively arranged in the plurality of grooves. The encapsulation layer covers the plurality of white light emitting units and the pixel defining layer. The plurality of filter layers are respectively arranged in the plurality of grooves and are respectively positioned in the packaging layers. The plurality of filter layers are used for filtering light with a transmittance corresponding to the color of the filter layers. The light emitting layer is formed on the entire surface of the pixel defining layer and the groove, and the light spectrum of the light emitting layer covers red, green, and blue. The light-emitting layer is formed by mixing and stacking corresponding spectrum materials, an opening mask is adopted in the process, and accurate position control is not needed like a precise mask technology.

Description

Display panel, manufacturing method thereof and display device

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.

Background

With the development of display technology, large-screen display technology has become a major research and development direction.

The conventional technology generally requires a high-precision metal mask (FMM) to form a light emitting layer on a substrate surface to form pixels for emitting light of different colors. However, as the size of the display panel increases, alignment errors are likely to occur using a high-precision metal mask plate, and the yield of the display panel is reduced. In addition, the high-precision metal mask plate is high in manufacturing difficulty, so that the high-precision metal mask plate is expensive in finished product price and not beneficial to reducing the cost.

Disclosure of Invention

Accordingly, it is necessary to provide a display panel, a method of manufacturing the same, and a display device, which are directed to the problem that alignment error is likely to occur using a high-precision metal mask plate, and the yield of the display panel is reduced.

A display panel, comprising:

a substrate;

the pixel limiting layer is arranged on the substrate and provided with a plurality of grooves arranged at intervals;

the light emitting layer comprises a plurality of white light emitting units which are respectively arranged in the grooves;

an encapsulation layer covering the light emitting layer and the pixel defining layer; and

and the filter layer is positioned in the packaging layer.

In one embodiment, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer disposed in a stack, the first inorganic encapsulation layer disposed proximate to the light emitting layer.

In one embodiment, the filter layer is located between the first inorganic encapsulation layer and the organic encapsulation layer.

In one embodiment, the first inorganic encapsulation layer includes a plurality of first sub-inorganic encapsulation layers arranged one above another, and one filter layer is arranged between at least two adjacent first sub-inorganic encapsulation layers.

In one embodiment, the filter layer is disposed within the organic encapsulation layer and/or within the first inorganic encapsulation layer.

In one embodiment, the filter layer is an organic material.

In one embodiment, the thickness of the middle portion of the filter layer is greater than or less than the thickness of both sides of the filter layer.

In one embodiment, the pixel defines a maximum distance L1 from the surface of the substrate to the substrate for the pixel layer, a maximum distance L2 from the surface of the substrate to the substrate for the filter layer, the L1 is greater than or equal to the L2;

in one embodiment, the difference between L1 and L2 is 1-5 um.

In one embodiment, at least one of the white light emitting units includes a structure in which a plurality of organic light emitting diodes are connected in series.

A display device comprises the display panel.

A display panel manufacturing method comprises the following steps:

providing a substrate;

forming a pixel defining layer on the substrate, the pixel defining layer being provided with a plurality of grooves;

forming a white light emitting unit in each of the plurality of grooves through an opening mask plate;

forming a first inorganic encapsulation layer on a side of the plurality of white light emitting units and the pixel defining layer away from the substrate;

forming filter layers on the surfaces, far away from the substrate, of the first inorganic packaging layers respectively;

and forming an organic packaging layer on the surfaces of the plurality of filter layers and the first inorganic packaging layer far away from the substrate.

The display panel, the manufacturing method thereof and the display device provided by the embodiment of the application comprise a substrate, a pixel limiting layer, a plurality of white light-emitting units, an encapsulating layer and a plurality of filter layers. The pixel defining layer is disposed on the substrate. The pixel limiting layer is provided with a plurality of grooves which are arranged at intervals. The plurality of white light emitting units are respectively arranged in the plurality of grooves. The encapsulation layer covers the plurality of white light emitting units and the pixel defining layer. The plurality of filter layers are located within the encapsulation layer. The plurality of filter layers may be used to filter light of the same color as the filter layers in the white light.

The light emitting layer is formed on the entire surface of the pixel defining layer and the groove, and the light spectrum of the light emitting layer covers red, green, and blue. The light-emitting layer is formed by mixing and stacking corresponding spectrum materials, an opening mask is adopted in the process, and accurate position control is not needed like a precise mask technology. By using the opening mask, the phenomenon of light emitting and color mixing caused by position errors caused by using a fine mask when the pixel limiting layer forms light emitting units with different colors can be avoided, so that the product yield can be improved. The light emitting layer positioned in the groove can form the white light emitting unit. Furthermore, the filter layers with different colors are arranged on one side of the white light emitting unit, which is far away from the substrate, so that the pixels corresponding to the white light emitting unit can emit light with different colors. The filter layers of different colors can enable the display panel to display different patterns. In addition, the filter layer is arranged on the packaging layer, so that the situation that an optical filter is arranged on the outer side of the display panel can be avoided, and the thickness of the display panel can be obviously reduced. The display panel is convenient to carry and use.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of a display panel according to an embodiment of the present application;

FIG. 2 is a cross-sectional view along the I-I direction of the display panel provided in one embodiment of the present application;

FIG. 3 is a cross-sectional view along the I-I direction of the display panel provided in one embodiment of the present application;

FIG. 4 is a cross-sectional view of a thin film encapsulation layer of the display panel according to an embodiment of the present application;

FIG. 5 is a cross-sectional view along the I-I direction of the display panel provided in one embodiment of the present application;

FIG. 6 is a cross-sectional view along the I-I direction of the display panel provided in one embodiment of the present application;

fig. 7 is a structural diagram of a white light emitting unit according to an embodiment of the present application.

Description of reference numerals:

the display device includes a display panel 10, a substrate 100, a pixel defining layer 200, a groove 210, an anode layer 310, a cathode layer 320, a white light emitting unit 400, an electron injection layer 402, a first electron transport layer 404, a first yellow light emitting layer 406, a first blue light emitting layer 408, a second yellow light emitting layer 410, a first hole transport layer 412, a first electron blocking layer 414, a charge generation layer 416, a second electron transport layer 418, a third yellow light emitting layer 420, a second blue light emitting layer 422, a fourth yellow light emitting layer 424, a second electron blocking layer 426, a second hole transport layer 428, a hole injection layer 430, an encapsulation layer 500, a first inorganic encapsulation layer 510, a first sub-inorganic encapsulation layer 512, an organic encapsulation layer 520, a second inorganic encapsulation layer 530, a filter layer 600, a driving circuit layer 700, a touch layer 800, and a light emitting layer 20.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Spatially relative terms such as "upper" and "lower" are defined herein with reference to the drawings. Thus, it will be understood that "upper" and "lower" may be used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be formed directly on the other layer, or intervening layers may also be present. Thus, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers interposed therebetween.

In the drawings, the size of layers and regions may be exaggerated for clarity. It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. Like reference numerals refer to like elements throughout.

Hereinafter, although terms such as "first", "second", and the like may be used to describe various components, the components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another. It will also be understood that expressions used in the singular include expressions of the plural unless the singular has a distinctly different meaning in the context. Furthermore, in the following embodiments, it will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

In the following embodiments, when layers, regions or elements are "connected", it may be interpreted that the layers, regions or elements are not only directly connected but also connected through other constituent elements interposed therebetween. For example, when layers, regions, elements, etc. are described as being connected or electrically connected, the layers, regions, elements, etc. may be connected or electrically connected not only directly or directly but also through another layer, region, element, etc. interposed therebetween.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. When a statement such as "at least one (or" an) of … … is placed after a list of elements (elements), the entire list of elements (elements) is modified rather than modifying individual elements (elements) in the list.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Electronic or electrical devices and/or any other related devices or components (e.g., display devices including display panels and display panel drivers, wherein the display panel drivers also include driver controllers, gate drivers, gamma reference voltage generators, data drivers, and emission drivers) according to embodiments of the inventive concepts described herein may be implemented using any suitable hardware, firmware (e.g., application specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices may be formed on one Integrated Circuit (IC) chip or on separate IC chips. In addition, various components of these devices may be implemented on a flexible printed circuit film, a Tape Carrier Package (TCP), a Printed Circuit Board (PCB), or formed on one substrate.

Although exemplary embodiments of a display module and a display apparatus including the same have been particularly described herein, many modifications and variations will be apparent to those skilled in the art. Accordingly, it will be understood that display modules and display devices including display modules constructed in accordance with the principles of the present application may be implemented other than as specifically described herein. The application is also defined in the claims and their equivalents.

Referring to fig. 1 and fig. 2, an embodiment of the present application provides a display panel 10. The display panel 10 includes a substrate 100, a pixel defining layer 200, a light emitting layer 20, an encapsulation layer 500, and a plurality of filter layers 600. The pixel defining layer 200 is disposed on the substrate 100. The pixel defining layer 200 defines a plurality of spaced grooves 210. The light emitting layer 20 includes a plurality of white light emitting units 400. The plurality of white light emitting units 400 are respectively disposed in the plurality of grooves 210. The encapsulation layer 500 covers the light emitting layer 20 and the pixel defining layer 200. The plurality of filter layers 600 are located within the encapsulation layer 500.

A plurality of the grooves 210 may be arranged in an array in the pixel defining layer 200. The plurality of white light emitting units 400 and the plurality of grooves 210 may be disposed in a one-to-one correspondence. One of the white light emitting units 400 may be disposed at the bottom of one of the grooves 210. The encapsulation layer 500 may cover the white light emitting unit 400 and the side of the pixel defining layer 200 away from the substrate 100. The encapsulation layer 500 may extend along the edge of the groove 210 to the bottom of the groove 210 and cover the surface of the white light emitting unit 400. The plurality of filter layers 600 may be disposed in one-to-one correspondence with the grooves 210, and the orthographic projection of the plurality of filter layers 600 on the substrate 100 falls into the grooves 210. The white light emitting units 400 may be disposed in one-to-one correspondence with the filter layers 600. The orthographic projection of the filter layer 600 on the substrate 100 is greater than or equal to the orthographic projection of the corresponding white light emitting unit 400 on the substrate 100. That is, light emitted from one of the white light emitting units 400 may pass through one of the filter layers 600 and then emit light having the same color as the filter layer 600.

In one embodiment, one filter layer 600 may be disposed in each of the recesses 210. In each of the grooves 210, an orthogonal projection of the filter layer 600 on the surface of the substrate 100 may be greater than or equal to an orthogonal projection of the white light emitting unit 400 on the substrate 100. The plurality of filter layers 600 are used to emit light having the same color as the filter layer 600.

Further, the light emitting layer 20 is formed on the entire surface of the pixel defining layer 200 and the groove 210, and the light spectrum of the light emitting layer 20 covers red, green, and blue. The light emitting layer 20 is formed by mixing and stacking corresponding spectrum materials, and an opening mask is adopted in the whole process, so that precise position control is not required like a precise mask technology. By using the opening mask, a light emitting and color mixing phenomenon caused by a position error caused by using a fine mask when the pixel defining layer 200 forms light emitting units of different colors can be avoided, so that the product yield can be improved. The light emitting layer 20 in the groove 210 can form the white light emitting unit 400. Further, by disposing the filter layer 600 with different colors on the side of the white light emitting unit 400 away from the substrate, the pixels corresponding to the white light emitting unit 400 can emit light with different colors. The filter layer 600 of different colors may allow the display panel 10 to display different patterns. In addition, by providing the filter layer 600 on the encapsulation layer 500, it is possible to avoid disposing an optical filter on the outer side of the display panel 10, and the thickness of the display panel 10 can be significantly reduced. The display panel 10 is convenient to carry and use.

In one embodiment, the substrate 100 may be a flexible substrate 100 or a rigid substrate 100. In one embodiment, the material of the flexible substrate 100 may be polyvinyl alcohol (PVA), Polyester (PET), Polyimide (PI), polyethylene naphthalate (PEN), a textile material, or the like. The material of the rigid substrate 100 may be glass, ceramic, or the like.

In one embodiment, a planarization layer, a thin film transistor, an insulating layer, and the like may be disposed between the pixel defining layer 200 and the substrate 100. The pixel defining layer 200 can be manufactured by a process of exposure and development through a mask.

In one embodiment, the filter layer 600 may be a three-primary color filter film. The filter layer 600 may be classified into a red filter layer, a green filter layer, and a blue filter layer. Different color filter layers 600 may be disposed in different adjacent grooves 210, respectively, so as to emit different colors of light.

In one embodiment, the filter layer 600 may be formed by using a flexible organic material as a substrate and then coating three colors of red, green, and blue on the surface of the flexible organic material. In one embodiment, the coating material may be applied to the surface of the flexible substrate material by electrodeposition, printing, pigment dispersion, or the like.

In one embodiment, the filter layer 600 may have a thickness of 0.8 microns to 3 microns. Further, the filter layer 600 may have a thickness of 1 to 2 microns. In one embodiment, the filter layer 600 may have a thickness of 1.8 microns. At this thickness, the filter layer 600 can prevent light from generating large attenuation, and has a good light filtering effect.

In one embodiment, the white light emitting unit 400 may include a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer.

In one embodiment, the groove 210 may have a trapezoidal structure in a vertical cross section. The trapezoid structure may facilitate the deposition of the white light emitting unit 400 on the surface of the groove 210. In one embodiment, the projection of the groove 210 on the substrate 100 may also be a circle, an ellipse, a triangle, or other polygonal structures.

In one embodiment, the encapsulation layer includes a first inorganic encapsulation layer 510, an organic encapsulation layer 520, and a second inorganic encapsulation layer 530, which are disposed in a stack. The first inorganic encapsulation layer 510 is disposed adjacent to the light emitting layer 20. That is, the first inorganic encapsulation layer 510 covers the plurality of white light emitting units 400 and the pixel defining layer 200. The first inorganic encapsulation layer 510, the organic encapsulation layer 520, and the second inorganic encapsulation layer 530 sequentially cover the plurality of white light emitting units 400 and the pixel defining layer 200. Accordingly, the multi-layered package structure may prevent water and oxygen from invading the white light emitting unit 400.

The filter layer 600 is located between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520. Therefore, the filter layer 600 is closer to the white light emitting unit 400, thereby being beneficial to improving the saturation of the display colors of the display panel 10. The encapsulation layer 500 may function to prevent water and oxygen from invading the white light emitting unit 400. The encapsulation layer 500 may also have a function of improving flexibility of the display panel 10. The first inorganic encapsulation layer 510, the organic encapsulation layer 520, and the second inorganic encapsulation layer 530 cover a side of the plurality of white light emitting units 400 and the pixel defining layer 200 away from the substrate 100. A surface of the filter layer 600 may be in contact with the first inorganic encapsulation layer 510 and the organic encapsulation layer 520, respectively.

In one embodiment, the material of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be silicon oxide, silicon nitride, aluminum oxide, or other inorganic materials. The first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 can be fabricated by atomic layer deposition techniques or chemical vapor deposition methods. The first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may serve the purpose of preventing water and oxygen from invading the white light emitting unit 400. The organic encapsulation layer 520 may be an organic material. In one embodiment, the organic encapsulation layer 520 may be fabricated by an inkjet printing process. The organic encapsulation layer 520 may function to improve flexibility of the encapsulation layer 500. The organic encapsulation layer 520 may prevent the encapsulation layer 500 from being broken when the display panel 10 is bent.

In one embodiment, the thickness of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be 1 micron to 8 microns. In one embodiment, the thickness of the first inorganic encapsulation layer 510 is 2 to 8 microns. Further, the thickness of the first inorganic encapsulation layer 510 may be 5 micrometers. The thickness of the second inorganic encapsulation layer 530 may also be 1 to 5 micrometers. In one embodiment, the organic encapsulation layer 520 may have a thickness of 2 microns. In one embodiment, the thickness of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may each be 3 micrometers. The organic encapsulation layer 520 may have a thickness of 7 microns. Within this range, the encapsulation layer 500 may have sufficient flexibility while also ensuring the water-oxygen barrier properties of the first inorganic encapsulation layer 510 and the organic encapsulation layer 520.

In one embodiment, the filter layer 600 is disposed between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520. Therefore, the filter layer 600 is closer to the white light emitting unit 400, thereby being beneficial to improving the saturation of the display colors of the display panel 10.

In one embodiment, the organic encapsulation layer 520 and the filter layer 600 are both organic materials. Therefore, the adhesion between the organic encapsulation layer 520 and the filter layer 600 is better, the adhesion between inorganic and organic is increased, and these effects are not expressed; separation of the organic encapsulation layer 520 and the filter layer 600 may be prevented. Further, the overall thickness of the organic layer on which the filter layer 600 and the organic encapsulation layer 520 are stacked is increased. The filter layer 600 and the organic encapsulation layer 520 as a whole further improve the flexibility of the encapsulation layer 500.

Referring to fig. 3, in one embodiment, the plurality of filter layers 600 are disposed in the organic encapsulation layer 520. That is, the filter layer 600 is coated by the organic encapsulation layer 520. The filter layer 600 may be prevented from peeling off from the organic encapsulation layer 520. The filter layer 600 may be an organic material. The organic encapsulation layer 520 and the filter layer 600 as a whole improve the flexibility of the encapsulation layer 500. Further, by disposing the plurality of filter layers 600 in the organic encapsulation layer 520, the filter layer 600 may also serve to increase the overall flexibility of the encapsulation layer 500 when it is made of an organic material. And the filter layer 600 is more flexible than the organic encapsulation layer 520 having the same thickness. Disposing the filter layer 600 inside the organic encapsulation layer 520 may reduce the overall thickness of the organic encapsulation layer 520.

In one embodiment, after the first inorganic encapsulation layer 510 is formed, a portion of the organic encapsulation layer 520 may be deposited on the surface of the first inorganic encapsulation layer 510. Further, a pit may be formed on the surface of the organic encapsulation layer 520 by a process such as exposure, development, or etching, and then the filter layer 600 may be disposed in the pit. Finally, a part of organic material is deposited on the surface of the filter layer 600 away from the substrate 100 to cover the filter layer 600, so as to form the complete organic encapsulation layer 520. The filter layer 600 is enclosed within the organic encapsulation layer 520. Preferably, the filter layers 600 may also be respectively located on the convex surfaces of the organic encapsulation layers 520. The convex surface of the organic encapsulation layer 520 may be provided with the filter layer 600 of different colors. The projection of each filter layer 600 on the surface of the substrate 100 may cover the corresponding white light emitting unit 400. By disposing the filter layer 600 on the convex surface of the organic encapsulation layer 520, the surface area of the filter layer 600 can be increased accordingly, the area of the organic encapsulation layer 520 covering the white light emitting unit 400 can be increased, and thus the filtering effect can be improved.

In one embodiment, the filter layer 600 may include organic molecules dispersed in the organic encapsulation layer 520. Therefore, the filter layer 600 and the organic encapsulation layer 520 can be integrated together, and the overall structure of the organic encapsulation layer 520 is not affected.

In one embodiment, the filter layer 600 is disposed within the first inorganic encapsulation layer 510. It is understood that the filter layer 600 may be an organic material having different colors, and the filter layer 600 is disposed in the first inorganic encapsulation layer 510, which may increase the flexibility of the first inorganic encapsulation layer 510.

Further, the filter layer 600 may include organic molecules uniformly distributed within the first inorganic encapsulation layer 510. In one embodiment, the filter layer 600 may also be a sheet structure inserted into the first inorganic encapsulation layer 510. Since the first inorganic encapsulation layer 510 is further close to the white light emitting unit 400, the saturation of the display colors of the display panel 10 can be further improved.

Referring to fig. 4, in one embodiment, the first inorganic encapsulation layer 510 includes a plurality of first inorganic sub-encapsulation layers 512 stacked one on another. One filter layer 600 is disposed between at least two adjacent first sub-inorganic encapsulation layers 512. It is understood that the filter layer 600 may be an organic material. By disposing the filter layer 600 between at least two adjacent first sub-inorganic encapsulation layers 512. The filter layer 600 may further improve the flexibility of the first inorganic encapsulation layer 510 and the adhesion between the first sub-inorganic encapsulation layers 512 while having a filtering effect. In addition, the filter layer 600 is integrally disposed between the two adjacent first sub-inorganic encapsulation layers 512, so that the process difficulty can be reduced.

In one embodiment, the second inorganic encapsulation layer 530 may include a plurality of second sub-inorganic encapsulation layers arranged in a stack, and one of the filters 600 is arranged between at least two adjacent second sub-inorganic encapsulation layers. The filter layer may be an organic material. By disposing the filter layer 600 between at least two adjacent second sub-inorganic encapsulation layers. The filter layer 600 may further improve the flexibility of the second inorganic encapsulation layer 530 while having a filtering effect.

In one embodiment, the filter layer 600 may include organic molecules uniformly distributed in the organic encapsulation layer 510, which may improve flexibility of the organic encapsulation layer 510 and bondability between the organic encapsulation layer 510, the second inorganic encapsulation layer 530, and the first inorganic encapsulation layer 510, thereby preventing the organic encapsulation layer 510, the second inorganic encapsulation layer 530, and the first inorganic encapsulation layer 510 from being separated from each other.

Referring to fig. 5, in an embodiment, the filter layer 600 may also be located between the organic encapsulation layer 520 and the second inorganic encapsulation layer 530. Opposite surfaces of the filter layer 600 are in contact with the organic encapsulation layer 520 and the second inorganic encapsulation layer 530, respectively. In one embodiment, a cathode layer 320 may be disposed between the white light emitting cell 400 and the first inorganic encapsulation layer 510. The cathode layer 320 may cover the surfaces of the white light emitting unit 400 and the pixel defining layer 200 as a whole. The first inorganic encapsulation layer 510 covers the surface of the cathode layer 320 far from the substrate 100. A plurality of anode layers 310 may be further disposed between the white light emitting unit 400 and the substrate 100. In one embodiment, each of the white light emitting cells 400 corresponds to one of the anode layers 310. When the anode layer 310 and the cathode layer 320 are powered on, the white light emitting unit 400 may be driven to emit light.

In one embodiment, a driving circuit layer 700 may be further disposed between the substrate 100 and the plurality of anode layers 310. The driving circuit layer 700 may be connected to a plurality of the anode layers 310, respectively. The driving circuit layer 700 includes a circuit array including a plurality of thin film transistors. Whether the anode layer 310 is energized or not can be controlled by the thin film transistor. When one of the anode layers 310 is powered on, the white light emitting unit 400 corresponding to the anode layer 310 may emit light.

Referring to fig. 6, in an embodiment, a thickness of a central portion of the filter layer 600 is greater than or less than a thickness of a peripheral side of the filter layer 600. Accordingly, the filter layer 600 may constitute a structure of a concave lens or a convex lens. The filter layer 600 having a concave lens may have a diverging function with respect to light, and thus may expand a viewing angle range. The filter layer 600 having a convex lens structure may have a focusing function, and thus may improve brightness of light emitted in a direction perpendicular to the display panel 10. Improve the brightness of light color. The display effect of the display panel 10 can be improved. Different types of filter layers 600 may be selected according to actual needs.

In one embodiment, a central portion of the filter layer 600 may transition uniformly to a peripheral side of the filter layer 600, and a thickness of the filter layer 600 may increase or decrease uniformly from the central portion of the filter layer 600 to the peripheral side of the filter layer 600. That is, the rate of change of the cross-sectional area of the filter layer 600 is the same from the middle portion of the filter layer 600 to the peripheral side of the filter layer 600. In one embodiment, the central portion of the filter layer 600 may transition to the peripheral side of the filter layer 600 through a smooth curve, or may transition in a step shape.

In one embodiment, the filter layer 600 has an ellipsoidal structure. Accordingly, the filter layer 600 has a structure of a convex lens. The filter layer 600 with the convex lens structure has a better light-gathering effect, so that the display effect of the display panel 10 is further improved.

In one embodiment, the maximum distance L1 from the surface of the pixel defining layer 200 away from the substrate 100 to the substrate 100 is greater than or equal to the maximum distance L2 from the surface of the filter layer 600 away from the substrate 100 to the substrate 100. That is, the height of the edge of the opening of the recess 210 is higher than the height of the top of the filter layer 600. The maximum distance from the surface of the substrate 100 to the substrate 100 of the filter layer 600 is less than the L1. That is, the filter layer 600 is located in the groove 210. That is, the filter layer 600 is embedded in the groove 210, so that the filter layer 600 can be prevented from falling off from the groove 210. In addition, the filter layer 600 is embedded in the groove 210, so that the space occupied by the filter layer 600 can be reduced, and the thickness of the encapsulation layer 500 can be reduced. Further, the surface of the filter layer 600 away from the substrate 100 may also cover the organic encapsulation layer 520. Accordingly, the organic encapsulation layer 520 is partially embedded in the groove 210. The filter layer 600 and the encapsulation layer 500 are integrated and engaged with each other through the recess 210 and the pixel defining layer 200. The filter layer 600 is embedded in the groove 210, and the edge of the filter layer 600 can be inserted into the sidewall of the groove 210, so that the light emitted from the white light emitting unit 400 can be sufficiently filtered. A portion of the first inorganic encapsulation layer 510, the filter layer 600, and a portion of the organic encapsulation layer 520 are embedded in the groove 210, which can improve the adhesion among the pixel defining layer 200, the first inorganic encapsulation layer 510, the filter layer 600, and the organic encapsulation layer 520. It is possible to prevent detachment among the pixel defining layer 200, the first inorganic encapsulation layer 510, the filter layer 600, and the organic encapsulation layer 520. Further, when the depth of the groove 210 is sufficient, a portion of the second inorganic encapsulation layer 530 may also fall into the groove 210. The encapsulation layer 500 and the groove 210 are concavo-convex engaged with each other, improving adhesion between the encapsulation layer 500 and the pixel defining layer 200.

Further, a portion of the encapsulation layer 500 covering the filter layer 600 may inevitably fall into the groove 210, for example, a side of the encapsulation layer 500 close to the substrate 100 may fall into the groove 210. Therefore, the encapsulation layer 500 may be partially engaged with the pixel defining layer 200 through the groove 210, so that the pixel defining layer 200 may be prevented from being previously separated from the encapsulation layer 500. Further, a side of the encapsulation layer 500 close to the substrate 100 may be the first inorganic encapsulation layer 510. When the recess 210 is deep enough, the second inorganic encapsulation layer 530 may also fall into the recess 210, and thus the degree of engagement of the encapsulation layer 500 with the pixel defining layer 200 may be enhanced. Preferably, the difference between L1 and L2 is 1-5 um. Within this range, the engagement between the encapsulation layer 500 and the pixel defining layer 200 is strong, and the process difficulty is not increased.

In one embodiment, the height of the edge of the opening of the recess 210 is at least 1 μm higher than the height of the top of the filter layer 600. That is, the difference between the vertical distance from the surface of the substrate 100 to the virtual plane where the opening of the recess 210 is located is at least 1 μm. Within this height difference range, the depth to which a portion of the first inorganic encapsulation layer 510, the filter layer 600, and a portion of the organic encapsulation layer 520 are embedded into the groove 210 is sufficient to improve the adhesion between the encapsulation layer 500 and the pixel defining layer 200. Further, in the range of the height difference, the groove 210 does not have to be too deep, so that the process complexity can be reduced and the work efficiency can be improved.

In one embodiment, at least one of the white light emitting units 400 includes a structure in which a plurality of organic light emitting diodes are connected in series. It will be appreciated that light intensity may be significantly attenuated after passing through the filter layer 600. By the series structure of the plurality of white organic light emitting diodes, the light emitting intensity of the white light emitting unit 400 may be increased to offset the attenuation of light generated by the optical filter. Therefore, the white light emitting unit 400 is configured as a plurality of organic light emitting diodes in series to ensure the light emitting effect of the display panel 10. In one embodiment, the series connection of the plurality of organic light emitting diodes may include a plurality of organic light emitting diodes of different colors connected in series in a film lamination direction, or connected in series in a direction parallel to the substrate 100. A plurality of the white light emitting diodes may be connected in series to emit white light. In one embodiment, the structure in which the plurality of organic light emitting diodes are connected in series may also include a blue light emitting diode and a green light emitting diode. The blue light emitting diode and the green light emitting diode are matched with each other to emit white light, thereby forming the white light emitting unit 400.

Referring to fig. 7, in one embodiment, the series structure of organic light emitting diodes includes an electron injection layer 402, a first electron transport layer 404, a first yellow light emitting layer 406, a first blue light emitting layer 408, a second yellow light emitting layer 410, a first hole transport layer 412, a first electron blocking layer 414, a charge generation layer 416, a second electron transport layer 418, a third yellow light emitting layer 420, a second blue light emitting layer 422, a fourth yellow light emitting layer 424, a second electron blocking layer 426, a second hole transport layer 428, and a hole injection layer 430, which are sequentially disposed.

In one embodiment, the display panel 10 further includes a touch layer 800. The touch layer 800 is disposed on a side of the second inorganic encapsulation layer 530 away from the substrate 100. It is understood that the touch layer 800 can sense an external touch signal and transmit the touch signal to the driving chip. The driving chip may light up different white light emitting units 400 through the driving circuit layer 700. In one embodiment, a polarizer is also included. The touch layer 800 and the polarizer are laminated on the display panel 10 on the side away from the substrate 100. Note that the lamination order of the polarizer and the touch layer 800 with respect to the display panel 10 may be determined according to specific situations, and is not limited herein. For example, in some embodiments, the touch layer 800 and the polarizer may be sequentially stacked on the display panel 10 by adhesion, and then a cover plate may be disposed on the outermost side of the display panel 10.

The embodiment of the application also provides a display device. The display device includes the display panel 10 provided in the above embodiments. The display panel 10 may be any product or component having a display function, such as an OLED display device, electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a wearable device, and an internet of things device, which is not limited in this respect. In the display device, by disposing the filter layer 600 with different colors on the light emitting surface of the white light emitting unit 400, the pixels corresponding to the white light emitting unit 400 can emit light with different colors, so that the display panel 10 can display different patterns. In addition, by disposing the filter layer 600 in the groove 210, it is possible to avoid disposing an optical filter outside the display panel 10, and the thickness of the display device can be significantly reduced. The display device is convenient to carry and use.

The embodiment of the present application further provides a manufacturing method of the display panel 10. The method comprises the following steps:

s10, providing the substrate 100;

s20, forming the pixel defining layer 200 on the substrate 100, the pixel defining layer 200 being provided with a plurality of the grooves 210;

s30, forming a white light emitting unit 400 in each of the plurality of grooves 210 through an open mask;

s40, forming the first inorganic encapsulation layer 510 on the side of the plurality of white light emitting cells 400 and the pixel defining layer 200 away from the substrate 100;

s50, forming a filter layer 600 on the surface of the first inorganic encapsulation layer 510 away from the substrate 100;

s60, forming an organic encapsulation layer 520 on the surfaces of the plurality of filter layers 600 and the first inorganic encapsulation layer 510 away from the substrate 100.

In the S20, the pixel defining layer 200 may be precisely fabricated through a photolithography process. The pixel defining layer 200 may be formed with a plurality of grooves 210 arranged in an array. The arrangement of the pixels can be determined by the plurality of grooves 210 arranged in an array. The groove 210 may be a pixel opening.

In S30, the OPEN MASK (OPEN MASK) is different from a high-precision metal MASK (FMM). The opening MASK (OPEN MASK) may be a hollow frame structure. The light emitting layer 20 may be formed on the entire surface of the pixel defining layer 200 away from the pixel defining layer 200 and the recess 210 by the opening mask (OPENMASK), and the light spectrum of the light emitting layer 20 covers red, green, and blue. The light emitting layer 20 is formed by mixing and stacking corresponding spectrum materials, and the opening mask is adopted in the whole process, so that precise position control is not required like a precise mask technology. By using the opening mask, a light emitting and color mixing phenomenon caused by a position error caused by using a fine mask when the pixel defining layer 200 forms light emitting units of different colors can be avoided, so that the product yield can be improved. The light emitting layer 20 in the groove 210 can form the white light emitting unit 400.

In S50, by disposing the filter layer 600 in the groove 210, the filter layer 600 is used to emit light with the same color as the filter layer 600; the filter can be prevented from being arranged on the outer side of the display panel 10, and the thickness of the display panel 10 can be remarkably reduced. The display panel is convenient to carry and use.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A display panel, comprising:

a substrate (100);

the pixel limiting layer (200) is arranged on the substrate (100) and provided with a plurality of grooves (210) arranged at intervals;

a light emitting layer (20) including a plurality of white light emitting units (400) respectively disposed in the plurality of grooves (210);

an encapsulation layer (500) covering the light emitting layer (20) and the pixel defining layer (200); and

a filter layer (600) within the encapsulation layer (500).

2. The display panel of claim 1, wherein the encapsulation layer (500) comprises a first inorganic encapsulation layer (510), an organic encapsulation layer (520), and a second inorganic encapsulation layer (530) in a stacked arrangement, the first inorganic encapsulation layer (510) being disposed proximate to the light emitting layer (20).

3. The display panel of claim 2, wherein the filter layer (600) is located between the first inorganic encapsulation layer (510) and the organic encapsulation layer (520).

4. A display panel as claimed in claim 2 characterized in that the filter layer (600) is arranged in the organic encapsulation layer (520) and/or in the first inorganic encapsulation layer (510); preferably, the first inorganic encapsulation layer (510) comprises a plurality of first sub-inorganic encapsulation layers (512) arranged one above the other, and the filter layer (600) is arranged between at least two adjacent first sub-inorganic encapsulation layers (512).

5. A display panel as claimed in claim 3 or 4 characterized in that the filter layer (600) is an organic material.

6. A display panel as claimed in claim 3 or 4 characterized in that the thickness of the middle part of the filter layer (600) is larger or smaller than the thickness of both sides of the filter layer (600).

7. The display panel according to any of claims 1 to 4, wherein the pixel defining layer (200) is away from the surface of the substrate (100) by a maximum distance L1 to the substrate (100), the filter layer (600) is away from the surface of the substrate (100) by a maximum distance L2 to the substrate (100), the L1 is greater than or equal to the L2;

preferably, the difference between L1 and L2 is 1-5 um.

8. The display panel according to claim 1, wherein at least one of the white light emitting units (400) comprises a structure in which a plurality of organic light emitting diodes are connected in series.

9. A display device, characterized in comprising a display panel (10) according to any one of claims 1-8.

10. A method for manufacturing a display panel is characterized by comprising the following steps:

providing a substrate (100);

forming a pixel defining layer (200) on the substrate (100), the pixel defining layer (200) being provided with a plurality of grooves (210);

forming a white light emitting unit (400) in each of the plurality of grooves (210) through an opening mask;

forming a first inorganic encapsulation layer (510) on a side of the plurality of white light emitting cells (400) and the pixel defining layer (200) away from the substrate (100);

forming a filter layer (600) on the surface of the first inorganic packaging layer (510) far away from the substrate (100);

forming an organic encapsulation layer (520) on the surface of the filter layer (600) and the first inorganic encapsulation layer (510) away from the substrate (100).

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