CN111799241A - Bonding structure, method of making the same, and display panel - Google Patents

Abstract

The present application relates to a bonding structure, a manufacturing method thereof and a display panel. The bonding structure includes a first device, a second device, and an array of conductive pillars. The first device includes a first electrode. The second device is disposed opposite to the first device. The second device includes a second electrode. The conductive column array is sandwiched between the first electrode and the second electrode, and electrically connects the first electrode and the second electrode. Both ends of the conductive column array can be in contact with the first electrode and the second electrode respectively. Therefore, by setting the distance between the two ends of the conductive column array and the first electrode and the second electrode, the The contact area between the two electrodes can ensure good electrical contact between the first electrode and the second electrode. By making the two ends of the conductive column array respectively contact the first electrode and the second electrode, the purpose of circuit conduction can be achieved.

Description

Bonding structure, method of making the same, and display panel

technical field

The present invention relates to the field of display technology, in particular to a bonding structure and a manufacturing method thereof and a display panel.

Background technique

With the development of display technology, the requirements for the electrical connection between the panel and the components are getting higher and higher.

In the traditional technology, the electrical connection between the pads of the panel and the pads of the components is realized by the metal particles exposed inside the anisotropic conductive adhesive (ACF) after the particles are crushed. However, the anisotropic conductive adhesive has higher requirements on the contact area between the pad and the pad. When the contact area is small, the number of metal particles between the pad and the pad is small, which affects the conductive effect.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a bonding structure and a manufacturing method thereof and a display panel for the above problems.

In one aspect of the present application, a bonding structure is provided, including: a first device including a first electrode; a second device disposed opposite to the first device, the second device including a second electrode; and a conductive column array , which is sandwiched between the first electrode and the second electrode and used to electrically connect the first electrode and the second electrode.

In one embodiment, the conductive column array includes a plurality of conductive columns arranged in parallel, the plurality of conductive columns extending from the first electrode to the direction of the second electrode. This embodiment provides possible implementations of the extending direction of the conductive pillars.

In one embodiment, the plurality of conductive pillars are arranged at intervals. In this embodiment, there may be gaps between the conductive pillars and the conductive pillars. The voids can be filled with colloid, thereby increasing the contact area between the colloid and the sidewalls of the conductive pillars.

In one embodiment, along a direction parallel to the first electrode, the cross-sectional area of the plurality of conductive pillars becomes smaller in a gradient direction from the first electrode to the second electrode; preferably, the The shape of the conductive column is a cone. This embodiment can facilitate the insertion of the conductive post into the colloid.

In one embodiment, the conductive column includes a plurality of circular truncated cones, and the bottoms and the tops of the plurality of circular truncated truncated cones are connected in sequence. The conductive pillars may also include truncated truncated structures, providing one possible embodiment of the conductive pillars.

In one embodiment, the conductive pillar array further includes a plurality of conductive particles, and one end of each of the conductive pillars away from the first electrode is in contact with the second electrode through one of the conductive particles. In this embodiment, the area where the conductive particles are attached to the inner surface of the pit of the second electrode is relatively large, so the conductive area can be increased and the on-resistance can be reduced.

In one embodiment, a colloidal layer is further included, sandwiched between the first device and the second device, and the conductive column array is located in the colloidal layer. In this embodiment, the colloid layer can increase the firmness of the connection between the first electrode and the second electrode.

Another aspect of the present application provides a method for fabricating a bonding structure, including: providing a first device, the first device including a first electrode; forming a conductive column array on the surface of the first electrode; Relatively close to the first device such that the second electrode of the second device contacts a surface of the array of conductive pillars remote from the first device.

In one embodiment, in the step of forming a conductive column array on the surface of the first electrode, the conductive column array is integrally formed with the first electrode. This embodiment can improve the firmness of the connection between the conductive column array and the first electrode, and also simplifies the process steps.

Another aspect of the present application provides a display panel, which is characterized in that it includes the bonding structure or the bonding structure produced by the manufacturing method of the bonding structure; wherein, the first device is a panel The main body, the second device is a component.

The bonding structure and the manufacturing method thereof, and the display panel provided by the embodiments of the present application, the bonding structure includes a first device, a second device and a conductive column array. Wherein, the first device includes a first electrode; the second device is disposed opposite to the first device, the second device includes a second electrode; the conductive column array is sandwiched between the first electrode and the second electrode for connecting the first electrode is electrically connected to the second electrode. Since both ends of the conductive column array can be in contact with the first electrode and the second electrode, respectively, by setting the contact area between the two ends of the conductive column array and the first electrode and the second electrode, the first electrode and the second electrode can be ensured. With good electrical contact between the second electrodes, the purpose of circuit conduction can be achieved. At the same time, the problem of damage to the first device or the second device caused by pressing the first electrode and the second electrode at high temperature and high pressure can be avoided.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a cross-sectional view of a bonding structure provided in an embodiment of the present application;

2 is a cross-sectional view of a bonding structure provided by another embodiment of the present application;

3 is a cross-sectional view of a conductive column including a truncated cone provided by an embodiment of the present application;

4 is a cross-sectional view of a bonding structure provided by yet another embodiment of the present application;

FIG. 5 is a cross-sectional view of a conductive pillar connected to a second electrode through conductive particles according to an embodiment of the present application.

Description of reference numbers:

Bonding structure 10; first device 100; first electrode 110; second device 200; second electrode 210; conductive pillar array 300; conductive pillar 310;

Detailed ways

In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Back, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device or Elements must have a particular orientation, be constructed and operate in a particular orientation and are therefore not to be construed as limitations of the invention. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or an intervening element may also be present.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

The applicant's long-term research found that the pads and pins between the devices are usually connected by anisotropic conductive glue. When the pads and the pins need to be electrically connected, the anisotropic conductive glue is usually coated between the pads and the pins. The device is then pressed at a high temperature by an indenter, so that the pads and the pins are brought close to each other. At the same time, the particles in the anisotropic conductive adhesive are crushed, so that the conductive particles therein are exposed. The conductive particles dispersed in the anisotropic conductive adhesive are in close contact with each other, and are in contact with the pads and pins to conduct electricity. However, when the relative area of the pads or the pins is small, or when the bonding pads and the pins are misaligned, or due to uneven density distribution of the conductive particles, the pins can be connected to each other. The number of the conductive particles of the feet or pads is small, thereby affecting the effect of conduction. If the pad and the pin are seriously misaligned, a short circuit may be caused.

Referring to FIG. 1 , an embodiment of the present application provides a bonding structure 10 . The bonding structure 10 includes a first device 100 , a second device 200 and an array 300 of conductive pillars. The first device 100 includes a first electrode 110 . The second device 200 is disposed opposite to the first device 100 , and the second device 200 includes a second electrode 210 . The conductive column array 300 is sandwiched between the first electrode 110 and the second electrode 210 , and the conductive column array 300 is used to electrically connect the first electrode 110 and the second electrode 210 .

In one embodiment, the first device 100 may be a flexible circuit board, a driver chip, a touch screen driver chip, or the like. The second device 200 may be a display panel body. It can be understood that the first device 100 can also be a display panel body, and the second device 200 can be a flexible circuit board, a driver chip, or a touch screen driver chip, which can be set according to actual conditions.

The first electrode 110 and the second electrode 210 may be structures such as pads and pins formed on the first device 100 and the second device 200 . When the first device 100 and the second device 200 need to be electrically connected, the first electrode 110 and the second electrode 210 may be connected correspondingly. It can be understood that each of the first devices 100 may include a plurality of first electrodes 110 . Each of the second devices 200 may include a plurality of second electrodes 210 . A plurality of the first electrodes 110 and a plurality of the second electrodes 210 may be provided in a one-to-one correspondence. That is, the first electrode 110 and the second electrode 210 in one-to-one correspondence may form a conductive path.

In one embodiment, at least one of the first electrode 110 and the second electrode 210 may be a multi-layer metal structure. Materials of the first electrode and the second electrode may include molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, platinum, and the like.

In one embodiment, the first electrode 110 and/or the second electrode 210 may be at least two metal layers arranged in a stacked manner. For example, the first electrode 110 and/or the second electrode 210 may be a structure of a first metal layer, a second metal layer and a third metal layer that are arranged in layers. The metal materials of the first metal layer and the third metal layer can be materials with good corrosion resistance such as molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, and platinum. The second metal layer can be made of gold, silver, copper, aluminum, iron and other materials with good electrical conductivity.

In one embodiment, the first electrode 110 and the second electrode 210 may be a cubic structure, and the projection of the cubic structure on the surface of the first device 100 or the second device 200 is a rectangle. The width of the rectangle may be 10 microns to 200 microns. The length of the rectangle is 80 microns to 2 mm. Further, the first electrode 110 and/or the second electrode 210 may have a width of 20 microns and a length of 100 microns.

The conductive pillar array 300 may include a plurality of conductive pillars 310 . One of the conductive column arrays 300 may be disposed between each pair of the first electrodes 110 and the second electrodes 210 in one-to-one correspondence. The conductive column array 300 is disposed between the first electrode 110 and the second electrode 210 . The plurality of conductive pillars 310 are arranged on opposite surfaces of the first electrode 110 and the second electrode 210 to form the conductive pillar array 300 . The conductive column array 300 may be a rectangular array, a circular array, or a linear array or the like. Two ends of the conductive column array 300 may be in contact with two opposite surfaces of the first electrode 110 and the second electrode 210, respectively. Therefore, the conductive column array 300 can electrically connect the first electrode 110 and the second electrode 210 .

In one embodiment, the conductive column array 300 may be a rectangular array, and the projection of the rectangular array on the first device 100 or the second device 200 may be a rectangle. The width of the rectangle may be 8 micrometers to 70 micrometers, and the length of the conductive pillar array 300 may be 15 micrometers to 180 micrometers.

Two ends of the conductive column array 300 may be connected to the first electrode 110 and the second electrode 210 respectively. Therefore, by setting the contact area between the two ends of the conductive column array 300 and the first electrode 110 and the second electrode 210 , the conductive column array 300 and the first electrode 110 and the second electrode 210 can be guaranteed. The contact area between the second electrodes 210 ensures the conduction effect between the first electrodes 110 and the second electrodes 210 . Meanwhile, since the shape of the conductive column array 300 is relatively fixed, it is more stable than the random distribution of conductive particles in the anisotropic conductive adhesive when the first electrode 110 and the second electrode 210 are in contact. Further, the conductive column array 300 is used to connect the first electrode 110 and the second electrode 210, as long as both ends of the conductive column array 300 are in contact with the first electrode 110 and the second electrode 210, respectively. Can. Therefore, it can be avoided that high temperature and high pressure are required to connect the first electrode 110 and the second electrode 210 when using the anisotropic conductive adhesive, thereby causing damage to the first device 100 or the second device 200 .

The bonding structure 10 provided in this embodiment of the present application includes a first device 100 , a second device 200 and a conductive pillar array 300 . The first device 100 includes a first electrode 110 . The second device 200 is disposed opposite to the first device 100 . The second device 200 includes a second electrode 210 . The conductive column array 300 is sandwiched between the first electrode 110 and the second electrode 210 . The conductive column array 300 is used to electrically connect the first electrode 110 and the second electrode 210 . Both ends of the conductive column array 300 can be in contact with the first electrode 110 and the second electrode 210 respectively. Therefore, by setting the two ends of the conductive column array 300 to be in contact with the first electrode 110 and all The contact area between the second electrodes 210 can ensure good electrical contact between the first electrode 110 and the second electrode 210 . By making the two ends of the conductive column array 300 contact with the first electrode 110 and the second electrode 210 respectively, the purpose of circuit conduction can be achieved. At the same time, damage to the first device 100 or the second device 200 caused by pressing the first electrode 110 and the second electrode 210 at high temperature and high pressure can be avoided.

In one embodiment, the conductive column array 300 includes a plurality of the conductive columns 310 , and the plurality here refers to two or more. The conductive column 310 extends from the first electrode 110 to the direction of the second electrode 210 . That is, the conductive column 310 is vertically disposed between the first electrode 110 and the second electrode 210 . Specifically, a plurality of the conductive pillars 310 are arranged in parallel. Two ends of the conductive pillar 310 are respectively connected to the first electrode 110 and the second electrode 210 . By setting the cross-sectional area of both ends of the conductive column 310, the electrical contact area of the conductive column 310 with the first electrode 110 and the second electrode 210 can be determined, so as to ensure that the first electrode 110 and the second electrode 210 are in contact with each other. Conductivity between the second electrodes 210 .

In one embodiment, one of the conductive pillar arrays 300 may include 2 to 5 of the conductive pillars 310 . Further, one of the conductive pillar arrays 300 may include three of the conductive pillars 310 .

In one embodiment, the material of the conductive column 310 may be one or more of nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, and platinum.

In one embodiment, the conductive pillar 310 may be an inside-out multilayer structure. The outer layer material of the conductive column 310 can be made of molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, and platinum materials with better corrosion resistance, so as to avoid being corroded by colloid.

The conductive column 310 may be cylindrical, or may be in the shape of a cube, a cone, or the like. The distance that the conductive column 310 extends from the first electrode 110 to the second electrode 210 may be the height of the conductive column 310 . The distance between the first electrode 110 and the second electrode 210 can be defined by setting the height of the conductive pillar 310 .

In one embodiment, the height of the conductive pillars 310 may be 3 micrometers to 10 micrometers, which can further save materials and reduce costs on the basis of ensuring the conduction between the first electrode 110 and the second electrode 210 . Further, the height of the conductive pillars 310 may be 5 micrometers to 8 micrometers. Further, the height of the conductive pillars 310 may be 7 microns.

In one embodiment, the diameter of the conductive pillars 310 may be 1 μm to 8 μm, which is easy to fabricate within this range. Further, the diameter of the conductive pillars may be 2 microns to 3 microns. In one embodiment, the conductive pillars are 2 microns in diameter.

A plurality of the conductive pillars 310 are arranged in parallel, that is, the plurality of the conductive pillars 310 may be independent structures, respectively, and are arranged between the first electrode 110 and the second electrode 210 . A plurality of the conductive pillars 310 may also partially contact each other or be integrally formed.

In one embodiment, the space around the conductive column array 300 between the first electrode 110 and the second electrode 210 may be bonded by colloid filling. Therefore, the reliability of the connection between the first electrode 110 and the second electrode 210 can be ensured.

Referring to FIG. 2 , in one embodiment, the plurality of conductive pillars 310 are arranged at intervals. Therefore, there may be gaps between the plurality of the conductive pillars 310 in the conductive pillar array 300 . By filling colloid between the first electrode 110 and the second electrode 210 , the contact area between the colloid and the side wall of the conductive pillar 310 can be increased, and the adhesion between the two can be improved. At the same time, the colloid is also in contact with the opposite surfaces of the first electrode 110 and the second electrode 210 respectively. Therefore, the adhesion between the first electrode 110 , the second electrode 210 and the conductive pillar 310 can be improved. At the same time, the overall firmness of the first electrode 110 , the second electrode 210 and the conductive pillar 310 is improved. In one embodiment, the sidewalls of the conductive pillars 310 can be rough surfaces, so that the adhesion between the colloid and the conductive pillars 310 can be improved.

In one embodiment, along a direction parallel to the first electrode 110 , the cross-sectional area of the plurality of conductive pillars 310 becomes smaller in a gradient from the first electrode 110 to the second electrode 210 . That is, the cross-sectional areas of the plurality of conductive pillars 310 tend to decrease in the direction from the first electrode 110 to the second electrode 210 . Therefore, the cross-sectional area of the end of the conductive pillar 310 away from the first electrode 110 is smaller than the cross-sectional area of the end of the conductive pillar 310 close to the first electrode 110 .

When the conductive column 310 is disposed on the first electrode 110 and the surface of the first electrode 110 is coated with colloid, since the cross-sectional area of the end of the conductive column 310 away from the first electrode 110 is small, it is convenient to The conductive posts 310 are inserted into the gel. Optionally, the colloid can be provided on the second electrode 210 or on other structures, which can be specifically set according to actual conditions. In one embodiment, the shape of the conductive column 310 is a cone, and the method for manufacturing the cone is simple and can reduce the production cost.

Further, when the colloid is filled between the plurality of the conductive pillars 310, the content of the colloid will also change along the extending direction from the first electrode 110 to the second electrode 210, so that the The contact area between the colloid and the conductive post 310 at different positions is changed to further improve the adhesion. That is, when the gradient is large, the diameter of the conductive column 310 changes greatly in the direction from the first electrode 110 to the second electrode 210 . When the gradient is small, in the direction from the first electrode 110 to the second electrode 210 , the diameter of the conductive column 310 changes little. Further, when the gradient variation is zero, the diameters of the conductive pillars 310 at different positions may be the same. Further, in a certain region of the conductive pillar 310, the gradient of the diameter of the conductive pillar 310 can be abruptly changed, that is, the diameter of the conductive pillar 310 can be abruptly changed. It can be understood that the diameter of the conductive pillar 310 in this embodiment is the maximum distance between two points in the outer edge of the cross-sectional area of the conductive pillar 310 .

Referring to FIG. 3 , in one embodiment, the conductive pillar 310 includes a plurality of circular troughs 312 . The bottoms (the side close to the first electrode 110 ) and the tops (the side close to the second electrode 210 ) of the plurality of circular tables 312 are connected in sequence. It can be understood that the bottom area of the circular table 312 is larger than the top area of the circular table 312 . The top of the first circular table 312 is in contact with the bottom of the other circular table 312 , and the conductive pillars 310 are formed by connecting in turn. Therefore, the surface area of the conductive pillars 310 in the axial direction will have a plurality of sudden changes. When the colloid is filled between the conductive pillars 310, the adhesion area between the colloid and the conductive pillars 310 can be increased, and the adhesion can be increased. Attached firmness.

In one embodiment, the plurality of conductive pillars 310 are integrally formed with the first electrode 110 . Therefore, the conductive pillars 310 can be formed on the surface of the first electrode 110 . One ends of the plurality of conductive pillars 310 away from the first electrode 110 are in contact with the second electrode 210 .

In one embodiment, the conductive pillars 310 may be formed on the surface of the first electrode 110 through deposition, exposure, and etching processes.

Referring to FIG. 4 , in one embodiment, the conductive pillars 310 may be disposed on the surface of the second electrode 210 opposite to the first electrode 110 . At this time, colloid can be coated on the surface of the first electrode 110 , and then the second electrode 210 is relatively close to the first electrode 110 . At this time, the end of the conductive column 310 away from the second electrode 210 can be quickly inserted into the colloid.

Referring to FIG. 5 , in one embodiment, the conductive pillar array 300 further includes a plurality of conductive particles 320 . One end of each of the conductive pillars 310 away from the first electrode 110 is in contact with the second electrode 210 through one of the conductive particles 320 . It can be understood that the surface of the second electrode 210 is generally a rough surface, that is, the surface of the second electrode 210 has a pit structure. Therefore, when one end of the conductive pillar 310 away from the first electrode 110 is in contact with the rough surface of the second electrode 210 through the conductive particles 320 , the conductive particles 320 can be embedded in the pit structure. Therefore, the firmness between the conductive pillar 310 and the second electrode 210 can be increased. Further, the area where the conductive particles 320 are attached to the inner surface of the pit is relatively large, so the conductive area can be increased and the on-resistance can be reduced.

In one embodiment, the material of the conductive particles 320 can be one or more of gold, silver, and platinum materials with good electrical conductivity, so that the electrical conductivity can be improved. The shape of the conductive particles 320 may be spherical, irregular polygon, or the like.

In one embodiment, the conductive particles 320 may be integrally formed with the conductive pillars 310 , or may be attached to an end of the conductive pillars 310 away from the first electrode 110 . It can be understood that, in order to adapt to the size of the conductive particles 320 , a pit structure adapted to the size of the conductive particles 320 may also be formed on the surface of the second electrode 210 .

In one embodiment, the diameter of the conductive particles 320 may be 0.5 micrometers to 1 micrometer. Further, the diameter of the conductive particles 320 is 0.7 μm, which can be adapted to the pit structure of the rough surface of the second electrode 210 .

In one embodiment, the bonding structure 10 further includes a gel layer 400 . The colloid layer 400 is sandwiched between the first device 100 and the second device 200 . The conductive column array 300 is located in the colloidal layer 400 . The colloid layer 400 may include colloid. When the conductive column array 300 is disposed on the first electrode 110 , the colloidal layer 400 may be coated on the surface of the conductive column array 300 , and the conductive column array 300 may be inserted into the colloidal layer 400 . Alternatively, the colloidal layer 400 may be coated on the surface of the second electrode 210 , and then the first electrode 110 may be placed on the surface of the conductive column array 300 close to the colloidal layer 400 , so that the conductive column array 300 The colloid layer 400 is inserted. The firmness of the connection between the first electrode 110 and the second electrode 210 can be increased by the colloid layer 400 . The material of the colloid layer 400 may be resin gel. The resin gel may include thermoplastic resin or thermosetting resin or the like. The material of the colloid layer 400 may also be acrylate adhesive, composite structural adhesive, polymer adhesive, hot melt adhesive, pressure-sensitive adhesive, and the like.

The embodiment of the present application also provides a method for fabricating the bonding structure 10 . The method includes:

S10, a first device 100 is provided, and the first device 100 includes the first electrode 110;

S20, forming a conductive column array 300 on the surface of the first electrode 110;

S30, the second device 200 is relatively close to the first device 100, so that the second electrode 210 of the second device contacts the surface of the conductive column array 300 away from the first device 100.

Specifically, in S10, the first device 100 may be a display panel body. The surface of the display panel body may have the first electrode 110 . The first electrode 110 may be a pad.

In the S20, the conductive column array 300 may be formed on the surface of the first electrode 110 through processes such as deposition, exposure, and etching.

In the S30, the second electrodes 210 disposed on the surface of the second device 200 may be pins. The second device 200 is placed on the surface of the second electrode 210 close to the surface of the first device 100 where the conductive column array 300 is placed, so that the second electrode 210 contacts the conductive column array 300 and is far away from the first device 100 the surface of the device 100 , so the conductive pillars 310 can electrically connect the first electrode 110 and the second electrode 210 .

In one embodiment, before the second electrode 210 contacts the surface of the conductive pillar array 300 away from the first device 100 , a colloidal layer 400 may be coated on the surface of the first electrode 110 . When the conductive column array 300 is inserted into the colloidal layer 400 , the second electrode 210 is then covered on the surface of the conductive column array 300 away from the first electrode 110 .

In one embodiment, in forming the conductive column array 300 on the surface of the first electrode 110 , the conductive column array 300 and the first electrode 110 are integrally formed. The conductive column array 300 and the first electrode 110 are integrally formed to improve the firmness of the conductive column array 300 and the first electrode 110 .

Embodiments of the present application also provide a display panel. The display panel includes the bonding structure 10 described in the above embodiment or the bonding structure 10 produced by the above embodiment. The first device 100 is a panel body. The second device 200 is a component. The panel body may have a panel bonding area, and the first electrode 110 may be disposed in the panel bonding area. The second device 200 is a component, and the component may also have a device bonding area, and the second electrode 210 may be disposed in the device bonding area.

The panel body may be an OLED panel, and the panel body may also be a flexible display screen. The second device 200 is a component. The components may be flexible circuit boards, drive chips, touch screen drive chips, and the like. The display panel main body can be driven to display by the driving chip. The display of the panel body can be controlled by feedback through the touch screen driving chip.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are more specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims (10)

1. A bonding structure, comprising:

a first device including a first electrode;

a second device disposed opposite the first device, the second device including a second electrode; and

and the conductive column array is clamped between the first electrode and the second electrode and is used for electrically connecting the first electrode and the second electrode.

2. The bonding structure of claim 1, wherein the array of conductive pillars includes a plurality of conductive pillars extending from the first electrode in a direction of the second electrode.

3. The bonding structure of claim 2, wherein the plurality of conductive pillars are spaced apart.

4. The bonding structure of claim 3, wherein the cross-sectional area of the plurality of conductive pillars, in a direction parallel to the first electrode, tapers from the first electrode to the second electrode;

preferably, the conductive post is in the shape of a cone.

5. A bonding structure according to claim 3, wherein the conductive post includes a plurality of truncated cones, the bottom and top of which are connected in series.

6. The bonding structure of claim 2, wherein the array of conductive pillars further includes a plurality of conductive particles, an end of each of the conductive pillars distal from the first electrode being in contact with the second electrode through one of the conductive particles.

7. A bonding structure according to claim 1, further comprising a glue layer sandwiched between the first and second devices, the array of conductive pillars being located in the glue layer.

8. A method of fabricating a bonding structure, comprising:

providing a first device comprising a first electrode;

forming a conductive column array on the surface of the first electrode;

a second device is brought into relative proximity with the first device such that a second electrode of the second device contacts a surface of the array of conductive pillars remote from the first device.

9. The method of claim 8, wherein the step of forming the array of conductive pillars on the surface of the first electrode is performed integrally with the first electrode.

10. A display panel comprising the bonding structure of any one of claims 1-7 or the bonding structure fabricated by the method of fabricating the bonding structure of claims 8-9;

the first device is a panel main body, and the second device is a component.

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