CN111796482A - Photosensitive resin composition, method for producing patterned cured film, and patterned cured film - Google Patents

Abstract

The present invention relates to a photosensitive resin composition, a method for producing a patterned cured film, and a patterned cured film. To provide a photosensitive resin composition capable of forming a patterned cured film capable of suppressing liquid repellency of non-patterned parts; a method for producing a patterned cured film using the photosensitive resin composition; from the above-mentioned photosensitive resin composition A patterned cured film formed of a cured product; a bank formed from a cured film of the photosensitive resin composition described above; a banked substrate for manufacturing an optical element including the bank; a banked substrate including the bank The optical element of ; the display device provided with this optical element; the formation method of the bank using the said photosensitive resin composition; and the manufacturing method of the optical element. A photosensitive resin composition containing an alkali-soluble resin, a photopolymerizable monomer, a photopolymerization initiator, and a fluorine-based resin uses an oxime ester compound of a predetermined structure containing two or three N-substituted carbazole skeletons as a photopolymerization initiator .

Description

Photosensitive resin composition, method for producing patterned cured film, and patterned cured film

technical field

The present invention relates to a photosensitive resin composition, a method for producing a patterned cured film, and a patterned cured film. In addition, the present invention relates to a bank formed of a cured film of the photosensitive resin composition, a banked substrate for producing an optical element including the bank, an optical element including the banked substrate, and an optical element including the bank. The display apparatus of an optical element, the formation method of the bank using the said photosensitive resin composition, and the manufacturing method of an optical element.

Background technique

Conventionally, optical elements such as organic EL display elements, color filters, and organic TFT arrays have been manufactured by forming banks (partitions) surrounding pixels on a substrate, and then stacking each of them in a region surrounded by the banks. functional layer. As a method of easily forming such a bank, a method of forming a bank by a photolithography method using a photosensitive resin composition is known (Patent Document 1).

In addition, as a method of laminating various functional layers in a region surrounded by banks, there is known a method of preparing ink containing a material constituting the functional layer, and injecting the prepared ink into the region surrounded by banks. In this method, the ink jet method is often used because it is easy to accurately inject a predetermined amount of ink to a predetermined portion.

In addition, when forming a pixel using ink, it is required to impart ink repellency to the bank for the purpose of preventing the ink from adhering to the bank, preventing the ink injected between adjacent pixels from being mixed, and the like. As a method of imparting ink repellency to the bank, for example, a method of including a fluorine-based resin in the bank is known (Patent Document 2).

prior art literature

Patent Literature

Patent Document 1: Japanese Patent Application Laid-Open No. 2010-262940

Patent Document 2: International Publication No. 2008-149498

SUMMARY OF THE INVENTION

However, the inventors of the present application have conducted studies and found that when a fluorine-based resin is blended in a photosensitive resin composition for bank formation in order to impart ink repellency to the bank to be formed, the following cases exist. : On the board|substrate provided with the patterned cured film formed using this photosensitive resin composition, liquid repellency is exhibited also in the non-pattern part which is not covered with the photosensitive resin composition.

When the patterned cured film is used as a bank of the above-mentioned optical element, if liquid repellency is exhibited in the non-patterned portion as described above, there is a problem that the ink for forming the pixel is The area enclosed by the bank is repelled, and a sufficient amount of ink cannot be injected into the area enclosed by the bank.

This problem is remarkable when the ink is injected into the region surrounded by the bank by the ink jet method. The reason for this is that, in the inkjet method, the ink is ejected from the inkjet head in the form of droplets into the region surrounded by the banks, but if the region surrounded by the banks has ink repellency, the droplets are easily repelled. outside the area enclosed by the dike.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a photosensitive resin composition capable of forming a patterned cured film capable of suppressing liquid repellency of non-patterned portions; A method for producing a cured film of A banked substrate of an element; an optical element including the banked substrate; a display device including the optical element; a method for forming a bank using the above-mentioned photosensitive resin composition; and a method for producing an optical element.

[Means for solving problems]

The inventors of the present application found that, by using a photosensitive resin composition containing an alkali-soluble resin (A), a photopolymerizable monomer (B), a photopolymerization initiator (C), and a fluorine-based resin (D), using The oxime ester compound of the predetermined structure containing two or three N-substituted carbazole skeletons can solve the said subject as a photoinitiator (C), and completed this invention. More specifically, the present invention provides the following aspects.

The first aspect of the present invention is a photosensitive resin composition comprising an alkali-soluble resin (A), a photopolymerizable monomer (B), a photopolymerization initiator (C), and a fluorine-based resin (D),

Among them, the photopolymerization initiator (C) includes a photopolymerization initiator (C-I) represented by the following formula (C1),

[Chemical formula 1]

(In formula (C1), X ^c1 is a divalent or trivalent linking group, a plurality of R ^c1 are each independently a monovalent organic group, and a plurality of R ^c2 are each independently a hydrogen atom, which may have a substituent An alkyl group having 1 or more and 11 or less carbon atoms, or an aryl group which may have a substituent, each of a plurality of R ^c3 is independently a monovalent organic group bonded to a nitrogen atom in a carbazole ring through a CN bond group, t1 is 0 or 1.).

A second aspect of the present invention is a method for producing a patterned cured film, which includes the following steps:

a step of applying the photosensitive resin composition according to the first aspect on a substrate to form a coating film; and

The process of exposing the coating film,

wherein the coating film is patterned, or

The coating film is subjected to position-selective exposure, and then, development of the exposed coating film is performed.

The 3rd aspect of this invention is a patterned cured film formed from the hardened|cured material of the photosensitive resin composition which concerns on 1st aspect.

A fourth aspect of the present invention is a bank formed from a cured product of the photosensitive resin composition according to the first aspect for forming the bank.

A fifth aspect of the present invention is a banked substrate for manufacturing an optical element, which is provided with the bank according to the fourth aspect.

A sixth aspect of the present invention is an optical element including the banked substrate for manufacturing the optical element according to the fifth aspect.

A seventh aspect of the present invention is a display device including the optical element according to the sixth aspect.

An eighth aspect of the present invention is a method for forming a bank, comprising the following steps:

a step of applying the photosensitive resin composition according to the first aspect for forming a bank on a substrate to form a coating film; and

The process of exposing the coating film,

wherein the coating film is patterned, or

The coating film is subjected to position-selective exposure, and then, development of the exposed coating film is performed.

A ninth aspect of the present invention is a method of manufacturing an optical element including the step of injecting ink into a region surrounded by banks formed on a substrate by the method according to the eighth aspect to form pixels.

[Effect of invention]

According to the present invention, there can be provided: a photosensitive resin composition capable of forming a patterned cured film capable of suppressing liquid repellency of a non-patterned portion; a method for producing a patterned cured film using the photosensitive resin composition; A patterned cured film formed from a cured product of the photosensitive resin composition; a bank formed from a cured film of the photosensitive resin composition; a banked substrate for producing an optical element including the bank; An optical element including the banked substrate; a display device including the optical element; a method for forming a bank using the above-mentioned photosensitive resin composition; and a method for producing an optical element.

Detailed ways

"Photosensitive resin composition"

It is a photosensitive resin composition containing an alkali-soluble resin (A), a photopolymerizable monomer (B), a photopolymerization initiator (C), and a fluorine-based resin (D). The photopolymerization initiator (C) contains an oxime ester compound represented by the following formula (C1) as the photopolymerization initiator (C-I).

[Chemical formula 2]

In formula (C1), X ^c1 is a divalent or trivalent linking group, a plurality of R ^c1 are each independently a monovalent organic group, and a plurality of R ^c2 are each independently a hydrogen atom, which may have a substituent. An alkyl group having 1 or more and 11 or less carbon atoms, or an aryl group which may have a substituent, and each of a plurality of R ^c3 is independently a monovalent organic group bonded to a nitrogen atom in a carbazole ring through a CN bond , t1 is 0 or 1.

The photosensitive resin composition can be formed using the photosensitive resin composition by including the alkali-soluble resin (A) and the photopolymerizable monomer (B), and simultaneously including the fluorine-based resin (D) and the photopolymerization initiator (C-I) in combination. A patterned cured film capable of suppressing liquid repellency of the non-patterned portion.

The patterned cured film can be suitably used to form banks that divide pixels in color filters, organic EL display elements, quantum dot displays, or organic TFT arrays and the like. This is because, by suppressing the liquid repellency in the region surrounded by the banks, when the ink for forming the pixels is injected into the region surrounded by the banks, the ink injection failure such as the repelling ink is less likely to occur.

In addition, when the above-mentioned photosensitive resin composition is used, when banks are formed by a photolithography method including position-selective exposure and development, it is easy to simultaneously realize: as a function for preventing ink (which is used for forming pixels) from adjoining adjacent ones sufficient function of the partition walls infiltrated by the pixel area; and ideal light transmittance.

Hereinafter, the essential or optional components contained in the photosensitive resin composition and the manufacturing method of the photosensitive resin composition will be described in order.

<Alkali-soluble resin (A)>

The photosensitive resin composition contains alkali-soluble resin (A). It does not specifically limit as an alkali-soluble resin (A), It can select suitably from the alkali-soluble resin compounded in various photosensitive resin compositions conventionally.

Here, in this specification, the alkali-soluble resin (A) means a resin containing an alkali-soluble functional group (for example, a phenolic hydroxyl group, a carboxyl group, a sulfonic acid group, etc.) in the molecule.

Resin (a-1) which has a Cardo structure is mentioned as resin suitable as an alkali-soluble resin (A) (it is also described as "Cardo resin (a-1)" below.).

When the resin (a-1) having a Cardo structure is used as the alkali-soluble resin, a photosensitive resin composition excellent in resolution is easily obtained, and a cured film that is less likely to flow excessively by heating is easily formed by using the photosensitive resin composition. Therefore, it becomes easy to form a cured film with a favorable shape.

[Resin (a-1) having a Cardo structure]

As the resin (a-1) having a Cardo structure, a resin having a Cardo skeleton in the structure and having predetermined alkali solubility can be used. The Cardo skeleton refers to a skeleton in which a second cyclic structure and a third cyclic structure are bonded to one ring carbon atom constituting the first cyclic structure. In addition, the 2nd cyclic structure and the 3rd cyclic structure may be the same structure, and may be a different structure.

A typical example of the Cardo skeleton includes a skeleton in which two aromatic rings (eg, benzene rings) are bonded to the carbon atom at the 9-position of the fluorene ring.

It does not specifically limit as Cardo resin (a-1), A conventionally known resin can be used. Among them, the resin represented by the following formula (a-1) is preferable.

[Chemical formula 3]

In the formula (a-1), X ^a represents a group represented by the following formula (a-2). m1 represents an integer of 0 or more and 20 or less.

[Chemical formula 4]

In the above formula (a-2), R ^a1 each independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, or a halogen atom, R ^a2 each independently represents a hydrogen atom or a methyl group, and R ^a3 each independently A represents a linear or branched alkylene group, m2 represents 0 or 1, and W ^a represents a group represented by the following formula (a-3).

[Chemical formula 5]

In formula (a-2), as R ^a3 , an alkylene group having 1 or more and 20 or less carbon atoms is preferable, an alkylene group having 1 or more and 10 or less carbon atoms is more preferable, and an alkylene group having 1 or more carbon atoms is particularly preferable. The alkylene group of more than 6 and less than 6 is most preferably ethane-1,2-diyl, propane-1,2-diyl, and propane-1,3-diyl.

Ring A in formula (a-3) represents an optionally substituted aliphatic ring which may be condensed with an aromatic ring. The aliphatic ring may be an aliphatic hydrocarbon ring or an aliphatic heterocyclic ring.

As an aliphatic ring, a monocycloalkane, a bicycloalkane, a tricycloalkane, a tetracycloalkane, etc. are mentioned.

Specifically, monocycloalkanes such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, adamantane, norbornane, isobornane, tricyclodecane, and tetracyclododecane can be mentioned.

The aromatic ring which may be condensed with the aliphatic ring may be an aromatic hydrocarbon ring or an aromatic heterocyclic ring, but an aromatic hydrocarbon ring is preferable. Specifically, a benzene ring and a naphthalene ring are preferable.

Preferred examples of the divalent group represented by the formula (a-3) include the following groups.

[Chemical formula 6]

The divalent group X ^a in the formula (a-1) can be introduced into the Cardo resin (a) by reacting the tetracarboxylic dianhydride providing the residue Z ^a with a diol compound represented by the following formula (a-2a). -1).

[Chemical formula 7]

In formula (a-2a), R ^a1 , R ^a2 , R ^a3 , and m2 are as shown in the description for formula (a-2). The ring A in the formula (a-2a) is as described in the description for the formula (a-3).

The diol compound represented by formula (a-2a) can be produced, for example, by the following method.

First, if necessary, the hydrogen atom in the phenolic hydroxyl group of the diol compound represented by the following formula (a-2b) is replaced by a group represented by -R ^a3 -OH by a conventional method, and then, using epichlorohydrin An epoxy compound represented by the following formula (a-2c) is obtained by glycidylation of an alcohol or the like.

Next, by reacting the epoxy compound represented by formula (a-2c) with acrylic acid or methacrylic acid, the diol compound represented by formula (a-2a) is obtained.

In the formula (a-2b) and the formula (a-2c), R ^a1 , R ^a3 , and m2 are as shown in the description for the formula (a-2). The ring A in the formula (a-2b) and the formula (a-2c) is as described in the description for the formula (a-3).

In addition, the manufacturing method of the diol compound represented by Formula (a-2a) is not limited to the said method.

[Chemical formula 8]

Preferred examples of the diol compound represented by the formula (a-2b) include the following diol compounds.

[Chemical formula 9]

In the above formula (a-1), R ^a0 is a hydrogen atom or a group represented by -CO-Y ^a -COOH. Here, Y ^a represents a residue obtained by removing an acid anhydride group (-CO-O-CO-) from a dicarboxylic acid anhydride. Examples of dicarboxylic anhydrides include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetramine Hydrogen phthalic anhydride, chloroplastic anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, etc.

Moreover, in said formula (a-1), Z ^a represents the residue which removed two acid anhydride groups from tetracarboxylic dianhydride. Examples of tetracarboxylic dianhydrides include tetracarboxylic dianhydrides represented by the following formula (a-4), pyromellitic dianhydrides, benzophenone tetracarboxylic dianhydrides, biphenyltetracarboxylic dianhydrides, Diphenyl ether tetracarboxylic dianhydride, etc.

Moreover, in said Formula (a-1), m represents the integer of 0 or more and 20 or less.

[Chemical formula 10]

(In formula (a-4), R ^a4 , R ^a5 , and R ^a6 each independently represent one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and a fluorine atom, m3 represents an integer of 0 or more and 12 or less.)

The alkyl group that can be selected as R ^a4 in the formula (a-4) is an alkyl group having 1 or more and 10 or less carbon atoms. By setting the number of carbon atoms in the alkyl group within this range, the heat resistance of the obtained carboxylate can be further improved. When R ^a4 is an alkyl group, the number of carbon atoms is preferably 1 or more and 6 or less, more preferably 1 or more and 5 or less, further preferably 1 or more and 4 or less, from the viewpoint of easily obtaining a Cardo resin excellent in heat resistance. , particularly preferably 1 or more and 3 or less.

When R ^a4 is an alkyl group, the alkyl group may be linear or branched.

R ^a4 in the formula (a-4) is more preferably a hydrogen atom or an alkyl group having 1 or more and 10 or less carbon atoms each independently from the viewpoint of easily obtaining a Cardo resin excellent in heat resistance. R ^a4 in the formula (a-4) is more preferably a hydrogen atom, a methyl group, an ethyl group, an n-propyl group or an isopropyl group, and particularly preferably a hydrogen atom or a methyl group.

From the viewpoint of easy production of high-purity tetracarboxylic dianhydride, it is preferable that a plurality of R ^a4 in the formula (a-4) are the same group.

m3 in formula (a-4) represents an integer of 0 or more and 12 or less. Purification of tetracarboxylic dianhydride can be made easy by making the value of m3 12 or less.

The upper limit of m3 is preferably 5, and more preferably 3, from the viewpoint of easy purification of the tetracarboxylic dianhydride.

The lower limit of m3 is preferably 1, and more preferably 2, from the viewpoint of the chemical stability of the tetracarboxylic dianhydride.

m3 in formula (a-4) is particularly preferably 2 or 3.

The alkyl group having 1 or more and 10 or less carbon atoms that can be selected as R ^a5 and R ^a6 in formula (a-4) is the same as the alkyl group having 1 or more and 10 or less carbon atoms that can be selected as R ^a4 .

From the viewpoint of easy purification of tetracarboxylic dianhydride, R ^a5 and R ^a6 are preferably hydrogen atoms, or have 1 or more and 10 or less carbon atoms (preferably 1 or more and 6 or less, more preferably 1 or more and 5 or less) , more preferably 1 or more and 4 or less, particularly preferably 1 or more and 3 or less) alkyl groups, particularly preferably a hydrogen atom or a methyl group.

Examples of the tetracarboxylic dianhydride represented by the formula (a-4) include norbornane-2-spiro-α-cyclopentanone-α'-spiro-2"-norbornane-5,5" , 6,6"-tetracarboxylic dianhydride (alias is "norbornane-2-spiro-2'-cyclopentanone-5'-spiro-2"-norbornane-5,5",6,6" -Tetracarboxylic dianhydride"), methylnorbornane-2-spiro-α-cyclopentanone-α'-spiro-2"-(methylnorbornane)-5,5",6,6"- Tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclohexanone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride (alias "norbornane" Bornane-2-spiro-2'-cyclohexanone-6'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride"), methyl norbornane-2 -Spiro-α-cyclohexanone-α'-spiro-2"-(methylnorbornane)-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α- Cycloacetone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclobutanone-α'-spiro-2 "-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cycloheptanone-α'-spiro-2"-norbornane-5,5 ",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclooctanone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic acid Dianhydride, norbornane-2-spiro-α-cyclononanone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2- Spiro-α-cyclodecanone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cycloundecanone -α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclododecanone-α'-spiro-2 "-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclotridecone-α'-spiro-2"-norbornane-5 , 5",6,6"-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclotetradecanone-α'-spiro-2"-norbornane-5,5",6,6 "-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclopentadecanone-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, Norbornane-2-spiro-α-(methylcyclopentanone)-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, norbornane-2 -Spiro-α-(methylcyclohexanone)-α'-spiro-2"-norbornane-5,5",6,6"-tetracarboxylic dianhydride, etc.

The weight average molecular weight of the Cardo resin (a-1) is preferably 1,000 or more and 40,000 or less, more preferably 1,500 or more and 30,000 or less, and further preferably 2,000 or more and 10,000 or less. By making it into the said range, not only favorable developability but also sufficient heat resistance and mechanical strength can be obtained with respect to the cured film formed using the photosensitive resin composition.

[Novolac resin (a-2)]

It is also preferable that the alkali-soluble resin (A) contains the Novolac resin (a-2) from the viewpoint of easily forming a cured film that does not easily flow excessively by heating.

As the Novolac resin (a-2), various Novolac resins conventionally blended in the photosensitive resin composition can be used. The Novolac resin (a-2) is preferably obtained by addition-condensing an aromatic compound having a phenolic hydroxyl group (hereinafter, simply referred to as "phenols") and aldehydes under an acid catalyst.

(Phenolics)

Examples of phenols used in preparing Novolac resin (a-2) include: phenol; cresols such as o-cresol, m-cresol, and p-cresol; 2,3-xylenol, 2,4 -Xylenols such as xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol; o-ethylphenol, m-ethyl Ethyl phenols such as phenol, p-ethylphenol; 2-isopropylphenol, 3-isopropylphenol, 4-isopropylphenol, o-butylphenol, m-butylphenol, p-butylphenol, and p- Alkylphenols such as tert-butylphenol; 2,3,5-trimethylphenol, and trialkylphenols such as 3,4,5-trimethylphenol; resorcinol, catechol, p- Hydroquinone, hydroquinone monomethyl ether, pyrogallol, and phloroglucinol and other polyphenols; alkyl resorcinol, alkyl catechol, and alkyl hydroquinone, etc. Alkyl polyphenols (all alkyl groups have 1 or more and 4 or less carbon atoms.); α-naphthol; β-naphthol; hydroxybiphenyl; and bisphenol A; and the like. These phenols may be used alone or in combination of two or more.

Among these phenols, m-cresol and p-cresol are preferred, and m-cresol and p-cresol are more preferably used in combination. In this case, various characteristics, such as heat resistance of the cured film formed using the photosensitive resin composition, can be adjusted by adjusting the mixing ratio of both.

The compounding ratio of m-cresol and p-cresol is not particularly limited, but is preferably 3/7 or more and 8/2 or less in terms of the molar ratio of m-cresol/p-cresol. By using m-cresol and p-cresol in the ratio of this range, it becomes easy to obtain the photosensitive resin composition which can form a cured film excellent in heat resistance.

In addition, Novolac resin produced by using m-cresol and 2,3,5-trimethylphenol in combination is also preferable. When this Novolac resin is used, it becomes easy to obtain especially the photosensitive resin composition which can form the cured film excellent in heat resistance.

The compounding ratio of m-cresol and 2,3,5-trimethylphenol is not particularly limited, but in terms of the molar ratio of m-cresol/2,3,5-trimethylphenol, it is preferably 70/30 or more and 95/ 5 or less.

(Aldehydes)

Examples of aldehydes used for preparing Novolac resin (a-2) include formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde. These aldehydes may be used alone or in combination of two or more.

(acid catalyst)

Examples of acid catalysts used in the preparation of Novolac resin (a-2) include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and phosphorous acid; formic acid, oxalic acid, acetic acid, diethylsulfuric acid, and parabens. Organic acids such as toluenesulfonic acid; and metal salts such as zinc acetate; etc. These acid catalysts may be used alone or in combination of two or more.

(molecular weight)

The weight average molecular weight (Mw; hereinafter, also simply referred to as "weight average molecular weight") in terms of polystyrene of Novolac resin (a-2), from the heat resistance of the cured film formed using the photosensitive resin composition From the viewpoint of properties, the lower limit is preferably 2,000, more preferably 5,000, particularly preferably 10,000, more preferably 15,000, and most preferably 20,000, and the upper limit is preferably 50,000, more preferably 45,000, still more preferably 40,000, and most preferably 35,000.

As the Novolac resin (a-2), at least two kinds of Novolac resins having different weight average molecular weights in terms of polystyrene can be used in combination. By using Novolac resins having different weight average molecular weights in combination, it is possible to obtain a balance between the developability of the photosensitive resin composition and the heat resistance of the cured film formed using the photosensitive resin composition.

[Modified epoxy resin (a-3)]

The alkali-soluble resin (A) may contain a polybasic acid anhydride (a-3c) adduct (a-3) which is a product of an epoxy compound (a-3a) and an unsaturated group-containing carboxylic acid (a-3b) . This adduct is also described as "modified epoxy resin (a-3)".

It should be noted that, in the specification and claims of the present application, a compound that satisfies the above definition but does not belong to the above-mentioned resin (a-1) having a Cardo structure is referred to as a modified epoxy resin (a-3).

Hereinafter, the epoxy compound (a-3a), the unsaturated group-containing carboxylic acid (a-3b), and the polybasic acid anhydride (a-3c) will be described.

<Epoxy compound (a-3a)>

The epoxy compound (a-3a) is not particularly limited as long as it is a compound having an epoxy group, and may be an aromatic epoxy compound having an aromatic group or an aliphatic epoxy compound not containing an aromatic group The compound is preferably an aromatic epoxy compound having an aromatic group.

The epoxy compound (a-3a) may be a monofunctional epoxy compound or a polyfunctional epoxy compound of bifunctional or more, but a polyfunctional epoxy compound is preferable.

Specific examples of the epoxy compound (a-3a) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, and naphthalene type epoxy resin. Epoxy resins, biphenyl type epoxy resins and other bifunctional epoxy resins; dimer acid glycidyl esters, triglycidyl esters and other glycidyl ester type epoxy resins; tetraglycidylaminodiphenylmethane, triglycidyl Glycidyl amine epoxy resins such as glycidyl p-aminophenol, tetraglycidyl m-xylylenediamine, and tetraglycidyl bisaminomethyl cyclohexane; heterocyclic epoxy resins such as triglycidyl isocyanurate Epoxy resins; phloroglucinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxyphenylmethane triglycidyl ether, glycerol triglycidyl ether, 2-[4-(2,3- Glycidoxy)phenyl]-2-[4-[1,1-bis[4-(2,3-glycidoxy)phenyl]ethyl]phenyl]propane, and 1,3 -Bis[4-[1-[4-(2,3-glycidoxy)phenyl]-1-[4-[1-[4-(2,3-glycidoxy)phenyl ]-1-methylethyl]phenyl]ethyl]phenoxy]-2-propanol and other 3-functional epoxy resins; tetrahydroxyphenylethane tetraglycidyl ether, tetraglycidyl diphenylmethane Ketones, bis-resorcinol tetraglycidyl ether, and tetra-functional epoxy resins such as tetraglycidoxybiphenyl.

Moreover, as an epoxy compound (a-3a), the epoxy compound which has a biphenyl skeleton is preferable.

The epoxy compound having a biphenyl skeleton preferably has at least one biphenyl skeleton represented by the following formula (a-3a-1) in the main chain.

The epoxy compound having a biphenyl skeleton is preferably a polyfunctional epoxy compound having two or more epoxy groups.

By using the epoxy compound which has a biphenyl skeleton, it becomes easy to obtain the resin composition which is excellent in the balance of sensitivity and developability, and can form a cured film which is excellent in the adhesiveness with a board|substrate.

[Chemical formula 11]

(In formula (a-3a-1), R ^a7 is each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a halogen atom, or an optionally substituted phenyl group, and j is 1 or more and an integer less than 4.)

When R ^a7 is an alkyl group having 1 or more and 12 or less carbon atoms, specific examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec- Butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl, tert-amyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, Isononyl, n-decyl, isodecyl, n-undecyl, and n-dodecyl.

When R ^a7 is a halogen atom, specific examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

When R ^a7 is an optionally substituted phenyl group, the number of substituents on the phenyl group is not particularly limited. The number of substituents on the phenyl group is 0 or more and 5 or less, preferably 0 or 1.

Examples of the substituent include an alkyl group having 1 or more and 4 or less carbon atoms, an alkoxy group having 1 or more and 4 or less carbon atoms, an aliphatic acyl group having 2 or more and 4 or less carbon atoms, Halogen atom, cyano group, and nitro group.

Although it does not specifically limit as epoxy compound (a-3a) which has a biphenyl skeleton represented by said formula (a-3a-1), For example, the epoxy compound represented by following formula (a-3a-2) is mentioned .

[Chemical formula 12]

(In formula (a-3a-2), for R ^a7 and j, as in formula (a-3a-1), k is the average number of repetitions of the structural unit in the parentheses, and is 0 or more and 10 or less.)

Among the epoxy compounds represented by the formula (a-3a-2), those represented by the following formula (a-3a-3) are preferred from the viewpoint of being particularly easy to obtain a photosensitive resin composition excellent in the balance of sensitivity and developability compound of.

[Chemical formula 13]

(In formula (a-3a-3), it is the same as formula (a-3a-2) with respect to k.)

(Carboxylic acid (a-3b) containing an unsaturated group)

In preparing the modified epoxy compound (a-3), the epoxy compound (a-3a) is reacted with the unsaturated group-containing carboxylic acid (a-3b).

The unsaturated group-containing carboxylic acid (a-3b) is preferably a monocarboxylic acid containing reactive unsaturated double bonds such as an acrylic group and a methacrylic group in the molecule. Examples of such unsaturated group-containing carboxylic acids include acrylic acid, methacrylic acid, β-styryl acrylic acid, β-furfuryl acrylic acid, α-cyanocinnamic acid, and cinnamic acid. In addition, the unsaturated group-containing carboxylic acid (a-3b) may be used alone or in combination of two or more.

The epoxy compound (a-3a) can be reacted with the unsaturated group-containing carboxylic acid (a-3b) by a known method. Preferable reaction methods include, for example, a method in which tertiary amines such as triethylamine and benzylethylamine, dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylchloride A quaternary ammonium salt such as ammonium chloride, benzyltriethylammonium chloride, pyridine, or triphenylphosphine, etc., is used as a catalyst in an organic solvent at a reaction temperature of 50°C or higher and 150°C or lower, and the epoxy compound (a) -3a) Reaction with unsaturated group-containing carboxylic acid (a-3b) for several hours or more and several tens of hours or less.

In terms of the ratio of the amount of use of both in the reaction of the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b), the epoxy equivalent of the epoxy compound (a-3a) , and the carboxylic acid equivalent ratio of the unsaturated group-containing carboxylic acid (a-3b), usually preferably 1:0.5 to 1:2, more preferably 1:0.8 to 1:1.25, especially preferably 1:1 0.9 to 1:1.1.

When the ratio of the use amount of the epoxy compound (a-3a) to the use amount of the unsaturated group-containing carboxylic acid (a-3b) is 1:0.5 to 1:2 in terms of the above-mentioned equivalent ratio, the crosslinking efficiency is improved Tendency is preferred.

(polybasic acid anhydride (a-3c))

The polybasic acid anhydride (a-3c) is an acid anhydride of a carboxylic acid having two or more carboxyl groups.

Although it does not specifically limit as polybasic acid anhydride (a-3c), For example, maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride can be mentioned , Methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, 3-methylhexahydrophthalic anhydride, 4-Methylhexahydrophthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride Phthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride, the following formula (a-3c- The compound represented by 1) and the compound represented by the following formula (a-3c-2). Moreover, polybasic acid anhydride (a-3c) can be used individually or in combination of 2 or more types.

[Chemical formula 14]

(In formula (a-3c-2), R ^a8 represents an optionally substituted alkylene group having 1 or more and 10 or less carbon atoms.)

As the polybasic acid anhydride (a-3c), a compound having two or more benzene rings is preferable because it is easy to obtain a photosensitive resin composition having excellent balance between sensitivity and developability. Moreover, it is more preferable that the polybasic acid anhydride (a-3c) contains at least one of the compound represented by said formula (a-3c-1) and the compound represented by said formula (a-3c-2).

After reacting the epoxy compound (a-3a) with the unsaturated group-containing carboxylic acid (a-3b), the method of reacting the polybasic acid anhydride (a-3c) can be appropriately selected from known methods.

In addition, in terms of the usage ratio, the number of moles of the OH group in the component after the reaction of the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b), and the number of moles of the polybasic acid anhydride (a-3b) The equivalent ratio of the acid anhydride group of -3c) is usually 1:1 to 1:0.1, preferably 1:0.8 to 1:0.2. By making it into the said range, it becomes easy to obtain the photosensitive resin composition with favorable developability.

In addition, the acid value of the modified epoxy resin (a-3) is preferably 10 mgKOH/g or more and 150 mgKOH/g or less, more preferably 70 mgKOH/g or more and 110 mgKOH/g or less, in terms of resin solid content. By making the acid value of the resin 10 mgKOH/g or more, sufficient solubility in a developer can be obtained, and by making the acid value 150 mgKOH/g or less, sufficient curability can be obtained and surface properties can be improved.

In addition, the weight average molecular weight of the modified epoxy resin (a-3) is preferably 1,000 or more and 40,000 or less, and more preferably 2,000 or more and 30,000 or less. By making the weight average molecular weight 1000 or more, it becomes easy to form a cured film excellent in heat resistance and strength. Moreover, by making a weight average molecular weight into 40000 or less, it becomes easy to obtain the photosensitive resin composition which shows sufficient solubility in a developing solution.

[Acrylic resin (a-4)]

The acrylic resin (a-4) is also preferable as a component constituting the alkali-soluble resin (A).

As the acrylic resin (a-4), a resin containing a structural unit derived from (meth)acrylic acid and/or a structural unit derived from other monomers such as (meth)acrylate can be used. (Meth)acrylic acid is acrylic acid or methacrylic acid. The (meth)acrylate is represented by the following formula (a-4-1), and is not particularly limited unless the object of the present invention is inhibited.

[Chemical formula 15]

In the above formula (a-4-1), R ^a9 is a hydrogen atom or a methyl group, and R ^a10 is a monovalent organic group. The organic group may contain a bond other than a hydrocarbon group such as a hetero atom or a substituent, in the organic group. In addition, the organic group may be linear, branched, or cyclic.

The substituents other than the hydrocarbon group in the organic group of R ^a10 are not particularly limited as long as the effects of the present invention are not impaired, and examples thereof include halogen atoms, hydroxyl groups, mercapto groups, thioether groups, cyano groups, isocyano groups, Cyanate group, isocyanate group, thiocyanate group, isothiocyanate group, silyl group, silanol group, alkoxy group, alkoxycarbonyl group, carbamoyl group, thiocarbamoyl group, nitro group , nitroso, carboxyl, carboxylate/ester, acyl, acyloxy, sulfinyl, sulfo, sulfonate/ester, phosphino, phosphinyl, phosphono, phosphonate/ester , hydroxyimino group, alkyl ether group, alkyl sulfide group, aryl ether group, aryl sulfide group, amino group (-NH ₂ , -NHR, -NRR': R and R' each independently represent a hydrocarbon group) Wait. Hydrogen atoms contained in the above-mentioned substituents may be substituted with hydrocarbon groups. Moreover, the hydrocarbon group contained in the said substituent may be any of linear, branched, and cyclic.

In addition, the organic group as R ^a10 may have a reactive functional group such as an acryloyloxy group, a methacryloyloxy group, an epoxy group, and an oxetanyl group.

Acyl groups such as acryloyloxy groups and methacryloyloxy groups having unsaturated double bonds and the like can be produced, for example, by combining an unsaturated carboxylic acid (acrylic acid, methacrylic acid, etc.) with a structural unit including an epoxy group. At least a part of the epoxy groups in the acrylic resin (a-4) reacted.

In addition, the structural unit derived from unsaturated carboxylic acid such as acrylic acid and methacrylic acid, which is contained in the acrylic resin (a-4), can be reacted with a compound having an epoxy group and an unsaturated double bond. An unsaturated double bond is introduced into the acrylic resin (a-4). As a compound which has an epoxy group and an unsaturated double bond, the compound represented by glycidyl (meth)acrylate and formula (a-4-1a)-(a-4-1o) mentioned later can be used, for example.

As R ^a10 , an alkyl group, an aryl group, an aralkyl group, or a heterocyclic group is preferable, and these groups may be substituted by a halogen atom, a hydroxyl group, an alkyl group, or a heterocyclic group. In addition, in the case where these groups contain an alkylene moiety, the alkylene moiety may be interrupted by an ether bond, a thioether bond, or an ester bond.

When the alkyl group is linear or branched, the number of carbon atoms is preferably 1 or more and 20 or less, more preferably 1 or more and 15 or less, and particularly preferably 1 or more and 10 or less. Examples of preferable alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec- Amyl, tert-amyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl, isodecyl, etc.

When the alkyl group is an alicyclic group or a group containing an alicyclic group, preferable alicyclic groups included in the alkyl group include monocyclic alicyclic groups such as cyclopentyl and cyclohexyl. group, adamantyl, norbornyl, isobornyl, tricyclononyl, tricyclodecyl, and polycyclic alicyclic groups such as tetracyclododecyl.

( ^Methyl ) Glycidyl acrylate, 2-methyl glycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 6,7-epoxyheptyl (meth)acrylate, etc. (meth) base) epoxy alkyl acrylates.

In addition, the compound represented by formula (a-4-1) may be an alicyclic epoxy group-containing (meth)acrylate. The alicyclic group constituting the alicyclic epoxy group may be monocyclic or polycyclic. As a monocyclic alicyclic group, a cyclopentyl group, a cyclohexyl group, etc. are mentioned. Moreover, as a polycyclic alicyclic group, a norbornyl group, an isobornyl group, a tricyclononyl group, a tricyclodecyl group, a tetracyclododecyl group, etc. are mentioned.

Specific examples when the compound represented by the formula (a-4-1) is an alicyclic epoxy group-containing (meth)acrylate include the following formulae (a-4-1a) to (a- The compound represented by 4-1o). Among these, the compounds represented by the following formulae (a-4-1a) to (a-4-1e) are preferred, and the following formulae (a-4-1a) to (a-4) are more preferred in order to moderate the developability. A compound represented by -1c).

[Chemical formula 16]

[Chemical formula 17]

[Chemical formula 18]

In the above formula, R ^a20 represents a hydrogen atom or a methyl group, R ^a21 represents a divalent aliphatic saturated hydrocarbon group having 1 or more and 6 or less carbon atoms, and R ^a22 represents a divalent carbon number of 1 or more and 10 or less. In the hydrocarbon group, t represents an integer of 0 or more and 10 or less. As R ^a21 , linear or branched alkylene groups such as methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, and hexamethylene are preferred . As R ^a22 , for example, a methylene group, an ethylene group, a propylene group, a tetramethylene group, an ethylethylene group, a pentamethylene group, a hexamethylene group, a phenylene group, a cyclohexylene group, and -CH ₂ are preferable. -Ph-CH ₂ - (Ph represents phenylene).

In addition, the acrylic resin (a-4) may be obtained by polymerizing monomers other than (meth)acrylates. Examples of such monomers include (meth)acrylamides, unsaturated carboxylic acids, allyl compounds, vinyl ethers, vinyl esters, styrenes, and the like. These monomers can be used alone or in combination of two or more.

Examples of (meth)acrylamides include (meth)acrylamides, N-alkyl (meth)acrylamides, N-aryl (meth)acrylamides, N,N-dialkyl (meth)acrylamides yl) acrylamide, N,N-diaryl(meth)acrylamide, N-methyl-N-phenyl(meth)acrylamide, N-hydroxyethyl-N-methyl(meth)propene amide, etc.

Examples of unsaturated carboxylic acids include monocarboxylic acids such as crotonic acid; dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid; acid anhydrides of these dicarboxylic acids; Wait.

Examples of the allyl compound include allyl acetate, allyl hexanoate, allyl octoate, allyl laurate, allyl palmitate, allyl stearate, allyl benzoate, Allyl esters such as allyl acetoacetate and allyl lactate; allyloxyethanol; and the like.

Examples of vinyl ethers include hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether, and ethoxyethyl vinyl ether , chloroethyl vinyl ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol vinyl ether , dimethylaminoethyl vinyl ether, diethylaminoethyl vinyl ether, butylaminoethyl vinyl ether, benzyl vinyl ether, tetrahydrofurfuryl vinyl ether and other alkyl vinyl ethers; Vinyl phenyl ether, vinyl cresyl ether, vinyl chlorophenyl ether, vinyl-2,4-dichlorophenyl ether, vinyl naphthyl ether, vinyl anthracenyl ether and other vinyl aryl ethers; and many more.

Examples of vinyl esters include vinyl butyrate, vinyl isobutyrate, vinyl trimethyl acetate, diethyl vinyl acetate, vinyl valerate, vinyl hexanoate, and chloroacetic acid. Vinyl Esters, Vinyl Dichloroacetate, Vinyl Methoxy Vinyl Acetate, Vinyl Butoxy Vinyl Acetate, Phenyl Vinyl Acetate, Vinyl Acetoacetate, Vinyl Lactate, Vinyl Beta-Phenyl Butyrate, Vinyl Benzoate ester, vinyl salicylate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, vinyl naphthoate, etc.

Styrenes include styrene; methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, isopropylstyrene, butylstyrene, Alkyl such as hexylstyrene, cyclohexylstyrene, decylstyrene, benzylstyrene, chloromethylstyrene, trifluoromethylstyrene, ethoxymethylstyrene, acetoxymethylstyrene, etc. Styrene; alkoxystyrene such as methoxystyrene, 4-methoxy-3-methylstyrene, dimethoxystyrene; chlorostyrene, dichlorostyrene, trichlorostyrene, tetrachlorostyrene Chlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, 4-fluoro-3- Halogenated styrenes such as trifluoromethylstyrene; etc.

The amount of the structural unit derived from (meth)acrylic acid and the amount of the structural unit derived from other monomers in the acrylic resin (a-4) may be within a range that does not hinder the purpose of the present invention, and there is no Specially limited. The amount of the structural unit derived from (meth)acrylic acid in the acrylic resin (a-4) is preferably 5 mol % or more and 50 mol with respect to the number of moles of the total structural units of the acrylic resin (a-4). % or less, more preferably 10 mol % or more and 30 mol % or less.

When the acrylic resin (a-4) contains a structural unit having an unsaturated double bond, in the acrylic resin (a-4), the number of moles of the total structural units of the acrylic resin (a-4) The amount of the structural unit having an unsaturated double bond is preferably 1 mol % or more and 50 mol % or less, more preferably 1 mol % or more and 30 mol % or less, and particularly preferably 1 mol % or more and 20 mol % or less.

By making the acrylic resin (a-4) contain a structural unit having an unsaturated double bond in an amount within the above range, the acrylic resin can be introduced into the resist film for a cross-linking reaction to be homogenized, so for columnar It is effective in improving the heat resistance and mechanical properties of the spacer.

The weight average molecular weight of the acrylic resin (a-4) is preferably 2,000 or more and 50,000 or less, and more preferably 3,000 or more and 30,000 or less. By making it into the said range, there exists a tendency for the balance of the film forming ability of the photosensitive resin composition and the developability after exposure to be easily obtained.

The content of the alkali-soluble resin (A) is preferably 20% by mass or more and 85% by mass or less with respect to the mass of the photosensitive resin composition (the entire solid content) excluding the mass of the organic solvent (S) described later, More preferably, it is 25 mass % or more and 75 mass % or less. By making it into the said range, it becomes easy to obtain the photosensitive resin composition which is excellent in developability.

<Photopolymerizable monomer (B)>

As the photopolymerizable monomer (B), a monomer having an ethylenically unsaturated group can be preferably used. The monomers having ethylenically unsaturated groups include monofunctional monomers and polyfunctional monomers.

As the monofunctional monomer, (meth)acrylamide, methylol (meth)acrylamide, methoxymethyl (meth)acrylamide, ethoxymethyl (meth)acrylamide, Propoxymethyl (meth)acrylamide, butoxymethoxymethyl (meth)acrylamide, N-methylol (meth)acrylamide, N-hydroxymethyl (meth)acrylamide , (meth)acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, crotonic acid, 2-acrylamido-2-methylpropane Sulfonic acid, tert-butylacrylamide sulfonic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylate ) cyclohexyl acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-phenoxy (meth)acrylate- 2-Hydroxypropyl, 2-(meth)acryloyloxy-2-hydroxypropyl phthalate, glycerol mono(meth)acrylate, tetrahydrofurfuryl (meth)acrylate, ( Dimethylaminoethyl meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrakis (meth)acrylate Fluoropropyl esters, (meth)acrylic acid half esters of phthalic acid derivatives, etc. These monofunctional monomers may be used alone or in combination of two or more.

On the other hand, as a polyfunctional monomer, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, (Meth)acrylate, polypropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate base) acrylate, trimethylolpropane tri(meth)acrylate, glycerol di(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate , pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 2, 2-bis(4-(meth)acryloyloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloyloxypolyethoxyphenyl)propane, (methyl) base) 2-hydroxy-3-(meth)acryloyloxypropyl acrylate, ethylene glycol diglycidyl ether di(meth)acrylate, diethylene glycol diglycidyl ether di(meth)acrylate , diglycidyl phthalate di(meth)acrylate, glycerol triacrylate, glycerol polyglycidyl ether poly(meth)acrylate, urethane (meth)acrylate ( That is, tolylene diisocyanate, trimethylhexamethylene diisocyanate, or a product of hexamethylene diisocyanate and 2-hydroxyethyl (meth)acrylate), methylenebis(meth)acrylamide, Polyfunctional monomers such as (meth)acrylamide methylene ether, polyol and N-methylol (meth)acrylamide condensate, 1,3,5-triacryloylhexahydro-1,3, 5-triazine, etc. These polyfunctional monomers may be used alone or in combination of two or more.

Among these monomers having an ethylenically unsaturated group, from the viewpoint of the tendency to improve the adhesiveness between the photosensitive resin composition and the substrate, and the strength of the photosensitive resin composition after curing, trifunctional or more are preferred The polyfunctional monomer of , more preferably a tetrafunctional or more multifunctional monomer, and further preferably a 5 functional or more functional monomer.

The content of the photopolymerizable monomer (B) in the photosensitive resin composition is preferably 1 with respect to the mass of the photosensitive resin composition (the entire solid content) excluding the mass of the organic solvent (S) described later. The mass % or more and 50 mass % or less are more preferably 5 mass % or more and 40 mass % or less. By making it into the said range, there exists a tendency for the balance of sensitivity, developability, and resolution to be easily obtained.

<Photopolymerization initiator (C)>

The photosensitive resin composition contains the photopolymerization initiator (C-I) represented by the formula (C1) described later as the photopolymerization initiator (C). The photosensitive resin composition contains a photopolymerization initiator (C-I) as a photopolymerization initiator (C) in combination with a fluorine-based resin (D) described later, whereby a patterned structure capable of suppressing liquid repellency of non-patterned portions can be formed. cured film.

[Photopolymerization initiator (C1)]

As described above, the photopolymerization initiator (C-I) is an oxime ester compound represented by the following formula (C1).

[Chemical formula 19]

In formula (C1), X ^c1 is a divalent or trivalent linking group, a plurality of R ^c1 are each independently a monovalent organic group, and a plurality of R ^c2 are each independently a hydrogen atom, which may have a substituent. An alkyl group having 1 or more and 11 or less carbon atoms, or an aryl group which may have a substituent, and each of a plurality of R ^c3 is independently a monovalent organic group bonded to a nitrogen atom in a carbazole ring through a CN bond , t1 is 0 or 1.

In formula (C1), X ^c1 is preferably a divalent or trivalent linking group represented by the following formula (C2). X ^c2 is a divalent or trivalent aromatic group, a plurality of X ^c3 are each independently -C(=O)-, -C(=S)-, or a single bond, when t1 is 0, t2 is 0 , when t1 is 1, t2 is 1.

[Chemical formula 20]

The aromatic group as X ^c2 may be an aryl group or a heteroaryl group. O, S, N, P, and Si are mentioned as a hetero atom which a heteroaryl group has. The aromatic group may have a substituent.

The number of carbon atoms of the aromatic group of X ^c2 is not particularly limited. The number of carbon atoms of the aromatic group as X ^c2 is, for example, preferably 1 or more and 50 or less, more preferably 1 or more and 30 or less, and particularly preferably 1 or more and 20 or less. In addition, the carbon atom of an aromatic group does not include the number of carbon atoms of the substituent which substitutes on an aromatic group.

Furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, tetrazole, pyridine may be mentioned as the heterocycle constituting the heteroaryl group as X ^c2 , pyrazine, pyrimidine, pyridazine, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine , quinoline, isoquinoline, quinazoline, phthalazine, cinnoline, and quinoxaline, etc. Preferable examples of the heteroaryl group as X ^c2 include groups obtained by removing two or three hydrogen atoms from these heterocycles.

Preferable examples when X ^c2 is an aryl group include groups obtained by removing two or three hydrogen atoms from benzene, biphenyl, naphthalene, anthracene, and the like.

The aromatic group as X ^c2 may have a substituent. Examples of the substituent which the aromatic group of X ^c2 may have include an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and an alkyl group having 1 to 20 carbon atoms. Cycloalkyl having 3 or more and 10 or less, cycloalkoxy having 3 or more and 10 or less carbon atoms, saturated aliphatic acyl group having 2 or more and 20 or less carbon atoms, or 2 or more and 20 or less carbon atoms alkoxycarbonyl, saturated aliphatic acyloxy having 2 or more and 20 or less carbon atoms, optionally substituted phenyl, optionally substituted phenoxy, optionally substituted phenylthio, An optionally substituted benzoyl group, an optionally substituted phenoxycarbonyl group, an optionally substituted benzoyloxy group, an optionally substituted phenylalkyl group having 7 to 20 carbon atoms, optionally substituted naphthyl, optionally substituted naphthyloxy, optionally substituted naphthoyl, optionally substituted naphthyloxycarbonyl, optionally substituted naphthoyloxy, optionally substituted Naphthyl alkyl group having 11 or more and 20 or less carbon atoms, optionally substituted heterocyclic group, optionally substituted heterocyclic carbonyl group, amino group, amino group substituted with one or two organic groups , morpholin-1-yl, and piperazin-1-yl, halogen, nitro, and cyano, etc.

The number of substituents which the aromatic group of X ^c2 may have is not particularly limited, and may be one or two or more. When the aromatic group as X ^c2 has a plurality of substituents, the plurality of substituents may be the same or different.

Among the above-mentioned groups as X ^c2 , the aryl group is preferably obtained by removing two hydrogen atoms from benzene, biphenyl, naphthalene, anthracene, etc. from the viewpoints of synthesis and availability of a photopolymerization initiator (CI). The obtained group is more preferably a group obtained by removing two hydrogen atoms from benzene and naphthalene, and particularly preferably a group obtained by removing two hydrogen atoms from naphthalene. As the heteroaryl group, the heterocycle constituting the heteroaryl group is preferably furan, thiophene, and pyrrole, more preferably furan and thiophene, and particularly preferably thiophene.

The single bond as X ^c3 may contain a hetero atom. The number of carbon atoms in the single bond is not particularly limited, but preferably 1 to 20 carbon atoms.

In formula (C1), R ^c1 is each independently a monovalent organic group. Examples of preferable organic groups for R ^c1 include an alkyl group, an alkoxy group, a cycloalkyl group, a cycloalkoxy group, a saturated aliphatic acyl group, an alkoxycarbonyl group, a saturated aliphatic acyloxy group, a group which may have Substituted phenyl, optionally substituted phenoxy, optionally substituted benzoyl, optionally substituted phenoxycarbonyl, optionally substituted benzoyloxy, optionally substituted Phenylalkyl, optionally substituted naphthyl, optionally substituted naphthoxy, optionally substituted naphthoyl, optionally substituted naphthyloxycarbonyl, optionally substituted naphthoyloxy group, optionally substituted naphthylalkyl, optionally substituted heterocyclyl, optionally substituted heterocyclylcarbonyl, amino substituted with 1 or 2 organic groups, alkyl substituted with amino , Alkyl, morpholin-1-yl, and piperazin-1-yl substituted by amino group substituted with one or two organic groups, and the like.

When R ^c1 is an alkyl group, the number of carbon atoms of the alkyl group is preferably 1 or more and 20 or less, and more preferably 1 or more and 6 or less. In addition, when R ^c1 is an alkyl group, it may be a straight chain or a branched chain. Specific examples when R ^c1 is an alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl base, sec-pentyl, tert-amyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl, and isodecyl, etc. . In addition, when R ^c1 is an alkyl group, the alkyl group may contain an ether bond (-O-) in the carbon chain. Examples of the alkyl group having an ether bond in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propyloxy ethoxyethyl, and methoxypropyl.

When R ^c1 is an alkoxy group, the number of carbon atoms of the alkoxy group is preferably 1 or more and 20 or less, and more preferably 1 or more and 6 or less. In addition, when R ^c1 is an alkoxy group, it may be a straight chain or a branched chain. Specific examples when R ^c1 is an alkoxy group include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group, and tert-butoxy group. Oxy, n-pentyloxy, isopentyloxy, sec-pentyloxy, tert-amyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy group, n-nonyloxy, isononyloxy, n-decyloxy, and isodecyloxy, etc. In addition, when R ^c1 is an alkoxy group, the alkoxy group may contain an ether bond (-O-) in the carbon chain. Examples of the alkoxy group having an ether bond in the carbon chain include methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, and ethoxyethoxyethoxy group, propoxyethoxyethoxy, and methoxypropoxy, etc.

When R ^c1 is a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms in the cycloalkyl group or cycloalkoxy group is preferably 3 or more and 10 or less, and more preferably 3 or more and 6 or less. Specific examples when R ^c1 is a cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and the like. Specific examples when R ^c1 is cycloalkoxy include cyclopropyloxy, cyclobutyloxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, and cyclooctyloxy Base et al.

When R ^c1 is a saturated aliphatic acyl group or a saturated aliphatic acyloxy group, the carbon number of the saturated aliphatic acyl group or saturated aliphatic acyloxy group is preferably 2 or more and 21 or less, and more preferably 2 or more and 7 or less. Specific examples when R ^c1 is a saturated aliphatic acyl group include acetyl, propionyl, n-butyryl, 2-methylpropionyl, n-valeryl, 2,2-dimethylpropionyl, n-hexanoyl, n-heptanoyl, n-octanoyl, n-nonanoyl, n-decanoyl, n-undecanoyl, n-dodecanoyl, n-tridecanoyl, n-tetradecanoyl, n-pentadecanoyl, and n-hexadecanoyl Alkanoyl, etc. Specific examples when R ^c1 is a saturated aliphatic acyloxy group include acetoxy, propionyloxy, n-butyryloxy, 2-methylpropionyloxy, n-valeryloxy, 2, 2-dimethylpropionyloxy, n-hexanoyloxy, n-heptanoyloxy, n-octanoyloxy, n-nonanoyloxy, n-decanoyloxy, n-undecanoyloxy, n-dodecanoyloxy Alkanoyloxy, n-tridecanoyloxy, n-tetradecanoyloxy, n-pentadecanoyloxy, n-hexadecanoyloxy and the like.

When R ^c1 is an alkoxycarbonyl group, the number of carbon atoms in the alkoxycarbonyl group is preferably 2 or more and 20 or less, and more preferably 2 or more and 7 or less. Specific examples when R ^c1 is an alkoxycarbonyl group include methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, isobutoxycarbonyl, sec-butoxycarbonyl, tert-butoxycarbonyl, n-pentoxycarbonyl, isopentyloxycarbonyl, sec-pentoxycarbonyl, tert-amyloxycarbonyl, n-hexyloxycarbonyl, n-heptoxycarbonyl, n-octyloxy carbonyl, isooctyloxycarbonyl, sec-octyloxycarbonyl, tert-octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, and isodecyloxycarbonyl, etc.

When R ^c1 is a phenylalkyl group, the number of carbon atoms of the phenylalkyl group is preferably 7 or more and 20 or less, and more preferably 7 or more and 10 or less. In addition, when R ^c1 is a naphthylalkyl group, the number of carbon atoms of the naphthylalkyl group is preferably 11 or more and 20 or less, and more preferably 11 or more and 14 or less. Specific examples when R ^c1 is a phenylalkyl group include a benzyl group, a 2-phenylethyl group, a 3-phenylpropyl group, and a 4-phenylbutyl group. Specific examples when R ^c1 is naphthylalkyl include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-(β-naphthyl)ethyl . When R ^c1 is a phenylalkyl group or a naphthylalkyl group, R ^c1 may further have a substituent on the phenyl group or naphthyl group.

When R ^c1 is a heterocyclic group, the heterocyclic group is a 5- or 6-membered monocyclic ring containing at least one N, S, and O, or the monocyclic rings are condensed with each other, or the monocyclic rings are condensed with a benzene ring formed heterocyclic group. When the heterocyclic group is a condensed ring, the number of monocyclic rings constituting the condensed ring is 3 or less. The heterocyclic group may be an aromatic group (heteroaryl group) or a non-aromatic group. Examples of the heterocycle constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrazine, and pyrimidine , pyridazine, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, iso Quinoline, quinazoline, phthalazine, cinnoline, quinoxaline, piperidine, piperazine, morpholine, piperidine, tetrahydropyran, and tetrahydrofuran, etc. When R ^c7 is a heterocyclic group, the heterocyclic group may further have a substituent.

When R ^c1 is a heterocyclic carbonyl group, the heterocyclic group included in the heterocyclic carbonyl group is the same as when R ^c1 is a heterocyclic group.

When R ^c1 is an amino group substituted with one or two organic groups, preferable examples of the organic group include an alkyl group having 1 to 20 carbon atoms, and a ring having 3 to 10 carbon atoms. Alkyl, saturated aliphatic acyl having 2 or more and 21 or less carbon atoms, saturated aliphatic acyloxy having 2 or more and 21 or less carbon atoms, optionally substituted phenyl, optionally substituted benzyl Acyl, optionally substituted phenylalkyl group having 7 to 20 carbon atoms, optionally substituted naphthyl, optionally substituted naphthoyl, optionally substituted with 11 or more carbon atoms and naphthyl alkyl groups of 20 or less, heterocyclic groups, and the like. Specific examples of these preferable organic groups are the same as those of R ^c1 . Specific examples of the amino group substituted with one or two organic groups include methylamino, ethylamino, diethylamino, n-propylamino, di-n-propylamino, isopropylamino, n-propylamino Butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decylamino, phenylamino, naphthylamino, acetylamino, Propionylamino, n-butyrylamino, n-pentanoylamino, n-hexanoylamino, n-heptanoylamino, n-octanoylamino, n-decanoylamino, benzoylamino, α-naphthoylamino, β-naphthoyl Amino, N-acetyl-N-acetoxyamino, N-propionyl-N-propionyloxyamino and the like.

When R ^c1 is an alkyl group substituted with an amino group, and an alkyl group substituted with an amino group substituted with one or two organic groups, it is preferable that the alkyl group described as a specific example when R ^c1 is an alkyl group is replaced by an amino group, or Amino substituted with 1 or 2 organic groups.

Preferred specific examples of the alkyl group substituted with an amino group and the alkyl group substituted with an amino group substituted with one or two organic groups include 2-aminoethyl, 3-amino-n-propyl, 2-amino n-propyl, 4-amino-n-butyl, 2-(N,N-dimethylamino)ethyl, 3-(N,N-dimethylamino)n-propyl, 2-(N,N-diethylamino) Methylamino)n-propyl, 4-(N,N-dimethylamino)n-butyl, 2-(N,N-diethylamino)ethyl, 3-(N,N-diethylamino) ) n-propyl, 2-(N,N-diethylamino)n-propyl, 4-(N,N-diethylamino)n-butyl, 2-(N-acetyl-N-acetoxy Amino)ethyl, 3-(N-acetyl-N-acetoxyamino)n-propyl, 2-(N-acetyl-N-acetoxyamino)n-propyl, and 4-(N-acetyl yl-N-acetoxyamino) n-butyl.

Examples of substituents included in R ^c1 when the phenyl group, naphthyl group, and heterocyclic group further have a substituent include an alkyl group having 1 to 6 carbon atoms, an alkyl group having 1 to 6 carbon atoms, and 1 to 6 carbon atoms. The following alkoxy groups, saturated aliphatic acyl groups having 2 to 7 carbon atoms, alkoxycarbonyl groups having 2 to 7 carbon atoms, and saturated aliphatic acyl groups having 2 to 7 carbon atoms Oxyl group, monoalkylamino group having an alkyl group having 1 to 6 carbon atoms, dialkylamino group having an alkyl group having 1 to 6 carbon atoms, morpholin-1-yl, piperazine -1-yl, halogen, nitro, and cyano, etc.

These substituents are an alkyl group having 1 or more and 6 or less carbon atoms, an alkoxy group having 1 or more and 6 or less carbon atoms, a saturated aliphatic acyl group having 2 or more and 7 or less carbon atoms, and a carbon number of Alkoxycarbonyl having 2 or more and 7 or less, saturated aliphatic acyloxy having 2 or more and 7 or less carbon atoms, monoalkylamino having an alkyl group having 1 or more and 6 or less carbon atoms, and carbon In the case of the dialkylamino group of an alkyl group having 1 or more and 6 or less atoms, an ether bond (-O-) may be included in the carbon chain in these substituents.

When the phenyl group, naphthyl group, and heterocyclic group contained in R ^c1 further have a substituent, the number of such substituents is not limited within a range that does not hinder the purpose of the present invention, but is preferably 1 or more and 4 or less . When the phenyl group, the naphthyl group, and the heterocyclic group contained in R ^c1 have a plurality of substituents, the plurality of substituents may be the same or different.

As R ^c1 , a cycloalkylalkyl group, a phenoxyalkyl group which may have a substituent on the aromatic ring, and a phenylthioalkyl group which may have a substituent on the aromatic ring are also preferable. The substituent which the phenoxyalkyl group and the phenylthioalkyl group may have are as described above as the substituent which the phenyl group may have.

Among the organic groups, Rc1 is preferably an alkyl group, a cycloalkyl group, a phenyl group which may have a substituent, a cycloalkylalkyl group, or a phenylthioalkyl group which may have a substituent on an aromatic ring. The alkyl group is preferably an alkyl group having 1 or more and 20 or less carbon atoms, more preferably an alkyl group having 1 or more and 8 or less carbon atoms, particularly preferably an alkyl group having 1 or more and 4 or less carbon atoms, and most preferably methyl. Among the optionally substituted phenyl groups, methylphenyl groups are preferred, and 2-methylphenyl groups are more preferred. The number of carbon atoms in the cycloalkyl group contained in the cycloalkylalkyl group is preferably 5 or more and 10 or less, more preferably 5 or more and 8 or less, and particularly preferably 5 or 6. The number of carbon atoms of the alkylene group contained in the cycloalkylalkyl group is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and particularly preferably 2. Among the cycloalkylalkyl groups, cyclopentylethyl is preferred. The number of carbon atoms in the alkylene group contained in the phenylthioalkyl group which may have a substituent on the aromatic ring is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and particularly preferably 2. Among the phenylthioalkyl groups which may have a substituent on the aromatic ring, 2-(4-chlorophenylthio)ethyl is preferred.

Moreover, as R ^c1 , a group represented by -A ¹ -CO-OA ² is also preferable. A ¹ is a divalent organic group, preferably a divalent hydrocarbon group, preferably an alkylene group. A ² is a monovalent organic group, preferably a monovalent hydrocarbon group.

When A ¹ is an alkylene group, the alkylene group may be straight-chain or branched, but straight-chain is preferred. When A ¹ is an alkylene group, the number of carbon atoms of the alkylene group is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and particularly preferably 1 or more and 4 or less.

Preferable examples of A2 include an alkyl group having ¹ to 10 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and an aromatic group having 6 to 20 carbon atoms. Hydrocarbyl. Preferable specific examples of A2 include methyl, ethyl, n ^- propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, n-hexyl, and phenyl , naphthyl, benzyl, phenethyl, α-naphthylmethyl, and β-naphthylmethyl, etc.

Preferable specific examples of the group represented by -A ¹ -CO-OA ² include 2-methoxycarbonylethyl, 2-ethoxycarbonylethyl, 2-n-propoxycarbonylethyl, 2-n-propoxycarbonylethyl, -n-Butoxycarbonylethyl, 2-n-pentoxycarbonylethyl, 2-n-hexyloxycarbonylethyl, 2-benzyloxycarbonylethyl, 2-phenoxycarbonylethyl, 3-methoxy n-propyl carbonyl, 3-ethoxycarbonyl-n-propyl, 3-n-propoxycarbonyl-n-propyl, 3-n-butoxycarbonyl-n-propyl, 3-n-pentoxycarbonyl-n-propyl, 3 -n-hexyloxycarbonyl-n-propyl, 3-benzyloxycarbonyl-n-propyl, and 3-phenoxycarbonyl-n-propyl, etc.

Although R ^c1 has been described above, R ^c1 is preferably an alkyl group having 1 or more and 6 or less carbon atoms, and a group represented by the following formula (C1a) or (C1b).

[Chemical formula 21]

In formulas (C1a) and (C1b), R ^c10 and R ^c11 are each an organic group. t3 is an integer of 0 or more and 4 or less. When R ^c10 and R ^c11 are present at adjacent positions on the benzene ring, R ^c10 and R ^c11 may be bonded to each other to form a ring. t4 is an integer of 1 or more and 8 or less. t5 is an integer of 1 or more and 5 or less. t6 is an integer of 0 or more and (t5+3) or less. R ⁰¹² is an organic group.

For R ^c10 and R ^c11 in the formula (C1a), examples of the organic group are the same as those of R ^c1 . As R ^c10 , an alkyl group or a phenyl group is preferable. When R ^c10 is an alkyl group, the number of carbon atoms is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, particularly preferably 1 or more and 3 or less, and most preferably 1. That is, R ^c10 is most preferably a methyl group. When R ^c10 and R ^c11 are bonded to form a ring, the ring may be an aromatic ring or an aliphatic ring. Preferable examples of the group represented by the formula (C1a) in which R ^c10 and R ^c11 form a ring include naphthalene-1-yl, 1,2,3,4-tetrahydronaphthalene-5-yl and the like. In the above formula (C1a), t3 is an integer of 0 or more and 4 or less, preferably 0 or 1, and more preferably 0.

In the above formula (C1b), R ^c12 is an organic group. As an organic group, the same group as the organic group demonstrated about R ^c1 is mentioned. Among the organic groups, alkyl groups are preferred. The alkyl group may be linear or branched. The number of carbon atoms of the alkyl group is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and particularly preferably 1 or more and 3 or less. As R ^c12 , a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and the like can be preferably exemplified, and among these, a methyl group is more preferable.

In the above formula (C1b), t5 is an integer of 1 or more and 5 or less, preferably 1 or more and 3 or less, and more preferably 1 or 2. In the above formula (C1b), t6 is 0 or more and (t5+3) or less, preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and particularly preferably 0. In the above formula (C1b), t4 is an integer of 1 or more and 8 or less, preferably 1 or more and 5 or less, more preferably 1 or more and 3 or less, and particularly preferably 1 or 2.

In formula (C1), R ^c2 is each independently a hydrogen atom, an optionally substituted alkyl group having 1 to 11 carbon atoms, or an optionally substituted aryl group. As a substituent which may be possessed when R ^c2 is an alkyl group, a phenyl group, a naphthyl group and the like are preferably exemplified. In addition, as a substituent which R ^c2 may have when it is an aryl group, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a halogen atom, and the like are preferably exemplified.

In formula (C1), as R ^c2 , hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, phenyl group, benzyl group, methylphenyl group, naphthyl group and the like can be preferably exemplified, and these Among them, a methyl group or a phenyl group is more preferable.

In formula (C1), R ^c3 is a monovalent, optionally substituted aromatic group bonded to a nitrogen atom in a carbazole ring through a CN bond. The aromatic group can be aryl or heteroaryl. O, S, N, P, Si, etc. are mentioned as a hetero atom which a heteroaryl group has.

The number of carbon atoms of the aromatic group which may have a substituent as R ^c3 is not particularly limited. The number of carbon atoms of the optionally substituted aromatic group as R ^c3 is, for example, preferably 1 or more and 50 or less, more preferably 1 or more and 30 or less, and particularly preferably 1 or more and 20 or less. In addition, the carbon number of the aromatic group which may have a substituent does not include the carbon number of a substituent.

Furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, tetrazole, pyridine can be mentioned as the heterocycle constituting the heteroaryl group as R ^c3 , pyrazine, pyrimidine, pyridazine, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine , quinoline, isoquinoline, quinazoline, phthalazine, cinnoline, and quinoxaline, etc.

Preferred examples when R ^c3 is an aryl group include a phenyl group, a naphthalene-1-yl group, a naphthalene-2-yl group, a 2-phenylphenyl group, a 3-phenylphenyl group, and a 4-phenylphenyl group. .

The aromatic group as R ^c3 may have a substituent. Examples of the substituent which the aromatic group of R ^c3 may have include an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and an alkyl group having 1 to 20 carbon atoms. Cycloalkyl having 3 or more and 10 or less, cycloalkoxy having 3 or more and 10 or less carbon atoms, saturated aliphatic acyl group having 2 or more and 20 or less carbon atoms, or 2 or more and 20 or less carbon atoms alkoxycarbonyl, saturated aliphatic acyloxy having 2 or more and 20 or less carbon atoms, optionally substituted phenyl, optionally substituted phenoxy, optionally substituted phenylthio, An optionally substituted benzoyl group, an optionally substituted phenoxycarbonyl group, an optionally substituted benzoyloxy group, an optionally substituted phenylalkyl group having 7 to 20 carbon atoms, optionally substituted naphthyl, optionally substituted naphthyloxy, optionally substituted naphthoyl, optionally substituted naphthyloxycarbonyl, optionally substituted naphthoyloxy, optionally substituted Naphthyl alkyl group having 11 or more and 20 or less carbon atoms, optionally substituted heterocyclic group, optionally substituted heterocyclic carbonyl group, amino group, amino group substituted with one or two organic groups , morpholin-1-yl, and piperazin-1-yl, halogen, nitro, and cyano, etc.

The number of substituents which the aromatic group of R ^c3 may have is not particularly limited, and may be one or two or more. When the aromatic group as R ^c3 has a plurality of substituents, the plurality of substituents may be the same or different.

The oxime ester compound represented by the formula (C1) described above preferably has t1 of 0 and t2 of 0 from the viewpoints of easy synthesis, easy availability, and easy formation of a patterned cured film having a favorable cross-sectional shape.

As described above, as X ^c1 , a group represented by the formula (C2) is preferable.

Preferred specific examples of the oxime ester compound represented by formula (C1) when X ^c1 is a group represented by formula (C2) include the following compounds.

[Chemical formula 22]

[Chemical formula 23]

[Chemical formula 24]

[Chemical formula 25]

[Chemical formula 26]

[Chemical formula 27]

[Photopolymerization initiator (C-II)]

The photosensitive resin composition may contain, as the photopolymerization initiator (C), other photopolymerization initiators (C-II) other than the photopolymerization initiator (C-I) together with the above-mentioned photopolymerization initiator (C-I). ). The other photopolymerization initiator (C-II) is not particularly limited as long as it is a photopolymerization initiator that does not belong to the photopolymerization initiator (C-I).

Preferred examples of the photopolymerization initiator (C-II) include: an oxime ester compound having a structure not belonging to the above formula (C1); Linophenyl) 1-butanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethyl Amino-1-(4-dimethylaminophenyl)1-butanone, 2-(4-methylbenzyl)-2-diethylamino-1-(4-morpholinophenyl)1- Butanone, 2-methyl-1-phenyl-2-morpholino-1-propanone, 2-methyl-1-[4-(hexyl)phenyl]-2-morpholino-1-propanone, α-Aminoketone compounds such as 2-ethyl-2-dimethylamino-1-(4-morpholinophenyl)1-butanone; 1-phenyl-2-hydroxy-2-methyl-1 - Acetone, 1-(4-Isopropylphenyl)-2-hydroxy-2-methyl-1-propanone, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl) ) α-hydroxy ketone photopolymerization initiators such as ketone and 1-hydroxycyclohexyl phenyl ketone; benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzil Benzoin-based photopolymerization initiators such as benzil methyl ketal; benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxydiphenyl Initiated by photopolymerization of benzophenones such as ketone, acrylated benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 4,4'-bisdiethylaminobenzophenone, etc. thioxanthone-based photopolymerization initiators such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, etc.; 2 , 4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloro) methyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphthalen-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4 -Methoxy-naphthalen-1-yl)-4,6-bis(trichloromethyl)s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, 2,4- Trichloromethyl-(4'-methoxystyryl)-6-triazine, 2-[4-(4-methoxystyryl)phenyl]-4,6-bis(trichloromethane base)-1,3,5-triazine and other triazine-based photopolymerization initiators; carbazole-based photopolymerization initiators; 2,2'-bis(2-chlorophenyl)-4,4',5,5 '-Tetrakis(4-ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-bis(2-bromophenyl)-4,4',5,5'-tetrakis(4- Ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-bi Imidazole, 2,2'-bis(2,4-dichlorophenyl)- 4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5,5' -Tetraphenyl-1,2'-biimidazole, 2,2'-bis(2-bromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2 , 2'-bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4,6 -Tribromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole and other biimidazole-based photopolymerization initiators; such a benzimidazoline-based photopolymer represented by the following formula Polymerization initiators, etc.

[Chemical formula 28]

The ratio of the mass of the photopolymerization initiator (C-I) to the mass of the photopolymerization initiator (C) may be in a range that does not inhibit the purpose of the present invention, and is not particularly limited. The ratio of the mass of the photopolymerization initiator (C-I) to the mass of the photopolymerization initiator (C) is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, still more preferably 90 mass % or more, 100 mass % is especially preferable.

The content of the photopolymerization initiator (C) is preferably 0.1 mass % or more and 30 mass % or less, more preferably 0.5 mass % or more and 20 mass % or less, with respect to the mass of the entire solid content of the photosensitive resin composition. By making content of a photoinitiator (C) into the said range, it becomes possible to obtain the photosensitive resin composition which is favorable in sclerosis|hardenability, and which is hard to produce a pattern shape defect.

<Fluorine resin (D)>

The photosensitive resin composition contains the fluorine-based resin (D). When the photosensitive resin composition contains a fluorine-based resin (D), when ink is used to form pixels in color filters, organic EL display elements, quantum dot displays, or organic TFT arrays, etc., the photosensitive resin composition The formed banks tend to repel ink. As a result, it is possible to prevent the adhesion of the ink to the banks and the mixing of the inks between adjacent pixels when the ink is injected into the region surrounded by the banks.

The fluorine-based resin (D) is not particularly limited as long as it contains fluorine atoms and can impart ink repellency to various inks to banks formed using the photosensitive resin composition. The fluorine-based resin (D) may be a homopolymer of a fluorine atom-containing monomer, or a copolymer of a fluorine atom-containing monomer and a fluorine atom-free monomer.

Preferred examples of the fluorine-based resin (D) include copolymers obtained by copolymerizing at least (d1) a monomer having an ethylenically unsaturated group and a fluorine atom and (d2) (meth)acrylic acid. In the case of using such a fluorine-based resin (D), it is easy to form a bank excellent in liquid repellency to ink (which is used to form a pixel) using the photosensitive resin composition.

[(d1) Monomer having ethylenically unsaturated group and fluorine atom]

The monomer having an ethylenically unsaturated group and a fluorine atom (hereinafter, also referred to as "(d1) monomer".) is not particularly limited as long as it has an ethylenically unsaturated group and a fluorine atom. As such a (d1) monomer, the compound etc. which are represented by following formula (d1-1) are mentioned. These (d1) monomers may be used alone or in combination of two or more.

[Chemical formula 29]

In formula (d1-1), X ¹ and X ² are each independently a hydrogen atom or a fluorine atom. X ³ is a hydrogen atom, a fluorine atom, a methyl group, or a perfluoromethyl group. X ⁴ and X ⁵ are each independently a hydrogen atom, a fluorine atom, or a perfluoromethyl group. Rf is a fluorine-containing alkyl group having 1 or more and 40 or less carbon atoms, or a fluorine-containing alkyl group having 2 or more and 100 or less carbon atoms and having an ether bond. a is an integer of 0 or more and 3 or less. b and c are each independently 0 or 1.

When Rf is a fluorine-containing alkyl group, the number of carbon atoms is preferably 2 or more and 20 or less, more preferably 3 or more and 10 or less, and particularly preferably 4 or more and 6 or less. When Rf is a fluorine-containing alkyl group having an ether bond, the number of carbon atoms is preferably 2 or more and 50 or less, more preferably 3 or more and 20 or less, and particularly preferably 4 or more and 6 or less.

The content of the structural unit derived from the monomer (d1) is preferably 30 mol % or more and 80 mol % or less, more preferably 40 mol % or more, with respect to the number of moles of the total structural units of the fluorine-based resin (D). 60 mol% or less. When the content of the structural unit derived from the monomer (d1) in the fluorine-based resin (D) is within the above range, there is a tendency that the photosensitive resin composition is used to easily form a bank excellent in ink repellency, and the photosensitivity In the resin composition, the fluorine-based resin (D) has good compatibility with other components.

The (d1) monomer preferably has a group represented by -(CF ₂ ) _t F. t is an integer of 1 or more and 10 or less, more preferably an integer of 1 or more and 8 or less, and still more preferably an integer of 2 or more and 6 or less. When the monomer (d1) has the above-mentioned group, it is easy to form a bank excellent in ink repellency using the photosensitive resin composition.

[(d2)(meth)acrylic acid]

In order to improve the developability of the photosensitive resin composition, the fluorine-based resin (D) preferably contains a structural unit derived from (d2) (meth)acrylic acid which is a monomer having a carboxyl group.

The content of the structural unit derived from (d2) (meth)acrylic acid is preferably 0.1 mol % or more and 20 mol % or less with respect to the number of moles of all the structural units of the fluorine-based resin (D). When the content of the structural unit derived from (d2) (meth)acrylic acid in the fluorine-based resin (D) is within the above range, it is easy to obtain a photosensitive resin composition capable of forming a bank with excellent developability and excellent ink repellency.

In the fluorine-based resin (D), other monomers other than the above-mentioned (d1) monomer and (d2) monomer may be copolymerized as necessary. Examples of such other monomers include various monomers described below.

[(d3) Monomer having ethylenically unsaturated group and epoxy group]

The fluorine-based resin (D) is preferably a copolymer in which a monomer (hereinafter, also referred to as "(d3) monomer") having an ethylenically unsaturated group and an epoxy group is further copolymerized. By copolymerizing the monomer (d3), the ink repellency of the bank formed of the photosensitive resin composition can be further improved.

(d3) Monomers include: glycidyl (meth)acrylate; alicyclic epoxy compounds represented by the following formulae (d3-1) to (d3-3); (meth)acrylic acid A monomer obtained by reacting the carboxyl group of the acrylic monomer with the epoxy group of a bifunctional or higher epoxy compound; the hydroxyl group or carboxyl group of an acrylic monomer having a hydroxyl group or a carboxyl group in the side chain and the epoxy group of a bifunctional or higher epoxy compound The monomers obtained by the reaction; and so on. Among them, glycidyl (meth)acrylate is preferable. These (d3) monomers may be used alone or in combination of two or more.

[Chemical formula 30]

In formula (d3-2) and formula (d3-3), R ^1d is a hydrogen atom or a methyl group. u is an integer of 1 or more and 10 or less. v and w are each independently an integer of 1 or more and 3 or less.

When the fluorine-based resin contains a structural unit derived from the monomer (d3), the content of the structural unit in the fluorine-based resin (D) is preferably 1 mol with respect to the number of moles of all the structural units in the fluorine-based resin (D). % or more and 40 mol% or less, more preferably 5 mol% or more and 15 mol% or less. When the content of the structural unit derived from the monomer (d3) in the fluorine-based resin (D) is within the above range, it is easy to obtain a photosensitive resin composition capable of forming a bank with good ink repellency.

[(d4) Monomer having a structure represented by formula (d4-1)]

It is preferable that the fluorine-based resin (D) is further copolymerized with a monomer having an ethylenically unsaturated group and a structure represented by the following formula (d4-1) (hereinafter, also referred to as "(d4) monomer".) the copolymer. By copolymerizing the monomer (d4), a photosensitive resin composition excellent in developability can be easily obtained, and the compatibility of the fluorine-based resin (D) and other components in the photosensitive resin composition can be improved.

[Chemical formula 31]

The monomer (d4) more preferably has an ethylenically unsaturated group and a structure represented by the following formula (d4-2).

[Chemical formula 32]

In formula (d4-1) and formula (d4-2), R ^2d is an alkylene group having 1 or more and 5 or less carbon atoms. The alkylene group may be linear or branched. As the alkylene group, an alkylene group having 1 or more and 3 or less carbon atoms is preferable, and an ethylene group is most preferable. R ^3d is a hydrogen atom, a hydroxyl group, or an optionally substituted alkyl group having 1 or more and 20 or less carbon atoms. The alkyl group may be linear or branched. As the alkyl group, an alkyl group having 1 or more and 3 or less carbon atoms is preferable, and a methyl group is most preferable. As said substituent, a carboxyl group, a hydroxyl group, an alkoxy group having 1 or more and 5 or less carbon atoms, etc. are mentioned. x is an integer of 1 or more. As x, an integer of 1 or more and 60 or less is preferable, and an integer of 1 or more and 12 or less is more preferable.

As such a (d4) monomer, the compound etc. which are represented by following formula (d4-3) are mentioned. These (d4) monomers may be used alone or in combination of two or more.

[Chemical formula 33]

In formula (d4-3), R ^4d is a hydrogen atom or a methyl group. R ^2d , R ^3d , and x have the same meanings as in the above formulas (d4-1) and (d4-2).

The content of the structural unit derived from the monomer (d4) is preferably 1 mol % or more and 40 mol % or less, more preferably 5 mol % or more, with respect to the number of moles of the total structural units of the fluorine-based resin (D). 25 mol% or less. When the content of the structural unit derived from the monomer (d4) is within the above range, the developability of the photosensitive resin composition and the phase relationship between the (D) fluorine-based resin and other components in the photosensitive resin composition tend to be Capacitance is good.

[(d5) Monomer having silicon atom]

The fluorine-based resin (D) is preferably a copolymer in which a monomer having a silicon atom (hereinafter, also referred to as "(d5) monomer") is further copolymerized. The monomer (d5) is not particularly limited as long as it has an ethylenically unsaturated group and at least one alkoxy group bonded to a silicon atom. By copolymerizing the monomer (d5), the ink repellency of the bank formed of the photosensitive resin composition can be further improved.

As such a monomer (d5), the compound etc. which are represented by following formula (d5-1) are mentioned. These (d5) monomers may be used alone or in combination of two or more.

[Chemical formula 34]

In formula (d5-1), R ^5d is a hydrogen atom or an alkyl group having 1 or more and 10 or less carbon atoms, preferably a hydrogen atom or a methyl group. R ^6d is an alkylene group or a phenylene group having 1 to 20 carbon atoms, preferably an alkylene group having 1 to 10 carbon atoms. R ^7d and R ^8d are each independently an alkyl group or a phenyl group having 1 or more and 10 or less carbon atoms, preferably an alkyl group having 1 or more and 3 or less carbon atoms. When a plurality of R ^7d is bonded to Si, the plurality of R ^7d may be the same or different. When a plurality of (OR ^8d ) are bonded to Si, the plurality of (OR ^8d ) may be the same or different. p is 0 or 1, preferably 1. q is an integer of 1 to 3, preferably 2 or 3, and more preferably 3.

The content of the structural unit derived from the monomer (d5) is preferably 20 mol % or less, more preferably 10 mol % or less, with respect to the number of moles of all the structural units of the fluorine-based resin (D). When the content of the structural unit derived from the monomer (d5) is within the above range, ink repellency and compatibility with other components of the colored photosensitive resin composition tend to be favorable.

As other monomers other than the above-mentioned monomers, various monomers having an ethylenically unsaturated group can be used, and among them, acrylic monomers are preferred. Preferable examples of the acrylic monomer include 2-hydroxyethyl methacrylate (HEMA), N-hydroxymethacrylamide (N-MAA), methyl methacrylate (MAA), and methacrylic acid. Cyclohexyl ester (CHMA), isobornyl methacrylate (IBMA), etc. The content of the structural units derived from these other monomers in the fluorine-based resin (D) is preferably 0 mol % or more and 25 mol % or less with respect to the number of moles of all the structural units of the fluorine-based resin (D).

A known method can be used as a method of reacting the monomer (d1) and the monomer (d2) and other monomers added as necessary to obtain a copolymer.

The weight average molecular weight of the fluorine-based resin (D) is preferably 2,000 or more and 50,000 or less, and more preferably 5,000 or more and 20,000 or less. By setting the weight average molecular weight of the fluorine-based resin (D) to be 2,000 or more, the heat resistance and strength of the bank formed using the photosensitive resin composition can be improved. The developability of the photosensitive resin composition can be improved by making the weight average molecular weight of a fluororesin (D) into 50,000 or less.

The content of the fluorine-based resin (D) in the photosensitive resin composition is preferably 0.1 mass % or more and 10 mass % or less, more preferably 0.2 mass % or more and 5 mass % with respect to the solid content of the photosensitive resin composition. %the following. When the photosensitive resin composition contains the fluorine-based resin (D) in such an amount, excellent sensitivity, developability, and resolution can be imparted to the photosensitive resin composition, and the barrier formed using the photosensitive resin composition can be easily prevented. The banks impart good ink repellency to the ink used to form the pixels.

<Colorant (E)>

The photosensitive resin composition may further contain a colorant (E). By making the photosensitive resin composition contain a coloring agent (E), it can be used suitably for coloring film formation applications, such as RGB in the color filter of a liquid crystal display display, for example. Moreover, it is also preferable that the photosensitive resin composition contains a light-shielding agent (E1) as a coloring agent (E). By using the light-shielding agent (E1), it is possible to form light-shielding banks that divide pixels in a color filter, an organic EL display element, a quantum dot display, an organic TFT array, or the like. In addition, in this application, the black matrix which comprises the color filter of a liquid crystal display is also included in a bank and demonstrated.

The colorant (E) contained in the photosensitive resin composition is not particularly limited. For example, compounds classified as pigments in the Dye Index (C.I.; issued by The Society of Dyers and Colourists) are preferably used. In terms of pigments, the following dye index (C.I.) numbers are attached.

Examples of yellow pigments that can be preferably used include C.I. Pigment Yellow 1 (hereinafter, also referred to as "C.I. Pigment Yellow", and only numbers are described), 3, 11, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 55, 60, 61, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, and 185.

Examples of orange pigments that can be preferably used include C.I. Pigment Orange 1 (hereinafter, also referred to as "C.I. Pigment Orange", and only the numbers are described.), 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 55, 59, 61, 63, 64, 71, and 73.

Examples of violet pigments that can be preferably used include C.I. Pigment Violet 1 (hereinafter, also referred to as "C.I. Pigment Violet", and only the numbers are described.), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, and 50.

Examples of red pigments that can be preferably used include C.I. Pigment Red 1 (hereinafter, also referred to as "C.I. Pigment Red", and only numbers are described.) 2, 3, 4, 5, 6, 7, 8, 9, 10 , 11, 12, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48:1, 48:2, 48:3 , 48:4, 49:1, 49:2, 50:1, 52:1, 53:1, 57, 57:1, 57:2, 58:2, 58:4, 60:1, 63:1 , 63:2, 64:1, 81:1, 83, 88, 90:1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149 , 150, 151, 155, 166, 168, 170, 171, 172, 174, 175, 176, 177, 178, 179, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207 , 208, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, and 265.

Examples of blue pigments that can be preferably used include C.I. Pigment Blue 1 (hereinafter, also referred to as "C.I. Pigment Blue", and only the numbers are described), 2, 15, 15:3, 15:4, 15:6 , 16, 22, 60, 64, and 66.

Examples of pigments with hues other than the above that can be preferably used include green pigments such as C.I. Pigment Green 7, C.I. Pigment Green 36, and C.I. Pigment Green 37, C.I. Pigment Brown 23, C.I. Pigment Brown 25, and C.I. Pigment Brown 26 , C.I. Pigment Brown 28 and other brown pigments, C.I. Pigment Black 1, C.I. Pigment Black 7 and other black pigments.

Moreover, when providing light-shielding property to the photosensitive resin composition, it is preferable that the photosensitive resin composition contains a black pigment as a light-shielding agent (E1). The photosensitive resin composition containing a black pigment can be suitably used for formation of a black matrix or a black column spacer in a liquid crystal display panel, and formation of a bank (which divides the light-emitting layer in an organic EL element).

Examples of black pigments include metal oxides and composite oxides such as carbon black, perylene-based pigments, lactam-based pigments, titanium black, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, and silver. , metal sulfides, metal sulfates or metal carbonates and other pigments (whether organic or inorganic). Among these black pigments, carbon black is preferable because it is easy to obtain, and is easy to form a cured film having excellent light-shielding properties and high electrical resistance.

It should be noted that the hue of the black pigment is not limited to achromatic black in terms of chromaticity, and may be purplish black, bluish black, or reddish black.

As the carbon black, known carbon blacks such as channel black, furnace black, thermal black, and lamp black can be used, and light-shielding properties are preferably used. Excellent channel black. In addition, resin-coated carbon black can also be used.

Resin-coated carbon black has lower electrical conductivity than non-resin-coated carbon black, so when used as a black matrix of a liquid crystal display element such as a liquid crystal display, it is possible to produce a power consumption with less leakage of current and high reliability. Display with low battery.

As carbon black, the carbon black which performed the process to introduce|transduce an acidic group is also preferable. The acidic group introduced into carbon black is a functional group showing acidity based on Bronsted's definition. As a specific example of an acidic group, a carboxyl group, a sulfonic acid group, a phosphoric acid group, etc. are mentioned. The acidic groups introduced into carbon black can form salts. The cation that forms a salt with the acidic group is not particularly limited as long as it does not hinder the object of the present invention. Examples of cations include various metal ions, cations of nitrogen-containing compounds, ammonium ions, and the like, and preferred are alkali metal ions such as sodium ions, potassium ions, and lithium ions, and ammonium ions.

Among the carbon blacks that have been subjected to the treatment of introducing an acidic group as described above, from the viewpoint of achieving high resistance of the light-shielding cured film formed using the photosensitive resin composition, it is preferable to have a carbon black selected from the group consisting of carboxylic acid groups and carboxylate salts. Carbon black with one or more functional groups in the group consisting of a group consisting of a sulfonic acid group, a sulfonic acid group, and a sulfonic acid salt group.

The method of introducing an acidic group into carbon black is not particularly limited. As a method of introducing an acidic group, the following method is mentioned, for example.

In method 1), a sulfonic acid group is introduced into carbon black by a direct substitution method (which uses concentrated sulfuric acid, oleum, chlorosulfonic acid, etc.), an indirect substitution method (which uses sulfite, hydrogen sulfite, etc.).

In method 2), an organic compound having an amino group and an acidic group is subjected to diazo coupling with carbon black.

In method 3), an organic compound having a halogen atom and an acidic group is reacted with carbon black having a hydroxyl group by the Williamson etherification method.

In method 4), an organic compound having a halogenated carbonyl group and an acidic group protected by a protecting group is reacted with carbon black having a hydroxyl group.

Method 5), using an organic compound having a halogenated carbonyl group and an acidic group protected by a protecting group, to carry out a Friedel-Clayford reaction on carbon black, followed by deprotection.

Among these methods, method 2) is preferable from the viewpoint of easy and safe treatment of introducing an acidic group. As the organic compound having an amino group and an acidic group used in the method 2), a compound in which an amino group and an acidic group are bonded to an aromatic group is preferable. Examples of such compounds include aminobenzenesulfonic acid such as p-aminobenzenesulfonic acid, and aminobenzoic acid such as 4-aminobenzoic acid.

The number of moles of acidic groups introduced into carbon black is not particularly limited as long as the number of moles of acidic groups does not hinder the object of the present invention. The number of moles of acidic groups introduced into carbon black is preferably 1 mmol or more and 200 mmol or less, and more preferably 5 mmol or more and 100 mmol or less, relative to 100 g of carbon black.

Coating treatment with resin can be performed on the carbon black into which the acidic group is introduced.

When the photosensitive resin composition containing resin-coated carbon black is used, it becomes easy to form a light-shielding cured film which is excellent in light-shielding property and insulating property, and has a low surface reflectance. In addition, by the coating process by resin, the dielectric constant of the light-shielding cured film formed using the photosensitive resin composition is not especially adversely affected. Examples of resins that can be used to coat carbon black include phenol resins, melamine resins, xylene resins, diallyl phthalate resins, glycerol resins, epoxy resins, and alkylbenzene resins. Thermosetting resin, polystyrene, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, modified polyphenylene ether, polysulfone, polyparaphenylene terephthalate , Polyamideimide, Polyimide, Polyaminobismaleimide, Polyethersulfone, Polyphenylenesulfone, Polyarylate, Polyetheretherketone and other thermoplastic resins. The coating amount of the carbon black with the resin is preferably 1 mass % or more and 30 mass % or less with respect to the sum of the mass of the carbon black and the mass of the resin.

In addition, as the black pigment, a perylene-based pigment can also be preferably used. Specific examples of the perylene-based pigment include a perylene-based pigment represented by the following formula (e-1), a perylene-based pigment represented by the following formula (e-2), and a perylene-based pigment represented by the following formula (e-3). Perylene pigments. Among the commercial products, the product names K0084 and K0086, Pigment Black 21, 30, 31, 32, 33, and 34 manufactured by BASF Corporation can be preferably used as the perylene-based pigments.

[Chemical formula 35]

In formula (e-1), R ^e1 and R ^e2 each independently represent an alkylene group having 1 to 3 carbon atoms, and R ^e3 and R ^e4 each independently represent a hydrogen atom, a hydroxyl group, a methoxy group, or Acetyl.

[Chemical formula 36]

In formula (e-2), R ^e5 and R ^e6 each independently represent an alkylene group having 1 or more and 7 or less carbon atoms.

[Chemical formula 37]

In formula (e-3), R ^e7 and R ^e8 are each independently a hydrogen atom, an alkyl group having 1 to 22 carbon atoms, and may contain N, O, S, or P hetero atoms. When R ^e7 and R ^e8 are alkyl groups, the alkyl groups may be linear or branched.

The compound represented by the above-mentioned formula (e-1), the compound represented by the formula (e-2), and the compound represented by the formula (e-3) can be used, for example, Japanese Patent Laid-Open No. 62-1753, Japanese Patent Laid-Open No. 63- It was synthesized by the method described in Gazette 26784. That is, perylene-3,5,9,10-tetracarboxylic acid or its dianhydride and amines are used as raw materials, and a heating reaction is performed in water or an organic solvent. Then, the target product can be obtained by reprecipitating the obtained crude product in sulfuric acid or recrystallization in water, an organic solvent, or a mixed solvent thereof.

In order to disperse the perylene-based pigment well in the photosensitive resin composition, the average particle diameter of the perylene-based pigment is preferably 10 nm or more and 1000 nm or less.

Moreover, as a light-shielding agent (E1), a lactam-type pigment is also contained. As a lactam-type pigment, the compound represented by following formula (e-4) is mentioned, for example.

[Chemical formula 38]

In the formula (e-4), X ^e represents a double bond, and as geometric isomers, each independently is an E or Z isomer, and R ^e9 each independently represents a hydrogen atom, a methyl group, a nitro group, a methoxy group, and a bromine group. Atom, chlorine atom, fluorine atom, carboxyl group, or sulfo group, R ^e10 each independently represents a hydrogen atom, methyl group, or phenyl group, and R ^e11 each independently represents a hydrogen atom, methyl group, or chlorine atom.

The compound represented by formula (e-4) may be used alone or in combination of two or more.

From the viewpoint of easy production of the compound represented by the formula (e-4), R ^e9 is preferably bonded to the 6-position of the indolinone ring, and R ^e11 is preferably bonded to the 4-position of the indolinone ring. From the same viewpoint, R ^e9 , R ^e10 , and R ^e11 are preferably hydrogen atoms.

The compound represented by the formula (e-4) has an EE body, a ZZ body, and an EZ body as geometric isomers, and it may be any single compound among them, or a mixture of these geometric isomers.

The compound represented by formula (e-4) can be produced by the method described in, for example, International Publication No. 2000/24736 and International Publication No. 2010/081624.

In order to disperse the lactam-based pigment well in the photosensitive resin composition, the average particle diameter of the lactam-based pigment is preferably 10 nm or more and 1000 nm or less.

In addition, it is also preferable to use fine particles mainly composed of a silver-tin (AgSn) alloy (hereinafter, referred to as "AgSn alloy fine particles") as the black pigment. The AgSn alloy fine particles may contain, for example, Ni, Pd, Au, and the like as other metal components as long as the AgSn alloy is the main component.

The average particle diameter of the AgSn alloy fine particles is preferably 1 nm or more and 300 nm or less.

When the AgSn alloy is represented by the chemical formula AgxSn, the range of x that can obtain chemically stable AgSn alloy is 1≤x≤10, and the range of x that can simultaneously obtain chemical stability and blackness is 3≤x≤4.

Here, within the range of the above x, the mass ratio of Ag in the AgSn alloy was obtained, and as a result,

When x=1, Ag/AgSn=0.4762

When x=3, 3·Ag/Ag3Sn=0.7317

When x=4, 4·Ag/Ag4Sn=0.7843

When x=10, 10·Ag/Ag10Sn=0.9008.

Therefore, when the AgSn alloy contains 47.6 mass % or more and 90 mass % or less of Ag, it becomes chemically stable, and when it contains 73.17 mass % or more and 78.43 mass % or less of Ag, it can be effectively obtained according to the amount of Ag. Chemical stability and blackness.

The AgSn alloy fine particles can be produced by a general particle synthesis method. Examples of the microparticle synthesis method include a gas phase reaction method, a spray pyrolysis method, a spray method, a liquid phase reaction method, a freeze drying method, a hydrothermal synthesis method, and the like.

Although AgSn alloy fine particles have high insulating properties, depending on the application of the photosensitive resin composition, in order to further improve the insulating properties, the surface may be covered with an insulating film. As a material of such an insulating film, a metal oxide or an organic polymer compound is preferable.

As the metal oxide, an insulating metal oxide such as silica (silica), alumina (alumina), zirconia (zirconia), Yttria (yttria, yttrium trioxide), titanium oxide (titania, titanium dioxide) and the like.

In addition, as the organic polymer compound, resins having insulating properties, such as polyimide, polyether, polyacrylate, polyamine compound, etc., are preferably used.

The thickness of the insulating film is preferably 1 nm or more and 100 nm or less, more preferably 5 nm or more and 50 nm or less, in order to sufficiently improve the insulating properties of the surfaces of the AgSn alloy fine particles.

The insulating film can be easily formed using a surface modification technique or a surface coating technique. In particular, the use of alkoxides such as tetraethoxysilane and aluminum triethoxide is preferable because an insulating film with a uniform thickness can be formed at a relatively low temperature.

As the black pigment, the above-mentioned perylene-based pigments, lactam-based pigments, and AgSn alloy fine particles may be used alone or in combination.

In addition, the black pigment may contain pigments of hues such as red, blue, green, and yellow for the purpose of adjusting the color tone or the like. Colorants of hues other than black pigments can be appropriately selected from known colorants. For example, the above-mentioned various pigments can be used as pigments of hues other than black pigments. It is preferable that the usage-amount of the pigment|dye of the hue other than a black pigment is 15 mass % or less with respect to the total mass of a black pigment, and it is more preferable that it is 10 mass % or less.

A black composition containing two or more black or chromatic pigments and/or dyes in combination can be used together with or instead of the black pigment described above.

The content of carbon black in the black composition is preferably 3% by mass or less. By using the black composition whose content of carbon black is 3 mass % or less, it becomes easy to suppress generation|occurence|production of the float after image development, and image development residue.

The content of carbon black in the black composition is more preferably 2 mass % or less, still more preferably 1 mass % or less, and particularly preferably 0 mass %.

The hue of the pigment and dye contained in the black composition is not particularly limited. The black composition may contain black pigments and/or dyes. The black composition may be a combination of various black colorants. In this case, as the black colorant, for example, perylene black, nigrosine, black azo compounds, and the like can be used.

In the black composition, two or more pigments and/or dyes of hues other than black may be combined and blended so that the composition exhibits black.

From the viewpoints that the hue of black can be finely adjusted, and the occurrence of floating matter and development residues after development can be easily suppressed, the black composition is more preferable than a colorant composed of a single colorant. A combination of multiple colored colorants.

The black composition is preferably a combination of two or more organic pigments selected from, for example, five organic pigments of blue, violet, yellow, red, and orange.

By combining organic pigments of two or more colors from the organic pigments of the above-mentioned five colors, it is possible to express a hue similar to blackening. The term "pseudo black" here is ideally chromatic black, but it may be a hue acceptable for the application of the black film formed using the black composition.

The ratio (mass ratio) of the organic pigments of the respective hues in the black composition that appears to be black is preferably (blue organic pigment)/(yellow organic pigment+orange organic pigment)/(red organic pigment+purple organic pigment) organic pigment)=(30 mass % or more and 60 mass % or less)/(0 mass % or more and 50 mass % or less)/(5 mass % or more and 70 mass % or less).

As the organic pigments of the above-mentioned five colors, known organic pigments that have been conventionally used can be used.

The blue organic pigments include C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:6, and C.I. Pigment Blue 60.

Examples of the purple organic pigment include C.I. Pigment Violet 19 and C.I. Pigment Violet 23.

Examples of yellow organic pigments include C.I. Pigment Yellow 83, C.I. Pigment Yellow 110, C.I. Pigment Yellow 128, C.I. Pigment Yellow 138, C.I. Pigment Yellow 139, C.I. Pigment Yellow 150, C.I. Pigment Yellow 151, C.I. Pigment Yellow 154, C.I. Pigment Yellow 155, C.I. Pigment Yellow 180, and C.I. Pigment Yellow 181.

Examples of the orange organic pigments include C.I. Pigment Orange 38, C.I. Pigment Orange 43, C.I. Pigment Orange 64, C.I. Pigment Orange 69, C.I. Pigment Orange 71, and C.I. Pigment Orange 73.

Examples of red organic pigments include C.I. Pigment Red 122, C.I. Pigment Red 166, C.I. Pigment Red 177, C.I. Pigment Red 179, C.I. Pigment Red 242, C.I. Pigment Red 224, C.I. Pigment Red 254, C.I. Pigment Red 256, C.I. Pigment Red 264, and C.I. Pigment Red 272.

Wherein, preferably, the blue organic pigment is at least one selected from the group consisting of C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, and C.I. Pigment Blue 15:6, and the purple organic pigment is C.I. Pigment Violet 23 , the yellow organic pigment is C.I. Pigment Yellow 83 and/or C.I. Pigment Yellow 139, the orange organic pigment is C.I. Pigment Orange 43 and/or C.I. Pigment Orange 64, and the red organic pigment is C.I. Pigment Red 254 and/or C.I. Pigment Red 256.

By using these organic pigments in combination, it becomes easy to form a black cured film which exhibits a favorable black hue and is excellent in optical density (OD value).

In order to obtain a black composition like black, at least one selected from the group consisting of blue organic pigments, yellow organic pigments, and orange organic pigments is preferably combined, and it is more preferable to further combine these organic pigments with red organic pigments A combination of at least one organic pigment in a pigment and a purple organic pigment.

As a combination of pigments belonging to specific organic pigments of various colors, for example, preferably

Combination of C.I. Pigment Blue 15:4, C.I. Pigment Yellow 139 and C.I. Pigment Red 254;

Combination of C.I. Pigment Blue 15:6, C.I. Pigment Orange 64 and C.I. Pigment Violet 23;

a combination of C.I. Pigment Blue 15:4 or 15:3, with C.I. Pigment Yellow 83, with C.I. Pigment Violet 23 and C.I. Pigment Red 254; and

· C.I. Pigment Blue 15:6, a combination of C.I. Pigment Violet 23 and C.I. Pigment Red 256; etc.

In order to disperse the said coloring agent (E) uniformly in a photosensitive resin composition, a dispersing agent can be used further. As such a dispersant, polyethyleneimine-based, urethane resin-based, and acrylic resin-based polymer dispersants are preferably used. In particular, when carbon black is used as the colorant (E), it is preferable to use an acrylic resin-based dispersant as the dispersant.

In addition, the corrosive gas by a dispersing agent may generate|occur|produce from a cured film. Therefore, dispersing the pigment without using a dispersant is also an example of a preferable form.

In addition, a pigment and a dye can be used in combination in the photosensitive resin composition. The dye may be appropriately selected from known materials.

Examples of dyes applicable to the photosensitive resin composition include azo dyes, metal complex salt azo dyes, anthraquinone dyes, triphenylmethane dyes, xanthene dyes, cyanine dyes, naphthoquinone dyes, Quinoneimine dyes, methine dyes, phthalocyanine dyes, and the like.

In addition, these dyes can be used as colorants (E) by being laked (salified) and dispersed in an organic solvent or the like.

In addition to these dyes, for example, JP 2013-225132 A, JP 2014-178477 A, JP 2013-137543 A, JP 2011-38085 A, JP 2011-38085 A can also be preferably used. Dyes and the like described in Gazette No. 2014-197206 and the like.

About the usage-amount of the coloring agent (E) in the photosensitive resin composition, it can select suitably in the range which does not inhibit the objective of this invention. Typically, the usage-amount of the colorant (E) is preferably 2 mass % or more and 75 mass % or less, more preferably 3 mass % or more and 70 mass % with respect to the mass of the entire solid content of the photosensitive resin composition. the following.

In particular, when forming a black matrix using the photosensitive resin composition, it is preferable to adjust the amount of the light-shielding agent (E1) in the photosensitive resin composition so that the OD value per 1 μm of the black matrix film becomes 4 or more. When the OD value per 1 μm of the film in the black matrix is 4 or more, when used for a black matrix of a liquid crystal display, a sufficient display contrast can be obtained.

When a pigment is used as the colorant (E), it is preferable to add the pigment to the photosensitive resin composition by dispersing the pigment at an appropriate concentration in the presence or absence of a dispersant to prepare a dispersion liquid.

In addition, in this specification, the usage-amount of the said pigment can be defined as the value which also includes the dispersing agent which exists.

<imidazole generator (F)>

The photosensitive resin composition may contain an imidazole generator (F) that generates an imidazole compound represented by the following formula (F1) by exposure to light. When the photosensitive resin composition contains the imidazole generator (F), it becomes easy to cure the photosensitive resin composition favorably by exposure, and it becomes easy to form a patterned cured film having a favorable cross-sectional shape.

[Chemical formula 39]

In formula (F1), R ^f1 , R ^f2 , and R ^f3 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid group A salt/ester group, a phosphino group, a phosphinyl group, a phosphonate/ester group, or an organic group.

In the imidazole compound represented by the formula (F1), examples of the organic groups of R ^f1 , R ^f2 , and R ^f3 include an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, and an aralkyl group Wait. The organic group may contain a bond other than a hydrocarbon group such as a hetero atom or a substituent. In addition, the organic group may be linear, branched, or cyclic. This organic group is usually monovalent, and may be a divalent or more organic group when a cyclic structure is formed, for example.

R ^f1 and R ^f2 may be bonded to form a cyclic structure, or may further include a bond of a heteroatom. As a cyclic structure, a heterocycloalkyl group, a heteroaryl group, etc. are mentioned, and a condensed ring may be sufficient.

The bonds contained in the organic groups of R ^f1 , R ^f2 , and R ^f3 are not particularly limited as long as the effects of the present invention are not hindered, and the organic groups may contain hetero atoms such as oxygen atoms, nitrogen atoms, and silicon atoms. key. Specific examples of the heteroatom-containing bond include an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amide bond, a urethane bond, an imino bond (-N=C(- R)-, -C(=NR)-: R represents a hydrogen atom or a monovalent organic group), a carbonate bond, a sulfonyl bond, a sulfinyl bond, an azo bond, and the like.

When the organic group as R ^f1 , R ^f2 , and R ^f3 is a substituent other than a hydrocarbon group, R ^f1 , R ^f2 , and R ^f3 are not particularly limited as long as they do not inhibit the effects of the present invention. Specific examples of R ^f1 , R ^f2 , and R ^f3 include a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a cyano group, an isocyano group, a cyanate group, an isocyanate group, a thiocyanate group, an isocyanato group Thiocyanate, silyl, silanol, alkoxy, alkoxycarbonyl, carbamoyl, thiocarbamoyl, nitro, nitroso, carboxylate/ester, acyl, acyl Oxy, sulfinyl, sulfonate/ester, phosphine, phosphinyl, phosphonate/ester, alkyl ether, alkenyl ether, alkyl sulfide, alkenyl sulfide group, aryl ether group, and aryl sulfide group, etc. The hydrogen atom contained in the above-mentioned substituent may be substituted with a hydrocarbon group. Moreover, the hydrocarbon group contained in the said substituent may be any of linear, branched, and cyclic.

R ^f1 , R ^f2 , and R ^f3 are preferably a hydrogen atom, an alkyl group having 1 or more and 12 or less carbon atoms, an aryl group having 6 or more and 12 or less carbon atoms, and 1 or more and 12 or less carbon atoms. alkoxy group and halogen atom, more preferably hydrogen atom.

The imidazole generator (F) is not particularly limited as long as it is a compound capable of generating the imidazole compound represented by the formula (F1) by exposure.

As the imidazole generator (F), for example, in a known photosensitive amine generator, a group derived from an amine generated by the amine generator can be used and a group derived from an imidazole compound represented by the formula (F1) can be used. compound of.

The compound represented by following formula (F1-1) is mentioned as a preferable imidazole generator (F) from the viewpoint of compatibility with the component contained in the photosensitive resin composition.

[Chemical formula 40]

In formula (F1-1), R ^f1 , R ^f2 , and R ^f3 are the same as those of formula (F1).

R ^f11 and R ^f12 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfinyl group, a sulfo group, and a sulfonate/ester group, phosphino group, phosphinyl group, phosphono group, phosphonate group, or organic group. R ^f13 , Rf ¹⁴ , R ^f13 , R ^f16 , and R ^f17 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group, a nitroso group, and a sulfinyl group group, sulfo group, sulfonate/ester group, phosphino group, phosphinyl group, phosphono group, phosphonate/ester group, amino group, ammonium group, or organic group. As for R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 , two or more of them may be bonded to form a cyclic structure, or a bond of a heteroatom may be included.

As the organic group of R ^f11 and R ^f12 , the organic groups exemplified for R ^f1 , R ^f2 , and R ^f3 in the formula (F1) can be mentioned. As in the case of R ^f1 , R ^f2 , and R ^f3 , as the organic groups of R ^f11 and R ^f12 , a hetero atom may be included in the organic group. In addition, the organic group may be linear, branched, or cyclic.

Among the above, as R ^f11 and R ^f12 , each independently is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 13 carbon atoms, and 4 carbon atoms. Cycloalkenyl having 13 or more carbon atoms, aryloxyalkyl group having 7 to 16 carbon atoms, aralkyl group having 7 to 20 carbon atoms, cyano group having 2 to 11 carbon atoms The following alkyl groups, alkyl groups having a hydroxyl group with 1 to 10 carbon atoms, alkoxy groups with 1 to 10 carbon atoms, amide groups with 2 to 11 carbon atoms, carbon atoms Alkylthio group having 1 or more and 10 or less, acyl group having 1 or more and 10 or less carbon atoms, ester group having 2 or more and 11 or less carbon atoms (-COOR, -OCOR: R represents a hydrocarbon group), carbon Aryl group with 6 or more and 20 or less atoms, aryl group with 6 or more and 20 carbon atoms substituted with electron donating group and/or electron withdrawing group, substituted with electron donating group and/or electron withdrawing group group benzyl, cyano, methylthio. More preferably, both R ^f11 and R ^f12 are hydrogen atoms, or R ^f11 is a methyl group and R ^f12 is a hydrogen atom.

In formula (F1-1), R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group group, nitroso group, sulfinyl group, sulfo group, sulfonate group, phosphine group, phosphinyl group, phosphono group, phosphonate group, amino group, ammonium group, or organic group.

As the organic group of R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 , the organic groups exemplified for R ^f1 , R ^f2 , and R ^f3 in the formula (F1) are exemplified. As for the organic groups of R ^f13 , Rf ¹⁴ , R ^f15 , R ^f16 , and R ^f17 , as in the case of R ^f1 , R ^f2 , and R ^f3 , a hetero atom may be included in the organic group. In addition, the organic group may be linear, branched, or cyclic.

As for R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 , two or more of them may be bonded to form a cyclic structure, or a bond of a heteroatom may be included. As a cyclic structure, a heterocycloalkyl group, a heteroaryl group, etc. are mentioned, and a condensed ring may be sufficient. For example, for R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 , two or more of them may be bonded, and a benzene ring is shared (R ^f13 , R ^f14 , R ^f15 , and R ^f16 are bonded to each other). , and R ^f17 ) atoms to form fused rings such as naphthalene, anthracene, phenanthrene, and indene.

Among the above, as R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 , each independently preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and 4 to 13 carbon atoms. cycloalkyl group, cycloalkenyl group with 4 to 13 carbon atoms, aryloxyalkyl group with 7 to 16 carbon atoms, aralkyl group with 7 to 20 carbon atoms, cyano group An alkyl group having 2 or more and 11 or less carbon atoms, an alkyl group having a hydroxyl group having 1 or more and 10 or less carbon atoms, an alkoxy group having 1 or more and 10 or less carbon atoms, and 2 carbon atoms An amide group having 11 or more and 11 or less carbon atoms, an alkylthio group having 1 or more and 10 or less carbon atoms, an acyl group having 1 or more and 10 or less carbon atoms, an ester group having 2 or more and 11 or less carbon atoms, and carbon atoms Aryl group having 6 or more and 20 or less, aryl group substituted with electron donating group and/or electron withdrawing group and having 6 or more and 20 carbon atoms, substituted with electron donating group and/or electron withdrawing group group of benzyl, cyano, methylthio, nitro.

In addition, as R ^f13 , R ^f14 , R ^f15 , R ^f16 , and R ^f17 , it is also preferable that two or more of them are bonded and share a benzene ring (which is bonded to R ^f13 , Rf ¹⁴ , R f17 , R f13 and R f17 ). ^f15 , R ^f16 , and R ^f17 ) atoms to form fused rings such as naphthalene, anthracene, phenanthrene, and indene.

Among the compounds represented by the above formula (F1-1), the compounds represented by the following formula (F1-1-1) are preferable.

[Chemical formula 41]

In formula (F1-1-1), R ^f1 , R ^f2 , and R ^f3 are the same as those of formula (F1). R ^f11 to R ^f16 are the same as formula (F1-1). R ^f18 represents a hydrogen atom or an organic group. In formula (F1-1-1), R ^f13 and R ^f14 are not hydroxyl groups. As for R ^f13 , R ^f14 , R ^f15 , and R ^f16 , two or more of them may be bonded to form a cyclic structure, or a bond of a hetero atom may be included.

Since the compound represented by formula (F1-1-1) has a substituent -OR ^f18 , it is particularly excellent in affinity with each component contained in the photosensitive resin composition.

In formula (F1-1-1), R ^f18 is a hydrogen atom or an organic group. When R ^f18 is an organic group, examples of the organic group include those exemplified for R ^f1 , R ^f2 , and R ^f3 in the formula (F1). In the case of the organic group, heteroatoms may be contained in the organic group. In addition, the organic group may be linear, branched, or cyclic. As R ^f18 , a hydrogen atom or an alkyl group having 1 or more and 12 or less carbon atoms is preferable, and a methyl group is more preferable.

Specific examples of particularly preferred compounds are shown below as the compound represented by the formula (F1-1).

[Chemical formula 42]

The compound represented by the following formula (F1-2) is also preferable as the imidazole generator (F).

[Chemical formula 43]

In formula (F1-2), R ^f1 , R ^f2 , and R ^f3 are the same as those of formula (F1). R ^f21 is a hydrogen atom or a monovalent organic group. R ^f22 is an aromatic group which may have a substituent. R ^f21 may bond with another R ^f21 or R ^f22 to form a cyclic structure.

In formula (F1-2), R ^f21 is a hydrogen atom or a monovalent organic group. The monovalent organic group is not particularly limited, and may be, for example, an optionally substituted alkyl group, an optionally substituted aromatic group, or the like. When R ^f21 is an alkyl group, the alkyl group may have an ester bond or the like in the chain.

As the alkyl group, for example, R ^f24 and the like in the formula (F1-2-1) described later may be the same. The number of carbon atoms of the alkyl group is preferably 1 or more and 40 or less, more preferably 1 or more and 30 or less, particularly preferably 1 or more and 20 or less, and most preferably 1 or more and 10 or less.

As a substituent which this alkyl group may have, for example, it may be the same as a substituent which the alkylene group of R ^f25 in the formula (F1-2-1) mentioned later may have.

As an aromatic group which may have a substituent, like R ^f22 in formula (F1-2-1) mentioned later, an aryl group is preferable, and a phenyl group is more preferable. The aromatic group which may have a substituent as R ^f21 may be the same as or different from R ^f22 .

In the formula (F1-2), preferably one R ^f21 is a hydrogen atom, more preferably one R ^f21 is a hydrogen atom and the other R ^f21 is an optionally substituted alkyl group or an optionally substituted aromatic group.

In formula (F1-2), R ^f21 may bond with another R ^f21 or R ^f22 to form a cyclic structure. For example, when at least one R ^f21 is an alkyl group which may have a substituent, R ^f21 may be bonded to another R ^f21 or R ^f22 to form a cyclic structure.

The compound represented by the formula (F1-2) may be a compound represented by the following formula (F1-2-1).

[Chemical formula 44]

In formula (F1-2-1), R ^f1 , R ^f2 , and R ^f3 are the same as those of formula (F1). R ^f23 is a hydrogen atom or an alkyl group. R ^f22 is an aromatic group which may have a substituent. R ^f24 is an alkylene group which may have a substituent. R ^f24 may bond with R ^f22 to form a cyclic structure.

In formula ( ^F1-2-1 ), R f23 is a hydrogen atom or an alkyl group. When R ^f23 is an alkyl group, the alkyl group may be a straight-chain alkyl group or a branched-chain alkyl group. The number of carbon atoms of the alkyl group is not particularly limited, but is preferably 1 or more and 20 or less, preferably 1 or more and 10 or less, and more preferably 1 or more and 5 or less.

Specific examples of the preferred alkyl group for R ^f23 include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopropyl Amyl, tert-amyl, n-hexyl, n-heptyl, n-octyl, 2-ethyl-n-hexyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl , n-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, and n-eicosyl.

In formula (F1-2-1), R ^f22 is an aromatic group which may have a substituent. The aromatic group which may have a substituent may be an aromatic hydrocarbon group which may have a substituent, or an aromatic heterocyclic group which may have a substituent.

The kind of the aromatic hydrocarbon group is not particularly limited as long as it does not hinder the purpose of the present invention. The aromatic hydrocarbon group may be a monocyclic aromatic group, a group formed by condensation of two or more aromatic hydrocarbon groups, or a group formed by bonding two or more aromatic hydrocarbon groups through a single bond . As the aromatic hydrocarbon group, a phenyl group, a naphthyl group, a biphenyl group, an anthracenyl group, and a phenanthryl group are preferable.

The kind of the aromatic heterocyclic group is not particularly limited as long as it does not hinder the purpose of the present invention. The aromatic heterocyclic group may be a monocyclic group or a polycyclic group. As the aromatic heterocyclic group, pyridyl, furyl, thienyl, imidazolyl, pyrazolyl, oxazolyl, thiazolyl, isoxazolyl, isothiazolyl, benzoxazolyl, and benzothiazolyl are preferred , and benzimidazolyl.

Examples of substituents that a phenyl group, a polycyclic aromatic hydrocarbon group, or an aromatic heterocyclic group may have include a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group, and a nitroso group. , sulfinyl, sulfo, sulfonate, phosphine, phosphinyl, phosphono, phosphonate, amino, ammonium, and organic groups. When a phenyl group, a polycyclic aromatic hydrocarbon group, or an aromatic heterocyclic group has a plurality of substituents, the plurality of substituents may be the same or different.

When the substituent which an aromatic group has is an organic group, an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, an aralkyl group, etc. are mentioned as this organic group. The organic group may contain a bond other than a hydrocarbon group such as a hetero atom or a substituent in the organic group. In addition, the organic group may be any of linear, branched, cyclic, and combinations of these structures. This organic group is usually monovalent, and when it forms a cyclic structure, it may become a divalent or more organic group.

When the aromatic group has a substituent on adjacent carbon atoms, two substituents bonded to adjacent carbon atoms may be bonded to form a cyclic structure. Examples of the cyclic structure include aliphatic hydrocarbon rings and heteroatom-containing aliphatic rings.

When the substituent of the aromatic group is an organic group, the bond contained in the organic group is not particularly limited as long as the effect of the present invention is not hindered, and the organic group may contain an oxygen atom, a nitrogen atom, a silicon atom, or the like. Heteroatom bonds. Specific examples of the heteroatom-containing bond include an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amide bond, a urethane bond, an imino bond (-N=C(- R)-, -C(=NR)-: R represents a hydrogen atom or an organic group), a carbonate bond, a sulfonyl bond, a sulfinyl bond, an azo bond, and the like.

When the organic group is a substituent other than a hydrocarbon group, the kind of the substituent other than the hydrocarbon group may be in a range that does not inhibit the purpose of the present invention, and is not particularly limited. Specific examples of the substituents other than the hydrocarbon group include a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a cyano group, an isocyano group, a cyanate group, an isocyanate group, a thiocyanate group, and an isothiocyanate group. group, silyl group, silanol group, alkoxy group, alkoxycarbonyl group, amino group, monoalkylamino group, dialkylaluminum group, monoarylamino group, diarylamino group, carbamoyl group, thiocarbamoyl group Acyl, nitro, nitroso, carboxylate/ester, acyl, acyloxy, sulfinyl, sulfonate/ester, phosphino, phosphinyl, phosphonate/ester, alkyl ether group, alkenyl ether group, alkyl sulfide group, alkenyl sulfide group, aryl ether group, aryl sulfide group and the like. The hydrogen atom contained in the above-mentioned substituent may be substituted with a hydrocarbon group. Moreover, the hydrocarbon group contained in the said substituent may be any of linear, branched, and cyclic.

The substituent of the phenyl group, the polycyclic aromatic hydrocarbon group, or the aromatic heterocyclic group is preferably an alkyl group having 1 or more and 12 or less carbon atoms, an aryl group having 1 or more and 12 or less carbon atoms, and a carbon An alkoxy group having 1 or more and 12 or less atoms, an aryloxy group having 1 or more and 12 or less carbon atoms, an arylamino group having 1 or more and 12 or less carbon atoms, and a halogen atom.

As R ^f22 , the imidazole compound represented by the formula (F1-2) or the formula (F1-2-1) can be synthesized cheaply and easily, and the solubility of the imidazole compound in water and organic solvents is good, and each of them is preferably Substituted phenyl, furyl, and thienyl groups.

In formula (F1-2-1), R ^f24 is an alkylene group which may have a substituent. The substituent which the alkylene group may have is not particularly limited as long as it does not inhibit the object of the present invention. As a specific example of the substituent which an alkylene group may have, a hydroxyl group, an alkoxy group, an amino group, a cyano group, a halogen atom, etc. are mentioned. The alkylene group may be a straight-chain alkylene group or a branched-chain alkylene group, and a straight-chain alkylene group is preferred. The number of carbon atoms of the alkylene group is not particularly limited, but is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and particularly preferably 1 or more and 5 or less. In addition, the carbon atom number of an alkylene group does not include the carbon atom of the substituent couple|bonded with an alkylene group.

The alkoxy group as the substituent bonded to the alkylene group may be a straight-chain alkoxy group or a branched-chain alkoxy group. The number of carbon atoms of the alkoxy group as a substituent is not particularly limited, but is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and particularly preferably 1 or more and 3 or less.

The amino group as the substituent bonded to the alkylene group may be a monoalkylamino group or a dialkylamino group. The alkyl group contained in the monoalkylamino group or the dialkylamino group may be a straight-chain alkyl group or a branched-chain alkyl group. The number of carbon atoms of the alkyl group contained in the monoalkylamino group or the dialkylamino group is not particularly limited, but is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and particularly preferably 1 or more and 3 or less.

Specific examples of the alkylene group preferable as R ^f24 include methylene, ethane-1,2-diyl, n-propane-1,3-diyl, n-propane-2,2-diyl, n-Butane-1,4-diyl, n-pentane-1,5-diyl, n-hexane-1,6-diyl, n-heptane-1,7-diyl, n-octane-1,8 -diyl, n-nonane-1,9-diyl, n-decane-1,10-diyl, n-undecane-1,11-diyl, n-dodecane-1,12-diyl, n-tridecane-1,13-diyl, n-tetradecane-1,14-diyl, n-pentadecan-1,15-diyl, n-hexadecane-1,16-diyl, n-decane Heptane-1,17-diyl, n-octadecane-1,18-diyl, n-nonadecan-1,19-diyl, and n-eicosane-1,20-diyl.

Among the imidazole compounds represented by the above formula (F1-2), the compounds represented by the following formula (F1-2-2) are preferred from the viewpoint of being inexpensive and easily synthesizable.

[Chemical formula 45]

In formula (F1-2-2), R ^f1 , R ^f2 , and R ^f3 are the same as those in formula (F1). R ^f21 is the same as formula (F1-2), R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, and a silanol group, nitro, nitroso, sulfinyl, sulfo, sulfonate, phosphino, phosphinyl, phosphono, phosphonate, amino, ammonium, or organic. However, at least one of R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 is a group other than a hydrogen atom. At least two of R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 may be bonded to form a cyclic structure. R ^f21 can combine with R ^f27 to form a ring structure.

R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 are the same as the formula (F1-2-3) described later. In formula (F1-2-2), R ^f21 may combine with R ^f27 to form a cyclic structure. For example, when R ^f21 is an alkyl group which may have a substituent, R ^f21 may combine with R ^f27 to form a cyclic structure.

Among the imidazole compounds represented by the above formula (F1-2-1) or formula (F1-2-2), the following formulae are preferred in view of being inexpensive and easy to synthesize and having excellent solubility in water and organic solvents The compound represented by (F1-2-3) is more preferably a compound represented by the formula (F1-2-3) and R ^f24 is a methylene group.

[Chemical formula 46]

In formula (F1-2-3), R ^f1 , R ^f2 , and R ^f3 are the same as those of formula (F1). R ^{f23 and R f24 are} the same as formula (F1-2-1). R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group, a nitroso group, and a sulfinic acid group group, sulfo group, sulfonate/ester group, phosphino group, phosphinyl group, phosphono group, phosphonate/ester group, amino group, ammonium group, or organic group. However, at least one of R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 is a group other than a hydrogen atom. At least two of R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 may be bonded to form a cyclic structure. R ^f24 can combine with R ^f27 to form a ring structure.

When R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 are organic groups, the organic groups are the same as the organic groups that R ^f22 in formula (F1-2-1) has as a substituent. R ^f25 , R ^f26 , R ^f27 , and R ^f28 are preferably hydrogen atoms.

Among them, at least one of R ^f25 , R ^f26 , R ^f27 , R ^f28 , and R ^f29 is preferably the following substituent, and R ^f29 is particularly preferably the following substituent. When R ^f29 is the following substituent, it is preferable that R ^f25 , R ^f26 , R ^f27 , and R ^f28 are hydrogen atoms.

-OR ^f30

(R ^f30 is a hydrogen atom or an organic group.)

When R ^f30 is an organic group, the organic group is the same as the organic group that R ^f22 in the formula (F1-2-1) has as a substituent. R ^f30 is preferably an alkyl group, more preferably an alkyl group having 1 or more and 8 or less carbon atoms, particularly preferably an alkyl group having 1 or more and 3 or less carbon atoms, and most preferably a methyl group.

Among the compounds represented by the above formula (F1-2-3), the compounds represented by the following formula (F1-2-4) are preferable.

[Chemical formula 47]

In formula (F1-2-4), R ^f1 , R ^f2 , and R ^f3 are the same as those of formula (F1). R f23 is the same as formula ( ^F1-2-1 ). R ^f31 , R ^f32 , R ^f33 , R ^f34 , and R ^f35 are each independently a hydrogen atom, a hydroxyl group, a mercapto group, a thioether group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfinyl group, a sulfonic group group, sulfonate/ester group, phosphino group, phosphinyl group, phosphono group, phosphonate/ester group, amino group, ammonium group, or organic group. However, at least one of R ^f31 , R ^f32 , R ^f33 , R ^f34 , and R ^f35 is a group other than a hydrogen atom.

Among the compounds represented by the formula (F1-2-4), at least one of R ^f31 , R ^f32 , R ^f33 , R ^f34 , and R ^f35 is preferably a group represented by the above-mentioned -OR ^f30 , and it is particularly preferable that R ^f35 is A group represented by -OR ^f30 . When R ^f35 is a group represented by -OR ^f30 , R ^f32 , R ^f33 , R ^f34 , and R ^f35 are preferably hydrogen atoms.

Preferred specific examples of the imidazole compound represented by formula (F1-2) or formula (F1-2-1) include the following compounds.

[Chemical formula 48]

Content of the imidazole generator (F) in the photosensitive resin composition should just be the range which does not inhibit the objective of this invention, and is not specifically limited. Typically, the content of the imidazole generator (F) is preferably 0.01 parts by mass or more and 2.5 parts by mass or less, relative to 100 parts by mass of the total amount of the alkali-soluble resin (A) and the photopolymerizable monomer (B). Preferably it is 0.01-0.5 mass part. When content of the imidazole generator (F) in the photosensitive resin composition is in the said range, it becomes easy to form the patterned cured film of a favorable cross-sectional shape.

<Sensitizer (G)>

The photosensitive resin composition may contain a sensitizer (G) together with the above-mentioned photopolymerization initiator. By containing the sensitizer (G), the photosensitive resin composition can be cured favorably even when a light source with low irradiation energy such as LED exposure is used.

As the sensitizer (G), a compound conventionally used for the purpose of sensitizing a photopolymerization initiator in a photosensitive resin composition can be used without any limitation.

As a sensitizer (G), the compound which has one or more types chosen from the group which consists of an alkoxy group, a substituted carbonyloxy group, and an oxo group (=O) as a substituent is preferable. As the compound having this substituent, a condensed polycyclic aromatic hydrocarbon compound or a condensed polycyclic aromatic heterocyclic compound is preferable.

The condensed polycyclic aromatic hydrocarbon compound or the condensed polycyclic aromatic heterocyclic compound may have a substituent other than an alkoxy group, a substituted carbonyloxy group, and an oxo group (=O). Examples of the substituent include an alkyl group having 1 or more and 20 or less carbon atoms, a haloalkyl group having 1 or more and 20 or less carbon atoms, and an alkoxyalkane having 2 or more and 20 or less carbon atoms. group, aliphatic acyl group having 2 or more and 20 or less carbon atoms, aromatic acyl group (aroyl group) having 7 or more and 11 or less carbon atoms, cyano group, nitro group, nitroso group, halogen atom, hydroxyl group, and Thiol, etc.

The alkoxy group may be linear or branched. The number of carbon atoms of the alkoxy group is not particularly limited, but is preferably 1 or more and 20 or less, more preferably 1 or more and 12 or less, and particularly preferably 1 or more and 6 or less.

Preferable examples of the alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, n-pentoxy, n-hexyloxy oxy, n-heptyloxy, n-octyloxy, 2-ethylhexyl, n-nonyloxy, n-decyloxy and the like.

The substituted carbonyloxy group is a group represented by -O-CO-A ^g . A ^g is not particularly limited as long as the sensitizer (G) has a desired sensitizing effect, and may be various organic groups. As A, an alkyl group having 1 or more and 20 or less carbon atoms, an aryl group having 6 or more and 10 or less carbon atoms, an alkoxy group having 1 or more and 20 or less carbon atoms, or an alkoxy group having 6 or more carbon atoms is preferable and 10 or less aryloxy groups.

An aryl or aryloxy group may have one or more substituents. The kind of the substituent is not particularly limited as long as it does not hinder the purpose of the present invention. When the aryl group or the aryloxy group has a plurality of substituents, the plurality of substituents may be the same or different.

Preferable examples of the substituent include an alkyl group having 1 or more and 6 or less carbon atoms, an alkoxy group having 1 or more and 6 or less carbon atoms, and an aryloxy group having 6 or more and 10 or less carbon atoms. group, aryloxy group having 6 or more and 10 or less carbon atoms, aliphatic acyl group having 2 or more and 7 or less carbon atoms, aromatic acyl group (aroyl group) having 7 or more and 11 or less carbon atoms, cyano group, nitro group, nitroso group, halogen atom, hydroxyl group, and mercapto group, etc.

When A ^g is an alkyl group or an alkoxy group, these groups may be linear or branched.

Preferred examples of the alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, and n-octyl group. , and 2-ethylhexyl, etc.

Preferable examples of the aryl group include a phenyl group, an o-tolyl group, a m-tolyl group, a p-tolyl group, an α-naphthyl group, a β-naphthyl group, and the like.

Preferable examples of the alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, n-pentoxy, n-hexyloxy oxy, n-heptyloxy, n-octyloxy, 2-ethylhexyloxy and the like.

Condensed polycyclic aromatic hydrocarbon compound or condensed polycyclic aromatic heterocycle substituted with at least one selected from the group consisting of alkoxy, substituted carbonyloxy, and oxo (=O) In the compound, the number of rings constituting the condensed ring is not particularly limited as long as the desired sensitization effect can be obtained. The number of rings is preferably 2 or more, more preferably 3 or more, particularly preferably 3 or more and 6 or less, and most preferably 3 or 4.

It should be noted that the condensed polycyclic aromatic hydrocarbon compound or the condensed polycyclic aromatic heterocyclic compound only needs to have aromaticity, and the monocyclic ring forming the condensed polycycle need not necessarily be an aromatic ring.

Preferred examples of the condensed polycyclic ring contained in the condensed polycyclic aromatic hydrocarbon compound or the condensed polycyclic aromatic heterocyclic compound include an acenaphthene ring, a phenanthrene ring, an anthracene ring, and a tetracene ring. , xanthene ring, and thioxanthene ring. Among these rings, an anthracene ring, a naphthacene ring, and a thioxanthene ring are preferable.

Specific examples of the compound that contains an anthracene ring and can be suitably used as the sensitizer (G) include 9,10-bis(acetoxy)anthracene, 9,10-bis(propionyloxy)anthracene, 9,10-bis(n-propylcarbonyloxy)anthracene, 9,10-bis(isopropylcarbonyloxy)anthracene, 9,10-bis(n-butylcarbonyloxy)anthracene, 9,10-bis (isobutylcarbonyloxy)anthracene, 9,10-bis(n-pentylcarbonyloxy)anthracene, 9,10-bis(n-hexylcarbonyloxy)anthracene, 9,10-bis(n-heptylcarbonyloxy)anthracene base) anthracene, 9,10-bis(2-ethylhexanoyloxy)anthracene, 9,10-bis(n-octylcarbonyloxy)anthracene, 9,10-bis(n-nonylcarbonyloxy)anthracene , 9,10-bis(n-decylcarbonyloxy)anthracene, 9,10-bis(benzoyloxy)anthracene, 9,10-bis(4-methylbenzoyloxy)anthracene, 9, 10-bis(2-naphthoyloxy)anthracene, 2-methyl-9,10-bis(acetoxy)anthracene, 2-methyl-9,10-bis(propionyloxy)anthracene, 2 -Methyl-9,10-bis(n-propylcarbonyloxy)anthracene, 2-methyl-9,10-bis(isopropylcarbonyloxy)anthracene, 2-methyl-9,10-bis( n-Butylcarbonyloxy)anthracene, 2-methyl-9,10-bis(isobutylcarbonyloxy)anthracene, 2-methyl-9,10-bis(n-pentylcarbonyloxy)anthracene, 2 -Methyl-9,10-bis(n-hexylcarbonyloxy)anthracene, 2-methyl-9,10-bis(benzoyloxy)anthracene, 2-methyl-9,10-bis(4- Methylbenzoyloxy)anthracene, 2-methyl-9,10-bis(2-naphthoyloxy)anthracene, 1-methyl-9,10-bis(acetoxy)anthracene, 1- Methyl-9,10-bis(propionyloxy)anthracene, 1-methyl-9,10-bis(n-propylcarbonyloxy)anthracene, 1-methyl-9,10-bis(isopropyl) Carbonyloxy)anthracene, 1-methyl-9,10-bis(n-butylcarbonyloxy)anthracene, 1-methyl-9,10-bis(isobutylcarbonyloxy)anthracene, 1-methyl -9,10-bis(n-pentylcarbonyloxy)anthracene, 1-methyl-9,10-bis(n-hexylcarbonyloxy)anthracene, 1-methyl-9,10-bis(benzoyloxy) base) anthracene, 1-methyl-9,10-bis(4-methylbenzoyloxy)anthracene, 1-methyl-9,10-bis(2-naphthoyloxy)anthracene, 2- Ethyl-9,10-bis(acetoxy)anthracene, 2-ethyl-9,10-bis(propionyloxy)anthracene, 2-ethyl-9,10-bis(n-propylcarbonyloxy) ) anthracene, 2-ethyl-9,10-bis(isobutylcarbonyloxy)anthracene, 2-ethyl-9,10-bis(n-butylcarbonyloxy)anthracene, 2-ethyl-9, 10-Bis(isobutylcarbonyloxy)anthracene, 2-ethyl-9,10-bis(n-pentylcarbonyloxy)anthracene, 2-ethyl-9,10-bis(n-hexylcarbonyloxy) Anthracene, 2-ethyl-9,10-bis(benzoyloxy)anthracene, 2-ethyl-9,10-bis(4-ethyl-benzoyloxy)anthracene, 2-ethyl- 9, 10-bis(2-naphthoyloxy)anthracene, 1-ethyl-9,10-bis(acetoxy)anthracene, 1-ethyl-9,10-bis(propionyloxy)anthracene, 1 -Ethyl-9,10-bis(n-propylcarbonyloxy)anthracene, 1-ethyl-9,10-bis(isopropylcarbonyloxy)anthracene, 1-ethyl-9,10-bis( n-Butylcarbonyloxy)anthracene, 1-ethyl-9,10-bis(isobutylcarbonyloxy)anthracene, 1-ethyl-9,10-bis(n-pentylcarbonyloxy)anthracene, 1 -Ethyl-9,10-bis(n-hexylcarbonyloxy)anthracene, 1-ethyl-9,10-bis(benzoyloxy)anthracene, 1-ethyl-9,10-bis(4- Ethyl-benzoyloxy)anthracene, 1-ethyl-9,10-bis(2-naphthoyloxy)anthracene, 1-(tert-butyl)-9,10-bis(n-propylcarbonyl) Oxy)anthracene, 1-(tert-butyl)-9,10-bis(isopropylcarbonyloxy)anthracene, 1-(tert-butyl)-9,10-bis(n-butylcarbonyloxy)anthracene , 1-(tert-butyl)-9,10-bis(isobutylcarbonyloxy)anthracene, 1-(tert-butyl)-9,10-bis(n-pentylcarbonyloxy)anthracene, 1-( tert-butyl)-9,10-bis(n-hexylcarbonyloxy)anthracene, 1-(tert-butyl)-9,10-bis(benzoyloxy)anthracene, 1-(tert-butyl)-9 , 10-bis(4-(tert-butyl)-benzoyloxy)anthracene, 1-(tert-butyl)-9,10-bis(2-naphthoyloxy)anthracene, 2-(tert-butyl) base)-9,10-bis(n-propylcarbonyloxy)anthracene, 2-(tert-butyl)-9,10-bis(isopropylcarbonyloxy)anthracene, 2-(tert-butyl)-9 , 10-bis(n-butylcarbonyloxy)anthracene, 2-(tert-butyl)-9,10-bis(isobutylcarbonyloxy)anthracene, 2-(tert-butyl)-9,10-bis (n-pentylcarbonyloxy)anthracene, 2-(tert-butyl)-9,10-bis(n-hexylcarbonyloxy)anthracene, 2-(tert-butyl)-9,10-bis(benzoyloxy) base) anthracene, 2-(tert-butyl)-9,10-bis(4-(tert-butyl)-benzoyloxy)anthracene, 2-(tert-butyl)-9,10-bis(2- Naphthoyloxy)anthracene, 2-pentyl-9,10-bis(n-propylcarbonyloxy)anthracene, 2-pentyl-9,10-bis(isopropylcarbonyloxy)anthracene, 2- Amyl-9,10-bis(n-butylcarbonyloxy)anthracene, 2-pentyl-9,10-bis(isobutylcarbonyloxy)anthracene, 2-pentyl-9,10-bis(n-butylcarbonyloxy)anthracene Amylcarbonyloxy)anthracene, 2-pentyl-9,10-bis(n-hexylcarbonyloxy)anthracene, 2-pentyl-9,10-bis(benzoyloxy)anthracene, 2-pentyl -9,10-bis(4-(tert-butyl)-benzoyloxy)anthracene, 2-pentyl-9,10-bis(2-naphthoyloxy)anthracene, etc.

As the sensitizer (G), an anthracene compound substituted by a halogen atom is also preferred. As a halogen atom, a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom is mentioned.

Specific examples of compounds substituted by halogen atoms and preferably used as the sensitizer (G) include 2-chloro-9,10-bis(acetoxy)anthracene, 2-chloro-9,10-bis(propane) Acyloxy)anthracene, 2-chloro-9,10-bis(n-propylcarbonyloxy)anthracene, 2-chloro-9,10-bis(isopropylcarbonyloxy)anthracene, 2-chloro-9, 10-Bis(n-butylcarbonyloxy)anthracene, 2-chloro-9,10-bis(isobutylcarbonyloxy)anthracene, 2-chloro-9,10-bis(n-pentylcarbonyloxy)anthracene , 2-chloro-9,10-bis(n-hexylcarbonyloxy)anthracene, 2-chloro-9,10-bis(benzoyloxy)anthracene, 2-chloro-9,10-bis(4-methyl) benzoyloxy)anthracene, 2-chloro-9,10-bis(2-naphthoyloxy)anthracene, 1-chloro-9,10-bis(acetoxy)anthracene, 1-chloro-9 , 10-bis(propionyloxy)anthracene, 1-chloro-9,10-bis(n-propylcarbonyloxy)anthracene, 1-chloro-9,10-bis(isopropylcarbonyloxy)anthracene, 1-Chloro-9,10-bis(n-butylcarbonyloxy)anthracene, 1-chloro-9,10-bis(isobutylcarbonyloxy)anthracene, 1-chloro-9,10-bis(n-pentyloxy)anthracene ylcarbonyloxy)anthracene, 1-chloro-9,10-bis(n-hexylcarbonyloxy)anthracene, 1-chloro-9,10-bis(benzoyloxy)anthracene, 1-chloro-9,10 -Bis(4-methylbenzoyloxy)anthracene, 1-chloro-9,10-bis(2-naphthoyloxy)anthracene, 2-fluoro-9,10-bis(acetoxy)anthracene , 2-fluoro-9,10-bis(propionyloxy)anthracene, 2-fluoro-9,10-bis(n-propylcarbonyloxy)anthracene, 2-fluoro-9,10-bis(isopropyl) Carbonyloxy)anthracene, 2-fluoro-9,10-bis(n-butylcarbonyloxy)anthracene, 2-fluoro-9,10-bis(isobutylcarbonyloxy)anthracene, 2-fluoro-9, 10-bis(n-pentylcarbonyloxy)anthracene, 2-fluoro-9,10-bis(n-hexylcarbonyloxy)anthracene, 2-fluoro-9,10-bis(benzoyloxy)anthracene, 2 -Fluoro-9,10-bis(4-methylbenzoyloxy)anthracene, 2-fluoro-9,10-bis(2-naphthoyloxy)anthracene, 1-fluoro-9,10-bis (acetoxy)anthracene, 1-fluoro-9,10-bis(propionyloxy)anthracene, 1-fluoro-9,10-bis(n-propylcarbonyloxy)anthracene, 1-fluoro-9,10 - bis(isopropylcarbonyloxy)anthracene, 1-fluoro-9,10-bis(n-butylcarbonyloxy)anthracene, 1-fluoro-9,10-bis(isobutylcarbonyloxy)anthracene, 1-Fluoro-9,10-bis(n-pentylcarbonyloxy)anthracene, 1-fluoro-9,10-bis(n-hexylcarbonyloxy)anthracene, 1-fluoro-9,10-bis(benzoyl oxy)anthracene, 1-fluoro-9,10-bis(4-methylbenzoyloxy)anthracene, 1-fluoro-9,10-bis(2-naphthoyloxy)anthracene, 2-bromo -9,10-bis(acetoxy)anthracene, 2-bromo-9,10-bis(propionyloxy)anthracene, 2-bromo-9,10-bis(n-propylcarbonyloxy)anthracene, 2 -bromine -9,10-bis(isopropylcarbonyloxy)anthracene, 2-bromo-9,10-bis(n-butylcarbonyloxy)anthracene, 2-bromo-9,10-bis(isobutylcarbonyloxy)anthracene base) anthracene, 2-bromo-9,10-bis(n-pentylcarbonyloxy)anthracene, 2-bromo-9,10-bis(n-hexylcarbonyloxy)anthracene, 2-bromo-9,10-bis (benzoyloxy)anthracene, 2-bromo-9,10-bis(4-methylbenzoyloxy)anthracene, 2-bromo-9,10-bis(2-naphthoyloxy)anthracene , 1-bromo-9,10-bis(acetoxy)anthracene, 1-bromo-9,10-bis(propionyloxy)anthracene, 1-bromo-9,10-bis(n-propylcarbonyloxy) ) anthracene, 1-bromo-9,10-bis(isopropylcarbonyloxy)anthracene, 1-bromo-9,10-bis(n-butylcarbonyloxy)anthracene, 1-bromo-9,10-bis (Isobutylcarbonyloxy)anthracene, 1-bromo-9,10-bis(n-pentylcarbonyloxy)anthracene, 1-bromo-9,10-bis(n-hexylcarbonyloxy)anthracene, 1-bromo -9,10-bis(benzoyloxy)anthracene, 1-bromo-9,10-bis(4-methylbenzoyloxy)anthracene, and 1-bromo-9,10-bis(2- Naphthoyloxy) anthracene, etc.

As the sensitizer (G), an anthracene compound substituted by an alkoxy group is also preferred.

Specific examples of the anthracene compound substituted with an alkoxy group and preferably used as the sensitizer (G) include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, and 9,10-bis (n-propoxy)anthracene, 9,10-bis(n-butoxy)anthracene, 9,10-bis(n-pentoxy)anthracene, 9,10-bis(isoamyloxy)anthracene, 9, 10-bis(n-hexyloxy)anthracene, 9,10-bis(n-heptyloxy)anthracene, 9,10-bis(n-octyloxy)anthracene, 9,10-bis(2-ethylhexyloxy)anthracene base) anthracene, 9-methoxyanthracene, 9-ethoxyanthracene, 9-(n-propoxy)anthracene, 9-(n-butoxy)anthracene, 9-(n-pentoxy)anthracene, 9- (Isoamyloxy)anthracene, 9-(n-hexyloxy)anthracene, 9-(n-heptyloxy)anthracene, 9-(n-octyloxy)anthracene, 9-(2-ethylhexyloxy) ) anthracene, 2-methyl-9,10-dimethoxyanthracene, 2-methyl-9,10-diethoxyanthracene, 2-methyl-9,10-bis(n-propoxy)anthracene , 2-methyl-9,10-bis(n-butoxy)anthracene, 2-methyl-9,10-bis(n-pentoxy)anthracene, 2-methyl-9,10-bis(isoamyl) oxy)anthracene, 2-methyl-9,10-bis(n-hexyloxy)anthracene, 2-methyl-9,10-bis(n-heptyloxy)anthracene, 2-methyl-9,10 -Bis(n-octyloxy)anthracene, 2-methyl-9,10-bis(2-ethylhexyloxy)anthracene, 2-ethyl-9,10-dimethoxyanthracene, 2-ethyl base-9,10-diethoxyanthracene, 2-ethyl-9,10-bis(n-propoxy)anthracene, 2-ethyl-9,10-bis(n-butoxy)anthracene, 2- Ethyl-9,10-bis(n-pentyloxy)anthracene, 2-ethyl-9,10-bis(isoamyloxy)anthracene, 2-ethyl-9,10-bis(n-hexyloxy) Anthracene, 2-ethyl-9,10-bis(n-heptyloxy)anthracene, 2-ethyl-9,10-bis(n-octyloxy)anthracene, 2-ethyl-9,10-bis (2-ethylhexyloxy)anthracene, 2-methyl-9-methoxyanthracene, 2-methyl-9-ethoxyanthracene, 2-methyl-9-(n-propoxy)anthracene, 2-Methyl-9-(n-butoxy)anthracene, 2-methyl-9-(n-pentyloxy)anthracene, 2-methyl-9-(isoamyloxy)anthracene, 2-methyl -9-(n-hexyloxy)anthracene, 2-methyl-9-(n-heptyloxy)anthracene, 2-methyl-9-(n-octyloxy)anthracene, 2-methyl-9-( 2-ethylhexyloxy)anthracene, 2-ethyl-9-methoxyanthracene, 2-ethyl-9-ethoxyanthracene, 2-ethyl-9-(n-propoxy)anthracene, 2 -Ethyl-9-(n-butoxy)anthracene, 2-ethyl-9-(n-pentoxy)anthracene, 2-ethyl-9-(isoamyloxy)anthracene, 2-ethyl- 9-(n-hexyloxy)anthracene, 2-ethyl-9-(n-heptyloxy)anthracene, 2-ethyl-9-(n-octyloxy)anthracene, 2-ethyl-9-(2 -Ethylhexyloxy)anthracene, 2-chloro-9,10-dimethoxyanthracene, 2-chloro-9,10-diethoxyanthracene, 2-chloro-9,10-bis(n- Propoxy)anthracene, 2-chloro-9,10-bis(n-butoxy)anthracene, 2-chloro-9,10-bis(n-pentoxy)anthracene, 2-chloro-9,10-bis( Isopentyloxy)anthracene, 2-chloro-9,10-bis(n-hexyloxy)anthracene, 2-chloro-9,10-bis(n-heptyloxy)anthracene, 2-chloro-9,10- Bis(n-octyloxy)anthracene, 2-chloro-9,10-bis(2-ethylhexyloxy)anthracene, 2-bromo-9,10-dimethoxyanthracene, 2-bromo-9, 10-diethoxyanthracene, 2-bromo-9,10-bis(n-propoxy)anthracene, 2-bromo-9,10-bis(n-butoxy)anthracene, 2-bromo-9,10- Bis(n-pentyloxy)anthracene, 2-bromo-9,10-bis(isoamyloxy)anthracene, 2-bromo-9,10-bis(n-hexyloxy)anthracene, 2-bromo-9,10 -Bis(n-heptyloxy)anthracene, 2-bromo-9,10-bis(n-octyloxy)anthracene, 2-bromo-9,10-bis(2-ethylhexyloxy)anthracene, 2 -Chloro-9-methoxyanthracene, 2-chloro-9-ethoxyanthracene, 2-chloro-9-(n-propoxy)anthracene, 2-chloro-9-(n-butoxy)anthracene, 2 -Chloro-9-(n-pentyloxy)anthracene, 2-chloro-9-(isoamyloxy)anthracene, 2-chloro-9-(n-hexyloxy)anthracene, 2-chloro-9-(n-heptyloxy)anthracene oxy)anthracene, 2-chloro-9-(n-octyloxy)anthracene, 2-chloro-9-(2-ethylhexyloxy)anthracene, 2-bromo-9-methoxyanthracene, 2 -Bromo-9-ethoxyanthracene, 2-bromo-9-(n-propoxy)anthracene, 2-bromo-9-(n-butoxy)anthracene, 2-bromo-9-(n-pentoxy)anthracene Anthracene, 2-ethyl-9-(isoamyloxy)anthracene, 2-bromo-9-(n-hexyloxy)anthracene, 2-bromo-9-(n-heptyloxy)anthracene, 2-bromo- 9-(n-octyloxy)anthracene, 2-bromo-9-(2-ethylhexyloxy)anthracene, etc.

Among the anthracene compounds described above, 9,10-bis(acetoxy)anthracene, 9,10-bis(propionyloxy) are preferred from the viewpoint of ease of production and performance as a sensitizer (G). base) anthracene, 9,10-bis(n-propylcarbonyloxy)anthracene, 9,10-bis(isopropylcarbonyloxy)anthracene, 9,10-bis(n-butylcarbonyloxy)anthracene, 9 , 10-bis(isobutylcarbonyloxy)anthracene, 9,10-bis(n-hexanoyloxy)anthracene, 9,10-bis(n-heptanoyloxy)anthracene, 9,10-bis(n-octanoyl) oxy)anthracene, 9,10-bis(2-ethylhexanoyloxy)anthracene, 9,10-bis(n-nonanoyloxy)anthracene, 9,10-diethoxyanthracene, 9,10- Dipropoxyanthracene, and 9,10-dibutoxyanthracene.

Specific examples of the compound containing a naphthacene ring and which can be suitably used as the sensitizer (G) include:

2-Methyl-5,11-dioxo-6,12-bis(acetoxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(propionyloxy) ) tetracene, 2-methyl-5,11-dioxo-6,12-bis(n-propylcarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6, 12-bis(isopropylcarbonyloxy)tetracene, 2-methyl-5,11-dioxo-6,12-bis(n-butylcarbonyloxy)tetracene, 2-methyl- 5,11-dioxo-6,12-bis(isobutylcarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(n-pentylcarbonyloxy) ) tetracene, 2-methyl-5,11-dioxo-6,12-bis(n-hexylcarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12 -Bis(n-heptylcarbonyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(acetoxy)naphthacene, 2-ethyl-5,11- Dioxo-6,12-bis(propionyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(n-propylcarbonyloxy)tetracene, 2 -Ethyl-5,11-dioxo-6,12-bis(isopropylcarbonyloxy)naphthacene, 2-ethyl-5,11-dioxo-6,12-bis(n-butyl) carbonyloxy) tetracene, 2-methyl-5,11-dioxo-6,12-bis(isobutylcarbonyloxy)naphthacene, 2-ethyl-5,11-dioxo Substituted-6,12-bis(n-pentylcarbonyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(n-hexylcarbonyloxy)tetracene, and 2 -Ethyl-5,11-dioxo-6,12-bis(n-heptylcarbonyloxy)naphthacene and other tetracene compounds substituted by alkylcarbonyloxy groups;

2-Methyl-5,11-dioxo-6,12-bis(benzoyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(o-toluene) formyloxy) tetracene, 2-methyl-5,11-dioxo-6,12-bis(m-toluoyloxy)naphthacene, 2-methyl-5,11-dioxo Substituted-6,12-bis(p-toluoyloxy)tetracene, 2-methyl-5,11-dioxo-6,12-bis(α-naphthoyloxy)naphthacene, 2-Methyl-5,11-dioxo-6,12-bis(β-naphthoyloxy)naphthacene, 2-ethyl-5,11-dioxo-6,12-bis( Benzoyloxy) tetracene, 2-ethyl-5,11-dioxo-6,12-bis(o-toluoyloxy)tetracene, 2-ethyl-5,11-di Oxo-6,12-bis(m-toluoyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(p-toluoyloxy)tetracene, 2-Ethyl-5,11-dioxo-6,12-bis(α-naphthoyloxy)naphthacene, and 2-ethyl-5,11-dioxo-6,12-bis (β-naphthoyloxy) naphthacene compounds substituted by aroyloxy groups such as naphthacene;

2-Methyl-5,11-dioxo-6,12-bis(methoxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(ethyl) oxycarbonyloxy) tetracene, 2-methyl-5,11-dioxo-6,12-bis(n-propoxycarbonyloxy)naphthacene, 2-methyl-5,11- Dioxo-6,12-bis(isopropoxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(n-butoxycarbonyloxy)and Tetracene, 2-methyl-5,11-dioxo-6,12-bis(isobutyloxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6, 12-Bis(n-pentoxycarbonyloxy)tetracene, 2-methyl-5,11-dioxo-6,12-bis(n-hexyloxycarbonyloxy)tetracene, 2-methyl -5,11-dioxo-6,12-bis(n-heptyloxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(n-octyl) oxycarbonyloxy) tetracene, 2-ethyl-5,11-dioxo-6,12-bis(methoxycarbonyloxy)naphthacene, 2-ethyl-5,11-di Oxo-6,12-bis(ethoxycarbonyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(n-propoxycarbonyloxy)tetracene , 2-ethyl-5,11-dioxo-6,12-bis(isopropoxycarbonyloxy)naphthacene, 2-ethyl-5,11-dioxo-6,12-bis (n-Butoxycarbonyloxy)naphthalene, 2-ethyl-5,11-dioxo-6,12-bis(isobutyloxycarbonyloxy)naphthacene, 2-ethyl- 5,11-dioxo-6,12-bis(n-pentoxycarbonyloxy)naphthacene, 2-ethyl-5,11-dioxo-6,12-bis(n-hexyloxycarbonyloxy) base) tetracene, 2-ethyl-5,11-dioxo-6,12-bis(n-heptyloxycarbonyloxy)naphthacene, and 2-ethyl-5,11-dioxo Substituted-6,12-bis(n-octyloxycarbonyloxy)tetracene and other naphthacene compounds substituted by alkoxycarbonyloxy; and

2-Methyl-5,11-dioxo-6,12-bis(phenoxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(o- Tolyloxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(m-tolyloxycarbonyloxy)naphthacene, 2-methyl-5,11 -Dioxo-6,12-bis(p-tolyloxycarbonyloxy)naphthacene, 2-methyl-5,11-dioxo-6,12-bis(α-naphthyloxycarbonyloxy) base) tetracene, 2-methyl-5,11-dioxo-6,12-bis(β-naphthyloxycarbonyloxy)naphthacene, 2-ethyl-5,11-dioxo Substituted-6,12-bis(phenoxycarbonyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(o-tolyloxycarbonyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(m-tolyloxycarbonyloxy)naphthacene, 2-ethyl-5,11-dioxo-6,12-bis( p-Tolyloxycarbonyloxy)tetracene, 2-ethyl-5,11-dioxo-6,12-bis(α-naphthyloxycarbonyloxy)tetracene, and 2-ethyl -5,11-dioxo-6,12-bis(β-naphthyloxycarbonyloxy)naphthacene compound substituted by aryloxycarbonyloxy, such as tetracene.

Among the above-mentioned compounds containing a tetracene ring, 5,11-dioxo-6,12-bis(methoxycarbonyloxy)naphthacene, 5,11-dioxo-6,12-bis( Ethoxycarbonyloxy)naphthacene, 5,11-dioxo-6,12-bis(isopropoxycarbonyloxy)naphthacene, 5,11-dioxo-6,12-bis (isobutyloxycarbonyloxy)naphthacene, 5,11-dioxo-6,12-bis(n-butylcarbonyloxy)naphthacene, 5,11-dioxo-6,12 - bis(n-pentylcarbonyloxy)tetracene, 5,11-dioxo-6,12-bis(n-heptanoyloxy)tetracene.

Specific examples of the compound containing a thioxanthene ring that can be suitably used as the sensitizer (G) include thioxanthene-9-one, 2-methyl-9H-thioxanthene-9-one, 2-isoxanthene-9-one Propyl-9H-thioxanthene-9-one, 1,4-dimethylthioxanthene-9-one, and 3-methyl-9-oxo-9H-thioxanthene-2-yl acetate, etc.

The content of the sensitizer (G) is preferably 5 parts by mass or more and 60 parts by mass or less with respect to 100 parts by mass of the photopolymerization initiator (C) in the photosensitive resin composition, more preferably 15 parts by mass or more and 50 parts by mass or less. When the photosensitive resin composition contains a sensitizer within the above range, in particular, the curing reaction by exposure proceeds uniformly, and a patterned cured film with a particularly favorable edge angle is easily formed.

<Organic solvent (S)>

Typically, the photosensitive resin composition may contain an organic solvent (S) for the purpose of adjusting coatability or the like. Examples of the organic solvent (S) include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol n-propyl ether, ethylene glycol mono-n-butyl ether, and diethylene glycol monomethyl ether. base ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol Mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether and other (poly) alkylene glycol monoalkyl ethers; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether Ethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, etc. (poly ) alkylene glycol monoalkyl ether acetates; diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran and other ethers; methyl Ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone and other ketones; methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate and other lactic acid alkyl esters; 2-hydroxy-2-methyl Ethyl propionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethoxyacetic acid Ethyl ester, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutyrate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3- Methyl-3-methoxybutyl propionate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl formate, isoamyl acetate, propionic acid n-butyl, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, methyl acetoacetate, acetoacetate Ethyl ester, ethyl 2-oxobutyrate and other esters; Aromatic hydrocarbons such as toluene and xylene; N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylethyl acetate Amides such as amides, etc. These solvents may be used alone or in combination of two or more.

The usage-amount of an organic solvent (S) can be suitably determined according to the use of the photosensitive resin composition. As an example, the usage-amount of an organic solvent (S) is the quantity which the solid content concentration of the photosensitive resin composition becomes the range of 1 mass % or more and 50 mass % or less.

<Other ingredients>

In the photosensitive resin composition, if necessary, other various additives other than the above may be contained. Specifically, dispersing aids, fillers, fillers, adhesion promoters, antioxidants, ultraviolet absorbers, anti-agglomeration agents, thermal polymerization inhibitors, antifoaming agents, surfactants, and the like can be exemplified.

As a thermal polymerization inhibitor used for the photosensitive resin composition, hydroquinone, hydroquinone monoethyl ether, etc. are mentioned, for example. Moreover, as a defoaming agent, compounds, such as a silicone type and a fluorine type, can be illustrated, and as a surfactant, compounds, such as an anionic type, a cation type, and a nonionic type, can be illustrated, respectively.

<Preparation method of photosensitive resin composition>

The photosensitive resin composition is prepared by uniformly mixing each of the above-mentioned components in desired amounts. In addition, when the prepared photosensitive resin composition does not contain insoluble components, such as a pigment, it can filter using a filter to make the photosensitive resin composition uniform.

"Method for producing a patterned cured film"

A patterned cured film can be produced by using the photosensitive resin composition demonstrated above.

Typically, a patterned cured film can be produced by a method comprising:

The process of coating the above-mentioned photosensitive resin composition on a substrate to form a coating film;

The process of exposing the coating film,

wherein the coating film is patterned, or

Position-selective exposure is performed on the coating film, and then, development with respect to the exposed coating film is performed.

The substrate (substrate or support) can be selected according to various applications, for example, not particularly limited to quartz, glass, optical film, ceramic material, vapor deposition film, magnetic film, reflective film, metal substrates such as Ni, Cu, Cr, Fe, etc. , paper, SOG (Spin OnGlass), polyester film, polycarbonate film, polyimide film and other polymer substrates, TFT array substrates, PDP electrode plates, glass, transparent plastic substrates, ITO, metal and other conductive substrates materials, insulating substrates, silicon, silicon nitride, polysilicon, silicon oxide, amorphous silicon and other semiconductor substrates, etc. Moreover, for example, when a laminated structure is formed on a board|substrate, some layers which become a lower structure already formed on a board|substrate are also included in the concept as a base material suitable for the photosensitive resin composition. In addition, the shape of the base material is not particularly limited, either, and may be a plate shape or a roll shape. The substrate may have irregularities on the surface by various patterns, for example. In addition, as the above-mentioned base material, a light-transmitting or non-light-transmitting base material can be selected.

The method of forming the patterned coating film on the substrate is not particularly limited. In the case of forming a patterned coating film, the patterned coating film is typically formed by a printing method such as an ink jet method and a screen printing method.

In the case of forming a patterned coating film by a printing method, the viscosity of the photosensitive resin composition is preferably adjusted to an optimum viscosity corresponding to the selected printing method. As a method of adjusting the viscosity, dilution with an organic solvent (S), addition of a viscosity modifier, and the like are exemplified.

The thickness of the coating film is not particularly limited. The thickness of the coating film is preferably 0.05 μm or more, more preferably 1 μm or more, still more preferably 7 μm or more, and particularly preferably 10 μm or more. Although the upper limit of the thickness of a coating film is not specifically limited, For example, it is 50 micrometers or less, Preferably it is 20 micrometers or less.

Next, the coating film is dried as necessary. The drying method is not particularly limited. As a drying method, for example, (1) a method of drying for 60 seconds or more and 120 seconds or less using a hot plate at a temperature of 80°C or higher and 120°C or lower, preferably 90°C or higher and 100°C or lower; (2) A method of placing it at room temperature for several hours to several days; (3) A method of removing the solvent by placing it in a hot air heater or an infrared heater for tens of minutes to several hours; and so on.

A patterned cured film is formed by exposing the above-mentioned patterned coating film to light.

In exposure, the light source is not particularly limited, and examples thereof include high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, carbon arc lamps, and LEDs. ArF excimer laser, KrF excimer laser, F ₂ excimer laser, extreme ultraviolet (EUV), vacuum ultraviolet (VUV), electron beam, X-ray, soft X-ray, g-ray can be irradiated to the coating film using such a light source. The coating film is exposed to radiation such as , i-line, h-line, j-line, and k-line, or electromagnetic waves.

The exposure amount varies depending on the composition of the photosensitive resin composition, but for example, it is preferably 10 mJ/cm ² or more and 2000 mJ/cm ² or less, more preferably 100 mJ/cm ² or more and 1500 mJ/cm ² or less, and still more preferably 200 mJ/cm ² More than 1200mJ/cm ² or less. The exposure illuminance varies depending on the composition of the photosensitive resin composition, but it is preferably within a range of 1 mW/cm ² or more and 50 mW/cm ² or less.

The cured film cured by exposure may be heated. The temperature during heating is not particularly limited, but is preferably 180°C or higher and 280°C or lower, more preferably 200°C or higher and 260°C or lower, and particularly preferably 220°C or higher and 250°C or lower. The heating time is typically preferably 1 minute or more and 60 minutes or less, more preferably 10 minutes or more and 50 minutes or less, and particularly preferably 20 minutes or more and 40 minutes or less.

On the other hand, in the case of subjecting the coating film to position-selective exposure, an unpatterned coating film is formed on the surface of the substrate. Typically, the photosensitive resin composition is applied to the entire surface or substantially the entire surface of the substrate surface.

The coating method is not particularly limited. As a preferable coating method, a contact transfer type coating apparatus using a roll coater, a reverse coater, a bar coater, etc., a spinner (rotary coater), a dispenser, an ink jet, Methods for non-contact coating devices such as sprayers, screen printers, and curtain coaters.

Like the patterned coating film, the coating film formed in the above-described manner may be dried as necessary. The drying method is the same as that described for the patterned coating film.

With respect to the unpatterned coating film formed in the above-described manner, exposure is selectively performed through a negative mask having a light-transmitting portion having a shape corresponding to the pattern shape of the cured film.

The exposure method is the same as the exposure method for the patterned coating film described above, except that a negative mask is used.

Next, the exposed coating film is developed with a developing solution, thereby forming a patterned cured film. The development method is not particularly limited, and for example, a dipping method, a spray method, or the like can be used. Examples of the developer include organic developers such as monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts.

The patterned cured film obtained after development can be heated in the same manner as the method of exposing the above-mentioned patterned coating film.

"Methods of Forming a Dike"

The method of forming a bank using the photosensitive resin composition demonstrated above is not specifically limited. Banks are generally formed in the form of spacers dividing pixels in optical elements (color filters, organic EL display elements, quantum dot displays, and organic TFT arrays, etc.).

Therefore, in the method of forming the bank, the substrate corresponding to each optical element is selected. In addition, it is generally preferable that the bank is light-shielding. Therefore, as a photosensitive resin composition for bank formation, the photosensitive resin composition containing a light-shielding agent (E1) as a coloring agent (E) is preferable.

The formation method of a bank is the same as that of the manufacturing method of the patterned cured film mentioned above, except that the board|substrate corresponding to each optical element is selected. In this manner, banks are formed on the substrate for manufacturing the optical element, whereby the banked substrate for manufacturing the optical element can be manufactured.

"Manufacturing method of optical element"

Various optical elements were produced using the banked substrate for producing an optical element produced by the method described above. The method of manufacturing the optical element is not particularly limited. Preferably, after patterning the banks on the substrate by the above method, ink is injected into the regions surrounded by the banks on the substrate to form pixels, thereby manufacturing the optical element.

When the bank is formed using the photosensitive resin composition described above, the liquid repellency in the region surrounded by the bank can be suppressed. Therefore, the area surrounded by the bank can be sufficiently covered with the ink for forming the pixel. Thereby, for example, the problem of halation in the organic EL display element can be solved.

As the solvent used in forming the ink for forming the pixel, water, an organic solvent, and a mixed solvent thereof can be used. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Specific examples of the organic solvent include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, Methanol, ethanol, isopropanol, ethyl acetate, and butyl acetate, etc. In addition, surfactants, antioxidants, viscosity modifiers, ultraviolet absorbers and the like may be added to the ink.

As a method of injecting ink into the region surrounded by the banks, the ink jet method is preferable because a small amount of ink can be easily injected into a predetermined portion. The ink used for the formation of the pixel can be appropriately selected according to the type of the optical element to be manufactured. When the ink is injected by the ink jet method, the viscosity of the ink is not particularly limited as long as the ink can be discharged from the ink jet head satisfactorily, but it is preferably 4 mPa·s or more and 20 mPa·s or less, more preferably It is 5 mPa·s or more and 10 mPa·s or less. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, and the like.

The type of the optical element is not particularly limited as long as it is an optical element provided with a bank. Preferable optical elements include color filters, organic EL display elements, quantum dot displays, or organic TFT arrays.

Using the optical element produced by the method described above, various display devices can be produced according to a known method.

[Example]

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.

[Examples 1 to 12 and Comparative Examples 1 to 9]

In the Examples and Comparative Examples, as the alkali-soluble resin (A) (component (A)), RE1, which is a Cardo resin, and acrylic resin RE2 synthesized by the following method were used. RE2 is a resin obtained by reacting 12 mol% of methacrylic acid, 17% of dicyclopentyl methacrylate, and 71 mol% of 3,4-epoxycyclohexylmethylacrylate (3,4-Epoxycyclohexylmethylacrylate).

Hereinafter, the manufacturing method of the Cardo resin as A-1 will be described.

First, 235 g of bisphenol fluorene-type epoxy resin (epoxy equivalent: 235), 110 mg of tetramethylammonium chloride, and 100 mg of 2,6-di-tert-butyl-4-methylphenol were placed in a 500-mL four-necked flask. , and 72.0 g of acrylic acid, which were heated and dissolved at 90 to 100° C. while blowing in air at a rate of 25 mL/min. Next, the solution was gradually heated up while being cloudy, and was completely dissolved by heating to 120°C. At this time, the solution gradually became transparent and viscous, and stirring was continued in this state. During this period, the acid value was measured, and heating and stirring were continued until it became less than 1.0 mgKOH/g. It takes 12 hours for the acid value to reach the target value. Then, it cooled to room temperature, and obtained the bisphenol fluorene type epoxy acrylate represented by the following formula in a colorless, transparent and solid state.

[Chemical formula 49]

Next, 600 g of 3-methoxybutyl acetate was added to 307.0 g of the above-mentioned bisphenol fluorene-type epoxy acrylate obtained in the above-described manner and dissolved, and then 80.5 g of biphenyltetracarboxylic dianhydride and tetraethyl bromide were mixed. 1 g of ammonium chloride was gradually heated up and allowed to react at 110 to 115° C. for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed and reacted at 90° C. for 6 hours to obtain a Cardo resin. The disappearance of the acid anhydride group was confirmed by IR spectrum.

In Examples and Comparative Examples, dipentaerythritol hexaacrylate was used as the photopolymerizable monomer (B) (component (B)).

In Examples and Comparative Examples, the compounds described below were used as the photopolymerization initiator (C) (component (C)). In the examples, the following PI1 to PI4, which are the oxime ester compounds represented by the above formula (C1), were used. In the comparative example, the following PI5 to PI7, which are oxime ester compounds not belonging to the oxime ester compound represented by the above formula (C1), were used.

[Chemical formula 50]

[Chemical formula 51]

In Examples and Comparative Examples, as the fluorine-based resin (D) (component (D)), a fluorine-based resin containing the following units in the following ratios was used. In addition, in the following formula, the number in the lower right of each unit represents the content (mol%) of each unit in the fluorine-based resin.

[Chemical formula 52]

In the examples and comparative examples, as the colorant (E) (component (E)), the organic pigment mixed dispersion liquid (C.I. Pigment Blue 15:6/C.I. Pigment Violet 23/C.I. =40 mass %/20 mass %/40 mass %, solid content concentration 15 mass %). In addition, the quantity of the coloring agent (D) described in Table 1 mentioned later is not the quantity of a dispersion liquid, but the solid content amount (amount of a pigment and a dispersing agent) in a dispersion liquid.

In Examples and Comparative Examples, the following compounds were used as the imidazole generator (F).

[Chemical formula 53]

The photosensitive resin compositions of Examples and Comparative Examples were obtained by uniformly dissolving and dispersing the following substances in the organic solvent (S) so that the solid content concentration would be 15% by mass: the substances described in Table 1 The type and amount of alkali-soluble resin (A); the amount of photopolymerizable monomer (B) described in Table 1; the photopolymerization initiator (C) of the type described in Table 1 3.5 parts by mass; The amount of fluorine-based resin (D) 1 mass part; the colorant (E) of the amount described in Table 1; and the imidazole generator (F) 0.5 mass part. As the organic solvent (S), a mixed solvent containing 15% by mass of diethylene glycol methyl ethyl ether and 85% by mass of propylene glycol monomethyl ether acetate was used.

Using the obtained photosensitive resin compositions of Examples and Comparative Examples, pixel repellency (liquid repellency of non-pattern part), cross-sectional shape, and methoxybenzene contact angle (repulsion of cured film) were measured by the following methods. liquid) were evaluated.

[Pixel exclusion evaluation]

The photosensitive resin composition was spin-coated on a glass substrate (10 cm×10 cm) and heated at 90° C. for 120 seconds to form a coating film having a thickness of 1.0 μm on the surface of the glass substrate. Then, using a proximity exposure apparatus (product name: TME-150RTO, manufactured by Topcon Co., Ltd.), through a negative mask (a matrix pattern with a width of 10 μm and a square of 200 μm), the exposure amount was 100 mJ/cm ² . Exposure. The exposed film was developed for 50 seconds using a 0.04 mass % KOH aqueous solution at 26°C, and then fired at 230°C for 30 minutes to form a base pattern.

Methoxybenzene was dropped on the glass substrate on which the substrate pattern was formed, and then the inside of the substrate was observed with a scanning electron microscope. Next, based on the scanning electron microscope image, the area (μm ² ) of the portion (repelling portion) inside the substrate to which methoxybenzene is not applied was measured. The ratio (%) of the area (μm ² ) of the repelling portion to the area (200×200 μm ² ) inside the substrate was calculated, and the degree of pixel rejection was evaluated based on the ratio (%). The evaluation criteria of pixel rejection are as follows. Table 1 shows the evaluation results of pixel rejection.

○: The ratio of the area of the repelling portion to the internal area of the substrate is 0% or more and less than 5%.

Δ: The ratio of the area of the repelling portion to the internal area of the base is 5% or more and less than 20%.

×: The ratio of the area of the repelling portion to the internal area of the substrate is 20% or more.

[Cross-sectional shape evaluation]

The photosensitive resin composition was spin-coated on a glass substrate (10 cm×10 cm) and heated at 90° C. for 120 seconds to form a coating film having a thickness of 1.0 μm on the surface of the glass substrate. Thereafter, exposure was performed at an exposure amount of 100 mJ/cm ² through a negative mask (line and space pattern with a width of 10 μm) using a proximity exposure apparatus (product name: TME-150RTO, manufactured by Topcon Co., Ltd.). The exposed film was developed for 50 seconds using a 0.04 mass % KOH aqueous solution at 26°C, then fired at 230°C for 30 minutes, and the bonding angle (taper angle) between the pattern and the substrate was measured with a scanning electron microscope. The measured taper is shown in Table 1. Based on the measured taper, the cross-sectional shape was evaluated according to the following criteria.

○: 45 degrees or more and 90 degrees or less

△: 30 degrees or more and 44 degrees or less

×: Below 29 degrees or above 91 degrees

[Contact angle]

The photosensitive resin composition was spin-coated on a glass substrate (10 cm×10 cm) and heated at 90° C. for 120 seconds to form a coating film having a thickness of 1.0 μm on the surface of the glass substrate. Thereafter, exposure was performed at an exposure amount of 100 mJ/cm ² using a proximity exposure apparatus (product name: TME-150RTO, manufactured by Topcon Co., Ltd.). 50 μL of methoxybenzene was dropped on the surface of the exposed film, and the contact angle was measured using DROP MASTER-700. The case where the contact angle was 50°C or more was evaluated as ○, and the case where the contact angle was less than 50°C was evaluated as ×.

[Table 1]

As can be seen from Table 1, an alkali-soluble resin (A), a photopolymerizable monomer (B), a photopolymerization initiator (C), a fluorine-based resin (D), and a photopolymerization initiator (C-I) (which When the oxime ester compound having the structure represented by the above formula (C1) is used as the photosensitive resin composition of the examples of the photopolymerization initiator (C), the pixel rejection is small, and the non-pattern portion can be suppressed from exhibiting liquid repellency.

In addition, the patterned cured film formed using the photosensitive resin composition of the Example exhibited a taper within an appropriate range as a bank for producing an optical element, and further contained a p-methoxy group. Liquid repellency of organic solvents such as benzene.

On the other hand, it was found that when the fluorine-based resin (D) was used as the liquid repellent component, but the photopolymerization initiator (C-I) (which was the oxime ester compound having the structure represented by the above formula (C1)) was not included as the photopolymerization In the case of the photosensitive resin composition of the comparative example of the initiator (C), pixel repellency occurred in a large amount, and it was difficult to suppress the non-pattern part from expressing liquid repellency.

In addition, the patterned cured film formed using the photosensitive resin composition of the comparative example may exhibit an unsuitable low taper as a bank for producing an optical element, and may Organic solvents such as oxybenzene have low liquid repellency.

Claims (16)

1. A photosensitive resin composition comprising an alkali-soluble resin (A), a photopolymerizable monomer (B), a photopolymerization initiator (C), and a fluorine-based resin (D), Wherein, the photopolymerization initiator (C) includes a photopolymerization initiator (C-I) represented by the following formula (C1),

In formula (C1), X ^c1 is a divalent or trivalent linking group, a plurality of R ^c1 are each independently a monovalent organic group, and a plurality of R ^c2 are each independently a hydrogen atom, which may have a substituent. An alkyl group having 1 or more and 11 or less carbon atoms, or an aryl group which may have a substituent, and each of a plurality of R ^c3 is independently a monovalent organic group bonded to a nitrogen atom in a carbazole ring through a CN bond , t1 is 0 or 1. 2 . The photosensitive resin composition according to claim 1 , wherein the t1 is 0. 3 . The photosensitive resin composition according to claim 1 or 2, wherein the X ^c1 is a divalent or trivalent linking group represented by the following formula (C2),

In formula (C2), X ^c2 is a divalent or trivalent aromatic group, and a plurality of X ^c3 are each independently -C(=O)-, -C(=S)-, or a single bond, when t1 When it is 0, t2 is 0, and when t1 is 1, t2 is 1. 4 . The photosensitive resin composition according to claim 1 , further comprising a colorant (E). 5 . 5 . The photosensitive resin composition according to claim 4 , wherein the colorant (E) is a light-shielding agent (E1). 6 . 6. The photosensitive resin composition according to claim 5, which is used for bank formation. 7. A method for producing a patterned cured film, comprising the following steps: a step of applying the photosensitive resin composition according to any one of claims 1 to 6 on a substrate to form a coating film; and the step of exposing the coating film, wherein the coating film is patterned, or Position-selective exposure is performed on the coating film, and then, development with respect to the exposed coating film is performed. The patterned cured film formed from the cured product of the photosensitive resin composition in any one of Claims 1-6. 9 . A bank formed from a cured product of the photosensitive resin composition for bank formation according to claim 6 . 10. A banked substrate for producing an optical element, wherein the bank of claim 9 is provided on the substrate. 11. An optical element comprising the banked substrate for manufacturing an optical element according to claim 10. 12. A display device comprising the optical element according to claim 11. 13. A method for forming a bank, comprising the following steps: A step of applying the photosensitive resin composition of claim 6 on a substrate to form a coating film; and the step of exposing the coating film, wherein the coating film is patterned, or Position-selective exposure is performed on the coating film, and then, development with respect to the exposed coating film is performed. 14. A method of manufacturing an optical element, comprising a step of forming a pixel by injecting ink into a region surrounded by the bank formed on a substrate by the method according to claim 13. 15. The method of manufacturing an optical element according to claim 14, wherein the ink is injected into the region surrounded by the bank by an ink jet method. 16. The method of manufacturing an optical element according to claim 14 or 15, wherein the optical element is a color filter, an organic EL display element, a quantum dot display, or an organic TFT array.