CN111787651A - Heating element and preparation method thereof - Google Patents
Heating element and preparation method thereof Download PDFInfo
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- CN111787651A CN111787651A CN202010687738.5A CN202010687738A CN111787651A CN 111787651 A CN111787651 A CN 111787651A CN 202010687738 A CN202010687738 A CN 202010687738A CN 111787651 A CN111787651 A CN 111787651A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 87
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000010410 layer Substances 0.000 claims abstract description 152
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 239000003292 glue Substances 0.000 claims abstract description 31
- 239000012790 adhesive layer Substances 0.000 claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 239000002245 particle Substances 0.000 claims description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- 229910021389 graphene Inorganic materials 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- 230000001954 sterilising effect Effects 0.000 claims description 6
- 210000003298 dental enamel Anatomy 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000002585 base Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229910002027 silica gel Inorganic materials 0.000 description 8
- 239000000741 silica gel Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000004659 sterilization and disinfection Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 polysiloxane Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000012377 drug delivery Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000554 physical therapy Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003852 thin film production method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Resistance Heating (AREA)
Abstract
The invention discloses a heating element and a preparation method thereof, wherein the heating element comprises a first substrate and a second substrate which are arranged in parallel, a conductive circuit layer is arranged on one side surface of the first substrate close to the second substrate, a heating layer is printed on one side surface of the conductive circuit layer close to the second substrate, the heating layer is electrically communicated with the conductive circuit layer, the second substrate is bonded with the first substrate through a packaging adhesive layer, and the heating layer and the conductive circuit layer are sealed between the first substrate and the second substrate through the packaging adhesive layer. The conductive circuit layer and the printed heating layer are directly arranged on the first substrate, so that the manufacturing cost of the heating part can be reduced, the heating part does not need to be manufactured into a film structure by the conductive circuit layer and the heating layer in advance, the using amount of glue is reduced, the manufacturing period of the heating part is shortened, and the printed heating layer can be uniformly distributed on the side surface of the first substrate, so that uniform heating is realized; through setting up encapsulation glue film encapsulation conducting wire layer and the layer that generates heat, can realize good insulating seal.
Description
Technical Field
The invention relates to the technical field of electric heating equipment, in particular to a heating piece and a preparation method thereof.
Background
With the improvement of living standard of people, the requirements of people on living environment are higher and higher, and products with single structure and function can not meet the requirements of people, so more functions meeting the requirements are usually arranged on the products. For example, a conventional towel rack only has a function of hanging a towel, and an electric heating wire is arranged in the towel rack to heat the towel rack so as to achieve a function of drying the towel. However, most of the existing towel racks capable of being heated are made of steel pipes, and electric heating wires are installed in the steel pipes to achieve the heating function.
Disclosure of Invention
One object of an embodiment of the present invention is to: the heating element has the advantages of simple structure, low cost, long service life and uniform heating.
Another object of an embodiment of the present invention is to: the preparation method of the heating element is simple to operate and high in production efficiency.
To achieve the purpose, the embodiment of the invention adopts the following technical scheme:
the first aspect provides a piece generates heat, first base plate and second base plate including parallel arrangement, first base plate is close to a side of second base plate is provided with the conducting wire layer, the conducting wire layer is close to a side printing of second base plate has the layer that generates heat, generate heat the layer with conducting wire layer electric conductance leads to, the second base plate through the encapsulation glue film with first base plate bonds, generate heat the layer with the conducting wire layer passes through the encapsulation glue film is sealed first base plate with between the second base plate.
As a preferred scheme of the heating element, the heating layer and the conductive circuit layer are embedded in the packaging adhesive layer; and/or the presence of a gas in the gas,
the packaging adhesive layer is annularly arranged along the periphery of the first substrate, a sealing cavity is formed between the packaging adhesive layer and the first substrate and between the packaging adhesive layer and the second substrate, and the heating layer and the conductive circuit layer are arranged in the sealing cavity.
As a preferable scheme of the heating member, the first substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate; and/or the presence of a gas in the gas,
the second substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate.
As a preferable scheme of the heat generating member, the heat generating layer is a hardened heat generating particle layer, and the particle diameter of the particles of the particle layer is 1 to 80 micrometers.
As a preferable scheme of the heat generating member, the particles are any one of graphene particles, inorganic carbon particles, organic carbon particles and carbon fibers.
As a preferred scheme of the heating element, the packaging adhesive layer is any one of an epoxy resin layer, a silicon resin layer and a silicon gel layer.
As a preferred scheme of the heating element, the first substrate has a first side surface and a second side surface which are oppositely arranged, the conductive circuit layer and the heating layer are both arranged on the first side surface, and the second side surface is provided with a sterilization layer.
As a preferred scheme of the heating element, the first substrate is provided with a first side face, the conducting circuit layer and the heating layer are arranged on the first side face, the first side face corresponds to the conducting circuit layer and the heating layer is provided with a first groove and a second groove respectively, the first groove is communicated with the second groove, the conducting circuit layer is arranged in the first groove, and the heating layer is arranged in the second groove.
In a second aspect, a method for manufacturing a heating element is provided, the method includes providing a first substrate and a second substrate, forming a conductive circuit layer on a first side of the first substrate, printing a heating layer on the conductive circuit layer, and finally adhering the second substrate to the first side of the first substrate through a packaging adhesive layer.
As a preferred scheme of the preparation method of the heating element, the preparation method comprises the following specific steps:
step S100, electroplating or depositing or printing the conductive circuit layer on the first side of the first substrate;
step S200, printing the graphene slurry on the first side surface, and forming the heating layer after hardening;
step 300, pasting a glue film or brushing glue on the surfaces of the conductive circuit layer and the heating layer, and then pasting the second substrate on the first substrate.
The invention has the beneficial effects that: the manufacturing cost of the heating part can be reduced by directly arranging the conducting circuit layer and the printed heating layer on the first substrate, the heating part does not need to be manufactured into a film structure by the conducting circuit layer and the heating layer in advance, the using amount of glue is reduced, the manufacturing period of the heating part is shortened, the printed heating layer can be uniformly distributed on the side surface of the first substrate, the uniform heating effect is realized, and the using comfort is improved; through setting up encapsulation glue film encapsulation conducting wire layer and the layer that generates heat, can realize good insulating seal, stop the condition emergence of electric leakage completely, safe and reliable.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a sectional view of a heat generating member according to an embodiment of the present invention.
Fig. 2 is a sectional view of a heat generating member according to another embodiment of the present invention.
Fig. 3 is a top view of the heat generating member according to the embodiment of the invention (the second substrate and the encapsulating adhesive layer are not shown).
In the figure:
1. a first substrate; 2. a second substrate; 3. a conductive circuit layer; 4. a heat generating layer; 41. a heating bar; 5. packaging the adhesive layer; 6. sealing the cavity; 7. and a sterilization layer.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 and fig. 3, an embodiment of the present invention provides a heat generating component, which includes a first substrate 1 and a second substrate 2 that are arranged in parallel, a conductive circuit layer 3 is disposed on a side of the first substrate 1 close to the second substrate 2, a heat generating layer 4 is printed on a side of the conductive circuit layer 3 close to the second substrate 2, the heat generating layer 4 is electrically connected to the conductive circuit layer 3, the second substrate 2 is bonded to the first substrate 1 through an encapsulation adhesive layer 5, and the heat generating layer 4 and the conductive circuit layer 3 are sealed between the first substrate 1 and the second substrate 2 through the encapsulation adhesive layer 5. The conductive circuit layer 3 and the printed heating layer 4 are directly arranged on the first substrate 1, so that the manufacturing cost of the heating part can be reduced, the heating part does not need to be made into a film structure by the conductive circuit layer 3 and the heating layer 4 in advance, the using amount of glue is reduced, the manufacturing period of the heating part is shortened, the printed heating layer 4 can be uniformly distributed on the side surface of the first substrate 1, the uniform heating effect is realized, and the use comfort is improved; through setting up encapsulation glue film 5 encapsulation conducting wire layer 3 and layer 4 that generates heat, can realize good insulating seal, stop the condition emergence of electric leakage completely, safe and reliable.
The heating element of the invention can be used as a degerming dryer (such as a towel rack), a table top of a dining table, a floor, a partition of a shower room or a sauna room, and the heating element can be arranged at a position needing heating.
In an embodiment, the entire first substrate 1 is covered by the packaging adhesive layer 5, and the heat generating layer 4 and the conductive circuit layer 3 are embedded in the packaging adhesive layer 5. This design can stop water to enter into the region between first base plate 1 and the second base plate 2 completely, guarantee to generate heat layer 4 with conducting wire layer 3 can normal work, prolong the life of the two.
The thickness of the packaging adhesive layer 5 is slightly larger than the sum of the thicknesses of the heating layer 4 and the conductive circuit layer 3. The design can ensure the sealing effect of the heating layer 4 and the conducting circuit layer 3 and can also reduce the thickness of the whole heating part.
The whole first substrate 1 is not limited to be covered with the encapsulating adhesive layer 5, and a circle of encapsulating adhesive layer 5 may be annularly arranged on only one side of the first substrate 1 close to the second substrate 2. Specifically, as shown in fig. 2, the encapsulation adhesive layer 5 is annularly disposed along a peripheral portion of the first substrate 1, a sealed cavity 6 is formed between the encapsulation adhesive layer 5 and the first substrate 1 and the second substrate 2, and the heat generating layer 4 and the conductive circuit layer 3 are disposed in the sealed cavity 6. The design can reduce the use amount of the packaging adhesive layer 5 and reduce the cost.
Further, this sealed chamber 6 is a vacuum chamber. During manufacturing, the sealed cavity 6 can be vacuumized, so that water vapor is prevented from remaining in the sealed cavity 6, and normal use of the heating layer 4 and the conductive circuit layer 3 is prevented from being influenced.
The packaging adhesive layer 5 is any one of an epoxy resin layer, a silicon resin layer and a silicon gel layer.
The epoxy resin is a generic name of a polymer having two or more epoxy groups in a molecule. It is a polycondensation product of epichlorohydrin and bisphenol A or a polyol. Because of the chemical activity of the epoxy group, the epoxy group can be opened by a plurality of compounds containing active hydrogen, and the ring is hardened and crosslinked to form a network structure, so the epoxy group is a thermosetting resin. The main varieties of the epoxy resin are 16, including general purpose glue, structural glue, high temperature resistant glue, low temperature resistant glue, glue for water and wet surfaces, conductive glue, optical glue, spot welding glue, epoxy resin glue film, foaming glue, strain glue, soft material bonding glue, sealing glue, special glue, latent hardening glue and civil engineering and building glue. The epoxy resin as an anti-corrosion material not only has the characteristics of compactness, water resistance, good leakage resistance, high strength and the like, but also has good manufacturability of strong adhesive force, normal-temperature operation, simple and convenient construction and the like, and has moderate price.
The silicone resin is a thermosetting polysiloxane polymer with a highly cross-linked structure, has the dual characteristics of organic resin and inorganic materials, has unique physical and chemical properties, and has good electrical insulation property, temperature resistance and waterproof effect. The silicon resin has better weather resistance than common organic resin. Therefore, it is an ideal material for coating a surface layer protected by heat-resistant, heat-resistant and moisture-proof treatment. The silicon resin has good bonding performance to metals such as iron, aluminum and tin, and is easy to bond to glass and ceramics.
Silica gel (Silica gel, Silica) is also called silicic acid gel, is a high-activity adsorption material, belongs to an amorphous substance, has a chemical molecular formula of mSiO 2. nH2O, does not react with any substance except strong alkali and hydrofluoric acid, is insoluble in water and any solvent, is nontoxic and odorless, and has stable chemical properties. Different types of silica gel form different microporous structures due to different manufacturing methods. The silica gel has the characteristics of high adsorption performance, good thermal stability, stable chemical property, higher mechanical strength and the like due to the chemical components and the physical structure of the silica gel. The silica gel is classified into macroporous silica gel, B-type silica gel, and microporous silica gel according to the pore size.
In one embodiment, the first substrate 1 and the second substrate 2 are ceramic plates. The ceramic substrate has the advantages that the ceramic substrate has high-temperature resistance, does not rust, has good soaking effect and other functions, the cost of the ceramic substrate is lower than that of structures such as steel, and the cost of a heating piece can be reduced.
Of course, the first substrate 1 and the second substrate 2 are not limited to being made of ceramic, but may be made of glass, acryl, enamel, or the like, which is a heat-resistant hard material.
The material of the first substrate 1 and the second substrate 2 may be the same or different, for example, the first substrate 1 is a ceramic plate, and the second substrate 2 is a glass plate.
The heating layer 4 is a hardened heating particle layer, and the particle size of the particles of the particle layer is 1-80 microns. The particle structure is easier to be mixed with a solvent or a binder to prepare liquid slurry, and then the liquid slurry is formed on the first substrate 1 in a printing mode, and the particle size of the particles is 1-80 microns, so that the heat emitted by the heating layer 4 under the power-on condition can be ensured to be more uniform. The adhesive can be silicon rubber, silicon resin, PVC and other materials, the adhesive and the graphene particles are uniformly mixed according to a certain proportion, and then the mixture is formed on the side surface of the first substrate 1 in a printing mode and is heated and hardened to form the heating layer 4.
In this embodiment, the particles are graphene particles. Graphene (Graphene) is a polymer made of carbon atoms in sp2The hybrid tracks form a hexagonal honeycomb lattice two-dimensional carbon nanomaterial. The graphene has excellent optical, electrical and mechanical properties, and has important application prospects in the aspects of materials science, micro-nano processing, energy, biomedicine, drug delivery and the like. Common powder production methods of graphene are a mechanical stripping method, an oxidation-reduction method and a SiC epitaxial growth method, and a thin film production method is a Chemical Vapor Deposition (CVD) method.
The heating layer 4 made of graphene can generate far infrared light waves which are matched with infrared light wave bands emitted by a human body per se and have the wavelength of 5-15 microns when the heating layer is electrified, so that the heating piece also has a physiotherapy function when heating, and in addition, the heating piece has small leakage current and high safety when working.
Of course, the heat generating layer 4 is not limited to the use of graphene particles, and any one of inorganic carbon particles, organic carbon particles, and carbon fibers may be used.
In one embodiment, the first substrate 1 has a first side surface and a second side surface opposite to each other, the conductive circuit layer 3 and the heat generating layer 4 are both disposed on the first side surface, and the second side surface is disposed with a sterilization layer 7. By providing the sterilization layer 7, the ambient air or the object attached to the first substrate 1 can be sterilized while the heat generating member generates heat.
The side of the second substrate 2 remote from the first substrate 1 is also provided with a sterilization layer 7.
In addition, a pattern layer can be printed or pasted on the second side surface of the first substrate 1 or the side surface of the second substrate 2 far away from the first substrate 1, so that the appearance attractiveness of the heating element is improved.
Preferably, the roughness of the first side is greater than the roughness of the second side. The roughness of first side is high, can be convenient for conducting wire layer 3 and the shaping of layer 4 that generates heat on the first side of first base plate 1.
In an embodiment, the first side surface is provided with a first groove and a second groove corresponding to the conductive circuit layer 3 and the heating layer 4, respectively, the first groove is communicated with the second groove, the conductive circuit layer 3 is disposed in the first groove, and the heating layer 4 is disposed in the second groove. The first grooves are arranged in advance according to the patterns of the conductive circuit layer 3 when the first substrate 1 is manufactured, and the second grooves are arranged according to the structure of the heating layer 4, so that the forming difficulty of the conductive circuit layer 3 and the heating layer 4 can be reduced.
The heating layer 4 comprises a plurality of heating strips 41 spaced along a first direction, the length of each heating strip 41 extends along a second direction, the first direction is perpendicular to the second direction, and each heating strip 41 is connected with the conductive circuit layer 3. The heating strips 41 arranged uniformly make the heating effect more uniform.
The embodiment of the invention also provides a preparation method of the heating element, which is used for preparing the heating element in any embodiment, the conductive circuit layer 3 is formed on the first side surface of the first substrate 1, the heating layer 4 is printed on the conductive circuit layer 3, and finally the second substrate 2 is adhered to the first side surface of the first substrate 1 through the packaging adhesive layer 5. The preparation method is simple, has high production efficiency, and can be suitable for preparing heating parts with different shapes.
In one embodiment, the method comprises the following steps:
step S100, electroplating or depositing or printing the conductive circuit layer 3 on the first side of the first substrate 1;
step S200, mixing graphene particles with a binder to prepare graphene slurry, printing the graphene slurry on the first side surface, and hardening to form the heating layer 4;
step 300, adhering a film or brushing glue on the surfaces of the conductive circuit layer 3 and the heating layer 4, and then adhering the second substrate 2 to the first substrate 1.
In the description herein, it is to be understood that the terms "upper" and the like are based on the orientation or positional relationship shown in the drawings, which are for convenience of description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.
In the description herein, references to the term "an embodiment" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. The utility model provides a piece generates heat, its characterized in that, first base plate and second base plate including parallel arrangement, first base plate is close to a side of second base plate is provided with the conducting wire layer, the conducting wire layer is close to a side printing of second base plate has the layer that generates heat, generate heat the layer with conducting wire layer electric conductance leads to, the second base plate through the encapsulation glue film with first base plate bonds, generate heat the layer with the conducting wire layer passes through the encapsulation glue film is sealed first base plate with between the second base plate.
2. The heat generating member as claimed in claim 1, wherein the heat generating layer and the conductive circuit layer are embedded in the encapsulating adhesive layer; and/or the presence of a gas in the gas,
the packaging adhesive layer is annularly arranged along the periphery of the first substrate, a sealing cavity is formed between the packaging adhesive layer and the first substrate and between the packaging adhesive layer and the second substrate, and the heating layer and the conductive circuit layer are arranged in the sealing cavity.
3. The heat generating member according to claim 1, wherein the first substrate is any one of a ceramic plate, a glass plate, an acrylic plate, and an enamel plate; and/or the presence of a gas in the gas,
the second substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate.
4. The heat generating member according to claim 1, wherein the heat generating layer is a hardened heat generating particle layer having a particle diameter of 1 to 80 μm.
5. The heat generating member according to claim 4, wherein the particle layer is any one of graphene particles, inorganic carbon particles, organic carbon particles, and carbon fibers.
6. A heat generating member according to claim 1, wherein the encapsulating adhesive layer is any one of an epoxy resin layer, a silicone resin layer and a silicone rubber layer.
7. A heat generating member according to any one of claims 1 to 5, wherein the first substrate has a first side and a second side which are opposite to each other, the conductive circuit layer and the heat generating layer are both disposed on the first side, and the second side is provided with a sterilizing layer.
8. The heat generating member according to any one of claims 1 to 5, wherein the first substrate has a first side surface, the conductive circuit layer and the heat generating layer are both disposed on the first side surface, the first side surface is provided with a first groove and a second groove corresponding to the conductive circuit layer and the heat generating layer, respectively, the first groove is communicated with the second groove, the conductive circuit layer is disposed in the first groove, and the heat generating layer is disposed in the second groove.
9. A method for preparing a heat generating member, for preparing the heat generating member according to any one of claims 1 to 8, providing a first substrate and a second substrate, forming a conductive circuit layer on a first side of the first substrate, printing the heat generating layer on the conductive circuit layer, and finally adhering the second substrate to the first side of the first substrate through an encapsulation adhesive layer.
10. A method for manufacturing a heat generating member according to claim 9, comprising the steps of:
step S100, electroplating or depositing or printing the conductive circuit layer on the first side of the first substrate;
step S200, printing the graphene slurry on the first side surface, and forming the heating layer after hardening;
step 300, pasting a glue film or brushing glue on the surfaces of the conductive circuit layer and the heating layer, and then pasting the second substrate on the first substrate.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113534618A (en) * | 2021-07-19 | 2021-10-22 | 深圳瑞森特电子科技有限公司 | Manufacturing method of heated thick film |
| CN118075934A (en) * | 2024-03-27 | 2024-05-24 | 东莞市旺健电子科技有限公司 | Flexible heating pad and preparation method thereof |
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