CN111785672A - A kind of flexible touch screen separation method - Google Patents
A kind of flexible touch screen separation method Download PDFInfo
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- CN111785672A CN111785672A CN202010489973.1A CN202010489973A CN111785672A CN 111785672 A CN111785672 A CN 111785672A CN 202010489973 A CN202010489973 A CN 202010489973A CN 111785672 A CN111785672 A CN 111785672A
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- 238000000926 separation method Methods 0.000 title claims abstract description 15
- 230000007704 transition Effects 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000010409 thin film Substances 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 21
- 238000005507 spraying Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
Description
技术领域technical field
本发明属于触控屏技术领域,更具体地说,涉及一种柔性触摸屏分离方法。The invention belongs to the technical field of touch screens, and more particularly, relates to a method for separating flexible touch screens.
背景技术Background technique
触摸屏作为一种人机交互设备,近年来,随着智能手机、平板电脑、车载移动终端及商业化信息查询系统等智能终端产品的普及推广,触摸屏产品及技术突飞猛进,产业规模不断扩大,但市场竞争也日趋激烈。面对激烈的市场竞争,触摸屏行业不断创新,不断推出新产品,以期抢占市场的制高点。更轻,更薄,可弯曲的柔性触摸屏就是目前触摸屏行业的一个崭新的领域,也是未来触摸屏的发展方向。采用合理简便的生产制作过程可大大提升产品的市场竞争。As a human-computer interaction device, in recent years, with the popularization and promotion of intelligent terminal products such as smart phones, tablet computers, vehicle-mounted mobile terminals and commercial information query systems, touch screen products and technologies have advanced by leaps and bounds, and the industrial scale has continued to expand. Competition is also intensifying. In the face of fierce market competition, the touch screen industry continues to innovate and launch new products in order to seize the commanding heights of the market. Lighter, thinner and bendable flexible touch screen is a brand-new field in the touch screen industry at present, and it is also the development direction of the future touch screen. Using a reasonable and simple production process can greatly enhance the market competition of products.
现有技术中,先在平坦的基板上制作柔性触摸屏,再将柔性触摸屏从基板上分离下来,如何将柔性触摸屏分离下来至关重要,这是柔性触摸屏能否量产的关键。目前行业内通常是通过激光的方法将柔性触摸屏分离下来,但这种方法分离难度大且不够稳定,而且设备的投入非常昂贵,不利于柔性触摸屏的量产。In the prior art, a flexible touch screen is first fabricated on a flat substrate, and then the flexible touch screen is separated from the substrate. How to separate the flexible touch screen is very important, which is the key to mass production of the flexible touch screen. At present, the flexible touch screen is usually separated by a laser method in the industry, but this method is difficult to separate and is not stable enough, and the equipment investment is very expensive, which is not conducive to the mass production of the flexible touch screen.
发明内容SUMMARY OF THE INVENTION
本发明的目的是解决现有技术存在的问题,提供一种在生产过程中,可有效便捷的将柔性触摸屏进行分离,提高产品品质和良率的柔性触摸屏分离方法。The purpose of the present invention is to solve the problems existing in the prior art, and to provide a flexible touch screen separation method that can effectively and conveniently separate the flexible touch screen in the production process and improve product quality and yield.
为了实现上述目的,本发明采取的技术方案为:所提供的这种柔性触摸屏分离方法,其特征在于:在基板1上设置过渡薄膜层,在所述过渡薄膜层上设置柔性触摸屏,可手动将所述柔性触摸屏由所述过渡薄膜层上撕下。In order to achieve the above purpose, the technical solution adopted in the present invention is as follows: the provided method for separating a flexible touch screen is characterized in that: a transition film layer is arranged on the substrate 1, a flexible touch screen is arranged on the transition film layer, and the flexible touch screen can be manually separated. The flexible touch screen is torn off from the transition film layer.
为使上述技术方案更加详尽和具体,本发明还提供以下更进一步的优选技术方案,以获得满意的实用效果:In order to make the above-mentioned technical solutions more detailed and concrete, the present invention also provides the following further preferred technical solutions to obtain satisfactory practical effects:
所述过渡薄膜层为通过涂布的方法在所述基板上形成的液态状薄膜。The transition thin film layer is a liquid thin film formed on the substrate by a coating method.
将液态状薄膜经过低温烤炉加热初步固化为固态薄膜,在进一步加热进行彻底固化成膜。The liquid film is initially cured into a solid film by heating in a low-temperature oven, and is thoroughly cured to form a film after further heating.
所述过渡薄膜层厚度小于30μm。The thickness of the transition thin film layer is less than 30 μm.
所述过渡薄膜层采用液态的亚克力树脂材料制作。The transition film layer is made of liquid acrylic resin material.
所述基材厚度小于30μm。The thickness of the substrate is less than 30 μm.
本发明与现有技术相比,具有以下优点:本发明柔性触摸屏分离方法,在生产过程中,可有效便捷的将柔性触摸屏进行分离,提高产品品质和良率,具有较好的应用前景。Compared with the prior art, the present invention has the following advantages: the flexible touch screen separation method of the present invention can effectively and conveniently separate the flexible touch screen in the production process, improve product quality and yield, and has good application prospects.
附图说明Description of drawings
下面对本说明书的附图所表达的内容及图中的标记作简要说明:The content expressed in the accompanying drawings of this specification and the symbols in the drawings are briefly described below:
图1为本发明柔性触摸屏制作示意图;FIG. 1 is a schematic diagram of the manufacture of a flexible touch screen according to the present invention;
图中标记为:1、基板,2、过渡薄膜层,3、基材,4、触摸导电层。The figures are marked as: 1, substrate, 2, transition film layer, 3, base material, 4, touch conductive layer.
具体实施方式Detailed ways
下面对照附图,通过对实施例的描述,对本发明的具体实施方式作进一步详细的说明。The specific embodiments of the present invention will be described in further detail below through the description of the embodiments with reference to the accompanying drawings.
本发明首先使用涂布的方法在平坦的基板1上上通过印刷或喷涂的方式制作一层厚度在微米级别的液态材料的过渡薄膜层2,然后使用喷涂的工艺,通过控制喷涂的压力和速度,在过渡薄膜层2上制作厚度<30μm的基材3,基材3为透明PI,再利用溅射、光刻和蚀刻工艺在透明PI上制作触摸导电层4,最后可手动将柔性触摸屏分离下来。The present invention first uses the coating method to produce a
本发明中,基板1可以为玻璃基板。过渡薄膜层所使用的原材料是一种液态材料,可采用亚克力树脂材料,首先原材料通过涂布的方法在基板上形成厚度在30μm以内的液态状薄膜,然后经过低温烤炉加热初步固化为固态薄膜,在进一步加热进行彻底固化成膜,烘烤参数根据材料的具体特性控制,初步固化温度为150℃*10min,最终固化温度为230℃*30min,分段固化可更好的满足成型要求。这种过渡薄膜层2在基板1上非常平坦,不会影响柔性触摸屏膜层的制作。In the present invention, the substrate 1 may be a glass substrate. The raw material used in the transition film layer is a liquid material, and acrylic resin material can be used. First, the raw material forms a liquid film with a thickness of less than 30 μm on the substrate by coating, and then is heated in a low-temperature oven to initially solidify into a solid film. After further heating, it is thoroughly cured and formed into a film. The baking parameters are controlled according to the specific characteristics of the material. The initial curing temperature is 150℃*10min, and the final curing temperature is 230℃*30min. Segmented curing can better meet the molding requirements. The
这种过渡薄膜层2与透明PI柔性基材3之间的附着力非常小而与硬体基板1之间的附着力却很大,因此很容易将柔性触摸屏从基板1上分离出来。同时,在分离的过程中,过渡薄膜层2只会留在基板1上,不会残留在柔性触摸屏上。因此,不会影响柔性触摸屏的品质。The adhesion between the
本专利通过在硬体与透明PI之间添加一层过渡薄膜层2,这种过渡薄膜层2与基板1之间的附着力很好而与透明PI之间的附着力很小。因此,很容易将柔性触摸屏从基板1上分离下来同时不会影响柔性触摸屏的品质。In this patent, a
本专利提供一种柔性触摸屏分离方法,非常容易实现柔性触摸屏的分离,可以克服常规激光分离方法的不足,极大地提升柔性触摸屏的品质和良率,有利于实现柔性触摸屏的规模化生产。This patent provides a flexible touch screen separation method, which is very easy to realize the separation of the flexible touch screen, can overcome the shortcomings of the conventional laser separation method, greatly improve the quality and yield of the flexible touch screen, and is conducive to the large-scale production of the flexible touch screen.
本专利是在基板与透明PI之间添加一层过渡薄膜层,这种过渡薄膜层利用黄光的喷涂和光刻工艺制作非常方便,过程相对比较好控制,可以克服常规激光分离方法成本高及不稳定的缺点,有利于实现柔性触摸屏的规模化生产。This patent is to add a transition thin film layer between the substrate and the transparent PI. This transition thin film layer is very convenient to make by spraying and photolithography with yellow light, and the process is relatively easy to control, which can overcome the high cost and high cost of conventional laser separation methods. The disadvantage of instability is conducive to the large-scale production of flexible touch screens.
本发明柔性触摸屏分离方法,在生产过程中,可有效便捷的将柔性触摸屏进行分离,提高产品品质和良率,具有较好的应用前景。The flexible touch screen separation method of the invention can effectively and conveniently separate the flexible touch screen in the production process, improve product quality and yield, and has good application prospects.
上面结合附图对本发明进行了示例性描述,但是本发明并不受限于上述方式,只要采用本发明的方法构思和技术方案进行的各种非实质性的改进或直接应用于其它场合的,均落在本发明的保护范围内。The present invention has been exemplarily described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned manner, as long as various insubstantial improvements made by adopting the method idea and technical solution of the present invention or directly applied to other occasions, All fall within the protection scope of the present invention.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104201283A (en) * | 2014-09-04 | 2014-12-10 | 广州新视界光电科技有限公司 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
KR20150000126A (en) * | 2013-06-24 | 2015-01-02 | 주식회사 이엠아이 | Method for Separating Substrate |
CN106057864A (en) * | 2016-08-23 | 2016-10-26 | 武汉华星光电技术有限公司 | Flexible display panel and preparation method thereof |
CN109087587A (en) * | 2018-08-09 | 2018-12-25 | 京东方科技集团股份有限公司 | A kind of flexible display substrates, preparation method and display device |
CN110383460A (en) * | 2019-05-21 | 2019-10-25 | 京东方科技集团股份有限公司 | Fabrication method and substrate structure of flexible electronic substrate |
CN110728911A (en) * | 2019-10-21 | 2020-01-24 | 云谷(固安)科技有限公司 | Display substrate, display panel and manufacturing method thereof |
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- 2020-06-02 CN CN202010489973.1A patent/CN111785672A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150000126A (en) * | 2013-06-24 | 2015-01-02 | 주식회사 이엠아이 | Method for Separating Substrate |
CN104201283A (en) * | 2014-09-04 | 2014-12-10 | 广州新视界光电科技有限公司 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
CN106057864A (en) * | 2016-08-23 | 2016-10-26 | 武汉华星光电技术有限公司 | Flexible display panel and preparation method thereof |
CN109087587A (en) * | 2018-08-09 | 2018-12-25 | 京东方科技集团股份有限公司 | A kind of flexible display substrates, preparation method and display device |
CN110383460A (en) * | 2019-05-21 | 2019-10-25 | 京东方科技集团股份有限公司 | Fabrication method and substrate structure of flexible electronic substrate |
CN110728911A (en) * | 2019-10-21 | 2020-01-24 | 云谷(固安)科技有限公司 | Display substrate, display panel and manufacturing method thereof |
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