CN111785665A - a mounting head - Google Patents
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- CN111785665A CN111785665A CN202010738685.5A CN202010738685A CN111785665A CN 111785665 A CN111785665 A CN 111785665A CN 202010738685 A CN202010738685 A CN 202010738685A CN 111785665 A CN111785665 A CN 111785665A
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- 238000009434 installation Methods 0.000 claims description 11
- 230000008602 contraction Effects 0.000 abstract description 8
- 230000005484 gravity Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
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Abstract
本发明公开了一种贴装头,包括底座和多个弹簧,所述底座上设有可升降的主轴,所述主轴的端部设有吸嘴,所述弹簧连接所述底座及所述主轴,所述弹簧的伸缩方向与所述主轴的轴线方向相同。在贴装头的底座上设置可升降的主轴,主轴与底座通过弹簧连接,弹簧的伸缩方向与主轴的轴向相同,主轴的端部设有吸嘴,当主轴处于自由状态时吸嘴对芯片的压力为主轴受到的重力,随着贴片头向下移动,弹簧逐渐张紧,进而吸嘴对芯片的压力逐渐增大,通过弹簧对主轴的控制,实现吸嘴对芯片压力的精准控制,提高芯片的贴装精度,同时防止主轴及吸嘴对芯片产生的压力过大导致芯片损伤。
The invention discloses a mounting head, comprising a base and a plurality of springs, the base is provided with a main shaft that can be lifted and lowered, the end of the main shaft is provided with a suction nozzle, and the spring is connected to the base and the main shaft , the expansion and contraction direction of the spring is the same as the axis direction of the main shaft. A liftable spindle is set on the base of the placement head. The spindle and the base are connected by a spring. The expansion and contraction direction of the spring is the same as the axial direction of the spindle. The end of the spindle is provided with a suction nozzle. The pressure of the spindle is the gravity of the spindle. As the placement head moves down, the spring is gradually tensioned, and the pressure of the suction nozzle on the chip gradually increases. The mounting accuracy of the chip, and at the same time prevent the chip from being damaged due to excessive pressure on the chip by the spindle and the suction nozzle.
Description
技术领域technical field
本发明涉及半导体封装技术领域,尤其涉及一种贴装头。The present invention relates to the technical field of semiconductor packaging, in particular to a mounting head.
背景技术Background technique
随着半导体电路的小型化、集成化,对高密度立体贴装技术提出了更高的要求。现有的多功能组装系统一般用于将裸芯片自动贴装到基板上,例如将VCSEL芯片按芯片能承受的压力贴装到陶瓷多层基板,GaAs、SiC、GaN等薄且脆的芯片的芯片贴装时对贴装压力的精确控制尤为重要,不当的贴装压力会造成芯片暗裂、崩边等损伤,因此在裸芯片的拾取、贴放过程中精确控制压力是实现VCSEL芯片高质量、高精度贴装的关键。因此,需要一种贴装头实现裸芯片贴装过程中精确的压力控制。With the miniaturization and integration of semiconductor circuits, higher requirements are placed on high-density three-dimensional mounting technology. Existing multi-function assembly systems are generally used to automatically mount bare chips on substrates. For example, VCSEL chips are mounted on ceramic multilayer substrates according to the pressure that the chips can withstand, and thin and brittle chips such as GaAs, SiC, and GaN are mounted. The precise control of the mounting pressure during chip mounting is particularly important. Improper mounting pressure will cause damage such as chip cracks and edge chipping. Therefore, precise control of the pressure during the pick-up and placement process of bare chips is to achieve high quality VCSEL chips. , the key to high-precision placement. Therefore, there is a need for a placement head to achieve precise pressure control during bare chip placement.
发明内容SUMMARY OF THE INVENTION
本发明所要解决的技术问题是:提供一种高精度的贴装头。The technical problem to be solved by the present invention is to provide a high-precision placement head.
为了解决上述技术问题,本发明采用的技术方案为:一种贴装头,包括底座和多个弹簧,所述底座上设有可升降的主轴,所述主轴的端部设有吸嘴,所述弹簧连接所述底座及所述主轴,所述弹簧的伸缩方向与所述主轴的轴线方向相同。In order to solve the above technical problems, the technical solution adopted in the present invention is as follows: a mounting head includes a base and a plurality of springs, the base is provided with a main shaft that can be lifted and lowered, and the end of the main shaft is provided with a suction nozzle, so The spring is connected to the base and the main shaft, and the expansion and contraction direction of the spring is the same as the axial direction of the main shaft.
本发明的有益效果在于:在贴装头的底座上设置可升降的主轴,主轴与底座通过弹簧连接,弹簧的伸缩方向与主轴的轴向相同,主轴的端部设有吸嘴,当主轴处于自由状态时吸嘴对芯片的压力为主轴受到的重力,随着贴片头向下移动,弹簧逐渐张紧,进而吸嘴对芯片的压力逐渐增大,通过弹簧对主轴的控制,实现吸嘴对芯片压力的精准控制,提高芯片的贴装精度,同时防止主轴及吸嘴对芯片产生的压力过大导致芯片损伤。The beneficial effect of the present invention is that a liftable main shaft is arranged on the base of the placement head, the main shaft and the base are connected by a spring, the expansion and contraction direction of the spring is the same as the axial direction of the main shaft, and the end of the main shaft is provided with a suction nozzle. In the free state, the pressure of the suction nozzle on the chip is the gravity of the spindle. As the patch head moves down, the spring is gradually tightened, and then the pressure of the suction nozzle on the chip gradually increases. The precise control of the chip pressure improves the placement accuracy of the chip, and at the same time prevents the chip from being damaged due to excessive pressure on the chip by the spindle and the suction nozzle.
附图说明Description of drawings
图1为本发明实施例一的贴装头的结构示意图;1 is a schematic structural diagram of a placement head according to Embodiment 1 of the present invention;
图2为本发明实施例一的贴装头的正视图;2 is a front view of the placement head according to the first embodiment of the present invention;
图3为本发明实施例一的贴装头的爆炸图;3 is an exploded view of the placement head according to Embodiment 1 of the present invention;
图4为本发明实施例一的贴装头的部分结构示意图;FIG. 4 is a partial structural schematic diagram of the placement head according to the first embodiment of the present invention;
图5为本发明实施例一的贴装头中主轴的结构示意图。FIG. 5 is a schematic structural diagram of a spindle in a placement head according to Embodiment 1 of the present invention.
标号说明:Label description:
1、底座;11、安装位;12、转轴;13、第三弹簧拉杆;14、底板;15、触点;2、弹簧;21、上拉弹簧;22、下拉弹簧;3、主轴;31、第一弹簧拉杆;32、第二弹簧拉杆;33、第一通孔;34、第二通孔;35、固定孔;4、夹持轮;5、卡板;6、压板;7、安装座;8、进气管;81、第一进气管;82、第二进气管;83、进气口。1. Base; 11. Installation position; 12. Rotating shaft; 13. Third spring rod; 14. Bottom plate; 15. Contact; 2. Spring; 21. Pull-up spring; 22. Pull-down spring; 3. Spindle; 31. 32, the second spring rod; 33, the first through hole; 34, the second through hole; 35, the fixing hole; 4, the clamping wheel; 5, the clamping plate; 6, the pressure plate; 7, the mounting
具体实施方式Detailed ways
为详细说明本发明的技术内容、所实现目的及效果,以下结合实施方式并配合附图予以说明。In order to describe in detail the technical content, achieved objects and effects of the present invention, the following descriptions are given with reference to the embodiments and the accompanying drawings.
本发明最关键的构思在于:在贴装头的底座上设置可升降的主轴,主轴与底座通过弹簧连接,弹簧的伸缩方向与主轴的轴向相同。The key idea of the present invention is that a liftable main shaft is arranged on the base of the placement head, the main shaft and the base are connected by a spring, and the expansion and contraction direction of the spring is the same as the axial direction of the main shaft.
请参照图1至图5,一种贴装头,包括底座1和多个弹簧2,所述底座1上设有可升降的主轴3,所述主轴3的端部设有吸嘴,所述弹簧2连接所述底座1及所述主轴3,所述弹簧2的伸缩方向与所述主轴3的轴线方向相同。Referring to FIGS. 1 to 5, a mounting head includes a base 1 and a plurality of
本发明的结构原理简述如下:在贴装头的底座1上设置可升降的主轴3,主轴3与底座1通过弹簧2连接,弹簧2的伸缩方向与主轴3的轴向相同,主轴3的端部设有吸嘴,当主轴3处于自由状态时吸嘴对芯片的压力为主轴3受到的重力,随着贴片头向下移动,弹簧2逐渐张紧,进而吸嘴对芯片的压力逐渐增大。The structural principle of the present invention is briefly described as follows: a
从上述描述可知,本发明的有益效果在于:本发明提供的贴装头通过弹簧2对主轴3的控制实现吸嘴对芯片压力的精准控制,提高芯片的贴装精度,同时防止主轴3及吸嘴对芯片产生的压力过大导致芯片损伤。It can be seen from the above description that the beneficial effects of the present invention are: the placement head provided by the present invention realizes the precise control of the pressure of the suction nozzle on the chip through the control of the
进一步的,还包括多个夹持轮4,所述夹持轮4转动设置在所述底座1上,多个所述夹持轮4从不同的方向抵触所述主轴3。Further, a plurality of clamping
由上述描述可知,通过夹持轮4限制主轴3移动的方向,防止主轴3升降过程中在水平方向上产生位移导致设置在主轴3端部的吸嘴偏移,同时夹持轮4与主轴3之间的静摩擦力极小,夹持轮4对主轴3在垂直方向上的运动影响很小,保证了贴装头的精度。It can be seen from the above description that the direction of movement of the
进一步的,所述底座1上设有供所述夹持轮4安装的安装位11,所述安装位11内设有与所述夹持轮4相配合的转轴12。Further, the base 1 is provided with an
进一步的,还包括卡板5,所述卡板5分别抵触所述转轴12的两端,所述卡板5与所述底座1连接。Further, it further includes a
进一步的,还包括设置在所述底座1上的压板6,所述压板6位于所述主轴3远离所述底座1的一侧,所述压板6靠近所述主轴3的一面设有安装座7,所述安装座7上设有所述夹持轮4。Further, it also includes a
由上述描述可知,多个夹持轮4从不同的方向抵触主轴3,确保主轴3升降过程中无水平方向的位移,夹持轮4可转动设置在底座1上,进一步减少了夹持轮4对主轴3垂直方向上的运动的影响。It can be seen from the above description that the plurality of clamping
进一步的,所述主轴3上设有第一弹簧拉杆31和第二弹簧拉杆32,所述弹簧2包括上拉弹簧21和下拉弹簧22,所述第一弹簧拉杆31与所述上拉弹簧21相连,所述第二弹簧拉杆32与所述下压弹簧2相连。Further, the
由上述描述可知,在主轴3上设置与弹簧2相连的弹簧拉杆,通过弹簧2的伸缩带动弹簧拉杆进而带动主轴3在垂直方向上升降,提高对主轴3的位置的控制精度,实现吸嘴对芯片产生的压力的精准控制。It can be seen from the above description that the
进一步的,所述第一弹簧拉杆31及所述第二弹簧拉杆32设置在所述主轴3内,所述主轴3上设有供所述上拉弹簧21伸入的第一通孔33和供所述第二弹簧拉杆32伸出的第二通孔34。Further, the first
由上述描述可知,弹簧拉杆设置在主轴3内,减少了贴标头的整体体积,便于将贴标头安装到机床设备上,同时将主轴3设计为中空的结构,减少主轴3自身的重量,进而减少吸嘴对芯片产生的压力。It can be seen from the above description that the spring pull rod is arranged in the
进一步的,所述底座1上设有与所述上拉弹簧21相连的第三弹簧拉杆13。Further, the base 1 is provided with a third
由上述描述可知,在底座1上设置第三弹簧拉杆13,第三弹簧拉杆13与上拉弹簧21相连,实现对上拉弹簧21的精准控制,进而提高对主轴3的控制精度。It can be seen from the above description that a third
进一步的,所述主轴3上还设有供吸嘴安装的固定孔35及与所述固定孔35连通的进气管8,所述进气管8包括相连通的第一进气管81和第二进气管82,所述第一进气管81远离所述第二进气管82的一端伸入所述主轴3中,所述第二进气管82远离所述第一进气管81的一端设有进气口83。Further, the
由上述描述可知,吸嘴与主轴3端部的固定孔35相连,固定孔35与进气管8相连,进气管8与机床设备上的气动装置相连即可使所述吸嘴吸附芯片,进气管8包括第一进气管81和第二进气管82,第一进气管81伸入主轴3中,第二进气管82与第一进气管81呈一定的角度且第二进气管82的端部设有进气口83,便于进气管8与气动装置连接。It can be seen from the above description that the suction nozzle is connected to the fixing
进一步的,所述底座1还包括底板14,所述底板14上设有触点15,所述触点15朝向远离所述底座1的一侧。Further, the base 1 further includes a
由上述描述可知,在底座1的底板14上设置朝向远离底座1一侧的触点15,当贴装头下降到一定位置时触点15与位于贴装头底部的物体相接触,使贴装头停止下降,避免贴装头在运行过程中与其它物体产生碰撞。It can be seen from the above description that the
实施例一Example 1
请参照图1至图5,本发明的实施例一为:一种贴装头,包括底座1,所述底座1上设有可升降的主轴3,所述底座1上设有连接所述主轴3的弹簧2及抵触所述主轴3的夹持轮4,所述主轴3的下端设有吸嘴,当所述主轴3处于自由状态时,所述吸嘴对芯片产生的压力与所述主轴3受到的重力相等,当所述贴装头向下移动时所述主轴3随之向下移动,所述吸嘴抵触芯片,且所述吸嘴对芯片产生的压力逐渐增大,此时所述弹簧2逐渐张紧,达到精确控制所述吸嘴对芯片的压力的效果,同时避免所述吸嘴对所述芯片的压力过大导致芯片出现暗裂或崩边。Referring to FIGS. 1 to 5 , a first embodiment of the present invention is: a mounting head, comprising a base 1 , the base 1 is provided with a
进一步的,所述底座1上设有多个用于与机床相连的过气管,便于所述贴装头与机床上的气动装置相连,通过设置在机床上的启气动装置驱动所述贴装头上的所述主轴3升降,实现对所述吸嘴的自动控制。Further, the base 1 is provided with a plurality of air passages for connecting with the machine tool, so that the placement head is connected with the pneumatic device on the machine tool, and the placement head is driven by the pneumatic device arranged on the machine tool. The
如图1和图2所示,在本实施例中,所述夹持轮4的数量为五个,五个所述夹持轮4从不同的方向抵触所述主轴3,其中四个所述夹持轮4设置在所述底座1上,所述底座1上设有供所述夹持轮4安装的安装位11,所述安装位11内设有转轴12,所述夹持轮4套设于所述转轴12上使所述夹持轮4可在所述安装位11内转动,所述底座1上还设有与所述底座1相连的卡板5,所述卡板5上设有避让所述夹持轮4的缺口,所述缺口的两端分别抵持所述转轴12将所述夹持轮4限制在所述安装位11内。所述底座1上还设有压板6,所述压板6位于所述主轴3远离所述底座1的一侧,所述压板6靠近所述主轴3的一面上设有安装座7,所述安装座7内设有一所述夹持轮4。通过五个所述夹持轮4抵触所述主轴3以限制所述主轴3在水平方向上的位移,保证所述主轴3在垂直方向上升降时所述吸嘴不会偏移,确保所述贴装头吸附及贴装芯片的精度,同时所述主轴3与所述夹持轮4之间的静摩擦力极小,以减少所述夹持轮4对所述主轴3的升降运动的影响,使所述主轴3升降时的位置能够精确控制,确保所述贴装头的控制精度。As shown in FIG. 1 and FIG. 2 , in this embodiment, the number of the
进一步的,所述底座1的底部设有底板14,所述底板14上设有供触点15安装的孔位,所述触点15朝向远离所述底座1的一端设置,当所述贴装头下降到一定位置时,所述触点15与位于所述贴装头底部的物体触碰使所述贴装头停止下降,避免所述贴装头下降幅度过大导致所述吸嘴对芯片的压力过大或所述底座1与其它物体产生碰撞,使所述贴装头在确保设备安全的范围内活动。优选的,所述孔位内设有包裹所述触点15的绝缘套,使所述触点15稳定设置在所述孔位内,同时减少触点15与其他物体接触时受到的冲击。Further, the bottom of the base 1 is provided with a
如图3和图4所示,所述弹簧2包括上拉弹簧21和下拉弹簧22,所述上拉弹簧21连接所述主轴3垂直方向上的上端与所述底座1,所述下拉弹簧22连接所述主轴3垂直方向上的下端与所述底座1,所述主轴3上设有与所述上拉弹簧21相连的第一弹簧拉杆31及与所述下拉弹簧22相连的第二弹簧拉杆32,可选的,所述底座1上还设有与所述上拉弹簧21相连的第三弹簧拉杆13,所述第三弹簧拉杆13与所述底座1螺接。As shown in FIGS. 3 and 4 , the
进一步的,所述第一弹簧拉杆31及所述第二弹簧拉杆32设置在所述主轴3内,所述主轴3上设有连通的第一通孔33及第二通孔34,所述第一弹簧拉杆31设置在所述第一通孔33内且所述上拉弹簧21伸入所述第一通孔33并与所述第一弹簧拉杆31相连,所述第二弹簧拉杆32设置在所述第二通孔34内且所述第二弹簧拉杆32的头部伸出所述第二弹簧拉杆32并与所述下拉弹簧22相连。所述主轴3设置为中空以降低所述主轴3的整体重量,减少所述主轴3在自由状态下对芯片的压力,同时将所述第一拉杆及所述第二拉杆设置在所述主轴3内,减少所述贴装头的整体体积,利于所述贴装头安装在活动空间较为狭窄的机床上,提高所述贴装头的泛用性。Further, the first
优选的,所述第一弹簧拉杆31设置在所述主轴3的轴线上,进而所述上拉弹簧21与所述主轴3的轴线重合,所述第二弹簧拉杆32与所述第一弹簧拉杆31垂直且相连,所述下拉弹簧22与所述主轴3的轴线平行,以此防止所述上拉弹簧21及所述下拉弹簧22伸缩带动所述主轴3升降时所述主轴3在水平方向上晃动,进一步提高所述主轴3运动时的稳定性,使设置在所述主轴3端部的所述吸嘴能够更准确的吸附到目标芯片。Preferably, the first
请参照图5,所述主轴3的靠近芯片的一端设有供吸嘴安装的固定孔35及与所述固定孔35连通的进气管8,所述进气管8包括连通的第一进气管81及第二进气管82,所述第一进气管81设置在所述主轴3内,所述主轴3上设有供所述所述第一进气管81安装的孔位,所述第二进气管82远离所述第一进气管81一端设有供气动装置相连的进气孔,优选的,所述第一进气管81及第二进气管82呈一定角度设置,便于气动装置与进气管8连接。Please refer to FIG. 5 , one end of the
综上所述,本发明提供的贴装对芯片产生的压力小,能够精确控制吸嘴对芯片产生的压力,避免吸嘴在拾取及贴装芯片过程中芯片产生暗裂或崩边,提高芯片贴装精及芯片贴装质量,贴装头整体安装方便,便于与机床连接。To sum up, the mounting pressure provided by the present invention on the chip is small, the pressure generated by the suction nozzle on the chip can be precisely controlled, the chip is prevented from being cracked or chipped by the suction nozzle during the process of picking up and mounting the chip, and the chip is improved. The placement precision and chip placement quality, the overall installation of the placement head is convenient, and it is easy to connect with the machine tool.
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等同变换,或直接或间接运用在相关的技术领域,均同理包括在本发明的专利保护范围内。The above descriptions are only examples of the present invention, and are not intended to limit the scope of the present invention. Any equivalent transformations made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in related technical fields, are similarly included in the within the scope of patent protection of the present invention.
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