[go: up one dir, main page]

CN111785665A - a mounting head - Google Patents

a mounting head Download PDF

Info

Publication number
CN111785665A
CN111785665A CN202010738685.5A CN202010738685A CN111785665A CN 111785665 A CN111785665 A CN 111785665A CN 202010738685 A CN202010738685 A CN 202010738685A CN 111785665 A CN111785665 A CN 111785665A
Authority
CN
China
Prior art keywords
spring
base
main shaft
spindle
pull rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010738685.5A
Other languages
Chinese (zh)
Other versions
CN111785665B (en
Inventor
张跃春
梁国城
李金龙
罗元明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Original Assignee
ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD filed Critical ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Priority to CN202010738685.5A priority Critical patent/CN111785665B/en
Publication of CN111785665A publication Critical patent/CN111785665A/en
Application granted granted Critical
Publication of CN111785665B publication Critical patent/CN111785665B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)

Abstract

本发明公开了一种贴装头,包括底座和多个弹簧,所述底座上设有可升降的主轴,所述主轴的端部设有吸嘴,所述弹簧连接所述底座及所述主轴,所述弹簧的伸缩方向与所述主轴的轴线方向相同。在贴装头的底座上设置可升降的主轴,主轴与底座通过弹簧连接,弹簧的伸缩方向与主轴的轴向相同,主轴的端部设有吸嘴,当主轴处于自由状态时吸嘴对芯片的压力为主轴受到的重力,随着贴片头向下移动,弹簧逐渐张紧,进而吸嘴对芯片的压力逐渐增大,通过弹簧对主轴的控制,实现吸嘴对芯片压力的精准控制,提高芯片的贴装精度,同时防止主轴及吸嘴对芯片产生的压力过大导致芯片损伤。

Figure 202010738685

The invention discloses a mounting head, comprising a base and a plurality of springs, the base is provided with a main shaft that can be lifted and lowered, the end of the main shaft is provided with a suction nozzle, and the spring is connected to the base and the main shaft , the expansion and contraction direction of the spring is the same as the axis direction of the main shaft. A liftable spindle is set on the base of the placement head. The spindle and the base are connected by a spring. The expansion and contraction direction of the spring is the same as the axial direction of the spindle. The end of the spindle is provided with a suction nozzle. The pressure of the spindle is the gravity of the spindle. As the placement head moves down, the spring is gradually tensioned, and the pressure of the suction nozzle on the chip gradually increases. The mounting accuracy of the chip, and at the same time prevent the chip from being damaged due to excessive pressure on the chip by the spindle and the suction nozzle.

Figure 202010738685

Description

一种贴装头a mounting head

技术领域technical field

本发明涉及半导体封装技术领域,尤其涉及一种贴装头。The present invention relates to the technical field of semiconductor packaging, in particular to a mounting head.

背景技术Background technique

随着半导体电路的小型化、集成化,对高密度立体贴装技术提出了更高的要求。现有的多功能组装系统一般用于将裸芯片自动贴装到基板上,例如将VCSEL芯片按芯片能承受的压力贴装到陶瓷多层基板,GaAs、SiC、GaN等薄且脆的芯片的芯片贴装时对贴装压力的精确控制尤为重要,不当的贴装压力会造成芯片暗裂、崩边等损伤,因此在裸芯片的拾取、贴放过程中精确控制压力是实现VCSEL芯片高质量、高精度贴装的关键。因此,需要一种贴装头实现裸芯片贴装过程中精确的压力控制。With the miniaturization and integration of semiconductor circuits, higher requirements are placed on high-density three-dimensional mounting technology. Existing multi-function assembly systems are generally used to automatically mount bare chips on substrates. For example, VCSEL chips are mounted on ceramic multilayer substrates according to the pressure that the chips can withstand, and thin and brittle chips such as GaAs, SiC, and GaN are mounted. The precise control of the mounting pressure during chip mounting is particularly important. Improper mounting pressure will cause damage such as chip cracks and edge chipping. Therefore, precise control of the pressure during the pick-up and placement process of bare chips is to achieve high quality VCSEL chips. , the key to high-precision placement. Therefore, there is a need for a placement head to achieve precise pressure control during bare chip placement.

发明内容SUMMARY OF THE INVENTION

本发明所要解决的技术问题是:提供一种高精度的贴装头。The technical problem to be solved by the present invention is to provide a high-precision placement head.

为了解决上述技术问题,本发明采用的技术方案为:一种贴装头,包括底座和多个弹簧,所述底座上设有可升降的主轴,所述主轴的端部设有吸嘴,所述弹簧连接所述底座及所述主轴,所述弹簧的伸缩方向与所述主轴的轴线方向相同。In order to solve the above technical problems, the technical solution adopted in the present invention is as follows: a mounting head includes a base and a plurality of springs, the base is provided with a main shaft that can be lifted and lowered, and the end of the main shaft is provided with a suction nozzle, so The spring is connected to the base and the main shaft, and the expansion and contraction direction of the spring is the same as the axial direction of the main shaft.

本发明的有益效果在于:在贴装头的底座上设置可升降的主轴,主轴与底座通过弹簧连接,弹簧的伸缩方向与主轴的轴向相同,主轴的端部设有吸嘴,当主轴处于自由状态时吸嘴对芯片的压力为主轴受到的重力,随着贴片头向下移动,弹簧逐渐张紧,进而吸嘴对芯片的压力逐渐增大,通过弹簧对主轴的控制,实现吸嘴对芯片压力的精准控制,提高芯片的贴装精度,同时防止主轴及吸嘴对芯片产生的压力过大导致芯片损伤。The beneficial effect of the present invention is that a liftable main shaft is arranged on the base of the placement head, the main shaft and the base are connected by a spring, the expansion and contraction direction of the spring is the same as the axial direction of the main shaft, and the end of the main shaft is provided with a suction nozzle. In the free state, the pressure of the suction nozzle on the chip is the gravity of the spindle. As the patch head moves down, the spring is gradually tightened, and then the pressure of the suction nozzle on the chip gradually increases. The precise control of the chip pressure improves the placement accuracy of the chip, and at the same time prevents the chip from being damaged due to excessive pressure on the chip by the spindle and the suction nozzle.

附图说明Description of drawings

图1为本发明实施例一的贴装头的结构示意图;1 is a schematic structural diagram of a placement head according to Embodiment 1 of the present invention;

图2为本发明实施例一的贴装头的正视图;2 is a front view of the placement head according to the first embodiment of the present invention;

图3为本发明实施例一的贴装头的爆炸图;3 is an exploded view of the placement head according to Embodiment 1 of the present invention;

图4为本发明实施例一的贴装头的部分结构示意图;FIG. 4 is a partial structural schematic diagram of the placement head according to the first embodiment of the present invention;

图5为本发明实施例一的贴装头中主轴的结构示意图。FIG. 5 is a schematic structural diagram of a spindle in a placement head according to Embodiment 1 of the present invention.

标号说明:Label description:

1、底座;11、安装位;12、转轴;13、第三弹簧拉杆;14、底板;15、触点;2、弹簧;21、上拉弹簧;22、下拉弹簧;3、主轴;31、第一弹簧拉杆;32、第二弹簧拉杆;33、第一通孔;34、第二通孔;35、固定孔;4、夹持轮;5、卡板;6、压板;7、安装座;8、进气管;81、第一进气管;82、第二进气管;83、进气口。1. Base; 11. Installation position; 12. Rotating shaft; 13. Third spring rod; 14. Bottom plate; 15. Contact; 2. Spring; 21. Pull-up spring; 22. Pull-down spring; 3. Spindle; 31. 32, the second spring rod; 33, the first through hole; 34, the second through hole; 35, the fixing hole; 4, the clamping wheel; 5, the clamping plate; 6, the pressure plate; 7, the mounting seat 8. Intake pipe; 81. First intake pipe; 82. Second intake pipe; 83. Air inlet.

具体实施方式Detailed ways

为详细说明本发明的技术内容、所实现目的及效果,以下结合实施方式并配合附图予以说明。In order to describe in detail the technical content, achieved objects and effects of the present invention, the following descriptions are given with reference to the embodiments and the accompanying drawings.

本发明最关键的构思在于:在贴装头的底座上设置可升降的主轴,主轴与底座通过弹簧连接,弹簧的伸缩方向与主轴的轴向相同。The key idea of the present invention is that a liftable main shaft is arranged on the base of the placement head, the main shaft and the base are connected by a spring, and the expansion and contraction direction of the spring is the same as the axial direction of the main shaft.

请参照图1至图5,一种贴装头,包括底座1和多个弹簧2,所述底座1上设有可升降的主轴3,所述主轴3的端部设有吸嘴,所述弹簧2连接所述底座1及所述主轴3,所述弹簧2的伸缩方向与所述主轴3的轴线方向相同。Referring to FIGS. 1 to 5, a mounting head includes a base 1 and a plurality of springs 2. The base 1 is provided with a main shaft 3 that can be raised and lowered, and the end of the main shaft 3 is provided with a suction nozzle. The spring 2 is connected to the base 1 and the main shaft 3 , and the expansion and contraction direction of the spring 2 is the same as the axial direction of the main shaft 3 .

本发明的结构原理简述如下:在贴装头的底座1上设置可升降的主轴3,主轴3与底座1通过弹簧2连接,弹簧2的伸缩方向与主轴3的轴向相同,主轴3的端部设有吸嘴,当主轴3处于自由状态时吸嘴对芯片的压力为主轴3受到的重力,随着贴片头向下移动,弹簧2逐渐张紧,进而吸嘴对芯片的压力逐渐增大。The structural principle of the present invention is briefly described as follows: a main shaft 3 that can be raised and lowered is set on the base 1 of the placement head, the main shaft 3 and the base 1 are connected by a spring 2, the expansion and contraction direction of the spring 2 is the same as the axial direction of the main shaft 3, and the There is a suction nozzle at the end. When the spindle 3 is in a free state, the pressure of the suction nozzle on the chip is the gravity of the spindle 3. As the patch head moves down, the spring 2 is gradually tightened, and then the pressure of the suction nozzle on the chip gradually increases. big.

从上述描述可知,本发明的有益效果在于:本发明提供的贴装头通过弹簧2对主轴3的控制实现吸嘴对芯片压力的精准控制,提高芯片的贴装精度,同时防止主轴3及吸嘴对芯片产生的压力过大导致芯片损伤。It can be seen from the above description that the beneficial effects of the present invention are: the placement head provided by the present invention realizes the precise control of the pressure of the suction nozzle on the chip through the control of the spindle 3 by the spring 2, improves the placement accuracy of the chip, and prevents the spindle 3 and suction at the same time. Excessive pressure on the chip by the mouth causes chip damage.

进一步的,还包括多个夹持轮4,所述夹持轮4转动设置在所述底座1上,多个所述夹持轮4从不同的方向抵触所述主轴3。Further, a plurality of clamping wheels 4 are also included, the clamping wheels 4 are rotatably arranged on the base 1 , and the plurality of clamping wheels 4 abut the main shaft 3 from different directions.

由上述描述可知,通过夹持轮4限制主轴3移动的方向,防止主轴3升降过程中在水平方向上产生位移导致设置在主轴3端部的吸嘴偏移,同时夹持轮4与主轴3之间的静摩擦力极小,夹持轮4对主轴3在垂直方向上的运动影响很小,保证了贴装头的精度。It can be seen from the above description that the direction of movement of the main shaft 3 is restricted by the clamping wheel 4, so as to prevent the displacement of the main shaft 3 in the horizontal direction during the lifting and lowering of the main shaft 3, resulting in the deflection of the suction nozzle arranged at the end of the main shaft 3. At the same time, the clamping wheel 4 and the main shaft 3 The static friction force between them is extremely small, and the clamping wheel 4 has little influence on the movement of the main shaft 3 in the vertical direction, which ensures the accuracy of the placement head.

进一步的,所述底座1上设有供所述夹持轮4安装的安装位11,所述安装位11内设有与所述夹持轮4相配合的转轴12。Further, the base 1 is provided with an installation position 11 for the clamping wheel 4 to be installed, and the installation position 11 is provided with a rotating shaft 12 matched with the clamping wheel 4 .

进一步的,还包括卡板5,所述卡板5分别抵触所述转轴12的两端,所述卡板5与所述底座1连接。Further, it further includes a clamping plate 5 , the clamping plate 5 respectively abuts both ends of the rotating shaft 12 , and the clamping plate 5 is connected with the base 1 .

进一步的,还包括设置在所述底座1上的压板6,所述压板6位于所述主轴3远离所述底座1的一侧,所述压板6靠近所述主轴3的一面设有安装座7,所述安装座7上设有所述夹持轮4。Further, it also includes a pressure plate 6 arranged on the base 1 , the pressure plate 6 is located on the side of the main shaft 3 away from the base 1 , and a mounting seat 7 is provided on the side of the pressure plate 6 close to the main shaft 3 . , the mounting seat 7 is provided with the clamping wheel 4 .

由上述描述可知,多个夹持轮4从不同的方向抵触主轴3,确保主轴3升降过程中无水平方向的位移,夹持轮4可转动设置在底座1上,进一步减少了夹持轮4对主轴3垂直方向上的运动的影响。It can be seen from the above description that the plurality of clamping wheels 4 contact the main shaft 3 from different directions to ensure that there is no horizontal displacement during the lifting of the main shaft 3, and the clamping wheels 4 can be rotatably arranged on the base 1, which further reduces the number of clamping wheels 4. Influence on the movement of the spindle 3 in the vertical direction.

进一步的,所述主轴3上设有第一弹簧拉杆31和第二弹簧拉杆32,所述弹簧2包括上拉弹簧21和下拉弹簧22,所述第一弹簧拉杆31与所述上拉弹簧21相连,所述第二弹簧拉杆32与所述下压弹簧2相连。Further, the main shaft 3 is provided with a first spring pull rod 31 and a second spring pull rod 32, the spring 2 includes a pull-up spring 21 and a pull-down spring 22, the first spring pull rod 31 and the pull-up spring 21 connected, the second spring pull rod 32 is connected with the pressing spring 2 .

由上述描述可知,在主轴3上设置与弹簧2相连的弹簧拉杆,通过弹簧2的伸缩带动弹簧拉杆进而带动主轴3在垂直方向上升降,提高对主轴3的位置的控制精度,实现吸嘴对芯片产生的压力的精准控制。It can be seen from the above description that the main shaft 3 is provided with a spring tie rod connected to the spring 2, and the spring tie rod is driven by the expansion and contraction of the spring 2 to drive the main shaft 3 to rise and fall in the vertical direction, so as to improve the control accuracy of the position of the main shaft 3 and realize the suction nozzle pairing. Precise control of the pressure generated by the chip.

进一步的,所述第一弹簧拉杆31及所述第二弹簧拉杆32设置在所述主轴3内,所述主轴3上设有供所述上拉弹簧21伸入的第一通孔33和供所述第二弹簧拉杆32伸出的第二通孔34。Further, the first spring pull rod 31 and the second spring pull rod 32 are disposed in the main shaft 3 , and the main shaft 3 is provided with a first through hole 33 for the pull-up spring 21 to extend into and a The second through hole 34 protruding from the second spring pull rod 32 .

由上述描述可知,弹簧拉杆设置在主轴3内,减少了贴标头的整体体积,便于将贴标头安装到机床设备上,同时将主轴3设计为中空的结构,减少主轴3自身的重量,进而减少吸嘴对芯片产生的压力。It can be seen from the above description that the spring pull rod is arranged in the main shaft 3, which reduces the overall volume of the labeling head and facilitates the installation of the labeling head on the machine tool. In turn, the pressure generated by the suction nozzle on the chip is reduced.

进一步的,所述底座1上设有与所述上拉弹簧21相连的第三弹簧拉杆13。Further, the base 1 is provided with a third spring pull rod 13 connected to the pull-up spring 21 .

由上述描述可知,在底座1上设置第三弹簧拉杆13,第三弹簧拉杆13与上拉弹簧21相连,实现对上拉弹簧21的精准控制,进而提高对主轴3的控制精度。It can be seen from the above description that a third spring pull rod 13 is provided on the base 1 , and the third spring pull rod 13 is connected to the pull-up spring 21 to achieve precise control of the pull-up spring 21 , thereby improving the control accuracy of the main shaft 3 .

进一步的,所述主轴3上还设有供吸嘴安装的固定孔35及与所述固定孔35连通的进气管8,所述进气管8包括相连通的第一进气管81和第二进气管82,所述第一进气管81远离所述第二进气管82的一端伸入所述主轴3中,所述第二进气管82远离所述第一进气管81的一端设有进气口83。Further, the main shaft 3 is also provided with a fixing hole 35 for installing the suction nozzle and an air inlet pipe 8 communicating with the fixing hole 35. The air pipe 82, the end of the first air intake pipe 81 away from the second air intake pipe 82 extends into the main shaft 3, and the end of the second air intake pipe 82 away from the first air intake pipe 81 is provided with an air inlet 83.

由上述描述可知,吸嘴与主轴3端部的固定孔35相连,固定孔35与进气管8相连,进气管8与机床设备上的气动装置相连即可使所述吸嘴吸附芯片,进气管8包括第一进气管81和第二进气管82,第一进气管81伸入主轴3中,第二进气管82与第一进气管81呈一定的角度且第二进气管82的端部设有进气口83,便于进气管8与气动装置连接。It can be seen from the above description that the suction nozzle is connected to the fixing hole 35 at the end of the main shaft 3, the fixing hole 35 is connected to the air inlet pipe 8, and the air inlet pipe 8 is connected to the pneumatic device on the machine tool equipment, so that the suction nozzle can adsorb the chip, and the air inlet pipe is connected. 8 includes a first intake pipe 81 and a second intake pipe 82, the first intake pipe 81 extends into the main shaft 3, the second intake pipe 82 and the first intake pipe 81 are at a certain angle, and the end of the second intake pipe 82 is set. There is an air inlet 83, which is convenient for connecting the air inlet pipe 8 with the pneumatic device.

进一步的,所述底座1还包括底板14,所述底板14上设有触点15,所述触点15朝向远离所述底座1的一侧。Further, the base 1 further includes a bottom plate 14 on which a contact 15 is disposed, and the contact 15 faces a side away from the base 1 .

由上述描述可知,在底座1的底板14上设置朝向远离底座1一侧的触点15,当贴装头下降到一定位置时触点15与位于贴装头底部的物体相接触,使贴装头停止下降,避免贴装头在运行过程中与其它物体产生碰撞。It can be seen from the above description that the contact 15 facing the side away from the base 1 is arranged on the bottom plate 14 of the base 1. When the placement head descends to a certain position, the contact 15 is in contact with the object at the bottom of the placement head, so that the placement The head stops descending to avoid the placement head colliding with other objects during operation.

实施例一Example 1

请参照图1至图5,本发明的实施例一为:一种贴装头,包括底座1,所述底座1上设有可升降的主轴3,所述底座1上设有连接所述主轴3的弹簧2及抵触所述主轴3的夹持轮4,所述主轴3的下端设有吸嘴,当所述主轴3处于自由状态时,所述吸嘴对芯片产生的压力与所述主轴3受到的重力相等,当所述贴装头向下移动时所述主轴3随之向下移动,所述吸嘴抵触芯片,且所述吸嘴对芯片产生的压力逐渐增大,此时所述弹簧2逐渐张紧,达到精确控制所述吸嘴对芯片的压力的效果,同时避免所述吸嘴对所述芯片的压力过大导致芯片出现暗裂或崩边。Referring to FIGS. 1 to 5 , a first embodiment of the present invention is: a mounting head, comprising a base 1 , the base 1 is provided with a main shaft 3 that can be lifted and lowered, and the base 1 is provided with a connection to the main shaft The spring 2 of 3 and the clamping wheel 4 against the spindle 3. The lower end of the spindle 3 is provided with a suction nozzle. When the spindle 3 is in a free state, the pressure generated by the suction nozzle on the chip is the same as that of the spindle. The gravitational force received by 3 is equal. When the placement head moves downward, the spindle 3 moves downward, the suction nozzle collides with the chip, and the pressure generated by the suction nozzle on the chip gradually increases. The spring 2 is gradually tensioned, so as to achieve the effect of accurately controlling the pressure of the suction nozzle on the chip, and at the same time prevent the chip from being cracked or chipped due to the excessive pressure of the suction nozzle on the chip.

进一步的,所述底座1上设有多个用于与机床相连的过气管,便于所述贴装头与机床上的气动装置相连,通过设置在机床上的启气动装置驱动所述贴装头上的所述主轴3升降,实现对所述吸嘴的自动控制。Further, the base 1 is provided with a plurality of air passages for connecting with the machine tool, so that the placement head is connected with the pneumatic device on the machine tool, and the placement head is driven by the pneumatic device arranged on the machine tool. The main shaft 3 on the upper part rises and falls to realize the automatic control of the suction nozzle.

如图1和图2所示,在本实施例中,所述夹持轮4的数量为五个,五个所述夹持轮4从不同的方向抵触所述主轴3,其中四个所述夹持轮4设置在所述底座1上,所述底座1上设有供所述夹持轮4安装的安装位11,所述安装位11内设有转轴12,所述夹持轮4套设于所述转轴12上使所述夹持轮4可在所述安装位11内转动,所述底座1上还设有与所述底座1相连的卡板5,所述卡板5上设有避让所述夹持轮4的缺口,所述缺口的两端分别抵持所述转轴12将所述夹持轮4限制在所述安装位11内。所述底座1上还设有压板6,所述压板6位于所述主轴3远离所述底座1的一侧,所述压板6靠近所述主轴3的一面上设有安装座7,所述安装座7内设有一所述夹持轮4。通过五个所述夹持轮4抵触所述主轴3以限制所述主轴3在水平方向上的位移,保证所述主轴3在垂直方向上升降时所述吸嘴不会偏移,确保所述贴装头吸附及贴装芯片的精度,同时所述主轴3与所述夹持轮4之间的静摩擦力极小,以减少所述夹持轮4对所述主轴3的升降运动的影响,使所述主轴3升降时的位置能够精确控制,确保所述贴装头的控制精度。As shown in FIG. 1 and FIG. 2 , in this embodiment, the number of the gripping wheels 4 is five, and the five gripping wheels 4 interfere with the main shaft 3 from different directions, and four of the gripping wheels 4 The clamping wheel 4 is arranged on the base 1, and the base 1 is provided with an installation position 11 for the clamping wheel 4 to be installed. Set on the rotating shaft 12 so that the clamping wheel 4 can be rotated in the installation position 11, the base 1 is also provided with a clamping plate 5 connected to the base 1, and the clamping plate 5 is provided with a clamping plate 5. There is a notch for avoiding the clamping wheel 4 , and both ends of the notch abut against the rotating shaft 12 to restrict the clamping wheel 4 in the installation position 11 . The base 1 is also provided with a pressure plate 6, the pressure plate 6 is located on the side of the main shaft 3 away from the base 1, and a mounting seat 7 is provided on the side of the pressure plate 6 close to the main shaft 3. A said clamping wheel 4 is arranged in the seat 7 . The five clamping wheels 4 abut against the main shaft 3 to limit the displacement of the main shaft 3 in the horizontal direction, so as to ensure that the suction nozzle will not be displaced when the main shaft 3 is raised and lowered in the vertical direction. The precision of the placement head adsorption and placement of chips, and the static friction between the spindle 3 and the clamping wheel 4 is extremely small, so as to reduce the influence of the clamping wheel 4 on the lifting motion of the spindle 3, The position of the main shaft 3 when it is raised and lowered can be precisely controlled to ensure the control accuracy of the placement head.

进一步的,所述底座1的底部设有底板14,所述底板14上设有供触点15安装的孔位,所述触点15朝向远离所述底座1的一端设置,当所述贴装头下降到一定位置时,所述触点15与位于所述贴装头底部的物体触碰使所述贴装头停止下降,避免所述贴装头下降幅度过大导致所述吸嘴对芯片的压力过大或所述底座1与其它物体产生碰撞,使所述贴装头在确保设备安全的范围内活动。优选的,所述孔位内设有包裹所述触点15的绝缘套,使所述触点15稳定设置在所述孔位内,同时减少触点15与其他物体接触时受到的冲击。Further, the bottom of the base 1 is provided with a bottom plate 14 , and the bottom plate 14 is provided with holes for installing the contacts 15 . When the head descends to a certain position, the contact 15 touches the object located at the bottom of the placement head to stop the descending of the placement head, so as to avoid the drop of the placement head being too large and the suction nozzle to the chip If the pressure is too large or the base 1 collides with other objects, the placement head moves within a range that ensures the safety of the equipment. Preferably, an insulating sleeve wrapping the contacts 15 is arranged in the holes, so that the contacts 15 are stably arranged in the holes and at the same time reduce the impact when the contacts 15 are in contact with other objects.

如图3和图4所示,所述弹簧2包括上拉弹簧21和下拉弹簧22,所述上拉弹簧21连接所述主轴3垂直方向上的上端与所述底座1,所述下拉弹簧22连接所述主轴3垂直方向上的下端与所述底座1,所述主轴3上设有与所述上拉弹簧21相连的第一弹簧拉杆31及与所述下拉弹簧22相连的第二弹簧拉杆32,可选的,所述底座1上还设有与所述上拉弹簧21相连的第三弹簧拉杆13,所述第三弹簧拉杆13与所述底座1螺接。As shown in FIGS. 3 and 4 , the spring 2 includes a pull-up spring 21 and a pull-down spring 22 . The pull-up spring 21 connects the upper end of the main shaft 3 in the vertical direction with the base 1 , and the pull-down spring 22 Connect the lower end of the main shaft 3 in the vertical direction with the base 1 , the main shaft 3 is provided with a first spring pull rod 31 connected with the upper pull spring 21 and a second spring pull rod connected with the pull down spring 22 32. Optionally, the base 1 is further provided with a third spring pull rod 13 connected to the pull-up spring 21 , and the third spring pull rod 13 is screwed to the base 1 .

进一步的,所述第一弹簧拉杆31及所述第二弹簧拉杆32设置在所述主轴3内,所述主轴3上设有连通的第一通孔33及第二通孔34,所述第一弹簧拉杆31设置在所述第一通孔33内且所述上拉弹簧21伸入所述第一通孔33并与所述第一弹簧拉杆31相连,所述第二弹簧拉杆32设置在所述第二通孔34内且所述第二弹簧拉杆32的头部伸出所述第二弹簧拉杆32并与所述下拉弹簧22相连。所述主轴3设置为中空以降低所述主轴3的整体重量,减少所述主轴3在自由状态下对芯片的压力,同时将所述第一拉杆及所述第二拉杆设置在所述主轴3内,减少所述贴装头的整体体积,利于所述贴装头安装在活动空间较为狭窄的机床上,提高所述贴装头的泛用性。Further, the first spring pull rod 31 and the second spring pull rod 32 are arranged in the main shaft 3, and the main shaft 3 is provided with a first through hole 33 and a second through hole 34 that communicate with each other. A spring pull rod 31 is disposed in the first through hole 33 and the pull-up spring 21 extends into the first through hole 33 and is connected to the first spring pull rod 31 , and the second spring pull rod 32 is disposed at Inside the second through hole 34 and the head of the second spring pull rod 32 extends out of the second spring pull rod 32 and is connected to the pull-down spring 22 . The main shaft 3 is set to be hollow to reduce the overall weight of the main shaft 3 and reduce the pressure of the main shaft 3 on the chip in a free state. At the same time, the first pull rod and the second pull rod are arranged on the main shaft 3 In this case, the overall volume of the placement head is reduced, which facilitates the placement of the placement head on a machine tool with a relatively narrow moving space, and improves the versatility of the placement head.

优选的,所述第一弹簧拉杆31设置在所述主轴3的轴线上,进而所述上拉弹簧21与所述主轴3的轴线重合,所述第二弹簧拉杆32与所述第一弹簧拉杆31垂直且相连,所述下拉弹簧22与所述主轴3的轴线平行,以此防止所述上拉弹簧21及所述下拉弹簧22伸缩带动所述主轴3升降时所述主轴3在水平方向上晃动,进一步提高所述主轴3运动时的稳定性,使设置在所述主轴3端部的所述吸嘴能够更准确的吸附到目标芯片。Preferably, the first spring pull rod 31 is arranged on the axis of the main shaft 3 , and then the upper spring 21 and the axis of the main shaft 3 coincide, and the second spring pull rod 32 and the first spring pull rod 31 is vertical and connected, the pull-down spring 22 is parallel to the axis of the main shaft 3, so as to prevent the pull-up spring 21 and the pull-down spring 22 from extending and retracting to drive the main shaft 3 to lift and lower the main shaft 3 in the horizontal direction The shaking further improves the stability of the spindle 3 when it moves, so that the suction nozzle disposed at the end of the spindle 3 can be more accurately adsorbed to the target chip.

请参照图5,所述主轴3的靠近芯片的一端设有供吸嘴安装的固定孔35及与所述固定孔35连通的进气管8,所述进气管8包括连通的第一进气管81及第二进气管82,所述第一进气管81设置在所述主轴3内,所述主轴3上设有供所述所述第一进气管81安装的孔位,所述第二进气管82远离所述第一进气管81一端设有供气动装置相连的进气孔,优选的,所述第一进气管81及第二进气管82呈一定角度设置,便于气动装置与进气管8连接。Please refer to FIG. 5 , one end of the spindle 3 close to the chip is provided with a fixing hole 35 for installing the suction nozzle and an air intake pipe 8 communicating with the fixing hole 35 , and the air intake pipe 8 includes a first air intake pipe 81 that communicates with each other. and the second intake pipe 82, the first intake pipe 81 is arranged in the main shaft 3, the main shaft 3 is provided with a hole for the installation of the first intake pipe 81, the second intake pipe 82 One end away from the first intake pipe 81 is provided with an intake hole for connecting the pneumatic device. Preferably, the first intake pipe 81 and the second intake pipe 82 are arranged at a certain angle to facilitate the connection between the pneumatic device and the intake pipe 8. .

综上所述,本发明提供的贴装对芯片产生的压力小,能够精确控制吸嘴对芯片产生的压力,避免吸嘴在拾取及贴装芯片过程中芯片产生暗裂或崩边,提高芯片贴装精及芯片贴装质量,贴装头整体安装方便,便于与机床连接。To sum up, the mounting pressure provided by the present invention on the chip is small, the pressure generated by the suction nozzle on the chip can be precisely controlled, the chip is prevented from being cracked or chipped by the suction nozzle during the process of picking up and mounting the chip, and the chip is improved. The placement precision and chip placement quality, the overall installation of the placement head is convenient, and it is easy to connect with the machine tool.

以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等同变换,或直接或间接运用在相关的技术领域,均同理包括在本发明的专利保护范围内。The above descriptions are only examples of the present invention, and are not intended to limit the scope of the present invention. Any equivalent transformations made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in related technical fields, are similarly included in the within the scope of patent protection of the present invention.

Claims (10)

1. A mounting head, characterized in that: the lifting type spindle comprises a base and a plurality of springs, wherein a lifting spindle is arranged on the base, a suction nozzle is arranged at the end part of the spindle, the springs are connected with the base and the spindle, and the extension direction of the springs is the same as the axis direction of the spindle.
2. The head according to claim 1, wherein: still include a plurality of centre gripping wheels, the centre gripping wheel rotates to be set up on the base, and is a plurality of the centre gripping wheel is contradicted from different directions the main shaft.
3. The head according to claim 2, wherein: the base is provided with an installation position for installing the clamping wheel, and a rotating shaft matched with the clamping wheel is arranged in the installation position.
4. The head according to claim 3, wherein: the clamping plates are respectively abutted against two ends of the rotating shaft and are connected with the base.
5. The head according to claim 2, wherein: the clamping device is characterized by further comprising a pressing plate arranged on the base, the pressing plate is located on one side, away from the base, of the main shaft, a mounting seat is arranged on one side, close to the main shaft, of the pressing plate, and the clamping wheel is arranged on the mounting seat.
6. The head according to claim 1, wherein: the spindle is provided with a first spring pull rod and a second spring pull rod, the springs comprise an upward pull spring and a downward pull spring, the first spring pull rod is connected with the upward pull spring, and the second spring pull rod is connected with the downward pressing spring.
7. The head according to claim 6, wherein: the first spring pull rod and the second spring pull rod are arranged in the main shaft, and a first through hole for the upper pull spring to stretch into and a second through hole for the second spring pull rod to stretch out are formed in the main shaft.
8. The head according to claim 6, wherein: and a third spring pull rod connected with the pull-up spring is arranged on the base.
9. The head according to claim 1, wherein: the main shaft is further provided with a fixing hole for installing the suction nozzle and an air inlet pipe communicated with the fixing hole, the air inlet pipe comprises a first air inlet pipe and a second air inlet pipe which are communicated, the first air inlet pipe is far away from one end of the second air inlet pipe and extends into the main shaft, and the second air inlet pipe is far away from one end of the first air inlet pipe and is provided with an air inlet.
10. The head according to claim 1, wherein: the base further comprises a bottom plate, a contact is arranged on the bottom plate, and the contact faces to one side far away from the base.
CN202010738685.5A 2020-07-28 2020-07-28 A mounting head Active CN111785665B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010738685.5A CN111785665B (en) 2020-07-28 2020-07-28 A mounting head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010738685.5A CN111785665B (en) 2020-07-28 2020-07-28 A mounting head

Publications (2)

Publication Number Publication Date
CN111785665A true CN111785665A (en) 2020-10-16
CN111785665B CN111785665B (en) 2025-04-15

Family

ID=72766057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010738685.5A Active CN111785665B (en) 2020-07-28 2020-07-28 A mounting head

Country Status (1)

Country Link
CN (1) CN111785665B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115334866A (en) * 2022-09-02 2022-11-11 四川华平通讯设备有限公司 Accurate flexible subsides of chip adjustable pressure pastes dress equipment for circuit motherboard
CN116344432A (en) * 2023-04-06 2023-06-27 苏州联讯仪器股份有限公司 Chip pick-and-place mechanism and chip testing machine
WO2024179073A1 (en) * 2023-03-01 2024-09-06 苏州联讯仪器股份有限公司 Chip moving device
WO2025035644A1 (en) * 2023-08-11 2025-02-20 苏州联讯仪器股份有限公司 Turret sorting machine for chips

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012874A (en) * 1988-03-04 1991-05-07 Mydata Automation Ab Movable tool head for mounting machines and a rotatable, axially movable shaft therefor
KR940018691U (en) * 1992-12-29 1994-07-30 대우중공업 주식회사 Chip Centering Shock Absorber of Chip Mounting Head
US5336357A (en) * 1993-03-12 1994-08-09 Quantum Materials, Inc. Manually operable die attach apparatus
JP2000006095A (en) * 1998-06-22 2000-01-11 Howa Mach Ltd Substrate retainer for printed circuit board processing machine
US6154954A (en) * 1996-07-25 2000-12-05 Sanyo Electric Co., Ltd. Electronic component-mounting apparatus and mounting head device therefor
CN1533239A (en) * 2003-03-26 2004-09-29 广州市羊城科技实业有限公司 Integrated adhesive head of sheet adhesive machine
JP2009135175A (en) * 2007-11-29 2009-06-18 Panasonic Corp Mounting head for component mounting equipment
WO2014080473A1 (en) * 2012-11-21 2014-05-30 富士機械製造株式会社 Electronic-circuit-component-mounting head
CN212676223U (en) * 2020-07-28 2021-03-09 先进光电器材(深圳)有限公司 Mounting head

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012874A (en) * 1988-03-04 1991-05-07 Mydata Automation Ab Movable tool head for mounting machines and a rotatable, axially movable shaft therefor
KR940018691U (en) * 1992-12-29 1994-07-30 대우중공업 주식회사 Chip Centering Shock Absorber of Chip Mounting Head
US5336357A (en) * 1993-03-12 1994-08-09 Quantum Materials, Inc. Manually operable die attach apparatus
US6154954A (en) * 1996-07-25 2000-12-05 Sanyo Electric Co., Ltd. Electronic component-mounting apparatus and mounting head device therefor
JP2000006095A (en) * 1998-06-22 2000-01-11 Howa Mach Ltd Substrate retainer for printed circuit board processing machine
CN1533239A (en) * 2003-03-26 2004-09-29 广州市羊城科技实业有限公司 Integrated adhesive head of sheet adhesive machine
JP2009135175A (en) * 2007-11-29 2009-06-18 Panasonic Corp Mounting head for component mounting equipment
WO2014080473A1 (en) * 2012-11-21 2014-05-30 富士機械製造株式会社 Electronic-circuit-component-mounting head
CN212676223U (en) * 2020-07-28 2021-03-09 先进光电器材(深圳)有限公司 Mounting head

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115334866A (en) * 2022-09-02 2022-11-11 四川华平通讯设备有限公司 Accurate flexible subsides of chip adjustable pressure pastes dress equipment for circuit motherboard
CN115334866B (en) * 2022-09-02 2023-08-11 四川华平通讯设备有限公司 Accurate flexible subsides of chip adjustable pressure is installed equipment for circuit motherboard
WO2024179073A1 (en) * 2023-03-01 2024-09-06 苏州联讯仪器股份有限公司 Chip moving device
US12235316B2 (en) 2023-03-01 2025-02-25 Semight Instruments Co., Ltd Chip moving device
CN116344432A (en) * 2023-04-06 2023-06-27 苏州联讯仪器股份有限公司 Chip pick-and-place mechanism and chip testing machine
WO2025035644A1 (en) * 2023-08-11 2025-02-20 苏州联讯仪器股份有限公司 Turret sorting machine for chips

Also Published As

Publication number Publication date
CN111785665B (en) 2025-04-15

Similar Documents

Publication Publication Date Title
CN111785665A (en) a mounting head
CN101710565B (en) Device for picking up and flipping chips
KR101142346B1 (en) Vacuum suction head, and vacuum suction device and table using the same
US6805616B2 (en) Wafer planarization apparatus and planarization method thereof
CN109588039B (en) Rotatory first mechanism of paster
CN108393909A (en) Thin plate transmission manipulator with dedusting function and its component
US20070084901A1 (en) Lightweight bondhead assembly
CN117542777B (en) High-speed high-precision carrying device
KR100995845B1 (en) Vacuum adhesion transfer apparatus for semiconductor chip sorter
CN212676223U (en) Mounting head
CN108305849B (en) A device for aligning a chip and a mounting substrate and a method for aligning and installing
CN111252545B (en) Vacuum suction device for logistics objects
CN209038505U (en) A turning mechanism applied to automatic detection
JP3132496B2 (en) Die bonding equipment
KR101355860B1 (en) Sucker
CN216271927U (en) Transfer mechanism capable of sucking on planes at different angles
CN116469825A (en) A swing-arm force-controllable die-bonding system and a force-controllable die-bonding method
JP2770084B2 (en) Nut lift-up device
CN205333766U (en) Separate probe module and electronic component testing equipment with separate probe module
CN114883236A (en) Multi-specification wafer box conversion device
CN103617961B (en) Transfer semiconductor chip sucking disc mechanism
CN219652183U (en) Material taking mechanism and chip substrate material taking device
CN210126908U (en) Vacuum suction device for logistics objects
CN221977896U (en) Wafer inspection platform
KR20040082528A (en) Picker for transferring semiconductor chip package

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant