CN111777954A - Epoxy glue and application thereof - Google Patents
Epoxy glue and application thereof Download PDFInfo
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- CN111777954A CN111777954A CN201910273014.3A CN201910273014A CN111777954A CN 111777954 A CN111777954 A CN 111777954A CN 201910273014 A CN201910273014 A CN 201910273014A CN 111777954 A CN111777954 A CN 111777954A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an epoxy adhesive and application thereof. The epoxy glue comprises: the curing agent comprises a component A and a component B, wherein the component A comprises epoxy resin and a curing speed improver, and the curing speed improver is an acrylate functional compound; the component B comprises an amine curing agent. The curing speed improver (acrylate functional compound) can react with the amine curing agent, the speed of the curing speed improver is faster than that of the curing reaction of the epoxy group in the epoxy resin and the curing agent, and meanwhile, the curing speed improver can emit heat in the reaction process of the amine curing agent and the curing agent, so that the reaction speed of the epoxy group in the epoxy resin and the curing agent can be further accelerated. Therefore, the addition of the curing speed improver can effectively improve the curing speed of the epoxy adhesive, further improve the strength improvement speed of the cured epoxy adhesive, and simultaneously avoid excessive influence on the toughness of the adhesive, so that the adhesive becomes brittle.
Description
Technical Field
The invention relates to the field of epoxy glue, in particular to epoxy glue and application thereof.
Background
The epoxy glue has wide application, and one of the wide application is used as the bar-planting glue. The bar planting adhesive has the characteristics of high bonding strength, being embedded, small shrinkage in the normal-temperature curing and hardening processes, good temperature resistance, good durability and weather resistance, good aging resistance and medium (acid, alkali and water) resistance, excellent toughness and impact resistance after curing, no volatile solvent, no toxicity, environmental protection, convenient construction and the like, and can be welded after bar embedding. Meanwhile, the bar planting glue is widely applied to embedding of steel bars and screw rods in various building structures, reinforcing and strengthening of the building structures, fixing of bar planting of building structure frames and shear walls and various equipment foundations, such as reinforcing of railways, highways, bridges and water conservancy reconstruction and extension projects and the like.
In order to ensure the operation safety of the high-speed railway, the three layers of the high-speed railway track slab, the mortar layer and the roadbed need to be reinforced by using the bar planting glue on the high-speed railway currently operated in China. Because the bar planting glue is used for reinforcing the high-speed railway in operation at present, the construction must be carried out when the high-speed railway is stopped. Generally, the construction time is only about 4-5 hours, so the bar-planting glue is required to have a fast strength improvement speed. At present, a mercaptan system is often used for improving the curing speed of epoxy glue, but the mercaptan system has the disadvantages of strong smell, acid and alkali resistance and poor environment resistance, and the bar-planting glue is often used outdoors and cannot meet the application requirement of the mercaptan system after being blown by wind and sun for a long time.
Disclosure of Invention
The invention mainly aims to provide an epoxy adhesive and application thereof, and aims to solve the problem that the curing strength of the existing epoxy adhesive is increased at a low speed.
In order to achieve the above object, according to one aspect of the present invention, there is provided an epoxy glue including: the curing agent comprises a component A and a component B, wherein the component A comprises epoxy resin and a curing speed improver, and the curing speed improver is an acrylate functional compound; the component B comprises an amine curing agent.
Further, the epoxy adhesive comprises 5-10 parts by weight of a curing speed improver, wherein the curing speed improver is an acrylate functional compound with the molecular weight of less than or equal to 500; more preferably, the curing speed enhancer may be enumerated by one or more of hexanediol diacrylate, pentaerythritol trimethacrylate, tripropylene glycol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, and tricyclodecane dimethanol diacrylate.
Further, the epoxy glue comprises 40-60 parts by weight of epoxy resin, preferably the epoxy resin is a mixture of bisphenol F and polyurethane modified epoxy resin, and more preferably the amount of the polyurethane modified epoxy resin is 20-40% in percentage by weight of the epoxy resin.
Further, the component A also comprises a first toughening agent, preferably, the first toughening agent is a polyether modified compound and/or an organosilicon core-shell particle toughening agent; preferably, the component A comprises 12.5-8 parts by weight of polyether modified compound and 25.0-10 parts by weight of organosilicon core-shell particle toughening agent.
Further, the component A also comprises one or more of a diluent, a coupling agent, a first filler and a first thixotropic agent; preferably, the component A comprises 3.0-8.0 parts by weight of diluent, 1-8 parts by weight of coupling agent, 30-50 parts by weight of first filler and 3-8 parts by weight of first thixotropic agent.
Further, the amine curing agent is alicyclic amine curing agent and/or aliphatic amine curing agent; preferably, the amine curing agent comprises 20.0-30.0 parts by weight of alicyclic amine curing agent and 20.0-30.0 parts by weight of aliphatic amine curing agent.
Further, the alicyclic amine curing agent is m-xylylenediamine and/or 1, 3-cyclohexyldimethylamine.
Further, the component B also comprises a second toughening agent, preferably, the second toughening agent is a polyether modified compound and/or an organosilicon core-shell particle toughening agent; preferably, the component B comprises 12.5-8 parts by weight of polyether modified compound and 25.0-10 parts by weight of organosilicon core-shell particle toughening agent.
Further, the component B comprises one or more of an accelerator, a second filler, a second thixotropic agent and a rheological aid; preferably, the component B comprises 1.0-5.0 parts of an accelerator, 40.0-50.0 parts of a second filler, 2.0-5.0 parts of a second thixotropic agent and 0.1-0.5 part of a rheological additive in parts by weight.
The application also provides an application of the epoxy glue as a bar planting glue in the field of high-speed railways.
By applying the technical scheme of the invention, the curing speed improver (acrylate functional compound) can react with the amine curing agent, the speed of the curing speed improver is faster than that of the curing reaction of the epoxy group in the epoxy resin and the curing agent, and simultaneously, the curing speed improver can release heat in the reaction process of the amine curing agent and the curing agent, so that the reaction speed of the epoxy group in the epoxy resin and the curing agent can be further accelerated. Therefore, the addition of the curing speed improver can effectively improve the curing speed of the epoxy adhesive, further improve the strength improving speed of the cured epoxy adhesive, and simultaneously can not influence the toughness of the adhesive too much, so that the adhesive becomes brittle. On the basis, the epoxy adhesive with the components can rapidly improve the shear strength, the compressive strength and the bending strength in a short time, and a cured product of the epoxy adhesive also has excellent toughness, strength and impact resistance.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
As described in the background art, the conventional epoxy adhesive has the problems of slow curing strength improvement speed and poor reinforcing effect. In order to solve the above technical problem, the present application provides an epoxy adhesive, including: the curing agent comprises a component A and a component B, wherein the component A comprises epoxy resin and a curing speed improver, and the curing speed improver is an acrylate functional compound; the component B comprises an amine curing agent.
The curing speed improver (acrylate functional compound) can react with the amine curing agent, the speed of the curing speed improver is faster than that of the curing reaction of the epoxy group in the epoxy resin and the curing agent, and meanwhile, the curing speed improver can emit heat in the reaction process of the amine curing agent and the curing agent, so that the reaction speed of the epoxy group in the epoxy resin and the curing agent can be further accelerated. Therefore, the addition of the curing speed improver can effectively improve the curing speed of the epoxy adhesive, further improve the strength improvement speed of the cured epoxy adhesive, and simultaneously avoid excessive influence on the toughness of the adhesive, so that the adhesive becomes brittle. On the basis, the epoxy adhesive with the components can rapidly improve the shear strength, the compressive strength and the bending strength in a short time, and a cured product of the epoxy adhesive also has excellent toughness, strength and impact resistance.
The epoxy adhesive with the composition can rapidly improve the shear strength, the compressive strength and the bending strength in a short time. In order to further improve the reactivity of the curing speed improver and the amine curing agent, the epoxy glue preferably comprises 5 to 10 parts by weight of the curing speed improver.
In a preferred embodiment, the cure rate enhancer is an acrylate functional compound having a molecular weight of 500 or less. More preferably, the curing speed enhancer may be enumerated by one or more of hexanediol diacrylate, pentaerythritol trimethacrylate, tripropylene glycol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, and tricyclodecane dimethanol diacrylate. The organic matters have higher reactivity, so that the strength improvement efficiency of the epoxy adhesive is further improved by adopting the organic matters as the curing speed improver.
The epoxy resin may be of a kind commonly used in the art. The epoxy glue comprises 40-60 parts by weight of epoxy resin. The addition of the polyurethane modified epoxy resin is beneficial to improving the toughness of the epoxy adhesive, and in order to further improve the comprehensive performance of the epoxy adhesive, in a preferred embodiment, the epoxy resin is a mixture of bisphenol F epoxy resin and polyurethane modified epoxy resin. The addition of the bisphenol F epoxy resin can improve the strength of the epoxy adhesive, and the addition of the polyurethane modified epoxy resin can improve the toughness of molecular chain segments of the epoxy resin and improve the comprehensive properties of the adhesive, such as vibration resistance, impact resistance and the like. More preferably, the amount of the polyurethane modified epoxy resin is 20-40% of the percentage of the epoxy resin. The urethane-modified epoxy resin is commercially available, and for example, UA10 product of CVC, or ERS-105 product of Shanghai-Zhongshi industries, Inc. can be used.
In order to improve the toughness of the epoxy glue, in a preferred embodiment, the A component further comprises a first toughening agent, and the B component further comprises a second toughening agent. Preferably, the first toughening agent and the second toughening agent are each independently selected from a polyether modified compound and/or a silicone core shell particle toughening agent.
The polyether modified compound is a long-chain linear molecule, the structure of the polyether modified compound contains a polyether compound with a hydroxyl functional group, the viscosity is low, the toughening agent is added into an epoxy colloid system, the proportion of an etherate network structure in a cured product crosslinking network structure is favorably improved, the cracking resistance, the vibration resistance and the cold and hot shock resistance of a cured product can be improved, the viscosity of a resin system can be reduced, and the process performance is improved. The organic silicon core-shell particle toughening agent has a soft and elastic crosslinked organic silicon core and an organic polymer hard shell, and the addition of the toughening agent in an epoxy colloid system is beneficial to obviously improving the impact toughness of epoxy resin formed after curing, and hardly influences the mechanical strength and the high temperature resistance stability of the epoxy resin.
More preferably, the component A also comprises 12.5-8 parts by weight of polyether modified compound and 25.0-10 parts by weight of organosilicon core-shell particle toughening agent; the component B also comprises 12.5-8 parts by weight of polyether modified compound and 25.0-10 parts by weight of organosilicon core-shell particle toughening agent. The compositions of the first toughening agent and the second toughening agent include, but are not limited to, the above ranges, and the limitation of the compositions within the above ranges is beneficial for improving the toughness and mechanical strength of the epoxy cured product, and at the same time, the viscosity of the system can be properly reduced.
Polyether modification compounds include, but are not limited to, Shijiazhuangliding LD410 products, or the composite 164 products from the Chen desk world; the organosilicon core-shell particle toughener includes but is not limited to Wacker company P52 product, Wacker, Germany, or the winning 2240A product.
In order to further improve the comprehensive performance of the epoxy glue, the A component can be added with some additives, such as one or more of a diluent, a coupling agent, a first filler, a first thixotropic agent and the like. In order to better improve the comprehensive performance, preferably, the component A further comprises 3.0-8.0 parts of a diluent, 1-8 parts of a coupling agent, 30-50 parts of a first filler and 3-8 parts of a first thixotropic agent in parts by weight.
In the epoxy glue, the coupling agent can be selected from the types commonly used in the field. In a preferred embodiment, the coupling agent includes, but is not limited to, gamma-glycidoxypropylmethyldiethoxysilane and/or gamma- (2, 3-glycidoxy) propyltrimethoxysilane. The coupling agent gamma-glycidoxypropylmethyldiethoxysilane added to component A is commercially available as the product of Wetlink78, Miyao, or Dow Corning Z-60424.
In the epoxy adhesive, amine curing agents commonly used in the art can be used as the amine curing agent. In a preferred embodiment, the amine curing agent is the alicyclic amine curing agent and/or the aliphatic amine curing agent. In order to further improve the curing rate of the epoxy glue, more preferably, the amine curing agent comprises 20.0-30.0 parts by weight of alicyclic amine curing agent and 20.0-30.0 parts by weight of aliphatic amine curing agent. Alicyclic amine curing agents include, but are not limited to, m-xylylenediamine and/or 1, 3-cyclohexyldimethylamine. Meanwhile, the alicyclic amine curing agent may be a modified curing agent of m-xylylenediamine and/or a modified curing agent of 1, 3-cyclohexyldimethylamine. The modified curing agent of m-xylylenediamine is a product obtained by modification reaction such as substitution of some atoms or functional groups in m-xylylenediamine as a core skeleton. The modified curing agent of 1, 3-cyclohexyldimethylamine is explained above. The modified aliphatic amine curing agent comprises but is not limited to Ancamine2636 and 593 curing agents in the air chemical industry or Corning I-70 curing agents.
In order to further improve the comprehensive performance of the epoxy glue, the component B comprises one or more of an accelerator, a second filler, a second thixotropic agent and a rheological additive. More preferably, the component B comprises 1.0-5.0 parts of an accelerant, 40.0-50.0 parts of a second filler, 2.0-5.0 parts of a second thixotropic agent and 0.1-0.5 part of a rheological additive in parts by weight.
The first filler, second filler, first thixotropic agent, second thixotropic agent, accelerator, rheology aid, etc. used herein may be any of those commonly used in the art. Such as epoxy accelerators and the like.
In order to further improve the comprehensive performance of the epoxy adhesive, the weight ratio of the component A to the component B is preferably (1-4): 1, and preferably 2: 1. The use amount ratio of the component A and the component B in the epoxy glue is limited in the range, so that the comprehensive properties of the epoxy glue, such as high shear strength, compressive strength, bending strength, toughness and the like, can be further improved, and the effect of quickly improving the strength of the epoxy glue in a short time can be realized.
The application on the other hand still provides the application of above-mentioned epoxy glue as the bar planting glue in the high-speed railway field.
The invention is beneficial to improving the comprehensive properties of the epoxy adhesive, such as high shear strength, compressive strength, bending strength, toughness and the like, and realizes the effect of quickly improving the strength of the epoxy adhesive in a short time. The high-speed rail steel bar-planting adhesive can be applied to the field of high-speed rails to rapidly improve the strength of the steel bar-planting adhesive in a short time, the shear strength can reach 90% of the final strength, the compressive strength and the bending strength are high, the room-temperature curing time can reach 90% of the final strength after 24h, and all index performances meet the requirements of safety identification technical specification GB 50728-plus 2011 on A-grade adhesive of engineering structure reinforcing materials, and the high-speed rail steel bar-planting adhesive is suitable for anchoring high-speed rails.
The invention also provides a preferable method for preparing the epoxy adhesive for the high-speed rail, which comprises the following specific steps:
the preparation method of the component A comprises the following steps:
(1) drying the filler on a dryer for 2 hours at 120 ℃ in advance, and then cooling to room temperature for later use;
(2) under the condition of normal temperature, firstly adding mixed epoxy resin, a first toughening agent, a second toughening agent, a diluent, a curing speed improver and a coupling agent into a dispersion kettle in proportion, stirring for 15min, and keeping the vacuum degree at 0.090-0.095 MPa;
(3) then adding the filler in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(4) then adding a thixotropic agent in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(5) cleaning stirring teeth and kettle wall, stirring for 10min, discharging and packaging;
the preparation method of the component B comprises the following steps:
(1) at normal temperature, firstly adding alicyclic amine curing agent, aliphatic amine curing agent, epoxy accelerator and toughening agent in proportion into a dispersion kettle, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(2) then adding the filler in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(3) then adding a thixotropic agent and a rheological additive in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(4) cleaning stirring teeth and kettle wall, stirring for 10min, discharging and packaging;
a, B according to the weight ratio A of two components: b is 2:1, mixing uniformly.
The present application is described in further detail below with reference to specific examples, which should not be construed as limiting the scope of the invention as claimed.
The names and manufacturers of the raw materials used in examples 1 to 11 and comparative example 1 are shown in Table 1.
TABLE 1
Example 1
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 24 parts of bisphenol F type oxygen resin, 16 parts of UA10, 2.5 parts of LD410, 10 parts of 2240A, 3 parts of diluent, 5 parts of hexanediol diacrylate, 1 part of Wetlink78, 30 parts of first filler and 3 parts of first thixotropic agent; the component B comprises 20 parts of alicyclic amine curing agent, 30 parts of aliphatic amine curing agent, 1 part of accelerator, 40 parts of second filler, 2 parts of second thixotropic agent and 0.1 part of rheological additive.
Example 2
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 36 parts of bisphenol F type oxygen resin, 24 parts of UA10, 8 parts of LD410, 2.5 parts of 2240A, 8 parts of diluent, 10 parts of hexanediol diacrylate, 8 parts of Wetlink78, 50 parts of first filler and 8 parts of first thixotropic agent; the component B comprises 30 parts of alicyclic amine curing agent, 20 parts of aliphatic amine curing agent, 5 parts of accelerator, 50 parts of second filler, 5 parts of second thixotropic agent and 0.5 part of rheological additive.
Example 3
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 30 parts of bisphenol F type oxygen resin, 20 parts of SN9782, 5 parts of LD410, 6 parts of 2240A, 5 parts of diluent, 6 parts of pentaerythritol trimethacrylate, 6 parts of Wetlink78, 40 parts of first filler and 5 parts of first thixotropic agent; the component B comprises 25 parts of alicyclic amine curing agent, 25 parts of aliphatic amine curing agent, 3 parts of accelerator, 45 parts of second filler, 3 parts of second thixotropic agent and 0.3 part of rheological additive.
Example 4
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 40 parts of bisphenol F type oxygen resin, 10 parts of UA10, 5 parts of LD410, 6 parts of 2240A, 5 parts of diluent, 6 parts of pentaerythritol trimethacrylate, 6 parts of Wetlink78, 40 parts of first filler and 5 parts of first thixotropic agent; the component B comprises 25 parts of alicyclic amine curing agent, 25 parts of aliphatic amine curing agent, 3 parts of accelerator, 45 parts of second filler, 3 parts of second thixotropic agent and 0.3 part of rheological additive.
Example 5
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 32 parts of bisphenol F type oxygen resin, 8 parts of UA10, 2.5 parts of LD410, 10 parts of 2240A, 3 parts of diluent, 5 parts of hexanediol diacrylate, 1 part of Wetlink78, 30 parts of first filler and 3 parts of first thixotropic agent; the component B comprises 20 parts of alicyclic amine curing agent, 30 parts of aliphatic amine curing agent, 1 part of accelerator, 40 parts of second filler, 2 parts of second thixotropic agent and 0.1 part of rheological additive.
Example 6
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 48 parts of bisphenol F type oxygen resin, 12 parts of SN9782, 8 parts of LD410, 2.5 parts of 2240A, 8 parts of diluent, 10 parts of hexanediol diacrylate, 8 parts of Wetlink78, 50 parts of first filler and 8 parts of first thixotropic agent; the component B comprises 30 parts of alicyclic amine curing agent, 20 parts of aliphatic amine curing agent, 5 parts of accelerator, 50 parts of second filler, 5 parts of second thixotropic agent and 0.5 part of rheological additive.
Example 7
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 35 parts of bisphenol F type oxygen resin, 15 parts of UA10, 5 parts of LD410, 6 parts of 2240A, 5 parts of diluent, 6 parts of tripropylene glycol diacrylate, 6 parts of Wetlink78, 40 parts of first filler and 5 parts of first thixotropic agent; the component B comprises 25 parts of alicyclic amine curing agent, 25 parts of aliphatic amine curing agent, 3 parts of accelerator, 45 parts of second filler, 3 parts of second thixotropic agent and 0.3 part of rheological additive.
Example 8
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 28 parts of bisphenol F type oxygen resin, 12 parts of UA10, 2.5 parts of LD410, 10 parts of 2240A, 3 parts of diluent, 5 parts of tricyclodecane dimethanol diacrylate, 1 part of Wetlink78, 30 parts of first filler and 3 parts of first thixotropic agent; the component B comprises 20 parts of alicyclic amine curing agent, 30 parts of aliphatic amine curing agent, 1 part of accelerator, 40 parts of second filler, 2 parts of second thixotropic agent and 0.1 part of rheological additive.
Example 9
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A consists of 42 parts of bisphenol F type oxygen resin, 18 parts of UA10, 8 parts of LD410, 2.5 parts of 2240A, 8 parts of diluent, 10 parts of hexanediol diacrylate, 8 parts of Wetlink78, 50 parts of first filler and 8 parts of first thixotropic agent; the component B comprises 30 parts of alicyclic amine curing agent, 20 parts of aliphatic amine curing agent, 5 parts of accelerator, 50 parts of second filler, 5 parts of second thixotropic agent and 0.5 part of rheological additive.
Example 10
An epoxy adhesive for high-speed rails is prepared from the following components in parts by weight of 2:1, wherein the component A comprises 24 parts of bisphenol F type oxygen resin, 16 parts of UA10 and 5 parts of hexanediol diacrylate; the component B comprises 20 parts of alicyclic amine curing agent and 30 parts of aliphatic amine curing agent.
Example 11
The differences from example 1 are: the epoxy resin is bisphenol F.
Example 12
The differences from example 1 are: the curing speed improver is poly dipentaerythritol hexaacrylate.
Comparative example 1
The adopted bar-planting glue is Yangtze river reinforced YZJ-2 injection type bar-planting glue.
Comparative example 2
The adopted bar-planting glue is HIT-RE500SD bar-planting glue.
Comparative example 3
The difference from example 10 is that no curing accelerator was used.
The concrete production processes in the above examples are all prepared according to the following processes:
the preparation method of the component A comprises the following steps:
(1) drying the filler on a dryer for 2 hours at 120 ℃ in advance, and then cooling to room temperature for later use;
(2) under the condition of normal temperature, firstly adding mixed epoxy resin, an optional first toughening agent, an optional second toughening agent, an optional diluent, a curing speed improver and an optional coupling agent into a dispersion kettle in proportion, stirring for 15min, and keeping the vacuum degree at 0.090-0.095 MPa;
(3) then adding optional fillers in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(4) then adding an optional thixotropic agent in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(5) cleaning stirring teeth and kettle wall, stirring for 10min, discharging and packaging;
the preparation method of the component B comprises the following steps:
(1) at normal temperature, firstly, adding an alicyclic amine curing agent, a fatty amine curing agent and an optional epoxy accelerator in proportion into a dispersion kettle, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(2) then adding optional fillers in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(3) then adding an optional thixotropic agent and an optional rheological additive in proportion, stirring for 10min, and keeping the vacuum degree at 0.090-0.095 MPa;
(4) cleaning stirring teeth and kettle wall, stirring for 10min, discharging and packaging;
a, B according to the weight ratio A of two components: and B is 2:1, and the mixture is uniformly mixed.
And (3) performance testing:
the epoxy glue for high-speed rail prepared in examples 1 to 12 and comparative examples 1 to 3 was subjected to a performance test by the following detection method:
steel shear strength to steel: GB/T7124
Compressive strength GB/T1041
Bending Strength GB/T9341
Split tensile strength GB50728
Bonding strength between ribbed steel bar (or full bolt) and concrete under constrained drawing condition: GB50728
The reduction rate of the tensile shear strength of the aged 90D steel to steel at 0 ℃ and 95% RH is GB50728
For the above tests, the arithmetic mean of 5 groups of samples was taken.
Thixotropic index GB50728
Sag fluidity at 25 ℃: GB 50728.
The results of the measurements are shown in tables 2 and 3 below.
TABLE 2
TABLE 3
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: adopt the epoxy glue that this application provided can effectively improve the intensity promotion rate of epoxy glue condensate, can not too much influence the toughness of colloid simultaneously, make the colloid become fragile.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An epoxy glue, characterized in that the epoxy glue comprises: a component A and a component B, wherein,
the component A comprises epoxy resin and a curing speed improver, wherein the curing speed improver is an acrylate functional compound;
the component B comprises an amine curing agent.
2. The epoxy glue of claim 1, wherein the epoxy glue comprises 5-10 parts by weight of the curing speed enhancer, preferably the curing speed enhancer is an acrylate functional compound with a molecular weight of 500 or less;
more preferably, the curing speed enhancer is selected from one or more of hexanediol diacrylate, pentaerythritol trimethacrylate, tripropylene glycol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, and tricyclodecane dimethanol diacrylate.
3. The epoxy glue of claim 1 or 2, wherein the epoxy glue comprises 40-60 parts by weight of the epoxy resin, preferably the epoxy resin is a mixture of bisphenol F and a polyurethane modified epoxy resin, and more preferably the polyurethane modified epoxy resin is used in an amount of 20-40% by weight of the epoxy resin.
4. The epoxy glue according to any one of claims 1 to 3, characterized in that the A-component further comprises a first toughening agent, preferably the first toughening agent is a polyether modified compound and/or a silicone core shell particle toughening agent;
preferably, the component A comprises 12.5-8 parts by weight of the polyether modified compound and 25.0-10 parts by weight of the organosilicon core-shell particle toughening agent.
5. The epoxy glue of claim 4, wherein the A component further comprises one or more of a diluent, a coupling agent, a first filler, and a first thixotropic agent;
preferably, the component A comprises 3.0-8.0 parts by weight of the diluent, 1-8 parts by weight of the coupling agent, 30-50 parts by weight of the first filler and 3-8 parts by weight of the first thixotropic agent.
6. The epoxy glue of any one of claims 1 to 5, wherein the amine curing agent is an alicyclic amine curing agent and/or a fatty amine curing agent;
preferably, the amine curing agent comprises 20.0-30.0 parts by weight of the alicyclic amine curing agent and 20.0-30.0 parts by weight of the fatty amine curing agent.
7. The epoxy glue of claim 6, wherein the alicyclic amine curing agent is m-xylylenediamine and/or 1, 3-cyclohexyldimethylamine.
8. The epoxy glue according to any one of claims 1 to 7, characterized in that the B component further comprises a second toughening agent, preferably the second toughening agent is a polyether modified compound and/or a silicone core shell particle toughening agent;
preferably, the component B comprises 12.5-8 parts by weight of the polyether modified compound and 25.0-10 parts by weight of the organosilicon core-shell particle toughening agent.
9. The epoxy glue of claim 1, wherein the B component includes one or more of an accelerator, a second filler, a second thixotropic agent, and a rheological aid;
preferably, the component B comprises 1.0-5.0 parts by weight of the accelerator, 40.0-50.0 parts by weight of the second filler, 2.0-5.0 parts by weight of the second thixotropic agent and 0.1-0.5 part by weight of the rheological additive.
10. Use of an epoxy glue according to any one of claims 1 to 9 in the field of high speed railways.
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| CN201910273014.3A CN111777954A (en) | 2019-04-04 | 2019-04-04 | Epoxy glue and application thereof |
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| CN201910273014.3A CN111777954A (en) | 2019-04-04 | 2019-04-04 | Epoxy glue and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116103003A (en) * | 2022-12-22 | 2023-05-12 | 湖南神力胶业集团有限公司 | High-strength low-viscosity low-temperature moisture-cured two-component epoxy resin adhesive and preparation method and application thereof |
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