CN111774682A - Welding method for special-shaped porous printed board - Google Patents
Welding method for special-shaped porous printed board Download PDFInfo
- Publication number
- CN111774682A CN111774682A CN202010740332.9A CN202010740332A CN111774682A CN 111774682 A CN111774682 A CN 111774682A CN 202010740332 A CN202010740332 A CN 202010740332A CN 111774682 A CN111774682 A CN 111774682A
- Authority
- CN
- China
- Prior art keywords
- printed board
- welding
- shaped porous
- insulating glue
- welding method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims abstract description 93
- 238000000034 method Methods 0.000 title claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 74
- 239000003292 glue Substances 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 238000001035 drying Methods 0.000 claims abstract description 25
- 238000005476 soldering Methods 0.000 claims abstract description 25
- 230000004907 flux Effects 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims description 25
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- 238000007605 air drying Methods 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000004506 ultrasonic cleaning Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a welding method of a special-shaped porous printed board, which comprises the following steps: performing moisture removal preheating treatment, namely putting the printed board into a blast drying cabinet, and performing two-stage intermittent heating to perform the moisture removal preheating treatment; the total thickness is 60-80 μm according to the shape of the printed board and the thickness of the solder sheet; filling insulating glue in the position of the hole on the printed board; coating soldering flux on the front and back surfaces of the solder sheet, and then sequentially placing the printed board and the solder sheet into a specific position in the cavity; placing the mixture into a hot air reflow oven for reflow soldering; after welding, the insulating paste was cleaned with tweezers, and then subjected to ultrasonic cleaning. The invention controls the thickness of the solder sheet, and simultaneously adopts the insulating glue to fill the hole, thereby preventing the hole from being blocked and polluted in the welding process, leading the printed board to be connected with the cavity by welding, and improving the grounding performance, the service life and the impact resistance.
Description
Technical Field
The invention relates to the technical field of processing of avionic products, in particular to a welding method of an opposite-nature porous printed board.
Background
The manufacturing process of avionic products often involves a process of welding the printed board to the cavity. The original fixing mode comprises bolt fixing, solder paste is used for fixing the single-sided printed board in the shell by reflow soldering, and the like, the mode of screw fixing has adverse effect on the grounding of the radio frequency microwave product, and screw holes need to be added on the printed board, so that the difficulty is brought to the layout design of the product; and the solder paste welding method is only suitable for a single-sided printed board. Chinese patent publication No. CN103737135B discloses a method for soldering a metal shell, which comprises: step one, fixing: positioning the printed board in a metal shell and fixing the printed board by using soldering tin; step two, preheating: placing the printed board and the metal shell on a temperature control heating table for preheating, wherein the preheating temperature is 130-180 ℃, and the preheating time is not less than 3 minutes; thirdly, coating rosin soldering flux on the welding spots; step four, welding: adjusting the soldering iron to 300-380 ℃, enabling the soldering iron head to be close to one side of the metal shell, adjusting to 450 ℃, and enabling the soldering iron to be close to the printed board when the temperature of the metal shell rises to the melting point of the solder; and step five, cleaning. According to the method, the printed board and the shell are welded to form a seamless integrated structure, so that the product has better grounding performance and impact resistance. Chinese patent publication No. CN104125722A discloses a welding process of a microwave substrate and a shell, which comprises: processing a through hole on the microwave substrate; processing a column corresponding to the through hole on the bottom surface in the shell, wherein the height of the column is less than that of the microwave substrate; metallizing the outer wall of the through hole, the upper and lower surfaces of the substrate, the bottom of the shell and the outer surface of the column to form an integrated metallized layer; placing the microwave substrate, the solder block and the shell in sequence from top to bottom, wherein the thickness of the solder block is 20-30 mu m, performing reflow soldering on the microwave substrate and the shell, and applying pressure on the upper surface of the microwave substrate to enable the microwave substrate to be tightly attached to the shell.
In the MCM multi-chip module design process, the method is often applied to a special-shaped porous small-area printed board with a low dielectric constant, holes are used for mounting circuit elements, the holes are irregular in shape, large in number and close to welding points, and when a welding method is adopted, the holes are easily polluted by solder to cause scrapping. Therefore, the two prior arts cannot realize the welding of the small-area printed board and the cavity. In fact, the interconnection between the printed board and the cavity is mostly completed by adopting the conductive adhesive for bonding and curing. However, the glue is poor in electric and thermal conductivity and easy to age, so that the reliability is not ideal.
Disclosure of Invention
The technical problem solved by the invention is to provide a welding method which can be used for welding a special-shaped porous small-area printed board and a cavity, prevents holes from being blocked, and has good grounding performance and reliable connection.
The invention is realized by the following technical scheme.
The invention provides a welding method of a special-shaped porous printed board, which comprises the following steps:
step one, moisture removal and preheating treatment, namely putting the printed board into a blast drying cabinet for two-stage intermittent heating;
cutting solder sheets, wherein the solder sheets are cut according to the shape of the printed board, and the number of the cut solder sheets is calculated according to the thickness of each solder sheet, so that the total thickness is 60-80 μm;
filling insulating glue, namely filling the insulating glue in the position of the hole in the printed board;
step four, prefabricating a weldment, namely brushing soldering flux on the front side and the back side of a solder sheet, then sequentially placing the printed board and the solder sheet into a specific position in a cavity, and fixing the printed board and the solder sheet by using a pressing tool;
step five, welding, namely placing the weldment into a hot air reflow oven for reflow welding;
and step six, cleaning, after welding, cleaning the insulating glue by using a pair of tweezers, and then ultrasonically cleaning the welding piece.
The first step, preferably, the two-stage intermittent heating is: heating to 48-52 deg.C for 0.5 hr or more, heating to 95-105 deg.C for 2 hr or more.
In the second step, the total thickness of the solder sheet is preferably 60 μm.
In the third step, preferably, the insulating glue is GD414 insulating glue;
filling the insulating glue by adopting a silver needle;
after filling the insulating glue, putting the mixture into a blast drying cabinet for drying, wherein the drying temperature is preferably 120 ℃;
the drying time is 30-40 min, preferably 30 min.
And step four, the soldering flux is rosin soldering flux.
The invention has the beneficial effects that:
compared with the prior art, the invention has the following positive effects:
(1) the thickness of the solder sheet is controlled, and the insulating glue is adopted to fill the hole, so that the hole is prevented from being blocked and polluted in the welding process, the printed board is connected with the cavity in a welding manner, and the grounding performance, the service life and the impact resistance are improved;
(2) the two-stage intermittent heating, moisture removal and preheating treatment are carried out, so that the weldability of the printed board is improved, the printed board is prevented from thermal stress impact, and the welding quality is improved;
(3) controlling the thickness of a solder sheet, coating soldering flux on the solder sheet, and carrying out two-stage intermittent heating, moisture removal and preheating on the printed board to reduce the soldering hole rate to be within 15%;
(4) after the insulating glue is filled, the printed board is placed into a blast drying cabinet for drying, so that the insulating glue is easy to remove after welding.
Drawings
Fig. 1 is a schematic structural view of a printed board and a cavity.
In the figure: 1-a cavity; 2-a printed board; 3-welding; 4-hole.
Detailed Description
The technical solution of the present invention is further described below, but the scope of the claimed invention is not limited to the described.
The invention provides a welding method of a special-shaped porous printed board, which comprises the following steps:
step one, moisture removal and preheating treatment: putting the printed board 2 into a forced air drying cabinet, and carrying out two-stage intermittent heating, wherein the heating is carried out to 50 ℃ firstly, the error is 2 ℃, the heating is carried out for more than 0.5h, the heating is carried out to 100 ℃, the error is 5 ℃, and the heating is carried out for more than 2 h;
in the conventional method, the pre-heating treatment before welding the printed board 2 is to preheat to a higher temperature at one time and keep the time for the pre-heating treatment to be shorter. For example, preheating to 130-180 ℃ at one time, and keeping for 3 minutes. The welding range of the printed board acted by the method is large, so that no special requirements are required for the hole rate of welding and the strength of a welding point in unit area, the welding stress can be reduced only by recording preheating in the prior art, and the influence of preheating on the hole rate of welding and the strength of the welding point is not recorded.
Under the condition that the operation parameters of the second step to the sixth step are the same, the one-time preheating is adopted to be compared with the two-stage heating of the first step, and when the one-time heating is adopted, the measured welding hole rate is slightly larger than the two-stage heating. The welding hole rate affects not only the welding strength and the impact resistance but also the grounding performance between the printed board 2 and the cavity 1.
In addition, when one-time heating is adopted, due to the fact that microscopic defects are generated by stress impact in the printed board 2, after multiple heating experiments, a welding point of the printed board 2 becomes brittle, and the printed board cracks under slight impact after welding. The printed board 2 applied by the invention has the advantages of complex shape, small size, total length of only about 3cm, width of only 2-3 mm, and holes 4 for mounting components and parts distributed in the middle, so that the welding area is narrow, and the printed board is extremely sensitive to micro defects and welding hole rate; the invention adopts two-stage intermittent heating and preheating, avoids stress impact caused by sudden heating, and the welded part 3 can bear the impact after welding.
In addition, when the first-stage heating exceeds 52 ℃, the edges of the printed board are subjected to radiographic inspection, and micro cracks which are difficult to detect exist locally; when the first stage heating temperature is lower than 48 ℃, the result is still the same after the second stage heating is carried out. When the first-stage heat preservation time is less than 0.5h and the second-stage heat preservation time is less than 2h, the welding hole rate is slightly higher than the result strictly executed according to the step one because the moisture and the temperature field in the printed board 2 are not fully diffused.
Cutting solder sheets, wherein the solder sheets are cut according to the shape of the printed board 2, the number of the cut solder sheets is calculated according to the thickness of each solder sheet, and the total thickness of the solder sheets is 60-80 μm;
when the total thickness of the solder sheet is less than 60 μm, the soldering strength cannot be secured first. Secondly, the solder will naturally diffuse slightly due to the influence of the surface tension of the solder, which will result in an exponential increase in the solder void fraction, starting when the total thickness of the solder sheet is less than 60 μm. 80 μm is the limit of the thickness of the solder sheet, when the solder sheet is 80 μm, only a very small probability will flow out of the soldering range, when the total thickness of the solder sheet is greater than 80 μm, a certain probability will result that the solder will flow into the range of the hole 4, and there is a certain probability to contaminate the hole 4; at this time, if the step three insulating glue is not used for protection, the holes 4 are polluted and blocked.
Filling insulating glue, namely filling GD414 insulating glue at the position of the hole 4 on the printed board 2 by using a silver needle, putting the printed board into a blast drying cabinet, and drying the printed board for 30min at 120 ℃;
after the insulating glue is filled, when a small amount of solder flows into the range of the hole 4, the hole 4 can be protected from being polluted with a certain probability, and meanwhile, the pollution of gas and particles to the hole 4 in the welding process can be effectively prevented. However, the insulating glue needs to be dried and cured in advance, a layer of hard film is formed on the outer surface, when the temperature is lower than 120 ℃ or the drying time is shorter than 30min, the hard film is not completely formed, and the hard film is hard to adhere to the printed board 2 due to the invasion of hot wind during welding and is difficult to remove; when the temperature exceeds 120 ℃ or the drying time exceeds 30min, the insulating glue is completely hardened and is difficult to remove. Therefore, the temperature should be controlled as strictly as possible to be 120 ℃, the drying time is 30min, and at the moment, the cured insulating glue has the inner shape like jelly, a certain toughness is remained, and the cleaning is easy.
Step four, prefabricating a weldment, namely brushing rosin soldering flux on the front side and the back side of a solder sheet, then sequentially placing the printed board 2 and the solder sheet into a specific position in the cavity 1, and fixing the printed board and the solder sheet by using a pressing and fixing tool;
step five, welding, namely placing the weldment into a hot air reflow oven for reflow welding;
and step six, cleaning, after welding, cleaning the insulating glue by using a pair of tweezers, and then ultrasonically cleaning the welding piece.
For clarity, some examples of the present application are listed below:
the first embodiment is as follows:
the invention provides a welding method of a special-shaped porous printed board, which comprises the following steps:
step one, moisture removal and preheating treatment: putting the printed board 2 into a forced air drying cabinet, and carrying out two-stage intermittent heating, wherein the heating is carried out to 50 ℃ firstly, the error is 2 ℃, the heating is carried out for 0.5h, the heating is carried out to 100 ℃, the error is 5 ℃, and the heating is carried out for 2 h;
cutting solder sheets, wherein the solder sheets are cut according to the shape of the printed board 2, the number of the cut solder sheets is calculated according to the thickness of each solder sheet, and the total thickness of the solder sheets is 60 mu m;
filling insulating glue, namely filling GD414 insulating glue at the position of the hole 4 on the printed board 2 by using a silver needle, putting the printed board into a blast drying cabinet, and drying the printed board for 30min at 120 ℃;
step four, prefabricating a weldment, namely brushing rosin soldering flux on the front side and the back side of a solder sheet, then sequentially placing the printed board 2 and the solder sheet into a specific position in the cavity 1, and fixing the printed board and the solder sheet by using a pressing and fixing tool;
step five, welding, namely placing the weldment into a hot air reflow oven for reflow welding;
and step six, cleaning, after welding, cleaning the insulating glue by using a pair of tweezers, and then ultrasonically cleaning the welding piece.
The experimental results are as follows: firstly, after welding, the insulating glue is solidified, the surface is dry, toughness is remained in the insulating glue, and the insulating glue is easy to clean by using tweezers; secondly, after cleaning, the holes 4 on the printed board 2 are free from blockage and pollution; and thirdly, repeating the experiment for more than 5 times, and measuring the welding hole rate under a microscope, wherein the average welding hole rate is 10%.
Example two:
the invention provides a welding method of a special-shaped porous printed board, which comprises the following steps:
step one, moisture removal and preheating treatment: putting the printed board 2 into a forced air drying cabinet, and carrying out two-stage intermittent heating, wherein the heating is carried out to 50 ℃ firstly, the error is 2 ℃, the heating is carried out for 0.5, the heating is carried out to 100 ℃, the error is 5 ℃, and the heating is carried out for 2 hours;
cutting solder sheets, wherein the solder sheets are cut according to the shape of the printed board 2, the number of the cut solder sheets is calculated according to the thickness of each solder sheet, and the total thickness of the solder sheets is 80 mu m;
filling insulating glue, namely filling GD414 insulating glue at the position of the hole 4 on the printed board 2 by using a silver needle, putting the printed board into a blast drying cabinet, and drying for 60min at 120 ℃;
step four, prefabricating a weldment, namely brushing rosin soldering flux on the front side and the back side of a solder sheet, then sequentially placing the printed board 2 and the solder sheet into a specific position in the cavity 1, and fixing the printed board and the solder sheet by using a pressing and fixing tool;
step five, welding, namely placing the weldment into a hot air reflow oven for reflow welding;
and step six, cleaning, after welding, cleaning the insulating glue by using a pair of tweezers, and then ultrasonically cleaning the welding piece.
The experimental results are as follows: firstly, as the drying time of the insulating glue in the third step is too long, the insulating glue is cured after welding, the toughness is poor, and the cleaning difficulty is large; secondly, after cleaning, the holes 4 on the printed board 2 are free from blockage and pollution; and thirdly, repeating the experiment for more than 5 times, and measuring the welding hole rate under a microscope, wherein the average welding hole rate is 12%.
Example three:
the invention provides a welding method of a special-shaped porous printed board, which comprises the following steps:
step one, moisture removal and preheating treatment: putting the printed board 2 into a forced air drying cabinet, and carrying out two-stage intermittent heating, wherein the heating is carried out to 50 ℃ firstly, the error is 2 ℃, the heating is carried out for 0.5, the heating is carried out to 100 ℃, the error is 5 ℃, and the heating is carried out for 2 hours;
cutting solder sheets, wherein the solder sheets are cut according to the shape of the printed board 2, the number of the cut solder sheets is calculated according to the thickness of each solder sheet, and the total thickness of the solder sheets is 100 mu m;
filling insulating glue, namely filling GD414 insulating glue at the position of the hole 4 on the printed board 2 by using a silver needle, putting the printed board into a blast drying cabinet, and drying for 60min at 120 ℃;
step four, prefabricating a weldment, namely brushing rosin soldering flux on the front side and the back side of a solder sheet, then sequentially placing the printed board 2 and the solder sheet into a specific position in the cavity 1, and fixing the printed board and the solder sheet by using a pressing and fixing tool;
step five, welding, namely placing the weldment into a hot air reflow oven for reflow welding;
and step six, cleaning, after welding, cleaning the insulating glue by using a pair of tweezers, and then ultrasonically cleaning the welding piece.
The experimental results are as follows: firstly, as the drying time of the insulating glue in the third step is too long, the insulating glue is cured after welding, the toughness is poor, and the cleaning difficulty is large; secondly, after cleaning, the holes 4 on the printed board 2 are not blocked; thirdly, repeating the experiment for more than 5 times, and measuring the welding hole rate under a microscope, wherein the average welding hole rate is 20 percent; in addition, the solder flows to the distribution range of the holes 4, 2 samples are extracted for observation, wherein the solder of one sample invades into the insulating glue, so that the holes 4 are slightly polluted, and the holes 4 of the other sample are not polluted.
For understanding, the present application provides a schematic structural diagram of a printed board 2 and a cavity 1 and a description thereof, as shown in fig. 1.
The figure comprises a cavity 1, a printed board 2, a welding part 3 of the printed board 2 and the cavity 1, and a hole 4, wherein the shape is one encountered in production, and various shapes and sizes exist in actual production, and even the shape is bent. The position of the hole 4 is used for installing circuit components such as a bare chip, the shape of the hole is indefinite, the hole has a rectangular shape, a circular shape, an oval shape, a star shape and the like, the equivalent diameter is generally 0.8-1 mm, the width of the example shown in fig. 1 is 2.8mm, the distance from the welding position 3 is about 1mm, the welding process is easily blocked and polluted by solder flowing in, when the welding paste is adopted, the using amount of the solder is extremely difficult to control, and the welding flux sheet is adopted to replace the welding paste, so that the using amount of the solder can be effectively controlled.
Claims (9)
1. A welding method of a special-shaped porous printed board is characterized by comprising the following steps: the method comprises the following steps:
step one, moisture removal and preheating treatment, namely placing the printed board (2) into a forced air drying cabinet for two-stage intermittent heating;
cutting solder sheets, wherein the solder sheets are cut according to the shape of the printed board (2), and the number of the cut sheets is calculated according to the thickness of each solder sheet, so that the total thickness is 60-80 μm;
filling insulating glue, namely filling the position of the hole (4) on the printed board (2) with the insulating glue;
step four, prefabricating a weldment, namely brushing soldering flux on the front side and the back side of a solder sheet, then sequentially placing the printed board (2) and the solder sheet into a specific position in the cavity (1), and fixing the soldering flux by using a pressing and fixing tool;
step five, welding, namely placing the weldment into a hot air reflow oven for reflow welding;
and step six, cleaning, after welding, cleaning the insulating glue by using a pair of tweezers, and then ultrasonically cleaning the welding piece.
2. The welding method of the special-shaped porous printed board according to claim 1, wherein: the two-stage intermittent heating in the step one is to heat to 48-52 ℃ for more than 0.5h, and then to heat to 95-105 ℃ for more than 2 h.
3. The welding method of the special-shaped porous printed board according to claim 1, wherein: and step two, the total thickness of the solder sheet is 60 μm.
4. The welding method of the special-shaped porous printed board according to claim 1, wherein: and step three, the insulating glue is GD414 insulating glue.
5. The welding method of the special-shaped porous printed board according to claim 1, wherein: and step three, after the insulating glue is filled, putting the printed board (2) into a forced air drying cabinet for drying.
6. The welding method of the shaped porous printed board of claim 5, wherein: the drying temperature is 120 ℃.
7. The welding method of the shaped porous printed board of claim 5, wherein: the drying time is 30-40 min.
8. The welding method of the shaped porous printed board of claim 7, wherein: the drying time is 30 min.
9. The welding method of the special-shaped porous printed board according to claim 1, wherein: and step four, the soldering flux is rosin soldering flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010740332.9A CN111774682B (en) | 2020-07-28 | 2020-07-28 | Welding method for special-shaped porous printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010740332.9A CN111774682B (en) | 2020-07-28 | 2020-07-28 | Welding method for special-shaped porous printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111774682A true CN111774682A (en) | 2020-10-16 |
| CN111774682B CN111774682B (en) | 2021-12-28 |
Family
ID=72765311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010740332.9A Active CN111774682B (en) | 2020-07-28 | 2020-07-28 | Welding method for special-shaped porous printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111774682B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211004A (en) * | 2021-03-31 | 2021-08-06 | 西安航天发动机有限公司 | Method for eliminating brazing blockage of annular workpiece with tube seat stainless steel interlayer structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002185121A (en) * | 2000-12-13 | 2002-06-28 | Yazaki Corp | Printed wiring board reflow method and reflow furnace |
| CN106134330B (en) * | 2010-11-02 | 2013-02-27 | 北京卫星制造厂 | A kind of high soldering rate vacuum welding method based on plasma cleaning |
| CN103521868A (en) * | 2013-09-29 | 2014-01-22 | 湖北三江航天红林探控有限公司 | Microwave antenna component welding technology for preventing tin-lead soldering paste from soaking into antenna standing wave surface |
| CN103737135A (en) * | 2013-12-09 | 2014-04-23 | 成都赛英科技有限公司 | Metal shell soldering method |
| CN107199381A (en) * | 2017-06-22 | 2017-09-26 | 中科迪高微波系统有限公司 | A kind of process of SMP connectors welding |
| CN209216957U (en) * | 2018-12-28 | 2019-08-06 | 华羿微电子股份有限公司 | A kind of power device lead frame |
-
2020
- 2020-07-28 CN CN202010740332.9A patent/CN111774682B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002185121A (en) * | 2000-12-13 | 2002-06-28 | Yazaki Corp | Printed wiring board reflow method and reflow furnace |
| CN106134330B (en) * | 2010-11-02 | 2013-02-27 | 北京卫星制造厂 | A kind of high soldering rate vacuum welding method based on plasma cleaning |
| CN103521868A (en) * | 2013-09-29 | 2014-01-22 | 湖北三江航天红林探控有限公司 | Microwave antenna component welding technology for preventing tin-lead soldering paste from soaking into antenna standing wave surface |
| CN103737135A (en) * | 2013-12-09 | 2014-04-23 | 成都赛英科技有限公司 | Metal shell soldering method |
| CN107199381A (en) * | 2017-06-22 | 2017-09-26 | 中科迪高微波系统有限公司 | A kind of process of SMP connectors welding |
| CN209216957U (en) * | 2018-12-28 | 2019-08-06 | 华羿微电子股份有限公司 | A kind of power device lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211004A (en) * | 2021-03-31 | 2021-08-06 | 西安航天发动机有限公司 | Method for eliminating brazing blockage of annular workpiece with tube seat stainless steel interlayer structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111774682B (en) | 2021-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107124835B (en) | Reflow Soldering paster technique | |
| CN107222982B (en) | A kind of SMT paster technique | |
| CN112040669B (en) | SMT (surface mount technology) welding process for PCB (printed circuit board) in shell | |
| US20060065431A1 (en) | Self-reflowing printed circuit board and application methods | |
| CN110248495A (en) | Tin cream Reflow Soldering and glue technique for fixing | |
| CN109411372B (en) | Method for uniformly current-assisted sintering of nano-silver solder paste temperature field based on copper-clad ceramic substrate | |
| CN113695695A (en) | Method for soldering tin paste for semiconductor chip | |
| WO2012009848A1 (en) | Pre-solder method and rework method for multi-row qfn chip | |
| CN113206018A (en) | Low-temperature large-area uniform sintering method for nano-silver soldering paste | |
| CN111774682B (en) | Welding method for special-shaped porous printed board | |
| CN104271299B (en) | Method for technically optimally implementing soldering connection | |
| CN109604754A (en) | A kind of reflow soldering method improving device thermal expansion deformation | |
| CN105033387A (en) | Manufacturing method of welding pull pins | |
| WO2025036279A1 (en) | Peltier cooler manufacturing process and peltier cooler | |
| JP2001230275A5 (en) | ||
| CN112820652B (en) | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device | |
| CN112888188A (en) | PCBA (printed circuit board assembly) paster processing technology | |
| CN112151400A (en) | Method for solving SMD tube shell bonding point gold-aluminum system | |
| US20130119119A1 (en) | Solder spattering suppressed reflow method | |
| CN110278667B (en) | Microwave dielectric plate and carrier integrated welding method | |
| CN113539953B (en) | A microvia filling process in integrated circuits | |
| US9706694B2 (en) | Electronic module produced by sequential fixation of the components | |
| CN100409991C (en) | Welding wire and lead frame spot welding method | |
| CN119489235A (en) | A method for welding large-size power chips without pressure and with low void ratio | |
| CN112775509B (en) | Method for reducing voidage during welding of TO packaged components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |