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CN111762750A - Micro device integrating mechanical energy collection and vibration detection functions and preparation method thereof - Google Patents

Micro device integrating mechanical energy collection and vibration detection functions and preparation method thereof Download PDF

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Publication number
CN111762750A
CN111762750A CN202010769412.7A CN202010769412A CN111762750A CN 111762750 A CN111762750 A CN 111762750A CN 202010769412 A CN202010769412 A CN 202010769412A CN 111762750 A CN111762750 A CN 111762750A
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vibration detection
mechanical energy
base layer
micro
crack
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CN111762750B (en
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王可军
王倩
陆耀
张雷
樊成
薛宇程
蒋立伟
归悦承
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Suzhou University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The invention discloses a micro device integrating mechanical energy collection and vibration detection functions, which comprises: the substrate layer is provided with a crack structure, the crack structure penetrates through the substrate layer along the thickness direction of the substrate layer, and the crack structure is provided with a closed tip part; the vibration detection structure is arranged on the substrate layer and partially covers the crack structure, and is used for detecting a vibration signal; and the electromechanical conversion structure is embedded in the basal layer on one side of the tip part of the crack structure and can collect and convert mechanical energy into electric energy. The invention also discloses a method for integrating the micro device with the functions of mechanical energy collection and vibration detection. The invention has the advantages that the crack structure is arranged, so that the high-efficiency collection of mechanical energy can be realized, and the high-precision detection of weak vibration signals can also be realized.

Description

集成机械能收集与振动检测功能的微器件及其制备方法Micro device integrating mechanical energy collection and vibration detection functions and preparation method thereof

技术领域technical field

本发明属于微型智能电子技术领域,具体涉及一种集成机械能收集与振动检测功能的微器件及其制备方法。The invention belongs to the technical field of micro-intelligent electronics, and in particular relates to a micro-device integrating mechanical energy collection and vibration detection functions and a preparation method thereof.

背景技术Background technique

集成振动信号高精度检测与机械能高效俘获功能的微型器件是整体提升微型智能电子装备感知和续航能力的关键,现有的设计原理和制备方法难以实现。Micro-devices integrating high-precision detection of vibration signals and efficient capture of mechanical energy are the key to improving the overall perception and endurance of micro-intelligent electronic equipment. The existing design principles and preparation methods are difficult to achieve.

因此,针对上述技术问题,有必要提供一种集成机械能收集与振动检测功能的微器件及其制备方法。Therefore, in view of the above technical problems, it is necessary to provide a micro-device integrating mechanical energy collection and vibration detection functions and a preparation method thereof.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种集成机械能收集与振动检测功能的微器件及其制备方法,旨在解决现有智能电子装备无法在兼顾微小尺度的同时实现振动信号高精度检测和机械能高效收集的难题。The purpose of the present invention is to provide a micro-device integrating mechanical energy collection and vibration detection functions and a preparation method thereof, aiming to solve the problem that existing intelligent electronic equipment cannot realize high-precision detection of vibration signals and efficient collection of mechanical energy while taking into account the micro-scale .

为了实现上述目的,本发明一实施例提供的技术方案如下:In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

一实施例中,提供了一种集成机械能收集与振动检测功能的微器件,包括:In one embodiment, a micro-device integrating mechanical energy collection and vibration detection functions is provided, including:

基底层,其上开设有裂纹结构,所述裂纹结构沿所述基底层厚度方向贯穿该基底层,所述裂纹结构具有一封闭的尖端部;a base layer, on which a crack structure is opened, the crack structure penetrates the base layer along the thickness direction of the base layer, and the crack structure has a closed tip;

振动检测结构,设于所述基底层上且部分覆盖所述裂纹结构,所述振动检测结构用于检测振动信号;a vibration detection structure, disposed on the base layer and partially covering the crack structure, the vibration detection structure is used to detect vibration signals;

机电转换结构,嵌设于所述裂纹结构尖端部一侧的基底层内,所述机电转换结构能够将机械能进行收集并转化成电能。The electromechanical conversion structure is embedded in the base layer on one side of the tip of the crack structure, and the electromechanical conversion structure can collect and convert mechanical energy into electrical energy.

作为本发明的进一步改进,所述振动检测结构包括与所述基底层相贴合的柔性薄膜基底层,设于所述柔性薄膜基底层上的导电层以及设于所述导电层上的信号导出电极。As a further improvement of the present invention, the vibration detection structure includes a flexible film base layer attached to the base layer, a conductive layer disposed on the flexible film base layer, and a signal exporting signal disposed on the conductive layer electrode.

作为本发明的进一步改进,所述机电转换结构距所述尖端部由近及远依次包括第一导电膜,换能材料层和第二导电膜,其中所述第一导电膜和第二导电膜上分别设置有电能导出电极。As a further improvement of the present invention, the electromechanical conversion structure includes a first conductive film, a transducer material layer and a second conductive film in order from near to far from the tip portion, wherein the first conductive film and the second conductive film The electric energy lead-out electrodes are respectively arranged on them.

在上述技术方案中,所述机电转换结构设于所述裂纹结构尖端部一侧的基底层上,使得所述机电转换结构位于所述裂纹结构尖端部的应力场内,当含有机械能的外部刺激作用于微器件上时,裂纹结构尖端部的能量集中效应会使得机械能高效聚集到尖端部的应力场内并通过机电转换结构转化成电能传输到后续的电路或存储设备中;振动检测结构设于所述基底层上且部分覆盖所述裂纹结构,当振动信号作用于基底层上时,柔性薄膜基底层会随裂纹结构宽度变化而发生弯曲变形,进而触发导电层对信号进行检测。In the above technical solution, the electromechanical conversion structure is provided on the base layer on one side of the tip portion of the crack structure, so that the electromechanical conversion structure is located in the stress field of the tip portion of the crack structure, when the external stimulus containing mechanical energy When acting on the micro-device, the energy concentration effect at the tip of the crack structure will make the mechanical energy efficiently gather into the stress field at the tip and convert it into electrical energy through the electromechanical conversion structure and transmit it to subsequent circuits or storage devices; the vibration detection structure is located in the The base layer covers and partially covers the crack structure. When a vibration signal acts on the base layer, the flexible film base layer will bend and deform as the width of the crack structure changes, thereby triggering the conductive layer to detect the signal.

作为本发明的进一步改进,所述裂纹结构的裂纹宽度为5~50μm。As a further improvement of the present invention, the crack width of the crack structure is 5-50 μm.

作为本发明的进一步改进,所述裂纹结构自所述基底层的一侧向内凹陷形成,其具有与所述尖端部相对设置的开放部。As a further improvement of the present invention, the crack structure is formed by concave inward from one side of the base layer, and has an opening portion opposite to the tip portion.

作为本发明的进一步改进,所述振动检测结构覆盖于所述开放部上。As a further improvement of the present invention, the vibration detection structure covers the opening portion.

作为本发明的进一步改进,所述柔性薄膜基底层的导电层上开设有纳米级裂纹微结构。As a further improvement of the present invention, a nanoscale crack microstructure is formed on the conductive layer of the flexible film base layer.

作为本发明的进一步改进,所述纳米级裂纹微结构可通过机械弯曲、有机溶剂诱导膨胀或光诱导膨胀制备形成。As a further improvement of the present invention, the nano-scale crack microstructure can be prepared and formed by mechanical bending, organic solvent-induced expansion or light-induced expansion.

作为本发明的进一步改进,所述机电转换结构呈弧形设置,其内弧面与所述尖端部相对设置。As a further improvement of the present invention, the electromechanical conversion structure is arranged in an arc shape, and the inner arc surface thereof is arranged opposite to the tip portion.

作为本发明的进一步改进,所述振动检测结构内的导电层通过沉积、蒸镀、溅镀或刷涂的方法设于所述柔性薄膜基底层上。As a further improvement of the present invention, the conductive layer in the vibration detection structure is disposed on the flexible film base layer by means of deposition, evaporation, sputtering or brushing.

作为本发明的进一步改进,所述机电转换结构内的第一导电膜和第二导电膜通过沉积、蒸镀、溅镀或刷涂的方法设于所述换能材料层上。As a further improvement of the present invention, the first conductive film and the second conductive film in the electromechanical conversion structure are disposed on the transducer material layer by means of deposition, evaporation, sputtering or brushing.

作为本发明的进一步改进,所述导电层,第一导电膜和第二导电膜中的导电材料可以为金、银、铜、铂、石墨中的一种。As a further improvement of the present invention, the conductive material in the conductive layer, the first conductive film and the second conductive film may be one of gold, silver, copper, platinum, and graphite.

作为本发明的进一步改进,所述换能材料层的换能材料可以为压电陶瓷、压电薄膜、复合压电材料中的一种;As a further improvement of the present invention, the transducer material of the transducer material layer may be one of piezoelectric ceramics, piezoelectric films, and composite piezoelectric materials;

作为本发明的进一步改进,所述柔性薄膜基底层可以为聚酰亚胺、聚乙烯、氯乙烯中的一种。As a further improvement of the present invention, the flexible film base layer may be one of polyimide, polyethylene, and vinyl chloride.

本申请一实施例还提供了一种制备上述集成机械能收集与振动检测功能的微器件的制备方法,包括如下步骤:An embodiment of the present application also provides a preparation method for preparing the above-mentioned micro-device integrating mechanical energy collection and vibration detection functions, including the following steps:

将一端弧形的金属条放置于液态的固化材料中;Place the arc-shaped metal strip at one end in the liquid solidified material;

在固化材料达到半固化状态后,将机电转换结构置于金属条弧形端的固化材料中且距该金属条弧形端一定距离;After the cured material reaches a semi-cured state, the electromechanical conversion structure is placed in the cured material at the arc-shaped end of the metal strip at a certain distance from the arc-shaped end of the metal strip;

将金属条通过腐蚀液进行去除形成裂纹结构;The metal strip is removed by the corrosive liquid to form a crack structure;

将振动检测结构铺设于裂纹结构远离弧形端的一端,并对固化材料进行进一步固化。The vibration detection structure is laid on the end of the crack structure away from the arc-shaped end, and the cured material is further cured.

作为本发明的进一步改进,所述基底层为由环氧树脂、硅胶、聚氨酯、聚二甲基硅氧烷、光刻胶中的一种固化材料固化而成。As a further improvement of the present invention, the base layer is cured by a curing material selected from epoxy resin, silica gel, polyurethane, polydimethylsiloxane and photoresist.

作为本发明的进一步改进,用于金属条腐蚀去除的溶液可以为氯化铁溶液、盐酸溶液、硫酸溶液中的一种。As a further improvement of the present invention, the solution used for corrosion removal of metal strips can be one of ferric chloride solution, hydrochloric acid solution, and sulfuric acid solution.

与现有技术相比,本发明的优点在于:Compared with the prior art, the advantages of the present invention are:

由于机电转换结构位于裂纹结构的尖端部应力场中,因此能够基于裂纹尖端的能量集中效应将分散的机械能进行高效收集并转化成电能从而提高了机械能收集的效率。由于柔性薄膜基底层附于裂纹尾部,可利用裂纹尾部的形变现象使得柔性薄膜基底层发生弯曲变形,从而使得柔性薄膜基底层上的导电层的电阻发生变化,实现微弱振动信号的高精度检测。综上,在基底层上开设裂纹结构并设置机电转换结构和机电转换结构,既可实现对机械能的高效收集也可实现微弱振动信号的高精度检测。Since the electromechanical conversion structure is located in the stress field at the tip of the crack structure, the scattered mechanical energy can be efficiently collected and converted into electrical energy based on the energy concentration effect at the crack tip, thereby improving the efficiency of mechanical energy collection. Since the flexible film base layer is attached to the crack tail, the deformation phenomenon of the crack tail can be used to make the flexible film base layer bend and deform, so that the resistance of the conductive layer on the flexible film base layer changes, and high-precision detection of weak vibration signals can be realized. To sum up, opening a crack structure on the base layer and arranging an electromechanical conversion structure and an electromechanical conversion structure can not only achieve efficient collection of mechanical energy, but also achieve high-precision detection of weak vibration signals.

附图说明Description of drawings

为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

图1是本申请一实施方式中一种集成机械能收集与振动检测功能的微器件俯视效果图;1 is a top-down effect view of a micro-device integrating mechanical energy collection and vibration detection functions in an embodiment of the present application;

图2是本申请一实施方式中一种集成机械能收集与振动检测功能的微器件局部主视图;2 is a partial front view of a micro device integrating mechanical energy collection and vibration detection functions in an embodiment of the present application;

图3是一实施方式中振动检测结构细节示意图;FIG. 3 is a schematic diagram of the details of the vibration detection structure in one embodiment;

图4是一实施方式中机电转换结构细节示意图;FIG. 4 is a schematic diagram of the details of the electromechanical conversion structure in one embodiment;

图5是一实施方式中金属条与裂纹结构和基底层的数据描述示意图。FIG. 5 is a schematic diagram illustrating the data description of the metal strip and the crack structure and the base layer in one embodiment.

具体实施方式Detailed ways

以下将结合附图所示的各实施方式对本发明进行详细描述。但该等实施方式并不限制本发明,本领域的普通技术人员根据该等实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and the structural, method, or functional transformations made by those of ordinary skill in the art based on these embodiments are all included in the protection scope of the present invention.

参考图1和图2所示,本申请一实施例提供了一种集成机械能收集与振动检测功能的微器件,包括基底层1,裂纹结构2,振动检测结构3和机电转换结构4;其中,裂纹结构2开设于基底层1上,且沿厚度方向贯穿基底层1 设置,裂纹结构2具有一封闭的尖端部21,振动检测结构3覆盖于裂纹结构 2上且远离尖端部21设置,机电转换结构4嵌设于基底层1内且与裂纹结构 2的尖端部21之间设有一定距离。Referring to FIG. 1 and FIG. 2, an embodiment of the present application provides a micro-device integrating mechanical energy collection and vibration detection functions, including a base layer 1, a crack structure 2, a vibration detection structure 3 and an electromechanical conversion structure 4; wherein, The crack structure 2 is opened on the base layer 1 and is arranged through the base layer 1 along the thickness direction. The crack structure 2 has a closed tip portion 21. The vibration detection structure 3 covers the crack structure 2 and is arranged away from the tip portion 21. Electromechanical conversion The structure 4 is embedded in the base layer 1 and has a certain distance from the tip portion 21 of the crack structure 2 .

基底层1由固化材料固化而成,固化材料可以为环氧树脂、硅胶、聚氨酯、聚二甲基硅氧烷、光刻胶中的一种,在本实施例中,优选为环氧树脂。The base layer 1 is formed by curing a curing material, and the curing material may be one of epoxy resin, silica gel, polyurethane, polydimethylsiloxane, and photoresist, and in this embodiment, epoxy resin is preferred.

裂纹结构2的形成可以通过在固化材料中加入金属条,并通过对固定在固化材料中的金属条进行腐蚀去除而得,其中,用于金属条腐蚀去除的溶液可以为氯化铁溶液、盐酸溶液、硫酸溶液中的一种。裂纹结构2自基底层1的一侧向内凹陷形成,其具有与尖端部21相对设置的开放部(图1中被振动检测结构 3覆盖),振动检测结构3覆盖于开放部上,该裂纹结构的裂纹宽度为5~50μm。The formation of the crack structure 2 can be obtained by adding metal strips to the solidified material, and by removing the metal strips fixed in the solidified material by corrosion, wherein the solution used for the corrosion and removal of the metal strips can be ferric chloride solution, hydrochloric acid. One of the solution and sulfuric acid solution. The crack structure 2 is formed concavely inward from one side of the base layer 1, and it has an open part (covered by the vibration detection structure 3 in FIG. 1) opposite to the tip part 21, and the vibration detection structure 3 covers the open part, and the crack The crack width of the structure is 5 to 50 μm.

参考图3所示,振动检测结构3由柔性薄膜基底层33、导电层32、信号导出电极31组成,柔性薄膜基底层33设于基底层1上,导电层32通过沉积、蒸镀、溅镀或刷涂的方法设于柔性薄膜基底层33上,信号导出电极31设于导电层32上。柔性薄膜基底层33可以为聚酰亚胺、聚乙烯、氯乙烯中的一种。导电层32的导电材料可以为金、银、铜、铂、石墨中的一种,导电层32上开设有纳米级裂纹微结构,该纳米级裂纹微结构可通过机械弯曲、有机溶剂诱导膨胀或光诱导膨胀等方法制备形成。Referring to FIG. 3, the vibration detection structure 3 is composed of a flexible film base layer 33, a conductive layer 32, and a signal lead-out electrode 31. The flexible film base layer 33 is provided on the base layer 1, and the conductive layer 32 is deposited, evaporated, and sputtered. Or the method of brushing is provided on the flexible film base layer 33 , and the signal lead-out electrode 31 is provided on the conductive layer 32 . The flexible film base layer 33 may be one of polyimide, polyethylene, and vinyl chloride. The conductive material of the conductive layer 32 can be one of gold, silver, copper, platinum, and graphite, and the conductive layer 32 is provided with a nanoscale crack microstructure, which can be mechanically bent, organic solvent-induced expansion or Light-induced expansion and other methods to prepare and form.

参考图4所示,机电转换结构4呈弧形设置,其内弧面与尖端部21相对设置。机电转换结构4距尖端部21由近及远依次包括第一导电膜41,换能材料层42和第二导电膜43,其中第一导电膜41和第二导电膜43上分别设置有电能导出电极44。第一导电膜41和第二导电膜43通过沉积、蒸镀、溅镀或刷涂的方法设于换能材料层42上,第一导电膜41和第二导电膜43中的导电材料可以为金、银、铜、铂、石墨中的一种。换能材料层42的换能材料可以为压电陶瓷、压电薄膜、复合压电材料中的一种。Referring to FIG. 4 , the electromechanical conversion structure 4 is arranged in an arc shape, and its inner arc surface is arranged opposite to the tip portion 21 . The electromechanical conversion structure 4 includes a first conductive film 41 , a transducing material layer 42 and a second conductive film 43 in order from near to far from the tip portion 21 , wherein the first conductive film 41 and the second conductive film 43 are respectively provided with an electrical energy outlet. electrode 44 . The first conductive film 41 and the second conductive film 43 are disposed on the transducer material layer 42 by means of deposition, evaporation, sputtering or brushing, and the conductive materials in the first conductive film 41 and the second conductive film 43 can be One of gold, silver, copper, platinum, and graphite. The transducer material of the transducer material layer 42 may be one of piezoelectric ceramics, piezoelectric thin films, and composite piezoelectric materials.

本发明的微器件,其工作原理可概括为:当进行振动信号检测时,振动信号作用与基底层1上,使得裂纹结构2宽度发生变化,并诱导振动检测结构3中的柔性薄膜基底层33发生变化,使得位于柔性薄膜基底层33上导电层32中的电阻发生变化,并进一步通过信号导出电极31实现电阻信号的输出,达到振动信号检测的功能;当进行能量收集时,外部激励作用于基底层 1上,由于裂纹结构2尖端的能量集中效应,使得机械能在尖端处高效聚集并被机电转换结构4中的换能材料层42转换成电能,并通过第一导电膜41、第二导电膜43和电能导出电极44输送到后续的处理模块中。The working principle of the micro-device of the present invention can be summarized as follows: when the vibration signal is detected, the vibration signal acts on the base layer 1, so that the width of the crack structure 2 changes, and the flexible film base layer 33 in the vibration detection structure 3 is induced. The change occurs, so that the resistance in the conductive layer 32 on the flexible film base layer 33 changes, and the output of the resistance signal is further realized through the signal derivation electrode 31, so as to achieve the function of vibration signal detection; when the energy is collected, the external excitation acts on On the base layer 1, due to the energy concentration effect at the tip of the crack structure 2, the mechanical energy is efficiently concentrated at the tip and converted into electrical energy by the transducer material layer 42 in the electromechanical conversion structure 4, and passes through the first conductive film 41, the second conductive film 41, the second conductive film The membrane 43 and the electrical energy discharge electrodes 44 are transported to subsequent processing modules.

本发明还公开了一种集成机械能收集与振动检测功能的微器件的制备方法,包含如下步骤:The invention also discloses a preparation method of a micro-device integrating mechanical energy collection and vibration detection functions, comprising the following steps:

步骤S1、将一端弧形设置的金属条放置于盛有液态固化材料的培养皿中,进行适度固化;Step S1, placing the metal strip with one end in an arc shape in a petri dish containing a liquid solidified material for moderate solidification;

步骤S2、将预先加工好的圆弧状机电转换结构放置在金属条弧形端的端点处,其内弧面正对金属条弧形端,并通过培养皿中的半固化状态物质将机电转换结构与金属条弧形端的端点隔开一段距离;Step S2, place the pre-fabricated circular arc-shaped electromechanical conversion structure at the end point of the arc-shaped end of the metal strip, the inner arc surface of which is facing the arc-shaped end of the metal strip, and convert the electromechanical conversion structure through the semi-solidified substance in the petri dish. at a distance from the endpoint of the arcuate end of the metal strip;

步骤S3、将金属条通过腐蚀液进行去除形成具有裂纹结构的基底层;Step S3, removing the metal strip through an etching solution to form a base layer with a cracked structure;

步骤S4、将预先加工好的柔性的振动检测结构平铺在裂纹结构开放部的基底层上,且设有信号导出电极的一侧朝外,并对基底层进行进一步固化;Step S4, laying the pre-fabricated flexible vibration detection structure on the base layer of the open portion of the crack structure, with the side provided with the signal exporting electrode facing outward, and further curing the base layer;

步骤S5、对制得的样品进行剪裁处理最终得到集机械能收集与振动检测功能一体的微器件。Step S5 , cutting the prepared sample to finally obtain a micro-device integrating the functions of mechanical energy collection and vibration detection.

在本发明的一个较佳实施例中,金属条的宽度D应与裂纹结构的宽度d 一致,其长度应与裂纹结构的长度一致,金属条端部应为弧形,便于形成裂纹结构的尖端部,金属条的厚度L应大于基底层的厚度l(裂纹结构的厚度),参考图5所示。In a preferred embodiment of the present invention, the width D of the metal strip should be consistent with the width d of the crack structure, its length should be consistent with the length of the crack structure, and the end of the metal strip should be arc-shaped to facilitate the formation of the tip of the crack structure The thickness L of the metal strip should be greater than the thickness l of the base layer (the thickness of the crack structure), as shown in FIG. 5 .

在本实施例中,裂纹结构长度为1000μm,则金属条长度为1000μm;裂纹结构宽度d为100μm,金属条的宽度D为100μm;固化材料形成的基底层的厚度l为100μm,则金属条的厚度L应设置为100μm到1000μm之间,较佳地,设置为500μm。In this embodiment, the length of the crack structure is 1000 μm, then the length of the metal strip is 1000 μm; the width d of the crack structure is 100 μm, the width D of the metal strip is 100 μm; the thickness l of the base layer formed by the cured material is 100 μm, then the The thickness L should be set between 100 μm and 1000 μm, preferably, set at 500 μm.

金属条也可采用其他常见的材料,如铝、铁、铜、不锈钢或各种合金等,只要便于腐蚀去除即可。Metal strips can also be made of other common materials, such as aluminum, iron, copper, stainless steel or various alloys, as long as they are easy to remove by corrosion.

对于步骤S1中提到的作为基底层的固化材料,可使用常见的环氧树脂材料,也可使用硅胶、聚氨酯、聚二甲基硅氧烷、光刻胶等易固化的材料。For the curing material mentioned in step S1 as the base layer, common epoxy resin materials can be used, and easily curable materials such as silica gel, polyurethane, polydimethylsiloxane, and photoresist can also be used.

在本发明的一个较佳实施例中,采用环氧树脂材料为例进行说明,采用环氧树脂材料时,可在30℃-50℃的状态下加热1-5小时,以使得环氧树脂呈半固化状态。需要注意的是,为使振动检测结构能够更好的粘附在裂纹结构的开放部,且使得机电转换结构能够更好的与环氧树脂进一步固化,在此步试验时无需将环氧树脂材料完全融化。In a preferred embodiment of the present invention, an epoxy resin material is used as an example for illustration. When an epoxy resin material is used, it can be heated at 30°C-50°C for 1-5 hours, so that the epoxy resin becomes semi-cured state. It should be noted that, in order to enable the vibration detection structure to better adhere to the opening of the crack structure, and to enable the electromechanical conversion structure to be further cured with the epoxy resin, the epoxy resin material is not required in this step of the test. completely melted.

对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the appended claims. All changes within the meaning and range of the equivalents of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

此外,应当理解,虽然本说明书按照实施例加以描述,但并非每个实施例仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (10)

1.一种集成机械能收集与振动检测功能的微器件,其特征在于,包括:1. a micro-device integrating mechanical energy collection and vibration detection function, is characterized in that, comprising: 基底层,其上开设有裂纹结构,所述裂纹结构沿所述基底层厚度方向贯穿该基底层,所述裂纹结构具有一封闭的尖端部;a base layer, on which a crack structure is opened, the crack structure penetrates the base layer along the thickness direction of the base layer, and the crack structure has a closed tip; 振动检测结构,设于所述基底层上且部分覆盖所述裂纹结构,所述振动检测结构用于检测振动信号;a vibration detection structure, disposed on the base layer and partially covering the crack structure, the vibration detection structure is used to detect vibration signals; 机电转换结构,嵌设于所述裂纹结构尖端部一侧的基底层内,所述机电转换结构能够将机械能进行收集并转化成电能。The electromechanical conversion structure is embedded in the base layer on one side of the tip of the crack structure, and the electromechanical conversion structure can collect and convert mechanical energy into electrical energy. 2.根据权利要求1所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述裂纹结构自所述基底层的一侧向内凹陷形成,其具有与所述尖端部相对设置的开放部,所述振动检测结构覆盖于所述开放部上。2 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1 , wherein the crack structure is formed by concave inward from one side of the base layer, and the crack structure is disposed opposite to the tip portion. 3 . the opening part, the vibration detection structure covers the opening part. 3.根据权利要求1所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述振动检测结构包括与所述基底层相贴合的柔性薄膜基底层,设于所述柔性薄膜基底层上的导电层以及设于所述导电层上的信号导出电极。3 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1 , wherein the vibration detection structure comprises a flexible film base layer attached to the base layer, which is arranged on the flexible film. 4 . A conductive layer on the base layer and a signal lead-out electrode provided on the conductive layer. 4.根据权利要求3所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述柔性薄膜基底层的导电层上开设有纳米级裂纹微结构。4 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 3 , wherein a nanoscale crack microstructure is formed on the conductive layer of the flexible film base layer. 5 . 5.根据权利要求3所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述柔性薄膜基底层可以为聚酰亚胺、聚乙烯、氯乙烯中的一种。5 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 3 , wherein the flexible film base layer can be one of polyimide, polyethylene, and vinyl chloride. 6 . 6.根据权利要求1所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述机电转换结构距所述尖端部由近及远依次包括第一导电膜,换能材料层和第二导电膜,其中所述第一导电膜和第二导电膜上分别设置有电能导出电极。6 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1 , wherein the electromechanical conversion structure comprises a first conductive film, a transducing material layer and a The second conductive film, wherein the first conductive film and the second conductive film are respectively provided with electric energy lead-out electrodes. 7.根据权利要求6所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述换能材料层为压电陶瓷、压电薄膜、复合压电材料中的一种。7 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 6 , wherein the transducing material layer is one of piezoelectric ceramics, piezoelectric thin films, and composite piezoelectric materials. 8 . 8.根据权利要求1所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述机电转换结构呈弧形设置,其内弧面与所述尖端部相对设置。8 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1 , wherein the electromechanical conversion structure is arranged in an arc shape, and its inner arc surface is opposite to the tip portion. 9 . 9.根据权利要求1所述的集成机械能收集与振动检测功能的微器件,其特征在于,所述基底层由固化材料固化而成,所述固化材料为环氧树脂、硅胶、聚氨酯、聚二甲基硅氧烷、光刻胶中的一种。9 . The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1 , wherein the base layer is formed by curing a curing material, and the curing material is epoxy resin, silica gel, polyurethane, polydiene One of methyl siloxane and photoresist. 10.一种上述权利要求1~9任一所述集成机械能收集与振动检测功能的微器件的制备方法,其特征在于,包括如下步骤:10. A method for preparing a micro-device integrating mechanical energy collection and vibration detection functions according to any one of the above claims 1 to 9, characterized in that, comprising the following steps: 将一端弧形的金属条放置于液态的固化材料中;Place the arc-shaped metal strip at one end in the liquid solidified material; 在固化材料达到半固化状态后,将机电转换结构置于金属条弧形端的固化材料中且距该金属条弧形端一定距离;After the cured material reaches a semi-cured state, the electromechanical conversion structure is placed in the cured material at the arc-shaped end of the metal strip at a certain distance from the arc-shaped end of the metal strip; 将金属条通过腐蚀液进行去除形成裂纹结构;The metal strip is removed by the corrosive liquid to form a crack structure; 将振动检测结构铺设于裂纹结构远离弧形端的一端,并对固化材料进行进一步固化。The vibration detection structure is laid on the end of the crack structure away from the arc-shaped end, and the cured material is further cured.
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CN114216590A (en) * 2021-11-24 2022-03-22 吉林大学 Scorpion-like slit pressure sensor and manufacturing method thereof

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