CN111755432B - LED lamp device and LED lamp bead thereof - Google Patents
LED lamp device and LED lamp bead thereofInfo
- Publication number
- CN111755432B CN111755432B CN202010772530.3A CN202010772530A CN111755432B CN 111755432 B CN111755432 B CN 111755432B CN 202010772530 A CN202010772530 A CN 202010772530A CN 111755432 B CN111755432 B CN 111755432B
- Authority
- CN
- China
- Prior art keywords
- conductive sheet
- positive
- led lamp
- bracket
- negative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H10W90/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
本发明公开了一种LED灯装置及其LED灯珠，LED灯珠包括正极导电片、负极导电片、晶片和支架，支架呈碗状，内壁面设有第一斜面部分以形成反光面，晶片安装在支架的底部上侧，正极导电片和负极导电片相互绝缘；晶片的两极分别与正极导电片和负极导电片上的触点电连接；正极导电片和负极导电片靠近支架的碗沿处弯折后分别与线路板的正、负极焊盘电连接。本发明所提供的LED灯珠，利用支架的碗装结构设计，且内壁面设有第一斜面部分以形成反光面，提高发光效果，另一方面，还利用正极导电片和负极导电片的弯折设置，方便与线路板进行连接的同时，增加了水汽进入光源内部的流程，大大的提高了产品的气密性，从而提升产品的可靠性及寿命。
The present invention discloses an LED lamp device and its LED lamp bead. The LED lamp bead includes a positive conductive sheet, a negative conductive sheet, a chip and a bracket. The bracket is bowl-shaped, and the inner wall surface is provided with a first inclined surface portion to form a reflective surface. The chip is mounted on the bottom upper side of the bracket, and the positive conductive sheet and the negative conductive sheet are insulated from each other; the two poles of the chip are electrically connected to the contacts on the positive conductive sheet and the negative conductive sheet respectively; the positive conductive sheet and the negative conductive sheet are bent near the bowl edge of the bracket and are electrically connected to the positive and negative electrode pads of the circuit board respectively. The LED lamp bead provided by the present invention utilizes the bowl-shaped structural design of the bracket, and the inner wall surface is provided with a first inclined surface portion to form a reflective surface, thereby improving the luminous effect. On the other hand, the bending setting of the positive conductive sheet and the negative conductive sheet is also utilized to facilitate connection with the circuit board, while increasing the flow of water vapor entering the interior of the light source, greatly improving the airtightness of the product, thereby improving the reliability and life of the product.
Description
Technical Field
The invention relates to the field of LED light-emitting equipment, in particular to an LED lamp bead. In addition, the invention also relates to an LED lamp device comprising the LED lamp bead.
Background
Along with the multiparty popularization of the LED lamp beads, the LED illumination has penetrated into various scenes of living and living needs of people, and accordingly, the requirements of people on the light emitting quality of the LED light source are improved, the reliability and the service life of products are continuously improved, more and more details are mined in the direction of extracting the light emitting rate, and accordingly, each dimension of the LED light source is improved.
In the prior art, two main flows of LED light sources are provided, one is a horizontal heat dissipation structure, the heat dissipation capacity of a structural product is general, the use current of a lamp bead is smaller, the other is a vertical heat dissipation structure, the structural product is a copper heat sink which is directly downwards transmitted to a radiator, the heat dissipation speed is high, the power can be higher in general, but the defects of the structural product are obvious, namely the product is thinner in height and poorer in air tightness, water vapor can easily permeate into the lamp bead to cause bad and even dead lamps, the bowl-cup structure of the lamp bead cannot be designed too much due to the limited height, and the difficulty and the cost of secondary optics are increased on the application with higher requirements on the light-emitting type.
Therefore, how to improve the light emitting effect of the LED lamp beads is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide an LED lamp bead which has good luminous effect, good air tightness, high reliability and long service life. Another object of the present invention is to provide an LED lamp device comprising the above-mentioned LED lamp bead.
In order to achieve the above purpose, the present invention provides the following technical solutions:
The LED lamp bead comprises an anode conducting plate, a cathode conducting plate, a wafer and a support, wherein the support is bowl-shaped, a first inclined surface part is arranged on the inner wall surface of the support to form a reflecting surface, the wafer is arranged on the upper side of the bottom of the support, the anode conducting plate and the cathode conducting plate are mutually insulated, two poles of the wafer are respectively and electrically connected with contacts on the anode conducting plate and the cathode conducting plate, and the anode conducting plate and the cathode conducting plate are respectively and electrically connected with an anode pad and a cathode pad of a circuit board after being bent near the bowl edge of the support.
Preferably, the inner surface of the support is provided with the first inclined surface part, the transition surface and the second inclined surface part from top to bottom, and the bottoms of the positive electrode conducting plate and the negative electrode conducting plate are exposed on the transition surface after being bent to form a contact.
Preferably, the top height of the second bevel portion is higher than the top height of the wafer.
Preferably, the cross section of the inner cavity of the bracket is circular, elliptical, square or polygonal. .
Preferably, the transition surface extends along the horizontal direction, and the bowl edges of the positive electrode conducting plate and the negative electrode conducting plate, which are close to the bracket, are respectively bent outwards along the horizontal direction.
The wafer is connected to the bottom bent edges of the positive electrode conductive sheet and the negative electrode conductive sheet, and the top bent edges of the positive electrode conductive sheet and the negative electrode conductive sheet are respectively connected with the positive electrode bonding pad and the negative electrode bonding pad of the circuit board.
Preferably, the solar cell further comprises a heat dissipation supporting component, wherein the wafer is arranged on the upper portion of the heat dissipation supporting component, the heat dissipation supporting component is fixedly arranged at the bottom of the support and is insulated from the positive electrode conducting plate and the negative electrode conducting plate, and the bottom surface of the heat dissipation supporting component is exposed on the surface of the support.
Preferably, the heat dissipation support part further comprises a shell, and the heat dissipation support part is in contact connection with the shell.
Preferably, the heat dissipation supporting component is a copper block.
The invention also provides an LED lamp device, which comprises the LED lamp bead and the circuit board, wherein the circuit board is provided with a hollowed-out part for placing the LED lamp bead.
The LED lamp bead comprises an anode conducting plate, a cathode conducting plate, a wafer and a support, wherein the support is bowl-shaped, a first inclined surface part is arranged on the inner wall surface of the support to form a reflecting surface, the wafer is arranged on the upper side of the bottom of the support, the anode conducting plate and the cathode conducting plate are mutually insulated, two poles of the wafer are respectively and electrically connected with contacts on the anode conducting plate and the cathode conducting plate, and the anode conducting plate and the cathode conducting plate are respectively and electrically connected with an anode bonding pad and a cathode bonding pad of a circuit board after being bent near the bowl edge of the support. According to the LED lamp bead provided by the invention, the bowl-shaped structure design of the bracket is utilized, the first inclined surface part is arranged on the inner wall surface to form the reflecting surface, so that the luminous effect is improved, and on the other hand, the bending arrangement of the positive electrode conducting plate and the negative electrode conducting plate is utilized, so that the connection with the circuit board is facilitated, the flow of water vapor entering the light source is increased, the air tightness of a product is greatly improved, and the reliability and the service life of the product are improved.
In a preferred embodiment, the solar cell further comprises a heat dissipation supporting component, the wafer is mounted on the upper portion of the heat dissipation supporting component, the heat dissipation supporting component is fixedly arranged at the bottom of the support and insulated from the positive electrode conducting plate and the negative electrode conducting plate, and the bottom surface of the heat dissipation supporting component is exposed on the surface of the support. By the arrangement, thermoelectric separation of the bottom of the bowl cup of the bracket is realized, and the heat dissipation supporting component in the middle die bonding area only conducts heat and is not electrified, so that the heat conduction speed can be greatly increased, and the reliability and the service life of a product are improved.
The LED lamp device provided by the invention is provided with the LED lamp beads, and the LED lamp device provided with the LED lamp beads has the corresponding technical effects because the LED lamp beads have the technical effects.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of an embodiment of an LED lamp bead provided by the invention;
Fig. 2 is a schematic structural diagram of an embodiment of the LED lamp device according to the present invention;
fig. 3 is a schematic structural diagram of a specific embodiment of a circuit board in the LED lamp device provided by the present invention;
fig. 4 is a top view of an LED lamp bead provided by the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of the positive conductive sheet and the negative conductive sheet of the LED lamp bead according to the present invention;
Fig. 6 is a schematic structural diagram of a third embodiment of a positive conductive sheet and a negative conductive sheet of an LED light bulb according to the present invention;
The circuit board comprises a circuit board body 100, a hollowed-out part 101, a bonding pad 102, a lens 201, an anode conducting plate 202, a wafer 203, a bracket 204, a heat dissipation supporting part 205, a cathode conducting plate 206, a gold wire 207 and a shell 300.
Detailed Description
The core of the invention is to provide the LED lamp bead, which has good luminous effect, good air tightness, high reliability and long service life. Another core of the invention is to provide an LED lamp device comprising the above-mentioned LED lamp bead.
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 6, fig. 1 is a schematic structural diagram of an embodiment of an LED lamp bead provided by the present invention, fig. 2 is a schematic structural diagram of an embodiment of an LED lamp device provided by the present invention, fig. 3 is a schematic structural diagram of an embodiment of a circuit board in an LED lamp device provided by the present invention, fig. 4 is a top view of an LED lamp bead provided by the present invention, fig. 5 is a schematic structural diagram of another embodiment of a positive electrode conductive sheet and a negative electrode conductive sheet of an LED lamp bead provided by the present invention, and fig. 6 is a schematic structural diagram of a third embodiment of a positive electrode conductive sheet and a negative electrode conductive sheet of an LED lamp bead provided by the present invention.
In this embodiment, positive electrode conductive sheet 202, negative electrode conductive sheet 206, wafer 203, and holder 204 are included.
The inner wall surface of the support 204 is provided with a first inclined surface portion to form a reflecting surface, the outer surface of the first inclined surface portion faces the bowl opening direction of the support 204, specifically, the cross section of an inner cavity of the support 204 may be circular, elliptic, square or polygonal, preferably circular, the cross section of the first inclined surface portion is preferably a first circular table surface, of course, the cross section of the inner cavity of the support 204 may also be polygonal, that is, the first inclined surface portion is divided into a plurality of different inclined surfaces along the circumferential direction, the wafer 203 is mounted on the upper side of the bottom of the support 204, the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are mutually insulated and can be respectively mounted on two sides of the support 204, two poles of the wafer 203 are respectively electrically connected with contacts on the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206, specifically, the wafer 203 is connected to the bottoms of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206, and the positive electrode conductive sheet 206 are respectively electrically connected with the positive electrode pad 102 and the negative electrode pad 102 of the circuit board 100 after being bent near the bowl edge of the support 204, so that the electrical connection between the circuit board 100, the positive electrode conductive sheet 202, the negative electrode conductive sheet 206 and the wafer 203 is realized. Specifically, the bowl edge of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206, which are close to the bracket 204, are connected with the circuit board 100, the lens 201 is mounted at the outer edges of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 and is located at the upper side of the circuit board 100, and the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 adopt a mode of folding feet upwards, so that the heights of bonding pads on the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are close to the light emitting surface.
According to the LED lamp bead provided by the invention, the bowl-shaped structure design of the bracket 204 is utilized, the first inclined surface part is arranged on the inner wall surface to form the reflecting surface, so that the luminous effect is improved, and on the other hand, the bending arrangement of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 is utilized, so that the connection with the circuit board 100 is facilitated, the flow of water vapor entering the light source is increased, the air tightness of a product is greatly improved, and the reliability and the service life of the product are improved.
On the basis of the above embodiments, the inner surface of the support 204 is provided with a first inclined surface portion, a transition surface and a second inclined surface portion from top to bottom, that is, the inner surface of the support 204 is provided with two inclined surface portions, preferably, the bottoms of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are bent and then exposed on the transition surface to form contacts, the contacts of the wafer 203 and the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are respectively connected through gold wires 207, and the bent positions of the bottoms of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are close to the positions of the wafer 203, so that the connection of the wafer 203 is facilitated. The transition surface may divide the inner surface of the support 204 into two parts, forming two inclined surface parts, i.e. a light source structure for realizing double bowl and cup superposition.
Further, the top height of the second inclined surface portion is higher than the top height of the wafer 203, so that the light reflection effect of the second inclined surface portion is improved, and the light emitting effect of the whole lamp bead is further improved.
By designing the die bonding area and the bonding wire area to be different in height, the small bowl cup formed by the second inclined surface part can be formed first, the depth of the bowl cup is larger than or equal to the height of the wafer 203, and the bowl cup formed by the first inclined surface part of the bracket 204 is added to realize double bowl cup design.
Based on the above embodiments, the inner surface of the support 204 further includes a third inclined surface portion located at the bottom of the second inclined surface portion, and further, the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 affect the number of times of increasing the folded angle, so that the air tightness of the product is improved by folding the legs multiple times.
Of course, the die bonding area and the bonding wire area may not be subjected to dislocation processing, and the same height may be maintained, that is, only the first inclined surface portion may be provided, and the heat dissipation may be realized by adding a heat dissipation plate to the circuit board 100 to distinguish the power-on area from the heat dissipation area.
On the basis of the above embodiments, the transition surface extends in the horizontal direction, and the bowl edges of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 near the bracket 204 are respectively bent outward in the horizontal direction.
Based on the above embodiments, the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are all Z-shaped, and the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are symmetrically placed, the middle inclined surfaces of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 incline from top to bottom from the bowl edge of the bracket 204 to the bowl bottom, the wafer 203 is connected to the bottom bent edges of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206, and the top bent edges of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 are respectively connected with the positive electrode bonding pad 102 and the negative electrode bonding pad 102 of the circuit board 100.
Specifically, through designing the structure of bonding wire region, after keeping bonding wire region position, through the mode of bending foot, upwards roll over positive pole conducting strip 202 and negative pole conducting strip 206, make the bonding pad welded position on positive pole conducting strip 202 and the negative pole conducting strip 206 highly be close with the light emitting area, can make things convenient for the customer to use the time need with the lamp pearl subside, positive, negative bonding pad on positive pole conducting strip 202 and the negative pole conducting strip 206 just matches and paste the level with the positive, negative pole bonding pad 102 of circuit board 100, be favorable to realizing the ultrathin of whole lamp like this.
On the basis of the above embodiments, the heat dissipation support member 205 is further included, the wafer 203 is mounted on the upper portion of the heat dissipation support member 205, the heat dissipation support member 205 is fixedly arranged at the bottom of the support 204 and insulated from the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206, and the bottom surface of the heat dissipation support member 205 is exposed on the surface of the support 204.
By the arrangement, thermoelectric separation of the bottom of the bowl cup of the bracket 204 is realized, and the heat dissipation supporting component 205 in the middle die bonding area only conducts heat and is not electrified, so that the heat conduction speed can be greatly increased, and the reliability and the service life of a product are improved.
In addition to the above embodiments, the heat dissipation support member 205 further includes a housing 300, and the heat dissipation support member 205 is in contact connection with the housing 300, and the heat dissipation support member 205 is directly communicated with the heat dissipation housing 300 on the back surface, so that the heat dissipation effect is good.
Preferably, the heat dissipation supporting member 205 is a copper block, and the heat dissipation effect is good.
On the basis of the above embodiments, the outer end portions of the positive electrode conductive sheet 202 and/or the negative electrode conductive sheet 206 are cut to be provided with a plurality of protruding portions, so that the LED lamp bead provided by the application has a sinking design, so that the position of the positive electrode conductive sheet 202 and/or the negative electrode conductive sheet 206 for being connected with the circuit board 100 is larger in size, so as to ensure the connection strength.
Specifically, the outer end structures of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 may be the same or different, preferably have a plurality of protruding portions, and a through hole is formed in the middle of each protruding portion, as shown in fig. 5, or the outer end edge of the positive electrode conductive sheet 202 is provided with a broken line edge formed by cutting, so as to form a plurality of triangular protruding portions, and the outer end edge of the negative electrode conductive sheet 206 is provided with a circular arc edge formed by cutting, so as to form a plurality of arc protruding portions, and of course, the outer end structures of the positive electrode conductive sheet 202 and the negative electrode conductive sheet 206 may be freely combined, at least one of which may not be cut.
According to the LED lamp bead provided by the invention, through the height fall design between the die bonding area and the bonding wire area, the plastic material can wrap the anode conductive sheet 202 and the cathode conductive sheet 206 more comprehensively and tightly, and then the electrode is LED out by being assisted by a pin bending mode, so that the flow of water vapor entering the light source is increased, the air tightness of the product is greatly improved, and the reliability and the service life of the product are improved.
In addition to the LED lamp beads, the present invention further provides an LED lamp device including the LED lamp beads, and other parts of the LED lamp device are referred to the prior art, and are not described herein.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The LED lamp bead provided by the invention is described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010772530.3A CN111755432B (en) | 2020-08-04 | 2020-08-04 | LED lamp device and LED lamp bead thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010772530.3A CN111755432B (en) | 2020-08-04 | 2020-08-04 | LED lamp device and LED lamp bead thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111755432A CN111755432A (en) | 2020-10-09 |
| CN111755432B true CN111755432B (en) | 2025-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010772530.3A Active CN111755432B (en) | 2020-08-04 | 2020-08-04 | LED lamp device and LED lamp bead thereof |
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| Country | Link |
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| CN (1) | CN111755432B (en) |
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| KR20110123945A (en) * | 2010-05-10 | 2011-11-16 | 박광돈 | Light emitting diode heat dissipation package and its manufacturing method |
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| JP2017037917A (en) * | 2015-08-07 | 2017-02-16 | 日亜化学工業株式会社 | Lead frame, package, light emitting device, and manufacturing method thereof |
| CN212390215U (en) * | 2020-08-04 | 2021-01-22 | 宁波升谱光电股份有限公司 | LED lamp device |
| CN212485323U (en) * | 2020-08-04 | 2021-02-05 | 宁波升谱光电股份有限公司 | LED lamp device and LED lamp bead thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1467414A4 (en) * | 2001-12-29 | 2007-07-11 | Hangzhou Fuyang Xinying Dianzi | A led and led lamp |
| WO2017061844A1 (en) * | 2015-10-08 | 2017-04-13 | 주식회사 세미콘라이트 | Semiconductor light-emitting device |
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2020
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110123945A (en) * | 2010-05-10 | 2011-11-16 | 박광돈 | Light emitting diode heat dissipation package and its manufacturing method |
| CN102779934A (en) * | 2011-05-09 | 2012-11-14 | 绿弥利奇株式会社 | Light emitting diode device |
| KR20130077965A (en) * | 2011-12-30 | 2013-07-10 | 루미마이크로 주식회사 | Light emitting diode package |
| JP2017037917A (en) * | 2015-08-07 | 2017-02-16 | 日亜化学工業株式会社 | Lead frame, package, light emitting device, and manufacturing method thereof |
| CN212390215U (en) * | 2020-08-04 | 2021-01-22 | 宁波升谱光电股份有限公司 | LED lamp device |
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