CN111712036B - Optical device and packaging method thereof - Google Patents
Optical device and packaging method thereof Download PDFInfo
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- CN111712036B CN111712036B CN202010555692.1A CN202010555692A CN111712036B CN 111712036 B CN111712036 B CN 111712036B CN 202010555692 A CN202010555692 A CN 202010555692A CN 111712036 B CN111712036 B CN 111712036B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000013039 cover film Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 230000008054 signal transmission Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
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- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides an optical device and a packaging method thereof, the optical device comprises a flexible circuit board, a tube shell and a conductive connecting piece, the flexible circuit board comprises a first reference ground pad, a first signal pad and a dielectric layer, the first reference ground pad and the first signal pad are positioned on the same surface of the dielectric layer, the tube shell comprises a second reference ground pad, a second signal pad and a substrate, a first step surface and a second step surface adjacent to the first step surface are formed on one side surface of the substrate, the second step surface is higher than the first step surface in a height direction of the substrate, the second signal pad is positioned on the second step surface, the second reference ground pad is positioned on the first step surface, the first signal pad is connected with the second signal pad, an accommodating space is formed between the first reference ground pad and the second reference ground pad, and the conductive connecting member fills the accommodating space so as to connect the first reference ground pad and the second reference ground pad.
Description
Technical Field
The present application relates to the field of optical communication technologies, and in particular, to an optical device and a method for packaging the same.
Background
In the existing optical communication system, the optical device is packaged and applied by adopting an airtight shell very commonly, the signal transmission of the optical device is conducted by adopting a flexible circuit board generally, and along with the continuous improvement of the transmission rate of the optical communication system, in the transmission application of the transmission rate of 25Gbps and above, the high-frequency signal loss between the flexible circuit board and the airtight shell has more and more obvious influence, so that the indexes of a transmitting end or a receiving end are degraded, and the whole transmission performance of the optical device is influenced.
Disclosure of Invention
In view of the above, it is desirable to provide an optical device and a packaging method thereof, which have the characteristic of less high frequency signal loss. In order to achieve the above beneficial effects, the technical solution of the embodiment of the present application is implemented as follows:
an embodiment of the present application provides an optical device, including:
the flexible circuit board comprises a first reference ground pad, a first signal pad and a dielectric layer, wherein the first reference ground pad and the first signal pad are positioned on the same surface of the dielectric layer;
a package including a second reference ground pad, a second signal pad and a substrate, wherein a first step surface and a second step surface adjacent to the first step surface are formed on one side surface of the substrate, the second step surface is higher than the first step surface in the height direction of the substrate, the second signal pad is located on the second step surface, the second reference ground pad is located on the first step surface, the first signal pad is connected to the second signal pad, and an accommodating space is formed between the first reference ground pad and the second reference ground pad; and
a conductive connector filling the receiving space so as to connect the first and second reference ground pads.
Further, in a projection plane perpendicular to the height direction of the substrate, an edge line of the first step surface close to the second signal pad, an edge line of the second reference ground pad close to the second signal pad, an edge line of the first reference ground pad close to the first signal pad, and an edge line of the second step surface close to the first reference ground pad coincide.
Further, a portion of the first ground reference pad is located on the second step face.
Further, in a projection plane perpendicular to the height direction of the substrate, a projection of the conductive connector, a projection of the first ground reference pad, and a projection of the second ground reference pad coincide.
Furthermore, in a projection plane perpendicular to the height direction of the dielectric layer, the projection of the first reference ground pad is rectangular, the width of the first reference ground pad is A, and A is larger than or equal to 0.5mm and smaller than or equal to 1.5 mm.
Further, the flexible circuit board comprises two reference ground parts connected with the first reference ground pad, the first reference ground pad and the two reference ground parts are jointly arranged to form an accommodating area in an enclosing mode, and the first signal pad is located in the accommodating area.
Further, the flexible circuit board includes a first signal layer and a first reference ground, the first reference ground and the first reference ground pad are located on the same surface of the dielectric layer, the first signal layer is located on a surface of the dielectric layer away from the first reference ground, the first signal layer is connected to the first signal pad, the first reference ground is connected to the first reference ground pad, the package includes a second signal layer and a second reference ground, the second signal layer is connected to the second signal pad, the second reference ground pad is connected to the second reference ground, and the first signal layer and the second signal layer are used for transmitting high-frequency signals.
Further, the package includes a case, and the second ground reference pad, the second signal pad, and a portion of the substrate near the second signal pad are located outside the case.
Further, the optical device comprises a low frequency circuit board for transmitting a low frequency signal;
a third step surface is formed on the surface of the substrate where the first step surface is located, the third step surface is adjacent to the second step surface, the third step surface is higher than the second step surface in the height direction of the substrate, and the low-frequency circuit board is located on the third step surface; or the low-frequency circuit board is positioned on the surface of the substrate, which is deviated from the first step surface.
Another aspect of the embodiments of the present application provides a method for packaging an optical device, including:
forming a first step surface and a second step surface adjacent to the first step surface on one side surface of a substrate of a tube shell, wherein the second step surface is higher than the first step surface in the height direction of the substrate;
arranging a second reference ground pad on the first step surface, and arranging a second signal pad on the second step surface;
aligning a first signal pad and a second signal pad of a flexible circuit board, a first reference ground pad and a second reference ground pad of the flexible circuit board forming a receiving space therebetween;
the conductive connecting member fills the accommodating space.
The optical device provided by the embodiment of the application utilizes the conductive connecting piece to connect the first reference ground bonding pad and the second reference ground bonding pad, so that impedance sudden change is avoided, impedance is stably transited between the signal reference ground of the flexible circuit board and the signal reference ground of the tube shell, and signal loss is small.
Drawings
Fig. 1 is a schematic structural diagram of an optical device provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of another perspective of the flexible circuit board of FIG. 2;
FIG. 4 is a schematic structural diagram of a tube shell provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of another optical device provided in an embodiment of the present application;
fig. 6 is a graph of a simulation bandwidth calculation result of an optical device provided in the embodiment of the present application and an optical device in the prior art;
fig. 7 is a flowchart of a packaging method of an optical device according to an embodiment of the present disclosure.
Description of the reference numerals
A flexible circuit board 100; an avoidance region 100 a; a first ground reference pad 110; a first signal pad 120; a dielectric layer 130; a reference ground portion 140; a first signal layer 150; a first reference ground 160; a bottom cover film 170; a top cover film 180; a tube shell 200; a substrate 210; a first step surface 211; a second step surface 212; a third step surface 213; a second reference ground 220; a housing 230; a conductive connection member 300; a low frequency circuit board 400.
Detailed Description
It should be noted that, in the present application, technical features in examples and embodiments may be combined with each other without conflict, and the detailed description in the specific embodiment should be understood as an explanation of the gist of the present application and should not be construed as an improper limitation to the present application. In the description of the embodiments of the present application, the "top", "bottom", "upper" and "lower" orientation and position relationships are orientation and position relationships when the optical device is normally used, for example, the orientation and position relationship shown in fig. 1, "μm" refers to international unit micrometer, and "mm" refers to international unit millimeter. The present application will now be described in further detail with reference to the accompanying drawings and specific examples.
Referring to fig. 1 to 5, an aspect of the present disclosure provides an optical device including a flexible circuit board 100, a package 200, and a conductive connector 300. The flexible circuit board 100 includes a first reference ground pad 110, a first signal pad 120, and a dielectric layer 130. First reference ground pad 110 and first signal pad 120 are located on the same surface of dielectric layer 130. That is, the first reference ground pad 110 and the first signal pad 120 are located on the same side of the dielectric layer 130. The package 200 includes a second reference ground pad, a second signal pad, and a substrate 210. A first step surface 211 and a second step surface 212 adjacent to the first step surface 211 are formed on one side surface of the substrate 210. The second step surface 212 is higher than the first step surface 211 in the height direction of the substrate 210. A second signal pad is located on the second step surface 212 and a second reference ground pad is located on the first step surface 211. The first signal pad 120 is connected to the second signal pad. Since the first ground reference pad 110 and the first signal pad 120 are located at substantially the same height and the second step surface 212 is higher than the first step surface 211, the second signal pad is higher than the second ground reference pad, and the height of the first ground reference pad 110 is higher than that of the second ground reference pad, there is a height difference between the first ground reference pad 110 and the second ground reference pad. The first and second reference ground pads 110 and 110 form an accommodation space therebetween. The conductive connector 300 fills the receiving space to connect the first and second reference ground pads 110 and 110.
Referring to fig. 6, since the reference ground of the flexible circuit board and the reference ground of the package are connected by the via hole in the prior art, and the impedance at the via hole has a sudden change, which is a discontinuous point of a signal return path, it is easy to cause signal transmission discontinuity between the reference ground of the flexible circuit board and the reference ground of the package, and particularly in high-frequency signal transmission, discontinuous switching of the reference ground may cause significant signal loss (see a dashed line D in fig. 6), which affects signal transmission quality. In the embodiment of the present application, the conductive connection member 300 is used to connect the first reference ground pad 110 and the second reference ground pad, so as to avoid impedance abrupt change, so that impedance between the signal reference ground of the flexible circuit board 100 and the signal reference ground of the package 200 is smoothly transited, and signal loss is small (see a solid line C in fig. 6), thereby ensuring signal transmission quality and avoiding affecting the overall transmission performance of the optical device. In addition, compared with the process of drilling holes and copper plating in the holes required for forming the via holes on the substrate 210, in the embodiment of the application, the process of forming the first step surface 211 and the second step surface 212 on the substrate 210 is simple, an accommodating space can be formed between the first reference ground pad 110 and the second reference ground pad quickly and efficiently, the process size is controlled better, the process is simple and easy to implement, the process difficulty can be effectively reduced, and the cost can be reduced.
In one embodiment, referring to fig. 2 and 3, the flexible circuit board 100 includes a first signal layer 150 and a first reference ground 160. First ground reference 160 and first ground reference pad 110 are located on the same surface of dielectric layer 130. First signal layer 150 is located on a surface of dielectric layer 130 facing away from first reference ground 160. The first signal layer 150 is connected to the first signal pad 120. The first ground reference 160 is connected to the first ground reference pad 110. The package 200 includes a second signal layer and a second ground reference 220. The second signal layer is connected to the second signal pad. The second ground reference pad is connected to a second ground reference 220. The first signal layer 150 and the second signal layer are used to transmit high frequency signals.
A high frequency signal may be transmitted from the first signal layer 150 to the second signal layer through the first signal pad 120 and the second signal pad, and during a reflow process of the high frequency signal, the high frequency signal may reflow to the first reference ground 160 through the second reference ground 220, the second reference ground pad, the conductive connector 300, the first reference ground pad 110. Of course, the high frequency signal may also be transmitted from the second signal layer to the first signal layer 150 through the second signal pad and the first signal pad 120, and during the high frequency signal reflow process, the high frequency signal is reflowed to the second reference ground 220 through the first reference ground 160, the first reference ground pad 110, the conductive connector 300, and the second reference ground pad.
Because the conductive connection piece 300 enables the impedance between the second reference ground 220 and the first reference ground 160 to be smoothly transited, the impedance is prevented from suddenly changing, and the high-frequency signal is effectively prevented from generating large loss on the return flow path of the second reference ground 220, the conductive connection piece 300 and the first reference ground 160.
In the general optical communication field, a high-frequency signal is a signal having a frequency of 3MHZ or more. In the embodiment of the present application, the height direction of the substrate 210 is the thickness direction of the substrate 210. The Flexible Circuit board 100 (FPC) refers to a Circuit board having a certain flexibility.
It is understood that the end of the flexible Circuit Board 100 away from the package 200 may be connected to a Printed Circuit Board (PCB) or other structures, that is, the flexible Circuit Board 100 may be used to connect the PCB and the package 200 for signal transmission between the PCB and the package 200, of course, the end of the flexible Circuit Board 100 away from the package 200 may be connected to other structures, and the other structures may be optical components for realizing other functions, etc. In the embodiment of the present application, the package 200 may be a package with an optical transceiver function or other functions.
It should be noted that the first signal layer 150 may include at least one first signal line. For example, the number of the first signal lines may be 1, 2, 3, or 4, and the like, and the number of the first signal lines on the first signal layer 150 is not limited. The first signal pad 120 may include a plurality of first sub-signal pads. For example, 2, 3, or 4 first sub-signal pads, and the first signal pads 120 are disposed corresponding to the first signal lines. Flexible circuit board 100 may also include a third signal pad located on a surface of dielectric layer 130 facing away from first reference ground pad 110. That is, the third signal pad is located on the upper surface of the dielectric layer 130, the third signal pad is disposed corresponding to the first signal pad 120, and the third signal pad and the first signal pad 120 may be connected through a via. That is to say, the first signal layer 150 is connected to the second signal layer through the double-sided bonding pads, so that the connection strength between the first signal layer 150 and the second signal layer is enhanced, and the connection failure between the first signal layer 150 and the second signal layer after any one of the bonding pads falls off is avoided.
Also, the second signal layer may include at least one second signal line. For example, the number of the first signal lines may be 1, 2, 3, or 4, and the like, and the number of the first signal lines on the first signal layer 150 is not limited. The second signal pad may include a plurality of sub-signal line pads. For example, the sub-signal line pads may be 2, 3, or 4, and so on, and the second signal pads and the second signal lines are disposed correspondingly.
Specifically, the connection of the first signal pad 120 and the second signal pad is an electrical connection. The first signal pad 120 and the second signal pad may be connected by soldering. The connection of the first reference ground pad 110 and the second reference ground pad is an electrical connection. The conductive connection member 300 may be a conductive paste or a solder. The connection between the first reference ground pad 110 and the second reference ground pad is accomplished using a conductive connection 300. The first signal layer 150 is connected to be electrically connected to the first signal pad 120. The connection between the first signal layer 150 and the first signal pad 120 may be achieved using soldering. The first reference ground 160 is connected to be electrically connected with the first reference ground pad 110. The connection between the first reference ground 160 and the first reference ground pad 110 may be achieved using soldering. The second signal layer is electrically connected to the second signal pad. The second signal layer and the second signal pad may be connected by soldering. The second ground reference pad is connected to be electrically connected with the second ground reference 220. The connection between the second ground reference pad and the second ground reference 220 may be achieved by soldering.
In one embodiment, referring to fig. 2, the flexible circuit board 100 includes a top cover film 180 and a bottom cover film 170, the top cover film 180 is located on the first signal layer 150, and the bottom cover film 170 is located on the first reference ground 160. The top cover film 180 and the bottom cover film 170 function to insulate, protect the first signal layer 150, protect the first reference ground 160, and enhance the bending resistance of the flexible circuit board 100.
Specifically, the first signal line is a metal line, for example, a copper-clad line. The first reference ground 160 is a metal layer, for example, a copper clad layer. The top cover film 180 and the bottom cover film 170 are made of an insulating material. The dielectric layer 130 and the substrate 210 are made of insulating materials. The dielectric layer 130 may be made of polyester or polyimide. The substrate 210 may be made of ceramic.
In one embodiment, the thickness of the bottom cover film 170 is 25 μm, the thickness of the first reference ground 160 is 18 μm, the thickness of the dielectric layer 130 is 50 μm, the thickness of the first signal layer 150 is 18 μm, and the thickness of the bottom cover film 170 is 25 μm. The height difference between the third step surface 213 and the second step surface 212 is greater than or equal to 0.5mm and less than or equal to 1.5 mm. For example, the height difference between the third step surface 213 and the second step surface 212 may be 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.3mm, 1.5mm, or the like. The height difference between the second step surface 212 and the first step surface 211 is greater than or equal to 0.2mm and less than or equal to 0.4 mm. For example, the difference in height between the second step surface 212 and the first step surface 211 may be 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, or 0.5mm, and so forth.
In an embodiment, referring to fig. 1 and 5, in a projection plane perpendicular to the height direction of the substrate 210, an edge line of the first step surface 211 close to the second signal pad, an edge line of the second reference ground pad close to the second signal pad, an edge line of the first reference ground pad 110 close to the first signal pad 120, and an edge line of the second step surface 212 close to the first reference ground pad 110 coincide. That is, an edge line of the first reference ground pad 110 adjacent to the first signal pad 120 is aligned with an edge line of the second step face 212 adjacent to the first reference ground pad 110. The edge line of the second reference ground pad adjacent to the second signal pad is aligned with the edge line of the first step face 211 adjacent to the second signal pad.
The conductive connector 300 is filled into the accommodating space, the conductive connector 300 is substantially confined in the accommodating space by the wall surface of the accommodating space, and the edge line of the first reference ground pad 110 adjacent to the first signal pad 120 is aligned with the edge line of the second step face 212 adjacent to the first reference ground pad 110, the contact edge of the conductive connector 300 with the first reference ground pad 110 is enabled to be aligned with the edge of the second step face 212 adjacent to the first reference ground pad 110, and thus, it can be easily ensured by the constraint of the wall surface of the receiving space that the contact edges of the conductive connector 300 and the first reference ground pad 110 and the contact edges of the conductive connector 300 and the second reference ground pad can be substantially aligned, therefore, the impedance of the conductive connection 300 can be easily controlled, and the impedance transition between the signal reference ground of the flexible circuit board 100 and the signal reference ground of the package 200 can be ensured.
In an embodiment not shown, a portion of first ground reference pad 110 is located on second step surface 212. Therefore, under the condition that the conductive connecting piece 300 can be fully contacted with the first reference ground pad 110, a certain fault-tolerant interval can be provided for the conductive connecting piece 300, the assembly difficulty of the conductive connecting piece 300 is reduced, and the problems that the contact area between the conductive connecting piece 300 and the first reference ground pad 110 is insufficient and the like caused by manufacturing process errors and/or assembly process errors are solved.
In some embodiments, the minimum distance between the edge line of the first reference ground pad 110 close to the first signal pad 120 and the edge line of the second step face 212 close to the first reference ground pad 110 is B, wherein B is greater than or equal to 0.1mm and less than or equal to 0.5 mm. Illustratively, the minimum distance B between the edge line of the first reference ground pad 110 close to the first signal pad 120 and the edge line of the second step face 212 close to the first reference ground pad 110 may be 0.1mm, 0.2mm, 0.25mm, 0.3mm, 0.4mm, 0.45mm, 0.5mm, or the like. Thus, the minimum distance B between the edge line of the first reference ground pad 110 close to the first signal pad 120 and the edge line of the second step surface 212 close to the first reference ground pad 110 is prevented from being too small, and the fault-tolerant interval of the conductive connecting member 300 is not sufficient; and the minimum distance B between the edge line of the first reference ground pad 110 close to the first signal pad 120 and the edge line of the second step surface 212 close to the first reference ground pad 110 is prevented from being too large, so that impedance smooth transition between the signal reference ground of the flexible circuit board 100 and the signal reference ground of the package 200 is not realized.
In an embodiment, referring to fig. 1, in a projection plane perpendicular to the height direction of the substrate 210, a projection of the conductive connector 300, a projection of the first ground reference pad 110, and a projection of the second ground reference pad coincide. In this way, the soldering areas of the conductive connection member 300, the first reference ground pad 110 and the second reference ground pad are consistent, thereby ensuring a smooth transition in impedance between the signal reference ground of the flexible circuit board 100 and the signal reference ground of the package 200.
In an embodiment, referring to fig. 3, in a projection plane perpendicular to the height direction of the dielectric layer 130, the projection of the first reference ground pad 110 is rectangular, the width of the first reference ground pad 110 is a, where a is greater than or equal to 0.5mm and less than or equal to 1.5 mm. Illustratively, the width a of the first reference ground pad 110 may be 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.3mm, 1.4mm, 1.5mm, and so on. Specifically, the width direction of the first reference ground pad 110 refers to a direction extending from the dielectric layer 130 toward the substrate 210. In this way, the conductive connection member 300, the first reference ground pad 110 and the second reference ground pad are ensured to have a sufficient contact area, increasing the connection strength between the conductive connection member 300, the first reference ground pad 110 and the second reference ground pad.
In an embodiment, referring to fig. 3, the flexible circuit board 100 includes two reference ground portions 140 connected to the first reference ground pad 110, the first reference ground pad 110 and the two reference ground portions 140 jointly enclose a keep-out region 100a, and the first signal pad 120 is located in the keep-out region 100 a. Thus, loss in the signal backflow process is further avoided.
Specifically, the reference ground part 140 extends from the first reference ground pad 110 toward the substrate 210. The reference ground portion 140 is substantially elongated. Further, the first reference ground pad 110 and the two reference ground portions 140 are substantially F-shaped in a projection plane perpendicular to the height direction of the substrate 210.
In one embodiment, referring to fig. 1, 4 and 5, the package 200 includes a housing 230, and the second ground reference pad, the second signal pad and a portion of the substrate 210 near the second signal pad are located outside the housing 230. Thus, the flexible circuit board 100 is mounted and dismounted without disassembling the housing 230 for the second time, thereby avoiding affecting the air tightness of the housing 230 and saving the process and cost.
In some embodiments, the package 200 is hermetically sealed. Other structures may be disposed on a portion of the substrate 210 away from the second signal pad, so as to hermetically encapsulate the other structures in the housing 230, so as to ensure electrical performance of the other structures located in the housing 230 and avoid moisture, dust, and the like.
In one embodiment, referring to fig. 1 and 5, the optical device includes a low frequency circuit board 400 for transmitting low frequency signals. In an embodiment, referring to fig. 1, a third step surface 213 is formed on a surface of the substrate 210 where the first step surface 211 is located. The third step surface 213 abuts the second step surface 212. The third step surface 213 is higher than the second step surface 212 in the height direction of the substrate 210, and the low frequency circuit board 400 is located on the third step surface 213. Thus, the distance between the flexible circuit board 100 and the low frequency circuit board 400 is relatively long, and the signals transmitted on the flexible circuit board 100 and the signals transmitted on the low frequency circuit board 400 are prevented from interfering with each other. In another embodiment, referring to fig. 5, the low frequency circuit board 400 is located on a surface of the substrate 210 facing away from the first step surface 211. Thus, the distance between the flexible circuit board 100 and the low frequency circuit board 400 is relatively long, and the signals transmitted on the flexible circuit board 100 and the signals transmitted on the low frequency circuit board 400 are prevented from interfering with each other.
Referring to fig. 7, another aspect of the present invention further provides a method for packaging an optical device, where the method includes:
s110: a first step surface and a second step surface adjacent to the first step surface are formed on one side surface of a substrate of a package, and the second step surface is higher than the first step surface in the height direction of the substrate.
S120: a second reference ground pad is disposed on the first step surface, and a second signal pad is disposed on the second step surface.
S130: and aligning a first signal pad and a second signal pad of a flexible circuit board, wherein a containing space is formed between the first reference ground pad and the second reference ground pad of the flexible circuit board.
Specifically, the first signal pad may be located at an end portion of the dielectric layer. The first signal pad and the second signal pad can be welded through manual welding, and when the first signal pad and the second signal pad are aligned, a certain gap is formed between the dielectric layer and the second step surface, so that an operator can observe whether the first signal pad and the second signal pad are aligned or not.
S140: the conductive connecting member fills the accommodating space.
The conductive connecting member may be a conductive paste or solder. If the conductive connection is solder, the first and second reference ground pads are soldered. The first signal pad and the second signal pad may be soldered after aligning the first signal pad and the second signal pad. The first signal pad and the second signal pad may also be soldered after the conductive connector fills the receiving space.
Specifically, welding includes, but is not limited to, laser welding or pressure welding.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A light device, comprising:
the flexible circuit board comprises a first reference ground pad, a first signal pad and a dielectric layer, wherein the first reference ground pad and the first signal pad are positioned on the same surface of the dielectric layer;
a package including a second reference ground pad, a second signal pad and a substrate, wherein a first step surface and a second step surface adjacent to the first step surface are formed on one side surface of the substrate, the second step surface is higher than the first step surface in the height direction of the substrate, the second signal pad is located on the second step surface, the second reference ground pad is located on the first step surface, the first signal pad is connected to the second signal pad, and an accommodating space is formed between the first reference ground pad and the second reference ground pad; and
a conductive connector filling the receiving space so as to connect the first and second reference ground pads.
2. The optical device according to claim 1, wherein, in a projection plane perpendicular to the height direction of the substrate, an edge line of the first step face close to the second signal pad, an edge line of the second reference ground pad close to the second signal pad, an edge line of the first reference ground pad close to the first signal pad, and an edge line of the second step face close to the first reference ground pad coincide.
3. The optical device of claim 1, wherein a portion of the first ground reference pad is located on the second step face.
4. The optical device according to claim 1, wherein a projection of the conductive connection, a projection of the first ground reference pad, and a projection of the second ground reference pad coincide within a projection plane perpendicular to a height direction of the substrate.
5. The optical device according to claim 1, wherein a projection of the first reference ground pad is rectangular in a projection plane perpendicular to a height direction of the dielectric layer, a width of the first reference ground pad is A, and A is greater than or equal to 0.5mm and less than or equal to 1.5 mm.
6. The optical device according to any one of claims 1 to 5, wherein the flexible circuit board comprises two reference ground portions connected to the first reference ground pad, the first reference ground pad and the two reference ground portions jointly enclose a receiving area, and the first signal pad is located in the receiving area.
7. The optical device according to any of claims 1 to 5, wherein the flexible circuit board comprises a first signal layer and a first reference ground, the first reference ground and the first reference ground pad are located on the same surface of the dielectric layer, the first signal layer is located on a surface of the dielectric layer facing away from the first reference ground, the first signal layer is connected to the first signal pad, the first reference ground is connected to the first reference ground pad, the package comprises a second signal layer and a second reference ground, the second signal layer is connected to the second signal pad, the second reference ground pad is connected to the second reference ground, and the first signal layer and the second signal layer are used for transmitting high-frequency signals.
8. The optical device according to any one of claims 1 to 5, wherein the package includes a housing, and the second ground reference pad, the second signal pad, and a portion of the substrate adjacent to the second signal pad are located outside the housing.
9. The optical device according to any one of claims 1 to 5, wherein the optical device comprises a low frequency circuit board for transmitting a low frequency signal;
a third step surface is formed on the surface of the substrate where the first step surface is located, the third step surface is adjacent to the second step surface, the third step surface is higher than the second step surface in the height direction of the substrate, and the low-frequency circuit board is located on the third step surface; or the low-frequency circuit board is positioned on the surface of the substrate, which is deviated from the first step surface.
10. A method of packaging an optical device, comprising:
forming a first step surface and a second step surface adjacent to the first step surface on one side surface of a substrate of a tube shell, wherein the second step surface is higher than the first step surface in the height direction of the substrate;
arranging a second reference ground pad on the first step surface, and arranging a second signal pad on the second step surface;
aligning a first signal pad and a second signal pad of a flexible circuit board, a first reference ground pad and a second reference ground pad of the flexible circuit board forming a receiving space therebetween;
the conductive connecting member fills the accommodating space.
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| CN202010555692.1A CN111712036B (en) | 2020-06-17 | 2020-06-17 | Optical device and packaging method thereof |
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| CN202010555692.1A CN111712036B (en) | 2020-06-17 | 2020-06-17 | Optical device and packaging method thereof |
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| WO2025000692A1 (en) * | 2023-06-29 | 2025-01-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135637A (en) * | 1996-10-31 | 1998-05-22 | Sumitomo Kinzoku Electro Device:Kk | Ceramic multilayer wiring substrate |
| CN101448375A (en) * | 2008-06-23 | 2009-06-03 | 崔景德 | Flexible printed circuit board of large capacity signal transmission medium |
| CN110213880A (en) * | 2018-02-28 | 2019-09-06 | 苏州旭创科技有限公司 | Flexible circuit board, circuit board assemblies, optical transceiver module and optical module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7969015B2 (en) * | 2005-06-14 | 2011-06-28 | Cufer Asset Ltd. L.L.C. | Inverse chip connector |
| CN103426844B (en) * | 2012-05-22 | 2017-02-15 | 广州程星通信科技有限公司 | Broadband full-sealed package of microwave devices |
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2020
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135637A (en) * | 1996-10-31 | 1998-05-22 | Sumitomo Kinzoku Electro Device:Kk | Ceramic multilayer wiring substrate |
| CN101448375A (en) * | 2008-06-23 | 2009-06-03 | 崔景德 | Flexible printed circuit board of large capacity signal transmission medium |
| CN110213880A (en) * | 2018-02-28 | 2019-09-06 | 苏州旭创科技有限公司 | Flexible circuit board, circuit board assemblies, optical transceiver module and optical module |
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