CN111687078B - Semiconductor test sorting machine - Google Patents
Semiconductor test sorting machine Download PDFInfo
- Publication number
- CN111687078B CN111687078B CN202010707664.7A CN202010707664A CN111687078B CN 111687078 B CN111687078 B CN 111687078B CN 202010707664 A CN202010707664 A CN 202010707664A CN 111687078 B CN111687078 B CN 111687078B
- Authority
- CN
- China
- Prior art keywords
- turnover
- workbench
- tray
- platform
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 154
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 230000007306 turnover Effects 0.000 claims abstract description 152
- 230000007246 mechanism Effects 0.000 claims abstract description 147
- 230000000750 progressive effect Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 238000002203 pretreatment Methods 0.000 claims 2
- 230000007723 transport mechanism Effects 0.000 claims 1
- 238000007599 discharging Methods 0.000 description 47
- 238000000034 method Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 125000004122 cyclic group Chemical class 0.000 description 6
- 210000001503 joint Anatomy 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000003993 interaction Effects 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本发明公开了一种半导体测试分选机，其包括第一工作台、第二工作台、上料机构、下料机构、循环转运机构以及测试机构；上料机构和下料机构分别设置在第一工作台上的两侧，测试机构设置在第二工作台上；循环转运机构包括循环转运输送线和设置在循环转运输送线上的若干周转盘，循环转运输送线的一端与第一工作台对接，另一端与第二工作台对接，循环转运输送线用于带动其上的若干周转盘以递进移动方式在第一工作台和第二工作台之间循环移动；具有上述结构的半导体测试分选机，通过上料、循环输送、测试、下料分选等多工位的设置，实现了对芯片测试工作的全自动运行，有效提高测试效率，使用方便。
The present invention discloses a semiconductor test sorting machine, which comprises a first workbench, a second workbench, a loading mechanism, an unloading mechanism, a circulating transfer mechanism and a testing mechanism; the loading mechanism and the unloading mechanism are respectively arranged on both sides of the first workbench, and the testing mechanism is arranged on the second workbench; the circulating transfer mechanism comprises a circulating transfer conveying line and a plurality of turnover disks arranged on the circulating transfer conveying line, one end of the circulating transfer conveying line is connected to the first workbench, and the other end is connected to the second workbench, and the circulating transfer conveying line is used to drive the plurality of turnover disks thereon to circulate between the first workbench and the second workbench in a progressive movement manner; the semiconductor test sorting machine with the above structure realizes the full automatic operation of chip testing work through the setting of multiple stations such as loading, circulating conveying, testing, unloading and sorting, effectively improves the testing efficiency, and is easy to use.
Description
Technical Field
The invention relates to the technical field of chip testing equipment, in particular to a fully-automatic semiconductor testing and sorting machine.
Background
Chips, i.e., large-scale integrated circuits, are used in various circuit structures to simplify the circuit scale. As a precision electronic device, after the chip is processed, a strict test procedure is required to be performed to formally enter the market. Although various automatic test equipment is used for testing the performance of chips at present, most of the current test equipment focuses on the application of a terminal test machine, in practice, a series of intermediate processes of feeding and discharging are very little focused, so that a worker is required to carry a tray to the terminal test machine, and after the test is finished, the tested tray is removed, so that the whole test process needs to be attended by people and is matched with the work of the terminal test machine, the current chip test equipment can only be calculated as semi-automatic equipment, and the efficiency of chip test work is seriously affected due to the innovation defect of a matching mechanism between the multi-station of feeding, transferring, testing and discharging in the chip test process.
Disclosure of Invention
The invention aims to provide a semiconductor test sorting machine for solving the defects of the technical problems, and the working mechanisms among a plurality of stations which are stored in a classified manner from feeding to discharging in the chip test process are effectively connected together so as to realize the full-automatic operation of chip test analysis work.
In order to achieve the above purpose, the invention discloses a semiconductor test handler, which comprises a first workbench, a second workbench, a feeding mechanism, a discharging mechanism, a circulating transfer mechanism and a test mechanism;
The feeding mechanism and the discharging mechanism are respectively arranged on two sides of the first workbench, and the testing mechanism is arranged on the second workbench;
The circulating transfer mechanism comprises a circulating transfer conveying line and a plurality of peripheral turntables arranged on the circulating transfer conveying line, one end of the circulating transfer conveying line is in butt joint with the first workbench, the other end of the circulating transfer conveying line is in butt joint with the second workbench, and the circulating transfer conveying line is used for driving the plurality of peripheral turntables on the circulating transfer conveying line to move in a circulating manner between the first workbench and the second workbench in a progressive manner;
the feeding mechanism is used for transferring chips to be tested to the turnover disc, the discharging mechanism is used for transferring the tested chips from the turnover disc to different material discs according to test results, and the testing mechanism is used for testing the chips conveyed by the circulating transfer mechanism
Compared with the prior art, the semiconductor test sorting machine is provided with the feeding mechanism, the discharging mechanism and the circulating transfer mechanism which are matched with the test mechanism, the feeding mechanism, the discharging mechanism and the test mechanism are respectively arranged on the first workbench and the second workbench which are mutually separated and are connected through the circulating transfer mechanism, when the test work is carried out, the chip to be tested is moved and placed in the turntable on the circulating transfer conveying line through the feeding mechanism on the first workbench, then, the peripheral turntable is conveyed to a testing mechanism on a second workbench in a progressive movement mode through a circulating transfer conveying line, after the testing is finished, the testing mechanism automatically moves the tested chips to the peripheral turntable on the circulating transfer conveying line, then the circulating transfer conveying line conveys the peripheral turntable to a blanking mechanism at the first workbench, and the blanking mechanism places the tested chips in the peripheral turntable into different trays according to the testing result so as to finish the blanking and sorting work of the chips; therefore, the semiconductor test sorting machine with the structure realizes full-automatic operation of chip test work through multi-station arrangement of feeding, circulating conveying, testing, blanking sorting and the like, effectively improves the test efficiency and is convenient to use.
Preferably, the feeding mechanism comprises a plurality of first positioning grooves and feeding manipulators, wherein the first positioning grooves and the feeding manipulators are arranged on the first workbench and are positioned on one side of the circulating transfer conveying line, and the discharging mechanism comprises a plurality of second positioning grooves and discharging manipulators, the second positioning grooves and the discharging manipulators are arranged on the first workbench and are positioned on the other side of the circulating transfer conveying line;
The first positioning groove is used for placing a tray filled with chips to be tested, the feeding manipulator is used for moving the chips in the tray positioned in the first positioning groove into a turnover tray positioned on the circulating transfer conveying line and moving towards the second workbench, the second positioning groove is used for placing an empty tray, and the discharging manipulator is used for moving the chips in the turnover tray returned from the second workbench on the circulating transfer conveying line into the empty tray in the second positioning groove.
Preferably, the testing mechanism comprises at least one testing machine and a testing manipulator, and the testing manipulator is used for moving the chips to be tested in the turnover tray to the testing machine and moving the tested chips in the testing machine to the turnover tray.
The feeding mechanism further comprises a plurality of feeding bins, a feeding turnover manipulator and a plurality of feeding lifting platforms, wherein the feeding bins, the feeding turnover manipulator and the feeding lifting platforms are arranged below the first workbench, the feeding lifting platforms are respectively right opposite to each first positioning groove, the feeding lifting platforms are arranged below the first workbench, the feeding turnover manipulator and the discharging lifting platforms are respectively right opposite to each second positioning groove, the feeding bins and the discharging bins are respectively used for accommodating a plurality of trays in a stacked mode, the feeding turnover manipulator is used for transferring any tray in the feeding bin to the feeding lifting platform, the discharging turnover manipulator is used for transferring the tray on the discharging lifting platform to any discharging lifting platform, the feeding lifting platforms are used for lifting the tray to the first positioning groove in an up-down moving mode, and the discharging lifting platforms are used for grabbing the tray in the second positioning groove to the second positioning groove in an up-down moving mode.
Preferably, the upper bin and the lower bin comprise a base, a base and a plurality of stop rods, the stop rods are vertically arranged at different positions on the base, a containing space for containing a tray is positioned between the stop rods, and the base is in sliding connection with the base through a drawing structure, so that the base can enter and exit below the first workbench.
Preferably, the feeding turnover manipulator and the discharging turnover manipulator comprise a substrate matched with the material tray, a rotating shaft is respectively arranged at four corners of the substrate, at least one hooking part is arranged on the rotating shaft and used for hooking the edge of the material tray, a connecting rod driving mechanism connected with the rotating shaft is further arranged on the substrate and used for driving the four rotating shafts to synchronously rotate so as to hook or release the material tray.
The circulating transfer conveyor line comprises a feed line, a feed back line, a front turnover mechanism and a rear turnover mechanism which are arranged in parallel, wherein the feed line is used for conveying the turnover plate from the first workbench to the second workbench, the feed back line is used for conveying the turnover plate from the second workbench to the first workbench, the front turnover mechanism is arranged at one end, close to the first workbench, of the feed back line, the rear turnover mechanism is arranged at one end, close to the second workbench, of the feed back line, the front turnover mechanism comprises a first turnover platform in butt joint with the feed back line and the feed back line, a side pushing mechanism and a front pushing mechanism are arranged on the first turnover platform, the side pushing mechanism is used for pushing the turnover plate from a position corresponding to the feed back line to a position corresponding to the feed back line on the first turnover platform, the front pushing mechanism is used for pushing the turnover plate from the first turnover platform to one end, close to the feed back line, the rear turnover mechanism is arranged at one end, close to the second turnover platform, or the first turnover platform, the second turnover platform, the first turnover platform, the second turnover mechanism, the second turnover platform, the second turnover platform and the lifting mechanism are arranged in parallel to be connected to the first turnover platform, the second turnover platform, the turnover platform and the lifting mechanism are arranged in a parallel to the lifting platform.
The feeding line and the returning line both comprise a guide rail group and a pushing mechanism arranged below the guide rail group, the guide rail group extends from the first workbench to the second workbench, the turnover plate can slide back and forth on the guide rail group, the pushing mechanism comprises a push rod, a sliding rail, a rotary driver and a displacement driver, a plurality of supporting rods extending in the same direction are arranged on the push rod at intervals, the distance between the two supporting rods is equal to the length of the turnover plates, the push rod is in sliding connection with the sliding rail, the displacement driver is used for driving the push rod to slide back and forth along the sliding rail, and the rotary driver is used for driving the push rod to rotate on the sliding rail by taking the long axis of the push rod as a rotary shaft so that the supporting rods extend out of or are separated from between the two turnover plates.
Preferably, a section of pretreatment box is arranged on the feeding line, and the pretreatment box is used for heating or freezing the chips in the turnover disc passing through the feeding line.
Preferably, the test machine comprises a supporting table, a holding cavity for holding the chip to be tested is arranged on the supporting table, a cover plate is arranged above the holding cavity, the cover plate can horizontally slide above the holding cavity to open or close the holding cavity, a heating block is arranged on the bottom wall of the cover plate, a lifting driver for driving the heating block to move up and down is arranged on the bottom wall of the cover plate, and the heating block is used for being abutted to the chip to be tested at a set test temperature.
Drawings
Fig. 1 is a schematic plan view of a semiconductor test handler according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view of a station chip testing and sorting machine according to an embodiment of the invention.
Fig. 3 is a schematic perspective view of a station chip test handler according to an embodiment of the present invention, in which a manipulator has been removed.
Fig. 4 is a schematic diagram of a turnover mechanism for feeding and discharging in an embodiment of the present invention.
Fig. 5 is a schematic diagram of a three-dimensional structure of an upper bin and a lower bin in an embodiment of the invention.
Fig. 6 is a schematic perspective view of a loading turnover manipulator and a unloading turnover manipulator according to an embodiment of the present invention.
Fig. 7 is a schematic perspective view of the rotation structure in fig. 6.
Fig. 8 is a schematic view of an installation structure of a cyclic transfer conveyor line in an embodiment of the present invention.
Fig. 9 is a schematic perspective view of the front epicyclic mechanism mounted in fig. 8.
Fig. 10 is a schematic perspective view of the rear epicyclic mechanism mounted in fig. 8.
Fig. 11 is a schematic perspective view of a pushing mechanism installed in the feed line in fig. 8.
Fig. 12 is a schematic perspective view of a pushing mechanism installed in the feed back line in fig. 8.
FIG. 13 is a schematic view showing the mounting structure of a suction head according to an embodiment of the present invention.
Fig. 14 is a schematic perspective view of a test machine according to an embodiment of the invention.
Fig. 15 is an exploded view of fig. 14.
Detailed Description
In order to describe the technical content, the constructional features, the achieved objects and effects of the present invention in detail, the following description is made in connection with the embodiments and the accompanying drawings.
The invention discloses a semiconductor test separator which is used for testing manufactured chips, and the invention only aims at the flow cooperation among multiple stations in the chip test process and does not describe the test principle too much. As shown in fig. 1 to 3, the semiconductor test handler in the present embodiment includes a first table 1, a second table 2, a loading mechanism 10, a discharging mechanism 11, a circulating transfer mechanism 3, and a testing mechanism 20.
The first workbench 1 is located at a front end station, the second workbench 2 is located at a rear end station, the feeding mechanism 10 and the discharging mechanism 11 are respectively arranged on two sides of the first workbench 1, and the testing mechanism 20 is arranged on the second workbench 2. The circulating transfer mechanism 3 comprises a circulating transfer conveying line 30 and a plurality of peripheral turntables 31 arranged on the circulating transfer conveying line 30, one end of the circulating transfer conveying line 30 is in butt joint with the first workbench 1, the other end of the circulating transfer conveying line is in butt joint with the second workbench 2, the circulating transfer conveying line 30 is used for driving the plurality of peripheral turntables 31 on the circulating transfer conveying line to move between the first workbench 1 and the second workbench 2 in a progressive moving mode, so that chips to be tested are conveyed to the testing mechanism 20 by the feeding mechanism 10, and the tested chips are conveyed to the discharging mechanism 11 by the testing mechanism 20. The feeding mechanism 10 is used for transferring chips to be tested to the turnover disc 31, the discharging mechanism 11 is used for transferring the chips after the testing to different trays 4 from the turnover disc 31 according to the testing result, in this embodiment, the feeding mechanism 10 and the discharging mechanism 11 are respectively located at two opposite sides of the circulating transfer conveying line 30, so as to facilitate feeding and discharging, and the testing mechanism 20 is used for testing the chips conveyed by the circulating transfer mechanism 3. Therefore, the semiconductor test sorting machine with the structure realizes full-automatic operation of chip test work through multi-station arrangement of feeding, circulating conveying, testing, discharging sorting and the like, effectively improves the test efficiency and is convenient to use.
As shown in fig. 2 and 3, the feeding mechanism 10 includes a plurality of first positioning slots 100 and a feeding manipulator 101 disposed on the first working table 1 and located at one side of the circulating transfer conveyor line 30, and the discharging mechanism 11 includes a plurality of second positioning slots 110 and a discharging manipulator 111 disposed on the first working table 1 and located at the other side of the circulating transfer conveyor line 30.
The first positioning groove 100 is used for placing a tray 4 filled with chips to be tested, and the feeding manipulator 101 is used for moving the chips in the tray 4 in the first positioning groove 100 into a turnover tray 31 which is positioned on the circulating transfer conveying line 30 and moves towards the second workbench 2. The second positioning groove 110 is used for placing the empty tray 4, and the blanking manipulator 111 is used for moving the chips in the turnover tray 31 returned from the second workbench 2 on the circulating transfer conveyor line 30 into the empty tray 4 in the second positioning groove 110. In operation, the loading robot 101 takes material from the tray 4 in the two first positioning grooves 100 adjacent to the cyclic transfer line 30, and the unloading robot 111 temporarily moves all chips in the cyclic carousel 31 into the tray 4 in the two second positioning grooves 110 adjacent to the cyclic transfer line 30, so for convenience of description, the two first positioning grooves 100 adjacent to the cyclic transfer line 30 are defined as loading levels, and the two second positioning grooves 110 adjacent to the cyclic transfer line 30 are defined as unloading levels.
As shown in fig. 2 and 13, the feeding manipulator 101 and the discharging manipulator 111 in the above embodiment have the same mechanical structure, and each of them adsorbs a chip by arranging a row of a plurality of suction heads 5, and the feeding manipulator 101 and the discharging manipulator 111 share a portal frame assumed above the first table 1. In addition, since the pitch of the tray 4 is different from the pitch of the pockets in the turnover tray 31 (one chip is placed in each pocket), the feeding manipulator 101 and the discharging manipulator 111 are each provided with a pitch-changing structure for changing the distance between the suction heads 5 on the feeding manipulator 101 and the discharging manipulator 111, for example, when the feeding manipulator 101 is to suck chips from the tray 4, the distance between the suction heads 5 is changed to correspond to the pitch of the pockets in the tray 4 through the pitch-changing structure, and when the feeding manipulator 101 is to suck chips from the turnover tray 31, the distance between the suction heads 5 is changed to correspond to the pitch of the pockets in the turnover tray 31 through the pitch-changing structure. The specific composition of the pitch-changing structure is common knowledge in the art, and will not be described herein.
In this embodiment, two (not limited by times) first positioning slots 100 are provided, ten (not limited by times) second positioning slots 110 are provided, before the test work starts, trays 4 filled with chips to be tested are placed in the two first positioning slots 100, empty trays 4 are placed in the ten second positioning slots 110, two of the ten second positioning slots 110 can be used for discharging material levels, the rest are used for sorting, and can be divided into a first chip position, a second chip position, a third chip position, etc. according to the test result, NG positions can be further provided, when the turnover tray 31 is conveyed to the second workbench 2 by the circulating transfer conveyor line 30, all chips are placed in the empty trays 4 in the discharging material levels in sequence by the discharging manipulator 111, and after the turnover tray 31 is removed, the chips with different test performances are placed in the empty trays 4 in different positions by the discharging manipulator 111 in sequence according to the test result, so that sorting storage is facilitated. In addition, as shown in fig. 3, because the spacing between the pockets in the tray 4 and the turnover tray 31 is different, in order to facilitate the quick blanking of the blanking manipulator 111 to match with the quick running of the testing mechanism 20, a middle tray 6 may be disposed on the second workbench 2 near the blanking position, where the spacing between the pockets in the middle tray 6 is the same as that of the turnover tray 31, the blanking manipulator 111 may firstly place the chips in the turnover tray 31 into the middle tray 6 quickly, and no pitch change is required in each transferring process, and after the blanking of the turnover tray 31 is completed, the blanking manipulator 111 sorts the different chips in the middle tray 6 into the empty trays 4 in different positions.
Preferably, as shown in fig. 2, the test mechanism 20 includes at least one test machine 200 and a test manipulator 201, and the test manipulator 201 is used for moving the chips to be tested in the turnover tray 31 to the test machine 200 and moving the tested chips in the test machine 200 to the turnover tray 31. In this embodiment, six groups of testing machines 200 are respectively disposed on two sides of the circulating conveying device 30, and the six groups of testing machines 200 can work simultaneously to improve the testing efficiency.
Further, referring to fig. 3 and 4 in combination, the feeding mechanism 10 further includes a plurality of feeding bins 102, a feeding turnover manipulator 103 and a plurality of feeding lifting platforms 104 respectively opposite to each first positioning slot 100 below the first workbench 1. The blanking mechanism 11 further comprises a plurality of blanking bins 112, a blanking turnover manipulator 113 and a plurality of blanking lifting platforms 114 which are respectively right opposite to each second positioning groove 110, wherein the blanking bins 112, the blanking turnover manipulator 113 and the blanking lifting platforms are arranged below the first workbench 1. In this embodiment, the upper bin 102 is located on the same side of the first table 1 as the first positioning slot 100, the lower bin 112 is located on the same side of the first table 1 as the second positioning slot 110, and the upper bin 102 and the lower bin 112 are each configured to house a plurality of trays 4 in a stacked manner. The feeding turnover manipulator 103 is used for transferring the material tray 4 in any one of the feeding bins 102 to the feeding lifting platform 104, and the discharging turnover manipulator 113 is used for transferring the material tray 4 on the discharging lifting platform 114 to any one of the discharging bins 112. The feeding lifting platform 104 is used for lifting the material tray 4 into the first positioning groove 100 in an up-and-down moving manner, and the discharging lifting platform 114 is used for transferring the material tray 4 in the second positioning groove 110 to the lower part of the second positioning groove 110 in an up-and-down moving manner so as to be grabbed by the discharging turnover manipulator 113.
In the above embodiment, two loading lifting platforms 104 are provided, and the two loading lifting platforms are respectively arranged under the first positioning slots 100 corresponding to the two loading levels, and the loading turnover manipulator 103 moves the trays 4 in each loading bin 102 under the loading lifting platform 104 to the loading lifting platform 104 through up-down and left-right translational movement, and then lifts the trays 4 to the loading level through the loading lifting platform 104 to be grabbed by the loading manipulator 101, so that batches of trays 4 filled with chips can be placed in each loading bin 102, and batch automatic testing is realized. In addition, the blanking lifting platform 114 is disposed below each second positioning groove 110 except the blanking level, when chips are loaded in the trays 4, the trays 4 are moved to the lower side of the second workbench 2 by the blanking lifting platform 114, and then the trays 4 are transferred to each blanking bin 112 by the blanking turnover manipulator 113, so that batch blanking is realized.
As shown in fig. 5, the upper bin 102 and the lower bin 112 each include a base 120, a base 121, and a plurality of bars 122, the bars 122 are vertically disposed at different positions on the base 120, and a receiving space 123 for receiving the tray 4 is located between the bars 122. The base 120 is slidably connected with the base 121 through a drawing structure (drawer type), so that the base 120 can enter and exit from the lower part of the first workbench 1, and feeding is facilitated. In addition, in order to facilitate fixing the base 120, a limiting hole 124 is provided on the base 121 mated with the base 120, a limiting post (not shown) and a rotating handle 125 connected to the limiting post are provided on the base 120, and the limiting post is rotated by the rotating handle 125, so that the limiting post is locked or unlocked with the limiting hole 124.
As shown in fig. 6, the feeding turnover manipulator 103 and the discharging turnover manipulator 113 each include a substrate 130 adapted to the tray 4, four corners of the substrate 130 are respectively provided with a rotation shaft 131, at least one hooking portion 132 is provided on the rotation shaft 131, the hooking portion 132 is used for hooking the edge of the tray 4, a link driving mechanism 133 connected with the rotation shaft 131 is further provided on the substrate 130, and the link driving mechanism 133 is used for driving the four rotation shafts 131 to rotate synchronously so as to hook or release the tray 4. In this embodiment, referring to fig. 7, an upper hooking portion 132 and a lower hooking portion 132 are disposed on each rotating shaft 131, the hooking directions of the two hooking portions 132 are opposite, and the distance between the two hooking portions 132 is the thickness of one tray 4, so that the feeding turnover manipulator 103 and the discharging turnover manipulator 113 can grasp two trays 4 each time, and the specific working principle is that when the base plate 130 is located right above the current tray 4 and is attached to the tray 4, the connecting rod driving mechanism 133 drives the rotating shaft 131 to rotate, when the upper hooking portion 132 is rotated 90 ° (clockwise) to rotate below the upper tray 4, one tray 4 can be taken, and when the lower hooking portion 132 is rotated 90 ° (anticlockwise) to rotate below the second tray 4, two trays 4 can be removed at a time.
Further, as shown in fig. 8, the endless transfer conveyor line 30 includes a feed line 300, a return line 301, a front turnaround mechanism 302, and a rear turnaround mechanism 303, which are arranged in parallel.
The feed line 300 is used for transferring the turnover disc 31 from the first workbench 1 to the second workbench 2, the return line 301 is used for transferring the turnover disc 31 from the second workbench 2 to the first workbench 1, the front turnover mechanism 302 is arranged at one end of the feed line 300 and the return line 301 close to the first workbench 1, and the rear turnover mechanism 303 is arranged at one end of the feed line 300 and the return line 301 close to the second workbench 2.
Referring to fig. 8 and 9 in combination, the front turn-around mechanism 302 includes a first turn platform 3020 that interfaces with the feed line 300 and the return line 301, and a side pushing mechanism 3021 and a front pushing mechanism 3022 are provided on the first turn platform 3020. The side pushing mechanism 3021 is used for pushing the turn table 31 on the first turn table 3020 from a position corresponding to the feed line 301 to a position corresponding to the feed line 300, and the front pushing mechanism 3022 is used for pushing the turn table 31 from the first turn table 3020 to the feed line 300. When the tray 4 is conveyed to the position corresponding to the feed line 301 on the first rotation stage 3020, first, the side pushing mechanism 3021 is operated to push the current tray 4 to the position corresponding to the feed line 300, and then the forward pushing mechanism 3022 is operated to push the current tray 4 to the feed line 300 to participate in the circulation again.
Referring to fig. 8 and 10 in combination, the rear turn-around mechanism 303 includes a lift table 3030, a rotary table 3031, a translation mechanism 3032, and a second turn-around platform 3033. The elevating platform 3030 is mounted on a translation mechanism 3032, the rotating platform 3031 is mounted on the elevating platform 3030, the second turnover platform 3033 is connected with the rotating platform 3031, the translation mechanism 3032 is used for driving the elevating platform 3030 to move between the feeding line 300 and the return line 301, so that the first turnover platform 3020 is in butt joint with the feeding line 300 or the return line 301, the rotating platform 3031 is used for driving the second turnover platform 3033 to rotate in a horizontal plane, and the elevating platform 3030 is used for driving the second turnover platform to move up and down. When the tray 4 is transported to the test bench 200 at the end position of the tray 300, firstly, the translation mechanism 3032 acts to make the second turnover platform 3033 opposite to the feed line 300, then the lifting platform 3030 moves up and down to make the working surface of the second turnover platform 3033 flush with the feed line 300, so that the current turnover tray 31 is transported to the second turnover platform 3033, then the lifting platform 3030 rises to make the turnover tray 31 flush with the test bench 200, then the rotating platform 3031 rotates, the direction of the current turnover tray 31 is adjusted to match the work of the test manipulator 201, after the test manipulator 201 finishes taking the material, the translation mechanism 3032 acts again to make the second turnover platform 3033 translate to be aligned with the return line 301, then the rotating platform 3031 and the lifting platform 3030 act again to make the height of the second turnover platform 3033 flush with the return line 301, at this time, the turnover tray 31 on the second turnover platform 3033 can be moved to the return line 301 by a pushing mechanism or a driving mechanism of the return line 301 which is additionally arranged, and the turnover tray 31 can be moved to the blanking mechanism 11 by the return line 301.
Further, as shown in fig. 8, 11 and 12, each of the feeding line 300 and the returning line 301 includes a guide rail set 40 and a pushing mechanism 41 mounted below the guide rail set 40, the guide rail set 40 extends from the first working table 1 to the second working table 2, and the turnover plate 31 can slide back and forth on the guide rail set 40. The pushing mechanism 41 includes a push rod 410, a slide rail 411, a rotation driver 412, and a displacement driver 413. The push rod 410 is provided with a plurality of struts 414 extending in the same direction at intervals, and the distance between the struts 414 is equal to the length of the turnover disc 31. The push rod 410 is slidably connected with the sliding rail 411, the displacement driver 413 is used for driving the push rod 410 to slide back and forth along the sliding rail 411, and the rotation driver 412 is used for driving the push rod 410 to rotate on the sliding rail 411 with the long axis of the push rod 410 as a rotation axis, so that the support rod 414 extends out or is separated from between the two peripheral turntables 31. When the turntable 31 is to be pushed to advance for one position, the push rod 410 is rotated by the rotary driver 412, so that the supporting rod 414 on the push rod 410 is turned from the vertical state to the horizontal state, and is separated from the space between the two turntable 31, then the push rod 410 is driven by the displacement driver 413 to move backward for one position, then the rotary driver 412 is reversely rotated, so that the supporting rod 414 on the push rod 410 is turned from the horizontal state to the vertical state, and is located between the two turntable 31 again, and then the displacement driver 413 reversely acts, so that the push rod 410 moves forward, at this time, each supporting rod 414 on the push rod 410 pushes the adjacent turntable 31 to move forward, so that the backward movement process of the turntable 31 is identical to that described herein, and details are omitted. It should be noted that, in this embodiment, the rotary driver 412 in the pushing mechanism 41 on the feeding line 300 is mounted at an end of the pushing rod 410 (as shown in fig. 11), and since the pushing mechanism 41 mounted on the returning line 301 is further used to push the turnover disc 31 on the second turnover platform 3033 back to the feeding line 300, the rotary driver 412 in the pushing mechanism 41 mounted on the returning line 301 is located at a middle portion of the pushing rod 410 (as shown in fig. 12), so that the supporting rod 414 is disposed at an end of the pushing rod 410 near the second working platform 2, and when the second turnover platform 3033 is docked with the returning line 301, the turnover disc 31 on the second turnover platform 3033 is pushed into the guide rail group 40 on the returning line 301 by one cycle of movement of the pushing rod 410.
Further, referring to fig. 1 and 8 again, in order to better test the high temperature or low temperature resistance of the chips, a pretreatment tank 304 is disposed on the feeding line 300, and the pretreatment tank 304 is used to heat or freeze the chips in the turnover tray 31 passing through the feeding line 300. In this embodiment, by setting the pretreatment box 304, the chip can be heated or frozen in advance before being sent to the test machine 200, so that not only the high temperature resistance or low temperature resistance of the chip can be better tested, but also the test time of the test machine 200 can be reduced, and the test efficiency can be effectively improved.
Preferably, as shown in fig. 14 and 15, the test machine 200 includes a support table 2000, a holding chamber 2001 for holding a chip to be tested is provided on the support table 2000, a cover plate 2002 is provided above the holding chamber 2001, the cover plate 2002 can slide horizontally above the holding chamber 2001 to open or close the holding chamber 2001, a heating block 2003 is provided on a bottom wall of the cover plate 2002, a lifting driver 2004 for driving the heating block 2003 to move up and down is provided on a bottom wall of the cover plate 2002, and the heating block 2003 is used for abutting against the chip to be tested at a set test temperature.
In another preferred embodiment of the semiconductor test handler of the present invention, as shown in fig. 2 and 3, an open-short circuit test machine 140, an open-short circuit handling manipulator 141, a secondary interaction positioning platform 142 and a plurality of third positioning slots 143 are further disposed on a side of the first working table 1 near the first positioning slot 100. The open-short circuit test machine 140 is used for performing open-short circuit test on the chip, the secondary interaction positioning platform 142 is used for moving the chip between the loading level and the open-short circuit test machine 140 in a turnover interaction mode, and the open-short circuit carrying manipulator 141 is used for carrying the chip in or out of the secondary interaction positioning platform 142. The third positioning groove 143 is used for placing NG trays 4 bearing open-short circuit test results that are not up to standard. In this embodiment, as shown in fig. 3, the secondary interactive positioning platform 142 includes a mounting groove 1420 formed on the first working platform 1, two movable exchange platforms 1421 are disposed in the mounting groove 1420, two columns of acupoints for placing chips are disposed on the two exchange platforms 1421, one column of acupoints is used for placing chips to be tested, the other column of acupoints is used for placing chips to be tested, and the two exchange platforms 1421 can alternatively move between the loading level and the open/short circuit testing machine 140, so that the two exchange platforms 1421 do not affect each other in the moving process, and the position of one of the two exchange platforms 1421 is higher than the position of the other.
In summary, as shown in fig. 1 to 15, the semiconductor test handler according to the present invention is provided with a loading position, a unloading position, a turnover position and an open/short circuit test position on the first table 1, a test position and a turnover position on the second table 2, and a circulation movement position between the first table 1 and the second table 2, and specifically, the process of performing chip test and handler using the semiconductor test handler is as follows:
Firstly, placing a plurality of trays 4 with chips to be tested into each upper bin 102, and placing a plurality of empty trays 4 into a lower bin 112; then, carrying out open-short circuit test (the step can be skipped) on the chips in the feeding level through the open-short circuit test machine 140, the open-short circuit carrying manipulator 141 and the secondary interaction positioning platform 142, after the open-short circuit test is finished, putting the chips passing the test into the feeding level tray 4 again, and putting the chips failing the test into the NG tray 4; then, chips in a feeding tray 4 are transferred into a turnover tray 31 in a feed line 300 by a feeding robot 101, the turnover tray 31 is transferred to a second work table 2 by the feed line 300 to be docked with a second turnover table 3033, in addition, a heating switch of a pretreatment tank 304 can be opened to heat the chips passing by in advance in the course of transferring the chips through the feed line 300, then, the second turnover table 3033 is docked with a test machine 200 by lifting and rotating the second turnover table 3033, the chips are transferred into the test machine 200 by the test robot 201, after the test is completed, the chips are transferred into the turnover tray 31 on the second turnover table 3033 by the test robot 201, then, the second turnover table 3033 is docked with a return line 301 by lifting, rotating and shifting the second turnover table 3033, then, the turnover tray 31 on the second turnover table 3033 is transferred into the return line 301 by a pushing mechanism 41 on the return line 301, the turnover tray 31 is transferred to the first work table 1 by the lifting and rotating the test robot 201, the chips are transferred into the turnover tray 31 by the test machine 1 by the test robot 201, and then, the chips are transferred into the test tray 111 by the test tray is not placed in the test tray according to the test result of the first and the test tray is empty, and the test tray is not transferred into the test tray 4, respectively, after the current peripheral turntable 31 is removed, the current peripheral turntable 31 is moved into different empty trays 4 from the central turntable, when the trays 4 in the second positioning groove 110 are fully filled, the trays are received into the discharging bin 112 by the discharging lifting platform 114 and the discharging turnover manipulator 113, so that the above-mentioned processes are executed in a circulating and reciprocating mode, no manual duty is needed in the whole testing process, and the working efficiency is high.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the claims, which follow, as defined in the claims.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010707664.7A CN111687078B (en) | 2020-07-21 | 2020-07-21 | Semiconductor test sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010707664.7A CN111687078B (en) | 2020-07-21 | 2020-07-21 | Semiconductor test sorting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111687078A CN111687078A (en) | 2020-09-22 |
| CN111687078B true CN111687078B (en) | 2024-12-27 |
Family
ID=72486678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010707664.7A Active CN111687078B (en) | 2020-07-21 | 2020-07-21 | Semiconductor test sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111687078B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112588592B (en) * | 2020-12-01 | 2022-06-21 | 群沃电子科技（苏州）有限公司 | Full-automatic chip aging test and PCB shielding test blanking machine |
| CN113003180B (en) * | 2021-04-14 | 2023-06-23 | 深圳市标王工业设备有限公司 | IC chip loading and sorting machine |
| CN113306994B (en) * | 2021-06-18 | 2023-05-12 | 东莞市冠佳电子设备有限公司 | Material tray reclaimer |
| CN113578781B (en) * | 2021-07-26 | 2023-07-25 | 北京比特大陆科技有限公司 | Chip sorting method, device, equipment and storage medium |
| CN113560225A (en) * | 2021-08-24 | 2021-10-29 | 深圳市指南测控技术有限公司 | Full-automatic test equipment of TWS earphone |
| CN114029245A (en) * | 2021-11-03 | 2022-02-11 | 深圳市锐伺科技有限公司 | Chip testing and sorting line and method |
| CN114056945B (en) * | 2021-12-10 | 2024-05-28 | 苏州策林智能科技有限公司 | Material tray stacking equipment |
| CN114690024B (en) * | 2022-05-31 | 2022-08-26 | 广东东博自动化设备有限公司 | Full-automatic chip testing machine |
| CN116666249B (en) * | 2023-07-28 | 2024-01-26 | 广东长兴半导体科技有限公司 | Wafer testing method |
| CN117388660B (en) * | 2023-10-23 | 2024-06-28 | 江苏盟星智能科技有限公司 | Multi-station detection device capable of marking defective products |
| CN117352449B (en) * | 2023-12-04 | 2024-03-08 | 扬州爱迪秀自动化科技有限公司 | Automatic assembly device for IGBT module outer frames |
| CN117583259A (en) * | 2023-12-14 | 2024-02-23 | 苏州乾鸣半导体设备有限公司 | Three-temperature test sorting equipment |
| CN118588152B (en) * | 2024-06-06 | 2025-04-04 | 深圳市宸悦存储电子科技有限公司 | A memory card automatic testing machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107128680A (en) * | 2017-05-16 | 2017-09-05 | 深圳锦帛方激光科技有限公司 | A kind of small sized product charging tray sub-material and closing quotation device |
| CN109801854A (en) * | 2019-01-11 | 2019-05-24 | 杭州长川科技股份有限公司 | Chip high temperature side presses separation system and high temperature side to press method for separating |
| CN111038958A (en) * | 2019-12-31 | 2020-04-21 | 珠海市汇邦智能科技有限公司 | Material tray transfer device and material tray transfer method |
| CN111137679A (en) * | 2020-01-19 | 2020-05-12 | 苏州德机自动化科技有限公司 | An automatic film sticking and two-dimensional code equipment |
| CN213287735U (en) * | 2020-07-21 | 2021-05-28 | 深圳市标王工业设备有限公司 | Semiconductor test sorting machine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10292660A (en) * | 1997-04-11 | 1998-11-04 | Ishikawajima Harima Heavy Ind Co Ltd | Pallet transfer device and elevator type parking device using the same |
| CN104891140A (en) * | 2015-04-23 | 2015-09-09 | 上海烟草集团有限责任公司 | Rotary type vertical separating mechanism of pallet piles |
| CN204538127U (en) * | 2015-05-13 | 2015-08-05 | 惠州金源精密自动化设备有限公司 | Button cell discharge equipment |
| CN108527873A (en) * | 2018-04-11 | 2018-09-14 | 苏州派菲特自动化科技有限公司 | A kind of automatic assembly line of robot assisted loading type chest card and its assemble method |
| CN110626807B (en) * | 2019-10-09 | 2024-07-26 | 苏州西通自动化科技有限公司 | Cylinder-driven tray separating mechanism |
-
2020
- 2020-07-21 CN CN202010707664.7A patent/CN111687078B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107128680A (en) * | 2017-05-16 | 2017-09-05 | 深圳锦帛方激光科技有限公司 | A kind of small sized product charging tray sub-material and closing quotation device |
| CN109801854A (en) * | 2019-01-11 | 2019-05-24 | 杭州长川科技股份有限公司 | Chip high temperature side presses separation system and high temperature side to press method for separating |
| CN111038958A (en) * | 2019-12-31 | 2020-04-21 | 珠海市汇邦智能科技有限公司 | Material tray transfer device and material tray transfer method |
| CN111137679A (en) * | 2020-01-19 | 2020-05-12 | 苏州德机自动化科技有限公司 | An automatic film sticking and two-dimensional code equipment |
| CN213287735U (en) * | 2020-07-21 | 2021-05-28 | 深圳市标王工业设备有限公司 | Semiconductor test sorting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111687078A (en) | 2020-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111687078B (en) | Semiconductor test sorting machine | |
| CN212821225U (en) | Chip arrangement device for chip aging test | |
| CN112108401A (en) | Chip arrangement device for chip aging test | |
| CN112520413B (en) | Full-automatic aging test loading and unloading system and method | |
| CN113466255B (en) | Chip detection equipment | |
| CN111940323A (en) | A chip swinging device for chip aging test | |
| CN106217214A (en) | A kind of automatic loading/unloading scribing machine | |
| CN114799860A (en) | Automatic assembling and testing production line for server mainboard | |
| CN105958106B (en) | A kind of step-by-step movement pre-arcing machine of button cell | |
| CN213287735U (en) | Semiconductor test sorting machine | |
| KR102368128B1 (en) | Cassette magazine supply circulation device for printed circuit board vision inspection device | |
| CN110255112B (en) | Automatic disc changing equipment for optical lens test | |
| CN109545728B (en) | Automatic wafer transfer method | |
| CN107309567B (en) | Welding device for realizing battery reversing welding | |
| CN118183267B (en) | Material transfer device | |
| KR102274543B1 (en) | saw & placement system | |
| CN113562438A (en) | Circuit board circulation streamline packagine machine | |
| CN220006734U (en) | Full-automatic electromagnetic valve assembly test line | |
| CN112024428A (en) | OCV test machine and battery | |
| KR102475098B1 (en) | Semiconductor Device Process System and Method for Tube Offloading thereof | |
| CN218143647U (en) | Wafer storage intelligent bin | |
| CN216956254U (en) | Chip testing system | |
| CN216582729U (en) | Automatic material loading formula lithium cell multiaspect detects gets looks device with shooting | |
| JP2013018604A (en) | Article sorting apparatus | |
| CN208861749U (en) | Resistor disc automatic forming press and resistor disc automatic production line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |