CN111642067A - Circuit substrate, flexible thin film circuit and manufacturing method thereof - Google Patents

Abstract

The invention provides a circuit substrate, a flexible thin film circuit and a manufacturing method thereof, and relates to the technical field of microelectronics. The circuit substrate provided by the invention comprises: a first flexible substrate; a second flexible substrate; a liquid metal line between the first flexible substrate and the second flexible substrate; wherein the first flexible substrate has a non-tacky state and a tacky state, the first flexible substrate being in the non-tacky state when dry and in the tacky state upon contact with the first liquid. The technical scheme of the invention can simply and conveniently manufacture and use the flexible thin film circuit.

Description

A circuit substrate, a flexible film circuit and a manufacturing method thereof

technical field

The invention relates to the technical field of microelectronics, in particular to a circuit substrate, a flexible film circuit and a manufacturing method thereof.

Background technique

The traditional circuit is integrated on the PCB board, and the process of making the PCB board is complicated. The production and processing cycle is long and the production cost is high.

With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metals have made direct circuit printing technologies such as direct writing and printing possible. However, it is still necessary to use liquid metal direct writing pens, liquid metal printers and other equipment to fabricate circuits, and the fabrication of circuits is still relatively complicated.

Moreover, the existing circuits are enclosed in fixed products, which cannot meet the diverse needs of users for circuit usage scenarios and purposes.

SUMMARY OF THE INVENTION

The present invention provides a circuit substrate, a flexible film circuit and a manufacturing method thereof, which can simply and conveniently manufacture and use the flexible film circuit.

In the first aspect, the present invention provides a circuit substrate, which adopts the following technical solutions:

The circuit substrate includes:

a first flexible substrate;

a second flexible substrate;

a liquid metal circuit, the liquid metal circuit is located between the first flexible substrate and the second flexible substrate;

Wherein, the first flexible substrate has a non-adhesive state and a viscous state, the first flexible substrate is in a non-adhesive state when dry, and is in a viscous state after contacting the first liquid.

Optionally, the first flexible substrate includes an insulating body and starch powder and/or beeswax powder dispersed in the insulating body.

Optionally, the second flexible substrate has a dense state and a loose state, the second flexible substrate is in a dense state when dry, and is in a loose state after contacting the second liquid, allowing the first liquid to pass through the A second flexible substrate.

Optionally, the second flexible substrate is a homogeneous structure, and the second flexible substrate can be completely dissolved in the second liquid.

Further, the second flexible substrate is PVB film, PVP film, PVA film, sodium alginate film, gelatin film, chitosan film, PEO film or PEG film.

Optionally, the second flexible substrate includes a porous structure and a filling structure filled in the pores of the porous structure, and the filling structure is soluble in the second liquid.

Optionally, the circuit substrate further includes: at least one resistor and at least one light emitting diode, and the at least one resistor and the at least one light emitting diode are located on the first flexible substrate and the second flexible substrate between, and all are connected with the liquid metal circuit.

In the second aspect, the present invention provides a flexible film circuit, which adopts the following technical solutions:

The flexible thin film circuit is made of the circuit substrate described in any one of the above, and the flexible thin film circuit includes:

a first flexible substrate in an adhesive state;

a liquid metal circuit, the liquid metal circuit is located on the first flexible substrate;

a battery, which is pasted on the first flexible substrate and connected to the liquid metal circuit;

at least one resistor, the at least one resistor is located on the first flexible substrate and connected to the liquid metal circuit;

At least one light emitting diode, the at least one light emitting diode is located on the first flexible substrate and connected with the liquid metal circuit.

In a third aspect, the present invention provides a method for manufacturing a flexible thin-film circuit, which adopts the following technical solutions:

The manufacturing method of the flexible thin film circuit is used for manufacturing the above-mentioned flexible thin film circuit, and the manufacturing method of the flexible thin film circuit includes:

Step S1, providing a circuit substrate;

Step S2, making the first flexible substrate in the circuit substrate contact the first liquid to be in a viscous state;

Step S3, sticking a battery on the first flexible substrate in a sticky state, where the battery is connected to the liquid metal circuit.

Optionally, the step S2 includes:

A second liquid is sprayed on the second flexible substrate in the circuit substrate, the second liquid is the same as the first liquid, or includes the first liquid, so that the second flexible substrate is in a loose state state;

The second liquid reaches the first flexible substrate through the second flexible substrate in a loose state, so that the first flexible substrate is in a sticky state.

The invention provides a circuit substrate, a flexible film circuit and a manufacturing method thereof, wherein the circuit substrate comprises a first flexible substrate, a second flexible substrate and a liquid metal circuit located therebetween, the circuit substrate There is already a liquid metal circuit in the material, so the process of using the circuit substrate to make a flexible film circuit is simple, and since the first flexible substrate is in a non-sticky state when it is dry, it is in a viscous state after contacting the first liquid. As soon as the flexible substrate contacts the first liquid, the flexible film circuit made by using the circuit substrate can be pasted at the target position, so that the use of the flexible film circuit is simple and convenient, and it is beneficial to meet the user's usage scenarios and purposes of the flexible film circuit. Diversified needs.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a top view 1 of a circuit substrate provided by an embodiment of the present invention;

Fig. 2 is a schematic cross-sectional view along the AA' direction of Fig. 1 provided by an embodiment of the present invention;

FIG. 3 is a second top view of a circuit substrate provided by an embodiment of the present invention;

4 is a schematic cross-sectional view along the AA' direction of FIG. 3 according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a flexible thin film circuit provided by an embodiment of the present invention;

FIG. 6 is a flowchart of a method for fabricating a flexible thin film circuit according to an embodiment of the present invention.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that each technical feature in the embodiments of the present invention can be combined with each other without conflict.

An embodiment of the present invention provides a circuit substrate. Specifically, as shown in FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , FIG. 1 is a top view of the circuit substrate provided by the embodiment of the present invention, and FIG. 2 is a 1 is a schematic cross-sectional view along the AA' direction provided by an embodiment of the present invention, FIG. 3 is a top view 2 of a circuit substrate provided by an embodiment of the present invention, and FIG. 4 is a schematic cross-sectional view along the AA' direction of FIG. 3 provided by an embodiment of the present invention, The circuit substrate includes a first flexible substrate 1, a second flexible substrate 2 and a liquid metal circuit 3, and the liquid metal circuit 3 is located between the first flexible substrate 1 and the second flexible substrate 2; wherein the first flexible substrate The substrate 1 has a non-tacky state and a tacky state, the first flexible substrate 1 is in a non-tacky state when it is dry, and is in a tacky state after being in contact with the first liquid.

Since the circuit substrate already has the liquid metal circuit 3, the process of using the circuit substrate to make a flexible film circuit is simple, and since the first flexible substrate 1 is in a non-viscous state when it is dry, it is in a non-stick state after contacting the first liquid. In the viscous state, by making the first flexible substrate 1 contact the first liquid, the flexible film circuit made by using the circuit substrate can be pasted at the target position, so that the use of the flexible film circuit is simple and convenient, and it is beneficial to satisfy the user's expectations for the flexible film. Diversified needs of circuit usage scenarios and purposes.

In the embodiment of the present invention, the structure of the first flexible substrate 1 can be various, and the corresponding first liquid can be selected for different structures, so that the first flexible substrate 1 can be in a viscous state after contacting the first liquid . The first flexible substrate 1 may undergo physical changes and/or chemical changes during the process of changing from a non-sticky state to a sticky state, which is not limited in the embodiment of the present invention, as long as it can also function as a liquid fixed on it. The role of the metal line 3 is sufficient.

In one example, the first flexible substrate 1 includes an insulating body and starch powder and/or beeswax powder dispersed in the insulating body. The insulating body may include vegetable fibers, water-soluble resins, and the like. After the first flexible substrate 1 with this structure is in contact with water, the starch powder and/or beeswax powder in it will dissolve in the water, thereby showing stickiness, so that the first flexible substrate 1 is in a sticky state. Based on this, water or any liquid containing water can be used as the above-mentioned first liquid, so that the selection range of the first liquid is wide, and the biocompatibility is good, which is conducive to further simplifying the use method of the flexible film circuit, and further Meet the diverse needs of users for the use scenarios and purposes of flexible thin film circuits.

In yet another example, the first flexible substrate 1 includes a plurality of microcapsules, the walls of the microcapsules are soluble in the first liquid and have no viscosity, and the cores of the microcapsules have viscosity. After the first flexible substrate 1 with this structure contacts the first liquid, the walls of the microcapsules dissolve, and the cores of the microcapsules are released, thereby making the first flexible substrate 1 in a sticky state.

In yet another example, the first flexible substrate 1 includes two components that are uniformly mixed, and the two components may undergo a chemical reaction after contacting the first liquid to generate a viscous substance. After the first flexible substrate 1 with this structure contacts the first liquid, the two components undergo a chemical reaction to generate a viscous substance, thereby making the first flexible substrate 1 in a viscous state.

It should be noted that the "liquid metal" used in the liquid metal circuit 3 in the embodiment of the present invention is an alloy or metal element with a melting point below 300° C., or a conductive mixture with the above-mentioned metal element or alloy as the main component.

Optionally, the alloy or metal element in the liquid metal may be gallium element, indium element, tin element, mercury element, gallium-indium alloy, gallium-indium-tin alloy, gallium-tin alloy, gallium-zinc alloy, gallium-indium-zinc alloy, gallium-tin alloy Zinc alloys, gallium indium tin zinc alloys, gallium tin cadmium alloys, gallium zinc cadmium alloys, bismuth indium alloys, bismuth tin alloys, bismuth indium tin alloys, bismuth indium zinc alloys, bismuth tin zinc alloys, bismuth indium tin zinc alloys, bismuth indium One or more of tin-lead alloys, bismuth-tin-cadmium alloys, bismuth-lead-tin alloys, bismuth-tin-lead-cadmium alloys, tin-lead alloys, tin-copper alloys, tin-zinc alloys, tin-zinc-copper alloys, and tin-silver-copper alloys.

Preferably, in the embodiment of the present invention, the liquid metal is a mixture of gallium indium eutectic alloy and silver-coated copper powder, so that the liquid metal has good electrical properties and suitable viscosity, and will not move with gravity. The mass percentage of the silver-coated copper powder in the liquid metal may be 8%.

The specific direction of the liquid metal circuit 3 can be selected according to actual needs. For example, when the main purpose of realizing the circuit function is to realize the circuit function, the liquid metal circuit 3 can be simplified as much as possible to save materials. Line 3 is designed to present an aesthetic pattern.

In the embodiment of the present invention, the second flexible substrate 2 can have many structures, as long as the liquid metal circuit 3 can be effectively protected when the circuit substrate is not in use. When the circuit substrate is in use, the second flexible substrate 2 The original structure can be kept unchanged, or it can be removed, or the structure can be changed.

In one example, the second flexible substrate 2 has a stable structure, that is, the structure of the second flexible substrate 2 does not change in any way before and after the circuit substrate is used. During the use of the circuit substrate with this structure, the first liquid needs to be sprayed on the side close to the first flexible substrate 1, so that the first flexible substrate 1 is in contact with the first liquid, and then is in a viscous state, and then the circuit is in a viscous state. The substrate is glued to the target location.

In this example, at least one mounting opening may be provided on the second flexible substrate 2 to facilitate subsequent mounting of other structures (eg, light-emitting diodes, power supplies, resistors, etc.).

In yet another example, the second flexible substrate 2 has a dense state and a loose state, the second flexible substrate 2 is in a dense state when dry, and is in a loose state after contacting the second liquid, allowing the first liquid to pass through the second flexible substrate material 2. During the use of the circuit substrate with this structure, the circuit substrate can be placed at the target position first, and then the second liquid is sprayed on the side close to the second flexible substrate 1, so that the second flexible substrate 2 is densely formed. The state changes to a loose state, and then the first liquid passes through the second flexible substrate 2 to reach the first flexible substrate 1 (the first liquid can be included in the second liquid, or can be provided separately), so that the first flexible substrate 1 In a sticky state, the circuit substrate can be pasted, avoiding the occurrence of inaccurate pasting positions.

Further, the second flexible substrate 2 may be in a loose state after contacting with the second liquid.

First, the second flexible substrate 2 includes a porous structure and a filling structure filled in the holes of the porous structure. The filling structure can be dissolved in the second liquid. After the second flexible substrate 2 contacts the second liquid, the filling structure is dissolved. , to obtain the second flexible substrate 2 in a loose state; at this time, at least one installation opening may also be provided on the second flexible substrate 2 to facilitate subsequent installation of other structures (such as light-emitting diodes, power supplies, resistors, etc.).

In the second type, the second flexible substrate 2 is of a homogeneous structure, the second flexible substrate 2 can be completely dissolved in the second liquid, and after the second flexible substrate 2 contacts the second liquid, all of it is dissolved and exists in the form of a solute And the second liquid, and then showing a loose state.

Optionally, the second flexible substrate 2 is made of a water-soluble material or an alcohol-soluble material, so that the selection range of the second liquid is wide and the biocompatibility is better. Exemplarily, the second flexible substrate 2 is PVB (polyvinyl butyral) film, PVP (polyvinyl pyrrolidone) film, PVA (polyvinyl alcohol, polyvinyl alcohol) film, sodium alginate Film, gelatin film, chitosan film, PEO (Polyethylene oxide) film or PEG (polyethylene glycol, polyethylene glycol) film, etc. Among them, sodium alginate, gelatin and chitosan are water-soluble materials, which can be dissolved in water; PVB and PEG are alcohol-soluble materials, which can be dissolved in alcohol; PVP, PVA, and PEO are both water-soluble and soluble in water. alcohol.

Optionally, in the embodiment of the present invention, as shown in FIG. 3 and FIG. 4 , the circuit substrate further includes: at least one resistor 5 and at least one light emitting diode 4 , and each resistor 5 and each light emitting diode 4 are located on the first flexible base between the material 1 and the second flexible substrate 2, and both are connected with the liquid metal circuit 3, so as to further simplify the method of using the circuit substrate to manufacture the flexible film circuit.

In addition, the setting of the resistor 5 can also effectively prevent the current flowing through the light emitting diode 4 from being too large during the operation of the flexible thin film circuit, and can prevent the light emitting diode 4 from overheating. The resistor 5 can be a voltage dividing resistor or a current limiting resistor. The specific number of light-emitting diodes 4 can be selected according to the voltage of the battery selected in the flexible film circuit and the actual needs. For example, a 3V battery can carry 1-10 light-emitting diodes, and a 5V battery can carry up to 50 light-emitting diodes. Of course, the circuit substrate can also include other electrical components according to actual needs.

The above light emitting diodes 4 can be common light emitting diodes 4 available in the market, such as 0805 package light emitting diodes, 0603 package light emitting diodes, 0402 package light emitting diodes, 5050 package light emitting diodes, and the like. When targeting a 3V or 5V battery and the resistor 5 is a voltage dividing resistor, it can be selected as a packaged chip resistor with a resistance value of 300Ω to 500Ω below 0805.

In addition, as shown in FIG. 1 and FIG. 3 , the circuit substrate in the embodiment of the present invention also includes battery pads 6 and positive and negative electrode marks (“+” and “-” in the figure), and the battery pads 6 and the positive and negative electrode marks are both located at Between the first flexible base material 1 and the second flexible base material 2, it is convenient to paste a battery on the circuit base material to make a flexible film circuit. The battery pads 6 and the positive and negative signs can be made of the same liquid metal as the liquid metal circuit 3 to simplify the fabrication method of the circuit substrate.

In order to facilitate those skilled in the art to fabricate the above-mentioned circuit substrates, the embodiments of the present invention provide several fabrication methods of the circuit substrates.

In one example, the liquid metal circuit 3 is printed on the dry first flexible substrate 1, that is, the first flexible substrate 1 in a non-adhesive state; after the liquid metal circuit 3 is printed, the liquid metal circuit 3 is printed. SMD operation of components such as light-emitting diodes 4 and resistors 5; seal the material of the second flexible substrate 2 in liquid state; then put it into a blast drying oven at 50°C to 80°C for air drying; finally wait for the second flexible substrate After the material 2 is dried, a circuit substrate is obtained.

In yet another example, the liquid metal is dispensed on the wet first flexible substrate 1, that is, the first flexible substrate 1 in a viscous state using a dispensing valve to obtain a liquid metal circuit 3; After the extraction is completed, the light-emitting diode 4, the resistor 5 and other components are patched on the liquid metal circuit 3; the material of the second flexible substrate 2 in liquid state is sealed; Air-dry in a box; finally, after the first flexible substrate 1 and the second flexible substrate 2 are both dried, a circuit substrate is obtained.

In yet another example, the liquid metal circuit 3 is fabricated on the surface of a certain liquid metal-phobic substrate (such as a stainless steel surface) by means of printing or dispensing valve, and a second flexible substrate in liquid state is sealed on the liquid metal circuit 3 Then, the drying speed of the material of the second flexible base material 2 in liquid state is accelerated by heating the surface of the base material sparse in the liquid metal; after the second flexible base material 2 is dried, the second flexible base material is peeled off. Material 2, the liquid metal circuit 3 will be transferred to the second flexible substrate 2; on the liquid metal circuit 3, the light-emitting diode 4, resistor 5 and other components will be patched; The metal circuit 3 encapsulates the material of the first flexible substrate 1 in liquid state; it is dried on a heated stainless steel plate or in a blast drying oven, and after the first flexible substrate 1 is dried, a circuit substrate is obtained.

In addition, an embodiment of the present invention provides a flexible film circuit, and the flexible film circuit is made of the circuit substrate described in any of the above. Specifically, as shown in FIG. 5 , FIG. 5 is the flexible film circuit provided by the embodiment of the present invention. Schematic diagram of the structure of the thin film circuit, the flexible thin film circuit includes:

the first flexible substrate 1 in an adhesive state;

Liquid metal circuit 3, the liquid metal circuit 3 is located on the first flexible substrate 1;

battery 7, the battery 7 is pasted on the first flexible substrate 1 and connected to the liquid metal circuit 3;

at least one resistor 5, each resistor 5 is located on the first flexible substrate 1 and connected to the liquid metal circuit 3;

At least one light-emitting diode 4, each light-emitting diode 4 is located on the first flexible substrate 1, and is connected to the liquid metal circuit 3.

It should be noted that the above-mentioned resistors 5 and light-emitting diodes 4 can be integrated into the circuit substrate, or the first flexible substrate 1 is still in a sticky state after the circuit substrate is pasted to the target position. When , each resistor 5 and each light emitting diode 4 are pasted to the corresponding position.

If all the second flexible substrates in the selected circuit substrate can be dissolved in the second liquid, the flexible film circuit made from the circuit substrate does not include the second flexible substrate. If the selected circuit substrate When the part of the second flexible substrate in the circuit substrate can be dissolved in the second liquid, the flexible film circuit made of the circuit substrate also includes a second flexible substrate in a loose state. When the flexible substrate has a stable structure, the flexible film circuit made of the circuit substrate also includes the second flexible substrate.

In addition, an embodiment of the present invention also provides a method for manufacturing a flexible thin film circuit, which is used to manufacture the above-mentioned flexible thin film circuit. Specifically, as shown in FIG. 6 , FIG. 6 is the flexible thin film circuit provided by the embodiment of the present invention. The flow chart of the manufacturing method, the manufacturing method of the flexible film circuit includes:

Step S1, providing a circuit substrate;

The circuit substrate described here may be any of the circuit substrates described above, and the specific structure thereof will not be repeated here.

Step S2, making the first flexible substrate in the circuit substrate contact the first liquid to be in a viscous state;

Optionally, step S2 includes:

spraying a second liquid on the second flexible substrate in the circuit substrate, the second liquid is the same as the first liquid, or includes the first liquid, so that the second flexible substrate is in a loose state;

The second liquid reaches the first flexible substrate 1 through the second flexible substrate in a loose state, so that the first flexible substrate 1 is in a sticky state.

Step S3, sticking a battery on the first flexible substrate in a sticky state, and connecting the battery to the liquid metal circuit.

The first flexible substrate in the circuit substrate includes an insulating body and starch powder and/or beeswax powder dispersed in the insulating body, and the second flexible substrate is sodium alginate, gelatin, chitosan, PVP, PVA or PEO When the first liquid and the second liquid are both water; the first flexible substrate in the circuit substrate includes an insulating body and starch powder and/or beeswax powder dispersed in the insulating body, and the second flexible substrate is PVB , PEG, PVP, PVA or PEO, the second liquid can be an ethanol solution (such as medical alcohol), the first liquid is water, the first liquid can be water provided separately, or the water contained in the second liquid.

The above-mentioned manufacturing method of the flexible film circuit can also be understood as the use method of the circuit substrate described above by the user. The user can fabricate the desired flexible thin-film circuit at any desired location (eg, on human skin) using the circuit substrates described previously. When the obtained flexible thin film circuit is located on human skin, the flexible thin film circuit can play the role of decoration, monitoring of physiological parameters and the like.

In one example, the circuit substrate includes a first flexible substrate, a second flexible substrate, a liquid metal circuit, at least one resistor, at least one light-emitting diode, and a battery pad, the first flexible substrate includes an insulating body and dispersed in the insulating Starch powder and/or beeswax powder in the main body, the second flexible substrate is sodium alginate, gelatin, chitosan, PVP, PVA or PEO, and the circuit substrate described above is used to make a flexible film circuit on human skin At the time, the specific production process of the flexible film circuit includes:

Affix the first flexible substrate of the circuit substrate to the skin facing down;

spraying water on the second flexible substrate;

The second flexible substrate is dissolved and eliminated, and the first flexible substrate is in a sticky state after being wetted with water, and adheres to the skin, thereby fixing the liquid metal circuit on the skin;

When the first flexible substrate has not been completely dehydrated and is still in a sticky state, the light-emitting diodes can start to emit light by pasting the battery at the battery pad.

In yet another example, the circuit substrate includes a first flexible substrate, a second flexible substrate, a liquid metal circuit, at least one resistor, at least one light-emitting diode, and a battery pad, the first flexible substrate includes an insulating body and a Starch powder and/or beeswax powder in the insulating body, and the second flexible substrate is PVB, PEG, PVP, PVA or PEO. When the circuit substrate described above is used to make a flexible film circuit on human skin, the flexible film circuit The specific production process includes:

Affix the first flexible substrate of the circuit substrate to the skin facing down;

Spray medical alcohol on the second flexible substrate, that is, alcohol with a concentration of 35% to 75%;

The second flexible substrate is dissolved and eliminated, and the first flexible substrate is in a sticky state after being dipped in water in medical alcohol, and adheres to the skin, thereby fixing the liquid metal circuit on the skin;

When the first flexible substrate has not been completely dehydrated and is still in a sticky state, the light-emitting diodes can start to emit light by pasting the battery at the battery pad.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (10)

1. A circuit substrate, comprising:

a first flexible substrate;

a second flexible substrate;

a liquid metal line between the first flexible substrate and the second flexible substrate;

wherein the first flexible substrate has a non-tacky state and a tacky state, the first flexible substrate being in the non-tacky state when dry and in the tacky state upon contact with the first liquid.

2. The circuit substrate of claim 1, wherein the first flexible substrate comprises an insulative body and a starch powder and/or a beeswax powder dispersed in the insulative body.

3. The circuit substrate of claim 1 or 2, wherein the second flexible substrate has a dense state and a loose state, the second flexible substrate being in the dense state when dry and in the loose state upon contact with a second liquid, allowing the first liquid to pass through the second flexible substrate.

4. The circuit substrate of claim 3, wherein the second flexible substrate is a homogeneous structure, and the second flexible substrate is completely soluble in the second liquid.

5. The circuit substrate of claim 4, wherein the second flexible substrate is a PVB film, a PVP film, a PVA film, a sodium alginate film, a gelatin film, a chitosan film, a PEO film, or a PEG film.

6. The circuit substrate of claim 3, wherein the second flexible substrate comprises a porous structure and a filling structure filled in the pores of the porous structure, the filling structure being soluble in the second liquid.

7. The circuit substrate of claim 1, further comprising: the at least one resistor and the at least one light emitting diode are both located between the first flexible substrate and the second flexible substrate and are both connected with the liquid metal circuit.

8. A flexible thin film circuit made of the circuit substrate according to any one of claims 1 to 7, comprising:

a first flexible substrate in a tacky state;

a liquid metal line on the first flexible substrate;

the battery is pasted on the first flexible base material and is connected with the liquid metal circuit;

at least one resistor located on the first flexible substrate and connected to the liquid metal line;

and the at least one light-emitting diode is positioned on the first flexible substrate and is connected with the liquid metal circuit.

9. A method of manufacturing a flexible thin film circuit, for manufacturing the flexible thin film circuit of claim 8, wherein the method of manufacturing the flexible thin film circuit comprises:

step S1, providing a circuit substrate according to any one of claims 1 to 7;

step S2, contacting the first flexible substrate in the circuit substrate with a first liquid in a viscous state;

and step S3, adhering a battery on the first flexible base material in the viscous state, wherein the battery is connected with the liquid metal circuit.

10. The method of claim 9, wherein the step S2 includes:

spraying a second liquid onto the second flexible substrate in the circuit substrate, wherein the second liquid is the same as the first liquid or comprises the first liquid, so that the second flexible substrate is in a loose state;

and the second liquid passes through the second flexible substrate in a loose state and reaches the first flexible substrate, so that the first flexible substrate is in a viscous state.

Images