CN111623551A - Refrigerating system and refrigerating equipment - Google Patents
Refrigerating system and refrigerating equipment Download PDFInfo
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- CN111623551A CN111623551A CN202010536699.9A CN202010536699A CN111623551A CN 111623551 A CN111623551 A CN 111623551A CN 202010536699 A CN202010536699 A CN 202010536699A CN 111623551 A CN111623551 A CN 111623551A
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- fan body
- fan
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a refrigerating system and refrigerating equipment, wherein the refrigerating system comprises: a semiconductor chip having a cold side and a hot side; the cold dissipation structure is connected with the cold end of the semiconductor chip; the heat dissipation structure is connected with the hot end of the semiconductor chip; the cold circulating fan is arranged corresponding to the cold dissipating structure so that the air coming out of the cold circulating fan passes through the cold dissipating structure and exchanges heat with the cold dissipating structure; this heat radiation structure includes: the heat dissipation pipe is connected with the hot end of the semiconductor chip, and a refrigerant is arranged in the heat dissipation pipe; and the heat dissipation steel wire is connected with the heat dissipation guide pipe. The refrigeration equipment comprises a cabinet body and the refrigeration system. The embodiment of the invention provides a refrigerating system and refrigerating equipment, which are used for radiating heat through a radiating guide pipe and a radiating steel wire which work in a mute manner, so that the radiating form of a fan and a radiating aluminum sheet is replaced, and the noise generated when the refrigerating system and the refrigerating equipment using the refrigerating system work is greatly reduced.
Description
Technical Field
The invention belongs to the field of refrigeration equipment, and particularly relates to a refrigeration system and refrigeration equipment.
Background
In the prior art, semiconductor refrigeration technology has been widely applied to various types of refrigeration equipment, such as refrigerators or refrigeration equipment, and semiconductor refrigeration systems have been widely used for refrigeration. Semiconductor refrigeration mainly utilizes semiconductor chip circular telegram back, forms a hot junction and a cold junction, and the cold junction carries out the heat exchange through the air that looses in cold structure and the cabinet and forms cold air, and then reaches the refrigerated effect of cooling, and the hot junction dispels the heat through heat radiation structure. In the existing refrigeration system, a heat dissipation structure usually adopts a fan and a heat dissipation aluminum sheet, the heat dissipation aluminum sheet is connected with a hot end, and then the fan drives an air flow to dissipate heat. In such a heat dissipation structure, when the fan rotates, the main structure of the fan (such as the driving motor and the fan blades) vibrates, and the structural components of the fan are hard connected, so that the vibration causes the collision between the fan structures to generate non-negligible noise. When refrigerating system installs and uses on refrigeration plant such as freezer or refrigeration plant, because also carry out the rigid connection between the cabinet body of fan and equipment, can lead to even also consequently bumping and producing the noise between fan and the cabinet body for refrigeration plant produces a large amount of noises in the course of the work, and the noise is too big even, causes the influence to people's work and life, gives people and brings unpleasant use experience.
Accordingly, the prior art is in need of improvement and development.
Disclosure of Invention
The embodiment of the invention provides a refrigerating system and refrigerating equipment, which are used for radiating heat through a radiating guide pipe and a radiating steel wire which work in a mute manner, so that the radiating form of a fan and a radiating aluminum sheet is replaced, and the noise generated when the refrigerating system and the refrigerating equipment using the refrigerating system work is greatly reduced.
To solve the technical problem, in one aspect, a refrigeration system according to an embodiment of the present invention includes:
a semiconductor chip having a cold side and a hot side;
the cold dissipation structure is connected with the cold end of the semiconductor chip;
the heat dissipation structure is connected with the hot end of the semiconductor chip;
the cold circulating fan is arranged corresponding to the cold dissipating structure, so that air coming out of the cold circulating fan passes through the cold dissipating structure and exchanges heat with the cold dissipating structure;
the heat dissipation structure includes:
the heat dissipation pipe is connected with the hot end of the semiconductor chip, and a refrigerant is arranged in the heat dissipation pipe;
and the heat dissipation steel wire is connected with the heat dissipation guide pipe.
Further, the cold dissipation structure comprises a cold dissipation plate, the cold dissipation plate is connected with the cold end of the semiconductor chip through a cold conduction piece, and auxiliary cold dissipation parts are distributed on the cold dissipation plate.
Further, the cold dissipation structure comprises a cold dissipation plate, the cold dissipation plate is connected with the cold end of the semiconductor chip through a cold conduction piece, the cold conduction piece is provided with an extension supporting portion, and the cold dissipation plate is connected with the extension supporting portion.
Further, the cold circulation fan comprises a damping structure, a panel and a fan body, wherein the fan body is connected with the panel through the damping structure; the damping structure comprises a damping plate, and the damping plate is arranged between the fan body and the panel.
Furthermore, the damping structure further comprises an elastic fixing piece, and the fan body is fixedly connected with the panel through the elastic fixing piece.
Furthermore, the fan body, the damping plate and the panel are provided with corresponding fixing holes, and two ends of the elastic fixing piece are respectively provided with a first limiting part and a second limiting part; the elastic fixing piece is arranged in the three fixing holes, and the first limiting portion and the second limiting portion are used for being clamped outside the fan body or the fixing holes of the panel so as to fixedly connect the fan body, the damping panel and the panel.
Furthermore, the second limiting part is provided with a limiting end and a guiding end, and the limiting end and the guiding end are continuously arranged; the guide end is far away from the first limiting part and used for guiding the second limiting part to pass through the three fixing holes; the limiting end is close to the first limiting part and used for clamping the second limiting part outside the fixing hole of the fan body or the panel after passing through the three fixing holes.
Furthermore, the fan body is provided with a fixing piece, the fixing piece is provided with a first flow limiting part around the fan body, an air duct is formed between the first flow limiting part and the fan body, the air duct is provided with an air outlet, and the air outlet corresponds to the cold dissipation structure.
Furthermore, the panel and the damping plate are provided with a first air inlet corresponding to the fan body; the fixing piece is provided with a second air inlet corresponding to the fan body.
In another aspect, the refrigeration equipment provided by the embodiment of the invention comprises a cabinet body and the refrigeration system.
The refrigeration system provided by the embodiment of the invention has a simple structure, adopts the heat dissipation structure of the heat dissipation guide pipe and the heat dissipation steel wire, and absorbs the heat at the hot end of the semiconductor chip by circulating the heat absorption gasification and the precooling liquefaction of the refrigerant in the heat dissipation guide pipe, and then transfers the heat to the heat dissipation steel wire for heat dissipation through the heat dissipation guide pipe, so that the noise is low in the heat dissipation process, and the excellent noise reduction effect is achieved.
Drawings
FIG. 1 is a side view of one embodiment of a refrigeration system of the present invention.
Fig. 2 is a schematic diagram of the structure of the refrigeration system shown in fig. 1.
Fig. 3 is a side view of another embodiment of a refrigeration system of the present invention.
Fig. 4 is an exploded view of a refrigeration cycle fan of a refrigeration system of the present invention.
Fig. 5 is a perspective view of the cold circulation fan shown in fig. 4.
Fig. 6 is a schematic structural view of an elastic fixing member of the cold circulation fan shown in fig. 4.
Fig. 7 is a front view of a refrigeration apparatus of the present invention.
Fig. 8 is a rear view of a refrigeration apparatus shown in fig. 7.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
As shown in fig. 1 to 4, a refrigeration system according to an embodiment of the present invention includes: a semiconductor chip 100 having a cold side and a hot side; a cold dissipation structure 200 connected to a cold side of the semiconductor chip 100; a heat sink structure 300 connected to the hot side of the semiconductor chip 100; the cooling circulation fan 400 is disposed corresponding to the cooling dissipation structure 200, so that the air coming out of the cooling circulation fan 400 passes through the cooling dissipation structure 200 and exchanges heat with the cooling dissipation structure 200. The heat dissipation structure 300 includes: a heat dissipating pipe 310 connected to the hot end of the semiconductor chip 100 and having a refrigerant therein; the heat dissipating steel wire 320 is connected to the heat dissipating pipe 310.
The refrigeration system carries out the circulation of heat absorption gasification and precooling liquefaction through the refrigerant in the heat dissipation pipe so as to absorb the heat at the hot end of the semiconductor chip, and then the heat is transmitted to the heat dissipation steel wire through the heat dissipation pipe to carry out heat dissipation, so that the heat dissipation process is zero in noise, and the refrigeration system can meet the application of various occasions/places with high requirements on noise.
The heat dissipation pipe 310 is disposed in contact with the hot end of the semiconductor chip 100, and is heat-exchanged in a heat conduction manner, and may be fixed by a screw. The refrigerant in the heat dissipation conduit 310 is heated and vaporized, the gaseous refrigerant flows along the heat dissipation conduit, and then precooling, liquefying and refluxing are carried out, so that the heat dissipation effect is achieved through the circulation process of heating, vaporizing and precooling and liquefying. Preferably, the heat dissipation conduit 310 is arranged in a spiral or winding manner to increase the motion range of the refrigerant vaporizing in the tube, thereby promoting precooling and liquefaction of the refrigerant and further promoting heat dissipation. The heat radiation wire 320 is disposed around the heat radiation guide tube 310 and in contact with the heat radiation guide tube 310 to perform heat exchange in a heat conduction manner, thereby promoting heat radiation of the refrigerant. Specifically, the heat dissipation conduit may be made of a material capable of conducting heat conduction in the prior art, and preferably made of a material with a high heat conduction coefficient, such as a copper pipe; the refrigerant can be a refrigerant in the prior art, such as environment-friendly refrigerant R600A/R134A and the like. The semiconductor chip is also wrapped with a heat insulation material.
In the concrete application, above-mentioned cold circulation fan is used for promoting the circulation of cold air to improve refrigeration efficiency, to a certain extent, improve this cold circulation fan's rotational speed and be favorable to the improvement of refrigeration efficiency. On the other hand, when the cooling circulation fan rotates, the main structure (driving motor, fan blades, etc.) of the cooling circulation fan vibrates, and thus, the main structure collides with the structure to generate noise.
As shown in fig. 1 and 2, in particular, the cooling structure 200 includes a cooling plate 201, and the cooling plate 201 is connected to the cold end of the semiconductor chip through the cold conducting member 110.
In some preferred embodiments, the cold dissipating plate 201 is distributed with auxiliary cold dissipating portions 210. Therefore, the cooling area of the cooling plate can be increased through the auxiliary cooling part, so that the refrigeration efficiency can be improved, the working load of the cold circulating fan can be reduced, and the working noise of the cold circulating fan and the refrigeration system can be reduced. Specifically, the auxiliary cooling portion 210 is a strip-shaped cooling plate protruding from the cooling plate 201, a plurality of strip-shaped cooling plates are arranged at intervals on the front side of the cooling plate 201 facing the inner cavity of the cabinet, and the back side of the cooling plate 201 directly contacts the cooling guide member 110 for heat transfer.
When the semiconductor cooling device is used and installed, the semiconductor chip 100 and the cold conducting piece 110 are connected with the back of the cabinet body 500 in an embedded mode, and after the heat dissipation guide pipe 310 is connected with the semiconductor chip 100, the heat dissipation guide pipe penetrates through the cabinet body 500 to be installed outside the cabinet body 500, and the semiconductor cooling device can be installed through the installation support 330; the cold circulation fan 400 is connected to the cabinet 500 through the panel 410, wherein three sides of the panel 410, which are not the outlet air, are respectively connected to the top, the left side, the right side, and the left side of the cabinet 500, and one side of the panel 410 corresponding to the outlet 461 is opposite to the cold dissipation plate 201 at the lower part, so that the panel 410 and the cold dissipation plate 201 form a sidewall of the storage cavity of the cabinet. Since the cold guide 110 is connected to the back of the cabinet 500 in an inlaid manner, there is no ventilation space between the back of the cold dissipation plate and the cabinet, and the air flowing out of the cold circulation fan can only flow through the front of the cold dissipation plate.
In some preferred embodiments, as shown in fig. 3, the cold guide member 110 is provided with an extended support 111, and the cold dissipation plate 201 is connected to the extended support 111. Therefore, a ventilation space is formed between the back of the cold dissipation plate and the cabinet body, and air coming out of the cold circulation fan 400 can pass through the front side and the back side of the cold dissipation plate 201 to take away cold, so that the refrigeration efficiency can be improved, the working load of the cold circulation fan can be reduced, and the working noise of the cold circulation fan and the refrigeration system can be reduced. Specifically, the extension supporting portion 111 and the cooling conductive member 110 may be integrally formed, for example, an integrally formed aluminum block.
Specifically, the cold dissipation plate 201, the auxiliary cold dissipation portion 210, the cold conducting member 110, and the extending support portion 111 may be made of a material capable of conducting heat in the prior art, and preferably made of a material with a high heat conduction coefficient, for example, the cold dissipation plate is made of an aluminum sheet or a copper sheet.
In the concrete application, lead cold piece 110 and the cold plate 201 contact setting of loosing, can fix through the screw specifically, from this, the cold volume that the cold junction produced is transmitted to the cold plate 201 that looses through leading cold piece 110, and the cold plate 201 that looses contacts with the air and carries out the heat exchange to reach refrigeration effect. The air outlet 461 of the cooling circulation fan 400 corresponds to the cold dissipation plate 201, and air enters from the first air inlet 462, the second air inlet 463 and the third air inlet 464 of the cooling circulation fan 400 and flows from the air outlet 461 to the cold dissipation plate 201 through the air duct 422, and the cooling circulation fan 400 drives the air to circularly flow to exchange heat with the cold dissipation plate 201, so that the cold energy carried by the cold dissipation plate 201 is diffused, and the refrigeration is promoted.
As shown in fig. 4 and 5, the cold circulation fan 400 includes a shock-absorbing structure, a panel 410 and a fan body 420, and the fan body 420 is connected to the panel 410 through the shock-absorbing structure; the shock absorbing structure includes a shock absorbing plate 430, and the shock absorbing plate 430 is disposed between the fan body 420 and the panel 410.
In some preferred embodiments, the shock absorbing structure further includes an elastic fixing member 440, and the fan body 420 and the panel 410 are fixedly connected by the elastic fixing member 440. Therefore, the elastic fixing piece 440 completes the fixed connection among the fan body 420, the damping plate 430 and the panel 410, so that the noise generated by collision caused by the rotation of the fan in the hardware connection process can be eliminated, and the damping and noise reduction of the refrigeration system are further promoted.
As shown in fig. 4 to 6, in some preferred embodiments, the fan body 420, the damping plate 430 and the panel 410 are provided with corresponding fixing holes 471, and two ends of the elastic fixing member 440 are respectively provided with a first limiting portion 441 and a second limiting portion 442; the elastic fixing member 440 is disposed in the three fixing holes 471, and the first and second position-limiting portions 441 and 442 are clamped outside the fixing holes 471 of the fan body 420 or the panel 410 to fixedly connect the fan body 420, the damping plate 430 and the panel 410, which is simple in structure. Specifically, the first position-limiting portion 441 and/or the second position-limiting portion 442 and the elastic fixing member 440 may be separately disposed, for example, by using a snap fastener, or may be integrally disposed.
As shown in fig. 6, in some preferred embodiments, the second position-limiting portion 442 has a position-limiting end 4421 and a guiding end 4422, the position-limiting end 4421 and the guiding end 4422 are disposed continuously, and the guiding end 4422 is far from the first position-limiting portion 441 for guiding the second position-limiting portion 442 through the three fixing holes 471; the position-limiting end 4421 is close to the first position-limiting portion 441, and is used for clamping the second position-limiting portion 442 outside the fixing hole 471 of the fan body 420 or the panel 410 after passing through the three fixing holes 471. Therefore, the first and second position-limiting portions 441 and 442 and the elastic fixing member 440 can be integrally arranged, and the connection between the fan body 420 and the panel 410 can be simply and quickly completed.
Specifically, the elastic fixing member 440 is a rotating body, and the cross-sectional diameter of the first position-limiting portion 441 is larger than the aperture of the fixing hole 471, so that when the fixing connection is made, the first position-limiting portion 441 is blocked outside the fixing hole 471 (in this embodiment, blocked outside the fixing hole 471 of the panel 410); the cross-sectional diameters of the limiting end 4421 and the guiding end 4422 of the second limiting portion 442 continuously change, and gradually decrease from the limiting end 4421 to the guiding end 4422, and the cross-sectional diameter of the limiting end 4421 is larger than the aperture of the fixing hole 471, and the cross-sectional diameter of the guiding end 4422 is smaller than the aperture of the fixing hole 471, so that when the fixing connection is made, the guiding end 4422 can pass through the fixing hole 471, and the limiting end 4421 is blocked outside the fixing hole 471 (in this embodiment, blocked outside the fixing hole 471 of the fan body 420); a connecting portion 443 is further disposed between the first and second position-limiting portions 441 and 442, a central axis of the connecting portion 443 is equal to a sum of thicknesses of the fan body 420, the damper plate 430, and the panel 410, and a cross-sectional diameter of the connecting portion 443 is smaller than a bore diameter of the fixing hole 471. In a specific application, the elastic fixing member 440 is elastically deformed to enter the fixing hole 471 through the guiding end 4422 of the second position-limiting portion 442, and a pulling force is applied to elastically deform the position-limiting end 4421 of the second position-limiting portion 442 (the length of the central axis of the position-limiting end 4421 is increased, and the diameter of the cross section is decreased), so that the guiding end 4422 guides the fixing member to pass through the fixing hole 471; when the second position-limiting portion 442 passes through the fixing hole 471, the position-limiting end 4421 is deformed and blocked outside the fixing hole 471, the connecting portion 443 is disposed in the three fixing holes 471, and the first position-limiting portion 441 is blocked outside the fixing hole 471, so as to achieve the fixing connection among the fan body 420, the damping plate 430 and the panel 410, and the operation is simple.
In some preferred embodiments, the above-mentioned position-limiting end 4421 is provided with a pressing gap 445, and the pressing gap 445 is used to provide a space for the position-limiting end 4421 to be forced to contract to pass through the fixing hole 471. In specific application, when the fan needs to be disassembled, the corresponding position of the limiting end 4421 is extruded, so that the limiting end 4421 is contracted to enter the fixing holes 471, the elastic fixing piece 440 is separated from the three fixing holes 471, and the disassembly of the fan is simply and quickly completed; when a pulling force is applied as the fixing connection, deformation is promoted to pass through the fixing hole 471.
In some embodiments, the second position-limiting portion 442 further includes a pulling portion 444, the pulling portion 444 is connected to the guiding end 4422, and when the second position-limiting portion 442 is fixed, a pulling force is applied to the pulling portion 444 to allow the second position-limiting portion 442 to pass through the fixing hole 471.
As shown in fig. 4, in some embodiments, the panel 410 is provided with a buckle 411, and a locking groove 431 is provided at a position corresponding to the damping plate 430. Specifically, a plurality of snaps 411 may be provided at the peripheral edge of the panel 410, as desired. When the shock absorption plate is installed and connected specifically, the buckle 411 is clamped in the clamping groove 431, so that the shock absorption plate 430 and the panel 410 can be connected.
As shown in fig. 4, in particular, a first screw 450 may be disposed between the damping plate 430 and the panel 410 for reinforcement, and since the first screw 450 is disposed on the damping plate 430 and the first screw 450 is not connected to the fan body 420, the damping and noise reducing effects of the fan are not affected.
In some preferred embodiments, the shock absorbing structure is made of silicone or rubber. Silica gel or rubber materials have good elasticity, on the one hand, make shock-absorbing structure have good shockproof effect, and then make the fan reach more excellent noise reduction effect, on the other hand, can make elastic fixing's connection and dismantlement work light swift more. For specific applications, other elastic shock-proof materials that are easily known to those skilled in the art can be used for the shock-absorbing structure.
As shown in fig. 4, in some preferred embodiments, the fan body 420 has a fixing member 421, the fixing member 421 has a first flow restriction portion 423 around the fan body 420, an air duct 422 is formed between the first flow restriction portion 423 and the fan body 420, the air duct 422 has an air outlet 461, and the air outlet 461 corresponds to the cooling structure 200. Compared with a refrigeration system in the prior art, air is diffused and circulated to the periphery after entering the fan, and noise is generated by impact between the air and the fan structure; and the air flows from the air outlet 461 to the cold dissipation structure 200 through the air duct 422, so that the heat exchange between the air and the cold dissipation structure 200 can be promoted, the cold quantity can be diffused to the maximum extent, and the refrigeration efficiency can be improved.
As shown in fig. 5, in some preferred embodiments, the damping plate 430 is provided with a third limiting portion 432, and the third limiting portion 432 surrounds the first current limiting portion 423 and is tightly fitted with the first current limiting portion 423. Therefore, the air duct 422 is ensured to be sealed, and air does not escape from the gap to cause noise such as airflow sound.
As shown in fig. 4 and 5, in some preferred embodiments, the panel 410 and the damping plate 430 are provided with a first air inlet 462 corresponding to the fan body 420; the fixing member 421 is provided with a second air inlet 463 corresponding to the fan body 420. From this, the fan realizes two-sided air inlet, and the air is from the front of fan and back air inlet simultaneously, converges from the air outlet air-out again, can accelerate the cold wind circulation in refrigeration plant such as freezer or gradevin, promotes the refrigeration cooling, and then can reduce the operating power of fan based on in service behavior to noise when can reducing the refrigerating system function.
In a specific application, the cold circulation fan is installed in a refrigeration device such as a refrigerator or a wine cabinet through the panel 410, and the panel 410 faces the inside of the cabinet body. The side of the panel 410 corresponding to the air outlet 461 is provided with the cold dissipation structure 200, and the other sides are connected to the cabinet body of the refrigeration equipment such as a refrigerator or a wine cabinet, so that the air on the back of the cold circulation fan 400 is not smooth, and therefore, in order to realize double-sided air intake, in some embodiments, the panel 410 and the damping plate 430 are provided with corresponding air vents 472, so that the air in the cabinet body can flow to the back of the cold circulation fan 400 from the air vents 472, and further enters the air from the back (the second air inlet 463) of the cold circulation fan 400; and the air in the cabinet is directly supplied from the front side (the first air inlet 462) of the cooling circulation fan, so that the cooling circulation fan 400 is supplied with air from both sides.
In some preferred embodiments, the air duct 422 is provided with a third air inlet 464, thereby further promoting the circulation of cool air in practical applications.
As shown in fig. 5, in some embodiments, the damping plate 430 is provided with a shielding structure 433 at a position corresponding to the air outlet 461. The shielding structure 433 can prevent foreign matters from entering the fan body 420 or the air duct 422 through the air outlet 461; for example, in specific applications, when a child greets the child to cool and opens the refrigerator for playing, the existence of the protection structure can prevent the child from extending the hands (fingers) from the air outlet into the fan body to cause safety accidents. Specifically, the shielding structure 433 includes a plurality of shielding bars 434 disposed in a distributed manner.
The refrigeration system provided by the embodiment of the application adopts the heat dissipation structure of the heat dissipation guide pipe and the heat dissipation steel wire, the heat at the hot end of the semiconductor chip is absorbed through the circulation of heat absorption gasification and precooling liquefaction of the refrigerant in the heat dissipation guide pipe, and then the heat is transferred to the heat dissipation steel wire through the heat dissipation guide pipe for heat dissipation, so that the noise is zero in the heat dissipation process; the auxiliary cooling part is arranged on the cooling plate, and the extension supporting part is arranged on the cold guide piece to improve the refrigeration efficiency, so that the noise generated when the refrigeration system operates is reduced; the noise generated when the cold circulation fan works is reduced through the damping structure and the air duct structure; by adopting the refrigeration system, the noise can be reduced to be below 27 decibels, and a superior noise reduction effect is achieved.
As shown in fig. 7 to 8, in another aspect, a refrigeration apparatus according to an embodiment of the present invention includes a cabinet 500 and the refrigeration system. The semiconductor chip 100, the cooling structure 200 and the cooling circulation fan 400 are disposed in the cabinet 500, and the heat dissipation structure 300 is connected to the hot end of the semiconductor chip 100 and then connected to the cabinet 500 outside the cabinet 500.
Specifically, the semiconductor chip 100 and the cold conducting part 110 are connected with the back of the cabinet 500 in an embedded manner, and after the heat dissipation conduit 310 is connected with the semiconductor chip 100, the heat dissipation conduit passes through the outer cabinet plate and is installed outside the cabinet 500, specifically, the heat dissipation conduit can be installed through the installation bracket 330; the cold circulation fan 400 is connected to the cabinet 500 through the panel 410, wherein three sides of the panel 410, which are not the outlet air, are respectively connected to the top, the left side, the right side, and the left side of the cabinet 500, and one side of the panel 410 corresponding to the outlet 461 is opposite to the cold dissipation plate 201 at the lower part, so that the panel 410 and the cold dissipation plate 201 form a sidewall of the storage cavity of the cabinet.
The refrigeration equipment provided by the embodiment of the application adopts the heat dissipation structure of the heat dissipation guide pipe and the heat dissipation steel wire, the heat at the hot end of the semiconductor chip is absorbed through the circulation of heat absorption gasification and precooling liquefaction of the refrigerant in the heat dissipation guide pipe, and then the heat is transferred to the heat dissipation steel wire through the heat dissipation guide pipe for heat dissipation, so that the noise is zero in the heat dissipation process; the auxiliary cooling part is arranged on the cooling plate, and the extension supporting part is arranged on the cold guide piece to improve the refrigeration efficiency, so that the noise generated when the refrigeration system operates is reduced; the noise generated when the cold circulation fan works is reduced through the damping structure and the air duct structure, so that the noise of the refrigeration equipment can be reduced to be lower than 27 decibels during working, and a superior noise reduction effect is achieved.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (10)
1. A refrigeration system, comprising:
a semiconductor chip (100) having a cold side and a hot side;
a cold sink structure (200) connected to a cold side of the semiconductor chip (100);
a heat dissipation structure (300) connected to a hot end of the semiconductor chip (100);
a cold circulation fan (400) disposed corresponding to the cold dissipation structure (200) such that air coming out of the cold circulation fan (400) passes through the cold dissipation structure (200) and exchanges heat with the cold dissipation structure (200);
the heat dissipation structure (300) includes:
a heat radiation pipe (310) connected with the hot end of the semiconductor chip (100), wherein a refrigerant is arranged in the heat radiation pipe;
and a heat radiation steel wire (320) connected with the heat radiation guide pipe (310).
2. The refrigeration system according to claim 1, wherein the cold dissipation structure (200) comprises a cold dissipation plate (201), the cold dissipation plate (201) is connected with the cold end of the semiconductor chip (100) through a cold conducting piece (110), and the cold dissipation plate (201) is distributed with auxiliary cold dissipation parts (210).
3. The refrigeration system according to claim 1, characterized in that the cold dissipation structure (200) comprises a cold dissipation plate (201), the cold dissipation plate (201) is connected with the cold end of the semiconductor chip (100) through a cold conducting piece (110), the cold conducting piece (110) is provided with an extended support (111), and the cold dissipation plate (201) is connected with the extended support (111).
4. The refrigerating system as recited in claim 1, wherein said cold circulation fan (400) includes a shock absorbing structure, a panel (410), and a fan body (420), said fan body (420) being connected with said panel (410) through said shock absorbing structure; the shock-absorbing structure comprises a shock-absorbing plate (430), and the shock-absorbing plate (430) is arranged between the fan body (420) and the panel (410).
5. The refrigerating system as recited in claim 4, wherein the shock absorbing structure further comprises an elastic fixing member (440), and the fan body (420) and the panel (410) are fixedly connected through the elastic fixing member (440).
6. The refrigerating system as recited in claim 5, wherein the fan body (420), the damping plate (430) and the panel (410) are provided with corresponding fixing holes (471), and both ends of the elastic fixing member (440) are respectively provided with a first limiting portion (441) and a second limiting portion (442);
the elastic fixing piece (440) is arranged in the three fixing holes (471), and the first limiting portion (441) and the second limiting portion (442) are used for being clamped outside the fixing holes (471) of the fan body (420) or the panel (410) so as to fixedly connect the fan body (420), the damping plate (430) and the panel (410).
7. The refrigerating system as recited in claim 6, wherein said second position-limiting portion (442) is provided with a position-limiting end (4421) and a guiding end (4422), said position-limiting end (4421) and said guiding end (4422) being arranged in series; the guide end (4422) is far away from the first limiting part (441) and is used for guiding the second limiting part (442) to pass through the three fixing holes (471); the limiting end (4421) is close to the first limiting part (441) and is used for clamping the second limiting part (442) outside the fixing hole (471) of the fan body (420) or the panel (410) after passing through the three fixing holes (471).
8. The refrigeration system according to claim 4, wherein the fan body (420) has a fixing member (421), the fixing member (421) is provided with a first flow restriction portion (423) around the fan body (420), an air duct (422) is formed between the first flow restriction portion (423) and the fan body (420), the air duct (422) is provided with an air outlet (461), and the air outlet (461) corresponds to the cold dissipation structure (200).
9. The refrigerating system as recited in claim 4, wherein the panel (410) and the damping plate (430) are provided with a first intake vent (462) corresponding to the fan body (420); the fixing piece (421) is provided with a second air inlet (463) corresponding to the fan body (420).
10. Refrigeration device, characterized in that it comprises a cabinet (500) and a refrigeration system according to any one of claims 1 to 9.
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CN202010536699.9A CN111623551A (en) | 2020-06-12 | 2020-06-12 | Refrigerating system and refrigerating equipment |
PCT/CN2020/142112 WO2021248901A1 (en) | 2020-06-12 | 2020-12-31 | Refrigeration system and refrigeration device |
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CN202010536699.9A CN111623551A (en) | 2020-06-12 | 2020-06-12 | Refrigerating system and refrigerating equipment |
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CN217952747U (en) * | 2022-06-29 | 2022-12-02 | 莱尔德热系统(深圳)有限公司 | Heat exchange system for semiconductor refrigeration sheet |
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