CN111610608A - Optical module encapsulating structure and method - Google Patents
Optical module encapsulating structure and method Download PDFInfo
- Publication number
- CN111610608A CN111610608A CN202010604373.5A CN202010604373A CN111610608A CN 111610608 A CN111610608 A CN 111610608A CN 202010604373 A CN202010604373 A CN 202010604373A CN 111610608 A CN111610608 A CN 111610608A
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- Prior art keywords
- optical module
- substrate
- heat dissipation
- heat
- potting
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides an optical module encapsulating structure and a method, wherein the optical module encapsulating structure comprises: the heat dissipation device comprises a shell, a heat dissipation substrate, a circuit substrate and a plurality of electronic devices; the heat dissipation substrate and the circuit substrate are packaged in the shell; the heat dissipation substrate and the circuit substrate enclose a packaging space, and the packaging space is sealed by a cover plate; the electronic devices are located in the packaging space and are attached to the heat dissipation substrate, and the packaging space is filled and sealed by heat conduction sealant. The encapsulating structure of the optical module is internally provided with the encapsulating space, and the colloid which plays the roles of sealing and heat conduction is encapsulated in the encapsulating space, so that the encapsulation of the miniaturized optical module is realized, and the problems of encapsulation and heat dissipation of the module are solved. Meanwhile, the optical module has good waterproof, shockproof and dustproof performances and EMC performance through the potting mode.
Description
Technical Field
The invention relates to the technical field of optical module packaging, in particular to an optical module encapsulating structure and an optical module encapsulating method.
Background
With the rapid iteration of 5G and data centers, optical modules are rapidly moving towards a route of high speed, miniaturization, low power consumption and low cost. Therefore, in the face of the development demand for miniaturization of the optical module, the structure inside the module faces the problem of packaging, and meanwhile, the optical module is required to have good waterproof and heat dissipation performance. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The invention aims to provide an optical module encapsulating structure and an optical module encapsulating method, which aim to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a light module potting structure, comprising: the heat dissipation device comprises a shell, a heat dissipation substrate, a circuit substrate and a plurality of electronic devices;
the heat dissipation substrate and the circuit substrate are packaged in the shell; the heat dissipation substrate and the circuit substrate enclose a packaging space, and the packaging space is sealed by a cover plate; the electronic devices are located in the packaging space and are attached to the heat dissipation substrate, and the packaging space is filled and sealed by heat conduction sealant.
As an improvement of the potting structure of the optical module of the present invention, the housing includes: the upper shell is a shell cover, the lower shell is arranged in a hollow mode, and the shell cover is buckled on the lower shell.
As an improvement of the encapsulating structure of the optical module, the cover plate is connected with the top surface inside the housing through a heat dissipation gasket or heat-conducting silicone gel, and the heat dissipation substrate is connected with the bottom surface inside the housing through a heat dissipation gasket or heat-conducting silicone gel.
As an improvement of the optical module potting structure of the present invention, the plurality of electronic devices include: the drive chip is electrically connected with the photonic integrated chip through a gold thread, and an electric connection area between the drive chip and the photonic integrated chip is wrapped through organic silicon gel.
As an improvement of the optical module encapsulating structure, the electronic devices further comprise an optical fiber support, the photonic integrated chip is connected with the optical fiber input and output unit of the optical module encapsulating structure through the optical fiber support, and the optical fiber support is coupled with the end face of the photonic integrated chip through organic silicon gel.
As an improvement of the optical module potting structure, a layer of organic silicon gel is filled between the optical fiber bracket and the heat dissipation substrate.
As an improvement of the encapsulating structure of the optical module, the heat-conducting sealant is insulating heat-conducting silica gel.
As an improvement of the encapsulating structure of the optical module, the cover plate is further provided with an encapsulating hole and a glue overflow hole, and the encapsulating hole and the glue overflow hole are communicated with the encapsulating space.
In order to solve the technical problems, the technical scheme of the invention is as follows:
an optical module encapsulating method comprises the following steps:
connecting the heat dissipation substrate with the circuit substrate;
mounting a plurality of electronic devices on the radiating substrate, so that the electronic devices are positioned in a packaging space defined by the radiating substrate and the circuit substrate;
electrically connecting the electronic devices and the circuit board;
and pouring heat-conducting silica gel into the packaging space.
In the optical module potting method according to the present invention, before potting the thermally conductive silicone gel in the package space, the method further includes:
wrapping the silicone gel in the required electrical connection area between the electronic devices;
the required area between the electronic device and the heat-dissipating substrate is filled with silicone gel.
Compared with the prior art, the invention has the beneficial effects that: the encapsulating structure of the optical module is internally provided with the encapsulating space, and the colloid which plays the roles of sealing and heat conduction is encapsulated in the encapsulating space, so that the encapsulation of the miniaturized optical module is realized, and the problems of encapsulation and heat dissipation of the module are solved. Meanwhile, the optical module has good waterproof, shockproof and dustproof performances and EMC performance through the potting mode.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic perspective view of an optical module potting structure according to an embodiment of the present invention;
fig. 2 is a schematic exploded perspective view of the potting structure of the light module in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides an optical module potting structure, which includes: a housing 1, a heat dissipation substrate 2, a circuit substrate 3, and a plurality of electronic devices 4.
The heat dissipation substrate 2 and the circuit substrate 3 are enclosed in the case 1. The heat dissipation substrate 2 and the circuit substrate 3 are fixed by structural adhesive. In one embodiment, the heat dissipating substrate 2 is a tungsten copper heat dissipating substrate 2.
The housing 1 includes: an upper housing 11 and a lower housing 12. The upper housing 11 is a housing cover, the lower housing 12 is hollow, and the housing cover is fastened to the lower housing 12 to limit the internal space of the housing 1. In addition, the optical module encapsulating structure of the present embodiment further has an optical fiber input/output unit 5, and the optical fiber input/output unit 5 may be an optical connector. At this time, the housing 1 composed of the upper housing 11 and the lower housing 12 has an opening 10 at one end, and the optical connector is received in the opening 10 at one end, so that the optical connector is fittingly connected to the outside.
In order to realize the encapsulation and fixation of a plurality of electronic devices 4 inside, the heat dissipation substrate 2 and the circuit substrate 3 enclose a packaging space 6, the packaging space 6 is sealed by a cover plate 7, the electronic devices 4 are positioned in the packaging space 6, and the electronic devices 4 are attached to the heat dissipation substrate 2.
At this time, in order to fix the heat dissipating substrate 2 and the circuit substrate 3 in the housing 1, the cover plate 7 is connected to the top surface inside the housing 1 through a heat dissipating pad or a heat conductive silicone gel 71, and the heat dissipating substrate 2 is connected to the bottom surface inside the housing 1 through a heat dissipating pad or a heat conductive silicone gel 21. Therefore, the cover plate 7 and the heat dissipation substrate 2 are in close contact with the shell 1, and heat dissipation of the electronic device 4 during operation is facilitated.
The electronic devices 4 include, but are not limited to, a Driver chip (e.g., TIA/Driver), a photonic integrated chip pic (photonic integrated circuit), and a discrete optoelectronic device.
In one embodiment, when the electronic devices 4 include the driver chip 41 and the photonic integrated chip 42, the driver chip 41 and the photonic integrated chip 42 are electrically connected by gold wires, and considering the requirement of module miniaturization and high density development and high frequency signals, the gold wires are required to be shorter and thinner, and the electrical connection area between the driver chip 41 and the photonic integrated chip 42 is wrapped by the silicone gel 81. Thus, the silicone gel 81 not only has a pre-fixing function but also has a stress buffering and protecting function for the gold wire, and can improve the high-frequency transmission characteristics.
When the electronic devices 4 further include the optical fiber support 9, the photonic integrated chip 42 is connected to the optical fiber input/output unit 5 of the optical module encapsulating structure through the optical fiber support 9, and the end surfaces of the optical fiber support 9 and the photonic integrated chip 42 are coupled through the organic silicon gel. By adopting the organic silicon gel coupling mode, the end face coupling efficiency can not be interfered. In addition, a layer of silicone gel 82 is filled between the optical fiber support 9 and the heat dissipation substrate 2, and the silicone gel layer is formed by filling, so that the optical fiber support 9 can be protected from external mechanical impact and vibration, and the reliability of the optical module encapsulation structure in the embodiment is improved.
In addition, in order to adapt to the mounting of the driver chip 41 and the photonic integrated chip 42, a step structure 22 is formed on the heat dissipation substrate 2.
In consideration of the fact that in the long-term use process of the optical module, part of water vapor enters the inside of the package to affect the performance of the humidity sensitive element and the glue, in order to realize the sealing of the package space 6 and the sealing, heat conducting and waterproof performance of the encapsulation structure of the optical module in the embodiment, the package space 6 is encapsulated by the heat conducting sealant 83. Correspondingly, the cover plate 7 is further provided with a filling hole 72 and an adhesive overflow hole 73, and the filling hole 72 and the adhesive overflow hole 73 are communicated with the packaging space 6.
In one embodiment, there are one filling and sealing hole 72 and two glue overflow holes 73, and they are distributed on both sides of the filling and sealing hole. Thus, the potting adhesive is injected from the middle potting hole 72, and when the adhesive overflow hole 73 overflows, the entire package space 6 is filled with the heat conductive sealant 83. The heat-conducting sealant 83 can be an insulating heat-conducting silica gel, so that a complete encapsulating structure is formed in the encapsulating space 6, the internal photoelectric element is protected to the greatest extent, and the purposes of dust prevention, moisture prevention and improvement of the heat dissipation environment of an internal heat source are achieved.
Based on the same technical concept, the invention also provides an optical module encapsulating method, which comprises the following steps:
connecting the heat dissipation substrate with the circuit substrate;
mounting a plurality of electronic devices on the radiating substrate, so that the electronic devices are positioned in a packaging space defined by the radiating substrate and the circuit substrate;
electrically connecting the electronic devices and the circuit board;
and pouring heat-conducting silica gel into the packaging space.
In addition, in the optical module potting method, before the filling of the heat-conducting silicone gel into the encapsulation space, the method further includes:
wrapping the silicone gel in the required electrical connection area between the electronic devices;
the required area between the electronic device and the heat-dissipating substrate is filled with silicone gel.
In an exemplary embodiment, another embodiment of the present invention further provides a method for potting a light module. In this embodiment, the optical module potting method includes:
s1, firstly, welding the heat dissipation substrate and the circuit substrate;
s1, mounting a driving chip on the radiating substrate;
s1, mounting the photonic integrated chip;
s1, gold wire bonding: the driving chip is electrically connected with the circuit substrate and the photonic integrated chip;
s1, coupling the optical fiber support with the end face of the photonic integrated chip, curing the optical fiber support and the photonic integrated chip by using optical path matching glue on the end face, and connecting the optical fiber support and the photonic integrated chip;
s1, selecting low-volatility, low-density and low-dielectric-constant silicone gel to wrap the electric connection area of the driving chip and the photonic integrated chip to form a layer of encapsulation;
s1, selecting a low-volatility and low-CTE silicone gel to be filled between the optical fiber support and the heat dissipation substrate. Forming a buffer layer;
and S1, carrying out vacuum curing on the wrapped silicon gel and the filled silicon gel buffer layer.
And S1, fixing the cover plate, and then pouring heat-conducting silica gel inwards through the glue pouring hole to form outermost layer encapsulation. The encapsulation silicone gel requires low volatilization, insulation and heat conduction and good water resistance.
And S1, carrying out vacuum curing on the poured heat-conducting silicone gel.
In one embodiment, a tungsten copper heat dissipation substrate is used as the heat dissipation substrate, and the cover plate and the tungsten copper heat dissipation substrate are both bonded with a heat conduction gasket or heat conduction silica gel to realize close contact with the housing.
In summary, the encapsulation structure for the optical module of the present invention is configured with the encapsulation space inside, and encapsulates the colloid with the sealing and heat conducting functions into the encapsulation space, so as to implement the encapsulation of the miniaturized optical module and solve the problems of encapsulation and heat dissipation of the module. Meanwhile, the optical module has good waterproof, shockproof and dustproof performances and EMC performance through the potting mode.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. An optical module potting structure, comprising: the heat dissipation device comprises a shell, a heat dissipation substrate, a circuit substrate and a plurality of electronic devices;
the heat dissipation substrate and the circuit substrate are packaged in the shell; the heat dissipation substrate and the circuit substrate enclose a packaging space, and the packaging space is sealed by a cover plate; the electronic devices are located in the packaging space and are attached to the heat dissipation substrate, and the packaging space is filled and sealed by heat conduction sealant.
2. The light module potting structure of claim 1, wherein the housing comprises: the upper shell is a shell cover, the lower shell is arranged in a hollow mode, and the shell cover is buckled on the lower shell.
3. The optical module potting structure of claim 1 or 2, wherein the cover plate is connected to the top surface of the inside of the housing through a heat sink or a heat conductive silicone gel, and the heat sink substrate is connected to the bottom surface of the inside of the housing through a heat sink or a heat conductive silicone gel.
4. The light module potting structure of claim 1, wherein the number of electronics comprises: the drive chip is electrically connected with the photonic integrated chip through a gold thread, and an electric connection area between the drive chip and the photonic integrated chip is wrapped through organic silicon gel.
5. The optical module potting structure of claim 4, wherein the plurality of electronic components further comprise a fiber holder, the photonic integrated chip is connected to the fiber input and output unit of the optical module potting structure through the fiber holder, and the fiber holder is coupled to an end face of the photonic integrated chip through an organic silicon gel.
6. The optical module potting structure of claim 5, wherein a layer of silicone gel is further filled between the optical fiber bracket and the heat dissipation substrate.
7. The optical module potting structure of any one of claims 1, 4, 5 and 6, wherein the heat conducting sealant is an insulating heat conducting silicone gel.
8. The optical module potting structure of claim 1, wherein the cover plate is further provided with a potting hole and an adhesive overflow hole, and the potting hole and the adhesive overflow hole are communicated with the potting space.
9. An optical module potting method, characterized by comprising the steps of:
connecting the heat dissipation substrate with the circuit substrate;
mounting a plurality of electronic devices on the radiating substrate, so that the electronic devices are positioned in a packaging space defined by the radiating substrate and the circuit substrate;
electrically connecting the electronic devices and the circuit board;
and pouring heat-conducting silica gel into the packaging space.
10. The method for potting a light module according to claim 9, further comprising, before potting the thermally conductive silicone gel into the encapsulation space:
wrapping the silicone gel in the required electrical connection area between the electronic devices;
the required area between the electronic device and the heat-dissipating substrate is filled with silicone gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604373.5A CN111610608A (en) | 2020-06-29 | 2020-06-29 | Optical module encapsulating structure and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604373.5A CN111610608A (en) | 2020-06-29 | 2020-06-29 | Optical module encapsulating structure and method |
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| CN111610608A true CN111610608A (en) | 2020-09-01 |
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| CN202010604373.5A Pending CN111610608A (en) | 2020-06-29 | 2020-06-29 | Optical module encapsulating structure and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113835170A (en) * | 2021-11-26 | 2021-12-24 | 长芯盛（武汉）科技有限公司 | A kind of injection molding packaging method of photoelectric module and photoelectric module thereof |
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