CN111610603A - Improved structure of light emission sub-module - Google Patents

Abstract

An improved structure of a transmitter optical subassembly comprises a packaging box body, a laser diode driver set, an electrothermal refrigeration chip, a multiplexer support column, a laser diode set and a collimating lens set. The packaging box body is provided with a circuit control end and a light emitting end, and the light emitting end is provided with a light emitting hole. The laser diode driver group is arranged on the circuit control end. The electrothermal refrigeration chip and the optical device support column are respectively arranged in the packaging box body, wherein the electrothermal refrigeration chip is arranged between the laser diode driver set and the optical device support column, and the optical device support column is arranged between the electrothermal refrigeration chip and the light emitting end. The optical device has an input end and an output end, the input end of the optical device is arranged on one end of the electric heating refrigeration chip, and the output end of the optical device is arranged on the optical device support column. The laser diode group is arranged on the other end of the electric heating refrigeration chip, wherein the laser diode group is electrically connected with the laser diode driver group.

Description

Improved structure of light emission sub-module

technical field

The present invention relates to an improved structure of a light emitting sub-module, in particular to an improved structure of a light emitting sub-module with an electrothermal cooling chip.

Background technique

Please refer to FIG. 10A , which is a specific embodiment of a light emitting sub-module in the prior art. Please also refer to FIG. 10B , which is a schematic top view of the embodiment of FIG. 10A . A light emitting sub-module 9 in the prior art includes: a package box 90, a laser diode driver group 92, a flexible circuit board 921, an electrothermal cooling chip 93 (TEC: thermoelectric cooler), an optical processor 95 (optical device 95). multiplexer), a laser diode group 96 , an optical window lens 904 , a fiber coupling portion 98 and a collimating lens group 97 . The packaging box 90 has a circuit control end 901 and a light emitting end 902 . The light exit end 902 has a light exit hole 903 . The laser diode driver group 92 includes four laser diode drivers 922 , 923 , 924 and 925 . The optical device 95 has an input end 951 and an output end 952 . The input end 951 of the optical device 95 has four optical input ports 953 , 954 , 955 and 956 . The output end 952 of the optical device 95 has an optical output port 957 . The laser diode group 96 includes four laser diodes 961 , 962 , 963 and 964 . The collimator lens group 97 includes four collimator lenses 971 , 972 , 973 and 974 (collimator lenses). The laser diode driver group 92 is disposed on the circuit control terminal 901 . The electrothermal cooling chip 93 is disposed in the packaging box 90 . The electrothermal cooling chip 93 is interposed between the laser diode driver group 92 and the light emitting end 902 . The optical generator 95 is disposed on one end 932 of the electrothermal cooling chip 93 , the laser diode group 96 is disposed on the other end 931 of the electrothermal cooling chip 93 , and the collimating lens group 97 is disposed on the electrothermal cooling chip 93 . , and the collimating lens group 97 is between the laser diode group 96 and the optical device 95 . The laser diode group 96 is located between the laser diode driver group 92 and the collimating lens group 97 , wherein the four laser diodes 961 , 962 , 963 , and 964 of the laser diode group 96 are connected to the corresponding laser diodes through the flexible circuit board 921 respectively. The four laser diode drivers 922 , 923 , 924 and 925 of the laser diode driver group 92 are electrically connected. The four collimating lenses 971 , 972 , 973 and 974 of the collimating lens group 97 correspond to the four laser diodes 961 , 962 , 963 and 964 of the laser diode group 96 respectively. The input end 951 of the optical device 95 is close to the collimating lens group 97 , so that the four collimating lenses 971 , 972 , 973 , and 974 of the collimating lens group 97 correspond to the four lenses of the input end 951 of the optical device 95 respectively The optical input ports 953, 954, 955, 956; and the output end 952 of the optical device 95 is close to the light output end 902, so that the light output port 957 of the output end 952 of the optical device 95 corresponds to the light output of the light output end 902 hole 903. The optical window lens 904 is disposed on the light exit hole 903 . The fiber coupling portion 98 is disposed outside the packaging box 90 and is connected to the light emitting end 902 . The fiber coupling portion 98 includes a focusing lens 981 and an optical fiber 982 , wherein the focusing lens 981 is interposed between the optical window lens 904 and the optical fiber 982 . The design of this embodiment is that the laser diode group 96 , the collimating lens group 97 and the optical processor 95 are all arranged on the electrothermal cooling chip 93 , and the laser diode group 96 , the collimating lens group 97 and the optical processor 95 are all arranged on the top of the electrothermal cooling chip 93 . Under good temperature control, the distance between the laser diode group 96 and the collimating lens group 97 is constant, and there is no phenomenon of up, down, left and right shifts. Therefore, the four laser diodes 961, 962, 963 of the laser diode group 96 The light emitted by 964 and 964 respectively pass through the four collimating lenses 971, 972, 973 and 974 of the collimating lens group 97, respectively, and the output light will not be out of focus or the angle will be deviated up, down, left and right due to the change of the external temperature. shifting phenomenon. Moreover, the distance between the collimating lens group 97 and the optical device 95 is also constant, and there is no phenomenon of up-down, left-right shift. Therefore, the light passing through the four collimating lenses 971 , 972 , 973 and 974 of the collimating lens group 97 respectively enters through the four light input ports 953 , 954 , 955 and 956 of the input end 951 of the optical device 95 respectively The optical device 95 will not be out of focus or the angle is shifted up, down, left and right due to changes in the external temperature. Therefore, after passing through the optical device 95, the light output by the light output port 957 of the output end 952 of the optical device 95 will not have changes in optical characteristics due to changes in the external temperature. Since the optical generator 95 is arranged on the electrothermal cooling chip 93, when the temperature of the electrothermal cooling chip 93 is controlled, although the temperature of the surface of the electrothermal cooling chip 93 can be well controlled, the electrothermal cooling chip 93 can be well controlled. The surface of 93 will not expand or shrink due to changes in external temperature, but when the temperature of the electrothermal cooling chip 93 is controlled, the optical window lens 904 and the optical window lens 904 and The position of the focusing lens 981 up, down, left and right will vary with the temperature of the outside world. Therefore, the distance between the electrothermal cooling chip 93 and the focusing lens 981 (the light first passes through the optical window lens 904 and then passes through the focusing lens 981 ) will vary with the temperature of the outside world. Change and there is a phenomenon of up and down, left and right offset. Therefore, the light output from the light output port 957 of the output end 952 of the optical device 95, passes through the optical window lens 904, and then is coupled into the optical fiber 982 by the focusing lens 981 will change with the change of the external temperature.

Please refer to FIG. 11 , which is another specific embodiment of a light emitting sub-module in the prior art. The main structure of the embodiment shown in FIG. 11 is substantially the same as that of the embodiment shown in FIG. 10A , however, it further includes an optical device fixing portion 94 , wherein the optical device fixing portion 94 is disposed between the packaging box 90 Inside, the electrothermal cooling chip 93 is located between the laser diode driver group 92 and the optical device fixing part 94, and the optical device fixing part 94 is between the electrothermal cooling chip 93 and the light emitting end 902, wherein the optical device 95 is arranged on the fixing part 94 of the optical tool, wherein the collimating lens group 97 is arranged on one end 932 of the electrothermal cooling chip 93, and the laser diode group 96 is arranged on the other end 931 of the electrothermal cooling chip 93, wherein The laser diode group 96 is located between the laser diode driver group 92 and the collimating lens group 97 , wherein the four laser diodes 961 , 962 , 963 , and 964 of the laser diode group 96 are respectively connected to the corresponding lasers through the flexible circuit board 921 The four laser diode drivers 922 , 923 , 924 and 925 of the diode driver group 92 are electrically connected. The four collimating lenses 971 , 972 , 973 and 974 of the collimating lens group 97 correspond to the four laser diodes 961 , 962 , 963 and 964 of the laser diode group 96 respectively. The input end 951 of the optical device 95 is close to the collimating lens group 97 , so that the four collimating lenses 971 , 972 , 973 , and 974 of the collimating lens group 97 correspond to the four lenses of the input end 951 of the optical device 95 respectively The optical input ports 953, 954, 955, 956; and the output end 952 of the optical device 95 is close to the light output end 902, so that the light output port 957 of the output end 952 of the optical device 95 corresponds to the light output of the light output end 902 hole 903. The design of this embodiment is to dispose the laser diode group 96 and the collimating lens group 97 on the electrothermal cooling chip 93, and the laser diode group 96 and the collimating lens group 97 are under good temperature control, so that the laser diode group 96 The distance from the collimating lens group 97 is constant, and there will be no phenomenon of up, down, left and right shift. Therefore, the light emitted by the four laser diodes 961, 962, 963, and 964 of the laser diode group 96 respectively passes through the collimator. The light output after the four collimating lenses 971 , 972 , 973 , and 974 of the collimating lens group 97 will not be out of focus or the angle will be shifted up, down, left and right due to changes in the outside temperature. However, since the optical device 95 is not temperature-controlled, the distance between the collimating lens group 97 and the optical device 95 is not constant, and there is also a phenomenon of up, down, left, and right shifts. Therefore, the light passing through the four collimating lenses 971 , 972 , 973 and 974 of the collimating lens group 97 respectively enters through the four light input ports 953 , 954 , 955 and 956 of the input end 951 of the optical device 95 respectively The optical device 95 may be out of focus or the angle may be shifted up, down, left and right due to changes in the external temperature. As a result, the optical properties of the light output by the light output port 957 of the output end 952 of the optical device 95 may be affected by changes in the external temperature.

In view of this, the inventor of the present application has developed a design that is easy to assemble, can avoid the above shortcomings, is easy to install, and has the advantages of low cost, so as to take into account the flexibility of use and economy, and thus the invention is born.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is how to make the optical characteristics of the output light of the light emitting sub-module not affected by the change of the external temperature.

In order to solve the aforementioned problems and achieve the expected effect, the present invention provides an improved structure of a light emitting sub-module, comprising: a package box, a laser diode driver group, an electrothermal cooling chip, an optical device support column, an optical generator, a laser diode group and a collimating lens group. The packaging box body has a circuit control end and a light emitting end, wherein the light emitting end has a light emitting hole. The laser diode driver group is arranged on the circuit control end. The electrothermal cooling chip is arranged in the packaging box. The optical device support column is arranged in the packaging box, wherein the electrothermal cooling chip is between the laser diode driver group and the optical device support column, and the optical device support column is between the electrothermal cooling chip and the light emitting end. The optical device has an input end and an output end, the input end of the optical device is arranged on one end of the electrothermal cooling chip, and the output end of the optical device is arranged on the support column of the optical device. The laser diode group is arranged on the other end of the electrothermal cooling chip, and the laser diode group is electrically connected with the laser diode driver group. The collimating lens group is arranged on the electrothermal cooling chip, the laser diode group is located between the laser diode driver group and the collimating lens group, and the collimating lens group is located between the laser diode group and the input end of the optical device. between. Since the input end of the optical device, the laser diode group and the collimating lens group are arranged on the electrothermal cooling chip, the connection between the laser diode group and the collimating lens group and between the collimating lens group and the optical device is The distance is constant, and there will be no phenomenon of up, down, left, and right shifts, so there will be no out-of-focus or up, down, left, and right shifts in the angle with the change of the outside temperature. And the output end of the optical generator is set on the optical generator support column, and the optical generator support column is not within the temperature control range of the electrothermal cooling chip, so the change of the optical generator support column with the temperature change will It is similar to the change of the light exit end of the packaging box with the change of temperature, especially when the material of the optical tool support is the same as that of the packaging box. Therefore, if an optical device, such as a focusing lens and/or an optical fiber, is provided at the light exit end of the packaging box, the light output from the output end of the optical device enters the optical device, and will not be affected by the external environment. The temperature changes and the focus is lost or the angle is shifted up, down, left and right. Therefore, the optical properties of the light entering the optical device are not affected by changes in the temperature of the outside world.

In some embodiments, the aforementioned improved structure of the light emitting sub-module further includes an optical window lens, wherein the optical window lens is disposed on the light exit hole.

In some embodiments, the aforementioned improved structure of the light emitting sub-module further includes an optical fiber coupling portion, wherein the optical fiber coupling portion is disposed outside the packaging box and connected to the light emitting end, wherein the optical fiber coupling portion includes a focusing A lens and an optical fiber, wherein the focusing lens is interposed between the optical window lens and the optical fiber.

In some embodiments, the aforementioned improved structure of the light emitting sub-module further includes an optical fiber coupling portion, wherein the optical fiber coupling portion is disposed outside the packaging box and connected to the light emitting end, wherein the optical fiber coupling portion includes a focusing A lens and an optical fiber, wherein the focusing lens is between the light exit hole and the optical fiber.

In some embodiments, in the aforementioned improved structure of the light emitting sub-module, the optical fiber coupling portion further includes an optical isolator, wherein the isolator is disposed between the focusing lens and the optical fiber.

In some embodiments, in the aforementioned improved structure of the light emitting sub-module, the optical fiber coupling portion further includes an optical fiber sleeve, wherein the optical fiber sleeve is used for fixing the optical fiber.

In some embodiments, the aforementioned improved structure of the light emitting sub-module further includes a flexible circuit board, wherein the laser diode group and the laser diode driver group are electrically connected through the flexible circuit board.

In some embodiments, the aforementioned improved structure of the light emitting sub-module, wherein the laser diode group includes four laser diodes, the laser diode driver group includes four laser diode drivers, the collimating lens group includes four collimating lenses, and the optical The input end has four optical input ports, four laser diode drivers correspond to four laser diodes, four laser diodes correspond to four collimating lenses, and four collimating lenses correspond to Four optical input ports at the input end of the optical device.

In some embodiments, the aforementioned light emitting submodule improved structure, wherein each of the four laser diodes is an externally modulated laser diode.

In some embodiments, in the improved structure of the aforementioned light emitting sub-module, the laser diode group further includes four photodetecting diodes, wherein the four photodetecting diodes correspond to the four laser diodes respectively.

In some embodiments, in the above-mentioned improved structure of the light emitting sub-module, there is a space between the electrothermal cooling chip and the supporting column of the optical device below the optical device.

In some embodiments, the aforementioned improved structure of the light emitting sub-module further includes a temperature sensor, wherein the temperature sensor is disposed on the electrothermal cooling chip and adjacent to the laser diode group.

In some embodiments, the aforementioned improved structure of the light emitting sub-module, wherein the packaging box is made of metal.

In some embodiments, in the aforementioned improved structure of the light emitting sub-module, the material constituting the support column of the optical device is the same as the material constituting the packaging box.

In order to further understand the present invention, the preferred embodiments are given below, and the specific components of the present invention and the effects achieved are described in detail as follows in conjunction with the drawings and drawing numbers.

Description of drawings

1A is a schematic cross-sectional view of a specific embodiment of an improved structure of a light emitting sub-module of the present invention.

FIG. 1B is a schematic top view of the embodiment of FIG. 1A .

FIG. 2 is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention.

FIG. 3 is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention.

4 is a schematic cross-sectional view of yet another specific embodiment of an improved structure of a light emitting sub-module of the present invention.

5 is a schematic cross-sectional view of a specific embodiment of an improved structure of a light emitting sub-module of the present invention.

6 is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention.

FIG. 7 is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention.

8 is a schematic top view of a specific embodiment of an improved structure of a light emitting sub-module of the present invention.

9 is a schematic top view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention.

FIG. 10A is a specific embodiment of a light emitting sub-module in the prior art.

FIG. 10B is a schematic top view of the embodiment of FIG. 10A .

FIG. 11 is another specific embodiment of a light emitting sub-module in the prior art.

Description of reference numerals: 1-improved structure of light emission sub-module; 10-package box; 11-circuit control end; 12-light exit end; 13-light exit hole; 14-optical window lens; 15-interval; 20- Laser diode driver group; 21 - flexible circuit board; 22, 23, 24, 25 - laser diode driver; 30 - electrothermal cooling chip; 31 - the other end of the electrothermal cooling chip; 32 - one end of the electrothermal cooling chip; 33-temperature sensor; 40-optical device support column; 50-optical device; 51-optical device input end; 52-optical device output end; 53, 54, 55, 56-optical input port; 57 -Light output port; 60-laser diode group; 61,62,63,64-laser diode; 65,66,67,68-detection diode; 70-collimation lens group; 71,72,73,74-collimation Straight lens; 80-fiber coupling part; 81-focusing lens; 82-fiber; 83-optical isolator; 84-fiber sleeve; 9-light emission sub-module; 90-package box; 901-circuit control end; 902 - Light exit end; 903 - Light exit hole; 904 - Optical window lens; 92 - Laser diode driver group; 921 - Flexible circuit board; 93 - Electrothermal cooling chip; 931 - The other end of the electrothermal cooling chip; 932- One end of the electrothermal cooling chip; 94-optical device fixing part; 95-optical device; 951-optical device input end; 952-optical device output end; 96-laser diode group; 97-collimating lens group; 98-fiber coupling part; 981-focusing lens; 982-fiber.

Detailed ways

Please refer to FIG. 1A , which is a schematic cross-sectional view of an embodiment of an improved structure of a light emitting sub-module of the present invention. Please also refer to FIG. 1B , which is a schematic top view of the embodiment of FIG. 1A . An improved structure 1 of a light emitting sub-module of the present invention includes: a package box 10, a laser diode driver group 20, a flexible circuit board 21, a thermoelectric cooler (TEC: thermoelectric cooler), and an optical device The support column 40 , an optical multiplexer 50 , a laser diode group 60 , and a collimating lens group 70 . The packaging box 10 is made of metal. The packaging box 10 has a circuit control end 11 and a light emitting end 12 . The light exit end 12 has a light exit hole 13 . The laser diode driver group 20 is disposed on the circuit control terminal 11 . The laser diode driver group 20 includes four laser diode drivers 22 , 23 , 24 and 25 . The electrothermal cooling chip 30 is disposed inside the packaging box 10 . The optical tool support column 40 is disposed in the package box 10, wherein the electrothermal cooling chip 30 is between the laser diode driver group 20 and the optical tool support column 40, and the optical tool support column 40 is located between the electrothermal cooling chip 30 and the light exit end 12 . The optical device 50 has an input end 51 and an output end 52 . The input end 51 of the optical device 50 has four optical input ports 53 , 54 , 55 and 56 . The output end 52 of the optical device 50 has an optical output port 57 . The input end 51 of the optical device 50 is disposed on one end 32 of the electrothermal cooling chip 30, and the output end 52 of the optical device 50 is disposed on the support column 40 of the optical device 50, so that the output end of the optical device 50 The light output port 57 of 52 corresponds to the light exit hole 13 of the light exit end 12 . The laser diode group 60 is disposed on the other end 31 of the electrothermal cooling chip 30 . The laser diode group 60 includes four laser diodes 61 , 62 , 63 and 64 . The four laser diodes 61 , 62 , 63 and 64 of the laser diode group 60 are electrically connected to the four laser diode drivers 22 , 23 , 24 and 25 of the corresponding laser diode driver group 20 through the flexible circuit board 21 respectively. . The collimating lens group 70 is disposed on the electrothermal cooling chip 30 . The collimator lens group 70 includes four collimator lenses 71 , 72 , 73 , and 74 (collimator lenses). The laser diode group 60 is located between the laser diode driver group 20 and the collimating lens group 70 , so that the four collimating lenses 71 , 72 , 73 , and 74 of the collimating lens group 70 correspond to the four laser diodes 61, 62, 63, 64; and the collimating lens group 70 is between the laser diode group 60 and the input end 51 of the optical device 50, so that the four collimating lenses 71, 70 of the collimating lens group 70 72 , 73 and 74 respectively correspond to the four optical input ports 53 , 54 , 55 and 56 of the input end 51 of the optical device 50 . There is a space 15 below the optical device 50 between the electrothermal cooling chip 30 and the optical device support column 40 . Since the input end 51 of the optical device 50 , the laser diode group 60 and the collimating lens group 70 are disposed on the electrothermal cooling chip 30 , the four laser diodes 61 , 62 , 63 , and 64 of the laser diode group 60 are respectively The distance between the four collimating lenses 71 , 72 , 73 , and 74 of the corresponding collimating lens group 70 is constant, and there will be no phenomenon of up and down, left and right shifts, so there will be no loss with the change of the external temperature. The phenomenon that the focus or angle is shifted up, down, left and right. And the distances between the four collimating lenses 71, 72, 73, 74 of the collimating lens group 70 and the four light input ports 53, 54, 55, 56 of the input end 51 of the corresponding optical device 50 are constant. , and there will be no phenomenon of up, down, left and right shifts, so there will be no out-of-focus or angle up, down, left and right shifts with the change of the external temperature. Moreover, the output end 52 of the optical device 50 is disposed on the optical device supporting column 40, and the optical device supporting column 40 is not within the temperature control range of the electrothermal cooling chip 30. Therefore, the optical device supporting column 40 follows the temperature control range of the electrothermal cooling chip 30. The variation of the temperature change will be similar to the variation of the light emitting end 12 of the package box 10 with the temperature change, especially when the material of the optical tool support 40 and the package box 10 is the same. Therefore, if an optical device, such as a focusing lens and/or an optical fiber, is provided at the light output end 12 of the packaging box 10, the light output from the light output port 57 of the output end 52 of the optical device 50 will enter the The optical device will not be affected by the phenomenon of defocusing or the angle shifting up, down, left and right with the change of the external temperature. Therefore, the optical characteristics of the light entering the optical device will not be affected by the change of the external temperature, so as to achieve the purpose that the optical characteristics of the output light of the light emitting sub-module will not be affected by the external temperature change.

In some embodiments, the optical tool support 40 is the same material as the packaging box 10 .

In some embodiments, each of the four laser diodes 61 , 62 , 63 , and 64 of the laser diode group 60 is an external modulation laser (EML).

Please refer to FIG. 2 , which is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 2 is substantially the same as that of the embodiment shown in FIG. 1A , except that it further includes an optical window lens 14 , wherein the optical window lens 14 is disposed on the light exit hole 13 .

Please refer to FIG. 3 , which is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 3 is substantially the same as that of the embodiment shown in FIG. 2 , except that it further includes an optical fiber coupling portion 80 , wherein the optical fiber coupling portion 80 is disposed outside the packaging box 10 and is connected to the optical fiber coupling portion 80 . The light emitting end 12 is connected. The fiber coupling portion 80 includes a focusing lens 81 and an optical fiber 82 , wherein the focusing lens 81 is interposed between the optical window lens 14 and the optical fiber 82 .

Please refer to FIG. 4 , which is a schematic cross-sectional view of yet another specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 4 is substantially the same as that of the embodiment shown in FIG. 1A , except that it further includes an optical fiber coupling part 80 , wherein the optical fiber coupling part 80 is disposed outside the packaging box 10 and is connected to the optical fiber coupling part 80 . The light emitting end 12 is connected. The fiber coupling portion 80 includes a focusing lens 81 and an optical fiber 82 , wherein the focusing lens 81 is interposed between the light exit hole 13 and the optical fiber 82 .

Please refer to FIG. 5 , which is a schematic cross-sectional view of a specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 5 is substantially the same as that of the embodiment shown in FIG. 3 , except that the optical fiber coupling portion 80 further includes an optical isolator 83 , wherein the optical isolator 83 is disposed between the between the focusing lens 81 and the optical fiber 82 .

Please refer to FIG. 6 , which is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 6 is substantially the same as that of the embodiment shown in FIG. 3 , except that the optical fiber coupling portion 80 further includes an optical fiber ferrule 84 (ferrule), wherein the optical fiber ferrule 84 is used to fix the optical fiber 82.

Please refer to FIG. 7 , which is a schematic cross-sectional view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 7 is substantially the same as that of the embodiment shown in FIG. 6 , except that the optical fiber coupling portion 80 further includes an optical isolator 83 , wherein the optical isolator 83 is disposed between the focusing lens 81 and between optical fibers 82 .

Please refer to FIG. 8 , which is a schematic top view of a specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 8 is substantially the same as that of the embodiment shown in FIG. 1B , except that it further includes an optical window lens 14 , an optical fiber coupling portion 80 and a temperature sensor 33 . The optical window lens 14 is disposed on the light exit hole 13 . The optical fiber coupling portion 80 is disposed outside the packaging box 10 and is connected to the light emitting end 12 . The fiber coupling portion 80 includes a focusing lens 81 and an optical fiber 82 , wherein the focusing lens 81 is interposed between the optical window lens 14 and the optical fiber 82 . The temperature sensor 33 is disposed on the electrothermal cooling chip 30 and adjacent to the laser diode group 60 .

Please refer to FIG. 9 , which is a schematic top view of another specific embodiment of an improved structure of a light emitting sub-module of the present invention. The main structure of the embodiment shown in FIG. 9 is substantially the same as that of the embodiment shown in FIG. 8 , except that the laser diode group 60 further includes four photodetector diodes 65 , 66 , 67 , and 68 (MPD: Monitor Photodiode) , wherein the four detection diodes 65 , 66 , 67 , and 68 of the laser diode group 60 correspond to the four laser diodes 61 , 62 , 63 , and 64 of the laser diode group 60 respectively, and the four detection diodes of the laser diode group 60 The diodes 65 , 66 , 67 , 68 correspond to the four laser diode drivers 22 , 23 , 24 , 25 of the laser diode driver group 20 , respectively.

The above are the specific embodiments of the present invention and the technical means used. Many changes and modifications can be derived from the disclosure or teaching herein, which can still be regarded as equivalent changes made by the concept of the present invention. The resulting effects still do not exceed the substantive spirit covered by the description and the drawings, and should be regarded as being within the technical scope of the present invention, and should be stated first.

To sum up, according to the content disclosed above, the present invention can clearly achieve the intended purpose of the invention, and provides an improved structure of the light emitting sub-module, which is very valuable for industrial use.

Claims (14)

1. An improved tosa structure, comprising:

a packaging box body, wherein the packaging box body is provided with a circuit control end and a light emitting end, and the light emitting end is provided with a light emitting hole;

a laser diode driver set arranged on the circuit control end;

an electrothermal refrigeration chip arranged in the packaging box body;

a supporting column of the optical device, which is arranged in the packaging box body, wherein the electrothermal refrigeration chip is arranged between the laser diode driver set and the supporting column of the optical device, and the supporting column of the optical device is arranged between the electrothermal refrigeration chip and the light emitting end;

the optical multiplexer is provided with an input end and an output end, the input end of the optical multiplexer is arranged on one end of the electrothermal refrigeration chip, and the output end of the optical multiplexer is arranged on the optical multiplexer support column;

a laser diode group arranged on the other end of the electrothermal refrigeration chip, wherein the laser diode group is electrically connected with the laser diode driver group; and

and a collimating lens set disposed on the electrothermal cooling chip, wherein the laser diode set is disposed between the laser diode driver set and the collimating lens set, and the collimating lens set is disposed between the laser diode set and the input end of the optical multiplexer.

2. The improved tosa structure of claim 1, further comprising an optical window lens, wherein the optical window lens is disposed on the light exit hole.

3. The improved tosa structure of claim 2, further comprising an optical fiber coupling portion, wherein the optical fiber coupling portion is disposed outside the package box and connected to the light emitting end, and the optical fiber coupling portion comprises:

a focusing lens; and

an optical fiber, wherein the focusing lens is between the optical window lens and the optical fiber.

4. The improved tosa structure of claim 1, further comprising an optical fiber coupling portion, wherein the optical fiber coupling portion is disposed outside the package box and connected to the light emitting end, and the optical fiber coupling portion comprises:

a focusing lens; and

an optical fiber, wherein the focusing lens is disposed between the light exit hole and the optical fiber.

5. The improved tosa structure of any of claims 3 or 4, wherein the fiber coupling portion further comprises an optical isolator, wherein the optical isolator is disposed between the focusing lens and the optical fiber.

6. The improved tosa structure of any of claims 3 or 4, wherein the fiber coupling portion further comprises a fiber sleeve, wherein the fiber sleeve is used to fix the optical fiber.

7. The improved tosa structure of claim 1, further comprising a flexible printed circuit board, wherein the laser diode set and the laser diode driver set are electrically connected by the flexible printed circuit board.

8. The improved tosa structure of claim 1, wherein the set of laser diodes includes four laser diodes, the set of laser diode drivers includes four laser diode drivers, the collimating lens set includes four collimating lenses, the input end of the photonic device has four input ports, wherein the four laser diode drivers correspond to the four laser diodes, respectively, wherein the four laser diodes correspond to the four collimating lenses, respectively, and wherein the four collimating lenses correspond to the four input ports of the input end of the photonic device, respectively.

9. The improved tosa structure of claim 8, wherein each of the four laser diodes is an externally modulated laser diode.

10. The improved tosa structure of claim 8, wherein the set of laser diodes further comprises four photodiodes, wherein the four photodiodes correspond to the four laser diodes respectively.

11. The improved tosa structure of claim 1, wherein a space is defined between the thermal cooling chip and the tosa support under the tosa.

12. The improved tosa structure of claim 1, further comprising a temperature sensor, wherein the temperature sensor is disposed on the thermoelectric cooling chip and adjacent to the set of laser diodes.

13. The improved tosa structure of claim 1, wherein the package body is made of metal.

14. The improved tosa structure of any of claims 1 or 13, wherein the support posts of the optical multiplexer are made of the same material as the package body.

Images