CN111604604A - Forming equipment for processing semiconductor element and using method thereof - Google Patents
Forming equipment for processing semiconductor element and using method thereof Download PDFInfo
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- CN111604604A CN111604604A CN202010599274.2A CN202010599274A CN111604604A CN 111604604 A CN111604604 A CN 111604604A CN 202010599274 A CN202010599274 A CN 202010599274A CN 111604604 A CN111604604 A CN 111604604A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 122
- 238000012545 processing Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 15
- 241000252254 Catostomidae Species 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 6
- 238000005389 semiconductor device fabrication Methods 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 16
- 238000003860 storage Methods 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 description 5
- 239000003814 drug Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a forming device for processing semiconductor elements and a using method thereof.A storage seat is arranged, a connecting column and a sucker are matched for use, and the storage seats are arranged in three rows and four columns, so that a plurality of semiconductor elements can be cut and processed at the same time, and the processing efficiency of the semiconductor elements is effectively improved; the laser can simultaneously cut the semiconductor elements in the same column, so that the problem of low cutting efficiency of the semiconductor elements in the existing scheme is solved; the supporting seat and the rotary seat are matched for use, so that the cutting position of the semiconductor element can be conveniently adjusted, the semiconductor elements in different directions can be cut, and the efficiency of processing and forming the semiconductor element can be effectively improved; meshing between first ring gear and the second ring gear rotates, and the fixed column is at the fixed slot internal rotation, has overcome can not adjust the direction of semiconductor element processing among the current scheme, leads to the fashioned inefficiency problem of semiconductor element processing.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a forming device for processing a semiconductor element.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, and the importance of the semiconductor is very great from the viewpoint of science and technology or economic development; most of electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors, and common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one of various semiconductor material applications; before a semiconductor device is formed, a semiconductor element needs to be processed, including operations such as cutting, film attaching, polishing, drying and the like.
The publication number (CN105225982A) discloses a semiconductor processing device and a process method for processing a semiconductor workpiece, the device comprises a process chamber, a sealing cover, a liquid medicine supply pipe, a wafer chuck, a washing liquid feed pipe and a temperature control system, wherein a heating source is arranged outside the process chamber of the semiconductor processing device, and a pipeline heating device is wrapped outside the liquid medicine supply pipe. The semiconductor processing device can ensure that the temperature of the liquid medicine in the wet etching process of the semiconductor wafer is nearly the same as the temperature of the surface of the wafer through some unique structural designs, and when the liquid medicine is dripped to the surface of the wafer, the etching process can be finished at a uniform speed at all positions of the wafer, so that the uniformity in the wafer is ensured. But has certain disadvantages: there are problems that the efficiency of semiconductor element processing is low and that the position cannot be adjusted when processing the semiconductor element, resulting in low efficiency of semiconductor element processing.
Disclosure of Invention
The invention aims to provide a molding device for processing a semiconductor element, which solves the technical problems that:
(1) how to solve the problem that the processing efficiency of the semiconductor element cannot be low; on one aspect of the invention, the storage seats are matched with the connecting columns and the suckers, and the storage seats are arranged in three rows and four columns, so that a plurality of semiconductor elements can be cut and processed at the same time, and the processing efficiency of the semiconductor elements is effectively improved; the semiconductor elements are adsorbed on the containing seats through the suckers, the semiconductor elements on the containing seats are cut through the laser columns by the laser generated by the laser seats, and the semiconductor elements in the same row can be cut simultaneously by the laser, so that the problem of low cutting efficiency of the semiconductor elements in the existing scheme is solved;
(2) the problem of low processing efficiency of the semiconductor element caused by the fact that the position of the semiconductor element cannot be adjusted during processing is solved; on the other hand, the cutting position of the semiconductor element can be conveniently adjusted by matching the arranged supporting seat and the rotary seat, so that the semiconductor elements in different directions can be cut, and the efficiency of processing and forming the semiconductor elements can be effectively improved; through being the horizontal direction with the supporting seat and putting through swivel mount and workstation, after the semiconductor component cutting that the horizontal direction was put was accomplished, be vertical direction with the supporting seat through swivel mount and workstation and put, rotate through the meshing between first ring gear and the second ring gear, the fixed column is at the fixed slot internal rotation, utilize laser to cut the semiconductor component that vertical direction was put, overcome can not adjust the direction of semiconductor component processing among the current scheme, lead to the fashioned inefficiency problem of semiconductor component processing.
The purpose of the invention can be realized by the following technical scheme:
a molding device for processing a semiconductor element comprises a workbench and a supporting seat, wherein the supporting seat is positioned at the upper end of the workbench, a swivel base is connected between the workbench and the supporting seat, a plurality of accommodating seats are installed inside the supporting seat, a rotary column is installed at the lower end of the supporting seat, a second toothed ring is installed at the position, close to the lower part, of the outer surface of the rotary column, a concave block is arranged at the position, close to the lower part, inside the rotary column, a fixed column is installed at the lower end of the concave block, and a baffle is arranged at the position, close to one side, of the upper end;
the utility model discloses a swivel mount, including swivel mount, fixed slot, swivel mount's lower extreme is connected with the go-between, first ring gear is installed to the position that the internal surface of swivel mount is close to the top, the lug is installed to the position that the inside of swivel mount is close to the bottom, the inside of lug is provided with the fixed slot, the swivel mount's lower extreme.
Further, the both sides of workstation are connected with the mount, the internal surface of mount has first traveller, the surface sliding connection of first traveller has first fixing base, the drive seat is installed to the upper end of first fixing base, the lower extreme of first fixing base is connected with the second traveller, the surface of second traveller is close to the position of below and installs the second fixing base.
Furthermore, a plurality of suckers are arranged at the upper ends of the containing seats, isolation grooves are formed in the supporting seats, and the isolation grooves are located between the containing seats.
Furthermore, a plurality of the containing seats are arranged in three rows and four columns, and connecting columns are connected between the containing seats and the inner surfaces of the supporting seats.
Furthermore, the upper end of second fixing base is provided with the laser seat, the laser post is installed to the lower extreme of second fixing base, the laser post is located the supporting seat directly over.
Furthermore, the supporting seat rotates on the workbench by taking the rotary seat as a circle center, the first gear ring and the second gear ring are connected in a meshed mode, and the fixing column is connected with the fixing groove in a rotating mode.
Furthermore, the driving seat slides left and right on the fixed frame through the first sliding column, and the laser column slides up and down on the first fixed seat through the second sliding column.
Further, the using method comprises the following specific steps:
the method comprises the following steps: placing the supporting seat and the workbench in a horizontal direction through the rotary seat, adsorbing the semiconductor elements on the containing seats through the suckers, and starting the driving seats after the semiconductor elements are adsorbed on the containing seats;
step two: the laser column is moved downwards to the position above the semiconductor element to be cut by utilizing the second sliding column, the laser seat is started, and the semiconductor element on the accommodating seat is cut by the laser generated by the laser seat through the laser column;
step three: the first fixed seat is moved left and right by the first sliding column, so that the semiconductor elements arranged in the horizontal direction are cut by laser in sequence;
step four: after the semiconductor component cutting that the horizontal direction was put was accomplished, it puts to be vertical direction with the supporting seat through swivel mount and workstation, and through the meshing rotation between first ring gear and the second ring gear, the fixed column is at the fixed slot internal rotation, utilizes laser to cut the semiconductor component that vertical direction was put.
The invention has the beneficial effects that:
(1) on one aspect of the invention, the storage seats are matched with the connecting columns and the suckers, and the storage seats are arranged in three rows and four columns, so that a plurality of semiconductor elements can be cut and processed at the same time, and the processing efficiency of the semiconductor elements is effectively improved; the semiconductor elements are adsorbed on the containing seats through the suckers, the semiconductor elements on the containing seats are cut through the laser columns by the laser generated by the laser seats, and the semiconductor elements in the same row can be cut simultaneously by the laser, so that the problem of low cutting efficiency of the semiconductor elements in the existing scheme is solved;
(2) on the other hand, the cutting position of the semiconductor element can be conveniently adjusted by matching the arranged supporting seat and the rotary seat, so that the semiconductor elements in different directions can be cut, and the efficiency of processing and forming the semiconductor elements can be effectively improved; through being the horizontal direction with the supporting seat and putting through swivel mount and workstation, after the semiconductor component cutting that the horizontal direction was put was accomplished, be vertical direction with the supporting seat through swivel mount and workstation and put, rotate through the meshing between first ring gear and the second ring gear, the fixed column is at the fixed slot internal rotation, utilize laser to cut the semiconductor component that vertical direction was put, overcome can not adjust the direction of semiconductor component processing among the current scheme, lead to the fashioned inefficiency problem of semiconductor component processing.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a molding apparatus for semiconductor device fabrication according to the present invention;
FIG. 2 is a schematic view showing a connection structure of a swivel base and a coupling ring according to the present invention;
FIG. 3 is a schematic sectional view of the connection between the support base and the rotary column according to the present invention;
fig. 4 is a schematic top view of the supporting base of the present invention.
In the figure: 1. a work table; 2. a fixed mount; 3. a first traveler; 4. a first fixed seat; 5. a driving seat; 6. a second strut; 7. a second fixed seat; 8. a laser seat; 9. a laser column; 10. a supporting seat; 11. rotating; 12. a first ring gear; 13. a bump; 14. a connecting ring; 15. fixing grooves; 16. a storage seat; 17. connecting columns; 18. a baffle plate; 19. turning the column; 20. a second ring gear; 21. fixing a column; 22. a suction cup; 23. and (4) isolating the groove.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-4, a molding apparatus for processing a semiconductor device comprises a worktable 1 and a supporting seat 10, wherein the supporting seat 10 is located at the upper end of the worktable 1, a rotary seat 11 is connected between the worktable 1 and the supporting seat 10, a plurality of receiving seats 16 are installed inside the supporting seat 10, a rotary column 19 is installed at the lower end of the supporting seat 10, a second toothed ring 20 is installed at a position, close to the lower part, on the outer surface of the rotary column 19, a concave block is arranged at a position, close to the lower part, inside the rotary column 19, a fixed column 21 is installed at the lower end of the concave block, and a baffle 18 is arranged at a position, close to one side, at the;
The utility model discloses a slide column, including workstation 1, mount 2, internal surface connection of mount 2 has first traveller 3, the surface sliding connection of first traveller 3 has first fixing base 4, drive seat 5 is installed to the upper end of first fixing base 4, the lower extreme of first fixing base 4 is connected with second traveller 6, second fixing base 7 is installed to the surface of second traveller 6 near the position of below.
The upper end of the containing seats 16 is provided with a plurality of suckers 22, the inside of the supporting seat 10 is provided with an isolation groove 23, and the isolation groove 23 is positioned between the containing seats 16.
The plurality of the containing seats 16 are arranged in three rows and four columns, and the connecting columns 17 are connected between the containing seats 16 and the inner surface of the supporting seat 10, so that a plurality of semiconductor elements can be cut simultaneously, and the processing efficiency of the semiconductor elements is effectively improved.
The upper end of second fixing base 7 is provided with laser seat 8, laser post 9 is installed to the lower extreme of second fixing base 7, laser post 9 is located the supporting seat 10 directly over.
The supporting seat 10 rotates on the workbench 1 by taking the rotary seat 11 as a circle center, the first gear ring 12 is meshed with the second gear ring 20, and the fixing column 21 is connected with the fixing groove 15 in a rotating mode, so that the cutting position of the semiconductor element can be conveniently adjusted, the semiconductor element in different directions can be cut, and the efficiency of processing and forming the semiconductor element can be effectively improved.
The driving seat 5 slides left and right on the fixed frame 2 through the first sliding column 3, and the laser column 9 slides up and down on the first fixed seat 4 through the second sliding column 6.
The using method comprises the following specific steps:
the method comprises the following steps: placing the support base 10 and the workbench 1 in a horizontal direction through the rotary base 11, adsorbing the semiconductor elements on the containing bases 16 through the suckers 22, and starting the driving bases 5 after the semiconductor elements are adsorbed on the containing bases 16;
step two: the laser column 9 is moved downwards to the position above the semiconductor element to be cut by utilizing the second sliding column 6, the laser seat 8 is started, and the semiconductor element on the accommodating seat 16 is cut by the laser generated by the laser seat 8 through the laser column 9;
step three: the first fixed seat 4 is moved left and right by the first sliding column 3, so that the semiconductor elements arranged in the horizontal direction are cut by laser in sequence;
step four: after the semiconductor element placed in the horizontal direction is cut, the supporting seat 10 is placed in the vertical direction with the workbench 1 through the rotary seat 11, the fixing column 21 rotates in the fixing groove 15 through the meshing rotation between the first toothed ring 12 and the second toothed ring 20, and the semiconductor element placed in the vertical direction is cut by laser.
The working principle of the invention is as follows: the supporting seat 10 is horizontally arranged with the workbench 1 through the rotary seat 11, the semiconductor elements are adsorbed on the containing seats 16 through the suckers 22, after the semiconductor elements are adsorbed on the containing seats 16, the driving seat 5 is started, and the driving cylinder is arranged in the driving seat 5 to provide driving force; the dry containing seats 16 are arranged in three rows and four columns, so that a plurality of semiconductor elements can be cut simultaneously, and the processing efficiency of the semiconductor elements is effectively improved;
the laser column 9 is moved downwards to the position above the semiconductor element to be cut by the second sliding column 6, the laser seat 8 is started, laser generated by the laser seat 8 cuts the semiconductor element on the accommodating seat 16 through the laser column 9, wherein a laser is arranged in the laser seat 8, and the laser is generated through the laser to cut the semiconductor element;
the first fixed seat 4 is moved left and right by the first sliding column 3, so that the semiconductor elements placed in the horizontal direction are cut in sequence by laser, and the cutting efficiency of the semiconductor elements can be effectively improved;
after the semiconductor elements placed in the horizontal direction are cut, the supporting seat 10 is placed in the vertical direction with the workbench 1 through the rotary seat 11, the fixing column 21 rotates in the fixing groove 15 through the meshing rotation between the first toothed ring 12 and the second toothed ring 20, and the semiconductor elements placed in the vertical direction are cut by using laser, so that the cutting position of the semiconductor elements can be conveniently adjusted, the semiconductor elements in different directions can be cut, and the efficiency of processing and forming the semiconductor elements can be effectively improved;
compared with the prior art, on one hand, the storage seats 16 are arranged in three rows and four columns by matching the storage seats 16, the connecting columns 17 and the suckers 22, so that a plurality of semiconductor elements can be cut and processed at the same time, and the processing efficiency of the semiconductor elements is effectively improved; by adsorbing the semiconductor element on the containing seat 16 through the sucking disc 22, the semiconductor element on the containing seat 16 is cut by the laser generated by the laser seat 8 through the laser column 9, and the semiconductor elements in the same row can be simultaneously cut by the laser, so that the problem of low cutting efficiency of the semiconductor element in the prior art is solved;
on the other hand, the cutting position of the semiconductor element can be conveniently adjusted by matching the arranged supporting seat 10 and the rotary seat 11, so that the semiconductor elements in different directions can be cut, and the processing and forming efficiency of the semiconductor element can be effectively improved; through being the horizontal direction with supporting seat 10 through swivel mount 11 and workstation 1 and putting, after the semiconductor element cutting that the horizontal direction was put was accomplished, it puts to be vertical direction with supporting seat 10 through swivel mount 11 and workstation 1, rotate through the meshing between first ring gear and the 12 second ring gear 20, fixed column 21 is at fixed slot 15 internal rotation, utilize laser to cut the semiconductor element that vertical direction was put, the orientation that can not adjust semiconductor element processing in having overcome current scheme, lead to the fashioned inefficiency problem of semiconductor element processing.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. The forming equipment for processing the semiconductor element is characterized by comprising a workbench (1) and a supporting seat (10), wherein the supporting seat (10) is positioned at the upper end of the workbench (1), a rotary seat (11) is connected between the workbench (1) and the supporting seat (10), a plurality of accommodating seats (16) are installed inside the supporting seat (10), a rotary column (19) is installed at the lower end of the supporting seat (10), a second toothed ring (20) is installed at the position, close to the lower part, of the outer surface of the rotary column (19), a concave block is arranged at the position, close to the lower part, inside the rotary column (19), a fixed column (21) is installed at the lower end of the concave block, and a baffle (18) is arranged at the position, close to one side, of the upper end of the supporting seat;
first ring gear (12) are installed to the position that the internal surface of swivel mount (11) is close to the top, lug (13) are installed to the position that the inside of swivel mount (11) is close to the bottom, the inside of lug (13) is provided with fixed slot (15), the lower extreme of swivel mount (11) is connected with go-between (14).
2. The forming equipment for processing the semiconductor element according to claim 1, wherein two sides of the workbench (1) are connected with fixing frames (2), the inner surface of each fixing frame (2) is connected with a first sliding column (3), the outer surface of each first sliding column (3) is connected with a first fixing seat (4) in a sliding mode, the upper end of each first fixing seat (4) is provided with a driving seat (5), the lower end of each first fixing seat (4) is connected with a second sliding column (6), and the outer surface of each second sliding column (6) is provided with a second fixing seat (7) at a position close to the lower side.
3. The molding apparatus for processing semiconductor devices as claimed in claim 1, wherein the upper end of the receiving seat (16) is provided with a plurality of suction cups (22), the supporting seat (10) is provided with an isolation groove (23), and the isolation groove (23) is located between the plurality of receiving seats (16).
4. The molding apparatus for semiconductor device fabrication as claimed in claim 1, wherein the plurality of the receiving seats (16) are arranged in three rows and four columns, and the connecting column (17) is connected between the plurality of the receiving seats (16) and the inner surface of the supporting base (10).
5. The forming equipment for processing the semiconductor element as claimed in claim 2, wherein the upper end of the second fixed seat (7) is provided with a laser seat (8), the lower end of the second fixed seat (7) is provided with a laser column (9), and the laser column (9) is positioned right above the supporting seat (10).
6. The molding apparatus for processing semiconductor elements as claimed in claim 1, wherein the supporting base (10) is rotatable on the table (1) about a rotation base (11), the first toothed ring (12) and the second toothed ring (20) are engaged, and the fixing posts (21) are rotatably connected to the fixing grooves (15).
7. The molding apparatus for processing semiconductor elements as claimed in claim 5, wherein the driving base (5) is slid left and right on the fixing frame (2) by the first sliding column (3), and the laser beam (9) is slid up and down on the first fixing base (4) by the second sliding column (6).
8. The use method of the molding equipment for processing the semiconductor element is characterized by comprising the following specific steps:
the method comprises the following steps: placing the supporting seat (10) and the workbench (1) in a horizontal direction through the rotary seat (11), adsorbing semiconductor elements on the containing seats (16) through the suckers (22), and starting the driving seats (5) after the semiconductor elements are adsorbed on the containing seats (16);
step two: the laser column (9) is moved downwards to the position above the semiconductor element to be cut by utilizing the second sliding column (6), the laser seat (8) is started, and laser generated by the laser seat (8) cuts the semiconductor element on the accommodating seat (16) through the laser column (9);
step three: the first fixed seat (4) is moved left and right by the first sliding column (3), so that the semiconductor elements placed in the horizontal direction are cut by laser in sequence;
step four: after the semiconductor elements placed in the horizontal direction are cut, the supporting seat (10) is placed in the vertical direction with the workbench (1) through the rotary seat (11), the fixing column (21) rotates in the fixing groove (15) through the meshing rotation between the first toothed ring (12) and the second toothed ring (20), and the semiconductor elements placed in the vertical direction are cut through laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010599274.2A CN111604604A (en) | 2020-06-28 | 2020-06-28 | Forming equipment for processing semiconductor element and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010599274.2A CN111604604A (en) | 2020-06-28 | 2020-06-28 | Forming equipment for processing semiconductor element and using method thereof |
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| CN111604604A true CN111604604A (en) | 2020-09-01 |
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| CN202010599274.2A Pending CN111604604A (en) | 2020-06-28 | 2020-06-28 | Forming equipment for processing semiconductor element and using method thereof |
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