CN111601454B - Single-sided cross-line conductive circuit film and manufacturing method thereof - Google Patents

Abstract

The invention relates to a single-sided cross-line type conducting circuit film and a manufacturing method thereof, wherein the circuit film comprises an insulating film, a first conductive printing layer, a second conductive printing layer and an isolation pattern layer between the two conductive printing layers; the first conductive printing layer comprises a plurality of groups of first sensing electrodes and second sensing electrodes which are arranged in pairs, and the second sensing electrodes continuously surround the corresponding first sensing electrodes. The bridging wiring of the second conductive printed layer spans the second sensing electrode and is electrically connected with the first sensing electrode and the connecting circuit along the length direction of the isolation pattern layer. The invention has the effects that the two sensing electrodes can be electrically connected without through holes and double-sided printing, and the surface of the first sensing electrode is complete and has no exposed holes.

Description

Single-sided overline type conductive circuit film and manufacturing method thereof

Technical Field

The invention relates to the technical field of double-sided conduction of circuits, in particular to a single-sided overline type conduction circuit film and a manufacturing method thereof.

Background

In the early technology of Printed Circuit Boards (PCBs) and flexible circuit boards (FPCs), since the layout of the circuit is staggered, a printed circuit needs to be formed on the upper and lower surfaces of a carrier board or a carrier film to achieve double-sided conduction, and the common double-sided conduction is to attach a copper layer on the surface of a substrate, and then to form Plated Through Holes (PTHs) by electroplating after punching. The through-hole morphology of the plated through holes prior to plating is conducive to double-sided flow of etching solution for etching lines in a wet process. However, with the development of microminiaturization of devices and the change of manufacturing processes, the circuit film has a thinner structure than the flexible circuit board, and the biggest difference between the circuit film and the flexible circuit board is that the circuit film does not use copper foil, an adhesive layer does not exist between a circuit and a base material, an etching process is not used in manufacturing, and the thickness of the whole product of the circuit film is more biased to be a film rather than a plate shape, so that the flexible circuit board has better bending property. However, in the process of manufacturing the circuit film, the circuit structure is directly printed by using metal paste such as silver paste, and the design of the through holes with double-sided conduction will cause paste overflow pollution during printing, which is easy to cause the problems of inaccurate circuit pattern and short circuit of the circuit.

In some special circuit designs, the peripheral electrode needs to be designed in a ring shape around the other central electrode. On single-sided printing, the ring electrode is divided into multiple regions and gaps are formed between the regions, and a line connecting the center electrode is formed at the gaps so as to pass through the ring electrode. For example, in a circuit structure without a central electrode in a ring part area, patent publication No. CN208520504U discloses a film pressure sensor for sensing stress balance, the film pressure sensor includes a ring part and a strip tail extending from the outer side of the ring part, the center of the ring part has a through hole, the conductive circuit layer includes a plurality of sensing areas and output leads led out from the sensing areas, the pressure sensing material layer includes a plurality of resistors corresponding to the sensing areas one by one, and the sensing areas are uniformly arranged at intervals along the circumferential direction and are integrally distributed in a ring shape around the through hole.

The invention patent publication No. CN105389048A discloses a printed circuit board of a gesture recognition device and electronic equipment, wherein the printed circuit board is used for the gesture recognition device, and the printed circuit board is provided with a positioning hole; the first metal induction areas are positioned on the first surface of the printed circuit board, the wiring shapes are irregular, and the wiring shapes are adjacent to each other; each first metal sensing area comprises a second metal sensing area and a first metal sensing disk corresponding to the mechanical key. A metal induction disk which is divided into a plurality of areas and is arranged in the center of the circle and a metal induction disk which is arranged at the periphery are arranged in the second metal induction area; however, this patent does not disclose a wire connection of the metal inductive disk. In general, a printed circuit board is electrically connected to signals or signals by plated through holes. In terms of industry trends, printed circuit boards are much thicker than circuit films and less flexible, and are generally not prone to select a printed circuit board as a sensing interface with electrodes in lightweight and thin electronic devices.

The invention patent publication No. CN110319971A discloses a bipolar capacitance type vacuum gauge and a measuring circuit corresponding to the same, wherein the bipolar capacitance type vacuum gauge comprises a shell, a diaphragm, a fixed substrate and a fixed electrode, the fixed substrate is fixedly arranged in a vacuum cavity, the fixed electrode is arranged on the fixed substrate, when the diaphragm is stressed to deform, the capacitance on the fixed electrode changes, and the pressure in a detection cavity can be obtained by detecting the capacitance change; the fixed electrode comprises an annular electrode and a circular electrode, and the circular electrode is positioned in the annular electrode. The patent publication does not specifically disclose that the fixed substrate is a circuit board of that kind, and does not specifically disclose a wiring structure connecting the ring electrode and the circular electrode.

Disclosure of Invention

The invention provides a single-sided line-crossing type conductive circuit film, which mainly improves the circuit film product to realize the line connection design of annular electrodes continuously surrounding a central electrode in a single-sided printing mode and can solve the notch defect of surrounding type induction electrodes under the design of no through hole.

The invention provides a manufacturing method of a single-sided cross-line type conduction circuit film, which is used for realizing the technical effect of single-sided printing of the circuit film and cross-bridge type conduction without exposed holes.

The main purpose of the invention is realized by the following technical scheme:

the utility model provides a single face is line-crossing to switch on circuit film, includes:

an insulating film having a front surface and an opposite rear surface;

The first conductive printing layer is formed on the front surface of the insulating film, and comprises a plurality of groups of first sensing electrodes and second sensing electrodes which are arranged in pairs, wherein the second sensing electrodes continuously surround the corresponding first sensing electrodes, and the first conductive printing layer also comprises a first connecting circuit which is not directly connected with the first sensing electrodes and a second connecting circuit which is directly connected with the second sensing electrodes;

The isolation pattern layer covers a line crossing part of the second induction electrode and is positioned on the surface of the film on the side edge of the line crossing part, and the line crossing part is positioned between the first induction electrode and the connection point of the first connection line;

the second conductive printed layer is formed on the isolation pattern layer and extends to the first conductive printed layer, the second conductive printed layer comprises a first bridging wire, and the first bridging wire is electrically connected with the first induction electrode and the first connection circuit along the length direction of the isolation pattern layer.

By adopting the technical scheme, the second induction electrode is isolated from the first bridging wire by the isolation pattern layer, so that the through-hole-free single-sided conduction under the front paste printing of the circuit film is realized, and the first induction electrode has a complete electrode surface without exposed holes.

The present invention in a preferred example may be further configured to: the first conductive printed layer includes a short circuit directly connected to the first sensing electrode, the first sensing electrode being electrically connected to the first crossover wire via the short circuit.

By adopting the above preferable technical characteristics, the short circuit of the first conductive printing layer is used as an extension circuit which is directly connected with the first induction electrode on the front surface of the film and used for shortening the length of the bridging wiring on the front surface of the film.

The present invention in a preferred example may be further configured to: the isolation graphic layer also comprises a line part which is covered on part of the second connecting line; the second conductive printing layer comprises a second bridging wiring, and the second bridging wiring is electrically connected with two adjacent first induction electrodes along the line part of the isolation pattern layer; the first bridging wires, the second bridging wires and the first sensing electrodes are all connected in series with the first connecting wires, and the first sensing electrodes are equipotential reference electrodes.

By adopting the above preferable technical characteristics, the line part of the isolation pattern layer and the second bridging wiring of the second conductive printed layer are utilized, the second bridging wiring is arranged on the line part and passes over the second sensing electrode and the second connecting wiring on the front surface of the film, so that the connecting wiring of the first sensing electrode and the second sensing electrode is not mutually connected in series, and all the first sensing electrodes are connected in series with the segmented first connecting wiring by utilizing the first bridging wiring and the second bridging wiring, more connecting wirings are arranged in the limited film surface area, the first sensing electrode is an equipotential reference electrode, the bridging wiring part is a multi-section separated segment wiring, and a serial circuit is formed by the first sensing electrode and the first connecting wiring on the same surface. Thus, all the lines of the circuit film may be located on the front surface of the insulating film.

The present invention in a preferred example may be further configured to: the insulation film is provided with a first connection terminal electrically connected with the first connection circuit and a second connection terminal electrically connected with the second connection circuit, and the first connection terminal and the second connection terminal are arranged in the same surface bus interface area of the insulation film.

By adopting the above preferable technical characteristics, two connection terminals which are connected by two connection lines connected by two sensing electrodes are arranged on the same surface bus line interface area of the insulating film, so that the same surface collection of the areas of the connection terminals is achieved, and external connection is facilitated.

The present invention in a preferred example may be further configured to: the insulation film is provided with a slotted shape at two sides of the flat cable interface area, so that the surface flat cable interface area is strip-shaped; preferably, the grooves on two sides are bent and expanded in a direction away from each other to form a test area, and a plurality of test terminals are arranged in the test area to electrically connect the corresponding first connection terminals and the second connection terminals.

By adopting the preferable technical characteristics, the insulation film is formed with a strip-shaped bendable integrated flat cable design by utilizing the grooved shapes at the two sides of the flat cable interface area, so that a section of welding point for connecting the flat cable and the flat cable is omitted. Preferably, the test area is formed by bending and expanding slots on two sides in the direction away from each other, the test terminals respectively connected with the two sensing electrodes are arranged in the test area for testing the thin film circuit, the test terminals are configured by expanding and bending the test area, and the distance between the test terminals can be larger than the distance between the connection terminals before the test terminals are connected with the flat cable which is in a fan-in convergence state, so that the probe press contact of the tester is facilitated.

The present invention in a preferred example may be further configured to: the first sensing electrode has a circular pad shape, the second sensing electrode has a continuous annular pad shape, and the second sensing electrode surrounds the first sensing electrode by taking the circle center of the first sensing electrode which corresponds to each sensing electrode as a ring center point.

By adopting the preferable technical characteristics, the first sensing electrode of the circular pad and the second sensing electrode of the annular pad are utilized, the second sensing electrode surrounds the first sensing electrode, and the object approaches or uses the external electrode to enable the two sensing electrodes to contact to generate capacitance or resistance change between the first sensing electrode and the second sensing electrode, so that a sensing interface of a gesture, electromotive force or short-distance non-touch mode or touch mode can be formed, and the sensing interface can be used as a next-generation non-touch/touch type power-saving passive sensing panel.

The present invention in a preferred example may be further configured to: a fixed gap is formed between the first sensing electrode and the corresponding second sensing electrode, and the first sensing electrode and the second sensing electrode which are arranged in pairs are arranged in the insulating film in a staggered matrix mode; preferably, the insulating film forms an opening between a pair-wise matrix adjacent dot and a pair-wise dislocation dot in the first sensing electrode and the second sensing electrode arranged in pairs.

By adopting the above preferable technical characteristics, the specific configuration relationship and the arrangement relationship between the first sensing electrode and the second sensing electrode are utilized to maintain the same sensing effect between the two sensing electrodes and have better sensing distribution in the sensing area. Preferably, openings are formed between pairs of adjacent dots and pairs of staggered dots, and a venting region can be formed within the device cell sensing region to reduce the adverse effect of airflow on short-range sensing.

The present invention in a preferred example may be further configured to: the single-sided line-crossing type conducting circuit film further comprises a front surface coating film formed on the insulating film and the first conductive printing layer, wherein the front surface coating film covers the first connecting circuit and the second connecting circuit, and is provided with an induction coil opening for exposing the first induction electrode and the second induction electrode which are configured in pairs.

By adopting the preferable technical characteristics, the front surface coating film and the formation form thereof are utilized to protect the conductive circuit printed on the front surface. And the induction efficiency of the first induction electrode and the second induction electrode which are arranged in a group is not affected by the opening of the induction coil with the front surface covered by the film.

The present invention in a preferred example may be further configured to: the front surface covering film is provided with a covering strip protruding into the opening of the induction coil, and the covering strip completely covers the first bridging line and the part of the isolation pattern layer in the opening of the induction coil.

By adopting the preferable technical characteristics, the covering strip with the front surface covering film protruding inwards can be utilized to prevent the circuit of the first bridging line from being exposed and strengthen the fixation of the isolation pattern layer on the film.

The main purpose of the invention is realized by the following technical scheme:

a method for manufacturing a single-sided overline type conductive circuit film is provided, which is used for manufacturing the single-sided overline type conductive circuit film according to any one of the technical schemes, and the manufacturing method comprises the following steps:

Providing the insulating film;

printing the front surface of the first conductive paste to form a first conductive printing layer;

printing an isolation pattern layer on the insulating film and the first conductive printing layer;

printing the front surface of the second conductive paste to form a second conductive printing layer;

Preferably, the first sensing electrode of the first conductive printed layer has a shape of complete non-porous exposure; preferably, the manufacturing method further includes: and printing a front surface coating film on the insulating film and the first conductive printing layer.

Through adopting above-mentioned technical scheme, utilizing with the many times printing of surface, the second conductive printing layer is formed with the cross-over connection and walks the line, reaches single-sided printing's cross-bridge type no through-hole and switches on, does not need the plated through hole process, and first sensing electrode in the film front has complete pore-free exposed shape, and the second sensing electrode has the complete continuous ring shape of surrounding first sensing electrode to reach the positive plane of film and 360 degrees unanimity sensing potential.

In summary, the present invention includes at least one of the following technical effects contributing to the prior art:

1. The circuit film can be printed on one side of the conductive paste for multiple times to achieve the bridge-type circuit connection of two specific induction electrodes, so that the pollution of a plating through hole process or the problem of reverse diffusion pollution caused by double-sided paste through a film through hole can be prevented;

2. The circuit for connecting the two specific induction electrodes can be formed on the front surface of the insulating film, the turnover printing is not needed, and the back surface film can be saved in a finished product structure;

3. the first sensing electrode has a complete appearance without a hole, the second sensing electrode has a continuous ring shape surrounding the first sensing electrode, the sensing efficiency can be controlled, and the touch screen is particularly suitable for interface boards of non-contact gesture sensing control panels and touch control interface boards of light and thin electronic products.

Drawings

FIG. 1 is a schematic front view of a single-sided, cross-line conductive circuit film according to some embodiments of the present invention;

FIG. 2 is an enlarged view of the area A of FIG. 1;

FIG. 3 is a schematic view of the region A of FIG. 1 in partial cutaway;

FIG. 4 is a schematic cross-sectional view of a single-sided, cross-line conductive circuit film at a first sensing electrode and a second sensing electrode configured in pairs, according to some embodiments of the present invention;

FIG. 5 is a process flow diagram of a method for manufacturing a single-sided cross-over conductive circuit film according to other embodiments of the present invention;

FIG. 6 is a schematic diagram showing the relationship between the devices in the step of providing the insulating film in the manufacturing method according to other embodiments of the present invention;

FIG. 7 is a schematic diagram showing the relationship between the components in the first printing step of the conductive paste in the manufacturing method according to other embodiments of the present invention;

FIG. 8 is a schematic diagram showing the relationship between devices in the step of forming the isolation pattern layer in the manufacturing method according to other embodiments of the present invention;

Fig. 9 is a schematic diagram showing a relationship between elements in a second conductive paste printing step in a manufacturing method according to another embodiment of the invention.

Reference numerals: 10. An insulating film; 11. slotting; 12. Opening holes; 20. A first conductive printed layer; 21. A first sensing electrode; 22. A second sensing electrode; 23. A first connection line; 24. A second connection line; 25. A short circuit; 30. An isolation pattern layer; 31. Line parts; 40. A second conductive printed layer; 41. A first jumper wire; 42. A second jumper wire; 51. A first connection terminal; 52. A second connection endpoint; 60. Coating a film on the front surface; 61. an induction coil opening; 62. a cover strip; 70. and testing the end points.

Detailed Description

The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only examples for understanding a part of the inventive concept of the present invention, and are not representative of all embodiments, nor are they to be construed as the only embodiments. All other embodiments, based on the embodiments of the present invention, which are obtained by those of ordinary skill in the art under the understanding of the inventive concept of the present invention, are within the scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indications are correspondingly changed. In order to facilitate understanding of the technical scheme of the present invention, the single-sided line-crossing type conductive circuit film and the manufacturing method thereof are described and explained in further detail below, but are not intended to limit the scope of the present invention.

The drawings show, to the extent possible, specific features common to multiple embodiments, with differences or differences between the embodiments being otherwise described in a literal or otherwise presented in contrast to the drawings. Thus, based on the industrial characteristics and technical essence, those skilled in the art should correctly and reasonably understand and determine whether individual features or any combination of several features described below can be characterized in the same embodiment or whether features mutually exclusive in technical essence can be characterized only in different variant embodiments.

In order to facilitate understanding of the technical solution of the present application, some terms appearing multiple times in the embodiments are explained. The "paste printing" is screen printing or stencil printing with a paste of metal particles, in which there is usually a high proportion of conductive particles and a binder, usually silver paste, which are sufficiently baked to achieve electrical connection, or a conductive paste in which other conductive particles are mixed. The "sensing electrode" is an electrode point that can sense by a gesture, electromotive force, or other means, and is usually non-contact, but may also be contact.

FIG. 1 is a schematic front view of a single-sided, cross-line conductive circuit film according to some embodiments of the present invention; FIG. 2 is a schematic diagram showing the circuit film in a region A of FIG. 1; FIG. 3 is a schematic view of the region A of FIG. 1 in partial cutaway; FIG. 4 is a schematic diagram showing the circuit film in a pair of first and second sensing electrodes. Referring to fig. 1 to 3, a single-sided overline conductive circuit film according to some embodiments of the present invention includes:

the utility model provides a single face is line-crossing to switch on circuit film, includes:

the insulating film 10 is usually made of PET, and is usually transparent in color, or white or black; the thickness of the insulating film 10 is usually 0.038 to 0.05mm or can be thinner depending on the capability of the film process;

A first conductive printed layer 20 formed on the front surface of the insulating film 10, the first conductive printed layer 20 including a plurality of sets of first sensing electrodes 21 and second sensing electrodes 22 arranged in pairs, the second sensing electrodes 22 continuously surrounding the corresponding first sensing electrodes 21, the first conductive printed layer 20 further including a first connection line 23 not directly connected to the first sensing electrodes 21 and a second connection line 24 directly connected to the second sensing electrodes 22; the circuit and the induction electrode can be formed on the same conductive printing layer;

An isolation pattern layer 30 covering a crossover portion of the second sensing electrode 22 and located on a surface of the film on a side of the crossover portion, the crossover portion being located between the connection points of the first sensing electrode 21 and the first connection line 23; the shape of the isolation pattern layer 30 includes a plurality of strips, as shown in fig. 8, to occupy a small coverage area of the insulating film 10; the isolation pattern layer 30 is preferably formed by printing with an insulating paste to fill the side edges of the crossover portion of the second sensing electrode 22 (as shown in fig. 3);

A second conductive printing layer 40 formed on the isolation pattern layer 30 and extending onto the first conductive printing layer 20; the respective thicknesses of the first conductive printed layer 20 and the second conductive printed layer 40 may be specifically between 6 and 8 μm; the printing paste of the first conductive printing layer 20 and the second conductive printing layer 40 may be silver paste.

The implementation principle of the embodiment is as follows: the isolation pattern layer 30 is used to isolate the second sensing electrode 22 from the first bridging wire 41, so that the single-sided conduction without through holes under the front paste printing of the circuit film is realized, and the first sensing electrode 21 has a complete electrode surface without exposed holes.

In use, when the first connection terminal 51 electrically connected to the first sensing electrode 21 is a ground connection or a low level connection, a potential difference is generated between the first sensing electrode 21 and the second sensing electrode 22, and a current change is detected by the second connection terminal 52 electrically connected to the second sensing electrode 22. When the first connection terminal 51 electrically connected to the first sensing electrode 21 is a high level connection, the first sensing electrode 21 is in contact with the second sensing electrode 22 as an input terminal, and the second connection terminal 52 electrically connected to the second sensing electrode 22 can measure the current to generate; or the change of capacitance or resistance between the first sensing electrode 21 and the second sensing electrode 22 in the same sensing coil can be measured by external gesture or potential change by utilizing electromagnetic effect.

Referring to fig. 2 to 4, in a preferred example, the first conductive printed layer 20 includes a short line 25 directly connected to the first sensing electrode 21, and the first sensing electrode 21 is electrically connected to the first bridging line 41 via the short line 25. Therefore, the short circuit 25 of the first conductive printed layer 20 is used as an extension circuit directly connected to the first sensing electrode 21 on the front surface of the film, so as to shorten the length of the first bridging line 41 on the back surface of the film, and the first bridging line 41 penetrating through the first sensing electrode 21 is not provided on the back surface of the film, so as to shorten the length of the bridging line on the front surface of the film, or avoid the first sensing electrode 21 from being covered. In addition, in the circuit design of the first conductive printed layer 20, the second connection circuit 24 is mainly used, and specifically, a circuit dense region can be formed at a part of the insulating film 10; a segmented first connection 23 can be provided in the line evacuation area of the second connection 24. The specific form of the first conductive printed layer 20 can be seen in fig. 7.

Referring to fig. 1 (see fig. 8 in conjunction) for a specific description of the isolation pattern layer 30 and the second conductive printed layer 40, in a preferred example, the isolation pattern layer 30 includes a line portion 31 covering a portion of the second connection line 24; the second conductive printed layer 40 includes a second bridging wire 42, and the second bridging wire 42 is electrically connected to two adjacent first sensing electrodes 21 along the line portion 31 of the isolation pattern layer 30; the first bridging wires 41, the second bridging wires 42 and the first connecting wires 23 are connected in series with all the first sensing electrodes 21, and the first sensing electrodes 21 are equipotential reference electrodes. The second bridging trace 42 is arranged on the line portion 31 by using the line portion 31 of the isolation pattern layer 30 and the second bridging trace 42 of the second conductive printed layer 40, and passes over the second sensing electrode 22 and the second connecting trace 24 on the front surface of the film, so that the connecting traces of the first sensing electrode 21 and the second sensing electrode 22 are not connected in series with each other, and all the first sensing electrodes are connected in series with the segmented first connecting trace 23 by using the first bridging trace 41 and the second bridging trace 42, more connecting traces are arranged in a limited film surface area, the first sensing electrode 21 is an equipotential reference electrode, and the bridging traces 41 and 42 are partially segmented traces separated in multiple segments to form a serial trace with the first connecting trace 23 on the same surface, so that no back surface trace is needed. Thus, all the lines of the circuit film may be located on the front surface of the insulating film.

Regarding the thickness relationship of the second conductive printed layer 40 and the first conductive printed layer 20, in a preferred example, the printed thickness of the second conductive printed layer 40 may be the same as or greater than the printed thickness of the first conductive printed layer 20.

For a specific description of the external connection mode of the circuit film, referring to fig. 1, in a preferred example, the insulating film 10 is provided with a first connection terminal 51 electrically connected to the first connection line 23 and a second connection terminal 52 electrically connected to the second connection line 24, and the first connection terminal 51 and the second connection terminal 52 are arranged in a wiring interface area on the same surface of the front surface of the insulating film 10. Therefore, two connection terminals connected by two connection lines connected by two sensing electrodes are arranged on the same surface bus line interface region of the insulating film 10, so that the same region as the surface of the connection terminals is collected, thereby facilitating external connection.

Referring to fig. 1, the insulation film 10 has a shape of a groove 11 on both sides of the bus bar interface area, so that the surface bus bar interface area is elongated. Therefore, the insulation film 10 itself is formed with a strip-shaped flexible integrated flat cable design by utilizing the shape of the slots 11 at both sides of the flat cable interface region, so as to omit a section of welding point for connecting the flat cable and the flat cable.

For a specific description of the test connection of the circuit film, referring to fig. 1, the slots 11 on both sides are bent and enlarged away from each other to form a test area, and a plurality of test terminals 70 are arranged in the test area to electrically connect the corresponding first connection terminals 51 and the second connection terminals 52. Therefore, the test terminals 70 respectively connected with the two sensing electrodes are arranged in the test area for testing the thin film circuit, the test terminals are configured by expanding the bending test area, the test terminals 70 are connected before the fan-in convergent flat cable, and the distance between the test terminals 70 can be larger than the distance between the connecting terminals 51 and 52, so that the probe press contact of the tester is facilitated.

In the specific shape descriptions of the first sensing electrode 21 and the second sensing electrode 22, in a preferred example, the first sensing electrode 21 has a circular pad shape, the second sensing electrode 22 has a continuous annular pad shape, and the second sensing electrode 22 surrounds the first sensing electrode 21 with the center of the circle of the respective corresponding first sensing electrode 21 as the center point of the circle. Therefore, by using the first sensing electrode 21 of the circular pad and the second sensing electrode 22 of the annular pad, the second sensing electrode 22 surrounds the first sensing electrode 21, and the object approaches or uses the external electrode to make the two sensing electrodes contact to generate the capacitance or resistance change between the first sensing electrode 21 and the second sensing electrode 22, the sensing interface of gesture, electromotive force or short-distance non-touch mode or touch mode can be formed, and the sensing interface can be used as the next generation non-touch/touch type power-saving passive sensing panel. The loop width of the second sensing electrode 22 is specifically between 10% and 50% of the diameter of the first sensing electrode 21.

Regarding the combination relationship between the first sensing electrode 21 and the second sensing electrode 22, in a preferred example, a fixed gap is formed between the first sensing electrode 21 and the corresponding second sensing electrode 22, and the first sensing electrode 21 and the second sensing electrode 22 arranged in pairs are arranged in the insulating film 10 in a staggered matrix manner. Therefore, the specific configuration and arrangement between the first sensing electrode 21 and the second sensing electrode 22 are utilized to maintain the same sensing effect between the two sensing electrodes and have better sensing distribution in the sensing area. The fixed gap is specifically smaller than the diameter or length of the first sensing electrode 21 and larger than the width of the second sensing electrode 22.

Regarding the specific shape of the insulating film 10 outside the paired arrangement of the induction electrode regions, in a preferred example, the insulating film 10 forms the openings 12 between the paired matrix adjacent points and the paired misplaced points in the paired arrangement of the first induction electrodes 21 and the second induction electrodes 22. Thus, the openings 12 are formed between the adjacent dots of the pair matrix and the pair offset, and the air-permeable region can be formed in the device cell sensing region (corresponding to the single body shape of the insulating film 10) to reduce the adverse effect of the air flow on the short-distance sensing. In this embodiment, the insulating film 10 is provided with two openings 12, the opening 12 far from the bus line interface area is smaller, which may be a rectangular hole or a square hole, and 3 paired induction electrode rings are disposed on the periphery; the open hole 12 in the middle of the film is larger and can be an irregular hole, and 6 paired induction electrode rings are arranged on the periphery of the film; the circuit film can be provided with 8 induction electrode rings, and can be corresponding to an induction switch of a palm.

With reference to fig. 3, in a preferred example, the single-sided overline conductive circuit film further includes a front cover film 60 formed on the insulating film 10 and the first conductive printed layer 20, the front cover film 60 covers the first connection line 23 and the second connection line 24, and the front cover film 60 has an induction opening 61 for exposing the first induction electrode 21 and the second induction electrode 22 arranged in pairs. The front-side printed conductive traces are protected by the front-side coating 60 and its form. The sensing efficiency of the first sensing electrode 21 and the second sensing electrode 22 arranged in pairs is not affected by the sensing coil opening 61 of the front surface film 60. The "paired arrangement" is specifically to combine one adjacent first sensing electrode 21 and one second sensing electrode 22 in one sensing coil region. The insulating film 10 and the front surface coating film 60 may have an effect of induction isolation; alternatively and/or additionally, an inductive isolation effect for the thin film lines may be obtained with an otherwise assembled shielding cover.

For a specific description of the coil opening 61, referring to fig. 2, in a preferred example, the front cover 60 has a cover strip 62 protruding into the coil opening 61, and the cover strip 62 completely covers the first crossover wire 41 and the portion of the isolation pattern layer 30 in the coil opening 61. The front cover film 60 is used to cover the strips 62 protruding inwards to avoid the wires of the first bridging wires 41 from being exposed and to strengthen the fixation of the isolation pattern layer 30 on the film.

In addition, other embodiments of the present invention disclose a method for manufacturing a single-sided cross-line conductive circuit film, which is used for manufacturing the circuit film according to any of the above technical schemes. FIG. 5 is a block diagram of the manufacturing method; FIG. 6 is a schematic diagram showing the relationship between the devices in the step of providing an insulating film; FIG. 7 is a schematic diagram showing the relationship of the components in the first printing step of the conductive paste; FIG. 8 is a schematic diagram showing the relationship between the devices at the step of forming the isolation pattern layer; fig. 9 is a schematic diagram showing the relationship of the elements in the second conductive paste printing step. Referring to fig. 5 in conjunction with fig. 6 to 9, the manufacturing method includes the following main steps and preferred steps:

Step S1: as shown in fig. 6, an insulating film 10 is provided; wherein, in the mass production process, the shape of the insulating film 10, the grooves 11 and the openings 12 are not formed yet, the units of the plurality of insulating films 10 are defined in a film substrate, and the shape of the insulating film 10, the grooves 11 and the openings 12 are formed after all printing processes are completed;

Step S2: as shown in fig. 7, the first conductive paste is front-printed to form the first conductive printed layer 20;

Step S3: as shown in fig. 8, an isolation pattern layer 30 is printed on the insulating film 10 and the first conductive printed layer 20;

Step S4: as shown in fig. 9, the second conductive paste is front-printed to form the second conductive printed layer 40; in addition, in a preferred step S5, referring to fig. 2 to 4, the insulating film 10 and the first conductive printed layer 20 are printed to form a front surface film 60.

The implementation principle of the embodiment is as follows: the isolation pattern layer 30 is used to isolate the second sensing electrode 22 from the first bridging wire 41, so as to realize single-sided conduction without through holes under the front paste printing of the circuit film, and make the first sensing electrode 21 have a complete electrode surface without exposed holes, so as to maintain the sensing performance of the first sensing electrode 21. More specifically, referring to fig. 1 and 9, the grooves 11, the openings 12 and the outer shape of the insulating film 10 are formed after the front surface film 60 is formed.

The embodiments of the present invention are all preferred embodiments for easy understanding or implementation of the technical solution of the present invention, and are not limited in scope by the present invention, and all equivalent changes according to the structure, shape and principle of the present invention should be covered in the scope of the claimed invention.

Claims (13)

1. A single-sided, overline conductive circuit film, comprising:

An insulating film (10);

The first conductive printing layer (20) is formed on the insulating film (10), the first conductive printing layer (20) comprises a plurality of groups of first sensing electrodes (21) and second sensing electrodes (22) which are arranged in pairs, the second sensing electrodes (22) continuously surround the corresponding first sensing electrodes (21), and the first conductive printing layer (20) also comprises a first connecting circuit (23) which is not directly connected with the first sensing electrodes (21) and a second connecting circuit (24) which is directly connected with the second sensing electrodes (22);

an isolation pattern layer (30) covering a crossover portion of the second sensing electrode (22) and located on a surface of the film on a side of the crossover portion, the crossover portion being located between the first sensing electrode (21) and a connection point of the first connection line (23);

A second conductive printed layer (40) formed on the isolation pattern layer (30) and extending onto the first conductive printed layer (20), the second conductive printed layer (40) including a first bridging trace (41), the first bridging trace (41) electrically connecting the first sensing electrode (21) and the first connection line (23) along a length direction of the isolation pattern layer (30); wherein the first conductive printing layer (20), the isolation pattern layer (30) and the second conductive printing layer (40) are formed by printing on the same surface for multiple times;

The single-sided line-crossing type conduction circuit film further comprises a front surface coating film (60) formed on the insulating film (10) and the first conductive printing layer (20), the front surface coating film (60) covers the first connection circuit (23) and the second connection circuit (24), and the front surface coating film (60) is provided with an induction coil opening (61) for exposing the first induction electrode (21) and the second induction electrode (22) which are configured in pairs.

2. The single-sided, cross-over conductive circuit film of claim 1, wherein the first conductive printed layer (20) comprises a short line (25) directly connecting the first sensing electrode (21), the first sensing electrode (21) being electrically connected with the first cross-over trace (41) via the short line (25).

3. The single-sided, cross-line conductive circuit film of claim 1, wherein the isolation pattern layer (30) further comprises a line portion (31) overlying a portion of the second connection line (24); the second conductive printing layer (40) comprises a second bridging wire (42), and the second bridging wire (42) is electrically connected with two adjacent first induction electrodes (21) along the line part (31) of the isolation pattern layer (30); the first bridging wires (41) and the second bridging wires (42) are connected with all the first sensing electrodes (21) in series with the first connecting wires (23), and the first sensing electrodes (21) are equipotential reference electrodes.

4. The single-sided line-crossing conductive circuit film according to claim 1, wherein a first connection terminal (51) electrically connected to the first connection line (23) and a second connection terminal (52) electrically connected to the second connection line (24) are provided on the insulating film (10), and the first connection terminal (51) and the second connection terminal (52) are arranged in a same surface wiring interface region of the insulating film (10).

5. The single-sided crossover conductive circuit film according to claim 4, wherein the insulating film (10) has a grooved (11) shape on both sides of the bus bar interface area, so that the surface bus bar interface area is elongated.

6. The single-sided cross-line conductive circuit film according to claim 5, wherein the grooves (11) on both sides are bent and enlarged away from each other to form a test area, and a plurality of test terminals (70) are arranged in the test area to electrically connect the corresponding first connection terminals (51) and the second connection terminals (52).

7. The single-sided, line-crossing conductive circuit film according to claim 1, wherein the first sensing electrode (21) has a circular pad shape, the second sensing electrode (22) has a continuous annular pad shape, and the second sensing electrode (22) surrounds the first sensing electrode (21) with the center of the circle of the respective first sensing electrode (21) as the center point of the circle.

8. The single-sided overline type conductive circuit film according to claim 7, wherein a fixed gap is formed between the first sensing electrode (21) and the corresponding second sensing electrode (22), and the first sensing electrode (21) and the second sensing electrode (22) arranged in pairs are arranged in the insulating film (10) in a staggered matrix manner.

9. The single-sided, overline type conductive circuit film according to claim 8, wherein the insulating film (10) forms an opening (12) between a pair-wise matrix adjacent dot and a pair-wise dislocation dot in the first and second sensing electrodes (21, 22) arranged in pairs.

10. The single-sided flying lead type conductive circuit film as set forth in claim 1, wherein the front side cover film (60) has a cover strip (62) protruding into the induction coil opening (61), the cover strip (62) entirely covering the first flying lead (41) and the isolation pattern layer (30) at a portion within the induction coil opening (61).

11. A method for manufacturing a single-sided, line-straddling conductive circuit film according to any one of claims 1 to 10, comprising:

providing the insulating film (10);

-first conductive paste front side printing to form said first conductive printed layer (20);

Printing an isolation pattern layer (30) on the insulating film (10) and the first conductive printing layer (20);

a second conductive paste is front printed to form the second conductive printed layer (40).

12. The method of manufacturing a single-sided, overline type conductive circuit film according to claim 11, wherein the first sensing electrode (21) of the first conductive printed layer (20) has a shape of complete non-porous exposure.

13. The method of manufacturing a single-sided, cross-line, on-circuit film of claim 11, further comprising: a front surface coating film (60) is printed on the insulating film (10) and the first conductive printed layer (20).