CN111595191A - Radiation heat exchange plate and radiation heat exchange system - Google Patents
Radiation heat exchange plate and radiation heat exchange system Download PDFInfo
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- CN111595191A CN111595191A CN202010577145.3A CN202010577145A CN111595191A CN 111595191 A CN111595191 A CN 111595191A CN 202010577145 A CN202010577145 A CN 202010577145A CN 111595191 A CN111595191 A CN 111595191A
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D15/00—Other domestic- or space-heating systems
- F24D15/04—Other domestic- or space-heating systems using heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0003—Exclusively-fluid systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
- F25B29/003—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously of the compression type system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B30/00—Heat pumps
- F25B30/06—Heat pumps characterised by the source of low potential heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The application relates to the field of waterless floor heating, in particular to a radiation heat exchange plate and a radiation heat exchange system. The radiation heat exchange plate comprises a plate main body, wherein micro-channels communicated with a medium inlet and a medium outlet are formed in the inner part or the side part of the plate main body. The micro-channel provides a circulation path and a phase change space for a medium in the micro-channel, and the medium can do work in the circulation process along with the suction or the discharge of heat, so that the heat of an object in the environment is absorbed or radiated to the object in the environment through the radiation of the plate main body, and the temperature of the object in the surrounding environment is changed. The radiation heat exchange system comprises a radiation heat exchange plate, a compressor, a condenser, a throttling component, an evaporator and a control valve; the radiation heat exchange system forms different circulation loops by changing the communication position of the control valve, so that the radiation heat exchange plate can be used as a radiation heat exchange plate type evaporator or a radiation heat exchange plate type condenser under different requirements, and radiation refrigeration or heating can be continuously carried out on objects or human bodies in the environment.
Description
Technical Field
The invention relates to the field of air conditioner/heat pump waterless floor heating, in particular to a radiation heat exchange plate and a radiation heat exchange system.
Background
In the prior art, an air source heat pump waterless floor heating system mainly comprises an air source heat pump heat source unit, a radiation system and a controller system, the working principle is that a compressor drives a refrigerant to do work to replace free heat energy in air, and the high-temperature heat energy released after the refrigerant is condensed in a capillary coil buried under the indoor ground (or on the ceiling) is used for heating the ground floor (or the ceiling) radiation system during heating, so that the indoor space is heated in a radiation mode.
The existing anhydrous floor heating system has the following problems:
1. the arrangement of the capillary coil pipes buried under indoor ground needs to be completed in a field 'manufacturing' mode, the manufacturing process is complex, the number of processes needing manual improvement is large, a plurality of uncontrollable factors exist in the field, hidden trouble is invisibly buried, and the result is that the manufacturing is difficult, the cost is high and the working hours are consumed naturally.
2. The inlet and return ports of the laid multi-path capillary coil are connected in a centralized manner by a pair (or a few pairs) of distributor heads, so that all pipelines at the distributor heads are centralized together, and the ground heat is unevenly distributed and the temperature difference is large (generally above 10 ℃), so that the heat exchange capacity of the system is relatively reduced, the unit working condition is abnormal, the energy efficiency ratio is low, the indoor temperature is unevenly distributed, and the human comfort is poor.
Disclosure of Invention
The invention aims to provide a radiation heat exchange plate and a radiation heat exchange system, which can solve the problems that in the prior art, an air conditioner/heat pump waterless floor heating system has an unsatisfactory unit working condition and an insufficient energy efficiency ratio due to unreasonable design of a capillary coil, and the capillary coil is difficult to pave and arrange.
In a first aspect, the present invention provides a radiation heat exchange plate, including a plate main body, where a medium inlet and a medium outlet are formed on the plate main body, a micro channel communicating the medium inlet and the medium outlet is formed inside or on a side of the plate main body, and the micro channel is used to provide a flow path and a phase change space for a medium.
In the above technical solution, preferably, the microchannels are distributed in the plate body in a curved shape, and an extending direction of the microchannels is parallel to a plate surface of the plate body;
the micro-channel is in a straight tube shape or a special-shaped tube shape; and/or
The microchannel comprises a plurality of linear branches or a plurality of special-shaped branches which are communicated with each other.
In the above technical solution, preferably, the number of the microchannels is plural, and the plural microchannels are arranged at intervals;
the microchannels are arranged in series, one end of each microchannel is communicated with the medium inlet, and the other end of each microchannel is communicated with the medium outlet; or
At least two micro channels are arranged in parallel in the plurality of micro channels, one end of each micro channel after parallel connection is communicated with the medium inlet, and the other end of each micro channel is communicated with the medium outlet.
In the above technical solution, preferably, a distance between sides of the plurality of microchannels connecting the medium inlets is larger than a distance between sides of the microchannels connecting the medium outlets.
In the above technical solution, preferably, the diameter of the microchannel is less than or equal to 2 mm;
the plate main body is flat-plate-shaped, and the area of the single-side plate surface of the plate main body is more than or equal to 1m2And the thickness of the plate main body is 1mm-55 mm.
In the above technical solution, preferably, the radiation heat exchange plate is a corrosion-resistant plate whose plate surface is subjected to passivation plating or adhesion coating treatment.
In the foregoing technical solution, preferably, switching distribution channels are respectively formed in the plate main body corresponding to the medium inlet and the medium outlet, each switching distribution channel includes at least one branch channel, and two ends of the microchannel are respectively in one-to-one correspondence with the branch channels at the medium inlet and the medium outlet to communicate the medium inlet and the medium outlet through the switching distribution channels.
In the above technical solution, preferably, the plate main body further includes a shock absorbing layer, and the shock absorbing layer is disposed on the first side portion of the plate main body and is parallel to the plate main body; and/or
The plate body further comprises a heat conducting layer disposed on the first side of the plate body and parallel to the plate body; and/or
The plate main body further comprises a vacuum interlayer, and the vacuum interlayer is arranged on the first side part of the plate main body and is parallel to the plate main body; and/or
The panel main body further comprises a finishing layer, and the finishing layer is arranged on the outermost layer of the first side part of the panel main body and is parallel to the panel main body; and/or
The plate main body further comprises a heat reflecting layer, and the heat reflecting layer is arranged on the second side part of the plate main body and is parallel to the plate main body; and/or
The plate main body further comprises a heat insulation layer, and the heat insulation layer is arranged on the second side portion of the plate main body and is parallel to the plate main body.
In a second aspect, the present application further provides a radiant heat exchange system, which includes a compressor, a condenser, a throttling component, an evaporator, a control valve, and the radiant heat exchange plate;
when the control valve is located at a first communication position, the compressor, the radiation heat exchange plate, the throttling component and the evaporator form a first circulation loop, and the radiation heat exchange plate is used as a radiation heat exchange plate type condenser in the first circulation loop; when the control valve is located at a second communication position, the compressor, the throttling component, the condenser and the radiation heat exchange plate form a second circulation loop, and the radiation heat exchange plate is used as a radiation heat exchange plate type evaporator in the second circulation loop; a medium circulates in the first circulation loop or the second circulation loop.
Or
The radiation heat exchange system comprises a compressor, a control valve, a throttling component and a plurality of radiation heat exchange plates, wherein the plurality of radiation heat exchange plates comprise a first radiation heat exchange plate and a second radiation heat exchange plate;
the compressor, the throttling component, the first radiant heat exchange plate and the second radiant heat exchange plate form a heat exchange circulation loop; in the heat exchange circulation loop, when the control valve is located at a first communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type condenser, and the second radiation heat exchange plate is used as a radiation heat exchange plate type evaporator; when the control valve is located at the second communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type evaporator, and the second radiation heat exchange plate is used as a radiation heat exchange plate type condenser.
In the above technical solution, preferably, the number of the radiation heat exchange plates as the radiation heat exchange plate condenser and/or the number of the radiation heat exchange plates as the radiation heat exchange plate evaporator are multiple;
the plurality of radiant heat exchange plates serving as the radiant heat exchange plate type condenser or the plurality of radiant heat exchange plates serving as the radiant heat exchange plate type evaporator are sequentially spliced, microchannels of the plurality of radiant heat exchange plates are sequentially communicated, and a medium outlet of one radiant heat exchange plate in two adjacent radiant heat exchange plates is communicated with a medium inlet of the other radiant heat exchange plate; or
The radiation heat exchange plates serving as the radiation heat exchange plate type condensers or the radiation heat exchange plate type evaporators are sequentially spliced, at least two micro-channels of the radiation heat exchange plates are arranged in the radiation heat exchange plates in parallel, and a medium inlet and a medium outlet of the radiation heat exchange plates which are arranged in parallel are respectively communicated with the first circulation loop and the second circulation loop.
The embodiment of the invention has the beneficial effects that:
the application provides a radiation heat exchange plate, including the board main part, seted up medium entry and medium export in the board main part, board main part inside or the lateral part is formed with the microchannel that communicates medium entry and medium export. The medium can enter the micro-channel through the medium inlet, can complete vaporization and liquefaction in the micro-channel, and then flows out of the micro-channel through the medium outlet. The micro-channel provides a phase change space for the medium in the micro-channel, and heat can be absorbed or released in the phase change 'doing work' process of the medium, so that the heat of an object in the environment is absorbed or radiated to the object in the environment through the radiation of the plate main body, and the temperature of the object in the surrounding environment is changed.
The radiation heat exchange system comprises a radiation heat exchange plate, a compressor, a condenser, a throttling component, an evaporator and a control valve; the radiation heat exchange system forms different circulation loops by changing the communication position of the control valve, so that the radiation heat exchange plate can be used as a radiation heat exchange plate type evaporator or a radiation heat exchange plate type condenser under different requirements, and radiation refrigeration or heating can be continuously carried out on objects or human bodies in the environment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of a first structure of a radiant heat exchange panel according to an embodiment of the present invention;
fig. 2 is a schematic view of a second structure of a radiant heat exchange plate according to an embodiment of the present invention;
fig. 3 is a schematic view of a third structure of a radiant heat exchange plate according to an embodiment of the present invention;
fig. 4 is a schematic view of a fourth structure of a radiant heat exchange plate according to an embodiment of the present invention;
fig. 5 is a schematic view of a connection between the radiant heat exchange plates according to an embodiment of the present invention;
fig. 6 is a schematic view of another connection between radiant heat exchange plates according to an embodiment of the present invention;
FIG. 7 is a graph of spectral emissivity versus wavelength for various materials in the prior art.
Reference numerals:
1-plate body, 11-medium inlet, 12-medium outlet, 13-microchannel, 14-special-shaped branch pipe and 15-switching distribution channel.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be mechanically coupled, directly coupled, indirectly coupled through an intermediary, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A radiant heat exchange panel and a radiant heat exchange system according to some embodiments of the present invention are described below with reference to fig. 1 to 4.
Example one
Referring to fig. 1 to 4, the present application provides a radiation heat exchange plate, which includes a plate body 1, wherein a medium inlet 11 and a medium outlet 12 are opened on the plate body 1, and a microchannel 13 communicating the medium inlet 11 and the medium outlet 12 is formed in the plate body 1 (including the inside and the side surface). The medium can enter the microchannel 13 through the medium inlet 11 and can be vaporized and liquefied in the microchannel 13 and then flow out of the microchannel 13 through the medium outlet 12. The micro-channel 13 provides a phase change space for the medium therein, and the phase change "doing work" process of the medium can absorb or release heat, so that the heat of the object in the environment is radiated and "absorbed" through the plate body 1 or radiated to the object in the environment, and the temperature of the object in the surrounding environment is changed.
The medium adopted by the radiation heat exchange plate is a refrigerant, and can be R410a, R290 or R32, and the like, the medium can be vaporized or liquefied in the micro-channel of the plate main body 1, and heat can be released or absorbed after the medium does work, so that radiation heat exchange is carried out between the plate main body 1 and objects in the surrounding environment. Specifically, the medium in the micro-channel 13 can release heat to the environment when condensing, and the released heat is radiated to the environment through the plate body 1, thereby playing a role of heating the indoor. The medium in the microchannel 13 can absorb heat from the environment when evaporating, and the absorbed heat is radiated to the plate main body 1 through the environment, so that the temperature of the plate main body 1 is lower than the temperature of indoor air, thereby playing a role in cooling the indoor.
Therefore, in the area with lower temperature, the heating is needed in winter, and the radiation heat exchange plate can be laid on the indoor ground or wall surface to radiate heat to the indoor so as to meet the requirement of indoor heating. In the higher area of temperature, the summer needs refrigeration, and indoor canopy face or wall can be laid to the radiation heat transfer board to absorb indoor heat, reduce indoor temperature, satisfy the demand of indoor cooling. In addition, the radiation heat exchange plate can also be used as a heat exchanger to directly act in a required environment without being laid on the ground or a wall surface and the like.
It should be noted that the term "radiation heat exchange" refers to the heat exchange between objects in the form of heat radiation when there is a temperature difference between the objects, so that the high temperature object loses heat and the low temperature object gains heat, and this heat transfer is called radiation heat exchange. The thermal radiation refers to a process of exciting micro-particle vibration inside an object due to heat, converting thermal energy into radiation energy, radiating the radiation energy to a surrounding object in the form of electromagnetic waves, and converting the radiation energy into the thermal energy.
The heat radiation is the inherent property of all objects in nature, and is characterized in that the objects can realize the energy 'conversion' type transfer without contact until the heat balance is realized and the 'continuous transfer' is also realized. The radiation heat exchange plate of this embodiment can utilize "heat" of plate self to produce the radiant energy and carry out the radiation heat transfer with the object or the human body in the environment under the prerequisite of contactless object to reach the effect of supplying heat or cooling to the object or the human body in the environment. Specifically, in the present embodiment, the temperature of the plate body 1 is changed by radiating the heat released or absorbed by the medium in the heat exchange plate, that is, "heat" contained in the plate body 1 is changed, and the "heat" inside the plate body 1 is further subjected to radiation heat exchange with the object or the human body in the environment in a heat radiation manner through the surface of the plate body 1, so as to achieve the effect of warming or cooling the object or the human body in the environment.
For thermal radiation also: the same wavelength, different materials have different absorption ratios (relative to the surface of the object); the materials are the same, and the absorption ratios are different (the absorption of the object is selective) when the wavelengths are different. The factors influencing the method mainly have two aspects, namely, the surface condition, namely the temperature of the surface and the surface condition (such as color, roughness, oxidation condition and the like) are related; the temperature, surface condition, orientation of the irradiated object, etc. of the projection radiation source-radiation source (radiation plate) are related.
In addition, factors that affect radiative heat transfer include the temperature of the surface of the object, the shape and size of the surface, the relative position between the surfaces of the object, the wavelength of the radiation from the object, and the radiation and absorption characteristics of the surface of the object.
For the above factors affecting the radiation heat exchange, on the first hand, the temperature of the surface of the object is related to the "heat" inside the object, that is, the higher the "heat" contained inside the object, the higher the temperature transmitted to the surface of the object, based on this, the present application can rapidly raise the surface temperature of the plate main body 1 by the large amount of heat (generally 303 ± 5k) generated by the refrigerant inside the plate main body 1 in the micro-channel 13, so as to convert the heat energy on the surface of the plate main body 1 into the radiation energy to be radiated outwards, thereby improving the radiation heat exchange efficiency with the object or the human body in the environment and the temperature of the object or the human body in the environment; in the second aspect, the shape and size of the surfaces of the objects, the radiation heat exchange amount between the surfaces of the two objects and the relative position between the surfaces of the two objects have a great relationship (angle coefficient), in order to achieve the optimal radiation effect, the indoor ground radiation plate can be fully paved as much as possible (namely the paving area is more than or equal to 75%) on the premise of avoiding shielding objects, because the angle coefficient is only a pure geometric quantity and only depends on the size and the relative position of the surfaces, and the surface of the radiation plate is preferably planar on the premise of relatively fixing the positions of the indoor objects; under the condition that the surface material, the temperature and the shape of the object are fixed, the radiation energy of the object is in direct proportion to the size of the surface of the object, so that in a reasonable range, the larger the surface size of a radiation plate (the object) is, the more the radiation energy is generated integrally; in the third aspect, the distance between the surfaces of the objects is smaller under the condition that the surface materials, the temperature and the shape of the objects are fixed, and the radiation heat exchange efficiency is higher when the angle formed by the radiation plate (body) and the object to be subjected to radiation heat exchange is not less than 70 degrees; in a fourth aspect, the spectral emissivity of radiation of the object varies with wavelength, in the infrared region the spectral emissivity of most media decreases with increasing wavelength, and the mechanism of infrared radiation absorption is spectral matching resonance absorption, i.e. when the radiation wavelength of the radiation source coincides with the absorption wavelength of the radiated object, the object absorbs a significant amount of infrared radiation; the wavelength of radiation of the solid object is 0.4-20 μm, most of the radiation is 0.8-20 μm in the infrared region, and the radiation wavelength of the heat pump radiation plate is about 2-20 μm; for the human body, the body itself is a good "infrared" absorber, with radiation wavelengths in the range of 2.5-15 μm (peak wavelength at about 9.3 μm) at the body surface; wherein the radiation absorption wavelength is mainly 8-14 μm, so the radiation wavelength of the radiation plate covers the absorption wavelength of human body, matching resonance can be realized completely, and high-efficiency heat radiation is provided for human body, so that human body feels warm. In a fifth aspect, the radiation emissivity (blackness) of the object is a property of the object material, which is unrelated to external factors, the kind of the substance, particularly the kind of the outermost material of the surface, has a large influence factor on the radiation emissivity, generally speaking, the radiation emissivity of metal is small, but the radiation emissivity of nonmetal is large, generally between 0.85 and 0.95, and therefore, better heat radiation can be obtained by taking the large radiation emissivity.
Based on the above analysis, a specific structure of the radiation heat exchange plate of the present embodiment will be explained.
The medium inlet 11 and the medium outlet 12 of the plate body 1 are opened to a plate surface (a plate surface in the longitudinal or width direction) of the plate body 1 so that the medium can flow in or out, and the plate surface in the thickness direction of the plate body 1 forms a heat radiation surface.
For the medium inlet 11 and the medium outlet 12 of the plate body 1, the medium inlet 11 and the medium outlet 12 may be disposed on the same side of the plate body 1, or may be disposed on different sides of the plate body 1, and may be selectively disposed according to specific laying requirements.
For the micro-channel 13 in the plate main body 1, the drift diameter is less than or equal to 2mm, preferably 1mm, the smaller the inner diameter (on the premise of meeting the medium flux) of the micro-channel 13 is, the higher the heat exchange rate of the medium flowing through the micro-channel is, and more heat energy can be released and generated in the plate main body 1 when the medium with the same quantity passes through the micro-channel, so that the heat exchange area of the plate surface is enlarged, a space is provided for increasing and balancing the temperature of the plate surface, all the media passing through the micro-channel 13 complete phase change as much as possible to perform work, the heat exchange capacity of the plate main body 1 is improved, and more heat is radiated to the environment (indoor). The utility model provides a radiation heat transfer board sets up in the microchannel 13 of board main part 1 and has greatly reduced microchannel 13's internal diameter as far as possible, improve the heat transfer rate of medium and the energy efficiency ratio of unit, the holistic structural performance of heat pump system has been improved behind the cooperation board main part 1 (the direct radiation heat transfer of miniwatt unit makes heat pump system more reasonable, light in weight is small in addition suitable for supporting with the high floor, can not appear "cold bridge formula" air fault between the unit), and installation rate has been improved, the supporting complexity of building has been solved, the travelling comfort of people's residence environment, the energy-conservation nature scheduling problem of unit work.
For the plate main body 1, in order to achieve the optimal heat radiation effect, the plate main body 1 is set to be flat, and two side plate surfaces in the thickness direction of the plate main body 1 form a heat radiation surface for performing radiation heat exchange with the environment. The area of the single-side plate surface of the plate body 1 is 1m or more2Specifically, 1m can be selected according to the installation requirement (the indoor cold and heat load requirement of the building)2、2m2、4m2And the like. The thickness of the plate body 1 is 1mm-55mm, which can be selected according to the size of the micro-channel 13 in the plate body 1 and the strength requirement of the plate body 1, for example, when the diameter of the micro-channel 13 in the plate body 1 is 1mm, the thickness of the plate body 1 is preferably 2 mm; when the through diameter of the microchannel 13 in the plate body 1 is 0.3mm or 0.5mm, the thickness of the plate body 1 is preferably 1mm or 1.5 mm; and along the thickness direction of board main part 1, microchannel 13 is located the middle part of board main part 1 to guarantee that the thickness of the board main part 1 of microchannel 13 both sides is unanimous, and of course microchannel 13 also can set up in one side of board main part 1 as required. When the plate body 1 is a stone plastic plate or a metal plate, the thickness of the plate body 1 is preferably 1 to 17.5mm, and more preferably 3mm, 5mm, 9mm, 15 mm. When the board body 1 is a polyurethane board or a phenol foam board, the thickness of the board body 1 is preferably 10 to 55mm, and more preferably 30mm, 35mm or 40 mm. The radiation heat exchange plate of the embodiment can be directly laid in a whole plate, the micro-channels 13 in the plate main body 1 are arranged in a factory in advance in a standard way, the working procedures of laying welding pipelines and the like by manual field calculation are not needed, the time and the labor are saved,the paving efficiency is high.
In addition, the surface of the radiation heat exchange plate can be processed into a corrosion-resistant plate through chemical passivation plating or adhesion (spraying) coating so as to improve the corrosion resistance of the radiation heat exchange plate, such as acid and alkali resistance, and the service life of the radiation heat exchange plate in special environments (such as severe environments of paving in a wet toilet and covering in cement).
Regarding the material of the plate body 1, kirchhoff's law of thermal radiation indicates that a material having a larger absorption coefficient has a stronger ability to radiate electromagnetic waves at a given temperature. The temperature of a radiation plate of the heat pump system is generally 303 +/-5 k, the metal radiation emissivity at the temperature is low (below 0.1), the radiation emissivity of other non-metal materials is high, and the wavelength of the non-metal materials is about 8 mu m, and the temperature is between 200 and 1000 k; because the wavelength of the heat radiation absorbed by the human body is mainly 8-14 mu m, the material with the radiation wavelength close to the wavelength range can achieve better radiation heat exchange effect with the human body. As shown in fig. 7, the spectral emissivity of common copper, iron, silver, gold, aluminum and graphite in a certain wavelength range is shown, and in the wavelength range of 8-14 μm, the spectral emissivity of graphite is much larger than that of other metal materials, so that the material of the plate body 1 of the present application may be selected from graphite materials or non-metal materials containing carbon black.
In addition, for metallic materials and non-metallic materials, the spectral emissivity of metal is lower, and that of non-metal is higher, generally greater than 0.8; however, the spectral emissivity of metal increases with the temperature, and when an oxide layer is formed on the surface, the spectral emissivity can be increased by a factor of 10 or more, so that a metal material subjected to oxidation treatment can be selected, only because the emissivity is relatively low around 10 μm; therefore, the material of the surface of the plate body 1 of the present embodiment is preferably a non-metal material, and specifically, a plate made of a non-metal material such as stone, a metal plate after oxidation treatment, or a plate made of a combination of metal and non-metal can be selected.
The distribution of the microchannels 13 in the plate body 1 will be explained in detail below with reference to fig. 1 to 4.
As shown in fig. 1, in order to increase the extension length of the micro channel 13 in the plate body 1 and increase the phase change space of the medium in the plate body 1 and the distribution area of the plate body 1, the micro channel 13 extends in a bent shape in the plate body 1, and the extension direction of the micro channel 13 is parallel to the plate surface of the plate body 1. One end of the micro-channel 13 is communicated with the medium inlet 11, and the other end is communicated with the medium outlet 12.
The micro-channels 13 may be straight or shaped tubular, preferably corrugated tubular, to further increase the length and width space of the micro-channels 13 within the plate body 1.
As shown in fig. 4, each microchannel 13 may also be in the form of a plurality of straight branches (not shown) or a plurality of special-shaped branches (not shown), i.e. the microchannel 13 may include a plurality of special-shaped branches 14 (e.g. corrugated branches) arranged in parallel and having the same channel inlet and channel outlet to further increase the phase change space and the plate surface area of the medium in the plate body 1.
Further, the number of microchannels 13 in the plate body 1 is plural, and the plural microchannels 13 are provided at intervals. A plurality of microchannels 13 may be arranged in series. When the plurality of microchannels 13 are sequentially arranged in series, one end of each of the plurality of microchannels 13 after series connection is communicated with the medium inlet 11, and the other end is communicated with the medium outlet 12. There may be at least two (partially or fully) microchannels 13 arranged in parallel in the plurality of microchannels 13; when the plurality of microchannels 13 are all connected in parallel, the plurality of microchannels 13 are respectively communicated with the medium inlet 11 and the medium outlet 12; when the plurality of microchannels 13 are partially connected in parallel, there are two cases, the first case, where the microchannels 13 of the parallel connection part have the same channel inlet and channel outlet, and the microchannels 13 arranged in parallel are connected in series with other microchannels 13, so that one end of the formed plurality of microchannels 13 is connected to the medium inlet 11, and the other end is connected to the medium outlet 12. Second, the microchannels 13 of the parallel portion have the same channel inlet and channel outlet and are connected in parallel with the remaining microchannels 13, and then communicate with the medium inlet 11 and the medium outlet 12, respectively. That is, the micro-channels 13 can be arranged in series, parallel or mixed in series and parallel, the medium phase change space can be increased by arranging the micro-channels 13, and the area of the radiation heat exchange plate can be increased, so that the radiation heat exchange requirements of different requirements can be met.
When the microchannel 13 in the plate body 1 has a plurality of branches or the plate body 1 has a plurality of microchannels 13 therein, in order to ensure uniformity of heat exchange of the medium entering the microchannel 13 at each position of the plate body 1 (in practical heating application, when the medium flowing in the plate body 1 releases heat to the outside, the temperature of the plate body 1 at the position corresponding to the medium inlet 11 is high, the temperature at the position corresponding to the medium outlet 12 is low, and sometimes the difference between the two is twenty or more degrees), the plurality of microchannels 13 are arranged at intervals, and the distance between the sides of the plurality of microchannels 13 or the plurality of branches connecting the medium inlets 11 is larger than the distance between the sides of the connecting medium outlets 12. That is, the density of the micro-channels 13 or branch pipes at the side corresponding to the medium inlet 11 in the plate body 1 is less than the density of the micro-channels 13 or branch pipes at the side corresponding to the medium outlet 12, so that the temperature of the plate surface at the end corresponding to the medium inlet 11 and the plate surface at the end corresponding to the medium outlet 12 are more balanced in the process of flowing the medium in the micro-channels 13.
As shown in fig. 1 to 4, switching distribution channels 15 are respectively formed in the plate body 1 corresponding to the medium inlet 11 and the medium outlet 12, when a micro channel 13 is disposed in the plate body 1, the switching distribution channel 15 includes a branch channel, and two ends of the micro channel 13 are respectively communicated with the branch channels of the switching distribution channel 15 corresponding to the medium inlet 11 and the medium outlet 12; when the plurality of microchannels 13 are provided in the plate body 1, the switching distribution channel 15 includes a plurality of branch channels, and both ends of the plurality of microchannels 13 are respectively communicated with the branch channels of the switching distribution channel 15 corresponding to the medium inlet 11 and the medium outlet 12 in a one-to-one correspondence, so that the medium can smoothly enter the microchannels 13 through the switching distribution channels 15 and smoothly flow out of the microchannels 13 through the switching distribution channels 15. It should be noted that the switching distribution channel 15 may be in a form that one inlet and outlet communicates with a plurality of branch channels connected in parallel, or may be formed by combining (series, parallel, or series-parallel) a plurality of switching distribution channels 15 including one or more branch channels.
For the formation of the micro-channels 13 in the plate body 1, on one hand, the plate body 1 may adopt a whole-plate structure, and the micro-channels 13 in the plate body 1 may be formed inside the plate body 1 by erosion or extrusion (stretching) or other processes; on one hand, the plate main body 1 can adopt a structure formed by buckling two plates, a half of the micro-channel 13 is formed on the two plates (or on one plate) through processes of laser, etching and the like, the micro-channel 13 can be formed in the plate main body 1 after the two plates are buckled, and meanwhile, in order to avoid leakage of a medium in the micro-channel 13 caused by a gap formed between the buckled plates, the two buckled plates can be buckled hermetically in a bonding, welding and other modes to form the complete plate main body 1; on the other hand, the microchannel 13 may be formed by attaching or grooving an ultrafine pipe to one side of the plate body 1.
In addition, it should be noted that the radiation heat exchange plate of this embodiment can be as the prefabricated plate, can be prefabricated in the mill through unified standardization, when the radiation heat exchange plate is used for indoor radiation heat transfer, can design the radiation plate of different specifications according to the room type of difference to on-the-spot direct with the radiation heat exchange plate concatenation of making mat formation, need not artifical laying pipeline, consequently greatly improved laying efficiency when having improved radiation heat exchange performance.
It should be noted that the radiant heat exchange plate of the present embodiment is configured to preferentially lay the floor surface and the wall surfaces that are not covered (the portion of 1.5m or less) as much as possible while mainly providing heating, and to preferentially lay the ceiling surface and the wall surfaces that are not covered (the portion of 1.5m or more) when the requirements cannot be met while mainly providing cooling. The Lanfibrate law shows that the radiation energy is maximum when the radiation plate and the human body (object) are arranged in parallel, and the ground radiation plate and the human body (front) are generally 90 degrees, so that only about 1/2 radiation energy is obtained; if the wall surface can be laid with radiation plates (below 1.5 m), the radiation plates are normal to the human body, and the radiation energy obtained at the time is maximum.
Example two
The second embodiment is an improvement on the first embodiment, technical contents disclosed in the above embodiments are not described repeatedly, and the contents disclosed in the above embodiments also belong to the contents disclosed in the second embodiment.
The board main part of the radiation heat transfer board of this embodiment includes heat-conducting layer, buffer layer, finish coat, heat reflection layer and heat insulation layer, and finish coat and buffer layer, the parallel attached first lateral part in board main part of heat-conducting layer, first lateral part are for one side (upper surface) towards the installation space at radiation heat transfer board place, promptly for deviating from one side of ground, wall body or shed face, and heat-conducting layer, buffer layer are located between finish coat and the board main part. The heat reflection layer and the heat insulation layer are attached to the second side portion of the plate main body in parallel, the second side portion is one side (lower surface) of the installation space where the radiation heat exchange plate is located, namely one side facing the ground, the wall or the shed surface, and the heat reflection layer is located between the plate main body and the heat insulation layer.
Based on the description of the thermal radiation principle of the radiation heat exchange plate in the first embodiment, when the spectral emissivity of the material adopted by the plate main body is not ideal, the material with higher spectral emissivity can be selected as the facing layer to form a radiation surface with better thermal radiation effect. In order to better transmit the heat generated by the medium in the micro-channel of the plate main body to the plate main body and the decorative layer, the material of the plate main body is preferably a material with good heat conductivity, such as metal materials of aluminum, copper and the like or non-metal materials of stone, plastic and the like; the facing layer is preferably a material with good heat radiation performance, such as a carbon-containing black stone plastic material layer, a cork (graphite) material layer, an oxidized metal material layer and the like. In addition, the veneer layer and the plate main body can be integrally formed so as to form the veneer layer on the surface of the plate main body; or the outer surface of the plate main body directly serves as a decorative layer.
The heat conducting layer has the functions of heat conduction and temperature equalization, and the metal film material can be selected, and the carbon crystal film material with good heat conducting property can also be selected.
To the buffer layer, because finish coat and board main part all adopt hard material, consequently do not avoid when the radiation heat transfer board of this application lays in the ground, produce the condition of collision wearing and tearing or production abnormal sound between both after finish coat and board main part atress, increase the production of buffer layer in order to avoid above-mentioned problem between the two. Preferably, the shock absorbing layer can be made of any soft material such as cork sheet, or rubber like cork form, or IXPE ground mat of artificial chemical synthesis, or sheet of non-metal material.
In addition, in order to prevent the heat generated by the medium in the micro-channels of the plate main body from being lost through the other side surface (i.e., the side facing the ground, the wall or the shed surface) of the plate main body, in this embodiment, a heat reflecting layer and a heat insulating layer are disposed on the side of the plate main body facing the ground, the wall or the shed surface, the heat reflecting layer and the heat insulating layer are disposed in parallel with the plate main body, the heat reflecting layer can reflect most of the heat back to the plate main body, the heat reflecting layer can be a structural layer with a smooth metal reflective coating having a "light reflecting" effect attached to the surface, and the metal reflective coating is disposed toward the; the thermal insulation layer is preferably made of materials with poor heat conduction performance, such as foamed polyurethane, aerogel thermal insulation materials, rock wool boards, extruded sheets, benzene boards, foamed cement, ceramic boards and the like, so that heat of the plate main body is prevented from being transferred downwards (outwards and upwards), and more heat generated in the micro-channels of the plate main body is radiated out through the heat radiation surface.
In addition, when the radiation heat transfer board acts on the indoor refrigeration that humidity is higher, for the phenomenon that avoids the radiation heat transfer board to appear the dewfall towards indoor one side, still be provided with the vacuum isolation layer towards indoor one side at the radiation heat transfer board, in order to avoid the indoor humid air of "cold" face direct contact of radiation heat transfer board and the temperature of part rising radiation heat transfer board towards indoor one side surface (avoid dew point temperature with the mode that is slightly higher than dew point 1 ~ 2 ℃), reduce indoor temperature with this, reach and give indoor "no wind" refrigerated purpose, realize reducing the production of dewfall condition simultaneously.
EXAMPLE III
The third embodiment is an improvement on the basis of the first embodiment and the second embodiment, technical contents disclosed in the embodiments are not described repeatedly, and the contents disclosed in the embodiments also belong to the contents disclosed in the third embodiment.
The embodiment provides a radiation heat exchange system, which comprises a compressor, a condenser, a throttling component, an evaporator, a control valve and the radiation heat exchange plate (indoor unit) of the embodiment.
When the unit heats, the control valve is positioned at a first communication position, the compressor, the radiation heat exchange plate, the throttling component and the evaporator form a first circulation loop, and the radiation heat exchange plate is used as a radiation heat exchange plate type condenser in the first circulation loop; when the control valve is positioned at a second communication position, the compressor, the throttling component, the condenser and the radiation heat exchange plate form a second circulation loop, and the radiation heat exchange plate is used as a radiation heat exchange plate type evaporator in the second circulation loop; the medium circulates in the first circulation loop or the second circulation loop.
Specifically, when the unit heats, the control valve is located at the first communication position, the first circulation loop is communicated, and at the moment, the compressor is communicated with a medium inlet, a micro-channel and a medium outlet of the radiation heat exchange plate type condenser (located indoors) through pipelines, and forms a front section of the first circulation loop. In the first circulation loop, the medium is compressed by the compressor to form a high-temperature high-pressure medium, the high-temperature high-pressure medium enters the micro-channel of the radiation heat exchange plate type condenser to be cooled and condensed, and the high-temperature high-pressure medium is changed from a gas state to a liquid state and radiates heat to objects or human bodies in the indoor environment, so that the effect of heating the objects or the human bodies in the indoor environment is achieved. The throttling component and the evaporator (located outdoors) form the rear section of the first circulation loop, the medium flows out of the radiation heat exchange plate type condenser, the pressure drops suddenly after passing through the throttling component, the medium is changed from a liquid state to a vapor state through the evaporator and absorbs heat from the outdoor environment, low-pressure superheated steam enters the air return port of the compressor, and the circulation is carried out, so that the energy-saving operation of the heat pump system and the continuous radiation heat exchange of the radiation heat exchange plate are realized. The process is mainly suitable for the condition that indoor heating is needed in the environment with lower temperature such as winter.
When the control valve is positioned at a second communication position, the second circulation loop is communicated, at the moment, the compressor and the condenser form a front section of the second circulation loop, the medium is compressed by the compressor to form a high-temperature and high-pressure medium, the high-temperature and high-pressure medium enters the condenser (positioned outdoors) to be cooled and condensed, and the high-temperature and high-pressure medium is changed from a gas state to a liquid state and releases heat to the outdoor environment; and after the medium is throttled by the throttling component, the medium enters the rear section of a second circulation loop formed by a radiation heat exchange plate type evaporator (positioned indoors) or an indoor unit, the pressure drops suddenly after the medium flows into the throttling component, the medium is changed into a vapor state from liquid through the radiation heat exchange plate type evaporator or the indoor unit, heat is absorbed from the indoor environment at the same time, the effect of cooling objects or human bodies in the indoor environment is further achieved, low-pressure superheated steam enters a return air port of the compressor, and the circulation is carried out, so that the normal energy-saving operation of the dehumidification function of the indoor unit of the air conditioning system is realized, and the radiation heat exchange cold is continuously provided for the indoor space by the radiation heat exchange. The process is mainly suitable for the condition that the indoor refrigeration is needed in the environment with higher temperature such as summer.
Preferably, the control valve is a four-way valve.
In addition, for satisfying the demand of unit radiation heat transfer ability and realizing the thermal radiation to a wider range in the environment, realize laying comprehensively of ground, wall body or canopy face promptly, the quantity of the radiation heat transfer board as radiation heat transfer board formula condenser of the radiation heat transfer system of this embodiment is a plurality of, and a plurality of radiation heat transfer boards splice in order to form complete thermal radiation face. When the plurality of radiation heat exchange plates are spliced in sequence, the micro-channels in the radiation heat exchange plates can be communicated in series or in parallel.
Referring to fig. 5, when the microchannels 13 of the plurality of radiation heat exchange plates are sequentially communicated, that is, the microchannels 13 of the plurality of radiation heat exchange plates are serially connected, the medium outlet 12 of one radiation heat exchange plate of two adjacent radiation heat exchange plates is communicated with the medium inlet 11 of the other radiation heat exchange plate, and one end of the complete microchannel formed by sequentially splicing the plurality of radiation heat exchange plates forms a total medium inlet and the other end forms a total medium outlet, so as to realize the inflow and outflow of the medium, therefore, a larger radiation heat exchange surface can be formed after splicing the plurality of radiation heat exchange plates, so as to better realize the heat exchange with the indoor environment uniformly.
In addition, there is a form that the microchannels 13 of a plurality of radiation heat exchange plates are partially or totally arranged in parallel, referring to fig. 6, when a plurality of radiation heat exchange plates are totally connected in parallel, the medium inlet 11 and the medium outlet 12 of each radiation heat exchange plate separately enter the medium, and the plurality of medium inlets 11 and the plurality of medium outlets 12 are respectively connected to the circulation loop. When only part of the plurality of radiant heat exchange plates are connected in parallel (not shown in the figure), two conditions exist, namely, in the first condition, the medium inlet and the medium outlet of the parallel part are independently fed with and discharged from the medium, the medium inlet and the medium outlet of the radiant heat exchange plates of the serial part are sequentially communicated to form a total medium inlet and a total medium outlet, and the medium inlet and the medium outlet of the parallel part and the medium inlet and the medium outlet of the serial part are respectively connected into the circulation loop (namely, the parallel part and the serial part are arranged in parallel); in the second mode, the serial part forms a total medium inlet, the medium inlet of the parallel part is communicated with the total medium outlet formed by the serial part, and the medium outlets of the parallel part are respectively connected into the circulating loop. I.e. when only some of the plurality of radiant heat exchange plates are connected in parallel, the system may be in a series-parallel connection.
In addition, the number of the radiation heat exchange plates as the radiation heat exchange plate type evaporator of the radiation heat exchange system of the embodiment is multiple, and the splicing mode of the multiple radiation heat exchange plates is the same as that of the radiation heat exchange plates as the radiation heat exchange plate type condenser, i.e. serial splicing, parallel splicing or serial-parallel hybrid splicing can be performed, which is not described herein again.
Example four
The fourth embodiment is an improvement on the basis of the first embodiment, the second embodiment and the third embodiment, technical contents disclosed in the embodiments are not described repeatedly, and the contents disclosed in the embodiments also belong to the contents disclosed in the fourth embodiment.
In this embodiment, the radiation heat exchange system includes a compressor, a control valve, a throttling component, and a plurality of radiation heat exchange plates, where the plurality of radiation heat exchange plates include a first radiation heat exchange plate and a second radiation heat exchange plate; the compressor, the throttling component, the first radiation heat exchange plate and the second radiation heat exchange plate form a heat exchange circulation loop; in the heat exchange circulation loop, when the control valve is positioned at the first communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type condenser, and the second radiation heat exchange plate is used as a radiation heat exchange plate type evaporator; when the control valve is located at the second communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type evaporator, and the second radiation heat exchange plate is used as a radiation heat exchange plate type condenser.
In a conventional such embodiment, the first radiant heat exchange panel is disposed indoors and the second radiant heat exchange panel is disposed outdoors. In the heat exchange circulation loop, when the control valve is located at the first communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type condenser, the second radiation heat exchange plate is used as a radiation heat exchange plate type evaporator, and the process that a medium circulates among the compressor, the radiation heat exchange plate type condenser, the throttling component and the radiation heat exchange plate type evaporator is the same as the principle that the radiation heat exchange plate type condenser is located indoors to radiate heat indoors in the third embodiment; in the refrigeration cycle loop, when the control valve is located at the second communication position, the first radiation heat exchange plate serves as the radiation heat exchange plate type evaporator, the second radiation heat exchange plate serves as the radiation heat exchange plate type condenser, and the process that the medium circulates among the compressor, the radiation heat exchange plate type condenser, the throttling component and the radiation heat exchange plate type evaporator is the same as the principle that the radiation heat exchange plate type evaporator is located indoors to absorb heat from indoors in the third embodiment, so that the principle is not repeated.
In addition, the splicing manner of the radiation heat exchange plate serving as the radiation heat exchange plate evaporator and the radiation heat exchange plate serving as the radiation heat exchange plate condenser in the present embodiment is also the same as that of the radiation heat exchange plate in the third embodiment, that is, the radiation heat exchange plates in the present embodiment may also be arranged in series, in parallel, or in a mixture of series and parallel, and a description thereof will not be repeated.
EXAMPLE five
The fourth embodiment is an improvement on the basis of the first to fourth embodiments, technical contents disclosed in the embodiments are not described repeatedly, and contents disclosed in the embodiments also belong to contents disclosed in the fourth embodiment.
In the third embodiment and the fourth embodiment, the radiation heat exchange plates arranged in the room are improved, the radiation heat exchange plates arranged in the room comprise a first-class radiation heat exchange plate and a second-class radiation heat exchange plate which are arranged in parallel, the first-class radiation heat exchange plate is laid on the ground and the wall surface, the second-class radiation heat exchange plate is laid on the shed surface and the wall surface, the first-class radiation heat exchange plate and the second-class radiation heat exchange plate can be respectively connected into the circulation loop, and the first-class radiation heat exchange plate or the second-class radiation heat exchange plate is respectively connected into the circulation loop under the requirements of different working conditions, so that the first-class radiation heat exchange plate is connected into the circulation loop and only heats (when necessary, the second-class radiation heat exchange plate is assisted to cool) or the second-class radiation heat exchange plate is connected into the circulation loop and only cools (when. The specific heat exchange and refrigeration principles are specifically described in the above embodiments, and are not described herein again.
Specifically, the first-type radiation heat exchange plate and the second-type radiation heat exchange plate can be switched and controlled through a control valve (such as an electromagnetic valve or an electronic expansion valve) so that the first-type radiation heat exchange plate or the second-type radiation heat exchange plate is respectively connected into a circulation loop formed under different working conditions.
It should be noted that, for the radiation heat exchange systems of the third embodiment, the fourth embodiment and the fifth embodiment of the present application, large-area efficient heating or cooling can be achieved indoors through the radiation heat exchange plate matching unit, the indoor heat exchange and cooling modes in the prior art are overturned, the multifunctional (with the fresh air function) indoor temperature and humidity independent control of the small unit can be achieved, the heat exchange efficiency of the system is improved, and meanwhile, the comfort level of a human body is also improved.
Next, according to tests and calculations, the radiant heat transfer amount per unit area of the radiant heat exchange system according to the embodiment of the present application, when the surface of the radiant heat exchange plate reaches different temperatures, corresponding to different environmental temperatures, will be described.
Wherein, table 1 shows the radiant heat transfer amount of the radiant heat exchange plate (when the indoor floor laying area is more than or equal to 75%, the shielding coefficient of furniture and the loss of the radiant heat transfer amount of the floor are not considered temporarily) in unit area under different temperatures.
TABLE 1
Taking the first case shown in table 1, i.e. the radiant heating indoor temperature is 18 ℃, the weighted average temperature of the non-heating surface is 18 ℃, and the average temperature of the ground radiation surface is 25 ℃, the actual radiation per unit area of the radiant heat exchange plate in the case of ground radiation is specifically explainedHeat transfer capacity q(floor)。
q(floor)=qf+qd
In the formula: q. q.sfRadiant surface radiant heat transfer per unit area, qd-radiant surface area convective heat transfer;
let tn18 ℃ (radiant heating indoor space temperature ℃)
Let tpj25 ℃ (average temperature on ground radiation surface ℃)
In floor heating of a room (convection heat transfer amount per unit area of radiation surface):
qd=2.13|tpj-tn|^0.31(tpj-tn)
=27.26W/m2
radiant heat transfer per unit area of room floor (assuming area weighted average temperature t of non-heated surfaces in the roomfj≤tnAt 18 ℃):
qf=5×10^﹣8[(tpj+273)^4-(tfj+273)^4]
=35.76(W/m2)
total radiant heat transfer per unit area when the room radiates from the ground:
q(floor)=qf+qd
q=35.76+27.26
=63.02W/m2
From the above results, no matter how hot the room temperature and the ground temperature are, the radiant heat transfer per unit surface area of the ground is always larger than the convective heat transfer per unit surface area of the ground; when the indoor temperature rises, the value of the indoor ground unit surface area convection heat transfer quantity is reduced, and the value of the indoor ground unit surface area radiation heat transfer quantity is also reduced, but at the same time when the percentage of the indoor ground unit surface area convection heat transfer quantity to the indoor unit area ground total radiation heat transfer quantity is reduced, the percentage of the indoor ground unit surface area radiation heat transfer quantity to the indoor unit area ground total radiation heat transfer quantity is increased; when the ground temperature is increased, the convection heat transfer amount per unit surface area of the indoor ground and the radiation heat transfer amount per unit surface area of the indoor ground are increased, but when the ground temperature is increased, the convection heat transfer amount per unit surface area of the indoor ground and the radiation heat transfer amount per unit surface area of the indoor ground are increased at different rates.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A radiation heat exchange plate is characterized by comprising a plate main body, wherein a medium inlet and a medium outlet are formed in the plate main body, a micro channel communicated with the medium inlet and the medium outlet is formed in the inner part or the side part of the plate main body, and the micro channel is used for providing a circulation path and a phase change space for a medium.
2. A radiant heat exchanger plate according to claim 1, wherein the microchannels are distributed in the plate body in a curved manner and extend in a direction parallel to the plate surface of the plate body;
the micro-channel is in a straight tube shape or a special-shaped tube shape; and/or
The microchannel comprises a plurality of linear branches or a plurality of special-shaped branches which are communicated with each other.
3. A radiant heat exchanger plate according to claim 1, wherein the number of microchannels is plural, and the plural microchannels are spaced apart;
the microchannels are arranged in series, one end of each microchannel is communicated with the medium inlet, and the other end of each microchannel is communicated with the medium outlet; or
At least two micro channels are arranged in parallel in the plurality of micro channels, one end of each micro channel after parallel connection is communicated with the medium inlet, and the other end of each micro channel is communicated with the medium outlet.
4. A radiant heat exchanger plate according to claim 3, wherein the spacing between the sides of the plurality of microchannels connecting the media inlets is greater than the spacing between the sides connecting the media outlets.
5. A radiant heat exchanger plate according to claim 1, wherein the diameter of the microchannels is less than or equal to 2 mm;
the plate main body is flat-plate-shaped, and the area of the single-side plate surface of the plate main body is more than or equal to 1m2And the thickness of the plate main body is 1mm-55 mm.
6. A radiant heat exchange panel as claimed in claim 1 wherein the panel surface is corrosion resistant by passive or adhesion coating.
7. A radiant heat exchanger plate according to claim 1, wherein a switching distribution channel is formed in the plate body corresponding to the medium inlet and the medium outlet, respectively, the switching distribution channel including at least one branch channel, and both ends of the micro channel are communicated with the branch channels of the medium inlet and the medium outlet, respectively, in a one-to-one correspondence, so as to communicate the medium inlet and the medium outlet through the switching distribution channel.
8. A radiant heat exchanger plate according to claim 1,
the plate body further comprises a heat conducting layer disposed on the first side of the plate body and parallel to the plate body; and/or
The plate main body further comprises a damping layer, and the damping layer is arranged on the first side part of the plate main body and is parallel to the plate main body; and/or
The plate main body further comprises a vacuum interlayer, and the vacuum interlayer is arranged on the first side part of the plate main body and is parallel to the plate main body; and/or
The panel main body further comprises a finishing layer, and the finishing layer is arranged on the outermost layer of the first side part of the panel main body and is parallel to the panel main body; and/or
The plate main body further comprises a heat reflecting layer, and the heat reflecting layer is arranged on the second side part of the plate main body and is parallel to the plate main body; and/or
The plate main body further comprises a heat insulation layer, and the heat insulation layer is arranged on the second side portion of the plate main body and is parallel to the plate main body.
9. A radiation heat exchange system is characterized in that,
the radiant heat exchange system comprises a compressor, a condenser, a throttling component, an evaporator, a control valve and the radiant heat exchange plate of any one of claims 1 to 8;
when the control valve is located at a first communication position, the compressor, the radiation heat exchange plate, the throttling component and the evaporator form a first circulation loop, and the radiation heat exchange plate is used as a radiation heat exchange plate type condenser in the first circulation loop; when the control valve is located at a second communication position, the compressor, the throttling component, the condenser and the radiation heat exchange plate form a second circulation loop, and the radiation heat exchange plate is used as a radiation heat exchange plate type evaporator in the second circulation loop; a medium circulates in the first circulation loop or the second circulation loop;
or
The radiant heat exchange system comprises a compressor, a control valve, a throttling component and a plurality of radiant heat exchange plates as claimed in any one of claims 1 to 8, wherein the plurality of radiant heat exchange plates comprises a first radiant heat exchange plate and a second radiant heat exchange plate;
the compressor, the throttling component, the first radiant heat exchange plate and the second radiant heat exchange plate form a heat exchange circulation loop; in the heat exchange circulation loop, when the control valve is located at a first communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type condenser, and the second radiation heat exchange plate is used as a radiation heat exchange plate type evaporator; when the control valve is located at the second communication position, the first radiation heat exchange plate is used as a radiation heat exchange plate type evaporator, and the second radiation heat exchange plate is used as a radiation heat exchange plate type condenser.
10. The radiant heat exchange system as claimed in claim 9 wherein the number of the radiant heat exchange plates as the radiant heat exchange plate condenser and/or the radiant heat exchange plates as the radiant heat exchange plate evaporator is plural respectively;
the plurality of radiant heat exchange plates serving as the radiant heat exchange plate type condenser or the plurality of radiant heat exchange plates serving as the radiant heat exchange plate type evaporator are sequentially spliced, microchannels of the plurality of radiant heat exchange plates are sequentially communicated, and a medium outlet of one radiant heat exchange plate in two adjacent radiant heat exchange plates is communicated with a medium inlet of the other radiant heat exchange plate; or
The radiation heat exchange plates serving as the radiation heat exchange plate type condensers or the radiation heat exchange plate type evaporators are sequentially spliced, at least two micro-channels of the radiation heat exchange plates are arranged in the radiation heat exchange plates in parallel, and a medium inlet and a medium outlet of the radiation heat exchange plates which are arranged in parallel are respectively communicated with the first circulation loop and the second circulation loop.
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CN202010577145.3A CN111595191A (en) | 2020-06-22 | 2020-06-22 | Radiation heat exchange plate and radiation heat exchange system |
CN202121354029.1U CN214950815U (en) | 2020-06-22 | 2021-06-17 | Radiation heat exchange plate, radiation heat exchange plate set and radiation heat exchange system |
CN202110673885.1A CN113175839A (en) | 2020-06-22 | 2021-06-17 | Radiation heat exchange plate, radiation heat exchange plate set and radiation heat exchange system |
PCT/CN2021/101302 WO2021259210A1 (en) | 2020-06-22 | 2021-06-21 | Radiation heat transfer plate, radiation heat transfer plate group and radiation heat transfer system |
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CN202010577145.3A CN111595191A (en) | 2020-06-22 | 2020-06-22 | Radiation heat exchange plate and radiation heat exchange system |
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CN202110673885.1A Pending CN113175839A (en) | 2020-06-22 | 2021-06-17 | Radiation heat exchange plate, radiation heat exchange plate set and radiation heat exchange system |
CN202121354029.1U Active CN214950815U (en) | 2020-06-22 | 2021-06-17 | Radiation heat exchange plate, radiation heat exchange plate set and radiation heat exchange system |
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Cited By (3)
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CN112886097A (en) * | 2021-02-02 | 2021-06-01 | 浙江银轮机械股份有限公司 | Heat exchange plate and battery pack |
WO2021259210A1 (en) * | 2020-06-22 | 2021-12-30 | 舒创电气科技(辽宁)有限公司 | Radiation heat transfer plate, radiation heat transfer plate group and radiation heat transfer system |
WO2023142963A1 (en) * | 2022-01-26 | 2023-08-03 | 洛阳瑞昌环境工程有限公司 | Plastic heat exchange plate assembly, assembly process and heat exchange module |
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TWI845004B (en) * | 2022-10-31 | 2024-06-11 | 技鋼科技股份有限公司 | Heat sink and electronic device |
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- 2021-06-17 CN CN202110673885.1A patent/CN113175839A/en active Pending
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WO2021259210A1 (en) * | 2020-06-22 | 2021-12-30 | 舒创电气科技(辽宁)有限公司 | Radiation heat transfer plate, radiation heat transfer plate group and radiation heat transfer system |
CN112886097A (en) * | 2021-02-02 | 2021-06-01 | 浙江银轮机械股份有限公司 | Heat exchange plate and battery pack |
WO2023142963A1 (en) * | 2022-01-26 | 2023-08-03 | 洛阳瑞昌环境工程有限公司 | Plastic heat exchange plate assembly, assembly process and heat exchange module |
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CN214950815U (en) | 2021-11-30 |
WO2021259210A1 (en) | 2021-12-30 |
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