CN111595101A - Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment - Google Patents
Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment Download PDFInfo
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- CN111595101A CN111595101A CN201910130504.8A CN201910130504A CN111595101A CN 111595101 A CN111595101 A CN 111595101A CN 201910130504 A CN201910130504 A CN 201910130504A CN 111595101 A CN111595101 A CN 111595101A
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- 239000007788 liquid Substances 0.000 title claims abstract description 143
- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- 238000005057 refrigeration Methods 0.000 title claims abstract description 77
- 230000035622 drinking Effects 0.000 title claims abstract description 34
- 238000005086 pumping Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 239000003595 mist Substances 0.000 claims description 18
- 238000009434 installation Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000003134 recirculating effect Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 15
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000007480 spreading Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 235000013361 beverage Nutrition 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000015203 fruit juice Nutrition 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to refrigeration equipment, and discloses an air-cooled circulating drinking liquid semiconductor refrigeration system which comprises a semiconductor refrigeration chip (1), an air-cooled hot end radiator contacted with the hot end of the semiconductor refrigeration chip (1), a liquid-cooled heat exchange unit (2), a storage container (3) and a pumping device (4). Aiming at the problems that the heat dissipation of the hot end of the semiconductor refrigeration chip (1) is not timely and the heat exchange efficiency of the cold end and the hot end is low in the existing refrigeration equipment, the hot end of the semiconductor refrigeration chip (1) is cooled by an air-cooled radiator, and the cold end of the semiconductor refrigeration chip (1) is refrigerated by a closed loop circulating liquid path (8) with a local turbulence forming structure, so that the working efficiency of the semiconductor refrigeration chip (1) can be enhanced, the structure is simple, and the cost is low.
Description
Technical Field
The invention relates to refrigeration equipment, in particular to an air-cooled circulating drinking liquid semiconductor refrigeration system. In addition, the invention also relates to a refrigeration device comprising the air-cooled circulating drinking liquid semiconductor refrigeration system.
Background
Semiconductor refrigeration technology has gained wider application since the end of the 20 th century 50 s, due to its unique advantages. Semiconductor refrigeration chip's theory of operation is that semiconductor refrigeration chip is when having the electric current to pass through, will produce heat transfer between the both ends, the heat will be followed one end and shifted to the other end, thereby produce the difference in temperature and form cold and hot end, but semiconductor self has resistance, will produce heat when the electric current passes through the semiconductor, thereby can influence the heat transfer, and heat between two polar plates also can carry out reverse heat transfer through air and semiconductor material self, reach certain difference in temperature when cold and hot end, the volume of these two kinds of heat transfers is equal mutually, will reach a balance point, positive and reverse heat transfer offsets each other, the temperature in cold and hot end just can not continue to change this moment, semiconductor refrigeration chip's refrigeration efficiency can reduce, can stop work even.
In addition, not only the hot end contends for the cold energy of the cold end, but also the refrigeration efficiency is low because the drinking liquid in the prior art can not effectively transfer heat or even damage the heat convection movement of the drinking liquid in the process of contacting with the cold end.
For the reasons, the prior art is difficult to improve the working efficiency of the semiconductor refrigeration chip, and the refrigeration effect is not ideal.
Disclosure of Invention
The invention aims to provide an air-cooled circulating drinking liquid semiconductor refrigerating system which overcomes the defects of low refrigerating efficiency and non-ideal refrigerating effect of a semiconductor refrigerating chip in the prior art.
In order to achieve the purpose, the invention provides an air-cooled circulating drinking liquid semiconductor refrigerating system which comprises a semiconductor refrigerating chip, an air-cooled hot end radiator, a liquid-cooled heat exchange unit, a storage container and a pumping device, wherein the air-cooled hot end radiator is in contact with the hot end of the semiconductor refrigerating chip, the cold end face of the semiconductor refrigerating chip is in contact with the liquid-cooled heat exchange unit, the storage container and the pumping device are connected through a liquid path to form a closed-loop circulating liquid path, a liquid movement track formed by the circulating liquid path can guide the heat convection movement of liquid, and a local turbulence forming structure for forming local turbulence is arranged or formed.
Preferably, the storage container is provided with an inlet and an outlet, the storage container is also internally provided with a bent water pipe, and a liquid inlet of the bent water pipe is hermetically connected with the inlet.
More preferably, the arrangement of the curved water tube forms a local turbulence creating structure, and the liquid outlet of the curved water tube is located at an upper portion in the storage container, so that the drinking liquid fed into the storage container can impact the liquid level with the height difference during operation, thereby creating the local turbulence.
Typically, the inlet in the liquid cooling heat transfer unit is located and is equipped with the baffle, be equipped with a plurality of flow distribution holes on the baffle, the baffle is V-arrangement baffle or cowl.
As a preferred embodiment, the liquid-cooled heat exchange unit includes a cold guide plate and flow disturbing fins protruding from the cold guide plate and serving as the local turbulence forming structure, and a channel for drinking liquid to pass through is formed between the flow disturbing fins.
As another preferred specific implementation, the air-cooled hot-end heat radiator comprises a heat dissipation element and a cooling air driving device for cooling the heat dissipation element, and a cooling air path is formed in the air-cooled hot-end heat radiator.
Further preferably, a heat absorbing liquid mist diffusing device is provided on a cooling air path in the air-cooled hot-end heat sink, the heat absorbing liquid mist diffusing device being provided on the cooling air path at a position before the cooling air enters the heat sink in the air-cooled hot-end heat sink or on a section passing through the heat sink.
More preferably, the endothermic liquid mist diffusing means is capable of spraying endothermic vaporized liquid mist.
On the basis of the technical scheme, the invention also provides refrigeration equipment, wherein the refrigeration equipment is provided with the air-cooled circulating drinking liquid semiconductor refrigeration system according to any one of the technical schemes.
According to the technical scheme of the invention, according to the working principle and the characteristics of the semiconductor refrigeration chip, the heat radiating piece and the cooling air driving device are arranged at the hot end of the semiconductor refrigeration chip, so that the temperature of the hot end of the semiconductor refrigeration chip can be rapidly reduced, meanwhile, the cold end of the semiconductor refrigeration chip is provided with the circulating liquid path consisting of the liquid cooling heat exchange unit, the storage container and the pumping device, the movement track of the liquid formed by the circulating liquid path can guide the heat convection movement of the liquid, and the local turbulence forming structure for forming local turbulence is arranged or formed, so that the original natural convection heat exchange mode of water is converted into the forced convection heat exchange mode, the convection heat exchange coefficient is increased, the refrigeration efficiency of the semiconductor refrigeration chip is increased under the condition of not changing the material and the current of the semiconductor chip, the energy is saved, the cost is lower, and the semiconductor.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The following drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the scope of the invention. In the drawings:
FIG. 1 is a schematic diagram of the overall configuration of an air-cooled recirculating potable liquid semiconductor refrigeration system in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram of a position structure of an embodiment of a heat absorption liquid mist spreading device disposed on a cooling air path in an air-cooled hot-end heat sink according to the present invention;
FIG. 3 is a schematic structural view of one embodiment of the baffle of the present invention;
FIG. 4 is a schematic structural view of another embodiment of the baffle of the present invention;
fig. 5 is a schematic structural view of an embodiment of the cold conduction plate of the present invention.
Description of the reference numerals
1 semiconductor refrigeration chip 2 liquid cooling heat exchange unit
21 baffle 22 spoiler fin
23 cold conducting plate 3 storage container
3a inlet and 3b outlet
3c liquid level 4 pumping device
5 heat sink 6 cooling air drive arrangement
7 circulating liquid path of heat absorption liquid mist scattering device 8
Liquid inlet of 9 bent water pipe 9a
9b liquid outlet
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
It should be noted that, in the following description, for clarity of explanation of the technical solution of the present invention, directional terms such as "outside", "inside", and the like are used according to the meaning of the directional terms normally used for components in an air-cooled circulating drinking liquid semiconductor refrigeration system, for example, a portion through which liquid passes is an inside, and a portion opposite to the inside is an outside.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, either internally or in any combination thereof. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1 and 2, the air-cooled circulating drinking liquid semiconductor refrigeration system of the invention comprises a semiconductor refrigeration chip 1, an air-cooled hot end radiator contacted with the hot end of the semiconductor refrigeration chip 1, a liquid-cooled heat exchange unit 2, a storage container 3 and a pumping device 4, wherein the cold end surface of the semiconductor refrigeration chip 1 is contacted with the liquid-cooled heat exchange unit 2, the storage container 3 and the pumping device 4 are connected in a liquid path to form a closed-loop circulating liquid path 8, a liquid movement track formed by the circulating liquid path 8 can guide the heat convection movement of liquid, and a local turbulence forming structure for forming local turbulence is arranged or formed.
The air-cooled circulating drinking liquid semiconductor refrigeration system can be applied to various electric appliances or equipment which need to cool liquid, such as a water dispenser, a fruit juice machine or a beverage machine and the like. In the working process of the refrigerating system of the invention, when the semiconductor refrigerating chip 1 passes through direct current, the heat of the cold end is transferred to the hot end, so that the temperature of the cold end is reduced, the temperature of the hot end is increased, and the cold end and the hot end of the semiconductor refrigerating chip 1 are formed, and the basis of whether the semiconductor refrigerating chip 1 can run for a long time is that good heat dissipation is required, which is a prerequisite condition for obtaining the lowest temperature of the cold end, therefore, in the air-cooled circulation drinking liquid semiconductor refrigerating system of the invention, the air-cooled hot end radiator contacted with the hot end of the semiconductor refrigerating chip 1 can quickly conduct the heat energy of the hot end of the semiconductor refrigerating chip 1 out, and the liquid-cooled heat exchange unit 2 connected with the cold end of the semiconductor refrigerating chip 1 can conduct the cold energy generated by the cold end of the semiconductor refrigerating chip 1 into a closed loop liquid path formed by connecting the liquid-cooled heat, therefore, the temperature difference between the hot end and the cold end of the semiconductor refrigeration chip 1 is always kept minimum. The semiconductor refrigeration chip 1 can achieve the maximization of refrigeration efficiency under the condition that the material is unchanged and the current is unchanged. Moreover, the liquid movement track formed by the circulating liquid path 8 of the refrigeration system can guide the heat convection movement of the liquid, and a local turbulence forming structure for forming local turbulence is arranged or formed, so that the heat convection movement of the liquid is greatly promoted, and the temperature diffusion is enhanced, so that the liquid cooling heat exchange unit 2 connected with the cold end of the semiconductor refrigeration chip 1 can conduct the cold energy generated at the cold end of the semiconductor refrigeration chip 1 into a closed loop liquid path formed by connecting the liquid cooling heat exchange unit 2, the storage container 3 and the pumping device 4, and the cold liquid (such as water, beverage or fruit juice) with relatively low temperature is obtained.
Furthermore, an inlet 3a and an outlet 3b are arranged on the storage container 3, a bent water pipe 9 is further arranged inside the storage container 3, and a liquid inlet 9a of the bent water pipe 9 is hermetically connected with the inlet 3 a. The arrangement structure of the bent water pipe 9 is a structure forming local turbulence, and the liquid outlet 9b of the bent water pipe 9 is positioned at the upper part in the storage container 3 so as to enable drinking liquid input into the storage container 3 to impact the liquid surface 3c by utilizing the height difference during the operation process, thereby forming the local turbulence. The liquid outlet 9b of the bent water pipe 9 has a height difference with the liquid level 3c, and the bent water pipe 9 has the advantages that drinking liquid in the bent water pipe 9 forms turbulent flow under the action of the height difference, liquid with lower temperature flowing out of the bent water pipe 9 is rapidly mixed with liquid with higher temperature in the storage container 3 under the action of local turbulent flow, the overall temperature of the liquid in the storage container 3 is rapidly reduced, the temperature of the liquid in the whole container is more uniform, and the phenomena that the temperature of the liquid in the upper half part of the storage container 3 is lower and the temperature of the liquid in the lower half part of the storage container 3 is higher can not occur. And the plurality of curved paths formed by the curved water pipes 9 from bottom to top in the storage container 3 can fully contact the curved water pipes 9 with the drinking liquid in the storage container 3, and the temperature of the drinking liquid in the storage container 3 is effectively reduced.
As shown in fig. 5, the liquid-cooled heat exchange unit 2 includes a cold guiding plate 23 and fins 22 protruding from the cold guiding plate 23 and serving as the local turbulence forming structure, and a channel for drinking liquid to pass through is formed between the fins 22.
As shown in fig. 3 and 4, a baffle 21 is disposed at an inlet of the liquid-cooling heat exchange unit 2, a plurality of shunting holes are disposed on the baffle 21, and the baffle 21 is a V-shaped baffle or an arc-shaped baffle. Through inciting somebody to action baffle 21 establishes to V-arrangement baffle or cowl for drink liquid from the import, can flow along baffle 21 dispersion after coming in, and flow into liquid cooling heat transfer unit 2 through the diffluent hole on baffle 21 in, make drink liquid can follow the surface of all directions homogeneous flow vortex fin 22, thereby improve heat exchange efficiency, avoid drinking liquid only along the import direction flow in liquid cooling heat transfer unit 2, and it is fast to lead to the liquid cooling heat transfer unit 2 interior middle part to drink the liquid velocity of flow, the marginal part is drunk the liquid velocity of flow slowly, it is unbalanced with the heat transfer of drinking liquid to arouse vortex fin 22, reduce heat exchange efficiency.
As shown in fig. 1, the air-cooled hot-end heat sink includes a heat sink 5 and a cooling air driving device 6 for cooling the heat sink 5, and a cooling air path is formed in the air-cooled hot-end heat sink. In order to better conduct heat, the hot end of the semiconductor refrigeration chip 1 needs to be attached to an air-cooled hot end radiator, and because the heat generated by the semiconductor refrigeration chip 1 is quickly conducted to the air-cooled hot end radiator, a cooling air path which can quickly conduct the heat to the air needs to be arranged inside the air-cooled hot end radiator, and the cooling air path can be in a grid form or a spiral form.
Further, the heat sink 5 may be heat-dissipating aluminum or heat-dissipating copper, and the cooling wind driving device 6 for cooling the heat sink may be a fan. The fan may be roughly divided into a circular shape and a square shape according to the shape of the fan, and the shape of the heat dissipation member 5 connected thereto is changed according to the shape change of the fan, so that the shapes of the two components are unified.
Of course, in order to achieve a better heat dissipation effect, the heat dissipation member 5 is provided with a plurality of heat dissipation teeth, which may be in the form of a grid, a circular sector, or a worm wheel.
Referring to fig. 2, as an optimized implementation form of the air-cooled hot-end radiator, a heat absorption liquid mist spreading device 7 can be arranged on a cooling air path of the air-cooled hot-end radiator, and the heat absorption liquid mist spreading device 7 is arranged on the cooling air path at a position before the cooling air enters a heat dissipation piece in the air-cooled hot-end radiator or on a section passing through the heat dissipation piece. The heat absorption liquid mist spreading device 7 is installed between the cooling air driving device 6 and the heat dissipation member 5, after the cooling air driving device 6 starts to work, heat energy generated by the hot end of the semiconductor refrigeration chip 1 is conducted to the heat dissipation member 5, the temperature of the heat dissipation member 5 rises, and when liquid mist generated by the heat absorption liquid mist spreading device 7 passes through the heat dissipation member 5 with the rising temperature, the liquid mist is vaporized by heat to take away the temperature on the heat dissipation member 5 and acts with the cooling air driving device 6 simultaneously, so that the heat energy generated by the hot end of the semiconductor refrigeration chip 1 is conducted more quickly, the efficiency is higher, and the refrigeration efficiency of the semiconductor refrigeration chip 1 is increased.
More specifically, the endothermic liquid mist diffusing means 7 is capable of spraying endothermic vaporized liquid mist.
As a specific embodiment, in fig. 1, a pumping device 4 is added at an outlet position of the liquid-cooled heat exchange unit 2 in the cold-end circulating liquid path 8 of the semiconductor refrigeration chip 1, and if the position of the pumping device 4 is changed, the pumping device 4 is installed at an inlet position of the liquid-cooled heat exchange unit 2, which also belongs to the protection scope of the present invention. The pumping device 4 can be directly installed at the position of the outlet or the inlet of the liquid cooling heat exchange unit 2 without a connecting pipeline, and forms an integrated module with the liquid cooling heat exchange unit 2, so that the integrated structure is simpler, and the installation is more convenient. However, no matter the pumping device 4 is installed at the inlet of the liquid cooling heat exchange unit 2 or at the outlet of the liquid cooling heat exchange unit 2, the pumping device 4 can make the liquid in the storage container form local turbulence, so that the mixing speed of the liquid with a lower temperature and the liquid with a higher temperature in the storage container can be increased, and meanwhile, the pumping device 4 can also rapidly convey the liquid water passing through the liquid cooling heat exchange unit 2 into the storage container to prevent the liquid temperature from rising back to some extent due to the overlong retention time of the liquid in the pipeline. Meanwhile, the outside of the storage container and the pipelines connecting the parts can be provided with heat-insulating layers, so that the liquid in the whole circulating liquid path 8 can be ensured to keep a specific temperature. In this air-cooled circulation drinking liquid semiconductor refrigeration system, the pumping device 4 mainly functions to change the natural convection mode of the liquid in the circulation liquid path 8 at the cold end of the semiconductor refrigeration chip 1 into a forced convection mode, wherein the heat exchange coefficient of the natural convection mode is as follows: 200-1000W/(square meter. per square inch ℃), and the heat transfer coefficient of the forced convection mode is as follows: 1000-15000W/(. square-meter. DEG C.), the heat exchange coefficient of the liquid is increased, so that the conduction efficiency of the liquid cooling heat exchange unit 2 is improved, and the cooling effect of the liquid is better.
In addition, the invention also provides refrigeration equipment which is provided with the air-cooled circulating drinking liquid semiconductor refrigeration system.
As can be seen from the above description, the advantages of the present invention are: according to the characteristics of the semiconductor refrigeration chip 1, an air-cooled hot end radiator composed of a radiating piece 5 and a cooling air driving device 6 is used for radiating the hot end of the semiconductor refrigeration chip 1, a liquid cooling heat exchange unit 2, a storage container 3 and a pumping device 4 are connected through liquid paths to form a liquid motion track formed by a closed-loop circulating liquid path 8 so as to guide the heat convection motion of liquid and form local turbulence, a local turbulence forming structure of a bent water pipe 9 in the storage container 3 is used for forming local turbulence to transfer cold energy generated by the cold end of the semiconductor refrigeration chip 1, and the minimum temperature difference between the hot end and the cold end of the semiconductor refrigeration chip 1 is ensured, so that the refrigeration efficiency of the semiconductor refrigeration chip 1 is increased under the condition that the current intensity and the semiconductor material are not changed, the energy is effectively saved, and the structure is simple, the cost is lower, and the realization is easier.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (9)
1. The utility model provides a liquid semiconductor refrigerating system is drunk in forced air cooling circulation, its characterized in that, including semiconductor refrigeration chip (1), with air-cooled hot junction radiator, liquid cooling heat transfer unit (2), storage container (3) and pumping installations (4) of the hot junction contact of this semiconductor refrigeration chip (1), the cold junction terminal surface of semiconductor refrigeration chip (1) with liquid cooling heat transfer unit (2) contact, liquid cooling heat transfer unit (2) storage container (3) with pumping installations (4) liquid way links to each other and forms closed loop's circulation liquid way (8), the liquid movement track that circulation liquid way (8) formed can guide the thermal convection motion of liquid, and is equipped with or is formed with the local turbulent flow formation structure that is used for forming local turbulent flow.
2. An air-cooled circulating drinking liquid semiconductor refrigeration system according to claim 1, wherein the storage container (3) is provided with an inlet (3a) and an outlet (3b), the storage container (3) is further provided with a bent water pipe (9) inside, and a liquid inlet (9a) of the bent water pipe (9) is hermetically connected with the inlet (3 a).
3. An air-cooled circulating drinking liquid semiconductor refrigeration system according to claim 2, characterized in that the arrangement of the bent water tube (9) forms a local turbulence creating structure, the outlet (9b) of the bent water tube (9) being located at an upper portion in the storage container (3) so as to enable the drinking liquid fed into the storage container (3) to impact the liquid surface (3c) with the height difference during operation, thereby creating the local turbulence.
4. The air-cooled circulating drinking liquid semiconductor refrigerating system according to claim 1, wherein a baffle (21) is arranged at an inlet of the liquid-cooled heat exchange unit (2), a plurality of shunting holes are formed in the baffle (21), and the baffle (21) is a V-shaped baffle or an arc-shaped baffle.
5. An air-cooled circulating drinking liquid semiconductor refrigeration system according to any one of claims 1 to 4, wherein the liquid-cooled heat exchange unit (2) comprises a cold guide plate (23) and flow disturbing fins (22) which are protrudingly arranged on the cold guide plate (23) and used as the local turbulence forming structure, and channels for drinking liquid to pass are formed between the flow disturbing fins (22).
6. An air-cooled circulating drinking liquid semiconductor refrigeration system according to any one of claims 1 to 4, wherein the air-cooled hot-end heat radiator comprises a heat radiating member (5) and a cooling air driving device (6) for cooling the heat radiating member (5), and a cooling air path is formed in the air-cooled hot-end heat radiator.
7. An air-cooled circulating drinking liquid semiconductor refrigeration system according to claim 6, wherein a heat absorbing liquid mist diffusing device (7) is provided on a cooling air path in the air-cooled hot-end radiator, and the heat absorbing liquid mist diffusing device (7) is provided on the cooling air path at a position before the cooling air enters a heat sink in the air-cooled hot-end radiator or on a section passing through the heat sink.
8. An air-cooled circulating drinking liquid semiconductor refrigeration system according to claim 7, wherein the heat-absorbing liquid mist diffusing device (7) is capable of spraying heat-absorbing vaporized liquid mist.
9. A refrigeration appliance, wherein the refrigeration appliance is an air-cooled recirculating potable liquid semiconductor refrigeration system according to any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910130504.8A CN111595101A (en) | 2019-02-21 | 2019-02-21 | Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910130504.8A CN111595101A (en) | 2019-02-21 | 2019-02-21 | Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment |
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| CN111595101A true CN111595101A (en) | 2020-08-28 |
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| CN201910130504.8A Pending CN111595101A (en) | 2019-02-21 | 2019-02-21 | Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment |
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| CN104633901A (en) * | 2015-02-13 | 2015-05-20 | 华为技术有限公司 | Device for handling condensate water and thermoelectric cooling semiconductor air conditioner |
| CN106073494A (en) * | 2016-05-27 | 2016-11-09 | 南珀湾（杭州）饮水设备有限公司 | The energy-conservation instant-heating water drinking machine of undercounter |
| CN106595356A (en) * | 2015-10-15 | 2017-04-26 | 中国石油化工股份有限公司 | Self-cleaning type fluidized bed heat exchanger |
| CN207456231U (en) * | 2016-11-17 | 2018-06-05 | 郑州网知汇信息科技有限公司 | A kind of new micro-channel heat exchanger |
| CN108131862A (en) * | 2018-01-02 | 2018-06-08 | 湘潭大学 | A kind of high miniature thermoelectric refrigerator of security performance |
| CN207868348U (en) * | 2018-03-01 | 2018-09-14 | 嘉兴泽通新能源科技有限公司 | The adaptive cooled plate of battery |
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| CN104596089A (en) * | 2013-10-30 | 2015-05-06 | 山东建筑大学 | Waste heat recovery type boiled drinking water electric heater |
| CN104633901A (en) * | 2015-02-13 | 2015-05-20 | 华为技术有限公司 | Device for handling condensate water and thermoelectric cooling semiconductor air conditioner |
| CN106595356A (en) * | 2015-10-15 | 2017-04-26 | 中国石油化工股份有限公司 | Self-cleaning type fluidized bed heat exchanger |
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| CN108131862A (en) * | 2018-01-02 | 2018-06-08 | 湘潭大学 | A kind of high miniature thermoelectric refrigerator of security performance |
| CN207868348U (en) * | 2018-03-01 | 2018-09-14 | 嘉兴泽通新能源科技有限公司 | The adaptive cooled plate of battery |
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