CN111567155B - Heat radiator - Google Patents

Abstract

The heat sink (1) includes a base (3), a gap securing member (5), a heat sink (7), and an upper metal plate (9). The fins (7) each have a width (W) in the X direction, and extend in the Z direction to have a length (H). The fins (7) each have a first end portion (7a) and a second end portion (7b) opposed to each other at a distance (H) from each other. The first end portion (7a) of the heat sink (7) is fixed to the base portion (3), and the second end portion (7b) side is defined as the open end side. The upper metal plate (9) is connected to the heat sink (7) in such a manner that the second end (7b) of one heat sink (7) is connected to the second end (7b) of the other heat sink (7). The second end (7b). The upper metal plate (9) extends in the Y direction.

Description

heat sink

technical field

The present invention relates to a heat sink, in particular to a heat sink provided with cooling fins.

Background technique

In recent years, with the significant increase in density or frequency of electronic equipment, electronic components such as large-scale integrated circuits (LSI: Large-Scale Integration) represented by central processing units (CPU: Central Processing Unit, central processing unit) Among them, heat generated from electronic components becomes a concern at the time of design. In order to dissipate heat generated from electronic components, a heat sink is fully utilized.

The generated heat can be dissipated by the heat sink. On the other hand, the heat sink may electrically resonate at a frequency of a wavelength due to the length of the fins that dissipate the heat. In the past, the frequency of the clock signal of the system has limited electrical impact on the heat sink.

However, in recent systems, multiple clock signals and higher frequencies have been developed, and heat sinks operate as radiation sources of electromagnetic noise. That is, the noise of the printed board may be conducted to the heat sink, or the noise may be superimposed on the heat sink due to the coupling of parts or wiring on the printed board and the heat sink, and the heat sink acts as an antenna to radiate the noise twice, thereby generating System malfunction.

In addition, the radiator may not only operate as a noise radiation source, but also may operate as a good noise receiving antenna. Therefore, standard values of various EMC (Electro-Magnetic Compatibility, electromagnetic compatibility) certification tests may not be satisfied. Therefore, in the design of the heat sink, not only securing the heat dissipation performance which is the original purpose, but also a design in consideration of electromagnetic noise is required, and various proposals have been made.

For example, in Patent Document 1, a heat sink is proposed so that the length of the heat sink does not coincide with the length of 1/2 wavelength of the signal frequency of the system or the higher harmonic frequency of the signal frequency. . In addition, Patent Document 2 proposes a heat sink including fins for dispersing resonance frequencies.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2000-156578 (Japanese Patent No. 3008942)

Patent Document 2: Japanese Patent Laid-Open No. 2000-305273

Contents of the invention

As described above, in recent systems, operations are performed using a large number of clock signals. In addition, data is transmitted and received based on the basic frequency of various digital I/F (Inter Face, interface). Therefore, it becomes difficult to design the length of the heat sink so as not to match the frequency of a reference signal such as a clock signal or its harmonic frequency.

Specifically, when the length of the heat sink is short, the heat dissipation performance which is the original purpose of the heat sink may be impaired. On the other hand, when the length of the heat sink becomes longer, it may be necessary to redesign the housing, for example. Therefore, in the heat sink proposed in Patent Document 1, when it is desired to achieve both the securing of heat dissipation and the reduction of electromagnetic noise, design constraints are expected to increase, making it difficult to design with a high degree of freedom.

On the other hand, in the heat sink proposed in Patent Document 2, heat sinks having different design lengths and metal materials are required, so that design and manufacture of the heat sink are expected to become complicated.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a heat sink that achieves a degree of freedom in design and reduces electromagnetic noise.

The heat sink of the present invention has a base and a plurality of fins. The base is mounted on the printed circuit board, and is electrically connected to any one of the signal ground potential, the frame ground potential, and the ground of the printed circuit board. A plurality of cooling fins are arranged on the base at intervals, and are electrically connected to the base. A part of one of the plurality of heat sinks is electrically connected to a part of the other heat sink through a conductive member at an open end side opposite to the side attached to the base of the plurality of heat sinks.

According to the heat sink of the present invention, on the open end side of the plurality of fins, a part of one of the plurality of fins is electrically connected to a part of the other fin through the conductive member. Accordingly, in the heat sink, the impedance of the open end sides of the plurality of heat sinks can be reduced, and electromagnetic noise can be returned to any one of the signal ground potential, the frame ground potential, and the ground line of the printed circuit board. As a result, the heat sink is not restricted by the wavelength of electromagnetic waves, and is not restricted by the material of the heat sink, so that the degree of freedom in design can be realized and the intensity of electromagnetic noise can be reduced.

Description of drawings

1 is a perspective view showing an example of a state where a heat sink according to Embodiment 1 of the present invention is mounted on a printed circuit board.

FIG. 2 is a side view showing an example of a state in which a heat sink is mounted on a printed circuit board in this embodiment.

Fig. 3 is a partially enlarged perspective view showing a connection form of a heat sink and an upper metal plate in the embodiment.

4 is a perspective view showing a state in which a heat sink of a comparative example is mounted on a printed circuit board.

5 is a perspective view showing an example of a state where a heat sink according to Embodiment 2 of the present invention is mounted on a printed circuit board.

6 is a perspective view showing an example of a state in which a heat sink according to a first example of Embodiment 3 of the present invention is mounted on a printed circuit board.

Fig. 7 is a partial enlarged perspective view of the heat sink in this embodiment.

FIG. 8 is a partially enlarged perspective view showing a connection form of a heat sink and a protrusion in this embodiment.

9 is a perspective view showing an example of a state where a heat sink according to a second example of Embodiment 3 of the present invention is mounted on a printed circuit board.

FIG. 10 is a partially enlarged perspective view showing a connection form of a heat sink and a protrusion in this embodiment.

11 is a perspective view showing an example of a state where a heat sink according to Embodiment 4 of the present invention is mounted on a printed circuit board.

FIG. 12 is an enlarged perspective view showing an example of a connection member in this embodiment.

Fig. 13 is an enlarged perspective view showing another example of the connection member in this embodiment.

14 is a perspective view showing an example of a state where a heat sink according to Embodiment 5 of the present invention is mounted on a printed circuit board.

(Description of Reference Signs)

1: radiator; 3: base; 5: gap securing member; 7: fin; 7a: first end; 7b: second end; 7bb: upper end; 7c: third end; 7d: fourth End; 9; 11: upper metal plate; 13, 15: protrusion; 13a, 15a: bridging portion; 13b, 15b: opening; 13c, 15c: engaging portion; 17: connecting member; 17a: bridging 17b: engagement portion; 19: side metal plate; 51: printed circuit board; 53: heat radiation member; 55: ground wiring.

Detailed ways

Implementation mode 1.

The radiator of Embodiment 1 will be described.

As shown in FIGS. 1 and 2 , the heat sink 1 is mounted on, for example, a printed circuit board 51 . Electronic components 53 are mounted on the printed circuit board 51 . The heat sink 1 is configured to be in contact with the electronic component 53 . Heat generated from electronic components 53 such as large-scale integrated circuits is dissipated via heat sink 1 . The structure of this heat sink 1 is demonstrated in detail.

The heat sink 1 includes a base 3 , a gap ensuring member 5 , a plurality of fins 7 , and an upper metal plate 9 as a conductive member. The base 3 is flat and has a certain thickness. The gap securing member 5 secures a space between the base 3 and the printed circuit board 51 so that the base 3 contacts or approaches the electronic component 53 . In addition, when the metallic gap ensuring member 5 cannot be used, a conductive member such as a screw, an on-board contact, or a spacer may be provided separately so that the base 3 and the printed circuit board 51 are electrically connected. connect.

Each of the plurality of fins 7 has a width W in the X direction and a length H extending in the Z direction. The plurality of fins 7 each have a first end portion 7a and a second end portion 7b opposed to each other with a length H therebetween. The plurality of cooling fins 7 are arranged on the base 3 at intervals from each other in the Y direction. The first end portion 7 a of the fin 7 is fixed to the base portion 3 . The second end portion 7b side of the fin 7 is an open end side.

The plurality of fins 7 are formed of the same metal material having high thermal conductivity and high electrical conductivity. In addition, the plurality of fins 7 are preferably formed with the same size. In addition, the same size does not mean completely the same, and includes manufacturing errors. The heat sink 7 is preferably formed of, for example, aluminum, aluminum alloy, or copper.

The upper metal plate 9 is connected to the second end portions 7b of the plurality of fins 7 so that the second end portion 7b of one fin 7 adjacent to each other is connected to the second end portion 7b of the other fin 7 . The upper metal plate 9 extends in the Y direction. In addition, even when one heat sink 7 and the other heat sink 7 are not adjacent to each other, as a whole of the plurality of heat sinks 7 , the open end sides need only be electrically connected via the upper metal plate 9 .

Like the heat sink 7, the base 3, the gap ensuring member 5, and the upper metal plate 9 are preferably formed of a metal material with high thermal conductivity and high electrical conductivity, such as aluminum, aluminum alloy, or copper.

Open end sides of the plurality of fins 7 are electrically connected by an upper metal plate 9 . On the open end side of the heat sink 7, the upper metal plate 9 needs to be connected at least at one point. In order to reduce the impedance of the heat sink 7 , it is preferable to connect multiple parts of the heat sink 7 through the upper metal plate 9 . In addition, as will be described later, it is also preferable to increase the width of the upper metal plate 9 . Here, as shown in FIG. 3, the two upper metal plates 9 are connected to the end surface 7bb of the 2nd end part 7b.

The upper metal plate 9 is connected to the second end portion 7b of the heat sink 7 by, for example, welding or a conductive adhesive. Alternatively, the upper metal plate 9 and the cooling fins 7 may be formed by integral molding.

The plurality of heat sinks 7 are electrically connected to, for example, ground wiring 55 formed on the printed circuit board 51 via the base 3 and the gap ensuring member 5 . The base 3 (gap ensuring member 5 ) and the ground wiring 55 need to be connected at least at one point. In order to reduce the impedance of the heat sink 1 with respect to the ground potential (ground line) of the ground wiring 55, the base 3 and the ground wiring 55 are preferably connected at multiple locations.

In addition, in each embodiment, the case where the plurality of cooling fins 7 are electrically connected to the ground wiring 55 (ground line) is described as an example, but the plurality of cooling fins 7 may be electrically connected to the ground potential. The ground potential differs depending on the ground design of the system on which the heat sink is installed, and includes signal ground potential, frame ground potential, and ground wire. The signal ground potential refers to a ground potential serving as a reference for a circuit. The frame ground potential refers to the ground potential of the frame including the heat sink 1 . Therefore, the plurality of heat sinks 7 may be electrically connected to any one of the signal ground potential, the frame ground potential, and the ground.

In the heat sink 1 described above, the open end sides of the plurality of fins 7 are electrically connected by the upper metal plate 9 . Thereby, the intensity of electromagnetic noise can be reduced. This case will be described in comparison with a heat sink of a comparative example.

In FIG. 4 , a general heat sink 1 in which no upper metal plate is arranged is shown as a heat sink of a comparative example. Here, the length in the Z direction of the heat sink 1 of the comparative example is H, and the wavelength of the electromagnetic wave is λ. Then, the heat sink 1 (plurality of fins 7 ) is considered to be equivalent to a λ/4 monopole antenna resonating at a frequency corresponding to λ=4L and odd multiples thereof. Electromagnetic noise having a high spectral intensity at the frequency corresponding to the wavelength and its higher harmonic frequency is radiated from the heat sink 7 .

In contrast to the comparative example, in the heat sink 1 according to Embodiment 1, the open end sides of the plurality of fins 7 are electrically connected by the upper metal plate 9 . In addition, the plurality of heat sinks 7 are electrically connected to the ground wiring 55 of the printed circuit board 51 via the base 3 and the gap ensuring member 5 .

Therefore, in the heat sink 1 , the impedance on the open end side of the plurality of fins 7 can be reduced. Furthermore, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground via the base 3 and the gap ensuring member 5 .

Thereby, even if the length H of the heat sink 7 has a dimensional relationship equivalent to that of a λ/4 monopole antenna, radiation of electromagnetic noise can be suppressed and the intensity of electromagnetic noise can be reduced. That is, the heat sink 1 is not restricted by the wavelength of electromagnetic waves, and is not restricted by the material of the heat sink 7 , so that the degree of freedom in design can be realized and the intensity of electromagnetic noise can be reduced.

In addition, when forced air cooling is performed in the heat sink 1 of the comparative example, it is assumed that a fan (not shown) is arranged to face the cooling fins 7 . In this case, the heat sink 7 may vibrate due to the flow of air generated by the fan, and this vibration is transmitted to the electronic component via the printed circuit board.

In contrast to the comparative example, in the heat sink 1 of Embodiment 1, the open end sides of the plurality of fins 7 are electrically and physically connected by the upper metal plate 9 . Thereby, even if the flow of air is generated by a fan (not shown), vibration of the heat sink 7 can be suppressed as a secondary effect of the upper metal plate 9 .

Implementation mode 2.

A heat sink according to Embodiment 2 will be described.

As shown in FIG. 5 , a wide upper metal plate 11 is arranged on the heat sink 1 as a conductive member. In such a manner that the second end portion 7b of one adjacent heat sink 7 is connected to the second end portion 7b of the other heat sink 7, it is horizontal from one end of the second end portion 7b of the heat sink 7 in the X direction. The upper metal plate 11 is arranged so as to straddle to the other end and close the gap between one fin 7 and the other fin 7 on the open end side.

The upper metal plate 11 is connected to the second end portion 7b of the heat sink 7 by, for example, welding or a conductive adhesive. In addition, the upper metal plate 11 may be integrally formed together with the base 3 and the heat sink 7 . In addition, since the structure other than this is the same as the structure of the heat sink 1 shown in FIG.

In the heat sink 1 described above, the wide upper metal plate 11 is arranged so as to span from one end to the other end in the X direction of the second end portion 7 b of the heat sink 7 and close the open end side. Therefore, the impedance on the open end side of the heat sink 7 can be further reduced compared to the narrow upper metal plate 9 ( FIG. 1 and the like). In addition, as described above, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground via the base 3 and the gap ensuring member 5 .

Accordingly, even if the length H of the heat sink 7 is equivalent to that of a λ/4 monopole antenna, radiation of electromagnetic noise can be reliably suppressed and the intensity of electromagnetic noise can be reduced.

That is, in the heat sink 1 of Embodiment 2, there is no restriction on the wavelength of electromagnetic waves, and there is no restriction on the material of the heat sink 7, so that the degree of freedom in design can be realized and the intensity of electromagnetic noise can be reduced.

In addition, like the heat sink 1 of the first embodiment, in the heat sink 1 of the second embodiment, the open end sides of the plurality of fins 7 are electrically and physically connected by the upper metal plate 11 . Thereby, even if the flow of air is generated by a fan (not shown), vibration of the heat sink 7 can be suppressed as a secondary effect by the upper metal plate 11 .

Implementation mode 3.

(1st case)

A first example of the heat sink according to Embodiment 3 will be described.

As shown in FIG. 6 , as a conductive member, a protrusion 13 having a relatively narrow width is arranged on the heat sink 1 . As shown in FIG. 7, the protrusion part 13 is provided in the 2nd end part 7b of the heat sink 7 so that it may protrude in a Y direction. For example, the protrusion part 13 is provided with the bridging part 13a, the opening part 13b, and the engaging part 13c.

As shown in FIG. 8 , the bridging portion 13 a is arranged to bridge between one heat sink 7 and another heat sink 7 adjacent to each other. By inserting the engaging portion 13c of the protrusion 13 of one heat sink 7 into the opening 13b of the protrusion 13 of the other heat sink 7, the protrusions 13 are caulked together, and one heat sink and the other heat sink engage with each other. Hereinafter, similarly, the open end sides of the plurality of cooling fins 7 are engaged with each other. In addition, since the structure other than this is the same as the structure of the heat sink 1 shown in FIG.

In the heat sink 1 described above, the open end sides of the plurality of fins 7 are engaged with each other by the protrusions 13 having a relatively narrow width. Therefore, the impedance on the open end side of the heat sink 7 can be reduced. In addition, as described in Embodiment 1, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground via the base 3 and the gap ensuring member 5 .

Accordingly, even if the length H of the heat sink 7 is equivalent to that of a λ/4 monopole antenna, radiation of electromagnetic noise can be suppressed and the intensity of electromagnetic noise can be reduced.

That is, in the heat sink 1 of the first example of the third embodiment, there is no restriction on the wavelength of electromagnetic waves, and there is no restriction on the material of the heat sink 7, so that the degree of freedom in design can be realized and the intensity of electromagnetic noise can be reduced. .

In addition, similar to the heat sink 1 of the first embodiment, in the heat sink 1 of the first example of the third embodiment, the open end sides of the plurality of fins 7 are electrically and physically connected by the protrusions 13 . Thereby, even if the flow of air is generated by a fan (not shown), the vibration of the cooling fin 7 can be suppressed as a subsidiary effect of the protrusion 13 .

In addition, in the above-mentioned heat sink 1, the case where two protrusions 13 are provided at a distance from each other in the X direction is taken as an example, but as the protrusions 13, at least one protrusion is provided at a desired position in the X direction. 1 will do.

(case 2)

A second example of the heat sink according to Embodiment 3 will be described.

As shown in FIG. 9 , as a conductive member, a protrusion 15 having a relatively wide width is arranged on the heat sink 1 . As shown in FIG. 10, the protrusion part 15 is provided in the 2nd end part 7b of the heat sink 7 so that it may protrude in a Y direction. For example, the protrusion part 15 is provided with the bridging part 15a, the opening part 15b, and the engaging part 15c.

The bridging portion 15 a is arranged to bridge between one heat sink 7 and the other heat sink 7 adjacent to each other. The bridging portion 15a is arranged to span from one end to the other end in the X direction of the second end portion 7b of the fin 7 and to close a gap between one fin 7 and the other fin 7 on the open end side.

By inserting the engaging portion 15c of the protrusion 15 of one heat sink 7 into the opening 15b of the protrusion 15 of the other heat sink 7, the protrusions 15 are caulked together, and one heat sink and the other heat sink engage with each other. Hereinafter, similarly, the open end sides of the plurality of cooling fins 7 are engaged with each other. In addition, since the structure other than this is the same as the structure of the heat sink 1 shown in FIG.

In the heat sink 1 described above, the open end sides of the plurality of fins 7 are engaged with each other so that the open end sides of the plurality of fins 7 are closed by the relatively wide protrusions 15 . Thereby, the impedance of the open end side of the heat sink 7 can be further reduced. In addition, as described in Embodiment 1, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground via the base 3 and the gap ensuring member 5 .

Accordingly, even if the length H of the heat sink 7 is equivalent to that of a λ/4 monopole antenna, radiation of electromagnetic noise can be reliably suppressed and the intensity of electromagnetic noise can be reduced.

That is, in the heat sink 1 of the second example of the third embodiment, there is no restriction on the wavelength of electromagnetic waves, and there is no restriction on the material of the heat sink 7, so that the degree of freedom in design can be realized and the intensity of electromagnetic noise can be reduced. .

In addition, similarly to the heat sink 1 of the first embodiment, in the heat sink 1 of the second example of the third embodiment, the open end sides of the plurality of fins 7 are electrically and physically connected by the protrusions 13 . Thereby, even if the flow of air is generated by a fan (not shown), the vibration of the cooling fin 7 can be suppressed as a subsidiary effect of the protrusion 13 .

Implementation mode 4.

A heat sink according to Embodiment 4 will be described.

As shown in FIG. 11 , connecting member 17 is arranged on heat sink 1 as a conductive member. An example of the connection member 17 is shown in FIG. 12 . The connecting member 17 shown in FIG. 12 is provided with a bridging portion 17a, an engaging portion 17b, and an engaging portion 17c.

As shown in FIG. 11 and FIG. 12 , the connecting member 17 is disposed so as to bridge between one heat sink 7 and another heat sink 7 adjacent to each other. The bridging portion 17 a is arranged to bridge between one heat sink 7 and the other heat sink 7 . The engaging portion 17 b engages with one heat sink 7 , and the engaging portion 17 c engages with the other heat sink 7 .

The plurality of connection members 17 are arranged at positions in the X direction where they do not interfere with each other. In addition, since the structure other than this is the same as the structure of the heat sink 1 shown in FIG.

In the heat sink 1 described above, the open end sides of the plurality of fins 7 are engaged with each other by the connecting member 17 . Therefore, the impedance on the open end side of the heat sink 7 can be further reduced. In addition, as described above, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground via the base 3 and the gap ensuring member 5 .

Accordingly, even if the length H of the heat sink 7 is equivalent to that of a λ/4 monopole antenna, radiation of electromagnetic noise can be reliably suppressed and the intensity of electromagnetic noise can be reduced.

That is, in the heat sink 1 according to Embodiment 4, there is no restriction on the wavelength of electromagnetic waves, and there is no restriction on the material of the heat sink 7, so that the degree of freedom in design can be realized and the intensity of electromagnetic noise can be reduced.

In addition, like the heat sink 1 of Embodiment 1, in the heat sink 1 of Embodiment 4, the open end sides of the plurality of fins 7 are electrically and physically connected by the protrusions 13 . Thereby, even if air flow is generated by a fan (not shown), the vibration of the cooling fin 7 can be suppressed as a subsidiary effect of the connection member 17 .

In addition, as the connection member 17, other than the connection member 17 shown in FIG. 12, the connection member 17 in which the engaging part 17b and the engaging part 17c are symmetrically arrange|positioned, for example as shown in FIG.

Implementation mode 5.

A heat sink according to Embodiment 5 will be described.

As shown in FIG. 14 , a pair of side metal plates 19 are arranged on the heat sink 1 as conductive members. The plurality of fins 7 each have a third end portion 7c and a fourth end portion 7d opposed to each other with a width W therebetween. One side metal plate 19 of the pair of side metal plates 19 is disposed on a portion on the open end side of each of the third end portions 7 c of the plurality of fins 7 . The other side metal plate 19 is arrange|positioned at the part located in the open end side of each 4th end part 7d of several heat sink 7. As shown in FIG.

Here, one side metal plate 19 is arranged from a portion of the third end portion 7c connected to the second end portion 7b with a desired width toward the first end portion 7a side. The other side metal plate 19 is also disposed toward the first end portion 7a side with a desired width from the portion connected to the second end portion 7b of the fourth end portion 7d. The side metal plate 19 is connected to the third end portion 7c and the fourth end portion 7d of the heat sink 7 by, for example, welding or a conductive adhesive. In addition, since the structure other than this is the same as the structure of the heat sink 1 shown in FIG.

In the heat sink 1 described above, the third end portion 7 c and the fourth end portion 7 d of the plurality of fins 7 are electrically connected through the side metal plate 19 . Therefore, the impedance on the open end side of the heat sink 7 can be reduced. In addition, as described above, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground via the base 3 and the gap ensuring member 5 .

Accordingly, even if the length H of the heat sink 7 is equivalent to that of a λ/4 monopole antenna, radiation of electromagnetic noise can be reliably suppressed and the intensity of electromagnetic noise can be reduced.

That is, in the heat sink 1 of Embodiment 5, there is no restriction on the wavelength of electromagnetic waves, and there is no restriction on the material of the heat sink 7, so that the degree of freedom in design can be realized, and the intensity of electromagnetic noise can be reduced.

Since the side metal plate 19 is a substitute for the upper metal plates 9, 11, etc., the positions where the side metal plate 19 is disposed are preferably above the third end 7c and the fourth end 7d of the heat sink 7, respectively.

From the viewpoint of reducing the impedance of the heat sink 7, it is considered that the effect of reducing electromagnetic noise can be obtained even if the side metal plate 19 is disposed at the center of each of the third end portion 7c and the fourth end portion 7d of the heat sink 7. Therefore, the position where the side metal plate 19 is arranged is preferably within the range from the center portion to the upper end portion of each of the third end portion 7 c and the fourth end portion 7 d of the heat sink 7 .

In addition, similarly to the heat sink 1 of Embodiment 1, in the heat sink 1 of Embodiment 5, the open end sides of the plurality of fins 7 are electrically and physically connected by the side metal plate 19 . Thereby, even if air flow is generated by a fan (not shown), the vibration of the heat sink 7 can be suppressed as a secondary effect by the side metal plate 19 .

In addition, in each embodiment, as a conductive member, a plate-shaped member is mainly taken as an example and described, but as long as a plurality of heat sinks can be electrically connected, it is not limited to a plate-shaped member, for example, may be It is a conductive strip-shaped member.

Various combinations are possible as necessary regarding the heat sink 1 including the upper metal plate and the like as the conductive member described in each embodiment.

Embodiment disclosed this time is an illustration, and is not limited to this. The present invention is shown not by the range described above but by the claims, and it is intended that all changes within the meanings and ranges equivalent to the claims are included.

Industrial availability

The present invention is effectively used for a heat sink provided with a plurality of fins.

Claims (4)

1. A heat sink, having:

a base portion mounted on a printed circuit board and electrically connected to any one of a signal ground potential, a frame ground potential, and a ground of the printed circuit board; and

a plurality of heat dissipation fins disposed at the base portion at intervals from each other and electrically connected to the base portion,

a part of one of the plurality of heat dissipating fins and a part of another heat dissipating fin are electrically connected to each other through a conductive member at an open end side of the plurality of heat dissipating fins opposite to the side attached to the base,

a plurality of the heat dissipating fins each having a width in a 1 st direction and extending in a 2 nd direction intersecting the 1 st direction,

a plurality of the heat dissipation fins are arranged on the base portion at intervals in a 3 rd direction intersecting the 1 st direction and the 2 nd direction,

the plurality of heat dissipation fins each have:

a 1 st end portion attached to the base portion; and

a 2 nd end portion located on the open end side and opposed to the 1 st end portion with a distance therebetween in the 2 nd direction,

the 2 nd end portion of the one heat radiation fin and the 2 nd end portion of the other heat radiation fin are electrically connected through the conductive member,

the conductive member includes:

a 1 st protrusion provided on the 2 nd end of the one heat radiation fin so as to protrude in the 3 rd direction, and engaging with the other heat radiation fin; and

a 2 nd protrusion provided at the 2 nd end of the other heat radiation fin so as to protrude in the 3 rd direction, and engaging with another heat radiation fin adjacent to the other heat radiation fin,

the 1 st projection is provided with a bridging part, an opening part and an engaging part,

the 2 nd protrusion is provided with a bridge portion, an opening portion, and an engaging portion,

the bridge is configured to bridge between the one and the other heat sinks that are adjacent to each other,

in a state where the one heat radiation fin and the another heat radiation fin are arranged at the base portion, the engaging portion of the 1 st projecting portion is inserted into the opening portion of the 2 nd projecting portion and the one heat radiation fin and the another heat radiation fin are engaged with each other,

the width of the 1 st projecting portion in the 1 st direction is shorter than the width of the one heat dissipating fin in the 1 st direction,

the width of the 2 nd protrusion in the 1 st direction is shorter than the width of the other heat dissipating fin in the 1 st direction,

two of the 1 st protrusions are disposed on the one heat dissipation fin at a distance in the 1 st direction.

2. The heat sink of claim 1,

the heat sink includes a space holding member attached to the base portion and holding a space between the base portion and the printed circuit board,

the plurality of heat dissipation fins are electrically connected to any one of the signal ground potential, the frame ground potential, and the ground line of the printed circuit board via the base portion and the spacer.

3. The heat sink according to claim 1,

a plurality of the heat dissipation fins are formed of the same material.

4. The heat sink according to claim 1,

the plurality of radiating fins have the same size.

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