CN111564457A - Array substrate and preparation method thereof, and display panel - Google Patents

Abstract

The invention relates to an array substrate, a preparation method thereof and a display panel. And transmitting a signal of a part of the first conductive layer opposite to the metal wire layer to another part of the first conductive layer opposite to the side wall of the through hole by using the second conductive layer. When the first conducting layer generates cracks at the included angle between the surface of the metal wire layer and the side wall of the through hole, signals of the metal wire layer can still be transmitted through the first conducting layer, the increase of lap joint impedance is avoided, and the abnormal touch phenomenon is avoided.

Description

Array substrate and preparation method thereof, and display panel

technical field

The present invention relates to the field of display technology, in particular to an array substrate, a preparation method thereof, and a display panel.

Background technique

The display device can convert the data of the computer into various characters, numbers, symbols or intuitive images for display, and can use input tools such as keyboards to input commands or data into the computer, and add, delete, and change the display at any time with the help of the hardware and software of the system. content. Display devices are classified into plasma, liquid crystal, light emitting diode, and cathode ray tube types according to the display device used.

TFT (Thin Film Transistor) is an abbreviation for Thin Film Transistor. TFT display is the mainstream display device on various laptops and desktops. Each liquid crystal pixel on this type of display is driven by a thin film transistor integrated behind the pixel, so TFT display is also a type of display. Active matrix liquid crystal display device. The TFT-type display is one of the best LCD color displays. The TFT-type display has the advantages of high responsivity, high brightness, and high contrast, and its display effect is close to that of the CRT-type display.

The TFT substrate of high-resolution products is densely traced in the fanout area near the IC, including signal lines for TP touch control. In order to transmit the signal of the metal line layer to the common electrode through the first conductive layer, we need to set a through hole on the flat layer.

As shown in FIG. 1, in the conventional design of the through hole 7, the first conductive layer 4 is lapped onto the metal wire layer 2 through the through hole 7. Since the material of the first conductive layer 4 is ITO, and ITO is a hard film , the angle between the surface of the metal wire layer 2 and the side wall of the through hole 7 is approximately a right angle, and the first conductive layer 4 is prone to cracks 9 at this angle, thereby increasing the lap resistance, resulting in the signal of the metal wire layer 2 cannot be It is transmitted to the common electrode through the first conductive layer 4 , thereby causing abnormal touch phenomenon. In the prior art, it is difficult to detect cracks 9 in the first conductive layer 4 at the included angle between the surface of the metal wire layer 2 and the sidewall of the through hole, and it is not even discovered until the whole machine is in the state, and the loss is heavy. Therefore, it is necessary to seek a new type of array substrate to solve the above problems.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an array substrate, a preparation method thereof, and a display panel, which can solve the problem that the first conductive layer existing in the existing array substrate is prone to cracks at the angle between the surface of the metal wire layer and the sidewall of the through hole. , thereby increasing the lap resistance, so that the signal of the metal wire layer cannot be transmitted to the common electrode through the first conductive layer, thereby causing problems such as abnormal touch.

In order to solve the above problems, the present invention provides an array substrate, which includes: a base; a metal wire layer, disposed on the base; a flat layer, disposed on the metal wire layer and the base; The flat layer is arranged opposite to the metal wire layer; the first conductive layer is arranged on the flat layer, extends into the through hole, is attached to the sidewall of the through hole, and is connected to the metal wire layer; a passivation layer, disposed on the first conductive layer, and extending into the through hole; a via hole, penetrating the passivation layer, and connected to the sidewall of the through hole and/or the metal wire layers are oppositely arranged; and a second conductive layer is arranged in the via hole, connected to a part of the first conductive layer opposite to the metal wire layer, and connected to the first conductive layer Another part of a conductive layer opposite to the sidewall of the through hole.

Further, the number of the via holes is more than two; one via hole is arranged opposite to the metal line layer; the other via hole is arranged opposite to the side wall of the through hole.

Further, the second conductive layer is connected to the first conductive layer through one via hole, and is connected to the first conductive layer through another via hole.

Further, the via hole is disposed opposite to the sidewall of the through hole and the metal line layer.

Further, the second conductive layer is disposed in the via hole, attached to the first conductive layer, and extends from the hole wall on one side of the via hole to the hole wall on the other side.

In order to solve the above problems, the present invention also provides a method for preparing an array substrate, which includes the following steps: providing a substrate; preparing a metal wire layer on the substrate; preparing a flat layer on the metal wire layer and the substrate A through hole is formed through the flat layer, and the through hole is arranged opposite to the metal line layer; a first conductive layer is prepared on the flat layer, and the first conductive layer extends to the through hole inside, attached to the sidewall of the through hole, and connected to the metal wire layer; a passivation layer is prepared on the first conductive layer, and the first conductive layer extends into the through hole forming a via hole through the passivation layer, and the via hole is disposed opposite to the sidewall of the via hole and/or the metal wire layer; and preparing a second conductive layer in the via hole, the The second conductive layer is connected to a portion of the first conductive layer opposite to the metal wire layer, and is connected to another portion of the first conductive layer opposite to the sidewall of the through hole.

Further, in the step of forming a via hole through the passivation layer, and the via hole is disposed opposite to the sidewall of the through hole and/or the metal wire layer, the step includes: forming two holes through the passivation layer. There are more than one via hole; one via hole is arranged opposite to the metal line layer; the other via hole is arranged opposite to the side wall of the through hole.

Further, in the step of forming a via hole through the passivation layer, and the via hole and the sidewall of the via hole and/or the metal wire layer are disposed opposite to each other, the via hole and the through hole are The sidewalls and the metal wire layer are arranged opposite to each other.

Further, the through holes and the via holes are formed by etching.

In order to solve the above problems, the present invention also provides a display panel including the array substrate involved in the present invention.

The advantages of the present invention are as follows: the present invention relates to an array substrate, a preparation method thereof, and a display panel, wherein the second conductive layer in the array substrate is connected to a portion of the first conductive layer opposite to the metal wire layer, and is connected to to another portion of the first conductive layer opposite to the sidewall of the through hole. Using the second conductive layer, the signal of a part of the first conductive layer opposite to the metal line layer is transmitted to another part of the first conductive layer opposite to the sidewall of the through hole. When a crack occurs in the first conductive layer at the angle between the surface of the metal wire layer and the sidewall of the through hole, the signal of the metal wire layer can still be transmitted through the first conductive layer, so as to avoid increasing the lap resistance and avoid abnormal touch control. Phenomenon.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an array substrate in the prior art.

FIG. 2 is a schematic structural diagram of the array substrate of Example 1. FIG.

FIG. 3 is a schematic diagram of through holes in the array substrate of Example 1. FIG.

FIG. 4 is a schematic structural diagram of a via hole in the array substrate of Embodiment 1. FIG.

FIG. 5 is a diagram showing the preparation steps of the array substrate of Example 1. FIG.

FIG. 6 is a schematic structural diagram of the array substrate of Example 2. FIG.

FIG. 7 is a schematic structural diagram of a via hole in the array substrate of Embodiment 2. FIG.

FIG. 8 is a diagram showing the preparation steps of the array substrate of Example 2. FIG.

The parts in the figure are marked as follows:

100. Array substrate

1. Substrate 2. Metal Wire Layer

3. Flat layer 4. The first conductive layer

5. Passivation layer 6. Second conductive layer

7. Through hole 8. Via hole

9. Cracks

81. The first via 82. The second via

83. The third via

Detailed ways

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to fully introduce the technical content of the present invention to those skilled in the art, to exemplify the implementation of the present invention, to make the technical content disclosed in the present invention clearer, and to make the present invention clearer. Those skilled in the art will more readily understand how to implement the present invention. However, the present invention can be embodied in many different forms of embodiments, the protection scope of the present invention is not limited to the embodiments mentioned herein, and the description of the following embodiments is not intended to limit the scope of the present invention.

The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inside", "outside", "side", etc., are only attached The directions in the drawings and the directional terms used herein are used to explain and describe the present invention, rather than to limit the protection scope of the present invention.

In the drawings, structurally identical components are denoted by the same numerals, and structurally or functionally similar components are denoted by like numerals throughout. In addition, for ease of understanding and description, the size and thickness of each component shown in the accompanying drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component.

When certain components are described as being "on" another component, the component can be directly on the other component; an intervening component may also be present and the component is placed on the intervening component , and the intermediate component is placed on another component. When one component is described as being "mounted to" or "connected to" another component, both can be understood as being "mounted" or "connected" directly, or one component being "mounted to" or "connected to" through an intervening component another component.

Example 1

This embodiment provides a display panel including an array substrate 100 .

As shown in FIG. 2 , the array substrate 100 includes: a substrate 1 , a metal wire layer 2 , a planarization layer 3 , a first conductive layer 4 , a passivation layer 5 and a second conductive layer 6 .

The base 1 includes a substrate, and the substrate can be a flexible substrate, which has the function of blocking water and oxygen, and the substrate can have good impact resistance, which can effectively protect the array substrate 100 . The material of the substrate includes one or more of glass, silicon dioxide, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyimide or polyurethane.

As shown in FIG. 2 , the metal wire layer 2 is disposed on the substrate 1 ; the material of the metal wire layer 2 is metal, such as copper Cu or molybdenum Mo.

As shown in FIG. 2 , the flat layer 3 is disposed on the metal wire layer 2 and the substrate 1 . The flat layer 3 can provide a flat surface for the preparation of the first conductive layer 4 thereon.

As shown in FIGS. 2 and 3 , the flat layer 3 is provided with a through hole 7 , and the through hole 7 penetrates through the flat layer 3 and is disposed opposite to the metal wire layer 2 . The through holes 7 are mainly used for the connection between the first conductive layer 4 and the metal wiring layer 2 , so as to realize the effect of transmitting the signal in the metal wiring layer 2 to the first conductive layer 4 .

As shown in FIG. 2 , the first conductive layer 4 is disposed on the flat layer 3 , extends into the through hole 7 , is attached to the sidewall of the through hole 7 , and is connected to the metal wire layer 2 on. In this way, the first conductive layer 4 is in contact with the metal wire layer 2 , so as to achieve the effect of transmitting the signal in the metal wire layer 2 to the first conductive layer 4 . Since ITO (indium tin oxide) has good conductivity and transparency, it can cut off electron radiation, ultraviolet rays and far infrared rays that are harmful to the human body. Therefore, in this embodiment, the material of the first conductive layer 4 is preferably ITO.

As shown in FIG. 2 , the passivation layer 5 is disposed on the first conductive layer 4 and extends into the through hole 7 .

As shown in FIG. 2 and FIG. 4 , the passivation layer 5 is provided with a via hole 8 , the via hole 8 penetrates the passivation layer 5 and is connected with the sidewall of the via hole 7 and/or the metal wire Layer 2 is set relatively.

As shown in FIG. 2 and FIG. 4 , in this embodiment, the number of the via holes 8 includes more than two. The via hole 8 in this embodiment includes a first via hole 81 , a second via hole 82 and a third via hole 83 . The first via hole 81 is arranged opposite to the metal wire layer 2 ; the second via hole 82 is arranged opposite to one side wall of the through hole 7 ; the third via hole 83 is arranged opposite to the other side side of the through hole 7 The walls are arranged opposite. By forming the via hole 8 on the passivation layer 5, it is convenient for the second conductive layer 6 to transmit the signal of a part of the first conductive layer 4 opposite to the metal wire layer 2 to the first conductive layer 4 and the The other part of the side wall of the through hole 7 is opposite.

As shown in FIG. 2 , the second conductive layer 6 is disposed in the via hole 8 , is connected to a portion of the first conductive layer 4 opposite to the metal wire layer 2 , and is connected to the first conductive layer 4 and the other part opposite to the side wall of the through hole 7 .

As shown in FIG. 2 , in this embodiment, the second conductive layer 6 is connected to the first conductive layer 4 through a first via hole 81 , and is connected to the first conductive layer through a second via hole 82 layer 4 , and is connected to the first conductive layer 4 through the third via hole 83 . Since ITO (indium tin oxide) has good conductivity and transparency, it can cut off electron radiation, ultraviolet rays and far infrared rays that are harmful to the human body. Therefore, in this embodiment, the material of the second conductive layer 6 is preferably ITO.

Thus, the second conductive layer 6 transmits the signal of a part of the first conductive layer 4 opposite to the metal wire layer 2 to the first conductive layer 4 opposite to the sidewall of the through hole 7 another part. When a crack occurs in the first conductive layer 4 at the angle between the surface of the metal wire layer 2 and the side wall of the through hole 7, the signal of the metal wire layer 2 can still be transmitted through the first conductive layer 4 to avoid increasing the lap impedance, Avoid abnormal touch.

As shown in FIG. 5 , this embodiment also provides a method for preparing the array substrate 100 involved in this embodiment, which includes the following steps: S1 , providing a substrate 1 ; S2 , preparing a metal wire layer 2 on the substrate 1 . ; S3, preparing a flat layer 3 on the metal wire layer 2 and the substrate 1; S4, forming a through hole 7 through the flat layer 3, and the through hole 7 and the metal wire layer 2 are arranged opposite; S5, a first conductive layer 4 is prepared on the flat layer 3, and the first conductive layer 4 extends into the through hole 7, is attached to the sidewall of the through hole 7, and is connected to the through hole 7 On the metal wire layer 2; S6, prepare a passivation layer 5 on the first conductive layer 4, and the first conductive layer 4 extends into the through hole 7; S7, form through the passivation layer 5 Two or more via holes 8 ; one via hole 8 is arranged opposite to the metal wire layer 2 ; the other via hole 8 is arranged opposite to the side wall of the through hole 7 ; Two conductive layers 6, the second conductive layer 6 is connected to a part of the first conductive layer 4 opposite to the metal wire layer 2, and is connected to the through hole 7 in the first conductive layer 4 the opposite part of the side wall.

In S8 , the second conductive layer 6 is connected to the first conductive layer 4 through one via hole 8 , and is connected to the first conductive layer 4 through another via hole 8 .

The through holes 7 and the via holes 8 are formed by etching.

The second conductive layer 6 in the array substrate 100 prepared by the above method transmits the signal of a part of the first conductive layer 4 opposite to the metal wire layer 2 to the first conductive layer 4 and the through hole 7 the other part of the side wall opposite. When a crack occurs in the first conductive layer 4 at the angle between the surface of the metal wire layer 2 and the side wall of the through hole 7, the signal of the metal wire layer 2 can still be transmitted through the first conductive layer 4 to avoid increasing the lap impedance, Avoid abnormal touch.

Example 2

This embodiment provides a display panel including an array substrate 100 .

As shown in FIG. 6 , the array substrate 100 includes: a substrate 1 , a metal wire layer 2 , a planarization layer 3 , a first conductive layer 4 , a passivation layer 5 and a second conductive layer 6 .

The base 1 includes a substrate, and the substrate can be a flexible substrate, which has the function of blocking water and oxygen, and the substrate can have good impact resistance, which can effectively protect the array substrate 100 . The material of the substrate includes one or more of glass, silicon dioxide, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyimide or polyurethane.

As shown in FIG. 6 , the metal wire layer 2 is disposed on the substrate 1 ; the material of the metal wire layer 2 is metal, such as copper Cu or molybdenum Mo.

As shown in FIG. 6 , the flat layer 3 is disposed on the metal wire layer 2 and the substrate 1 . The flat layer 3 can provide a flat surface for the preparation of the first conductive layer 4 thereon.

As shown in FIG. 6 , a through hole 7 is provided in the flat layer 3 , and the through hole 7 penetrates through the flat layer 3 and is disposed opposite to the metal wire layer 2 . The through holes 7 are mainly used for the connection between the first conductive layer 4 and the metal wiring layer 2 , so as to realize the effect of transmitting the signal in the metal wiring layer 2 to the first conductive layer 4 .

As shown in FIG. 6 , the first conductive layer 4 is disposed on the flat layer 3 , extends into the through hole 7 , is attached to the sidewall of the through hole 7 , and is connected to the metal wire layer 2 on. In this way, the first conductive layer 4 is in contact with the metal wire layer 2 , so as to achieve the effect of transmitting the signal in the metal wire layer 2 to the first conductive layer 4 . Since ITO (indium tin oxide) has good conductivity and transparency, it can cut off electron radiation, ultraviolet rays and far infrared rays that are harmful to the human body. Therefore, in this embodiment, the material of the first conductive layer 4 is preferably ITO.

As shown in FIG. 6 , the passivation layer 5 is disposed on the first conductive layer 4 and extends into the through hole 7 .

As shown in FIG. 6 and FIG. 7 , the passivation layer 5 is provided with a via hole 8 , the via hole 8 penetrates the passivation layer 5 and is connected to the sidewall of the via hole 7 and/or the metal line Layer 2 is set relatively.

As shown in FIG. 6 and FIG. 7 , in this embodiment, the number of the via hole 8 is one. The via hole 8 is disposed opposite to the sidewall of the through hole 7 and the metal wire layer 2 . By forming the via hole 8 on the passivation layer 5, it is convenient for the second conductive layer 6 to transmit the signal of a part of the first conductive layer 4 opposite to the metal wire layer 2 to the first conductive layer 4 and the The other part of the side wall of the through hole 7 is opposite.

As shown in FIG. 6 , the second conductive layer 6 is disposed in the via hole 8 , attached to the first conductive layer 4 , and extends from the hole wall on one side of the via hole 8 to the hole wall on the other side . Since ITO (indium tin oxide) has good conductivity and transparency, it can cut off electron radiation, ultraviolet rays and far infrared rays that are harmful to the human body. Therefore, in this embodiment, the material of the second conductive layer 6 is preferably ITO.

Thus, the second conductive layer 6 transmits the signal of a part of the first conductive layer 4 opposite to the metal wire layer 2 to the first conductive layer 4 opposite to the sidewall of the through hole 7 another part. When a crack occurs in the first conductive layer 4 at the angle between the surface of the metal wire layer 2 and the side wall of the through hole 7, the signal of the metal wire layer 2 can still be transmitted through the first conductive layer 4 to avoid increasing the lap impedance, Avoid abnormal touch.

As shown in FIG. 8 , this embodiment also provides a method for preparing the array substrate 100 involved in this embodiment, which includes the following steps: S1 , providing a substrate 1 ; S2 , preparing a metal wire layer 2 on the substrate 1 ; S3, preparing a flat layer 3 on the metal wire layer 2 and the substrate 1; S4, forming a through hole 7 through the flat layer 3, and the through hole 7 and the metal wire layer 2 are arranged opposite; S5, a first conductive layer 4 is prepared on the flat layer 3, and the first conductive layer 4 extends into the through hole 7, is attached to the sidewall of the through hole 7, and is connected to the through hole 7 On the metal wire layer 2; S6, prepare a passivation layer 5 on the first conductive layer 4, and the first conductive layer 4 extends into the through hole 7; S7, form through the passivation layer 5 A via hole 8, the via hole 8 is disposed opposite to the metal wire layer 2 and the sidewall of the through hole 7; and S8, a second conductive layer 6 is prepared in the via hole 8, the second conductive layer 6 is formed in the via hole 8 The conductive layer 6 is connected to a portion of the first conductive layer 4 opposite to the metal wire layer 2 , and is connected to another portion of the first conductive layer 4 opposite to the sidewall of the through hole 7 .

In S8, the second conductive layer 6 is disposed in the via hole 8, attached to the first conductive layer 4, and extends from the hole wall on one side of the via hole 8 to the hole wall on the other side.

The through holes 7 and the via holes 8 are formed by etching.

The second conductive layer 6 in the array substrate 100 prepared by the above method transmits the signal of a part of the first conductive layer 4 opposite to the metal wire layer 2 to the first conductive layer 4 and the through hole 7 the other part of the side wall opposite. When a crack occurs in the first conductive layer 4 at the angle between the surface of the metal wire layer 2 and the side wall of the through hole 7, the signal of the metal wire layer 2 can still be transmitted through the first conductive layer 4 to avoid increasing the lap impedance, Avoid abnormal touch.

The array substrate, its preparation method, and the display panel provided by the present application have been introduced in detail above. The principles and implementations of the present application are described with specific examples in this article. The descriptions of the above embodiments are only used to help understand the present application. Those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some of the technical features; and these modifications or replacements, and The essence of the corresponding technical solutions is not deviated from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. An array substrate, characterized in that, comprising: base; a metal wire layer disposed on the substrate; a flat layer, disposed on the metal wire layer and the substrate; a through hole, penetrating through the flat layer, and disposed opposite to the metal line layer; a first conductive layer, disposed on the flat layer, extending into the through hole, attached to the sidewall of the through hole, and connected to the metal wire layer; a passivation layer, disposed on the first conductive layer and extending into the through hole; a via hole, penetrating the passivation layer, and disposed opposite to the sidewall of the via hole and/or the metal line layer; and A second conductive layer, disposed in the via hole, connected to a portion of the first conductive layer opposite to the metal wire layer, and connected to the sidewall of the first conductive layer and the via hole the opposite part. 2. The array substrate according to claim 1, wherein the number of the via holes is two or more; a via hole is arranged opposite to the metal line layer; Another via hole is disposed opposite to the side wall of the through hole. 3 . The array substrate according to claim 2 , wherein the second conductive layer is connected to the first conductive layer through one via hole, and is connected to the first conductive layer through another via hole. 4 . Floor. 4 . The array substrate of claim 1 , wherein the via hole is disposed opposite to the sidewall of the through hole and the metal wire layer. 5 . 5 . The array substrate according to claim 4 , wherein the second conductive layer is disposed in the via hole, and is attached to the first conductive layer, from a hole wall on one side of the via hole. 6 . extends to the hole wall on the other side. 6. A method for preparing an array substrate, comprising the following steps: provide a base; preparing a metal wire layer on the substrate; preparing a planarization layer on the metal wire layer and the substrate; A through hole is formed through the flat layer, and the through hole is disposed opposite to the metal line layer; A first conductive layer is prepared on the flat layer, and the first conductive layer extends into the through hole, is attached to the sidewall of the through hole, and is connected to the metal wire layer; preparing a passivation layer on the first conductive layer, and the first conductive layer extends into the through hole; forming a via hole through the passivation layer, and the via hole is disposed opposite to the sidewall of the via hole and/or the metal line layer; and A second conductive layer is prepared in the via hole, the second conductive layer is connected to a portion of the first conductive layer opposite to the metal wire layer, and is connected to the first conductive layer and the Another part of the side wall of the through hole opposite. 7 . The manufacturing method of an array substrate according to claim 6 , wherein a via hole is formed through the passivation layer, and the via hole is connected to the sidewall of the via hole and/or the metal wire. 8 . The step of arranging the layers oppositely includes: forming more than two via holes through the passivation layer; a via hole is arranged opposite to the metal line layer; Another via hole is disposed opposite to the side wall of the through hole. 8 . The method for manufacturing an array substrate according to claim 6 , wherein a via hole is formed through the passivation layer, and the via hole is connected to the sidewall of the via hole and/or the metal wire. 9 . In the step of arranging the layers oppositely, the via hole is arranged opposite to the sidewall of the through hole and the metal wire layer. 9 . The method for manufacturing an array substrate according to claim 6 , wherein the through holes and the via holes are formed by etching. 10 . 10. A display panel comprising the array substrate of any one of claims 1-5.

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