CN111564271A - Thermistor - Google Patents
Thermistor Download PDFInfo
- Publication number
- CN111564271A CN111564271A CN202010406247.9A CN202010406247A CN111564271A CN 111564271 A CN111564271 A CN 111564271A CN 202010406247 A CN202010406247 A CN 202010406247A CN 111564271 A CN111564271 A CN 111564271A
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- Prior art keywords
- clamping
- chip
- shell
- casing
- clamping part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002184 metal Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 10
- 230000002452 interceptive effect Effects 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种电子元器件,尤其是一种车载MCU用的涌流抑制或马达启动器盒装型热敏电阻。The invention relates to an electronic component, in particular to an inrush current suppression or motor starter box-type thermistor for vehicle-mounted MCU.
背景技术Background technique
随着科技的发展,产品体积的小型化需求以及稳定性需求越来越大,以车载产品为例,目前车载MCU用的PSB产品(涌流抑制或马达启动器盒装型热敏电阻),其外壳尺寸为18*13.5*26.5mm,因此,对于一些安装条件有限的空间来说不能够很好的满足安装要求;并且,由于其结构本身的问题,PTC芯片悬空于外壳中,因此容易导致抗震效果不佳;同时,在焊接不到位的情况下,会造成外壳与安装板上的其它组件相互干涉,从而影响产品的整体使用性能。With the development of science and technology, the demand for miniaturization and stability of product volume is increasing. Taking automotive products as an example, the current PSB products (inrush current suppression or motor starter box-type thermistors) used in automotive MCUs, the The size of the shell is 18*13.5*26.5mm, so it cannot meet the installation requirements well for some spaces with limited installation conditions; and, due to its structure itself, the PTC chip is suspended in the shell, so it is easy to cause earthquake resistance The effect is not good; at the same time, if the welding is not in place, it will cause the shell and other components on the installation board to interfere with each other, thereby affecting the overall performance of the product.
发明内容SUMMARY OF THE INVENTION
本发明要解决的技术问题是:提供一种热敏电阻,具有体积小、抗震好、稳定性好等特点。The technical problem to be solved by the present invention is to provide a thermistor, which has the characteristics of small size, good shock resistance, good stability and the like.
本发明解决其技术问题所采用的技术方案是:一种热敏电阻,用于车载MCU,包括壳体,所述的壳体内设置有芯片,所述的芯片通过设置于壳体内且位于芯片两侧的夹紧件与壳体内侧的顶部接触;所述的夹紧件具有夹紧芯片的夹持部,所述的夹持部呈自下而上的状态从夹紧件延伸出来,夹持部与夹紧件的连接部为夹持部的底部,夹持部的上部抵于芯片的两侧并通过与芯片侧面的摩擦力将芯片固定于壳体内侧的顶部。这样可以对芯片提供除了有夹持力外还有抵抗芯片滑动的力,从而能够更好的防护芯片晃动,更好的满足车辆规定的振动需求。The technical solution adopted by the present invention to solve the technical problem is as follows: a thermistor, used for a vehicle-mounted MCU, comprising a casing, wherein a chip is arranged in the casing, and the chip is arranged in the casing and located between two sides of the chip. The clamping member on the side is in contact with the top of the inner side of the casing; the clamping member has a clamping portion for clamping the chip, and the clamping portion extends from the clamping member in a bottom-up state to clamp the chip. The connection part between the part and the clamping part is the bottom of the clamping part, and the upper part of the clamping part abuts on both sides of the chip and fixes the chip on the top inside the casing by friction with the side of the chip. In this way, in addition to the clamping force, the chip can be provided with a force against sliding of the chip, so that the chip can be better protected from shaking, and the vibration requirements specified by the vehicle can be better met.
进一步的说,所述的夹紧件还具有延伸出壳体外部的延伸部,所述的延伸部设置有能够插入PCB电路板焊接位置并且与PCB电路板的下表面固定的卡脚;所述的卡脚的顶部与壳体底部之间具有间隙,所述间隙的高度等于PCB电路板的厚度。Further, the clamping piece also has an extension portion extending out of the casing, and the extension portion is provided with a clip which can be inserted into the welding position of the PCB circuit board and fixed with the lower surface of the PCB circuit board; the There is a gap between the top of the clip and the bottom of the housing, and the height of the gap is equal to the thickness of the PCB circuit board.
再进一步的说,本发明所述的壳体底部设置有凸起,所述的凸起的高度为0.1至1mm,所述凸起均匀分布在壳体底部,这样能够防止产品没有卡住时干涉到电路板上的其它组件,进一步的提高了焊接安装时的稳定性。Still further, the bottom of the casing of the present invention is provided with protrusions, the height of the protrusions is 0.1 to 1 mm, and the protrusions are evenly distributed on the bottom of the casing, which can prevent interference when the product is not stuck. to other components on the circuit board, further improving the stability of the solder installation.
更进一步的说,本发明所述的壳体包括一体成型的上壳体以及设置于上壳体底部的底盖,所述的壳体尺寸小于等于17×17×22.1mm,这样可以满足更小的空间尺寸要求。Furthermore, the casing of the present invention includes an integrally formed upper casing and a bottom cover arranged at the bottom of the upper casing. space size requirements.
更进一步的说,本发明所述的夹紧件为金属件,所述夹持部与卡脚均为由夹紧件本身冲切出的金属弹片,这样可以通过金属弹片本身的形变性能更好的进行装配。Furthermore, the clamping piece of the present invention is a metal piece, and the clamping portion and the clamping feet are metal elastic pieces punched out by the clamping piece itself, so that the deformation performance of the metal elastic piece itself can be improved. to assemble.
本发明的有益效果是,解决了背景技术中存在的缺陷,具有较小的安装尺寸,并且为芯片提供由下至上的夹持力,能够防止芯片在壳体中晃动,从而提高了产品的抗震性能,同时在壳体底部设置支撑点能够有效防止壳体干涉到电路板上的其他组件,提供了产品使用的稳定性。The beneficial effects of the present invention are that it solves the defects existing in the background technology, has a smaller installation size, and provides a bottom-up clamping force for the chip, which can prevent the chip from shaking in the casing, thereby improving the shock resistance of the product At the same time, setting a support point at the bottom of the casing can effectively prevent the casing from interfering with other components on the circuit board, providing the stability of the product in use.
附图说明Description of drawings
图1-4是本发明的结构示意图;Figures 1-4 are schematic structural diagrams of the present invention;
图5是本发明与电路板的安装示意图;Fig. 5 is the installation schematic diagram of the present invention and circuit board;
图6是本发明另一实施例的结构示意图;6 is a schematic structural diagram of another embodiment of the present invention;
图中:1、壳体;2、芯片;3、夹紧件;4、凸起;5、电路板;11、上壳体;12、底盖;31、夹持部;32、延伸部;33、卡脚。In the figure: 1. Housing; 2. Chip; 3. Clamping part; 4. Protrusion; 5. Circuit board; 11. Upper housing; 12. Bottom cover; 31. Clamping part; 32. Extension part; 33. Card foot.
具体实施方式Detailed ways
现在结合附图和优选实施例对本发明作进一步详细的说明。这些附图均为简化的示意图,仅以示意方式说明本发明的基本结构,因此其仅显示与本发明有关的构成。The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the present invention in a schematic manner, so they only show the structures related to the present invention.
如图1-4所示的一种热敏电阻,用于车载MCU,包括壳体1,壳体1包括一体成型的上壳体11以及设置于上壳体11底部的底盖12,所述的壳体尺寸小于等于17×17×22.1mm,从而可以满足更小的空间尺寸要求。As shown in Figures 1-4, a thermistor used in a vehicle-mounted MCU includes a casing 1. The casing 1 includes an integrally formed upper casing 11 and a
壳体1内设置有芯片2,所述的芯片2通过设置于壳体1内且位于芯片2两侧的夹紧件3与壳体1内侧的顶部接触。根据其他实施例,芯片2也可同时与壳体1的顶部及底盖接触。A
如图2所示,夹紧件3具有夹紧芯片的夹持部31以及延伸出壳体1外部的延伸部32,夹紧件3为金属件,延伸部32设置有能够插入PCB电路板5焊接位置并且与PCB电路板5的下表面固定的卡脚33;图2中的卡脚33为向内弯折,但是如果因壳体尺寸缩小,向内弯的卡脚有可能会形成立体障碍,可能妨碍底盖盖上壳体,因此,根据其他实施例,卡脚33也可以向外弯折,如图6所示;所述夹持部31与卡脚33均为由夹紧件3本身冲切出的金属弹片,因此,夹持部31从夹紧件3自下而上的延伸出来,夹持部31的底部作为连接部与夹紧件3连接,夹持部31的上部抵于芯片2的两侧并通过与芯片表面产生的摩擦力将芯片2固定于壳体1内侧的顶部。这样可以对芯片提供除了有夹持力外还有抵抗芯片滑动的力,从而能够更好的防护芯片晃动,更好的满足车辆规定的振动需求。As shown in FIG. 2 , the
卡脚33的顶部与壳体1底部之间具有间隙,所述间隙的高度等于PCB电路板5的厚度。如图5所示,通过这样的焊接安装方式,使得产品与电路板安装后无间隙,能够提高产品与PCB电路板固定的稳定性。并且,壳体1底部设置有凸起4,凸起4可与壳体的底盖一体成形,所述的凸起4的高度为0.1至1mm,所述凸起4均匀分布在壳体底部,凸起起到支撑点的作用;如图1、4所示,凸起4呈矩形分布在壳体底部,这样能够防止产品没有卡住时干涉到电路板上的其它组件,进一步的提高了焊接安装时的稳定性。There is a gap between the top of the
本发明能够实现小型化的原因在于:The reason why the present invention can realize miniaturization is:
(a)现有的壳体内部需要有固定件来固定夹紧件,该固定件会于壳体内部形成凸块,需要于壳体内部设计凸块的容置空间,使得壳体的体积无法缩小。本发明无须额外的固定件来固定夹紧件,可缩小壳体体积。(a) The existing housing needs a fixing member to fix the clamping member. The fixing member will form a bump inside the housing. It is necessary to design the accommodating space for the bump inside the housing, so that the volume of the housing cannot be Zoom out. The present invention does not require additional fixing parts to fix the clamping parts, and can reduce the volume of the casing.
(b)壳体的材质由电木(酚醛树脂)改为介电强度较高的LCP(液晶高分子),因此,即便壳体厚度缩减,亦可达到相同耐压绝缘之功效。再加上LCP具有良好的可弯曲性,方便组合设计,可满足小型化的目的。(b) The material of the casing is changed from bakelite (phenolic resin) to LCP (liquid crystal polymer) with higher dielectric strength. Therefore, even if the thickness of the casing is reduced, the same voltage-resistant insulation effect can be achieved. In addition, LCP has good bendability, which is convenient for combined design and can meet the purpose of miniaturization.
以上说明书中描述的只是本发明的具体实施方式,各种举例说明不对本发明的实质内容构成限制,所属技术领域的普通技术人员在阅读了说明书后可以对以前所述的具体实施方式做修改或变形,而不背离发明的实质和范围。What is described in the above specification is only the specific embodiment of the present invention, and various examples do not limit the essential content of the present invention. Those of ordinary skill in the art can modify or modify the specific embodiment described above after reading the specification. variations without departing from the spirit and scope of the invention.
Claims (6)
Priority Applications (1)
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CN202010406247.9A CN111564271A (en) | 2020-05-14 | 2020-05-14 | Thermistor |
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CN202010406247.9A CN111564271A (en) | 2020-05-14 | 2020-05-14 | Thermistor |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114247493A (en) * | 2020-10-20 | 2022-03-29 | 深圳铭毅基因科技有限公司 | Fixing device for chip for chemical reaction |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3995931A (en) * | 1975-03-26 | 1976-12-07 | Molex Incorporated | Terminal for apertured circuit panel |
US5108312A (en) * | 1991-04-15 | 1992-04-28 | Molex Incorporated | Snap eyelet for mounting and grounding an electrical connector to a circuit board |
US5142265A (en) * | 1990-04-05 | 1992-08-25 | Nippon Oil & Fats Co., Ltd. | Positive temperature coefficient thermistor device |
CN1236957A (en) * | 1998-05-22 | 1999-12-01 | 株式会社村田制作所 | NTC thermistors |
KR20020029849A (en) * | 2000-10-14 | 2002-04-20 | 김상면 | A element apparatus of inorganic compound semiconductor |
CN201387777Y (en) * | 2008-12-16 | 2010-01-20 | 上海科特高分子材料有限公司 | Circuit positive temperature coefficient property self-restoring protection device |
CN212303258U (en) * | 2020-05-14 | 2021-01-05 | 兴勤(常州)电子有限公司 | Thermistor |
-
2020
- 2020-05-14 CN CN202010406247.9A patent/CN111564271A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3995931A (en) * | 1975-03-26 | 1976-12-07 | Molex Incorporated | Terminal for apertured circuit panel |
US5142265A (en) * | 1990-04-05 | 1992-08-25 | Nippon Oil & Fats Co., Ltd. | Positive temperature coefficient thermistor device |
US5108312A (en) * | 1991-04-15 | 1992-04-28 | Molex Incorporated | Snap eyelet for mounting and grounding an electrical connector to a circuit board |
CN1236957A (en) * | 1998-05-22 | 1999-12-01 | 株式会社村田制作所 | NTC thermistors |
KR20020029849A (en) * | 2000-10-14 | 2002-04-20 | 김상면 | A element apparatus of inorganic compound semiconductor |
CN201387777Y (en) * | 2008-12-16 | 2010-01-20 | 上海科特高分子材料有限公司 | Circuit positive temperature coefficient property self-restoring protection device |
CN212303258U (en) * | 2020-05-14 | 2021-01-05 | 兴勤(常州)电子有限公司 | Thermistor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114247493A (en) * | 2020-10-20 | 2022-03-29 | 深圳铭毅基因科技有限公司 | Fixing device for chip for chemical reaction |
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