CN111508971A - Active matrix substrate and inspection device thereof - Google Patents

Abstract

An active matrix substrate (1) includes: a plurality of gate lines; a plurality of data lines; a first terminal group including a plurality of terminals connected to one end of the plurality of gate lines; and a second terminal group (15a) ), which includes a plurality of terminals (151) connected to one end of a plurality of data lines. The active matrix substrate (1) is provided with a plurality of terminals for inspection, and the plurality of terminals for inspection are distributed in a plurality of terminals ( 151) between.

Description

Active matrix substrate and inspection device thereof

technical field

The present invention relates to an active matrix substrate and an inspection device thereof.

Background technique

Japanese Patent Laid-Open No. 2008-151954 discloses an inspection apparatus for detecting defects in scan lines and data lines in a display panel in a manufacturing process of the display panel. In the inspection method based on this inspection apparatus, in the inspection (hereinafter, main inspection) for detecting defects of the scanning lines and the data lines, probes are connected to each terminal of the terminal group connected to the scanning lines and the data lines, A predetermined voltage is applied to the probe to operate the pixel circuit in the display panel. In the above-mentioned Japanese Patent Application Laid-Open No. 2008-151954, the internal wiring is implemented so that two terminals arranged at both ends of the terminals connected to each scanning line and each data line have the same potential. Before the main inspection, when the resistance value between the probes connected to the two terminals is greater than the predetermined resistance value, it is determined that the probes are not properly contacted, that is, a deviation occurs between the probes and the terminals.

As described in Japanese Patent Laid-Open No. 2008-151954 mentioned above, before the main inspection, the probes are adjusted by detecting the contact states of the two terminals arranged at both ends of the terminal group connected to each scanning line and each data line and the probes in advance. position so that the main inspection can be performed appropriately. However, in the above-mentioned Japanese Unexamined Patent Application Publication No. 2008-151954, since it is necessary to connect the terminals at both ends of the terminal group connected to each scanning line and each data line so that the potentials are the same, there is a degree of freedom in the design of the terminal area. easy to fall.

SUMMARY OF THE INVENTION

An active matrix substrate completed in view of the above problems includes: a substrate; a plurality of gate lines arranged in one direction on the substrate; and a plurality of data lines on the substrate to be connected with the plurality of gates Lines are arranged in a crossing manner; a first terminal group, which is arranged with a plurality of terminals connected to one end of the plurality of gate lines; a second terminal group, which is arranged with one end of the plurality of data lines a plurality of terminals connected to each other; and a plurality of terminals for inspection, which are distributed between the plurality of terminals in at least one of the first terminal group and the second terminal group and are connected to each other .

According to the above configuration, the degree of freedom in the design of the terminal region is not easily reduced, and the operation confirmation inspection can be appropriately performed.

Description of drawings

FIG. 1 is a schematic diagram showing an active matrix substrate and an inspection apparatus for the active matrix substrate in the first embodiment.

FIG. 2 is a plan view showing a schematic configuration of the active matrix substrate shown in FIG. 1 .

FIG. 3 is an equivalent circuit diagram of a pixel in the imaging area shown in FIG. 2 .

FIG. 4 is a schematic view showing the structure of the tab 15a shown in FIG. 2 .

FIG. 5 is a schematic view showing the structure of the tab 15b shown in FIG. 2 .

FIG. 6 is a schematic diagram showing a configuration example of a part of the tab 15a shown in FIG. 2 and a part of the inspection apparatus 2 shown in FIG. 1 .

FIG. 7 is a schematic diagram showing a schematic configuration of the tab 15a of the active matrix substrate and the inspection apparatus in the second embodiment.

Detailed ways

Hereinafter, embodiments related to an active matrix substrate and an inspection apparatus for an active matrix substrate will be described in detail with reference to the accompanying drawings. The same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated.

[First Embodiment]

FIG. 1 is a schematic diagram showing an active matrix substrate 1 and an inspection apparatus 2 for the active matrix substrate 1 in the present embodiment. In the present embodiment, in the manufacturing process of the active matrix substrate 1 used in an X-ray imaging panel or the like, before the operation confirmation inspection of the active matrix substrate 1 is performed, the inspection apparatus 2 checks whether it is appropriate or not. The status of the operation confirmation check is performed. Hereinafter, the inspection performed by the inspection device 2 will be referred to as a preliminary inspection.

(constitute)

FIG. 2 is a plan view showing a schematic configuration of the active matrix substrate 1 . The active matrix substrate 1 can be used for, for example, an X-ray imaging panel. That is, an X-ray imaging panel can be produced by providing a scintillator for converting X-rays transmitted through the subject into fluorescence (scintillation light) on one surface side of the active matrix substrate 1 . Hereinafter, the structure of the active matrix substrate 1 will be specifically described.

The active matrix substrate 1 has a plurality of data lines 10 and a plurality of gate lines 11 crossing the plurality of data lines 10 . In this example, there are 3072 data lines 10 and 3072 gate lines 11 respectively. The active matrix substrate 1 has an imaging region Ra composed of a plurality of regions (hereinafter, pixels) surrounded by the data lines 10 and the gate lines 11 .

The offset wiring 13 is arranged inside the imaging region Ra so as to surround the imaging region Ra. In addition, although not shown in the figure, wirings drawn from the bias wirings 13 are provided in each pixel. In the following description, the wiring portion drawn from the bias wiring 13 arranged in the pixel is also referred to as the bias wiring 13 .

In the region outside the imaging region Ra, N (N is a natural number of 2 or more) tabs 15 a are arranged in the region on the one end side of the data line 10 , and are arranged in the region on the one end side of the gate line 11 . There are N tabs 15b. In this example, 12 pieces of each of the contact pieces 15a and the contact pieces 15b are arranged. Details of the tabs 15a, 15b will be described later.

Here, the configuration of the pixels in the imaging area Ra will be described. FIG. 3 is an equivalent circuit diagram showing the structure of a pixel. As shown in FIG. 3 , the pixel P has a TFT (Thin Film Transistor) 21 and a photoelectric conversion element 22 .

The photoelectric conversion element 22 has a PIN photodiode and a pair of electrodes (a cathode electrode and an anode electrode). The source electrode of the TFT 21 is connected to the data line 10 , and the drain electrode of the TFT 21 is connected to the cathode electrode of the photoelectric conversion element 22 . The anode electrode of the photoelectric conversion element 22 is connected to the bias wiring 13 . In addition, the bias wiring 13 arranged in the pixel is connected to the anode electrode of the photoelectric conversion element 22 via an interlayer insulating film not shown.

In addition, although not shown in FIG. 3 , the active matrix substrate 1 is connected to a drive circuit that applies a scan voltage to scan the gate lines 11 , and a drive circuit that reads the charges converted by the PIN photodiodes from the data lines 10 . read circuit. When the TFT 21 connected to the gate line 11 to be scanned is turned on, an electrical signal corresponding to the electric charge converted by the photoelectric conversion element 22 is output to the reading circuit via the data line 10 .

Next, the tabs 15a and 15b in this embodiment will be described.

FIG. 4 is a schematic view showing the structure of one tab 15a. As shown in FIG. 4 , the contact piece 15 a includes a plurality of data terminals 151 , a plurality of bias terminals 152 , and a plurality of dummy terminals 153 .

Each data terminal 151 is connected to one end of one data line 10 that is different from each other. As described above, in this example, 3072 data lines 10 are provided, 12 contact pieces 15a are provided, and 256 data terminals 151 are arranged on each contact piece 15a.

In addition, ten bias terminals 152 ( 152L and 152R ) are provided on each of the contact pieces 15 a so as to sandwich 256 data terminals 151 (hereinafter, a data terminal group), and so as to sandwich the offset terminals 152L and 152R. Ten dummy terminals 153 (153L, 153R) are provided. In other words, each of five offset terminals 152L and 152R, and five of each of five dummy terminals 153L and 153R are arranged so as to be symmetrical in the arrangement direction of the data terminals 151 with the data terminal group as the center. . That is, in this example, a total of 276 terminals are provided in one contact piece 15a.

The width of each terminal is, for example, about 40 μm, and each terminal is arranged at a predetermined interval, for example, about 70 μm.

The ten bias terminals 152L and 152R are connected to the bias wiring 13 . The bias terminals 152L and 152R are connected to each other via the wiring 160 .

The ten dummy terminals 153 ( 153L, 153R) are spare terminals that are not electrically connected to other elements in this example.

In addition, although illustration is abbreviate|omitted in FIG. 4, the other contact piece 15a also has the same structure as the above-mentioned contact piece 15a. The bias terminals 152 in each of the tabs 15 a are not only wired to the bias terminals 152 in the same tab 15 a but also to the bias terminals 152 in the other tabs 15 a via the wiring 160 .

Next, the structure of the facing piece 15b will be described. FIG. 5 is a schematic view showing the structure of one tab 15b. As shown in FIG. 5 , the tab 15 b includes a plurality of gate terminals 154 , a plurality of bias terminals 152 , and a plurality of dummy terminals 153 .

Each gate terminal 154 is connected to one end of one gate line 11 different from each other. As described above, in this embodiment, 3072 gate lines 11 are provided, 12 contact pieces 15b are provided, and 256 gate terminals 154 are arranged on each contact piece 15b.

Ten bias terminals 152 (152U, 152D) are provided on each of the tabs 15b with 256 gate terminals 154 (the gate terminal group hereinafter) interposed therebetween, and 10 bias terminals 152 (152U, 152D) are provided with the bias terminals 152U, 152D interposed therebetween. 10 virtual terminals 153 (153U, 153D) are provided. In other words, five bias terminals 152U and five bias terminals 152D, five dummy terminals 153U and five dummy terminals are arranged so as to be symmetrical with the gate terminal group as the center and in the arrangement direction of the gate terminals 154 . Terminal 153D. That is, in this example, a total of 276 terminals are provided in one contact piece 15b.

Ten bias terminals 152 ( 152U, 152D) are connected to the bias wiring 13 . The bias terminals 152U and 152D are connected to each other via the wiring 161 . In addition, the wiring 161 may be electrically connected to the wiring 160 (see FIG. 4 ).

The ten dummy terminals 153 ( 153L, 153R) are spare terminals that are not electrically connected to other elements in this example.

In addition, although illustration is abbreviate|omitted in FIG. 5, the other contact piece 15b also has the same structure as the above-mentioned contact piece 15b. The bias terminals 152 in each of the tabs 15b are not only wired to the bias terminals 152 in the same tab 15b, but also to the bias terminals 152 in the other tabs 15b via wirings 161.

When imaging is performed using the active matrix substrate 1 , a voltage reverse biased to the photoelectric conversion element 22 is applied to each bias terminal 152 . In addition, the two bias terminals 152 of the bias terminals 152 in the respective tabs 15 a and 15 b are used for preliminary inspection before the imaging inspection of the active matrix substrate 1 . Hereinafter, a specific example of the inspection apparatus 2 and the inspection method for performing the pre-inspection will be described.

FIG. 6 is a schematic diagram showing a configuration example of a part of the tabs 15 a and a part of the inspection apparatus 2 . As shown in FIG. 6 , the inspection apparatus 2 includes one probe group 200 for one tab 15a. In addition, although illustration is abbreviate|omitted in FIG. 6, the inspection apparatus 2 is equipped with the one probe group 200 for each tab 15a and each tab 15b.

The probe set 200 includes the same number of probes 201 as the number of terminals in the tab 15a or the tab 15b. That is, in this example, one probe set 200 includes 276 probes 201 .

When the active matrix substrate 1 is previously inspected by the inspection apparatus 2, each terminal (the data terminal 151, the bias terminals 152L, 152R, and the dummy terminals 153L, 153R) in the tab 15a is brought into contact with the tab 15a. Each probe 201 of the probe set 200 of the Moreover, each terminal (gate terminal 154, bias terminals 152U, 152D, dummy terminals 153U, 153D) in the contact piece 15b is brought into contact with each probe pin 201 of the probe needle group 200 corresponding to the contact piece 15b.

The measurement circuit 210 includes a set of switch circuits 211 a and 211 b , a potential measurement circuit 212 , and a power supply 213 for each probe group 200 .

The switch circuit 211a is connected to one probe 201 (201a). The probe 201a is a terminal provided for one bias terminal 152L in the tab 15a.

The switch circuit 211b is connected to one probe 201 (201b) different from the probe 201a. The probe needle 201b is a terminal provided for one bias terminal 152R in the tab 15a.

Hereinafter, when the probes 201a and 201b connected to the switch circuits 211a and 211b are distinguished from the other probes 201, the probes 201a and 201b are referred to as measurement candidate probes.

The switch circuit 211a and the switch circuit 211b each have two switching elements 2111 and 2112 composed of, for example, transistors or the like. The switching element 2111 is connected to the potential measurement circuit 212 , and the switching element 2112 is connected to the power supply 213 . On/off control of the switching elements 2111 and 2112 in the switch circuits 211a and 211b is controlled by a switch control circuit (not shown).

The measurement circuit 210 measures the voltages of all measurement candidate probes (201a, 201b) in sequence. In FIG. 6 , the ON/OFF states of the switching elements 2111 and 2112 when the potential of the probes 201a of the probe group 200_1 is measured are shown.

When measuring the potential of the probes 201a of the probe group 200_1, ON/OFF of the respective switch circuits 211a and 211b is controlled so that only the probes 201a in the probe group 200_1 and the potential measurement circuit 212 are conductive. That is, as shown in FIG. 6 , among the switching elements 2111 in all the switching circuits 211a and 211b, only the switching element 2111 of the switching circuit 211a connected to the probe 201a of the probe group 200_1 is turned on, and the The switching elements 2111 of the other switching circuits 211a and 211b are turned off. In addition, among all the switching elements 2112, only the switching element 2112 connected to the probe 201a of the probe group 200_1 is turned off, and the other switching elements 2112 are turned on. Accordingly, only one measurement candidate probe for measuring the potential is electrically connected to the potential measurement circuit 212 , and the other measurement candidate probes are electrically connected to the power source 213 . Hereinafter, for convenience of description, one measurement candidate probe for measuring the potential is referred to as a measurement probe 201P.

The potential measurement circuit 212 is connected to the switching element 2111 in each of the switching circuits 211a and 211b. The potential measurement circuit 212 measures and outputs the voltage in the measurement probe 201P via the switching element 2111 which is turned on.

The power supply 213 is connected to the switching element 2112 in each of the switching circuits 211a and 211b. The power supply 213 applies a bias voltage to the measurement candidate probes ( 201 a , 201 b ) other than the measurement probe 201 via the switching element 2112 that is turned on.

In the pre-inspection in the present embodiment, each probe group 200 in the inspection apparatus 2 is first arranged to be connected to each terminal of the contact piece 15 a or 15 b in the active matrix substrate 1 . Then, the measurement probe 201P is selected from the measurement candidate probes ( 201 a or 201 b ) of each probe group 200 through the switch control circuit (not shown) in the measurement circuit 210 , and the switch connected to the measurement probe 201P is connected The element 2111 is controlled to be on, and the switching element 2112 connected to the measurement probe 201P is controlled to be off. Furthermore, the switching element 2111 and the switching element 2112 connected to the measurement candidate probes other than the measurement probe 201P are controlled to be turned off and turned on, respectively. Then, in the potential measurement circuit 212, the voltage in the measurement probe 201P is measured.

As described above, the bias terminals 152 (152L, 152R) in all the tabs 15a are connected to each other (see FIG. 4). Therefore, when the bias voltage is applied from the power supply 213 to the measurement candidate probes 201a and 201b other than the measurement probe 201P, the bias voltage is applied to each bias terminal 152 via the measurement candidate probe. As a result, the potentials of all the bias terminals 152 are made equal potential via each of the measurement candidate probes. When the measurement probe 201P is properly brought into contact with the bias terminal 152, the voltage in the measurement probe 201P measured by the potential measurement circuit 212 becomes substantially the same as the bias voltage. On the other hand, if the measurement probe 201P is not properly in contact with the bias terminal 152, the voltage of the measurement probe 201P measured by the potential measurement circuit 212 does not become a voltage equivalent to the bias voltage. In this way, by measuring the voltage in each measurement candidate probe, it is possible to detect whether or not the measurement candidate probe is properly in contact with the bias terminal, that is, whether or not the measurement candidate probe is in position.

In the present embodiment, in the active matrix substrate 1, a set of bias terminals 152L and 152R of the data terminal group across each contact 15a functions as inspection terminals used in the pre-inspection. In addition, in the inspection apparatus 2, the probes 201 corresponding to the respective inspection terminals in the active matrix substrate 1 are used as measurement candidate probes. In recent years, with the advancement of narrower pitches of terminals, the difficulty of detection has also increased. In the present embodiment, the pitch between the terminals of the tabs 15a and 15b is also narrowed to about 70 μm. However, by measuring the voltage of each measurement candidate probe before the imaging inspection, the accuracy of the detection can be improved, and the detection accuracy can be improved. Prevents re-imaging exams.

In addition, in the present embodiment, since the bias terminal 152 is used in the preliminary inspection, it is not necessary to provide a separate inspection terminal in order to inspect whether the probe 201 is properly in contact with the corresponding terminal. In addition, in the present embodiment, the bias terminal 152 used in the pre-inspection has substantially the same shape and size as other terminals adjacent to the bias terminal 152, so the design of the contact pieces 15a and 15b is not easily affected. Design constraints.

In addition, in the above description, the probe group 200 with respect to the tab 15a has been described as an example, but the inspection apparatus 2 is provided with the probe group 200 per tab 15b, and the probe group 200 for each probe group 200 is provided in the inspection apparatus 2 Switch circuits 211a and 211b are provided. In this case, the switch circuit 211a of each probe set 200 is connected to the probe 201 (measurement candidate probe) provided for one bias terminal 152U (see FIG. 5 ) in the corresponding contact piece 15b. In addition, the switch circuit 211b of each probe set 200 is connected to the probe 201 (measurement candidate probe) provided for one bias terminal 152D in the corresponding contact piece 15b. The inspection apparatus 2 sequentially measures the voltage of each candidate measurement probe with respect to the contact piece 15b in the same manner as the method for measuring the voltage of each candidate measurement probe with respect to the contact piece 15b, and makes contact with each measurement candidate probe status is checked.

[Second Embodiment]

In the above-described first embodiment, an example of detecting the contact state between each of the two bias terminals 152 in the respective tabs 15a and 15b and the corresponding measurement candidate probes in the pre-inspection has been described . That is, in each of the tabs 15a and 15b, two bias terminals 152 are used as inspection terminals, and the contact state of the two measurement candidate probes corresponding to the bias terminals 152 is described. Example of detection. In this embodiment, one bias terminal 152 is used as an inspection terminal for each of the tabs 15a and 15b, and the contact state of one measurement candidate probe corresponding to the bias terminal 152 is detected. .

FIG. 7 is a schematic diagram showing a schematic configuration of a part of the tab 15a of the active matrix substrate 1 and the inspection apparatus in this embodiment. In FIG. 7 , the same reference numerals as those of the first embodiment are assigned to the same components as those of the first embodiment. Hereinafter, configurations different from those of the first embodiment will be mainly described.

As shown in FIG. 7 , the inspection apparatus 2A includes a probe group 200 and a measurement circuit 210A per tab 15a.

The measurement circuit 210A includes one switch circuit 211 a for each probe set 200 , and the switch circuit 211 a is connected to one probe 201 a in the probe set 200 . The probe 201a connected to the switch circuit 211a is a candidate probe for measurement, and is in contact with one of the bias terminals 152L in the contact piece 15a in the previous inspection.

In addition, although not shown in FIG. 7 , one measurement candidate probe 201 a is provided in the probe set 200 of each contact piece 15 b , and in the previous inspection, the measurement candidate probe 201 a is offset from one of the contact pieces 15 b contact with the terminal 152.

As described above, the measurement circuit 210A of the present embodiment differs from the measurement circuit 210 of the first embodiment in that the switch circuit 211b is not provided.

The method of measuring the voltage in each candidate probe 201a is the same as that of the first embodiment. That is, ON/OFF of the switching elements 2111 and 2112 in each switching circuit 211a is controlled so that the measurement candidate probes 201a electrically connected to the potential measurement circuit 212 are sequentially switched, and the measurement probes 201P are sequentially switched.

As described in the first embodiment, the bias terminals 152 in the tabs 15a and 15b are connected to each other. Therefore, when the voltage in the measurement probe 201P measured by the potential measurement circuit 212 is equal to the bias voltage, the measurement probe 201P and the corresponding bias terminal 152 are in a state of being in proper contact. On the other hand, when the voltage measured by the potential measurement circuit 212 is not equal to the bias voltage, the measurement probe 201P and the corresponding bias terminal 152 are not properly in contact with each other.

In this way, one biasing terminal 152 is used for the pre-inspection for each of the tabs 15a and 15b, and the contact state of the measurement candidate probe with the biasing terminal 152 is detected, thereby enabling confirmation before imaging inspection. Whether the position of each probe 201 is appropriate.

In addition, the bias terminal 152 used for the preliminary inspection in the tab 15a may be one bias terminal 152R. That is, the bias terminals 152 used in the pre-inspection may only be the bias terminals 152 arranged at one end on both sides of the data terminal group of each contact 15a or the gate terminal group of each contact 15b. That's it.

As mentioned above, although embodiment of this invention was described, the above-mentioned embodiment is only an illustration for implementing this invention. Therefore, the present invention is not limited to the above-described embodiment, and the above-described embodiment can be appropriately modified and implemented within a range that does not deviate from the gist. Hereinafter, a modification of the present invention will be described.

(1) In the above-described embodiment, the example in which the bias terminal 152 is used for the pre-inspection has been described. However, for example, at least one of the dummy terminals 153 provided for the tabs 15a and 15b may be used for the pre-inspection. . In this case, the dummy terminals 153 used in the pre-inspection are wired so that the electric potential of the dummy terminals 153 used in the pre-inspection becomes the same electric potential. That is, at least one terminal used for the pre-inspection may be arranged on either side of the data terminal group of the tab 15a or the gate terminal group of the contact 15b on the active matrix substrate 1 .

In addition, in the above-mentioned embodiment, the bias terminal 152 is also used as an inspection terminal, and thus the bias voltage is applied to each inspection terminal. However, the potential of each inspection terminal used in the pre-inspection is A common potential may be sufficient, and may be a predetermined reference potential (GND), for example.

(2) In the above-described embodiment, the example in which the bias terminals 152 of the tabs 15a and 15b are used for the pre-inspection has been described, but only one of the tabs 15a and 15b is required to be It is sufficient to arrange at least one inspection terminal used in the pre-inspection.

(3) In the above-described embodiment, the active matrix substrate before the scintillator is provided has been described, but the configuration of the above-described embodiment can also be applied to X-rays in which the scintillator is provided on one surface side of the active matrix substrate imaging panel. In addition, the scintillator is arranged on the surface side of the active matrix substrate for X-ray irradiation.

(4) In the above-mentioned embodiment, the active matrix substrate 1 used in an X-ray imaging panel has been described as an example. source matrix substrate.

(5) In the above-mentioned embodiment, the number of the data lines 10, the gate lines 11, and the number of the contacts 15a, 15b are not limited to the above-mentioned numbers. In addition, in the above-mentioned embodiment, it is sufficient that a plurality of terminals for inspection are dispersedly arranged in the terminal group connected to the wiring group of at least one of the data line 10 and the gate line 11 . That is, each inspection terminal of the plurality of inspection terminals may be provided with respect to one or more terminals adjacent to both sides of the inspection terminal, or may be provided with respect to one side of the inspection terminal. adjacent to one or more terminals.

In addition, the relationship between one terminal for inspection and one or more terminals adjacent to the terminal for inspection conforms to any of the following patterns.

(i) One terminal for inspection is provided for a plurality of terminals adjacent to both sides of the terminal for inspection, respectively.

(ii) One terminal for inspection is provided for one terminal adjacent to each of both sides of the terminal for inspection.

(iii) One terminal for inspection is provided for one terminal adjacent to one side of the terminal for inspection.

(iv) One terminal for inspection is provided for a plurality of terminals adjacent to one side of the terminal for inspection.

(v) One terminal for inspection is provided for one terminal adjacent to one side of the terminal for inspection and a plurality of terminals adjacent to the other side of the terminal for inspection.

As described above, by measuring the potential of one terminal for inspection, it can be determined whether or not the position of the probe with respect to one or more terminals adjacent to at least one of the terminals for inspection is appropriate.

The above-described active matrix substrate and inspection apparatus can be described as follows.

The active matrix substrate includes: a substrate; a plurality of gate lines arranged in one direction on the substrate; a plurality of data lines arranged on the substrate so as to intersect the plurality of gate lines; a first terminal group, which is arranged with a plurality of terminals connected to one end of the plurality of gate lines; a second terminal group, which is arranged with a plurality of terminals connected to one end of the plurality of data lines ; and a plurality of terminals for inspection, which are distributed among the plurality of terminals in at least one terminal group of the first terminal group and the second terminal group and are connected to each other (first configuration).

According to the first configuration, the active matrix substrate includes the first terminal group formed by arranging the terminals connected to the gate lines, and the second terminal group formed by arranging the terminals connected to the data lines. In addition, the active matrix substrate includes a plurality of terminals for inspection that are distributed among the plurality of terminals in at least one terminal group. A plurality of terminals for inspection are wired to each other.

In the manufacturing process of the active matrix substrate, in the case of performing an operation confirmation inspection such as whether a voltage is properly applied to the gate lines or the data lines, the probes used for the inspection are brought into contact with the first terminal group and the second terminal group. At least one terminal group. In the above configuration, the plurality of terminals for inspection, which are distributed among the plurality of terminals in at least one terminal group, are connected to each other. When the terminals for inspection and the probes are properly brought into contact with each other, the potentials of the plurality of probes in contact with the plurality of terminals for inspection become equal potentials. Therefore, by detecting the potential of the probe with respect to the terminal for inspection, it can be confirmed whether the position of the probe with respect to each terminal in at least one terminal group is appropriate, and the operation confirmation inspection can be performed appropriately. In addition, in the above-mentioned configuration, since the terminals for inspection are distributed among the plurality of terminals in at least one terminal group, compared with the case where the terminals at both ends of the plurality of terminals are connected for inspection, the The degree of freedom of design is improved.

In the first configuration, each of the plurality of terminals for inspection may be provided for one or a plurality of terminals adjacent to the terminal for inspection (second configuration).

According to the second configuration, by detecting the potential of the probe in contact with the inspection terminal, it can be determined whether or not one or more terminals adjacent to the inspection terminal and the corresponding probe are properly contacted.

In the first or second configuration, a plurality of photoelectric conversion elements may be provided in each of a plurality of pixels defined by the plurality of gate lines and the plurality of data lines. and a bias wiring for supplying a bias voltage to each of the plurality of photoelectric conversion elements, and each terminal for inspection is connected to the bias wiring (third configuration).

According to the third configuration, since each inspection terminal is connected to the bias wiring, each inspection terminal can also function as a terminal for applying a bias voltage to the photoelectric conversion element of each pixel.

In the second or third configuration, the shape and size of each of the plurality of terminals for inspection may be equal to the shape and size of one or more terminals adjacent to the terminal for inspection (No. four components).

According to the fourth configuration, compared with the case where the shape and size of the inspection terminal are different from the shape and size of one or more terminals adjacent to the inspection terminal, it is easier to design the area where the terminal is formed.

The inspection apparatus includes: a plurality of first probes provided corresponding to each of the plurality of inspection terminals in the active matrix substrate having any of the first to fourth configurations; a plurality of first probes Two probes, which are provided corresponding to each terminal of the plurality of terminals in the at least one terminal group in the active matrix substrate; and a measurement circuit, which is connected with the plurality of first probes, so that the The measurement circuit applies a predetermined voltage to the other first probes other than one of the plurality of first probes, and detects the voltage in the one first probe (fifth configuration).

According to the fifth configuration, in the inspection apparatus, the first probe is provided for each inspection terminal on the active matrix substrate, and the first probe is provided for at least one of the first terminal group and the second terminal group on the active matrix substrate. Each terminal is provided with a second probe. When the respective first probes are properly in contact with the corresponding terminals, the voltages in all the first probes become equal. Therefore, the positions of the first probe and the second probe can be adjusted according to the detection result of the voltage in the first probe, and the operation confirmation inspection can be appropriately performed.

Description of reference numerals

1...active matrix substrate; 2...inspection device; 10...data line; 11...gate line; 13...bias wiring; 17a, 17b, 27a...common wiring; 21...TFT; 22...photoelectric conversion element; 151...data terminal; 152, 152L, 152R, 152U, 152D...bias terminal; 154...gate terminal; 200...probe group; 201...probes; 211a, 211b...switching circuit; 212...potential measuring circuit; 213...power supply;

Claims (5)

1. An active matrix substrate, comprising:

a substrate;

a plurality of gate lines arranged in one direction on the substrate;

a plurality of data lines arranged on the substrate in such a manner as to cross the plurality of gate lines;

a first terminal group in which a plurality of terminals connected to one end portions of the plurality of gate lines are arranged;

a second terminal group in which a plurality of terminals connected to one end of the plurality of data lines are arranged; and

and a plurality of inspection terminals which are arranged in a dispersed manner between the plurality of terminals in at least one of the first terminal group and the second terminal group and which are connected to each other.

2. The active matrix substrate according to claim 1,

each of the plurality of inspection terminals is provided for one or more terminals adjacent to the inspection terminal.

3. The active matrix substrate according to claim 1, comprising:

a plurality of photoelectric conversion elements disposed on each of a plurality of pixels defined by the plurality of gate lines and the plurality of data lines; and

a bias wiring that supplies a bias voltage to each of the plurality of photoelectric conversion elements,

each of the inspection terminals is connected to the bias wiring.

4. The active matrix substrate according to claim 2,

the shape and size of each of the plurality of inspection terminals are equal to the shape and size of one or more terminals adjacent to the inspection terminal.

5. An inspection apparatus, comprising:

a plurality of first probes provided corresponding to each of the plurality of inspection terminals in the active matrix substrate according to claim 1;

a plurality of second probes provided corresponding to each of the plurality of terminals in the at least one terminal group in the active matrix substrate; and

a measurement circuit connected to the plurality of first probes,

the measurement circuit applies a predetermined voltage to the other first probes than the one first probe among the plurality of first probes, and detects the voltage in the one first probe.

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