CN111491439A - Circuit board assembly and electronic equipment - Google Patents

Abstract

The invention discloses a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board body, an electronic device and a shielding film assembly. The electronic device is arranged on the surface of the circuit board body, and the shielding film assembly is covered on the electronic device; wherein, the circuit The board body has a first grounding area, and the shielding film assembly includes a shielding layer and an insulating layer arranged in sequence, the insulating layer is located between the shielding layer and the electronic device, and the edge of the shielding layer is electrically connected to the first grounding area; the shielding film assembly is provided with In the avoidance area, the electronic device includes a first device, and the first device includes a device body and a ground terminal. In the avoidance area, the shielding layer penetrates the insulating layer and is electrically connected to the ground terminal. The above solution can solve the problem that the shielding film and the insulating film are easily peeled off and the shielding effect is reduced when the current circuit board assembly is thinned.

Description

Circuit board assemblies and electronic equipment

technical field

Embodiments of the present invention relate to the technical field of communication devices, and in particular, to a circuit board assembly and an electronic device.

Background technique

With the rapid development of science and technology, the performance of electronic devices (such as mobile phones, tablet computers, etc.) is continuously optimized. At the same time, in order to obtain a better user experience, the thin and light design of electronic devices has become a development trend. At present, in order to realize the thin and light design of electronic devices, one of the thinning processes is based on the improvement of circuit board components. By attaching insulating films to the surfaces of circuit boards and devices, a layer of shielding film with conductive properties is attached. It is attached to the surface of the insulating film, and the edge of the shielding film is connected to the ground pad of the circuit board to form a Faraday cage to electromagnetically shield the circuit board assembly, instead of the traditional metal shielding frame and metal shielding cover, thereby thinning the circuit board The thickness of the components ultimately realizes the thinning of electronic devices.

When the above-mentioned thinning treatment process is applied, gaps are likely to exist between the shielding film and the insulating film, and between the insulating film and the device, leaving air bubbles. In this case, the adhesion reliability of the shielding film and the insulating film will be weakened. Once the shielding film and insulating film fall off, the shielding effect will be reduced, causing electromagnetic interference.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a circuit board assembly and an electronic device, so as to solve the problem that the shielding film and the insulating film are easily peeled off and the shielding effect is reduced when the current circuit board assembly is thinned.

In order to solve the above-mentioned problems, the present invention is implemented as follows:

In a first aspect, an embodiment of the present invention provides a circuit board assembly, which includes a circuit board body, an electronic device, and a shielding film assembly, wherein the electronic device is disposed on the surface of the circuit board body, and the shielding film assembly is covered on the The electronic device; wherein the circuit board body has a first ground area, the shielding film assembly includes a shielding layer and an insulating layer that are stacked in sequence, and the insulating layer is located between the shielding layer and the electronic device , the edge of the shielding layer is electrically connected with the first grounding area.

The shielding film assembly is provided with an escape area, the electronic device includes a first device, and the first device includes a device body and a ground terminal. In the escape area, the shielding layer penetrates the insulating layer and is connected to the The ground terminal is electrically connected.

In a second aspect, an embodiment of the present invention further provides an electronic device, including the aforementioned circuit board assembly.

The technical scheme adopted in the present invention can achieve the following beneficial effects:

In the embodiment of the present invention, the shielding layer is fixed by electrically connecting the shielding layer to the ground terminal of the first device, thereby realizing the fixing of the shielding film assembly. Compared with the prior art, the circuit board assembly disclosed in the embodiment of the present invention can not only prevent the shielding film assembly from falling off the surface of the electronic device, but also reliably ground the shielding layer, ensuring that the circuit board assembly has a better shielding effect.

Description of drawings

The accompanying drawings described herein are used to provide further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention.

FIG. 1 is a schematic structural diagram of a circuit board assembly disclosed in an embodiment of the present invention;

2 is a schematic structural diagram of an extension part disclosed in an embodiment of the present invention from a top view;

Description of reference numbers:

100-circuit board body, 110-first grounding area, 120-second grounding area,

200-shielding film assembly, 210-shielding layer, 211-extension, 220-insulation layer, 230-avoidance area,

300-first device, 310-device body, 320-ground terminal, 321-electrical connector.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The technical solutions disclosed by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 and FIG. 2 , an embodiment of the present invention discloses a circuit board assembly including a circuit board body 100 , an electronic device and a shielding film assembly 200 .

The circuit board body 100 is the basic component of the circuit board assembly, which provides a mounting support base for both the electronic device and the shielding film assembly 200 . It should be understood that electronic devices will generate electromagnetic waves during operation, and these electromagnetic waves will cause electromagnetic interference to other devices other than the circuit board assembly. Correspondingly, the electronic devices on the circuit board assembly are also susceptible to electromagnetic interference from other devices. , so in order to ensure the normal operation of the electronic device, the electronic device on the circuit board assembly needs to be electromagnetically shielded. In the embodiment of the present invention, the electromagnetic shielding is realized by the shielding film assembly 200 .

In the embodiment of the present invention, the electronic device is disposed on the surface of the circuit board body 100 , and the shielding film assembly 200 is placed on the electronic device to shield the electronic device on the circuit board body 100 .

The circuit board body 100 has a first ground area 110 , and the first ground area 110 is usually connected to the ground network (GND) of the circuit board body 100 . The shielding film assembly 200 includes a shielding layer 210 and an insulating layer 220 that are stacked in sequence, and the insulating layer 220 is located between the shielding layer 210 and the electronic device. It should be understood that the shielding film assembly 200 can realize the thinning design of the circuit board assembly. In order to enable the shielding film assembly 200 to be attached to the surface of the electronic device, the shielding film assembly 200 should be a flexible structural member. Under such arrangement, the gap between the shielding film assembly 200 and the electronic device is reduced as much as possible, so that the overall thickness of the circuit board assembly is reduced, thereby realizing the thinning of the circuit board assembly.

Since direct contact between the shielding layer 210 and the electronic device may lead to short circuit, the insulating layer 220 is located between the shielding layer 210 and the electronic device, which can separate the shielding layer 210 and the electronic device, thereby avoiding short circuit failure.

Meanwhile, the edge of the shielding layer 210 is electrically connected to the first ground region 110 . It should be understood that the shielding structure usually needs to be grounded. Since currents are formed on the shielding structure, a potential difference is formed at different places of the shielding structure, and the impedance of the ground signal is low, and the shielding structure can be grounded to conduct these currents away. Specifically, the edge of the shielding layer 210 is connected to the ground network (GND) on the circuit board body 100 through the first grounding area 110 to achieve grounding, and the current on the shielding layer 210 can be conducted through the first grounding area 110 . The first grounding region 110 may be a grounding pad, and the shielding layer 210 may be electrically connected to the grounding pad by welding, thermoforming or the like.

In the embodiment of the present invention, the shielding film assembly 200 is provided with an escape area 230 . It should be understood that the escape area 230 is an area where windows are opened on the shielding film assembly 200 . In the prior art, since there are some large-sized electronic devices (such as integrated circuits, etc.) in the circuit board assembly, if the shielding film assembly 200 is attached to the surface of these electronic devices, the overall thickness of the circuit board assembly will be increased; at the same time, There are also some electronic devices, the top surfaces of which are mostly made of resin, glass, etc., have good insulating properties, and do not need to be shielded.

Therefore, the shielding film assembly 200 is usually opened on the surface of these electronic devices, and at least part of the shielding film assembly 200 projected on the surface of these electronic devices is peeled off, that is, the avoidance area 230 is formed, but at the same time, the shielding is also caused. It is difficult for the edge of the membrane assembly 200 to surround the escape area 230 to be connected to the ground network of the circuit board body 100 , which affects the shielding effect. Of course, in the embodiment of the present invention, there is no limitation on the specific window opening of the shielding film assembly 200 , for example, windows can be correspondingly opened above all electronic devices. It should be noted that the shielding layer 210 and the insulating layer 220 are usually connected by bonding, and the shielding layer 210 and the insulating layer 220 will not be separated during the process of opening the window of the shielding film assembly 200 .

In this embodiment of the present invention, the electronic device may include a first device 300, wherein the first device 300 includes a device body 310 and a ground terminal 320. Specifically, the ground terminal 320 is connected to the device body 310, and the ground terminal 320 can be connected to on the circuit board body 100 to fix the first device 300 on the circuit board body 100 and realize grounding.

Meanwhile, in the escape area 230 , the shielding layer 210 penetrates through the insulating layer 220 and is electrically connected to the ground terminal 320 . It should be understood that the ground terminal 320 is electrically connected to the ground network on the circuit board body 100, and is also electrically connected to the shielding layer 210, so as to realize reliable grounding of the shielding layer 210 around the avoidance area 230, thereby preventing the shielding effect from being affected. At the same time, the ground terminal 320 can fix the shielding layer 210 around the avoidance area 230, and as mentioned above, the shielding layer 210 and the insulating layer 220 are usually connected by bonding. Therefore, under this setting, It is equivalent to forming an attachment point on the electronic device, thereby realizing the fixation of the shielding film assembly 200 and preventing the shielding film assembly 200 from falling off from the electronic device at the avoidance area 230 .

As can be seen from the above description, in the embodiment of the present invention, the shielding layer 210 is fixed by electrically connecting the shielding layer 210 to the ground terminal 320 of the electronic device, thereby realizing the fixing of the shielding film assembly 200 . Compared with the prior art, the circuit board assembly disclosed in the embodiment of the present invention can not only prevent the shielding film assembly 200 from falling off the surface of the electronic device, but also reliably ground the shielding layer 210, ensuring that the circuit board assembly has a better shielding effect.

Please refer to Figure 1 and Figure 2 again:

In the embodiment of the present invention, in a direction perpendicular to the circuit board body 100 , the avoidance area 230 at least partially covers the ground terminal 320 . The embodiment of the present invention does not limit the specific type of the avoidance area 230. In the avoidance area 230, only part of the ground terminals 320 may be exposed, or all of the ground terminals 320 may be exposed, as long as the shielding layer 210 can be electrically connected to the ground terminals 320. Can.

Of course, only the ground terminal 320 may be exposed to the shielding film assembly 200 through the escape area 230 . In this way, the avoidance area 230 only needs small openings, and the small openings have little influence on the overall shielding effect of the circuit board assembly.

In the embodiment of the present invention, the electrical connection relationship between the grounding terminal 320 and the shielding layer 210 can be various, which is not limited in the embodiment of the present invention, such as bonding, thermoforming, etc., but it is necessary to ensure that the grounding terminal 320 and the shielding layer 210 are connected to each other. The conductive relationship of the shielding layer 210 is sufficient. In a specific embodiment, the grounding terminal 320 can be welded with the shielding layer 210 , and in this way, the connection stability and reliability of the grounding terminal 320 and the shielding layer 210 can be improved.

As mentioned above, the shielding film assembly 200 should be a flexible structural member. Based on this, in an optional solution, the shielding layer 210 may be a copper layer, that is, a copper foil. Copper foil is a conventional material in the electronic field and is easy to obtain. With this arrangement, the shielding layer 210 has good electrical conductivity and welding properties, which is beneficial to the stable connection between the shielding layer 210 and the ground terminal 320 ; at the same time, the shielding layer 210 also has good flexibility, which is also beneficial to the shielding film assembly 200 . Attachment settings with electronics. Of course, the embodiment of the present invention does not limit the specific type of the shielding layer 210, which may also be a conductive metal layer such as an aluminum layer, a zinc layer, or the like, or a non-metallic layer with conductive properties.

In order to facilitate the connection between the ground terminal 320 and the circuit board body 100, and to improve the connection stability and reliability of the two, in an optional solution, the circuit board body 100 may have a second ground area 120, and the shielding layer 210 is grounded through The terminal 320 is electrically connected to the second ground area 120 . Under this arrangement, the grounding process of the grounding terminal 320 can be completed only by installing the grounding terminal 320 on the second grounding area 120 .

Of course, the embodiment of the present invention does not limit the specific structure type of the second grounding area 120. In a specific embodiment, the second grounding area 120 can be selected as a grounding pad area. In a specific installation process, only the grounding The terminal 320 is installed on the ground pad area corresponding to the second ground area 120 , which not only realizes the stable installation of the first device 300 .

When opening the shielding film assembly 200, the shielding layer 210 and the insulating layer 220 in the area of the escape area 230 are usually cut and then peeled off, but in this case, the shielding layer 210 around the escape area 230 is usually connected to the ground. There is a distance between the terminals 320 and direct connection cannot be made.

Based on this, in an optional solution, an electrical connector 321 is provided on the side of the ground terminal 320 close to the shielding film assembly 200 , the electrical connector 321 is at least partially protruded from the device body 310 , and the shielding layer 210 is connected to the The ground terminal 320 is electrically connected. It should be understood that the electrical connector 321 is at least partially protruding from the device body 310 , that is to say, the electrical connector 321 has a certain length dimension, which can make up the distance between the ground terminal 320 and the shielding layer 210 , and at the same time the electrical connector 321 will ground the The terminal 320 is connected with the shielding layer 210 to realize the fixing of the shielding film assembly 200 .

Certainly, in the embodiment of the present invention, there may be various specific types of the electrical connector 321 , which are not limited in the embodiment of the present invention. For example, the electrical connector 321 may be a pad electrode, a copper strip, or the like.

In another optional solution, the shielding layer 210 may have an extension portion 211 , and in the escape area 230 , the extension portion 211 penetrates the insulating layer 220 and is electrically connected to the ground terminal 320 . Similar to the electrical connector 321 , the extension portion 211 electrically connects the ground terminal 320 and the shielding layer 210 together. The extension portion 211 has a certain length dimension, which can compensate for the distance between the grounding terminal 320 and the shielding layer 210 , while the shielding layer 210 passes through The extension portion 211 is connected to the ground terminal 320 to realize the fixation of the shielding film assembly 200 . Certainly, the embodiment of the present invention does not limit the specific type of the extension portion 211 .

In a further optional solution, the extension portion 211 may be integrally formed with the shielding layer 210 , which can be understood as being drawn out from the shielding layer 210 , or the shielding layer 210 forms the extension portion 211 by electroplating. With this arrangement, the conduction reliability and connection stability of the shielding layer 210 and the extension portion 211 can be improved, thereby making the grounding effect better.

In a specific embodiment, after the shielding layer 210 is cut, the part is not peeled off, and one side of the part is connected with the shielding layer 210 to form the extension part 211 . It should be understood that the extension portion 211 is a part of the shielding layer 210 in the area of the escape area 230 . Specifically, the extension portion 211 is bent and extends into the avoidance area 230 . After the extension portion 211 is bent, it can pass through the avoidance area 230 and be electrically connected to the ground terminal 320 , thereby realizing the electrical connection between the shielding layer 210 and the ground terminal 320 , and finally to the ground terminal 320 . The shielding film assembly 200 is attached and fixed.

The electronic device may include a plurality of first devices 300 . Of course, the embodiment of the present invention does not limit the specific number of the first devices 300 . This embodiment of the present invention does not limit the specific relationship between the first device 300 and the avoidance area 230 . In one embodiment, in a direction perpendicular to the circuit board body 100 , the ground terminal 320 of each first device 300 is at least partially Covered by the avoidance area 230 , and the ground terminal 320 of each first device 300 is electrically connected to the shielding layer 210 .

In this case, since there are multiple first devices 300, the number of ground terminals 320 increases accordingly. At this time, the number of connection points between the ground terminals 320 and the shielding layer 210 also increases accordingly. When the density reaches a certain level, it will be possible to The overall installation adhesion of the shielding film assembly 200 is improved, and even when the circuit board assembly is deformed, subjected to thermal stress, etc., it can be ensured that the shielding film assembly 200 does not fall off.

Typically, the electronic device further includes a second device, and the shielding film assembly 200 covers the second device in a direction perpendicular to the circuit board body 100 . It should be understood that, in order to ensure the shielding effect of the shielding film assembly 200 , the size of the avoidance area 230 needs to be limited, so there is a second device completely covered by the shielding film assembly 200 in the circuit board assembly.

In the embodiment of the present invention, the specific shape of the avoidance area 230 is not limited. In order to adapt to the shape of the electronic device itself, the avoidance area 230 can be selected as a square avoidance area or a rectangular avoidance area. Of course, the avoidance area 230 can also be other Shapes, such as circles, irregular shapes, etc.

Based on the foregoing circuit board assembly, an embodiment of the present invention further discloses an electronic device including the foregoing circuit board assembly. The electronic devices referred to in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, and wearable devices, and the embodiments of the present invention do not limit specific types of electronic devices.

The above embodiments of the present invention mainly describe the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form better embodiments. No longer.

The above descriptions are merely embodiments of the present invention, and are not intended to limit the present invention. Various modifications and variations of the present invention are possible for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.

Claims (10)

1. A circuit board assembly, comprising a circuit board body (100), an electronic device disposed on a surface of the circuit board body (100), and a shielding film assembly (200) covering the electronic device; the circuit board body (100) is provided with a first grounding area (110), the shielding film assembly (200) comprises a shielding layer (210) and an insulating layer (220) which are sequentially stacked, the insulating layer (220) is positioned between the shielding layer (210) and the electronic device, and the edge of the shielding layer (210) is electrically connected with the first grounding area (110);

the shielding film assembly (200) is provided with a relief area (230), the electronic device comprises a first device (300), the first device (300) comprises a device body (310) and a ground terminal (320), and the shielding layer (210) penetrates through the insulating layer (220) in the relief area (230) and is electrically connected with the ground terminal (320).

2. The circuit board assembly according to claim 1, characterized in that the relief area (230) at least partially covers the ground terminal (320) in a direction perpendicular to the circuit board body (100).

3. The circuit board assembly according to claim 1, characterized in that the circuit board body (100) has a second grounding region (120), the shielding layer (210) being electrically connected with the second grounding region (120) through the grounding terminal (320).

4. A circuit board assembly according to claim 3, wherein the second ground region (120) is a ground pad region.

5. The circuit board assembly according to claim 1, wherein the ground terminal (320) is provided with an electrical connector (321) near a side of the shielding film assembly (200), the electrical connector (321) at least partially protrudes from the device body (310), and the shielding layer (210) is electrically connected with the ground terminal (320) through the electrical connector (321).

6. A circuit board assembly according to claim 1, characterized in that the electronic device comprises a plurality of first devices, in a direction perpendicular to the circuit board body (100), the ground terminal (320) of each first device (300) is at least partially covered by the relief area (230), and the ground terminal (320) of each first device (300) is electrically connected to the shielding layer (210).

7. The circuit board assembly according to claim 1, wherein the electronic device further comprises a second device, the shielding film assembly (200) covering the second device in a direction perpendicular to the circuit board body (100).

8. The circuit board assembly of claim 1, wherein the bypass area (230) is a square bypass area or a rectangular bypass area.

9. The circuit board assembly of claim 1, wherein the shielding layer (210) has an extension (240), and the extension (240) penetrates the insulating layer (220) and is electrically connected to the ground terminal (320) in the relief region (230).

10. An electronic device, characterized in that it comprises a circuit board assembly according to any one of the preceding claims 1 to 9.

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