CN111477616A - Integrated support - Google Patents

Abstract

An integrated bracket, the present invention relates to the field of LED technology; pins a, b, c and d of an IC chip are respectively connected with pins 1, 2, 3 and 4 of the bracket ; Pin e, pin f, pin g and pin h of the IC chip are respectively connected with the functional area A, functional area B, functional area C and functional area D of the bracket; several chips are respectively fixed in the functional area E, Function area F, function area G, function area H. The production process is simplified, the overall reliability of the product is improved, the matching degree between the functional design of electronic components and the bracket design is increased, the influence of IC electronic components on the light emission of LED chips is avoided, and the cost and price are reduced.

Description

an integrated stand

technical field

The invention relates to the technical field of LEDs, in particular to an integrated bracket.

Background technique

As the market continues to mature, more and more requirements are placed on the color and integration of lamp beads. A bracket not only needs to place LED light-emitting chips on the bracket, but also sometimes needs to place electronic components on the bracket (such as : Place the Zener tube to stabilize the voltage), through the electronic components, to optimize and control the electrical performance of the lamp beads, and list two commonly used methods:

1. Place the Zener tube to stabilize the voltage;

2. Place the IC, and control the LED chip through the IC, including controlling the light-emitting time, light-emitting frequency, light-emitting current, etc., so as to realize the control of the color effect of the entire light strip or screen.

Existing stents have the following disadvantages:

1. The production process is complicated;

2. The placement position of electronic components should be determined according to the shape of the bracket functional area, LED chips, etc.; for large electronic components, a bracket functional area is often not enough to place, usually it needs to be placed across the white road. At this time, the white road is convex and uneven. And other factors will cause the bonding glue to be not tightly combined, the thrust is insufficient, and the heat dissipation of the electronic components is not good. The machine exists when placing the components: the suction force for the components is insufficient, and the chips cannot be sucked, so the operation cannot be performed;

3. At present, the electrical connection method of commonly used electronic components has the following disadvantages:

a. Possible welding problems in the interface of electronic components: due to the inconsistency between the interface of electronic components and the electrodes of the LED chip, when using wires of the same diameter to wire, there may be: inconsistent solder balls; Smaller solder balls require larger solder balls at the IC component interface, but the same wire obviously cannot meet the size requirements of both solder balls at the same time;

b. The wire connection is messy. According to the needs of electrical design, the interface position of the electronic component and the bracket pin position often cannot correspond, and the cross-chip connection occurs when the wire is soldered, and there is a risk of cross-contact between the wires;

c. The span of the wire welding line is large, and there is a long wire rod, which is prone to the hidden danger of line collapse;

d. Due to the messy connection of the wire, the large span of the wire, the mismatch between the component interface and the pin position of the bracket, etc., the welding arc and the welding mode are not easy to set, resulting in poor reliability of the wire. Poor, affecting the overall reliability of the product;

4. The functional design of electronic components does not match the bracket design, and there are the following disadvantages:

e. There are many functional interfaces on IC components, but during use, due to the small number of bracket pins, only part of the functions of IC components are actually used, resulting in that the functions of IC electronic components cannot be fully utilized, and functions are wasted;

f. Due to the inconsistent design purpose of IC electronic component design and bracket design, the functional matching differences between the two, such as insufficient functional utilization and low functional integration, will directly or indirectly affect the cost price;

5. IC electronic components are placed in the functional area of the bracket, which will affect the luminous brightness and color of the LED chip due to the blocking of the IC chip and the wire.

SUMMARY OF THE INVENTION

The purpose of the present invention is to aim at the defects and deficiencies of the prior art, to provide an integrated bracket with a simple structure, reasonable design and convenient use, simplifying the production process, improving the overall reliability of the product, and matching the functional design of electronic components with the design of the bracket. Increase, avoid the influence of IC electronic components on the light emission of LED chips, and reduce the cost and price.

In order to achieve the above-mentioned purpose, the technical scheme adopted in the present invention is as follows: it includes a bracket, an IC chip, and a wafer; the left horizontal surface of the inner bottom of the cup mouth of the bracket is sequentially provided with functional area A, functional area B, functional area C, Functional area D; the horizontal surface on the right side of the inner bottom of the cup mouth of the bracket is sequentially provided with functional area H, functional area G, functional area F, and functional area E from top to bottom; the IC chip is embedded in the interior of the bracket, and the IC Pin a, pin b, pin c and pin d of the chip are respectively connected with pin 1, pin 2, pin 3 and pin 4 of the bracket; The pin g and the pin h are respectively connected with the functional area A, functional area B, functional area C and functional area D of the bracket; several chips are respectively fixed on the functional area E, functional area F, functional area G and functional area H, And the chip on the functional area E is conductively connected with the functional area D and the functional area E by using gold wires; the chip on the functional area F is conductively connected with the functional area C and the functional area F by using the gold wire; The gold wires are conductively connected to the functional area B and the functional area G; the chip on the functional area H is conductively connected to the functional area A and the functional area H by using the gold wires.

Further, the IC chip is arranged at the bottom of the bracket.

Further, the type, color, quantity, serial-parallel mode and arrangement order of the wafers on the support are not limited.

The processing steps of the present invention are as follows:

1. Match the pin function sequence of the IC chip with the pin function of the bracket, and process the bracket and IC chip at the production place;

2. Encapsulate the IC chip into the bracket to form a bracket with nested IC chips, wherein the pins a, b, c and d of the IC chip are respectively connected with the pins 1 and 1 of the bracket. 2. Pin 3 and pin 4 are connected, and pin e, pin f, pin g and pin h of IC chip 2 are respectively connected with functional area A, functional area B, functional area C and functional area D of the bracket , so that the IC chip and the bracket are electrically connected together;

3. Bond the wafer on the functional area H, functional area G, functional area F, and functional area E in the support;

4. Finally, use gold wires to connect the IC chip, the functional area and the wafer.

After the above structure is adopted, the beneficial effects of the present invention are as follows: for the integrated bracket of the present invention, the production process is simplified, the overall reliability of the product is improved, the matching degree between the functional design of the electronic components and the bracket design is increased, and the interference of IC electronic components is avoided. The LED chip emits light and reduces the cost and price, and the invention has the advantages of simple structure, reasonable setting, low manufacturing cost and the like.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

Figure 1 is a schematic structural diagram of the present invention.

Figure 2 is a top view of an embodiment.

Figure 3 is a bottom view of an embodiment.

Figure 4 is a side view of the present invention.

FIG. 5 is a schematic structural diagram of an IC chip in the present invention.

FIG. 6 is a schematic view of the structure of the stent in the present invention.

FIG. 7 is a function diagram of IC chip pins in a specific embodiment.

Description of reference numbers:

Support 1, IC chip 2, wafer 3, gold wire 4.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings.

1-7, the technical solution adopted in this specific embodiment is: it includes a bracket 1, an IC chip 2, and a wafer 3; the bracket 1 is made of plastic material, which plays the role of fixing several functional areas , and create a corresponding safe space for the electrical circuit, the color of the plastic material can be white PCT, white PPA, black PPA or transparent PC, etc.; the cup mouth of bracket 1 can be round, square, oval, etc., the cup of bracket 1 can be Functional area A, functional area B, functional area C, and functional area D are arranged on the left horizontal surface of the inner bottom of the mouth from top to bottom in order; Functional area G, functional area F, and functional area E (the above-mentioned functional areas are structural functional areas of different shapes formed by combining metal brackets and plastic materials); the IC chip 2 is embedded in the interior of the bracket 1, and the IC Pin a, pin b, pin c and pin d of chip 2 are respectively connected with pin 1, pin 2, pin 3 and pin 4 of bracket 1; pin e, pin of IC chip 2 f, pin g and pin h are respectively connected with functional area A, functional area B, functional area C and functional area D of bracket 1; several chips 3 are respectively fixed in functional area E, functional area F, functional area G, On the functional area H, and the chip 3 on the functional area E is connected with the functional area D and the functional area E by the gold wire 4; the chip 3 on the functional area F is connected with the functional area C and the functional area F by the gold wire 4. Connection; the chip 3 on the functional area G is connected with the functional area B and the functional area G by the gold wire 4; the chip 3 on the functional area H is connected with the functional area A and the functional area H by the gold wire 4.

The processing steps of this specific embodiment are as follows:

1. Set the pin function sequence of IC chip 2 (pin 1 is GND, pin 2 is VDD, pin 3 is DIN, pin 4 is DO, pin 5 is OUTB, pin 6 is OUTG, and 7 is OUTR, pin 8-bit OUTW) and the pin function of bracket 1 match, bracket 1 and IC chip 2 are processed and fabricated;

2. The IC chip 2 is encapsulated inside the bracket 1 to form a bracket in which the IC chip is nested, wherein the pins a, b, c and d of the IC chip 2 are respectively connected with the pins of the bracket 1. 1. Pin 2, pin 3 and pin 4 are connected. Pin e, pin f, pin g and pin h of IC chip 2 are respectively connected with functional area A, functional area B, and functional area C of bracket 1. Connect with the functional area D, thereby electrically connecting the IC chip 2 and the bracket 1 together;

3. Bond the wafer 3 on the functional area H, functional area G, functional area F, and functional area E in the support 1;

4. Finally, use gold wires to connect the IC chip 2, the functional area and the chip, that is, the B chip on the functional area E is connected to the functional area D and the functional area E by the gold wire 4; G on the functional area F The chip is connected with the functional area C and the functional area F by the gold wire 4; the R chip on the functional area G is connected with the functional area B and the functional area G by the gold wire 4; the W chip on the functional area H uses the gold wire 4. Conductive connection with functional area A and functional area H.

After adopting the above structure, the beneficial effects of this specific embodiment are:

1. The production process is simplified: IC electronic components no longer need to be placed in the functional area of the bracket through the machine, only the LED chip needs to be placed, and the conventional die-bonding machine can be used for operation;

2. Electrical connection of electronic components: IC chips do not need to be connected by wires, but only need to wire the LED chips, which reduces the difficulty of wire bonding. The wire bonding mode and arc can also be wired in a conventional way, thereby enhancing the overall trust of the product. sex;

3. The matching degree between the functional design of electronic components and the bracket design is increased: because this bracket is positioned to integrate IC electronic components and brackets before the design, so as to avoid waste caused by excessive functional design of IC electronic components and reduce cost and price ;

4. Avoid the influence of IC electronic components on the light-emitting of the LED chip: Since the IC electronic components are nested inside the bracket, they are not placed in the functional area of the bracket, so as to avoid shading effects on the light-emitting and color of the LED chip. At this time, only the LED chip is placed in the functional area of the bracket, which can reduce the area of the ABCD functional area of the bracket (the ABCD functional area is only used for electrical connection, leaving enough area for bonding wires, and increasing the area of the functional area of the LED chip to improve the LED chip luminescence As a result, more chips can be placed in the chip functional area;

5. Before the design of the bracket, it is positioned to integrate the IC electronic components with the bracket, so as to avoid waste caused by excessive design of IC electronic components and reduce the cost and price.

The above is only used to illustrate the technical solution of the present invention and not to limit it. Other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solution of the present invention, as long as they do not depart from the spirit and scope of the technical solution of the present invention, should be Included within the scope of the claims of the present invention.

Claims (3)

1. An integrated support is characterized in that: it comprises a support, an IC chip, a wafer; the horizontal surface on the left side of the inner bottom of the cup mouth of the support is sequentially provided with functional area A, functional area B, functional area C, functional area from top to bottom. D; The horizontal surface on the right side of the inner bottom of the cup mouth of the bracket is sequentially provided with functional area H, functional area G, functional area F, and functional area E from top to bottom; the IC chip is embedded in the inside of the bracket, and the IC chip is Pin a, pin b, pin c and pin d are respectively connected with pin 1, pin 2, pin 3 and pin 4 of the bracket; pin e, pin f, pin g of the IC chip and pin h are respectively connected to the functional area A, functional area B, functional area C and functional area D of the bracket; several chips are respectively fixed on the functional area E, functional area F, functional area G and functional area H, and the functional area is The chip on the area E is connected to the functional area D and the functional area E by the gold wire; the chip on the functional area F is connected to the functional area C and the functional area F by the gold wire; the chip on the functional area G uses the gold wire It is conductively connected to the functional area B and the functional area G; the chip on the functional area H is conductively connected to the functional area A and the functional area H by using gold wires. 2 . The integrated support according to claim 1 , wherein the IC chip is arranged at the bottom of the support. 3 . 3. An integrated support, characterized in that: its processing steps are as follows: (1) Match the pin function sequence of the IC chip with the pin function of the bracket, and process the bracket and IC chip at the production site; (2) Encapsulate the IC chip into the bracket to form a bracket with the IC chip nested, wherein the pins a, b, c and d of the IC chip are respectively connected with the pins 1 and 1 of the bracket. Pin 2, pin 3 and pin 4 are connected, and pin e, pin f, pin g and pin h of IC chip 2 are respectively connected with the functional area A, functional area B, functional area C and functional area of the bracket D connection, so as to electrically connect the IC chip and the bracket together; (3), the wafer is bonded on the functional area H, functional area G, functional area F, and functional area E in the support; (4) Finally, use gold wires to connect the IC chip, the functional area and the wafer in a conductive manner.

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