CN111463564B - Preparation method of plastic antenna oscillator with high coating bonding strength - Google Patents
Preparation method of plastic antenna oscillator with high coating bonding strength Download PDFInfo
- Publication number
- CN111463564B CN111463564B CN202010147683.9A CN202010147683A CN111463564B CN 111463564 B CN111463564 B CN 111463564B CN 202010147683 A CN202010147683 A CN 202010147683A CN 111463564 B CN111463564 B CN 111463564B
- Authority
- CN
- China
- Prior art keywords
- plastic
- antenna
- plating
- bonding strength
- circuit area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 39
- 229920003023 plastic Polymers 0.000 title claims abstract description 39
- 239000011248 coating agent Substances 0.000 title claims abstract description 17
- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000010410 layer Substances 0.000 claims abstract description 37
- 238000007747 plating Methods 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 19
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- 238000004544 sputter deposition Methods 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 239000011241 protective layer Substances 0.000 claims abstract description 12
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 10
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 238000004381 surface treatment Methods 0.000 claims abstract description 7
- 239000013077 target material Substances 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000007822 coupling agent Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000012756 surface treatment agent Substances 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 150000004645 aluminates Chemical class 0.000 claims description 4
- 229920006393 polyether sulfone Polymers 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 229920002873 Polyethylenimine Polymers 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229920003208 poly(ethylene sulfide) Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- 239000012815 thermoplastic material Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 4
- 238000007788 roughening Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to the technical field of 5G communication, in particular to a preparation method of a plastic antenna oscillator with high coating bonding strength, which comprises the following steps: the method comprises the following steps that firstly, an antenna circuit area of a die is coarsened; step two, performing injection molding on thermoplastic plastics by adopting the mold in the step one to obtain a plastic oscillator body with a roughened surface antenna circuit area; step three, cleaning the oscillator body; step four, processing the surface of the vibrator body by adopting a surface treating agent; taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer on the antenna line area; plating a metal copper layer on the nickel layer by adopting electroplating or chemical plating, and then plating other metal protective layers; and finally, cleaning to obtain the antenna oscillator product.
Description
Technical Field
The invention relates to the technical field of 5G communication, in particular to a preparation method of an antenna oscillator.
Background
The antenna oscillator is a component on the antenna, has the functions of guiding and amplifying electromagnetic waves, and is one of key parts of the antenna; meanwhile, the geometric size of the antenna element corresponds to the wavelength of the received or transmitted electromagnetic wave, so that the maximum radiation and receiving effect can be achieved. The traditional antenna oscillator is mainly made of metal materials, and in the 5G communication era, the structure of the antenna can be greatly changed. On one hand, the number of the 5G antenna single-sector oscillators reaches 64, 128 or even 256, and the oscillator made of the metal material can cause the weight to be greatly increased, so that the problems of high cost, inconvenience in installation and the like are caused; on the other hand, the 5G working frequency is higher and higher, the wavelength is shorter and shorter, the requirement on the size precision of the oscillator is higher and higher, and the size precision of the oscillator made of the metal material cannot meet the requirement of the 5G antenna, so that the electric properties of the antenna, such as gain, a directional diagram, beam pointing, polarization characteristics and the like, are affected.
Plastic materials are not only low in density but also easy to mold. After the plastic material is directly injection molded, the metallization treatment is carried out, and the obtained plastic vibrator is light in weight and high in dimensional precision and can meet the requirements on the performance of the antenna vibrator in the 5G communication technology.
The vacuum sputtering process has simple process, is suitable for various plastic matrixes, and is widely applied to the metallization of the surface of plastic. However, the product obtained by the traditional vacuum sputtering process has the problem of low coating bonding strength, and is not suitable for antenna oscillator products with high requirements on the coating bonding strength.
Disclosure of Invention
The invention aims to provide a preparation method of a plastic antenna oscillator with high plating bonding strength, which aims to solve the technical problem.
The technical problem solved by the invention can be realized by adopting the following technical scheme:
the preparation method of the plastic antenna oscillator with high coating bonding strength is characterized by comprising the following steps:
the method comprises the following steps that firstly, an antenna circuit area of a die is coarsened;
step two, performing injection molding on thermoplastic plastics by adopting the mold in the step one to obtain a plastic oscillator body with a roughened surface antenna circuit area;
step three, cleaning the oscillator body;
step four, processing the surface of the vibrator body by adopting a surface treatment agent;
step five, taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer on the antenna circuit area;
plating a metal copper layer on the nickel layer by adopting electroplating or chemical plating, and plating other metal protective layers; and finally, cleaning to obtain the antenna oscillator product.
The thermoplastic plastics have no special requirement, and preferably one or an alloy of modified PC, ABS, PPS, PET, PBT, PA, POM, PPO, PES, PESU, LCP, PEEK and PEI.
The surface treating agent is one or more of silane coupling agent, aluminate coupling agent and titanate coupling agent.
The other metal protective layer is one or more of nickel, tin, silver and gold.
Has the advantages that: according to the invention, the line region of the oscillator antenna is subjected to roughening treatment by an injection molding process, so that the surface roughness of the line region of the oscillator body antenna is increased; meanwhile, the surface of the vibrator body is treated by adopting a surface treating agent, and a layer of active polar group-OH group is formed on the surface of the vibrator body; therefore, physical riveting force and chemical bond acting force are formed between the plating metal and the plastic substrate, and the bonding strength between the plating metal and the plastic substrate is greatly improved.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further explained below.
The preparation method of the plastic antenna oscillator with high coating bonding strength comprises the following steps: the method comprises the following steps that firstly, an antenna circuit area of a die is coarsened; step two, performing injection molding on thermoplastic plastics by adopting the mold in the step one to obtain a plastic oscillator body with a roughened surface antenna circuit area; step three, cleaning the oscillator body; step four, processing the surface of the vibrator body by adopting a surface treating agent; step five, taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer on the antenna circuit area; plating a metal copper layer on the nickel layer by adopting electroplating or chemical plating, and then plating other metal protective layers; and finally, cleaning to obtain the antenna oscillator product.
Example 1:
the plastic antenna oscillator with high coating bonding strength is prepared by the following method:
firstly, roughening a circuit area of a mold antenna;
step two, injection molding the modified PPS plastic by adopting the mold to obtain a plastic oscillator body with a roughened surface antenna circuit area;
step three, cleaning the oscillator body;
step four, treating the surface of the vibrator body by adopting a silane coupling agent;
taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer with the thickness of 0.05-1 mu m on the antenna circuit area;
step six, plating a metal copper layer with the thickness of 5-40 mu m on a nickel layer by adopting electroplating or chemical plating, and then plating a metal nickel protective layer with the thickness of 1-5 mu m; and finally, cleaning to obtain the antenna oscillator product.
Example 2:
the plastic antenna oscillator with high coating bonding strength is prepared by the following method:
firstly, roughening a circuit area of a mold antenna;
step two, injection molding the modified PPO plastic by adopting the mold to obtain a plastic oscillator body with a roughened surface antenna circuit area;
step three, cleaning the oscillator body;
step four, treating the surface of the vibrator body by using an aluminate coupling agent;
step five, taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer with the thickness of 0.05-1 mu m on the antenna circuit area;
step six, plating a metal copper layer with the thickness of 5-40 mu m on a nickel layer by adopting electroplating or chemical plating, and then plating a metal tin protective layer with the thickness of 1-5 mu m; and finally, cleaning to obtain the antenna oscillator product.
Example 3:
the plastic antenna oscillator with high coating bonding strength is prepared by the following method:
firstly, roughening a circuit area of a mold antenna;
step two, injection molding the modified LCP plastic by adopting the mold to obtain a plastic oscillator body with a roughened surface antenna circuit area;
step three, cleaning the oscillator body;
step four, adopting a titanate coupling agent to treat the surface of the vibrator body;
step five, taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer with the thickness of 0.05-1 mu m on the antenna circuit area;
step six, plating a metal copper layer with the thickness of 5-40 mu m on a nickel layer by adopting electroplating or chemical plating, and then plating a metal silver protective layer with the thickness of 1-5 mu m; and finally, cleaning to obtain the antenna oscillator product.
In the three embodiments, in the first step, the antenna circuit region of the mold may be roughened, and meanwhile, the raised pillars may be disposed at the edge of the antenna circuit region. So that the edge of the antenna line region obtained in step two is recessed inward. And fifthly, plugging the recess with a plug before vacuum sputtering, pulling out the plug after the vacuum sputtering, and measuring the thickness of the metal nickel layer from the recess to obtain the thickness of the metal nickel layer and the uniformity of the vacuum sputtering. And step six, the recess is not required to be plugged, so that the metal copper layer wraps the side edge of the metal nickel layer at the recess edge, and the metal nickel protective layer wraps the side edge of the metal copper layer at the recess edge. In addition, in the use of antenna, this sunken tie point that both can regard as connecting outer safety cover, at this moment, can set up the spliced pole supporting with this sunken on outer safety cover, insert the spliced pole in the sunken to make outer safety cover and antenna connection. The recess can also be used as a connection point for connecting the signal line, because the opening of the recess is provided with the metal layer, the conductive column can be inserted into the recess, and the signal line is connected through the conductive column.
In the three embodiments, the mold subjected to the roughening treatment in the first step may be provided with a plurality of convex cones, a plurality of concave cone-shaped grooves, or irregularly arranged spikes in the antenna circuit region. A combination of at least two of the above may be possible. The rough surface of the die before polishing can also be used in the production process of the die.
In the above three embodiments, the height of the mold in the antenna circuit area is preferably smaller than the height of the other part of the cavity, so as to avoid the thickness increase caused by the increase of the plating layer and make the surface unsmooth. At this time, the antenna circuit area is in a concave shape in a cavity of the mold, and the side wall of the antenna circuit area is provided with a strip-shaped bulge in the vertical direction. The strip-shaped bulges enable the edge of the plastic oscillator body obtained in the step two at the antenna line area to be wavy, and finally enable the outer edge of the plating layer on the antenna line area to be wavy, so that the capability of releasing expansion with heat and contraction with cold of the metal part of the antenna oscillator is facilitated. The cross section of the strip-shaped bulges can be triangular, square, semicircular and the like, and preferably, the strip-shaped bulges are arranged at equal intervals, so that the edge of the antenna line area is triangular wave-shaped, square wave-shaped or arc wave-shaped.
In the above three embodiments, the ultrasonic device may be placed below the mold cavity, and the probe of the ultrasonic device faces the mold cavity. Thereby expelling the air from the thermoplastic by means of ultrasound. The lateral wall of accessible messenger's die cavity is the slope form this moment, and slow and have better contact with the lateral wall when making thermoplastic injection, and then reduce gaseous production, and simultaneously, the lateral wall of slope can advance the gas flow direction, makes things convenient for gas to discharge.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The preparation method of the plastic antenna oscillator with high plating bonding strength is characterized by comprising the following steps:
the method comprises the following steps that firstly, an antenna circuit area of a die is coarsened;
step two, performing injection molding on thermoplastic plastics by adopting the mold in the step one to obtain a plastic oscillator body with a roughened surface antenna circuit area;
step three, cleaning the oscillator body;
step four, processing the surface of the vibrator body by adopting a surface treating agent;
step five, taking metallic nickel as a target material, carrying out vacuum sputtering on the oscillator body after surface treatment, and plating a metallic nickel layer on the antenna circuit area;
plating a metal copper layer on the nickel layer by adopting electroplating or chemical plating, and then plating other metal protective layers; finally, cleaning to obtain an antenna oscillator product;
in the first step, while the antenna circuit area of the die is roughened, a raised upright post is arranged at the edge of the antenna circuit area; making the edge of the antenna circuit area obtained in the step two have inward depressions; before vacuum sputtering, plugging the recess with a plug, pulling out the plug after vacuum sputtering, and measuring the thickness of the metallic nickel layer from the recess to obtain the thickness of the metallic nickel layer and the uniformity of the vacuum sputtering; and step six, the recess is not required to be plugged, so that the metal copper layer wraps the side edge of the metal nickel layer at the recess edge, and the metal nickel protective layer wraps the side edge of the metal copper layer at the recess edge.
2. The method for preparing a plastic antenna element with high plating bonding strength as claimed in claim 1, wherein the thermoplastic is one of modified PC, ABS, PPS, PET, PBT, PA, POM, PPO, PES, PESU, LCP, PEEK, PEI or an alloy thereof.
3. The method for manufacturing a plastic antenna element with high coating bonding strength according to claim 1, wherein the surface treatment agent is one or more of a silane coupling agent, an aluminate coupling agent and a titanate coupling agent.
4. The method for manufacturing a plastic antenna element with high coating bonding strength as claimed in claim 1, wherein the other metal protective layer is one or more of nickel, tin, silver and gold.
5. The method for preparing a plastic antenna element with high coating bonding strength as claimed in claim 1, wherein the thermoplastic plastic in the second step is modified PPS plastic, and the surface treatment agent in the fourth step is silane coupling agent.
6. The method for preparing a plastic antenna element with high coating bonding strength as claimed in claim 1, wherein the thermoplastic plastic in the second step is modified PPO plastic, and the surface treatment agent in the fourth step is an aluminate coupling agent.
7. The method of claim 1, wherein the thermoplastic material in step two is a modified LCP plastic, and the surface treatment agent in step four is a titanate coupling agent.
8. The method for preparing a plastic antenna element with high coating bonding strength as claimed in claim 5, 6 or 7, wherein the thickness of the metallic nickel layer is 0.05-1 μm, the thickness of the metallic copper layer is 5-40 μm, and the thickness of the metallic nickel protective layer is 1-5 μm.
9. The method for manufacturing a plastic antenna element with high coating bonding strength as claimed in claim 5, 6 or 7, wherein the height of the mold in the antenna circuit area is less than that of the other part of the cavity.
10. The method for manufacturing a plastic antenna element with high coating bonding strength according to claim 9, wherein the antenna circuit area is recessed in a cavity of a mold, and a strip-shaped protrusion in a vertical direction is arranged on a side wall of the antenna circuit area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010147683.9A CN111463564B (en) | 2020-03-05 | 2020-03-05 | Preparation method of plastic antenna oscillator with high coating bonding strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010147683.9A CN111463564B (en) | 2020-03-05 | 2020-03-05 | Preparation method of plastic antenna oscillator with high coating bonding strength |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111463564A CN111463564A (en) | 2020-07-28 |
| CN111463564B true CN111463564B (en) | 2022-05-31 |
Family
ID=71678344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010147683.9A Active CN111463564B (en) | 2020-03-05 | 2020-03-05 | Preparation method of plastic antenna oscillator with high coating bonding strength |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111463564B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112436271B (en) * | 2020-11-17 | 2021-05-07 | 常州仁千电气科技股份有限公司 | Production process of 5G antenna oscillator |
| CN114828417A (en) * | 2022-04-22 | 2022-07-29 | 深圳运嘉科技有限公司 | Coarsening process for mold forming, three-dimensional circuit and electronic equipment |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305373A (en) * | 2001-04-09 | 2002-10-18 | Sumitomo Electric Fine Polymer Inc | High-frequency circuit board or antenna substrate, and manufacturing method thereof |
| CN102185175A (en) * | 2011-04-11 | 2011-09-14 | 深圳市厚泽真空技术有限公司 | Mobile phone, vacuum coated antenna and manufacturing method thereof |
| CN102800920A (en) * | 2012-08-03 | 2012-11-28 | 捷荣模具工业(东莞)有限公司 | Bijection plating antenna shell and manufacturing method thereof |
| CN102943293A (en) * | 2012-11-19 | 2013-02-27 | 厦门建霖工业有限公司 | Manufacturing process of electroplating pieces with wire drawing veins |
| CN103281871A (en) * | 2013-06-09 | 2013-09-04 | 上海安费诺永亿通讯电子有限公司 | Electronic circuit manufacturing method |
| CN103458632A (en) * | 2012-06-01 | 2013-12-18 | 深圳富泰宏精密工业有限公司 | Electronic device shell and method for manufacturing same |
| CN105543813A (en) * | 2016-03-01 | 2016-05-04 | 上海安费诺永亿通讯电子有限公司 | Method for producing precise metal circuit on plastic surface |
| CN107567184A (en) * | 2016-07-02 | 2018-01-09 | 深圳市微航磁电技术有限公司 | The structure and method of electronic circuit are manufactured on the product of metal and plastic-injection |
| CN108425113A (en) * | 2018-02-13 | 2018-08-21 | 深圳市飞荣达科技股份有限公司 | Oscillator and its manufacturing method |
| CN109206751A (en) * | 2018-07-18 | 2019-01-15 | 上海阿莱德实业股份有限公司 | Antenna house weather-resistance flame-retardant polypropylene modified material and preparation method thereof |
| CN110544817A (en) * | 2018-05-29 | 2019-12-06 | 西安美频电子科技有限公司 | Weldable metalized injection-molded antenna oscillator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296420A (en) * | 2012-03-02 | 2013-09-11 | 深圳光启创新技术有限公司 | Manufacturing method for metamaterial antenna housing |
| CN204156077U (en) * | 2014-08-29 | 2015-02-11 | 航天材料及工艺研究所 | A kind of triangular prism-shaped antenna support structure |
| CN109640539A (en) * | 2019-01-03 | 2019-04-16 | 深圳市飞荣达科技股份有限公司 | Oscillator and its manufacturing method |
-
2020
- 2020-03-05 CN CN202010147683.9A patent/CN111463564B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305373A (en) * | 2001-04-09 | 2002-10-18 | Sumitomo Electric Fine Polymer Inc | High-frequency circuit board or antenna substrate, and manufacturing method thereof |
| CN102185175A (en) * | 2011-04-11 | 2011-09-14 | 深圳市厚泽真空技术有限公司 | Mobile phone, vacuum coated antenna and manufacturing method thereof |
| CN103458632A (en) * | 2012-06-01 | 2013-12-18 | 深圳富泰宏精密工业有限公司 | Electronic device shell and method for manufacturing same |
| CN102800920A (en) * | 2012-08-03 | 2012-11-28 | 捷荣模具工业(东莞)有限公司 | Bijection plating antenna shell and manufacturing method thereof |
| CN102943293A (en) * | 2012-11-19 | 2013-02-27 | 厦门建霖工业有限公司 | Manufacturing process of electroplating pieces with wire drawing veins |
| CN103281871A (en) * | 2013-06-09 | 2013-09-04 | 上海安费诺永亿通讯电子有限公司 | Electronic circuit manufacturing method |
| CN105543813A (en) * | 2016-03-01 | 2016-05-04 | 上海安费诺永亿通讯电子有限公司 | Method for producing precise metal circuit on plastic surface |
| CN107567184A (en) * | 2016-07-02 | 2018-01-09 | 深圳市微航磁电技术有限公司 | The structure and method of electronic circuit are manufactured on the product of metal and plastic-injection |
| CN108425113A (en) * | 2018-02-13 | 2018-08-21 | 深圳市飞荣达科技股份有限公司 | Oscillator and its manufacturing method |
| CN110544817A (en) * | 2018-05-29 | 2019-12-06 | 西安美频电子科技有限公司 | Weldable metalized injection-molded antenna oscillator |
| CN109206751A (en) * | 2018-07-18 | 2019-01-15 | 上海阿莱德实业股份有限公司 | Antenna house weather-resistance flame-retardant polypropylene modified material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111463564A (en) | 2020-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111463564B (en) | Preparation method of plastic antenna oscillator with high coating bonding strength | |
| TW539614B (en) | Laminate | |
| US8943674B2 (en) | Method of making a patch antenna having an insulation material | |
| EP0389619A1 (en) | Curved plastic body with circuit pattern and method of making. | |
| CN104681907A (en) | Radio frequency cable with integrated polytetrafluoroethylene insulating surface silver-plating outer conductor, and machining method for radio frequency cable | |
| WO2015075471A2 (en) | Ultrasound transducer and method of manufacturing | |
| JP2013214961A (en) | Antenna member | |
| US8785792B2 (en) | Case structure having film type electronic circuit and method of manufacturing the same | |
| KR102225688B1 (en) | Method for manufacturing low specific gravity conductive powder and Low specific gravity conductive powder | |
| US20120032566A1 (en) | Housing and fabrication method thereof | |
| WO2007105855A1 (en) | Shielding apparatus and manufacturing method thereof | |
| CN102570048A (en) | Metamaterial with three dimensional microstructure and manufacturing method of same | |
| CN217691621U (en) | Package member | |
| CN102501460B (en) | Rubber conducting plate with multi-layer structure and conducting particles | |
| JPH03104402A (en) | Dielectric lens antenna | |
| JP2012023661A (en) | Plane antenna and manufacturing method thereof | |
| CN114552180A (en) | Antenna structure and preparation method thereof | |
| CN211578951U (en) | Antenna for improving low-frequency bandwidth and mobile terminal | |
| JP2014218709A (en) | Solid molding with conductive pattern and method of manufacturing the same | |
| CN112909573A (en) | Polarized wire grating forming process using organic polymer film as carrier | |
| CN118763006B (en) | Electromagnetic shielding structure manufacturing method and packaging structure | |
| CN222562962U (en) | Chip array RF antenna | |
| CN219225918U (en) | Layering-preventing high-pressure injection molding copper bar | |
| JPS6099623A (en) | Manufacture of molded shape consisting of plastic material | |
| CN109676532A (en) | A kind of ground glass substrate of pattern gradual change and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |