CN111455442A - Semiconductor electroplating equipment and using method thereof - Google Patents
Semiconductor electroplating equipment and using method thereof Download PDFInfo
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- CN111455442A CN111455442A CN202010369340.7A CN202010369340A CN111455442A CN 111455442 A CN111455442 A CN 111455442A CN 202010369340 A CN202010369340 A CN 202010369340A CN 111455442 A CN111455442 A CN 111455442A
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- electroplating
- semiconductor
- door curtain
- servo motor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses semiconductor electroplating equipment, which comprises a cleaning mechanism, wherein an electroplating mechanism and a drying mechanism are arranged on one side of the cleaning mechanism, the cleaning mechanism comprises a washing mechanism, the washing mechanism is fixed in an outer cover of the cleaning mechanism, door curtain mechanisms are arranged on two sides in the outer cover of the cleaning mechanism, the electroplating mechanism comprises a lifting mechanism, the lifting mechanism is fixed on one side of the outer cover of the electroplating mechanism, an electroplating pool is arranged below the outer cover of the electroplating mechanism, the washing mechanism comprises annular water pipes which are distributed in an array, spray heads which are distributed in an array are arranged on the upper portion and the lower portion of each annular water pipe, a connecting pipe is jointly arranged at one end of each annular water pipe, a roller mounting plate which is distributed in an. The invention has simple operation and convenient equipment maintenance, is beneficial to reducing the equipment operation difficulty, reduces the use difficulty of operators, improves the electroplating efficiency of semiconductors, has few operation steps of the operators and reduces the labor intensity of the operators.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to a semiconductor electroplating device and a using method thereof.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. From the viewpoint of scientific and technological or economic development, semiconductors are very important, core units of many electronic products, such as computers, mobile phones and digital recorders, process information by using conductivity change of semiconductors, common semiconductor materials include silicon, germanium, gallium arsenide and the like, electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using an electrolysis principle, and is a process of attaching a metal film on the surface of a metal or other material product by using an electrolysis effect so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), improve attractiveness and the like.
Disclosure of Invention
The invention aims to provide a semiconductor electroplating device and a using method thereof, which are simple to operate, convenient to maintain, beneficial to reducing the operation difficulty of the device, reducing the use difficulty of operators, improving the electroplating efficiency of semiconductors, few in operation steps of the operators and reducing the labor intensity of the operators.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a semiconductor electroplating device, includes the wiper mechanism, wiper mechanism one side is equipped with electroplating mechanism and dry mechanism, and the wiper mechanism is fixed in the wiper mechanism dustcoat including washing the mechanism, and both sides all are equipped with door curtain mechanism in the wiper mechanism dustcoat, and electroplating mechanism includes lifting mechanism, and lifting mechanism fixes in electroplating mechanism dustcoat one side, and electroplating mechanism dustcoat below is equipped with electroplates the pond.
Further, wash mechanism including the annular water pipe of array distribution, the shower head that all is equipped with the array distribution about the annular water pipe, annular water pipe one end is equipped with the connecting pipe jointly, be equipped with the gyro wheel mounting panel of array distribution on the connecting pipe, all be equipped with the gyro wheel pivot on the gyro wheel mounting panel, be equipped with the gyro wheel in the gyro wheel pivot, wash the slide rail that the mechanism still includes the mirror image and distributes, the gyro wheel is sliding fit in the slide rail of one side wherein, the connecting pipe upper end is equipped with the water injection pipe, the annular water pipe upper end still is equipped with the fixed plate jointly, be equipped with first servo motor on the fixed plate, first servo motor one side is equipped with first servo motor driven power.
Further, a first observation window is arranged on one side of the cleaning mechanism outer cover, first conveying belt slots are further formed in the two sides of the cleaning mechanism outer cover, conveying belts are arranged in the first conveying belt slots and comprise second servo motors, conveying belt rolling shafts are arranged on one sides of the second servo motors, conveying tracks are arranged on the conveying belt rolling shafts, conveying belt rolling shafts are also arranged on the other sides of the conveying tracks, adjusting frames are arranged at the two ends of the conveying belt rolling shafts on the other sides, and conveying belt fixing frames are arranged at the lower ends of the adjusting frames.
Further, door curtain mechanism includes the door curtain, is equipped with the friction pulley of array distribution on the door curtain, and door curtain both sides all are equipped with the door curtain frame, and the door curtain upper end is equipped with the door curtain and presss from both sides, is equipped with the connector on the door curtain presss from both sides, and the connector upper end is equipped with first pneumatic cylinder.
Further, lifting mechanism includes third servo motor, third servo motor one side is equipped with the power switching-over case, the power switching-over case is fixed on the landing slab, the landing slab is fixed in electroplating mechanism dustcoat one side, the landing slab lower extreme is equipped with the litter of array distribution, all be equipped with the slider on the litter, power switching-over case lower extreme is equipped with the threaded rod, still be equipped with the lead screw piece on the threaded rod, the threaded rod lower extreme passes in the bearing hole that bottom plate central point put was equipped with, the bottom plate is fixed in electroplating mechanism dustcoat one side equally, the litter lower extreme all is equipped with the fixed head, the slider is equipped with the lifter plate with lead screw piece one side jointly, lifter plate one side is equipped with the crane of mirror image distribution, the.
Furthermore, both sides of the outer cover of the electroplating mechanism are provided with second conveyor belt slots, and conveyor belts are also arranged in the second conveyor belt slots.
Further, drying mechanism is including weathering the mechanism, weathers the mechanism and fixes in weathering the mechanism dustcoat, weathers mechanism dustcoat one side and is equipped with the second observation window, weathers mechanism dustcoat both sides third conveyer belt fluting, is equipped with the conveyer belt in the third conveyer belt fluting equally, weathers the mechanism and includes the fan, and fan one side is equipped with the rose box, is equipped with hot-blast case below the rose box, and the hot-blast case below is equipped with the blowing head.
1. The use method of the semiconductor electroplating equipment is characterized by comprising the following steps:
the method comprises the following steps: placing a semiconductor material to be electroplated on a conveying belt of a cleaning mechanism, and starting a first servo motor;
step two: the spray header washes the semiconductor on the conveyor belt clean and then falls on the lifting plate;
step three: starting a third servo motor, enabling the lifting plate to fall into an electroplating pool, and electroplating the semiconductor material on the lifting plate;
step four: after the electroplating is finished, starting a third servo motor, lifting the electroplated semiconductor material on the lifting plate, and manually placing the semiconductor material on a conveyor belt of a drying mechanism;
step five: and starting a fan to dry the electroplated semiconductor material.
The invention has the beneficial effects that:
1. the invention has simple operation and convenient equipment maintenance, is beneficial to reducing the equipment operation difficulty and reducing the use difficulty of operators;
2. the invention improves the electroplating efficiency of the semiconductor, has few operation steps for operators and reduces the labor intensity of the operators.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of a semiconductor plating apparatus according to the present invention;
FIG. 2 is a schematic view of a part of the structure of the cleaning mechanism of the present invention;
FIG. 3 is a schematic view of a part of the structure of the cleaning mechanism of the present invention;
FIG. 4 is a schematic view of a part of the structure of the cleaning mechanism of the present invention;
FIG. 5 is a schematic view of the structure of the electroplating mechanism according to the present invention;
FIG. 6 is a schematic view of a part of the structure of the electroplating mechanism according to the present invention;
FIG. 7 is a schematic view of the drying mechanism of the present invention;
fig. 8 is a schematic view of a part of the structure of the drying mechanism of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
The utility model provides a semiconductor electroplating device, includes wiper mechanism 1, as shown in fig. 1, fig. 5, fig. 6, fig. 7, wiper mechanism 1 one side is equipped with electroplating mechanism 2 and dry mechanism 3, and wiper mechanism 1 is including washing mechanism 11, washes mechanism 11 and fixes in wiper mechanism dustcoat 12, and both sides all are equipped with door curtain mechanism 13 in the wiper mechanism dustcoat 12, and electroplating mechanism 2 includes lifting mechanism 21, and lifting mechanism 21 fixes in electroplating mechanism dustcoat 22 one side, and electroplating mechanism dustcoat 22 below is equipped with electroplating pool 23.
The washing mechanism 11 includes annular water pipes 111 distributed in an array, as shown in fig. 3, spray headers 1111 distributed in an array are respectively disposed on the upper and lower sides of the annular water pipes 111, one end of the annular water pipes 111 is commonly provided with a connecting pipe 112, roller mounting plates 113 distributed in an array are disposed on the connecting pipe 112, roller rotating shafts 1131 are disposed on the roller mounting plates 113, rollers 114 are disposed on the roller rotating shafts 1131, the washing mechanism 11 further includes slide rails 115 distributed in a mirror image manner, the rollers 114 are slidably fitted in the slide rails 115 on one side of the connecting pipe 112, a water injection pipe 116 is disposed at the upper end of the connecting pipe 112, a fixing plate 117 is further disposed at the upper end of the annular water pipes 111, a first servo motor 118 is disposed on the fixing plate 117, a power wheel 1181 driven by the first servo motor.
A first observation window 121 is arranged on one side of the cleaning mechanism housing 12, as shown in fig. 2, first conveyor belt slots 122 are further arranged on two sides of the cleaning mechanism housing 12, conveyor belts 14 are arranged in the first conveyor belt slots 122, the conveyor belts 14 include second servo motors 141, conveyor belt rollers 142 are arranged on one sides of the second servo motors 141, conveyor belts 143 are arranged on the conveyor belt rollers 142, conveyor belt rollers 142 are also arranged on the other sides of the conveyor belts 143, adjustment frames 145 are arranged at two ends of the conveyor belt rollers 142 on the other sides, and a conveyor belt fixing frame 144 is arranged at the lower end of each adjustment frame 145.
The door curtain mechanism 13 includes a door curtain 131, as shown in fig. 4, friction wheels 132 are disposed on the door curtain 131 in an array distribution, door curtain frames 133 are disposed on both sides of the door curtain 131, a door curtain clamp 136 is disposed at an upper end of the door curtain 131, a connector 135 is disposed on the door curtain clamp 136, and a first hydraulic cylinder 134 is disposed at an upper end of the connector 135.
The lifting mechanism 21 includes a third servo motor 201, as shown in fig. 5 and 6, a power reversing box 202 is disposed on one side of the third servo motor 201, the power reversing box 202 is fixed on a platform board 211, the platform board 211 is fixed on one side of an electroplating mechanism housing 22, sliding rods 2121 distributed in an array are disposed at the lower end of the platform board 211, sliding blocks 212 are disposed on the sliding rods 2121, a threaded rod 213 is disposed at the lower end of the power reversing box 202, a screw rod block 204 is further disposed on the threaded rod 213, the lower end of the threaded rod 213 penetrates through a bearing hole 2131 disposed at the central position of the lower fixing plate 203, the lower fixing plate 203 is also fixed on one side of the electroplating mechanism housing 22, fixing heads 2122 are disposed at the lower end of the sliding rods 2121, a lifting plate 215 is disposed at both sides of the sliding blocks 212 and the screw rod block 204, lifting frames 214 distributed in.
The two sides of the outer cover 22 of the electroplating mechanism are both provided with a second conveyor belt slot 221, and the conveyor belt 14 is also arranged in the second conveyor belt slot 221.
The drying mechanism 3 includes a drying mechanism 31, as shown in fig. 7 and 8, the drying mechanism 31 is fixed in a drying mechanism housing 32, a second observation window 321 is arranged on one side of the drying mechanism housing 32, third conveyor belt slots 322 are arranged on two sides of the drying mechanism housing 32, a conveyor belt 14 is also arranged in the third conveyor belt slots 322, the drying mechanism 31 includes a blower 311, a filter box 312 is arranged on one side of the blower 311, a hot air box 313 is arranged below the filter box 312, and a blowing head 314 is arranged below the hot air box 313.
A method for using a semiconductor electroplating device comprises the following steps:
the method comprises the following steps: placing the semiconductor material to be plated on the conveyor belt 14 of the cleaning mechanism 1, and starting the first servo motor 118;
step two: the spray header 1111 washes the semiconductors on the conveyor belt 14 clean and then falls on the lifting plate 216;
step three: starting the third servo motor 201, enabling the lifting plate 216 to fall into the electroplating pool 23, and electroplating the semiconductor material on the lifting plate 216;
step four: after the electroplating is finished, the third servo motor 201 is started again, the semiconductor material which is electroplated on the lifting plate 216 is lifted, and the semiconductor material is manually placed on the conveyor belt 14 of the drying mechanism 3;
step five: and starting the fan 311 to dry the electroplated semiconductor material.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (8)
1. The utility model provides a semiconductor electroplating device, includes wiper mechanism (1), its characterized in that, wiper mechanism (1) one side is equipped with electroplating mechanism (2) and dry mechanism (3), and wiper mechanism (1) is including washing mechanism (11), washes mechanism (11) and fixes in wiper mechanism dustcoat (12), and both sides all are equipped with door curtain mechanism (13) in wiper mechanism dustcoat (12), and electroplating mechanism (2) include lifting mechanism (21), and lifting mechanism (21) are fixed in electroplating mechanism dustcoat (22) one side, and electroplating mechanism dustcoat (22) below is equipped with electroplating bath (23).
2. The semiconductor electroplating equipment according to claim 1, wherein the flushing mechanism (11) comprises annular water pipes (111) distributed in an array, spray headers (1111) distributed in an array are arranged above and below the annular water pipes (111), one end of each annular water pipe (111) is jointly provided with a connecting pipe (112), roller mounting plates (113) distributed in an array are arranged on the connecting pipes (112), roller rotating shafts (1131) are arranged on the roller mounting plates (113), rollers (114) are arranged on the roller rotating shafts (1131), the flushing mechanism (11) further comprises slide rails (115) distributed in a mirror image manner, the rollers (114) are in sliding fit in the slide rails (115) on one side of the roller mounting plates, a water injection pipe (116) is arranged at the upper end of each connecting pipe (112), a fixing plate (117) is jointly arranged at the upper end of each annular water pipe (111), a first servo motor (118) is arranged on each fixing plate (117), a power wheel (1181) driven by the first servo motor (118) is arranged on one side, the power wheel (1181) rolls on the slide rail (115) on the other side.
3. The semiconductor electroplating equipment according to claim 1, wherein a first observation window (121) is arranged on one side of the cleaning mechanism housing (12), first conveying belt slots (122) are further arranged on two sides of the cleaning mechanism housing (12), a conveying belt (14) is arranged in the first conveying belt slot (122), the conveying belt (14) comprises a second servo motor (141), a conveying belt roller (142) is arranged on one side of the second servo motor (141), a conveying crawler belt (143) is arranged on the conveying belt roller (142), the other side of the conveying crawler belt (143) is also provided with the conveying belt roller (142), adjusting frames (145) are arranged at two ends of the conveying belt roller (142) on the other side, and a fixing frame (144) is arranged at the lower end of each adjusting frame (145).
4. The semiconductor electroplating equipment according to claim 1, wherein the door curtain mechanism (13) comprises a door curtain (131), friction wheels (132) distributed in an array are arranged on the door curtain (131), door curtain frames (133) are arranged on two sides of the door curtain (131), a door curtain clamp (136) is arranged at the upper end of the door curtain (131), a connector (135) is arranged on the door curtain clamp (136), and a first hydraulic cylinder (134) is arranged at the upper end of the connector (135).
5. The semiconductor electroplating equipment according to claim 1, wherein the lifting mechanism (21) comprises a third servo motor (201), a power reversing box (202) is arranged on one side of the third servo motor (201), the power reversing box (202) is fixed on a platform plate (211), the platform plate (211) is fixed on one side of an electroplating mechanism housing (22), sliding rods (2121) distributed in an array manner are arranged at the lower end of the platform plate (211), sliding blocks (212) are arranged on the sliding rods (2121), a threaded rod (213) is arranged at the lower end of the power reversing box (202), a threaded rod block (204) is further arranged on the threaded rod (213), the lower end of the threaded rod (213) penetrates through a bearing hole (2131) formed in the central position of the lower fixing plate (203), the lower fixing plate (203) is also fixed on one side of the electroplating mechanism housing (22), a fixing head (2122) is arranged at the lower end of the sliding rod (2121), and a lifting plate (215) is arranged on one side of the sliding blocks (212) and the threaded rod block, lifting frames (214) distributed in a mirror image mode are arranged on one side of the lifting plate (215), and the top ends of the lifting frames (214) are jointly provided with a lifting plate (216).
6. A semiconductor electroplating apparatus according to claim 1, wherein the electroplating mechanism housing (22) is provided with second conveyor belt slots (221) on both sides, and the conveyor belt (14) is also arranged in the second conveyor belt slots (221).
7. The semiconductor electroplating device according to claim 1, wherein the drying mechanism (3) comprises a blow-drying mechanism (31), the blow-drying mechanism (31) is fixed in a blow-drying mechanism outer cover (32), a second observation window (321) is arranged on one side of the blow-drying mechanism outer cover (32), third conveyor belt slots (322) are formed in two sides of the blow-drying mechanism outer cover (32), conveyor belts (14) are also arranged in the third conveyor belt slots (322), the blow-drying mechanism (31) comprises a fan (311), a filter box (312) is arranged on one side of the fan (311), a hot air box (313) is arranged below the filter box (312), and a blowing head (314) is arranged below the hot air box (313).
8. The use method of the semiconductor electroplating equipment is characterized by comprising the following steps:
the method comprises the following steps: placing the semiconductor material to be electroplated on a conveyor belt (14) of a cleaning mechanism (1), and starting a first servo motor (118);
step two: the spray header (1111) washes the semiconductors on the conveyor belt (14) clean and then falls on the lifting plate (216);
step three: starting a third servo motor (201), enabling the lifting plate (216) to fall into the electroplating pool (23), and electroplating the semiconductor material on the lifting plate (216);
step four: after the electroplating is finished, the third servo motor (201) is started again, the semiconductor material which is electroplated on the lifting plate (216) is lifted, and the semiconductor material is manually placed on the conveyor belt (14) of the drying mechanism (3);
step five: and starting a fan (311) to dry the electroplated semiconductor material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010369340.7A CN111455442A (en) | 2020-05-03 | 2020-05-03 | Semiconductor electroplating equipment and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010369340.7A CN111455442A (en) | 2020-05-03 | 2020-05-03 | Semiconductor electroplating equipment and using method thereof |
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| Publication Number | Publication Date |
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| CN111455442A true CN111455442A (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010369340.7A Pending CN111455442A (en) | 2020-05-03 | 2020-05-03 | Semiconductor electroplating equipment and using method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210815A (en) * | 2020-10-17 | 2021-01-12 | 刘虎 | Intelligent electroplating device for surface of metal pipe fitting |
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Application publication date: 20200728 |