CN111445096A - Material automatic loading and unloading control method, device, electronic device and storage medium - Google Patents

Abstract

The present invention provides a control method, device, electronic device and storage medium for automatic loading and unloading of materials. The method includes: determining a carrier template, where the carrier template includes information on the placement position of the wafer in the carrier and type information of the wafer ; load the target wafer from the first column to the corresponding position of the carrier according to the carrier template according to the carrier template, the target wafer is the wafer corresponding to the target loading position of the carrier; create the first column A material information table, the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier. The automatic material loading and unloading control method provided by the invention can automatically complete the material loading control according to the carrier template, and at the same time can automatically record the corresponding relationship between the material source position and the material position on the carrier, so as to facilitate the retrospective management of the material in the later stage.

Description

Material automatic loading and unloading control method, device, electronic device and storage medium

technical field

The present invention relates to the field of display technology, in particular to a control method, device, electronic device and storage medium for automatic loading and unloading of materials.

Background technique

In the prior art, the process of loading and unloading materials needs to be controlled manually. In addition, information such as the position of the material on the carrier and the source of the material is generally recorded manually, which is inefficient and prone to errors.

SUMMARY OF THE INVENTION

In view of the defects in the prior art, the present invention provides a control method, device, electronic device and storage medium for automatic loading and unloading of materials.

Specifically, the present invention provides the following technical solutions:

In a first aspect, the present invention provides a method for controlling automatic loading and unloading of materials, including:

determining a carrier template, the carrier template including wafer placement information in the carrier and type information of the wafer;

Loading a target wafer from a first column according to the carrier template to a corresponding position of the carrier according to the carrier template, the target wafer being a wafer corresponding to the target loading position of the carrier;

A first material information table is created, where the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier.

Further, when moving the wafer on the carrier that has completed the corresponding growth process to the second column, the method further includes: creating a second material information table, the second material information table including carrier information, wafer information and corresponding information between the storage position of the wafer in the second column and the placement position of the wafer in the carrier.

Further, the method also includes:

A visual view information table is created, and the information included in the first material information table and/or the second material information table is displayed in the visual view information table.

Further, before the determining the vehicle template, the method further includes: creating a vehicle template;

Wherein, the creating a vehicle template includes:

Determine the number of rows and columns included in the carrier template, the number of rows and columns of the carrier template corresponds to the number of rows and columns of the carrier, and a row index and column index on the carrier template The composed index pair corresponds to a wafer placement position in the carrier;

Determine the placement position and wafer type of the wafer in the carrier template according to the quality verification area and process requirements of the carrier;

The carrier template is created based on the number of rows and columns included in the carrier template, as well as the placement position and wafer type of the wafers in the carrier template.

Further, the method also includes:

Add the created vehicle template to the vehicle template library.

Further, the determining the vehicle template includes:

According to the size of the carrier, the quality verification area and the process requirements, it is judged whether there is a matching carrier template in the carrier template library, and if so, select a matching carrier template from the carrier template library, Otherwise, create a vehicle template.

In the second aspect, the present invention also provides a control device for automatic loading and unloading of materials, including:

a determining module for determining a carrier template, the carrier template including information on the placement position of the wafer in the carrier and type information of the wafer;

a loading module for loading a target wafer from the first column to a corresponding position of the carrier according to the carrier template according to the carrier template, and the target wafer is corresponding to the target loading position of the carrier wafer;

The first creation module is used to create a first material information table, the first material information table includes carrier information, wafer information, and the storage position of the wafer in the first column and the placement position of the wafer in the carrier. corresponding information.

Further, the device also includes:

The second creation module is configured to create a second material information table when the wafer on which the corresponding growth process is completed on the carrier is moved to the second column, and the second material information table includes carrier information, wafer information and Correspondence information between the storage position of the wafer in the second column and the placement position of the wafer in the carrier.

In a third aspect, the present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, the processor implementing the program as described in the first aspect when the processor executes the program Describe the steps of the control method for automatic loading and unloading of materials.

In a fourth aspect, the present invention also provides a computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, implements the steps of the method for controlling the automatic loading and unloading of materials described in the first aspect.

As can be seen from the above technical solutions, the present invention provides a method for controlling automatic loading and unloading of materials, comprising: determining a carrier template, where the carrier template includes information on the placement position of the wafer in the carrier and type information of the wafer; The template is to load the target wafer from the first column to the corresponding position of the carrier according to the carrier template, and the target wafer is the wafer corresponding to the target loading position of the carrier; create a first material information table, The first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier. The automatic material loading and unloading control method provided by the invention can automatically complete the material loading control according to the carrier template, and at the same time can automatically record the corresponding relationship between the material source position and the material position on the carrier, so as to facilitate the retrospective management of the material in the later stage.

Description of drawings

In order to more clearly illustrate the technical solutions in this embodiment or the prior art, the following briefly introduces the accompanying drawings used in the description of the embodiment or the prior art. Obviously, the accompanying drawings in the following description are the For some embodiments of the invention, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a flowchart of a method for controlling automatic loading and unloading of materials provided by an embodiment of the present invention;

2 is a schematic diagram of a carrier template provided by an embodiment of the present invention;

3 is a schematic diagram of loading control according to a carrier template provided by an embodiment of the present invention;

4 is a schematic diagram of a material information table provided by an embodiment of the present invention;

5 is a schematic diagram of an unloading control provided by an embodiment of the present invention;

6 is a schematic diagram of a vehicle template library including four vehicle templates provided by an embodiment of the present invention;

7 is a schematic structural diagram of a material automatic loading and unloading control device provided by another embodiment of the present invention;

FIG. 8 is a schematic structural diagram of an electronic device provided by another embodiment of the present invention.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Before introducing the content of the present invention, the application background of the present invention is briefly described. In the field of GaAs thin film solar cell manufacturing equipment, GaAs thin film solar cell manufacturing equipment generally adopts the metal-organic chemical vapor deposition (Metal-organic Chemical Vapor Deposition, MOCVD) technical route to prepare GaAs solar cells. There are two types of processes involved, one is the MOCVD growth process, and the other is the chamber cleaning process, both of which are carried out on a carrier basis. For the MOCVD growth process, a carrier called a process carrier is used on which multiple growth wafers are usually placed. For the chamber cleaning process, a carrier called a dummy carrier is used, which is coated with a Materials that are corroded by Cl2 are usually no longer placed wafers.

Before the start of each MOCVD growth process, the loading module of the GaAs thin film solar cell manufacturing equipment needs to take the wafer out of the casing and place it on the carrier. After the growth process is completed, the unloading module needs to remove the wafer that has grown the GaAs epitaxial layer from the wafer. The carrier is taken out and put back into the casing.

Due to the complexity of the MOCVD process for gallium arsenide solar cells, multiple tests are usually required to obtain the relationship between product quality and production process control in different regions of the reaction chamber, as well as the impact of the chamber cleaning process on product quality. In order to save the test cost, the wafer is often placed in different positions of the carrier in the MOCVD process for repeated tests, and the chamber cleaning process is interspersed between the MOCVD processes. During the whole test process, it is necessary to record the position of the wafer on the casing and the carrier, as well as the number of times the carrier is used, so as to facilitate material traceability.

Before adopting the present invention, the entire production process was manually controlled, and the material-related information in the entire production process was manually recorded, which made the material location and the information mapping between the materials and the carriers unintuitive, and the manual recording method was prone to errors.

In order to solve the above problems, the present invention provides an automatic material loading and unloading control method. The present invention can automatically complete the material loading control according to the carrier template, and can automatically record the corresponding relationship between the material source position and the material position on the carrier, thereby It is convenient for the traceability management of materials in the later stage. The method for controlling the automatic loading and unloading of materials provided by the present invention will be described in detail below through specific embodiments.

FIG. 1 shows a flowchart of a method for controlling automatic loading and unloading of materials provided by an embodiment of the present invention. As shown in Figure 1, the method for controlling automatic loading and unloading of materials provided by this embodiment includes the following steps:

Step 101: Create a vehicle template.

In this step, before using the carrier template for automatic material loading and unloading, you need to create a carrier template first. Among them, the process of creating a vehicle template includes:

a. Determine the number of rows and columns included in the carrier template. The number of rows and columns of the carrier template corresponds to the number of rows and columns of the carrier that needs to be subjected to the MOCVD growth process. It is assumed that the MOCVD growth process needs to be performed. If the number of rows and columns of the vehicle is 6 rows and 6 columns, the number of rows and columns included in the vehicle template should also be 6 rows and 6 columns, as shown in Figure 2. Wherein, an index pair consisting of a row index and a column index on the carrier template corresponds to a wafer placement position in a carrier that needs to be subjected to the MOCVD growth process. For example, for the 6-row and 6-column carrier template shown in Figure 2, there are 6*6 locations where wafers can be placed: A1-A6, B1-B6, C1-C6, D1-D6, E1-E6 , F1-F6.

b. Determine the placement position and wafer type of the wafer in the carrier template according to the quality verification area and process requirements of the carrier on which the MOCVD growth process needs to be performed.

In this step, according to the quality verification area and process requirements of the carrier to be subjected to the MOCVD growth process, the placement position and wafer type of the wafer in the carrier template are determined. It is assumed that the quality verification area of the carrier to be subjected to the MOCVD growth process is four corners Area and central area, the process requirement of the carrier that needs to perform the MOCVD growth process is to perform MOCVD growth on the wafer that has not undergone the MOCVD growth process, then it can be determined that the placement position of the wafer in the carrier template is A1 in Figure 2, A6, F1, F6, C3, C4, D3 and D4, the types of wafers in these eight positions are all unprocessed wafers, that is, wafers that have not undergone the MOCVD growth process.

c. Create a carrier template according to the number of rows and columns included in the carrier template, as well as the placement position of the wafer in the carrier template and the type of the wafer.

In this step, since the number of rows and columns included in the carrier template has been determined, which are 6 rows and 6 columns, and the placement position and wafer type of the wafers in the carrier template have also been determined, it can be created as shown in Figure 2 vehicle template.

In this step, when the carrier template is created, the type of the wafer placed at the specified position can be marked with different colors or different graphic styles. Assuming that there are three types of wafers: unused, used and discarded, the designated placement position of the carrier template can be indicated in white for placing unused wafers of unprocessed type, and in red for placing used wafers. For wafers of processed type, yellow indicates that this position is used to place processed aborted type wafers.

Step 102: Add the created vehicle template to the vehicle template library.

In this step, the created vehicle template is added to the vehicle template library for use in subsequent repetitions. For example, four vehicle templates as shown in FIG. 6 can be created through the above step 101, for use when subsequent repetitions are required.

Step 103: Select a vehicle template.

In this step, according to the size, quality verification area and process requirements of the carrier currently required to perform the MOCVD growth process, it is judged whether there is a matching carrier template in the carrier template library, and if so, the carrier template is selected from the carrier template library. Select a matching vehicle template from the template library, otherwise, create a vehicle template and save the created vehicle template to the vehicle template library for subsequent reuse.

For example, it is assumed that the size of the current carrier that needs to be subjected to the MOCVD growth process is 6*6, and the quality verification area of the current carrier that needs to be subjected to the MOCVD growth process is the four corners and the center area, and the process of the current carrier that needs to be subjected to the MOCVD growth process If the requirement is to perform the MOCVD growth process for the first time, the first carrier template should be selected from the carrier template library as the matching carrier template. As another example, it is assumed that the size of the current carrier that needs to be subjected to the MOCVD growth process is 6*6, and the quality verification area of the current carrier that needs to be subjected to the MOCVD growth process is the four corners and the center area. If the process requirement is to perform the MOCVD growth process twice, the second carrier template should be selected from the carrier template library as the matching carrier template, because the wafer type in the second carrier template is the processed type.

Step 104 : Load a target wafer from the first column to a corresponding position of the carrier according to the carrier template according to the carrier template, where the target wafer is a wafer corresponding to the target loading position of the carrier.

In this step, after the carrier template is selected, since the carrier template contains the wafer placement position and wafer type information, the material can be automatically loaded according to the selected carrier template. For example, according to the carrier template The template loads target wafers from the first column to corresponding positions of the carrier according to the carrier template, the target wafers being the wafers corresponding to the target loading positions of the carrier. The first column here refers to the cassette used to hold the wafer.

Step 105 : Create a first material information table, where the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier.

In this step, the corresponding information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier specifically refers to: where the wafer is taken out from the first column and placed on the carrier where in the . As shown in Figure 3, it is assumed that there are 25 plots in the first column C001, and each plot is used to store one wafer. When the target wafer is loaded from the first column to the corresponding position of the carrier according to the carrier template according to the carrier template, you can know which position of the carrier P001 wafer comes from which slot in C001, as shown on the right The Mapping data area on the side shows which slots of the C001 cassette the 8 wafers on the P001process carrier come from. For example, the wafer at the A1 position on the P001 carrier comes from the C25 slot of the C001 cassette, thus creating the first material information table. Figure 4 also provides an example of the material information table.

It should be noted that the vehicle information here refers to information such as the vehicle identification such as P001 and the size of the vehicle 6*6. The wafer information here refers to the identification of the wafer, such as G19021025, the type of wafer unprocessed and other information.

It should be noted that this step 105 may be executed after step 104, or may be executed during the execution of step 104, that is, the first material information table is created while loading, which is not limited in the present invention.

Step 106: Create a visual view information table, and display the information included in the first material information table in the visual view information table.

In this step, when creating the first material information table, or after creating the first material information table, a visual view information table may be further created, which is used to convert the information included in the first material information table The information is displayed in the visual view information table, so that the material mapping information can be seen more intuitively. As shown in Figure 3, for example, the wafer at the A1 position of the P001carrier comes from the C25 slot of the C001 cassette. In addition, the types of wafers placed at different positions may be represented in different colors in the visual view information table, so as to visually display the type information of the wafers.

It should be noted that this step 106 may be executed after step 104 or 105, or may be executed during the execution of step 104 or 105, which is not limited in the present invention.

Step 107: When moving the wafer on the carrier that has completed the corresponding growth process to the second column, the method further includes: creating a second material information table, the second material information table including carrier information and wafer information and corresponding information between the storage position of the wafer in the second column and the placement position of the wafer in the carrier.

In this step, after the wafer on the carrier has completed the corresponding growth process, the wafer should be taken out and put back into the corresponding column for preservation for subsequent use. Referring to FIG. 5 , when the wafer on which the corresponding growth process is completed on the carrier is moved to the second column, a second material information table is created, and the second material information table includes the carrier information, the wafer information, and the wafer in the second column. Correspondence information between the storage position in the carrier and the placement position of the wafer in the carrier. For example, the wafer in the A1 position of the P001 carrier is placed in the C25 slot position of the C002 cassette. It should be noted that the vehicle information here refers to information such as the vehicle identification such as P001 and the size of the vehicle 6*6. The wafer information here refers to the identification of the wafer, such as F18051111000001, the type of the wafer processed, and other information. It can be seen that, according to the first material information table and the second material information table, the traceability of materials in the production process can be realized.

It should be noted that, the second fence and the first fence may be the same fence or different fences.

It should be noted that, while creating the second material information table, or after creating the second material information table, the information included in the second material information table may also be displayed in the above-mentioned visual view information table middle.

It should be noted that, in the description of the control method for automatic loading and unloading of materials in this embodiment, although the MOCVD growth process of gallium arsenide solar cells is used as an example to describe the automatic loading and unloading control process of materials, it should be emphasized that the invention provides The automatic material loading and unloading control method is not limited to the MOCVD growth process of GaAs solar cells, but can also be other processing processes involving loading and unloading control between the carrier and the wafer.

As can be seen from the above technical solutions, this embodiment provides a method for controlling automatic loading and unloading of materials, including: determining a carrier template, where the carrier template includes information on the placement position of the wafer in the carrier and information on the type of the wafer; according to the The carrier template loads the target wafer from the first column to the corresponding position of the carrier according to the carrier template, and the target wafer is the wafer corresponding to the target loading position of the carrier; creating a first material information table , the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier. The automatic material loading and unloading control method provided in this embodiment can automatically complete the material loading control according to the carrier template, and at the same time can automatically record the corresponding relationship between the material source position and the material position on the carrier, so as to facilitate the retrospective management of the material in the later stage.

Based on the same inventive concept, another embodiment of the present invention provides a material automatic loading and unloading control device, see FIG. 7 , including:

a determination module 21, configured to determine a carrier template, where the carrier template includes information on the placement position of the wafer in the carrier and type information of the wafer;

The loading module 22 is configured to load the target wafer from the first column to the corresponding position of the carrier according to the carrier template according to the carrier template, and the target wafer is corresponding to the target loading position of the carrier the wafer;

The first creation module 23 is used to create a first material information table, the first material information table includes carrier information, wafer information, and a difference between the storage position of the wafer in the first column and the placement position of the wafer in the carrier. corresponding information.

In an optional embodiment, the device further includes:

The second creation module is configured to create a second material information table when the wafer on which the corresponding growth process is completed on the carrier is moved to the second column, and the second material information table includes carrier information, wafer information and Correspondence information between the storage position of the wafer in the second column and the placement position of the wafer in the carrier.

It should be noted that the automatic material loading and unloading control device provided in this embodiment can be used to implement the automatic material loading and unloading control method described in the above embodiment, and its working principle and technical effect are similar. For details, please refer to the description of the above embodiment. It will not be described in detail here.

Based on the same inventive concept, another embodiment of the present invention provides an electronic device, see FIG. 8 , the electronic device specifically includes the following: a processor 701, a memory 702, a communication interface 703, and a bus 704;

Wherein, the processor 701, the memory 702 and the communication interface 703 communicate with each other through the bus 704; the communication interface 703 is used to realize the information between various modeling software and related equipment such as intelligent manufacturing equipment module library transmission;

The processor 701 is configured to call a computer program in the memory 702, and the processor implements all the steps in the first embodiment when executing the computer program. For example, the processor implements the computer program when executing the computer program. The following steps:

Step 101: Determine a carrier template, where the carrier template includes information on the placement position of the wafer in the carrier and type information of the wafer;

Step 102: Load a target wafer from the first column to a corresponding position of the carrier according to the carrier template according to the carrier template, where the target wafer is a wafer corresponding to the target loading position of the carrier;

Step 103: Create a first material information table, where the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier.

Based on the same inventive concept, another embodiment of the present invention provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, all the steps of the first embodiment described above are implemented , for example, the processor implements the following steps when executing the computer program:

Step 101: Determine a carrier template, where the carrier template includes information on the placement position of the wafer in the carrier and type information of the wafer;

Step 102: Load a target wafer from the first column to a corresponding position of the carrier according to the carrier template according to the carrier template, where the target wafer is a wafer corresponding to the target loading position of the carrier;

Step 103: Create a first material information table, where the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier.

It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

The above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The recorded technical solutions are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the present invention.

Claims (10)

1. a material automatic loading and unloading control method, is characterized in that, comprises: determining a carrier template, the carrier template including wafer placement information in the carrier and type information of the wafer; Loading a target wafer from a first column according to the carrier template to a corresponding position of the carrier according to the carrier template, the target wafer being a wafer corresponding to the target loading position of the carrier; A first material information table is created, where the first material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the first column and the placement position of the wafer in the carrier. 2 . The method according to claim 1 , wherein when moving the wafer on the carrier that has completed the corresponding growth process to the second column, the method further comprises: creating a second material information table, the said 2 . The second material information table includes carrier information, wafer information, and correspondence information between the storage position of the wafer in the second column and the placement position of the wafer in the carrier. 3. The method according to claim 2, wherein the method further comprises: A visual view information table is created, and the information included in the first material information table and/or the second material information table is displayed in the visual view information table. 4. The method according to claim 1, wherein, before the determining the vehicle template, the method further comprises: creating a vehicle template; Wherein, the creating a vehicle template includes: Determine the number of rows and columns included in the carrier template, the number of rows and columns of the carrier template corresponds to the number of rows and columns of the carrier, and a row index and column index on the carrier template The composed index pair corresponds to a wafer placement position in the carrier; Determine the placement position and wafer type of the wafer in the carrier template according to the quality verification area and process requirements of the carrier; The carrier template is created based on the number of rows and columns included in the carrier template, as well as the placement position and wafer type of the wafers in the carrier template. 5. The method according to claim 4, wherein the method further comprises: Add the created vehicle template to the vehicle template library. 6. The method according to claim 5, wherein the determining a vehicle template comprises: According to the size of the carrier, the quality verification area and the process requirements, it is judged whether there is a matching carrier template in the carrier template library, and if so, select a matching carrier template from the carrier template library, Otherwise, create a vehicle template. 7. A material automatic loading and unloading control device, characterized in that, comprising: a determining module for determining a carrier template, the carrier template including information on the placement position of the wafer in the carrier and type information of the wafer; a loading module for loading a target wafer from the first column to a corresponding position of the carrier according to the carrier template according to the carrier template, and the target wafer is corresponding to the target loading position of the carrier wafer; The first creation module is used to create a first material information table, the first material information table includes carrier information, wafer information, and the storage position of the wafer in the first column and the placement position of the wafer in the carrier. corresponding information. 8. The apparatus of claim 7, further comprising: The second creation module is configured to create a second material information table when the wafer on which the corresponding growth process is completed on the carrier is moved to the second column, and the second material information table includes carrier information, wafer information and Correspondence information between the storage position of the wafer in the second column and the placement position of the wafer in the carrier. 9. An electronic device, comprising a memory, a processor and a computer program stored on the memory and running on the processor, wherein the processor implements any one of claims 1 to 6 when the processor executes the program The steps of the control method for automatic loading and unloading of materials described in item. 10. A computer-readable storage medium on which a computer program is stored, characterized in that, when the computer program is executed by a processor, the steps of the method for controlling automatic loading and unloading of materials according to any one of claims 1 to 6 are implemented.

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