CN111444900A - Electronic device - Google Patents

Abstract

The present invention provides an electronic device, comprising a frame, a display panel, a bottom plate and a fingerprint sensing module. The frame has a first top surface and a first bottom surface. The display panel is arranged on the first top surface of the frame, providing an illumination beam to a finger to reflect a sensing beam. The bottom plate is arranged on the frame, and has a second top surface and a second bottom surface parallel to each other. The fingerprint sensing module is arranged on the second top surface of the bottom plate, and receives the sensing beam.

Description

electronic device

technical field

The present invention relates to an electronic device, in particular to an electronic device with a fingerprint identification function.

Background technique

With the development of portable electronic devices (such as smart phones or tablet computers) towards large screen-to-body ratio or full screen. In the process of manufacturing an electronic device including an optical fingerprint sensing module, the steel plate used to carry the fingerprint sensing module needs to be deformed first, and then the middle frame of the electronic device is processed, so that the above two components can be processed in the subsequent process. assembly during the process. However, this approach will result in that the outer shape of the steel plate needs to be processed with the middle frame structure, which will increase the manufacturing cost. In addition, due to the large number of processing times, the assembly tolerance is increased, resulting in a decrease in assembly yield and quality.

SUMMARY OF THE INVENTION

The invention provides an electronic device, which can reduce the processing process of the frame body and the bottom plate in the electronic device, and reduce the assembly tolerance that needs to be controlled during the assembly of the electronic device.

The present invention provides an electronic device including a frame body, a display panel, a bottom plate and a fingerprint sensing module. The frame body has a first top surface and a first bottom surface. The display panel is disposed on the first top surface of the frame, and provides illumination beams to the fingers to reflect the sensing beams. The bottom plate is arranged on the frame body and has a second top surface and a second bottom surface that are parallel to each other. The fingerprint sensing module is disposed on the second top surface of the base plate and receives the sensing beam.

Based on the above, in the electronic device of the present invention, the bottom plate for carrying the fingerprint sensing module is in the shape of a flat plate, and the bottom plate is disposed on the frame body. Therefore, the bottom plate can be directly connected to the bottom surface of the frame body without additional processing. In this way, the processing process of the frame body and the bottom plate in the electronic device can be reduced, thereby reducing the assembly tolerance that needs to be controlled during the assembly of the electronic device.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

Description of drawings

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention;

FIG. 2 is an assembly schematic diagram of the electronic device of FIG. 1;

3 is a schematic diagram of an electronic device according to another embodiment of the present invention;

4 is a schematic diagram of an electronic device according to another embodiment of the present invention;

5 is a schematic diagram of an electronic device according to another embodiment of the present invention;

6 is an assembly schematic diagram of the electronic device of FIG. 5;

FIG. 7 is a schematic diagram of an electronic device according to another embodiment of the present invention.

Description of reference numbers:

10: finger;

100, 100A, 100B, 100C, 100D: electronic devices;

110, 110A, 110B: frame body;

112: the first top surface;

113: side;

114: the first bottom surface;

116: groove;

120: display panel;

130, 130A: bottom plate;

132: second top surface;

134: second bottom surface;

140, 140A: fingerprint sensing module;

142: circuit board;

144: sensing component;

146: elastic connector;

148, 148A: filter layer;

150: adhesive pieces;

D1: horizontal direction;

D2: vertical direction;

L1: Lighting beam;

L2: sensing beam;

S: connecting surface.

Detailed ways

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the accompanying drawings are for purposes of description and explanation and not of limitation. For clarity, components may not be shown to scale. Also, some components and/or component symbols may be omitted in some of the drawings. In the specification and drawings, the same or similar reference numerals are used to designate the same or similar components. When it is stated that a component is "disposed on", "connected"...another component, in the case of no particular limitation, the component may be "directly disposed on", "directly connected"...another component, or there may be an intermediary components. It is contemplated that elements and features of one embodiment, where feasible, can be incorporated into another embodiment with benefit without further elaboration.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. Please refer to Figure 1. This embodiment provides an electronic device 100 including a frame body 110 , a display panel 120 , a bottom plate 130 and a fingerprint sensing module 140 . The electronic device 100 has a fingerprint recognition function, which is suitable for allowing a user to perform fingerprint sensing by pressing on the display panel 120 . Specifically, the illumination light beam L1 is transmitted from the display panel 120 to the user's finger 10 for reflection to generate the sensing light beam L2 . The electronic device 100 receives the sensing light beam L2 for fingerprint sensing. For example, the electronic device 100 is, for example, a smart phone, a tablet computer, a notebook computer, or a touch-sensitive display device, etc., and the present invention is not limited thereto.

The frame body 110 has a first top surface 112 and a first bottom surface 114 . Specifically, the frame body 110 is, for example, a middle frame of the electronic device 100 for carrying, separating and fixing the electronic components in the electronic device 100 . In different embodiments, the frame body 110 may be a stiffener additionally disposed in the electronic device 100 , but the present invention is not limited thereto.

The display panel 120 is disposed on the first top surface 112 of the frame body 110 , and provides the illumination light beam L1 to the finger 10 to reflect the sensing light beam L2 . The display panel 120 is, for example, an organic light-emitting diode (OLED) display panel. However, in other embodiments, the display panel 120 may also select a liquid crystal display panel or other suitable display panels, and the present invention is not limited thereto.

The bottom plate 130 has a second top surface 132 and a second bottom surface 134 that are parallel to each other. The bottom plate 130 is, for example, a steel plate for carrying the fingerprint sensing module 140 . In other words, compared with the shape of the conventional bottom plate, the bottom plate 130 of the present embodiment is a flat plate, that is, the thickness of the bottom plate 130 is the same in the horizontal direction D1. In other words, in this embodiment, the bottom plate 130 does not need additional processing. The bottom plate 130 is arranged on the frame body 110 . Specifically, the frame body 110 has a connection surface S, and the bottom plate 130 is connected to the connection surface S. In this embodiment, a part of the first bottom surface 114 of the frame body 110 is the connection surface S, but the invention is not limited to this.

The fingerprint sensing module 140 is disposed on the second top surface 132 of the base plate 130 and receives the sensing light beam L2. In detail, the fingerprint sensing module 140 includes a circuit board 142 , a sensing component 144 and an elastic connector 146 . The circuit board 142 is connected to the display panel 120 through the elastic connector 146 . The sensing element 144 is, for example, an image sensing chip such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD). The elastic connecting member 146 is, for example, an elastic component having a foamed structure such as foam.

More specifically, the fingerprint sensing module 140 further includes a filter layer 148 disposed on the circuit board 142 to cover the sensing element 144 . The filter layer 148 is, for example, an infrared light cut filter, which is used to filter out infrared light, thereby improving the quality of optical sensing. However, in other embodiments, the filter layer 148 may also be a filter for filtering other visible light bands or invisible light bands. In addition, this embodiment does not limit the type or form of the fingerprint sensing module 140 , and its detailed structure and implementation can be sufficiently taught, suggested, and implemented by those skilled in the art, and thus will not be repeated here.

FIG. 2 is an assembly schematic diagram of the electronic device of FIG. 1 . Please refer to Figure 1 and Figure 2. In the process of assembling the electronic device 100 , the display panel 120 is firstly disposed on the frame body 110 , and the fingerprint sensing module 140 is disposed on the base plate 130 , and finally the fingerprint sensing module 140 is extended into the frame body 110 to perform the assembly of the base plate 130 . The second top surface 132 is connected to the first bottom surface 114 of the frame body 110 . Specifically, the electronic device 100 further includes an adhesive member 150 connected between the frame body 110 and the bottom plate 130 . In this embodiment, the adhesive member 150 is, for example, a curing glue, but the present invention is not limited thereto. Since the bottom plate 130 does not require additional processing, it can be directly connected to the first bottom surface 114 of the frame body 110 , as shown in FIG. 1 . In this way, the processing process of the frame body 110 and the bottom plate 130 can be reduced, and the assembly tolerances that need to be controlled during the assembly of the electronic device 100 can be reduced.

FIG. 3 is a schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to Figure 3. The electronic device 100A of this embodiment is similar to the electronic device 100 shown in FIG. 1 . The difference between the two is that, in this embodiment, the frame body 110A has a groove 116 extending from the first bottom surface 114 toward the first top surface 112 , and the connecting surface S is located in the groove 116 . Specifically, the bottom plate 130 is connected to the connecting surface S in the groove 116 through the adhesive member 150 . In this way, the thickness of the entire electronic device 100A can be further thinned. This embodiment does not limit the type or shape of the groove 116 , and the detailed structure and implementation thereof can be adequately taught, suggested and implemented by those skilled in the art, and thus will not be repeated here.

FIG. 4 is a schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to Figure 4. The electronic device 100B of this embodiment is similar to the electronic device 100A shown in FIG. 3 . The difference between the two is that, in this embodiment, the fingerprint sensing module 140A is an embedded infrared filter layer module. Specifically, the filter layer 148A is directly formed on the upper surface of the sensing element 144 , as shown in FIG. 4 . In this way, the structure of the fingerprint sensing module 140A can be simplified, and can be further applied to different requirements.

FIG. 5 is a schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to Figure 5. The electronic device 100C of this embodiment is similar to the electronic device 100 shown in FIG. 1 . The difference between the two is that, in this embodiment, the connecting surface S of the frame body 110B is, for example, an oblique plane inclined to the first bottom surface 114 , extending from the first bottom surface 114 to the side surface 113 of the frame body 110B, and the bottom plate 130A Connected to the connecting surface S. Specifically, the bottom plate 130A is connected to the connection surface S of the frame body 110B through the adhesive member 150 . This embodiment does not limit the type or shape of the connection surface S, and its detailed structure and implementation can be adequately taught, suggested, and implemented by those skilled in the art, and thus will not be described again.

FIG. 6 is an assembly schematic diagram of the electronic device of FIG. 5 . Please refer to Figure 5 and Figure 6. In addition, in this embodiment, the first bottom surface 114 of the frame body 110B and the second bottom surface 134 of the bottom plate 130A are coplanar, and the bottom plate 130A and the circuit board 142 of the fingerprint sensing module 140 are aligned in the vertical direction D2 . Therefore, when assembling the electronic device 100A, the fingerprint sensing module 140 can be aligned with the bottom plate 130A and then assembled, and then the above-mentioned combination can be assembled in the hollow of the frame body 110B, and the adhesive member can be provided after the assembly is completed. 150 (for example, it is provided on the connection surface S by dispensing glue) for connection and fixation. In this way, the thickness of the entire electronic device 100C can be further thinned, and the ease of assembly can be simplified, thereby improving the yield of the electronic device 100C.

FIG. 7 is a schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to Figure 7. The electronic device 100D of this embodiment is similar to the electronic device 100C shown in FIG. 5 . The difference between the two is that, in this embodiment, the fingerprint sensing module 140A is an embedded infrared filter layer module. Specifically, the filter layer 148A is directly formed on the upper surface of the sensing element 144 , as shown in FIG. 7 . In this way, the structure of the fingerprint sensing module 140A can be simplified, and can be further applied to different requirements.

To sum up, in the electronic device of the present invention, the bottom plate for carrying the fingerprint sensing module is a flat plate, and the bottom plate is disposed on the frame body. Therefore, the bottom plate can be directly connected to the bottom surface of the frame body without additional processing. In this way, the processing process of the frame body and the bottom plate in the electronic device can be reduced, thereby reducing the assembly tolerance that needs to be controlled during the assembly of the electronic device.

Although the present invention has been disclosed above with examples, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be as defined by the claims.

Claims (10)

1. An electronic device, comprising:

a frame body having a first top surface and a first bottom surface;

the display panel is arranged on the first top surface of the frame body and provides an illuminating light beam to the finger to reflect a sensing light beam;

a bottom plate disposed on the frame body and having a second top surface and a second bottom surface parallel to each other; and

the fingerprint sensing module is configured on the second top surface of the bottom plate and receives the sensing light beam.

2. The electronic device of claim 1, wherein the thickness of the bottom plate is the same in the horizontal direction.

3. The electronic device of claim 1, further comprising:

and the adhesion piece is connected between the frame body and the bottom plate.

4. The electronic device of claim 3, wherein the adhesive is a curing adhesive.

5. The electronic device of claim 1, wherein the frame has a connection surface, and the base plate is connected to the connection surface.

6. The electronic device of claim 5, wherein the frame has a recess extending from the first bottom surface toward the first top surface, and the connecting surface is located in the recess.

7. The electronic device according to claim 5, wherein the connecting surface of the frame body is inclined to the first bottom surface.

8. The electronic device of claim 1, wherein the first bottom surface of the frame is coplanar with the second bottom surface of the chassis.

9. The electronic device of claim 1, wherein the backplane is vertically aligned with a circuit board of the fingerprint sensing module.

10. The electronic device of claim 1, wherein the fingerprint sensing module comprises a circuit board, a sensing assembly and an elastic connector, and the circuit board is connected to the display panel through the elastic connector.

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