CN111440590B - Polyamide acid adhesive composition for chip packaging, and preparation method and application thereof - Google Patents
Polyamide acid adhesive composition for chip packaging, and preparation method and application thereof Download PDFInfo
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- CN111440590B CN111440590B CN202010274096.6A CN202010274096A CN111440590B CN 111440590 B CN111440590 B CN 111440590B CN 202010274096 A CN202010274096 A CN 202010274096A CN 111440590 B CN111440590 B CN 111440590B
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- polyamic acid
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- adhesive composition
- ketone
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 46
- 239000000853 adhesive Substances 0.000 title claims abstract description 44
- 239000004952 Polyamide Substances 0.000 title claims abstract description 29
- 229920002647 polyamide Polymers 0.000 title claims abstract description 29
- 239000000203 mixture Substances 0.000 title claims abstract description 28
- 239000002253 acid Substances 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000000080 wetting agent Substances 0.000 claims abstract description 21
- -1 ketone dianhydride Chemical class 0.000 claims abstract description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 17
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 14
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims description 13
- 150000002576 ketones Chemical class 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 150000004985 diamines Chemical class 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 7
- 239000012454 non-polar solvent Substances 0.000 claims description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 7
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 7
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 238000005576 amination reaction Methods 0.000 claims description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000002981 blocking agent Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- MTZWHHIREPJPTG-UHFFFAOYSA-N phorone Chemical compound CC(C)=CC(=O)C=C(C)C MTZWHHIREPJPTG-UHFFFAOYSA-N 0.000 claims description 3
- 229930193351 phorone Natural products 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 6
- 238000013035 low temperature curing Methods 0.000 abstract description 5
- 230000009477 glass transition Effects 0.000 abstract description 3
- 125000000468 ketone group Chemical group 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 125000006157 aromatic diamine group Chemical group 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 125000000304 alkynyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical group 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- PPUSHVCDBGEUSR-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]-n-(2-piperazin-1-ylethyl)propan-1-amine Chemical compound CO[Si](C)(OC)CCCNCCN1CCNCC1 PPUSHVCDBGEUSR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09J179/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
- C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a polyamic acid adhesive composition for chip packaging, a preparation method and an application thereof, wherein the composition is prepared from the following components in parts by weight: 50-90 parts of polyamide acid resin, 10-50 parts of organic solvent, 0.05-1.5 parts of substrate wetting agent, 0.05-1.5 parts of defoaming agent and 0.5-5 parts of adhesion promoter; the polyamic acid resin has a structure of the following general formula:
the invention is used for reinforcing bonding points of bonding wires of an IGBT chip and insulating packaging of copper-clad edges, a ketone dianhydride row chain segment containing hydroxyl and an aromatic diamine chain segment containing ether are implanted into a main body component of polyamic acid through ingenious molecular chain design, and the synergistic effect of the hydroxyl and the ketone group ensures that an adhesive has strong adhesion to the diversity of materials of a bonding surface of a chip substrate, and simultaneously endows the polyamic acid resin with certain flexibility and molecular rotation, greatly reduces the glass transition temperature of the resin, and realizes low-temperature curing below 250 ℃.
Description
Technical Field
The invention belongs to the field of high polymer materials, and particularly relates to a polyamic acid adhesive composition for chip packaging, and a preparation method and application thereof.
Background
In recent years, a novel power semiconductor device represented by an Insulated Gate Bipolar Transistor (IGBT) has been widely applied to the fields of rail transit (high-speed rail, motor train unit), smart grid (flexible direct current transmission, extra-high voltage direct current transmission), aerospace, industrial frequency conversion, even household appliances and the like, and is an important mark for measuring the national science and technology level and the comprehensive national strength. The IGBT is used as a CPU for energy conversion, and in order to improve the stability and reliability of the high-voltage IGBT in long-time operation, the insulativity, the high temperature resistance, the adhesive force, the mechanical property and the like of a packaging material of a high-voltage IGBT chip are particularly important. Polyimide (PI) is a polymer containing imide rings in a high molecular main chain, and the main chain contains a very stable aromatic heterocyclic structure, so that the polyimide has very excellent comprehensive performance, can meet the performance requirements of an IGBT on packaging materials to a great extent, is widely applied to IGBT packaging, and is one of the best packaging and coating materials in the fields of current semiconductors and microelectronic information.
At present, many studies are made on polyamide acid adhesives for packaging IGBT chips, but the commercialized products of the polyamide acid adhesives are basically all monopolized by Japanese companies, and with the development of miniaturization and high power of chips and the limitation of manufacturing processes, the requirements of strengthening bonding points of bonding wires and requiring high bonding performance and high insulation performance of copper-clad edge insulating packaging adhesives under the condition of low-temperature curing and substrate material diversity are increasing.
Disclosure of Invention
The invention aims to solve the technical problems, overcome the defects and shortcomings in the background art, provide a polyamic acid adhesive composition for reinforcing bonding points of bonding wires of an IGBT chip and insulating packaging of copper-clad edges, meet the requirements of low-temperature curing, high bonding, high insulating property and the like, and provide a preparation method and application thereof.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a polyamic acid adhesive composition for chip packaging is prepared from the following components in parts by weight: 50-90 parts of polyamide acid resin, 10-50 parts of organic solvent, 0.05-1.5 parts of substrate wetting agent, 0.05-1.5 parts of defoaming agent and 0.5-5 parts of adhesion promoter;
the polyamic acid resin has a structure of the following general formula:
wherein n represents 5 to 200, m represents 5 to 200, and y represents 0 to 10;
r is a capping unit; r1、R2Each independently selected from any one or more of the following structures:
further, R is selected from any one of the following structures:
further, n represents 30 to 100, m represents 30 to 100, and y represents 0 to 2.
Furthermore, the organic solvent consists of a nonpolar solvent and a ketone solvent, wherein the mass percentage of the nonpolar solvent is 90-50%, and the mass percentage of the ketone solvent is 10-50%.
Further, the non-polar organic solvent comprises one of N, N-dimethylformamide, N-dimethylacetamide and pyrrolidone, and the ketone solvent comprises one of acetone, methyl ethyl ketone, diisobutyl ketone, methyl isobutyl ketone, phorone and isophorone.
Further, the substrate wetting agent is polydimethylsiloxane modified by a high molecular polymer, and the high molecular polymer is one of polyester, polyether, polyamide or polyamic acid.
The preparation method of the polyamic acid adhesive composition provided by the invention comprises the following steps: will contain R1And R2Dissolving diamine with a structure in the organic solvent, sequentially adding 3,3',4,4' -benzophenonetetracarboxylic dianhydride, corresponding aromatic ketone dianhydride containing hydroxyl in the structure and a capping reagent containing an R unit structure into the solution under the inert gas atmosphere, and stirring for reaction to obtain polyamide acid resin; adding a substrate wetting agent, a defoaming agent and an adhesion promoter into the polyamic acid resin solution, and uniformly mixing and stirring to obtain the polyamic acid adhesive composition.
Further, after the 3,3',4,4' -benzophenonetetracarboxylic dianhydride is reacted completely, the aromatic ketone dianhydride containing hydroxyl group is added.
The polyamic acid adhesive composition is applied to packaging of an IGBT chip, and after the chip is packaged and coated by the polyamic acid adhesive composition, hot-pressing amination treatment is carried out.
Further, the hot-pressing amination process comprises the following steps: heating to 80-150 ℃, keeping the temperature rise rate at 1-5 ℃/min for 30-90 min; then heating to 180-280 ℃, wherein the heating rate is 1-10 ℃/min, and keeping for 30-90 min; and finally, naturally cooling.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a polyamide acid adhesive composition for reinforcing bonding points of bonding wires of an IGBT (insulated gate bipolar transistor) chip and insulating and packaging a copper-clad edge, wherein a ketone dianhydride row chain segment containing hydroxyl and an aromatic diamine chain segment containing ether are implanted into a polyamide acid main body component through ingenious molecular chain design, and the hydroxyl and the ketone group have synergistic effect, so that the adhesive has strong adhesion to the diversity of the materials of the bonding surface of a chip substrate, and meanwhile, the polyamide acid resin is endowed with certain flexibility and molecular rotation, the glass transition temperature of the resin is greatly reduced, and the low-temperature curing of the resin below 250 ℃ is realized.
In addition, the polyamide acid resin is subjected to end capping treatment by the end capping agent containing alkynyl units, so that the stability of the molecular weight and the storage stability of the polyamide acid resin are guaranteed, and the molecular chains can be cured and crosslinked through alkynyl groups in the heating imidization process, so that the chain growth of the molecular chains is realized, and the cured polyamide acid has extremely high mechanical strength and insulating strength.
And secondly, the selected organic solvent is a two-component mixed solvent consisting of a non-polar solvent and a ketone solvent, the morphology, the size, the clustering and the like of a polyamide acid resin molecular chain are greatly improved, the introduction of the ketone solvent can improve the volatility of the adhesive and promote the leveling and the wetting of the adhesive on a substrate, so that the cured adhesive can keep a good surface appearance, and the combined action of the ketone solvent and a substrate wetting agent provides multiple guarantees for the bonding performance of the adhesive composition.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a Gel Permeation Chromatography (GPC) test data chart of the polyamic acid resin prepared in example 1.
Detailed Description
In order to facilitate an understanding of the present invention, the present invention will be described more fully and in detail with reference to the preferred embodiments, but the scope of the present invention is not limited to the specific embodiments below.
Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention.
Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or can be prepared by existing methods.
The polyamic acid resin for packaging the IGBT chip, which is provided by the embodiment of the invention, consists of a repeating unit of a ketone dianhydride chain segment containing hydroxyl, an aromatic polyamic acid chain segment and a capping unit R, and has the structure of the following general formula:
wherein n represents 5 to 200, preferably 30 to 100; m represents 5 to 200, preferably 30 to 100; y represents 0 to 10, preferably 0 to 2.
Wherein R is1、R2Each independently selected from any one or more of the following aromatic structures:
wherein the end capping unit R is selected from any one of the following structures:
according to the invention, a hydroxyl-containing ketone dianhydride row chain segment is selected in a main molecular chain structure of the polyamic acid resin, wherein the hydroxyl-containing ketone dianhydride structure is implanted into the main molecular chain structure, so that the bonding property of the polyamic acid resin and a matrix is improved, the hydroxyl and the ketone group act synergistically, and the adhesive property is strong for the diversity of chip base materials (the base materials comprise various materials such as AlN/SiN/copper/nickel).
The invention selects an aromatic polyamic acid chain segment repeating unit in the main molecular chain structure of the polyamic acid resin, and the repeating unit is prepared by reacting 3,3',4,4' -benzophenonetetracarboxylic dianhydride and R2The polymerization of the aromatic diamine containing ether in the structure guarantees the insulativity and the mechanical strength of the polyamic acid resin, and simultaneously endows the polyamic acid resin with certain flexibility and molecular rotation, and greatly reduces the glass transition temperature of the resin so as to realize low-temperature curing of the resin.
According to the invention, the end-capping agent containing the end-capping unit R is selected in the main molecular chain structure of the polyamic acid resin for end-capping treatment, the end-capping agent containing the alkynyl unit ensures the stability of the molecular weight and the storage stability of the polyamic acid resin, and the molecular chains can be cured and crosslinked through the alkynyl when cured at low temperature (less than or equal to 250 ℃), so that the chain growth of the molecular chains is realized, and the cured polyamic acid has extremely high mechanical strength and insulating strength.
The polyamic acid adhesive composition for packaging the IGBT chip, provided by the invention, is prepared from the following components in parts by weight: 50-90 parts of polyamide acid resin with the structure, 10-50 parts of organic solvent, 0.05-1.5 parts of substrate wetting agent, 0.05-1.5 parts of defoaming agent and 0.5-5 parts of adhesion promoter.
Preferably, the organic solvent is a two-component mixed solvent composed of one of nonpolar polar solvents N, N-dimethylformamide, N-dimethylacetamide or pyrrolidone and one of ketone solvents acetone, methyl ethyl ketone, diisobutyl ketone, methyl isobutyl ketone, phorone and isophorone, wherein the mass percentage of the nonpolar polar solvent is 90-50%, and the mass percentage of the ketone solvent is 10-50%.
The organic solvent selected by the invention is a two-component mixed solvent consisting of a non-polar solvent and a ketone solvent, so that the form, the size, the clustering and the like of a polyamide acid resin molecular chain are greatly improved, and secondly, the introduction of the ketone solvent can improve the volatility of the adhesive and promote the leveling and the wetting of the adhesive on a substrate, so that the cured adhesive can keep a good surface appearance.
Preferably, the substrate wetting agent is high molecular polymer modified polydimethylsiloxane, and the structure of the substrate wetting agent is as follows:
wherein the high molecular polymer is one of polyester, polyether, polyamide and polyamic acid.
The substrate wetting agent selected by the invention is high-molecular polymer modified polydimethylsiloxane, wherein the addition of the polydimethylsiloxane can improve the wetting capacity of the substrate to a great extent, and meanwhile, the intermiscibility and the matrix associativity of the wetting agent and the polyamide acid resin are improved by the modification of high-molecular polymers such as polyester, polyether, polyamide and polyamide acid, so that the adhesive composition of the invention provides a second-layer adhesive property guarantee.
Preferably, the defoaming agent is selected from one or more of BYK-067A, BYK-A535, BYK-1794, BYK-088, BYK-A525, BYK-A550, BYK-A530 and BYK-A515.
Preferably, the adhesion promoter is selected from 4-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-aminoethyl-3-aminopropylmethyldiethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, one or more of N-2-aminoethyl-3-aminopropyltriethoxysilane, N-2-aminoethyl-3-aminopropyltrimethoxysilane, N- (piperazinylethyl) -3-aminopropylmethyldimethoxysilane, 3-divinyltriaminopropylmethyldimethoxysilane and 3-divinyltriaminopropyltrimethoxysilane.
In one embodiment of the present invention, the polyamic acid resin is prepared by the following method: will contain R1And R2And (2) dissolving diamine with an aromatic structure in the two-component mixed solvent, controlling the reaction temperature at 0-40 ℃ in an inert gas atmosphere until the diamine is completely dissolved, sequentially adding 3,3',4,4' -benzophenone tetracarboxylic dianhydride, aromatic ketone dianhydride containing hydroxyl and a blocking agent containing an R unit structure into the solution (adding aromatic ketone dianhydride containing hydroxyl after the 3,3',4,4' -benzophenone tetracarboxylic dianhydride completely reacts to generate a block polymer), and uniformly stirring and reacting to obtain the polyamide acid resin solution.
In one embodiment of the present invention, the preparation method of the polyamic acid adhesive comprises: adding a substrate wetting agent, a defoaming agent and an adhesion promoter into the obtained polyamic acid resin solution, and uniformly mixing and stirring.
And packaging and coating the chip by using the polyamic acid adhesive, and then performing hot-pressing amination to obtain the polyamic acid to generate polyimide. Preferably, the hot-press amination process is: firstly, the room temperature is increased to 80-150 ℃ (preferably 100 ℃), the temperature increase rate is 1-5 ℃/min (preferably 2.5 ℃/min), and the temperature is kept for 30-90 min (preferably 60 min); heating to 180-280 ℃ (preferably 250 ℃), wherein the heating rate is 1-10 ℃/min (preferably 5 ℃/min), and keeping for 30-90 min (preferably 60 min); and thirdly, naturally cooling to room temperature.
Example 1:
the polyamic acid adhesive composition of the embodiment is prepared from the following components in parts by weight: 74 parts of polyamide acid resin, 23 parts of organic solvent (16 parts of pyrrolidone and 7 parts of diisobutyl ketone), 1.5 parts of substrate wetting agent, 0.5 part of defoaming agent and 1 part of adhesion promoter.
Wherein the structural formula of the polyamic acid resin
Wherein the substrate wetting agent is polyether modified polydimethylsiloxane, the defoaming agent is selected from Bike chemical brand BYK-A535, and the adhesion promoter is 3-aminopropyl trimethoxy silane.
The polyamide acid adhesive is prepared by the following method:
r is to be1Is composed of
And R2Is composed of
Dissolving diamine with the structure in a mixed organic solvent, controlling the reaction temperature at 30 ℃ under the inert gas atmosphere until the diamine is completely dissolved, and sequentially adding 3,3',4,4' -benzophenonetetracarboxylic dianhydride, aromatic ketone dianhydride (y is 0) containing hydroxyl and R is
And stirring the end capping agent with the unit structure for uniform reaction to obtain the polyamic acid resin solution. Gel Permeation Chromatography (GPC) test data of the polyamic acid resin are shown in FIG. 1Molecular weight data: mn34703 (daltons); mw34949 (daltons); mz35225 (daltons); mz+135531 (daltons); a polydispersity index of 1.007111; mz/Mw:1.007876；Mz+1/Mw:1.016641。
Adding a substrate wetting agent, a defoaming agent and an adhesion promoter into the obtained polyamic acid resin solution, and uniformly mixing and stirring to obtain the polyamic acid adhesive composition.
Example 2
The difference from example 1 is only that the components of the polyamic acid adhesive composition in parts by weight are changed to: 70 parts of polyamide acid resin, 25 parts of organic solvent (wherein the weight parts of pyrrolidone is 20 parts, and the weight parts of diisobutyl ketone is 5 parts), 2 parts of substrate wetting agent, 1 part of defoaming agent and 2 parts of adhesion promoter.
Example 3
The only difference from example 1 is that R is1Is composed of
Example 4
The only difference from example 1 is that R is
A capping agent of a unit structure.
Example 5
The only difference from example 1 is that y in the hydroxyl group-containing ketone dianhydride row segment is 1.
Comparative example 1
The difference from example 1 is only that in the ketone dianhydride row segment containing no hydroxyl group, the polyamic acid adhesive composition is prepared from the following components in parts by weight: 74 parts of polyamide acid resin, 23 parts of organic solvent (16 parts of pyrrolidone and 7 parts of diisobutyl ketone), 1.5 parts of substrate wetting agent, 0.5 part of defoaming agent and 1 part of adhesion promoter.
Wherein the structural formula of the polyamic acid resin
Wherein the substrate wetting agent is polyether modified polydimethylsiloxane, the defoaming agent is selected from Bike chemical brand BYK-A535, and the adhesion promoter is 3-aminopropyl trimethoxy silane.
The polyamide acid adhesive is prepared by the following method:
r is to be1Is composed of
And R2Is composed of
Dissolving diamine with a structure in a mixed solvent, controlling the reaction temperature at 0-40 ℃ in an inert gas atmosphere until the diamine is completely dissolved, and sequentially adding 3,3',4,4' -benzophenonetetracarboxylic dianhydride and R
And stirring the end capping agent with the unit structure for uniform reaction to obtain the polyamic acid resin solution.
Comparative example 2
The only difference from example 1 is that no substrate wetting agent was added.
Comparative example 3
The only difference from example 1 is that no blocking agent was added.
Comparative example 4
The difference from example 1 is that only a single solvent, pyrrolidone, is used.
The main properties of the polyamic acid adhesive compositions prepared in the above examples and comparative examples are shown in table 1.
TABLE 1 Main Properties of the Polyamic acid Adhesives prepared in examples and comparative examples after imidization
The foregoing is considered as illustrative of the preferred embodiments of the invention and is not to be construed as limiting the invention in any way. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.
Claims (8)
1. The polyamic acid adhesive composition for chip packaging is characterized by being prepared from the following components in parts by weight: 50-90 parts of polyamide acid resin, 10-50 parts of organic solvent, 0.05-1.5 parts of substrate wetting agent, 0.05-1.5 parts of defoaming agent and 0.5-5 parts of adhesion promoter; the substrate wetting agent is polydimethylsiloxane modified by a high molecular polymer, and the high molecular polymer is one of polyester, polyether, polyamide or polyamic acid;
the polyamic acid resin has a structure of the following general formula:
wherein n represents 5 to 200, m represents 5 to 200, and y represents 0 to 10;
r is a capping unit; r1、R2Each independently selected from any one or more of the following structures:
or
R is selected from any one of the following structures:
2. The polyamic acid adhesive composition according to claim 1, wherein n represents 30 to 100, m represents 30 to 100, and y represents 0 to 2.
3. The polyamic acid adhesive composition according to claim 1, wherein the organic solvent comprises a nonpolar solvent and a ketone solvent, wherein the mass percentage of the nonpolar solvent is 90-50%, and the mass percentage of the ketone solvent is 10-50%.
4. The polyamic acid adhesive composition according to claim 3, wherein the non-polar solvent comprises one of N, N-dimethylformamide, N-dimethylacetamide or pyrrolidone, and the ketone solvent comprises one of acetone, methyl ethyl ketone, diisobutyl ketone, methyl isobutyl ketone, phorone or isophorone.
5. A preparation method of the polyamic acid adhesive composition according to any one of claims 1 to 4, comprising the following steps: will contain R1And R2Dissolving diamine with the structure in the organic solvent, and sequentially adding 3,3',4,4' -benzophenonetetracarboxylic dianhydride and the R into the solution under the inert gas atmosphere1And R2Stirring and reacting aromatic ketone dianhydride containing hydroxyl corresponding to the structure and a blocking agent containing an R unit structure to obtain polyamic acid resin; a substrate wetting agent, a defoaming agent,And adding an adhesion promoter into the polyamic acid resin solution, and uniformly mixing and stirring to obtain the polyamic acid adhesive composition.
6. The process according to claim 5, wherein the hydroxyl group-containing aromatic ketone dianhydride is added after the reaction of 3,3',4,4' -benzophenonetetracarboxylic dianhydride is completed.
7. The application of the polyamic acid adhesive composition in packaging an IGBT chip as claimed in any one of claims 1 to 4, wherein the polyamic acid adhesive composition is used for hot-pressing amination treatment after coating the chip package.
8. Use according to claim 7, wherein the hot press amination process is: heating to 80-150 ℃, keeping the temperature rise rate at 1-5 ℃/min for 30-90 min; then heating to 180-280 ℃, wherein the heating rate is 1-10 ℃/min, and keeping for 30-90 min; and finally, naturally cooling.
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| CN108641665B (en) * | 2018-05-14 | 2020-08-21 | 中国科学院化学研究所 | Polyimide adhesive and preparation method thereof |
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