CN111438448A - A kind of laser processing equipment and method for free composite separation of galvanometer and nozzle - Google Patents

Abstract

The invention relates to a laser processing equipment and method for free composite separation of a galvanometer and a nozzle, comprising: a galvanometer, which is used to control the direction of a laser beam; The laser beam whose direction has been controlled is focused; the nozzle, which can be switched directly under the field lens in a composite and separate manner, and can be assisted by gas when the laser beam focused by the field lens passes through; the nozzle movement mechanism, The nozzle moving mechanism is used for assisting the nozzle to switch under the field lens in a composite and separate manner; a moving platform is used for placing the workpiece. The invention designs the free composite separation processing equipment and processing method of the galvanometer and the nozzle, so that the processing advantages of the galvanometer and the nozzle are combined, and their respective processing capabilities are retained, so they have more superior processing capabilities.

Description

A kind of laser processing equipment and method for free composite separation of galvanometer and nozzle

technical field

The invention relates to the technical field of laser processing, in particular to a laser processing equipment and method for free composite separation of a galvanometer and a nozzle.

Background technique

Laser processing technology is a processing technology for scribing, marking, cleaning, cutting, welding, surface treatment, drilling and micromachining of materials (including metals and non-metals) by using the characteristics of the interaction between laser beams and substances. . As an advanced manufacturing technology, laser processing has been widely used in important sectors of the national economy such as automobiles, electronics, electrical appliances, aviation, metallurgy, machinery manufacturing, etc. It plays an increasingly important role in improving product quality, labor productivity, automation, pollution-free, and reducing material consumption. important role.

Galvo mirrors and laser cutting heads are widely used in the field of laser processing, and they each have their own advantages and disadvantages. The galvanometer controls the laser beam by controlling the deflection of two internal mirrors. Its motor inertia is small. After focusing through the field mirror, the rapid movement of the laser focus in the plane can be precisely controlled. It is widely used in laser marking and laser precision engraving. However, the galvanometer cannot be equipped with a coaxial nozzle, so there is a lack of gas protection during the processing, and the processing product cannot be blown away in time, so it is difficult to use for the processing of deep holes and deep grooves.

The laser cutting head is equipped with a coaxial nozzle for blowing air, and the high-pressure gas injected during the processing has the function of protection and blowing, thereby improving the processing capacity and quality, and can be used for cutting and punching thicker materials. However, the cutting head needs to be processed through a motion platform, and the motion platform generally has a large inertia, which is difficult to apply to occasions that require high motion speed and accuracy, such as rapid cutting and precision small hole cutting.

Patented a multi-functional laser processing head (authorization number: CN102653030B), which combines the galvanometer and the nozzle, but the processing head is a closed fixed structure, which cannot realize the separation of the field lens and the cutting head, so that the galvanometer Lost the ability to process a wide range.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the defects of the prior art, and to provide a laser processing equipment and method for free composite separation of a galvanometer and a nozzle.

The technical scheme for realizing the purpose of the present invention is: a galvanometer and a nozzle are freely combined and separated laser processing equipment, which has the following characteristics:

a galvanometer, which is used to control the direction of the laser beam;

a field lens, which is used to focus the laser beam whose direction has been controlled through the galvanometer;

a nozzle, which can be switched directly under the field lens in a composite and separate manner and can perform gas assistance when the laser beam focused by the field lens passes through;

a nozzle moving mechanism, the nozzle moving mechanism is used to assist the nozzle to switch under the field lens in a composite and separate manner;

The moving platform is used to place the workpiece.

The nozzle moving mechanism described in the above technical solution has

a nozzle extraction mechanism, the nozzle extraction mechanism is used to recombine the nozzle to the directly below the field lens or to separate it from the directly below the field lens;

A nozzle height adjustment mechanism, the nozzle height adjustment mechanism is connected to the nozzle extraction mechanism, and the nozzle height adjustment mechanism is used to adjust the height of the nozzle from the workpiece.

In the above technical solution, the nozzle extraction mechanism and the nozzle height adjustment mechanism are driven by servo motors.

The nozzle described in the above technical solution has

an air inlet, the air inlet is used to input gas;

The air injection port is used for ejecting gas, and the air injection port is located directly under the field lens during operation.

In the above technical solution, the side of the nozzle facing away from the jet port is sealed with a high light transmission lens, and the high light transmission lens is used to ensure the high transmittance of the laser beam focused by the field lens.

The present invention also provides a laser processing method for free recombination and separation of a galvanometer and a nozzle. The method is based on a laser processing equipment for free recombination and separation of a galvanometer and a nozzle, and includes the following processing methods:

Galvanometer independent processing A: The moving platform does not move, the nozzle is compounded directly below the field mirror, the laser pixel controls the direction through the galvanometer, is focused by the field mirror and then passes through the nozzle, and the laser beam is directed to the moving platform within the processing range of the nozzle. on the workpiece for processing;

Galvanometer independent processing B: The moving platform does not move, the nozzle is separated directly below the field mirror, the laser pixel is controlled by the galvanometer, and focused by the field mirror, and then the laser beam hits the workpiece on the moving platform within the processing range of the field mirror. to be processed.

A galvanometer and nozzle free composite separation laser processing method, the method is based on a galvanometer and nozzle free composite separation laser processing equipment, and includes the following processing methods:

Platform-independent processing: the galvanometer does not move, the nozzle is compounded directly below the field mirror, the laser pixel passes through the galvanometer and is focused by the field mirror, and then passes through the nozzle, and the moving platform drives the workpiece for motion processing.

A galvanometer and nozzle free composite separation laser processing method, the method is based on a galvanometer and nozzle free composite separation laser processing equipment, and includes the following processing methods:

Combined processing of the galvanometer platform: the moving platform drives the workpiece for motion processing. At the same time, the nozzle is combined to the right under the field mirror. The laser pixel controls the direction through the galvanometer, and is focused by the field mirror and then passes through the nozzle. The laser beam is processed in the nozzle. The workpiece on the moving platform is processed within the scope. The direction of the laser is controlled by the galvanometer, focused by the field lens and then passed through the nozzle. The laser beam processes the workpiece on the moving platform within the processing range of the nozzle.

After adopting above-mentioned technical scheme, the present invention has following positive effect:

The invention provides a laser processing equipment and method for the free composite separation of the galvanometer and the nozzle, which adopts the structure and control form of the free composite separation of the galvanometer and the nozzle, and combines the advantages of high speed, small inertia, and high precision of the galvanometer with the gas-assisted processing of the nozzle. combination of advantages. When processing microstructures, the galvanometer scans within the nozzle range, avoiding the difficulty of microstructure processing through the motion of the large inertia machine, and at the same time, it has the advantages of gas-assisted processing.

Further, on the basis of the above advantages, the method realizes the separation of the nozzle and the galvanometer through the nozzle separation mechanism, thereby retaining the ability of the galvanometer to process, mark and scribe in a large range, and release the nozzle from the shackles of the galvanometer processing ability. .

Further, the closed sealing structure of the high-transmittance lens is adopted above the nozzle, which ensures that the laser capacity is not lost and the sealing requirements of the nozzle are not lost, and the nozzle structure is small. At the same time, the high-pressure gas also has a certain cooling effect on the high-transmission lens.

The present invention proposes a free composite separation laser processing method of a galvanometer and a nozzle. On the basis of the above processing equipment, a composite separation processing control method applied to different processing conditions is proposed, so that the capabilities of the above processing equipment can be fully applied and brought into play. .

To sum up, the present invention proposes a laser processing equipment and method for the free composite separation of the galvanometer and the nozzle, and designs the free composite separation processing equipment and processing method of the galvanometer and the nozzle, so as to combine the processing advantages of the galvanometer and the nozzle. , and retain their respective processing capabilities, so they have superior processing capabilities.

Description of drawings

In order to make the content of the present invention easier to understand clearly, the present invention will be described in further detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein

FIG. 1 is a schematic structural diagram of the present invention.

In the figure: galvanometer 1, field mirror 2, nozzle 3, nozzle motion mechanism 4, motion platform 5, workpiece 6, nozzle extraction mechanism 41, nozzle height adjustment mechanism 42, air inlet 31, jet port 32, high light transmission Lens 7.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in use, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", "third", etc. are only used to differentiate the description and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhanging" etc. do not imply that a component is required to be absolutely horizontal or overhang, but rather may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", it does not mean that the structure must be completely horizontal, but can be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise expressly specified and limited, the terms "arranged", "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

(Example 1)

Referring to Fig. 1, the present invention provides a galvanometer and nozzle free composite separation laser processing equipment, which has a galvanometer 1, and the galvanometer 1 is used to control the direction of the laser beam;

Field lens 2, the field lens 2 is used to focus the laser beam whose direction has been controlled through the galvanometer 1;

Nozzle 3, the nozzle 3 can be switched directly below the field lens 2 and can be assisted by gas when the laser beam focused by the field lens 2 passes through;

A nozzle moving mechanism 4, the nozzle moving mechanism 4 is used to assist the nozzle 3 to switch below the field lens 2 in a composite and separate manner;

The moving platform 5 is used for placing the workpiece 6 .

The nozzle 3 has

an air inlet 31, the air inlet 31 is used to input gas;

The air injection port 32 is used for ejecting gas, and the air injection port 32 is located directly below the field lens 2 during operation.

The shape of the nozzle 3 and the size of the nozzle orifice 32 refer to general laser cutting head nozzles, which are not limited here.

The side of the nozzle 3 facing away from the jet port 32 is sealed with a high-transparency lens 7 , and the high-transmittance lens 7 is used to ensure the high transmittance of the laser beam focused by the field lens 2 . That is to say, a closed sealing structure is adopted on the top of the high light transmission lens 7 and the nozzle 3, which ensures that the laser power is not lost and the sealing requirements of the nozzle 3, and at the same time, the structure of the nozzle 3 is small, and the high pressure gas also has a certain cooling effect on the high light transmission lens 7. .

This embodiment is the core technical solution of the present invention. The galvanometer 1 and the nozzle 3 are designed separately, and the nozzle movement mechanism 4 controls the position of the nozzle 3 to switch freely and quickly between the field lens 2 and outside the field lens 2. When the nozzle 3 is located in the field lens 2, the direction of the laser beam is controlled by the galvanometer 1, so that the focused spot moves within the processing range of the field lens 2 to complete laser scribing, marking, cleaning, etc.; when the nozzle 3 is located directly under the field lens 2, the nozzle 3. High-pressure gas is injected, and the galvanometer 1 controls the focusing spot to perform circles, lines, rotary cutting and other movements within the range of the nozzle opening 32 of the nozzle 3, so as to realize gas-assisted laser drilling, cutting, grooving, etc.; Free composite separation is controlled by computer according to certain methods and processing conditions.

(Example 2)

This embodiment is an implementation of the nozzle moving mechanism 4, and the nozzle moving mechanism 4 has

Nozzle extraction mechanism 41 , the nozzle extraction mechanism 41 is used for recombining the nozzle 3 directly below the field lens 2 or separating it from directly below the field lens 2 ;

The nozzle height adjustment mechanism 42 is connected to the nozzle extraction mechanism 41 , and the nozzle height adjustment mechanism 42 is used to adjust the height of the nozzle 3 from the workpiece 6 .

The nozzle extraction mechanism 41 and the nozzle height adjustment mechanism 42 are driven by servo motors. Servo motor use technology is relatively common in the present, and its installation, use and supporting computer control system will not be described in detail here, which should not affect the understanding of those skilled in the art.

The nozzle extraction mechanism 41 and the nozzle height adjustment mechanism 42 are uniformly controlled by the computer control system, so as to realize the combination of the nozzles 3 to be directly below the field lens 2 or to be separated from the directly below the field lens 2 .

The present invention also provides a laser processing method for free recombination and separation of a galvanometer and a nozzle. The method is based on a laser processing equipment for free recombination and separation of a galvanometer and a nozzle, and includes the following processing methods:

Galvanometer independent processing A: The moving platform 5 does not move, the nozzle 3 is compounded directly under the field mirror 2, the laser pixel controls the direction through the galvanometer 1, is focused by the field mirror 2 and then passes through the nozzle 3, and the laser beam is in the nozzle 3 The workpiece 6 on the motion platform 5 is processed within the processing range;

Galvanometer independent processing B: the moving platform 5 does not move, the nozzle 3 is separated from the directly below the field mirror 2, the direction of the laser is controlled by the galvanometer 1, and is focused by the field mirror 2, and then the laser beam is within the processing range of the field mirror 2 The workpiece 6 on the moving platform 5 is processed.

Platform independent processing: the galvanometer 1 does not move, the nozzle 3 is compounded directly under the field mirror 2, the laser pixel passes through the galvanometer 1 and is focused by the field mirror 2, and then passes through the nozzle 3, and the motion platform 5 drives the workpiece 6 for motion processing .

Combined processing of the galvanometer platform: the moving platform 5 drives the workpiece 6 to perform motion processing. At the same time, the nozzle 3 is combined to the right under the field mirror 2, and the laser is controlled by the galvanometer 1. The direction is focused by the field mirror 2 and then passes through the nozzle 3 , the laser beam processes the workpiece 6 on the moving platform 5 within the processing range of the nozzle 3. The laser pixel controls the direction through the galvanometer 1, is focused by the field lens 2 and then passes through the nozzle 3. The laser beam is within the processing range of the nozzle 3. The workpiece 6 on the moving platform 5 is processed.

It should be noted that the above processing methods are selected for comprehensive application according to material thickness, processing accuracy, material material, and processing graphics. The computer control system automatically controls the position of nozzle 3 and high-pressure gas injection according to the selected processing method to assist processing.

The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in further detail. It should be understood that the above descriptions are only specific embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims (8)

1. A galvanometer and nozzle free composite separation laser processing equipment, is characterized in that: have galvanometer (1), and described galvanometer (1) is in order to control the direction of laser beam; a field lens (2), the field lens (2) is used to focus the laser beam whose direction has been controlled through the galvanometer (1); a nozzle (3), the nozzle (3) can be switched directly below the field lens (2) in a composite and separate manner and can perform gas assist when the laser beam focused by the field lens (2) passes through; a nozzle moving mechanism (4), the nozzle moving mechanism (4) is used to assist the nozzle (3) to switch below the field lens (2) in a composite and separate manner; A moving platform (5) is used for placing the workpiece (6). 2. A kind of galvanometer and nozzle free composite separation laser processing equipment according to claim 1, is characterized in that: described nozzle motion mechanism (4) has Nozzle extraction mechanism (41), the nozzle extraction mechanism (41) is used for recombining the nozzle (3) directly below the field lens (2) or separating it from the front side of the field lens (2). below; A nozzle height adjustment mechanism (42), the nozzle height adjustment mechanism (42) is connected to the nozzle extraction mechanism (41), and the nozzle height adjustment mechanism (42) is used to adjust the distance from the nozzle (3) to the Height of workpiece (6). 3 . The laser processing equipment according to claim 2 , wherein the nozzle extraction mechanism ( 41 ) and the nozzle height adjustment mechanism ( 42 ) are driven by servo motors. 4 . 4. A kind of galvanometer and nozzle free composite separation laser processing equipment according to claim 1, is characterized in that: described nozzle (3) has an air inlet (31), the air inlet (31) is used to input gas; an air injection port (32), the air injection port (32) is used for ejecting gas, and the air injection port (32) is located directly below the field lens (2) during operation. 5. The laser processing equipment for free composite separation of a galvanometer and a nozzle according to claim 4, characterized in that: the side of the nozzle (3) facing away from the jet port (32) is sealed with a high-transmittance lens (7), the high transmittance lens (7) is used to ensure the high transmittance of the laser beam focused by the field lens (2). 6. A galvanometer and nozzle free composite separation laser processing method is characterized in that: the method is based on any one of claims 1-7 described a kind of galvanometer and nozzle free composite separation laser processing equipment, and comprises the following processing methods : Galvanometer independent processing A: The moving platform (5) does not move, the nozzle (3) is compounded directly below the field lens (2), the laser pixel is controlled by the galvanometer (1) and focused by the field lens (2). Then through the nozzle (3), the laser beam processes the workpiece (6) on the moving platform (5) within the processing range of the nozzle (3); Galvanometer independent processing B: the moving platform (5) does not move, the nozzle (3) is separated from directly below the field mirror (2), the laser pixel is controlled by the galvanometer (1), and focused by the field mirror (2), The laser beam then processes the workpiece (6) on the moving platform (5) within the processing range of the field lens (2). 7. A galvanometer and nozzle free composite separation laser processing method is characterized in that: the method is based on any one of claims 1-7 described a kind of galvanometer and nozzle free composite separation laser processing equipment, and comprises the following processing methods : The platform is independently processed: the galvanometer (1) does not move, the nozzle (3) is compounded directly under the field lens (2), the laser pixel passes through the galvanometer (1) and is focused by the field lens (2), and then passes through the nozzle ( 3), the motion platform (5) drives the workpiece (6) for motion processing. 8. A galvanometer and nozzle free composite separation laser processing method is characterized in that: the method is based on any one of claims 1-7 described a kind of galvanometer and nozzle free composite separation laser processing equipment, and comprises the following processing methods : Combined processing of the galvanometer platform: the moving platform (5) drives the workpiece (6) for motion processing, and at the same time, the nozzle (3) is combined to directly below the field mirror (2), and the laser element controls the direction through the galvanometer (1), Focused by the field lens (2) and then passed through the nozzle (3), the laser beam processes the workpiece (6) on the moving platform (5) within the processing range of the nozzle (3). The direction of the laser beam is controlled by the galvanometer (1). is focused by the field lens (2) and then passes through the nozzle (3), and the laser beam processes the workpiece (6) on the moving platform (5) within the processing range of the nozzle (3).

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